CN1143815A - Flash EEPROM cell and manufacturing methods thereof - Google Patents
Flash EEPROM cell and manufacturing methods thereof Download PDFInfo
- Publication number
- CN1143815A CN1143815A CN96107303A CN96107303A CN1143815A CN 1143815 A CN1143815 A CN 1143815A CN 96107303 A CN96107303 A CN 96107303A CN 96107303 A CN96107303 A CN 96107303A CN 1143815 A CN1143815 A CN 1143815A
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- CN
- China
- Prior art keywords
- silicon chip
- flash eeprom
- floating grid
- eeprom cell
- many
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 44
- 239000010703 silicon Substances 0.000 claims abstract description 44
- 238000007667 floating Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 24
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 20
- 229920005591 polysilicon Polymers 0.000 claims abstract description 20
- 239000012535 impurity Substances 0.000 claims description 11
- 238000005516 engineering process Methods 0.000 claims description 8
- 239000011229 interlayer Substances 0.000 claims description 4
- 238000004062 sedimentation Methods 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 abstract description 2
- 235000000396 iron Nutrition 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 238000002955 isolation Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32055—Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- High Energy & Nuclear Physics (AREA)
- Power Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
The invention discloses a high speed EEPROM unit, in particular to a unit which forms a first polysilicon film into a graph for a floating grid by the etching process using a mask, forms a source region and a drain region by injecting foreign irons, and forms a control grid extending towards the direction of a channel and minimizes the size of the control grid. Besides, the invention provides a unique structure for preventing the silicon chip from sinking; thereby the reliability of the parts of the device is improved.
Description
The present invention relates to a kind of flash EEPROM (EEPROM (Electrically Erasable Programmable Read Only Memo)) unit and manufacture method thereof, a unit to the control grid of the channel direction extension of floating grid is particularly arranged.
Have the flash EEPROM of programming and erase feature, its unit kind is divided into stacked gate structure and separate gate structure.Being illustrated referring now to accompanying drawing. Figure of description 1A represents the manufacture method of the unit with stacked gate structure commonly used to 1C.
Figure 1A is the sectional view of a flash EEPROM cell of commonly using with stacked gate structure along the A-A direction of Fig. 2 to 1C, is used to explain manufacture method.
In Figure 1A, raceway groove oxide film 2 and first polysilicon film, 3 sequential aggradations are on the silicon chip 1 with a place and an active area.Then, first polysilicon film 3 and raceway groove oxide film 2 use in order and take a picture and etch process formation figure, as shown in Figure 2.The dielectric film 4 and second polysilicon film 5 are placed on the structure of formed thereby, dielectric film 4 is formed by sequential aggradation oxide film and nitride film again.
With reference to Figure 1B, after coating the photoresist film (not shown) on the shaped structure, with the photograph technology of using mask photoresist film is formed figure for a control grid.With the self-regulation etch process of the photoresist film that uses the formation figure as mask, with second polysilicon film 5, dielectric film 4, first polysilicon film 3, the 2 order etchings of raceway groove oxide film, form the grid of storage unit, raceway groove oxide film 2, floating grid 3A, dielectric film 4, control grid 5A superpose in this element.
In Fig. 1 C, remove photoresist film after, implanting impurity ion forms source region and drain region (6 and 7) on the silicon chip 1 that exposes.Interlayer dielectric film 8 is deposited on the shaped structure.Then, interlayer dielectric film 8 forms the figure that exposes silicon chip, therefore forms a contact hole 9.Label 10 expression places among Fig. 2 isolate.
As above described in detail, because EEPROM of the prior art unit, per two unit need a contact hole, and this has just limited subtracting of cellar area.In addition, silicon chip (among Fig. 2 " the s district) may sink, and the first polycrystalline sheet is etched at this by the self-regulation etch process of Figure 1B.This can make the continuity of source line degenerate and cause integrity problem.For solve this type of problem, can use bury knot technology make the place oxide film form before the source line just form.Even in this case, also can make dwindling of cellar area be subjected to another restriction owing to the transverse dispersion of foreign ion.
An object of the present invention is to provide a kind of method of a kind of flash EEPROM cell and this unit of manufacturing, it can solve above shortcoming and reduce cellar area.Another object of the present invention provides a kind of flash EEPROM cell that has to the control grid of the channel direction stretching, extension of floating grid.
