CN114397478B - Single-axis differential resonance Liang Biaotou module and accelerometer - Google Patents
Single-axis differential resonance Liang Biaotou module and accelerometer Download PDFInfo
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- CN114397478B CN114397478B CN202111440050.8A CN202111440050A CN114397478B CN 114397478 B CN114397478 B CN 114397478B CN 202111440050 A CN202111440050 A CN 202111440050A CN 114397478 B CN114397478 B CN 114397478B
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- 238000007789 sealing Methods 0.000 claims abstract description 40
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 230000004888 barrier function Effects 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 6
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 8
- 238000000605 extraction Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009489 vacuum treatment Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/03—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses by using non-electrical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates TO a single-axis differential resonance Liang Biaotou module and an accelerometer, which comprise a vacuum sealing piece and two TO parts; the vacuum sealing piece comprises a sealing cavity with two open ends; the two TO parts are symmetrically packaged at two ends of the sealing cavity; each TO component includes a TO base, a resonant beam chip, an ASIC hybrid integrated circuit, a getter assembly, a getter barrier, a ceramic column, and pins; the gauge outfit module adopts two TO parts which are symmetrically packaged at the two ends of the sealed cavity TO form a differential mode structure, and has good environmental adaptability and high precision in the whole temperature range; the accelerometer is integrated by four independent gauge outfit modules through redundant configuration overall arrangement, compares the independent accelerometer of installation triaxial, and this scheme quality and volume are little, compact structure, precision and reliability are higher.
Description
Technical Field
The invention relates to the technical field of quartz resonance beam accelerometers, in particular to a single-axis differential resonance Liang Biaotou module and an accelerometer.
Background
The quartz resonance beam accelerometer is a sensor which converts the acceleration to be measured into the natural frequency change of the quartz resonance beam by utilizing the resonance type measurement principle, and has the advantages of wide range, high precision, small volume, low power consumption, digital output and the like, can be widely used in the fields of missile attitude control, inertial navigation, earth resource exploration and the like, and has important military value and civil value.
At present, a core sensing element of the quartz resonance beam accelerometer is a resonance beam chip, and the working principle is as follows: based on the inverse piezoelectric effect of single crystal quartz, the resonant beam works in a resonant state, the micro-lever structure of the resonant beam chip is utilized to convert the inertial force acting on the chip mass block into the axial force of the resonant beam, the change of the axial force of the resonant beam causes the resonant frequency to change, and the external inertial force is sensed by detecting the change value of the resonant frequency. The resonant beam chip must work in a vacuum environment, and after airtight packaging by adopting a vacuum sealing piece, the resonant beam chip works in an open-loop state, and the influence of the environmental temperature on zero bias is larger during working. And the matched oscillating circuit is generally assembled outside the vacuum sealing piece and can be greatly subjected to phase shift caused by environmental influence. In addition, the vacuum sealing member can release miscellaneous gas in long-term operation, and the change of the vacuum environment in the cavity causes the change of the working characteristics of the resonant beam chip.
In addition, with the development of inertial application technology, a single-axis accelerometer cannot meet the requirements of performance and function, and a triaxial accelerometer needs to be developed. The conventional inertial navigation unit generally adopts a scheme of orthogonally assembling 3 independent single-axis accelerometers together, which puts higher requirements on the overall design of the inertial navigation system, and has the defects of complex assembly, large volume and mass, high cost, low reliability and the like, so that development of a high-reliability high-precision integrated triaxial resonant beam accelerometer with redundancy features is urgently needed.
Disclosure of Invention
Based on the expression, the invention provides a single-axis differential resonance Liang Biaotou module, which aims to solve the technical problems of low reliability and low environmental adaptability of a resonant beam accelerometer in the prior art.
The technical scheme for solving the technical problems is as follows:
a single-axis differential resonance Liang Biaotou module comprises a vacuum sealing element and two TO parts;
the vacuum sealing piece comprises a sealing cavity with two open ends;
The two TO parts are symmetrically packaged at two ends of the sealing cavity; each of the TO components includes a TO base, a resonant beam chip, an ASIC hybrid integrated circuit, a getter assembly, a getter barrier, a ceramic column, and pins; the TO base is provided with a containing cavity with an opening at one end, the contact pin is connected TO the TO base and extends into the containing cavity, the ceramic column is arranged on the outer side of the contact pin TO ensure insulation between the contact pin and the TO base, the ASIC hybrid integrated circuit is arranged on the end face of the ceramic column, the resonance beam chip is connected TO the end part of the contact pin, the ASIC hybrid integrated circuit is arranged between the resonance beam chip and the bottom surface of the containing cavity, the getter component is arranged on the TO base and fixedly connected TO one side, far away from the resonance beam chip, of the ASIC hybrid integrated circuit, the getter baffle is arranged at the opening of the containing cavity of the TO base, and the getter component and the ASIC hybrid integrated circuit are respectively arranged on two sides of the getter baffle; one end of each TO component with the resonant beam chip is arranged opposite TO the other end of each TO component with the resonant beam chip.
Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:
The meter head module adopts two TO parts symmetrically packaged at two ends of the sealed cavity TO form a differential mode structure, so that common mode noise can be eliminated, the offset temperature coefficient and the second-order nonlinear coefficient can be reduced, the environmental adaptability is good, and the precision is high in the whole temperature range; in addition, the getter component is arranged in the gauge outfit module, so that the vacuum degree change caused by the release of miscellaneous gas in the sealed cavity of the gauge outfit module is avoided, the stable working environment of the resonant beam chip and the ASIC hybrid integrated circuit is ensured, and the reliability of the gauge outfit module is enhanced.
On the basis of the technical scheme, the invention can be improved as follows.
Further, each getter assembly comprises a getter, two getter leads, two lead pads, two getter ceramic columns and two getter pins, wherein the two getter leads are respectively connected TO two ends of the getter, the getter pins are installed on the TO base at intervals, one ends of the getter pins extend into the accommodating cavity, the getter ceramic columns are installed on the outer sides of the getter pins so as TO ensure insulation between the getter pins and the TO base, and the two getter leads are respectively connected TO the ends of the two getter pins through the two lead pads.
Further, a gap between the getter baffle and the getter is not less than 0.5mm.
Further, a gap between the ASIC hybrid integrated circuit and the getter barrier is not less than 0.2mm.
Further, the vacuum sealing piece further comprises an air extraction copper pipe, the air extraction copper pipe is hermetically welded to the outer side of the sealing cavity, and the air extraction copper pipe is communicated with the inner space of the sealing cavity.
Further, an annular flange is formed on the TO base, and the annular flange is provided with a sealing end face for being in airtight sealing with the end face of the sealing cavity.
The application also provides an accelerometer, which comprises a triaxial bracket and four gauge outfit modules according to any one of claims 1 to 6, wherein the triaxial bracket is provided with a mounting surface and four obliquely arranged mounting surfaces, the mounting surface is positioned at the bottom end of the triaxial bracket, the four mounting surfaces are sequentially arranged along the circumferential direction of the triaxial bracket to form a quadrangular frustum structure with the bottom surface dimension larger than the top surface dimension, each mounting surface is provided with a mounting hole, and the four gauge outfit modules are correspondingly arranged in the mounting holes one by one.
The technical scheme has the following beneficial technical effects:
The accelerometer is integrated by four groups of independent gauge outfit modules through redundant configuration layout, and compared with the accelerometer with three independent shafts, the accelerometer has the advantages of small mass and volume, compact structure, higher precision and reliability.
On the basis of the technical scheme, the invention can be improved as follows.
Further, the straight lines of the normals of all the assembly surfaces intersect at one point, and the included angle between the normals of the assembly surfaces and the normal direction of the installation surface is 50-60 degrees.
Furthermore, the gauge outfit module is locked through the set screw after being assembled with the triaxial bracket.
Drawings
FIG. 1 is a schematic diagram of a single-axis differential resonance Liang Biaotou module according to an embodiment of the present invention;
in fig. 2, a is a schematic perspective view of a TO component, and B is a schematic cross-sectional view of the TO component;
fig. 3 is a schematic structural diagram of an accelerometer according to a second embodiment of the invention;
FIG. 4 is a diagram illustrating a redundant configuration layout of four header modules in a second embodiment of the present invention.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. Embodiments of the application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. In the following embodiments, "connected" is understood to mean "electrically connected", "communicatively connected", and the like, if the connected circuits, modules, units, and the like have electrical or data transferred therebetween.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
Example 1
The first embodiment provides a uniaxial differential resonance Liang Biaotou module 10, which includes a vacuum seal 1 and two TO components 2.
Vacuum seal 1 comprises a sealed cavity 11 and a suction copper tube 12.
Wherein, the both ends opening of sealed cavity 1, the airtight welding of copper pipe 12 of bleeding is in the outside of sealed cavity 11, and copper pipe 12 of bleeding communicates with the inner space of sealed cavity 11.
