CN114378961A - Machining device and method for using machining device - Google Patents

Machining device and method for using machining device Download PDF

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Publication number
CN114378961A
CN114378961A CN202111126920.4A CN202111126920A CN114378961A CN 114378961 A CN114378961 A CN 114378961A CN 202111126920 A CN202111126920 A CN 202111126920A CN 114378961 A CN114378961 A CN 114378961A
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workpiece
unit
machining
processing device
information
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CN202111126920.4A
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Chinese (zh)
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大森崇史
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Disco Corp
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Disco Corp
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Publication of CN114378961A publication Critical patent/CN114378961A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/12—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using record carriers
    • G05B19/124—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using record carriers using tapes, cards or discs with optically sensed marks or codes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
    • G06K7/1404—Methods for optical code recognition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Automation & Control Theory (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Dicing (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • General Factory Administration (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Numerical Control (AREA)

Abstract

The invention provides a processing device and a using method of the processing device, wherein the processing device can prevent input errors of information. The processing device processes a processed object, wherein the processing device comprises: a chuck table for holding a workpiece; a processing unit for processing the processed object held by the chuck table; a control unit; and a reading unit that reads a code including information corresponding to a plurality of operation commands specifying operations for the machining device and information corresponding to an order in which the operations specified by the operation commands are executed, wherein the control unit controls the machining device based on the code read by the reading unit so that the operations specified by the plurality of operation commands are executed in the order.