In order to achieve the above object, according to a flash EEPROM cell array of the present invention, composed as follows:
Many modes by row and column are arranged in the floating grid on the silicon chip;
The many control grids of mode successive sedimentation on floating grid and silicon chip by row;
Many being formed on the silicon chip by column direction is arranged in isolated area between the floating grid; And
Many being formed on the silicon chip is deposited under the control grid and source line and thread cast-off between floating grid by line direction.
A kind of method of making flash EEPROM cell may further comprise the steps:
Order forms raceway groove oxide film, first polysilicon film, dielectric film on silicon chip;
Order forms figure on dielectric film, first polysilicon film, raceway groove oxide film;
Inject first foreign ion and form a source region and a drain region;
Method with oxidation forms an oxide film in source region and drain region;
Second polysilicon film is deposited on the above-mentioned shaped structure;
Order in the selection district of second polysilicon film, become the dielectric film of figure, form figure on first polysilicon film that has become figure and the raceway groove oxide film that becomes figure, so that form the cell array with floating grid and control grid overlaying structure, the control grid extends to the vertical direction in source region and drain region;
Form a cell isolation district by selecting the zone that second foreign ion is injected into silicon chip.
In order to fully understand essence of the present invention and purpose, invention is described in detail below in conjunction with accompanying drawing:
Figure 1A is to be used to explain the sectional view of manufacture method that has the EEPROM unit of stacked gate structure by one of prior art manufacturing to 1C.
Fig. 2 is one and is used to explain the sketch of Figure 1A to 1C;
Fig. 3 A is to be used to explain the sectional view of making the method for an EEPROM unit with stacked gate structure by the present invention to 3C; With
Fig. 4 is the method for an EEPROM unit is made in expression by the present invention a sketch.
Similar fixed reference feature is represented similar part in several accompanying drawings.
Fig. 3 A is a sectional view to 3C, is used to explain the method that has the EEPROM unit of stacked gate structure by manufacturing of the present invention.With reference to figure 4, explanation will provide below.(Fig. 3 A and 3B are the sectional view of Fig. 4 along the C-C direction, and Fig. 3 C is the sectional view of Fig. 4 along the B-B direction)
In Fig. 3 A, raceway groove oxide film 2, the first polysilicon film 3B, first oxide film 12, nitride film 13 (first oxide film 12 and nitride film 13 form dielectric film 14) order formation on silicon chip, whole zone is an active area.On shaped structure, coat photoresist film 11, floating grid is formed figure with the photograph technology of using mask with photoresist film 11, the exposed region of dielectric film 14 is formed figure, will become the photoresist film 11 of figure to form the first polysilicon film 3B and raceway groove oxide film 2 then as mask.Then, first foreign ion is injected in the silicon chip 1 of exposure, a source region 6A and a drain region 7A have just formed.
In above-mentioned technology, when silicon chip 1 was the p-type, first foreign ion was the n-type.When silicon chip 1 was the n-type, first foreign ion was the p-type.When silicon chip 1 was the p-type, high concentration was injected as the n-of arsenic type foreign ion and is formed source region and drain region.
Fig. 3 B is illustrated in and removes photoresist film 11 after behind the peroxide chemical industry one, second oxide film 16 just is created on source region and the drain region (6A and 7A) thickly, then second polysilicon film 15 is deposited on the shaped structure.In above-mentioned oxidation technology process, form second thick oxide film 16 at source region and drain region (6A and 7A), its formation is because implanting impurity ion has improved due to the growth rate of oxide film.
In Fig. 3 C, on shaped structure, coat photoresist film 11, with the photograph technology of using mask photoresist film 17 is formed figure for a control grid, second polysilicon film 15 is being formed figures, and the photoresist film 17 that will become figure is then processed with the self-regulation etch process to have become the dielectric film 14 of figure, become the first polysilicon film 3B and the raceway groove oxide film 2 that becomes figure of figure as mask.As a result, just generated the cell array with overlapping floating grid 3B and control grid 15A structure, wherein controlled grid 15A and extend to channel direction, Fig. 3 C is the sectional view of Fig. 4 along the B-B direction.Shown in Fig. 3 B, because the second very thick oxide film 16 of generation that implanting impurity ion causes can prevent that silicon chip 1 is exposed in above-mentioned self-regulation etch process (Fig. 3 C does not represent) process, silicon chip 1 sagging phenomenon just can not take place.In addition, because control grid 15A and raceway groove during Fig. 3 is B (the C-C section among Fig. 4) extend to same direction, source line and thread cast-off are connected and the outside contact point (that is, needn't have point of contact in cell array) of the cell array that forms, and it can make the cellar area miniaturization.