The two TO parts 2 are symmetrically packaged at two ends of the sealed cavity 1; each TO component 2 includes a TO base 21, a resonant beam chip 22, an ASIC hybrid integrated circuit 23, a getter assembly 24, a getter barrier 25, ceramic posts 26, and pins 27.
The TO base 21 is provided with a containing cavity with one end open, a pin 27 is connected TO the TO base 21 and extends into the containing cavity, a ceramic column 26 is arranged on the outer side of the pin 27 TO ensure insulation of the pin 27 and the TO base 21, an ASIC (application specific integrated circuit) hybrid integrated circuit 23 is arranged on the end face of the ceramic column 26, a resonance beam chip 22 is connected TO the end part of the pin 27, the ASIC hybrid integrated circuit 23 is positioned between the resonance beam chip 22 and the bottom face of the containing cavity, a getter assembly 24 is arranged on one side, far away from the resonance beam chip 22, of the ASIC hybrid integrated circuit 23, a getter baffle 25 is arranged at the opening of the containing cavity of the TO base 21, and the getter assembly 24 and the ASIC hybrid integrated circuit 22 are respectively positioned on two sides of the getter baffle 25; the two TO components 21 are disposed opposite one another with the ends of the resonant beam chip 22.
Each getter assembly 24 comprises a getter 241, two getter leads 242, two lead pads 243, two getter ceramic posts 244 and two getter pins 245, wherein the two getter leads 242 are respectively connected TO two ends of the getter 241, the getter pins 245 are installed on the TO base 21 at intervals, one ends of the getter pins extend into the accommodating cavity, the getter ceramic posts 244 are installed on the outer sides of the getter pins 245 TO ensure insulation between the getter pins 245 and the TO base 21, and the two getter leads 242 are respectively connected TO the ends of the two getter pins 245 through the two lead pads 243.
Wherein the gap between the getter baffle and the getter is not less than 0.5mm; the gap between the ASIC hybrid integrated circuit and the getter baffle is not less than 0.2mm.
TO ensure an effective seal between the TO component 2 and the sealed cavity 1, an annular flange 211 is formed on the TO base 21, the annular flange 211 having a sealing end face for sealing with the end face of the sealed cavity 1.
For a better understanding of the embodiments of the present application, the manufacture of the header module 10 is described in detail below.
The first step: fabrication of TO component 2:
(1) And the TO base 21, the contact pins 27 and the getter contact pins 245 are made of kovar alloy, and are heated TO 600-1100 ℃ in a hydrogen atmosphere for 10-30 min after the cleaning is finished, so as TO perform hydrogen burning annealing treatment.
(2) After the TO base 21, the getter ceramic column 244, the pin 27, the getter pin 245 and the getter ceramic column 244 are assembled, the assembly is fixed by a fixture, the airtight welding is adopted by adopting brazing filler metal, the brazing filler metal is selected TO have the welding temperature of 700 ℃ TO 900 ℃, the leakage rate of the TO base 21 is better than 10 < -11 > Pa/m 3 & s, and the electrical insulation among the pin 27, the getter pin 245 and the TO base 21 is ensured.
(3) The getter 241 is welded to the two getter pins 245 through the lead pads 243 at both ends, and the temperature of the getter 241 is not higher than 450 ℃ during welding, and the welding mode adopts laser spot welding.
(4) The getter baffle 245 is assembled and fixed at the opening of the accommodating cavity of the TO base 21 by laser spot welding, and the temperature on the getter 241 is not higher than 450 ℃ during the fixed welding. The gap between the getter baffle 245 and the getter 241 is not less than 0.5mm after assembly.
(5) The ASIC hybrid integrated circuit 23 is assembled and fixed on the end faces of the 4 ceramic posts 26 in a manner of using high-temperature glue with a curing temperature not exceeding 450 ℃ and a glass transition temperature not lower than 300 ℃. The ASIC hybrid integrated circuit 23 and the ceramic posts 26 are electrically interconnected by gold wires. After assembly, the gap between the ASIC hybrid integrated circuit 23 and the getter barrier 25 is no less than 0.2mm.
(6) The resonance beam chip 22 is fixed on the end face of the contact pin 27 through 4 points and is fixed through high-temperature glue, the curing temperature is not higher than 300 ℃, and the glass transition temperature of the high-temperature glue is not lower than 260 ℃; the resonant beam chip 22 and the ASIC hybrid integrated circuit 23 are electrically interconnected by gold wires.