Description

Machining device and method for using machining device
Technical Field
The present invention relates to a machining apparatus for machining a workpiece and a method of using the machining apparatus.
Background
In the manufacturing process of the device chip, a wafer is used in which devices are formed in a plurality of regions defined by a plurality of planned dividing lines (streets) arranged in a grid pattern. The wafer is divided along the lines to be divided, thereby obtaining a plurality of device chips each having a device. The device chip is incorporated in various electronic apparatuses such as a mobile phone, a personal computer, and the like.
For dividing a wafer, a cutting device for cutting a workpiece with an annular cutting tool, a laser processing device for performing laser processing on a workpiece, or the like is used. For example, patent document 1 discloses a cutting device including: a cassette mounting area for mounting a cassette for accommodating a plurality of workpieces; a chuck table for holding a workpiece; and a cutting unit to which a cutting tool is attached. The wafer accommodated in the cassette is transported and held by the chuck table, and the wafer is cut and divided by rotating the cutting tool to cut into the wafer.
In recent years, as electronic devices have been reduced in size and thickness, device chips have been required to be reduced in thickness. Therefore, the wafer may be thinned before the wafer is divided. For thinning a wafer, a grinding apparatus for grinding a workpiece by a grinding wheel including a plurality of grinding wheels, a polishing apparatus for polishing a workpiece by a disk-shaped polishing pad, or the like is used.
Patent document 1: japanese laid-open patent publication No. 7-45556
The various processing apparatuses described above include: a display unit that displays various information related to processing; and an input unit for inputting information to the processing device. The operator of the machining apparatus operates the input unit while referring to the information displayed on the display unit, and inputs predetermined information into the machining apparatus. For example, before the machining of the workpiece by the machining device, the operator inputs machining conditions (recipes) suitable for machining the workpiece to the machining device in accordance with the operation screen displayed on the display unit.
The machining conditions include a plurality of items such as the size and material of the workpiece, the moving speed of the components of the machining apparatus, and the position of the region to be machined in the workpiece. Therefore, when inputting machining conditions to the machining apparatus, the operator needs to perform input work (input of numerical values and characters, selection of items, and the like) on each of the plurality of input fields displayed on the display unit by operating the input unit. As a result, the frequency of operation of the input unit by the operator increases, and input errors tend to occur.
In addition to the machining conditions, various information is input to the machining device. For example, before starting the machining of the workpiece by the machining apparatus, it is necessary to perform operations such as inputting an execution instruction of a process (system initialization) for moving each component included in the machining apparatus to a predetermined initial position to the machining apparatus, and specifying information of the workpiece to be machined among the plurality of workpieces stored in the cassette. When such an input operation is performed, there is a possibility that an input error of the operator may cause an erroneous information to be input to the machining device.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a processing apparatus and a method of using the processing apparatus, which can prevent an input error of information.
According to one aspect of the present invention, there is provided a processing apparatus for processing a workpiece, the processing apparatus including: a chuck table for holding the workpiece; a machining unit that machines the workpiece held by the chuck table; a control unit; and a reading unit that reads a code including information corresponding to a plurality of operation commands specifying operations for the machining device and information corresponding to an order in which the operations specified by the operation commands are executed, the control unit controlling the machining device based on the code read by the reading unit so that the operations specified by the plurality of operation commands are executed in the order.
Preferably, the processing apparatus further includes a display unit, and the control unit causes the display unit to display the plurality of operation commands and the sequence in accordance with the code read by the reading unit. In addition, the code is preferably a matrix type two-dimensional code.
In addition, according to another aspect of the present invention, there is provided a method of using a machining apparatus that machines a workpiece, the machining apparatus including: a chuck table for holding the workpiece; a machining unit that machines the workpiece held by the chuck table; and a reading unit that reads a code including information corresponding to a plurality of operation commands that specify operations for the machining device and information corresponding to an order in which the operations specified by the operation commands are executed, the method including the steps of: reading the code by the reading section; and controlling the processing device according to the code read by the reading part so as to execute the operation specified by the plurality of operation commands in the order.
Preferably, the machining apparatus further includes a display unit, and the method of using the machining apparatus further includes the steps of: and displaying a plurality of operation instructions and the sequence on the display part according to the codes read by the reading part. In addition, the code is preferably a matrix type two-dimensional code.
A processing device according to an aspect of the present invention includes a reading unit configured to read a code including information corresponding to a plurality of operation commands and information corresponding to an order in which operations specified by the operation commands are executed. Further, the operator can input an operation command and an operation procedure to the machining device without operating an input unit (an operation panel or the like) by causing the reading unit to read the code. This can prevent an input error of information to the processing device.