By the control grid being used the etch process of mask, the selection district F of silicon chip 1 as shown in Figure 4 is exposed, and forms cell isolation district 18 by selecting district F that second foreign ion is injected silicon chip.Cell isolation district 18 prevents to produce punch through between raceway groove.Because implanting impurity ion does not have the additional masking operation when forming cell isolation district 18, so the needs that occur in the isolation technology that it can avoid commonly using are regulated the situation of the caused increase cellar area of allow clearance.
In mentioned above, when silicon chip 1 was the p-type, second foreign ion was the p-type.When silicon chip 1 was the n-type, second foreign ion was the n-type.When silicon chip 1 was the p-type, high concentration was injected as the p-of boron type foreign ion and is formed cell isolation district 18.
Form cell array by the present invention, comprise following steps:
Many modes by row and column are arranged in the floating grid on the silicon chip;
The many control grids of mode successive sedimentation on floating grid and silicon chip by row;
Many being formed on the silicon chip is arranged in isolated area between the floating grid by column direction; And
Many being formed on the silicon chip is deposited under the control grid and source line and thread cast-off between floating grid by line direction.
When silicon chip be the p-type when mixing here source line and thread cast-off be that the n-type mixes, isolated area is that the p-type mixes.Source line and thread cast-off are that the p-type mixes when silicon chip is the doping of n-type, and isolated area is that the n-type mixes.And the source line does not contact in cell array region with thread cast-off.
As mentioned above, by the present invention, with the etch process that uses mask first polysilicon film is formed figure for a floating grid, form source region and drain region by implanting impurity ion, and form the control grid that extends to channel direction, just can make unit size reduce to minimum.And, to sink in the self-regulation etch process by preventing silicon chip, the present invention has significant effect aspect device reliability.
Although above invention has been described to a certain extent with most preferred embodiment, principle of the present invention has been described just also.It should be explicitly made clear at this point that the present invention is not limited only to most preferred embodiment described here and illustrated.Therefore, in scope and spirit of the present invention, can produce various variations, and they are included in all among the further embodiment of the present invention.
Claims (5)
1. flash EEPROM cell array comprises:
Many modes by row and column are arranged in the floating grid on the silicon chip;
The many control grids of mode successive sedimentation on said floating grid and said silicon chip by row;
Many being formed on the said silicon chip is arranged in isolated area between the said floating grid by column direction; And
Many being formed on the said silicon chip is deposited under the said control grid and source line and thread cast-off between said floating grid by line direction.
2. according to the said flash EEPROM cell array of claim 1, it is characterized in that: when said silicon chip was p-type impurity, said source line and thread cast-off were n-type impurity, and said isolated area is a p-type impurity.
3. according to the said flash EEPROM cell array of claim 1, it is characterized in that: when said silicon chip was n-type impurity, said source line and thread cast-off were p-type impurity, and said isolated area is a n-type impurity.
4. according to the said flash EEPROM cell array of claim 1, it is characterized in that: said source line does not contact in said cell array region with thread cast-off.
5. a method of making flash EEPROM cell may further comprise the steps:
Order forms raceway groove oxide film, first polysilicon film, dielectric film on silicon chip;
Order forms figure on said dielectric film, said first polysilicon film and said raceway groove oxide film;
Inject first foreign ion and form a source region and a drain region;
Method with oxidation forms an oxide film in said source region and said drain region; Foreign ion forms source region and drain region (6 and 7).Interlayer dielectric film 8 is deposited on the shaped structure.Then, interlayer dielectric film 8 forms the figure that exposes silicon chip, therefore forms a contact hole 9.Label 10 expression places among Fig. 2 isolate.
As above described in detail, because EEPROM of the prior art unit, per two unit need a contact hole, and this has just limited subtracting of cellar area.In addition, silicon chip (" s " district among Fig. 2) may sink.And the first polycrystalline sheet is etched at this by the self-regulation etch process of Figure 1B.This can make the continuity of source line degenerate and cause integrity problem.For solve this type of problem, can use bury knot technology make the place oxide film form before the source line just form.Even in this case, also can make dwindling of cellar area be subjected to another restriction owing to the transverse dispersion of foreign ion.