And a second step of: manufacturing of the vacuum sealing member 1:
(1) The sealing cavity 11 of the vacuum sealing member 1 adopts kovar alloy, and after the cleaning of the parts is finished, the parts are heated to 600 to 1100 ℃ in a hydrogen atmosphere for 10 to 30 minutes, and then hydrogen burning annealing treatment is carried out;
(2) The air extraction copper pipe 12 of the vacuum sealing piece 1 is made of oxygen-free copper material, the copper pipe is pickled to remove surface oxides, and the copper pipe is dried after cleaning.
(3) After the sealed cavity 11 and the air extraction copper pipe 12 are assembled, the brazing filler metal is adopted for airtight welding. The solder is selected to be welded at 700-900 ℃, and the leak rate of the vacuum sealing piece 1 is better than 10 -11Pa/m3 s.
And a third step of: manufacturing of the header module 10:
(1) Two TO parts, TO part 2 and TO part 2', respectively, are provided, and TO part 2' are assembled and fixed with vacuum sealing 1, respectively. When assembled, the TO component 2 and TO component 2' are mirror image arranged about the vacuum seal 1, forming a differential configuration. The sealing end surface of the TO base 21 of the TO component 2 is hermetically sealed with the upper sealing surface 1a of the vacuum seal 1, and the sealing end surface of the TO base 21 'of the TO component 2' is hermetically sealed with the lower sealing surface 1b of the vacuum seal 1. The sealing mode can be low-temperature solder sealing or laser welding, and the sealing is carried out by ensuring that the temperature of the resonance beam chip 22 and the ASIC hybrid integrated circuit 23 is not higher than 200 ℃.
(2) The gauge outfit module 10 is connected with a vacuum treatment system through an air extraction copper pipe 12, and a vacuum generator and a valve of the vacuum treatment system are opened to detect the leakage of the whole gauge outfit module 10, wherein the leakage rate is superior to 10 -11Pa/m3 s. After the vacuum degree in the gauge outfit module 10 is superior to 10 -7 Pa, starting the baking gauge outfit module 1, keeping the temperature of the gauge outfit module 1 between 150 ℃ and 200 ℃, keeping the temperature for 24 to 72 hours, and then cooling naturally to room temperature.
(3) Two ends of the special activation power supply for the getter are respectively connected with two poles of the getter 241 through the getter pins 245, the activation power supply is turned on, the getter is activated for 10min to 20min, and the activation power supply is turned off.
(4) The vacuum generator and valves of the vacuum processing system are closed and the suction copper tube 12 is sealed and pinched off using ultrasonic welding.
The meter head module 10 adopts two TO parts 2 symmetrically packaged at two ends of the sealing cavity 11 TO form a differential mode structure, so that common mode noise can be eliminated, the offset temperature coefficient and the second-order nonlinear coefficient can be reduced, the environmental adaptability is good, and the precision is high in the whole temperature range; in addition, the getter component 24 is arranged in the gauge outfit module 10, so that the vacuum degree change caused by the release of the impurity gas in the sealed cavity 11 of the gauge outfit module 10 is avoided, the stable working environment of the resonant beam chip 22 and the ASIC hybrid integrated circuit 23 is ensured, and the reliability of the gauge outfit module 10 is enhanced.
Example two
The present embodiment provides an accelerometer 100, including a triaxial bracket 20 and four gauge outfit modules 10 according to the first embodiment, the triaxial bracket 20 has a mounting surface 20a and four inclined mounting surfaces 20b, the mounting surface 20a is located at the bottom end of the triaxial bracket 20, the four mounting surfaces 20b are sequentially arranged along the circumferential direction of the triaxial bracket 20 to form a quadrangular frustum structure with a bottom surface dimension larger than a top surface dimension, each mounting surface 20b is formed with a mounting hole 20c, and the four gauge outfit modules 10 are correspondingly mounted in the mounting holes 20c one by one and locked by fixing screws 30.
Preferably, the straight lines of the normals of all the mounting surfaces 20b intersect at a point, and the included angle between the normals of the mounting surfaces 20b and the normal direction of the mounting surface 20a is in the range of 50-60 degrees.
For a better understanding of embodiments of the present application, the fabrication of accelerometer 100 is described in detail below.
Assembly of the accelerometer:
(1) The normal directions of the 4 obliquely arranged assembly surfaces 20b correspond to the gauge head module sensitive axes 201, 202, 203 and 204 respectively, and the included angles of all the gauge head module sensitive axes and the installation surface 20a are the same, and the included angles range from 50 degrees to 60 degrees.
(2) After 4 groups of gauge outfit modules 10 are assembled with the assembly holes 20c corresponding to 4 inclined assembly surfaces 20b, the gauge outfit modules are locked by the fixing screws 30, and the screws 30 are glued and loose-proof.
The accelerometer is integrated by four groups of independent gauge outfit modules 10 through redundant configuration layout, and compared with the accelerometer with three independent shafts, the accelerometer has the advantages of small mass and volume, compact structure and higher precision and reliability.
It should be apparent that the foregoing description is not intended to limit the invention to the particular embodiments disclosed, but is not limited to the particular embodiments disclosed, as variations, modifications, additions or substitutions within the spirit and scope of the invention will become apparent to those skilled in the art.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (7)
1. A single axis differential resonance Liang Biaotou module comprising a vacuum seal and two TO components;
the vacuum sealing piece comprises a sealing cavity with two open ends;
The two TO parts are symmetrically packaged at two ends of the sealing cavity; each of the TO components includes a TO base, a resonant beam chip, an ASIC hybrid integrated circuit, a getter assembly, a getter barrier, a ceramic column, and pins; the TO base is provided with a containing cavity with an opening at one end, the contact pin is connected TO the TO base and extends into the containing cavity, the ceramic column is arranged on the outer side of the contact pin TO ensure insulation between the contact pin and the TO base, the ASIC hybrid integrated circuit is arranged on the end face of the ceramic column, the resonance beam chip is connected TO the end part of the contact pin, the ASIC hybrid integrated circuit is arranged between the resonance beam chip and the bottom surface of the containing cavity, the getter component is arranged on the TO base and fixedly connected TO one side, far away from the resonance beam chip, of the ASIC hybrid integrated circuit, the getter baffle is arranged at the opening of the containing cavity of the TO base, and the getter component and the ASIC hybrid integrated circuit are respectively arranged on two sides of the getter baffle; one end of each TO component with the resonant beam chip is arranged opposite TO the other end of each TO component with the resonant beam chip;
Each getter assembly comprises a getter, two getter leads, two lead bonding pads, two getter ceramic columns and two getter pins, wherein the two getter leads are respectively connected TO two ends of the getter, the getter pins are installed on the TO base at intervals, one ends of the getter pins extend into the accommodating cavity, the getter ceramic columns are installed on the outer sides of the getter pins so as TO ensure insulation of the getter pins and the TO base, and the two getter leads are respectively connected TO the ends of the two getter pins through the two lead bonding pads;
An annular flange is formed on the TO base and is provided with a sealing end face for sealing with the end face of the sealing cavity in a sealing mode.
2. The single axis differential resonance Liang Biaotou module as set forth in claim 1, wherein the gap between the getter baffle and the getter is not less than 0.5mm.
3. The single axis differential resonance Liang Biaotou module as set forth in claim 2, wherein a gap between the ASIC hybrid integrated circuit and the getter barrier is not less than 0.2mm.
4. The single-axis differential resonance Liang Biaotou module as set forth in claim 1, wherein the vacuum seal further comprises a copper suction tube hermetically welded to the outside of the sealed cavity, the copper suction tube communicating with the interior space of the sealed cavity.
5. An accelerometer characterized in that the accelerometer comprises a triaxial bracket and four gauge outfit modules according to any one of claims 1 to 4, wherein the triaxial bracket is provided with a mounting surface and four obliquely arranged mounting surfaces, the mounting surface is positioned at the bottom end of the triaxial bracket, the four mounting surfaces are sequentially arranged along the circumferential direction of the triaxial bracket to form a quadrangular frustum structure with the bottom surface dimension larger than the top surface dimension, each mounting surface is provided with a mounting hole, and the four gauge outfit modules are correspondingly arranged in the mounting holes one by one.
6. The accelerometer of claim 5, wherein all straight lines of the normal lines of the mounting surface intersect at a point, and an included angle between the normal line of the mounting surface and the normal line of the mounting surface ranges from 50 degrees to 60 degrees.
7. The accelerometer of claim 5, wherein the gauge outfit is locked with the tri-axial support after assembly by a set screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111440050.8A CN114397478B (en) | 2021-11-30 | 2021-11-30 | Single-axis differential resonance Liang Biaotou module and accelerometer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111440050.8A CN114397478B (en) | 2021-11-30 | 2021-11-30 | Single-axis differential resonance Liang Biaotou module and accelerometer |
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| CN114397478A CN114397478A (en) | 2022-04-26 |
| CN114397478B true CN114397478B (en) | 2024-05-10 |
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