An object of the present invention is to provide a kind of method of a kind of flash EEPROM cell and this unit of manufacturing, it can solve above shortcoming and reduce cellar area.Another object of the present invention provides a kind of flash EEPROM cell that has to the control grid of the channel direction stretching, extension of floating grid.
In order to achieve the above object, according to a flash EEPROM cell array of the present invention, composed as follows:
Many modes by row and column are arranged in the floating grid on the silicon chip;
The many control grids of mode successive sedimentation on floating grid and silicon chip by row;
Many being formed on the silicon chip by column direction is arranged in isolated area between the floating grid; And
Many being formed on the silicon chip is deposited under the control grid and source line and thread cast-off between floating grid by line direction.
A kind of method of making flash EEPROM cell may further comprise the steps:
Order forms raceway groove oxide film, first polysilicon film, dielectric film on silicon chip;
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR9736/95 | 1995-04-25 | ||
| KR1019950009736A KR0172271B1 (en) | 1995-04-25 | 1995-04-25 | Method of manufacturing flash eeprom cell |
| KR9736/1995 | 1995-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1143815A true CN1143815A (en) | 1997-02-26 |
| CN1100351C CN1100351C (en) | 2003-01-29 |
Family
ID=19412871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96107303A Expired - Fee Related CN1100351C (en) | 1995-04-25 | 1996-04-25 | Flash EEPROM cell and manufacturing methods thereof |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR0172271B1 (en) |
| CN (1) | CN1100351C (en) |
| DE (1) | DE19616603C2 (en) |
| GB (1) | GB2300302B (en) |
| TW (1) | TW306069B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1298026C (en) * | 2003-10-30 | 2007-01-31 | 上海集成电路研发中心有限公司 | Method for modifying formation procedure for fabricating cumulate texture of controlling grid of flash memory |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100871547B1 (en) * | 2007-08-14 | 2008-12-01 | 주식회사 동부하이텍 | Nor flash memory device and method for fabricating the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5047981A (en) * | 1988-07-15 | 1991-09-10 | Texas Instruments Incorporated | Bit and block erasing of an electrically erasable and programmable read-only memory array |
| JPH0247868A (en) * | 1988-08-10 | 1990-02-16 | Fujitsu Ltd | Nonvolatile semiconductor memory device |
| US5087584A (en) * | 1990-04-30 | 1992-02-11 | Intel Corporation | Process for fabricating a contactless floating gate memory array utilizing wordline trench vias |
| EP0509696A3 (en) * | 1991-04-18 | 1993-02-03 | National Semiconductor Corporation | Contactless flash eprom cell using a standard row decoder |
| US5350706A (en) * | 1992-09-30 | 1994-09-27 | Texas Instruments Incorporated | CMOS memory cell array |
| WO1994014196A1 (en) * | 1992-12-08 | 1994-06-23 | National Semiconductor Corporation | High density contactless flash eprom array using channel erase |
| DE69417211T2 (en) * | 1994-04-12 | 1999-07-08 | Stmicroelectronics S.R.L., Agrate Brianza, Mailand/Milano | Planarization process for the production of integrated circuits, in particular for non-liquid semiconductor memory devices |
-
1995
- 1995-04-25 KR KR1019950009736A patent/KR0172271B1/en not_active IP Right Cessation
-
1996
- 1996-04-17 TW TW085104591A patent/TW306069B/zh not_active IP Right Cessation
- 1996-04-18 GB GB9608086A patent/GB2300302B/en not_active Expired - Fee Related
- 1996-04-25 DE DE19616603A patent/DE19616603C2/en not_active Expired - Fee Related
- 1996-04-25 CN CN96107303A patent/CN1100351C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1298026C (en) * | 2003-10-30 | 2007-01-31 | 上海集成电路研发中心有限公司 | Method for modifying formation procedure for fabricating cumulate texture of controlling grid of flash memory |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2300302A (en) | 1996-10-30 |
| GB9608086D0 (en) | 1996-06-19 |
| GB2300302B (en) | 1999-07-21 |
| TW306069B (en) | 1997-05-21 |
| DE19616603A1 (en) | 1996-10-31 |
| KR0172271B1 (en) | 1999-02-01 |
| KR960039406A (en) | 1996-11-25 |
| DE19616603C2 (en) | 2002-12-12 |
| CN1100351C (en) | 2003-01-29 |
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Granted publication date: 20030129 Termination date: 20100425 |