Drawings
Fig. 1 is a perspective view showing a processing apparatus.
Fig. 2 is a front view showing an operation instruction sheet.
Fig. 3 is a perspective view showing a case where the code is read by the reading section.
Fig. 4 is a front view showing the display section.
Fig. 5 is a flowchart showing the operation of the control unit.
Description of the reference symbols
11: a workpiece; 13: a belt (dicing belt); 15: a frame; 2: a machining device (cutting device); 4: a base station; 4a, 4 b: an opening; 6: a cassette supporting table; 8: a cartridge; 10: a conveying unit (conveying mechanism); 10 a: a grip portion;
12: temporarily placing the area; 14: a guide rail; 16: a conveying unit (conveying mechanism); 18: a moving unit (moving mechanism); 18 a: moving the working table; 20: a dustproof drip-proof cover; 22: a chuck table (holding table); 22 a: a holding surface; 24: a clamp; 26: a processing unit (cutting unit); 28: a cutting tool; 30: a shooting unit; 32: a cleaning unit (cleaning mechanism); 34: a conveying unit (conveying mechanism); 36: a support table; 38: a display unit (display unit, display device); 38 a: a display area; 40: an input unit (input means, input device); 42: a reading unit (reading unit, reading device); 44: a control unit (control means, control device); 50: an operation instruction book; 52: operation information; 54. 54A to 54I: an operating instruction; 56. 56A to 56I: an operation sequence; 58: coding; 60: a selection key.
Detailed Description
Hereinafter, an embodiment of one embodiment of the present invention will be described with reference to the drawings. First, a configuration example of the processing apparatus according to the present embodiment will be described. Fig. 1 is a perspective view showing a machining apparatus (cutting apparatus) 2 that performs cutting on a workpiece. In fig. 1, the X-axis direction (the machining feed direction, the left-right direction, and the 1 st horizontal direction) and the Y-axis direction (the indexing feed direction, the front-back direction, and the 2 nd horizontal direction) are perpendicular to each other. The Z-axis direction (vertical direction, and height direction) is a direction perpendicular to the X-axis direction and the Y-axis direction.
The processing device 2 includes a base 4 that supports or houses each component constituting the processing device 2. An opening 4a is formed at a corner portion of the base 4 on the distal end side, and a cartridge support base 6 that moves (moves up and down) in the Z-axis direction by an elevating mechanism (not shown) is provided inside the opening 4 a. A cassette 8 capable of accommodating a plurality of workpieces 11 to be processed by the processing apparatus 2 is mounted on the cassette support base 6. In addition, in fig. 1, the outline of the cartridge 8 is shown by a two-dot chain line.
The workpiece 11 is a disk-shaped wafer made of a semiconductor such as silicon, for example, and has a front surface and a back surface which are substantially parallel to each other. The workpiece 11 is divided into a plurality of rectangular regions by a plurality of lines to divide (streets) arranged in a grid pattern so as to intersect each other. Further, devices such as an IC (Integrated Circuit), an LSI (Large Scale Integration), an LED (Light Emitting Diode), and an MEMS (Micro Electro Mechanical Systems) are formed in the region partitioned by the planned dividing line on the front side of the workpiece 11.
A circular tape (dicing tape) 13 having a larger diameter than the workpiece 11 is attached to the back surface side of the workpiece 11. The tape 13 includes a film-like base material and an adhesive (paste layer) on the base material. For example, the base material is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive is made of an epoxy-based, acrylic, or rubber-based adhesive. As the adhesive, an ultraviolet-curable resin that is cured by irradiation of ultraviolet rays can be used.
The outer periphery of the belt 13 is attached to an annular frame 15 made of metal or the like. The frame 15 has a circular opening in the center, the diameter of which is larger than that of the workpiece 11, and the workpiece 11 is disposed inside the opening of the frame 15. When the central portion of the tape 13 is attached to the workpiece 11 and the outer peripheral portion of the tape 13 is attached to the frame 15, the workpiece 11 is supported by the frame 15 via the tape 13.
The workpiece 11 is accommodated in the cassette 8 in a state of being supported by the frame 15, and is processed by the processing apparatus 2. For example, the workpiece 11 is cut and divided along the lines to be divided by the processing device 2, thereby manufacturing a plurality of device chips each including a device.
However, the type, material, shape, structure, size, and the like of the workpiece 11 are not limited. For example, the workpiece 11 may be a wafer (substrate) made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, or the like), glass, sapphire, ceramic, resin, metal, or the like. The type, number, shape, structure, size, arrangement, and the like of the devices are not limited, and the devices may not be formed on the workpiece 11.
A conveying unit (conveying means) 10 that conveys the workpiece 11 is provided behind the opening 4 a. The conveyance unit 10 is configured to be movable in the Y-axis direction, and carries out carrying-out of the workpiece 11 from the cassette 8 and carrying-in of the workpiece 11 into the cassette 8. A grip portion 10a for gripping the frame 15 supporting the workpiece 11 is provided at an end portion of the conveying unit 10 on the opening 4a side (the cassette 8 side).
A temporary storage area 12 for temporarily storing the object 11 to be processed carried out of the cassette 8 or the object 11 to be processed carried into the cassette 8 is provided between the opening 4a and the conveying unit 10. The pause area 12 is provided with a pair of guide rails 14 arranged substantially parallel to each other in the Y-axis direction. The pair of guide rails 14 move to approach and separate from each other in the X-axis direction, and position the workpiece 11 by holding the frame 15 therebetween.
A conveyance unit (conveyance mechanism) 16 that conveys the workpiece 11 is provided in the vicinity of the temporary storage area 12. For example, the conveyance unit 16 includes a plurality of suction pads for sucking and holding the upper surface side of the frame 15 supporting the workpiece 11.
An opening 4b formed in a rectangular shape with its longitudinal direction along the X-axis direction is provided on a side of the opening 4 a. Further, a moving means (moving mechanism) 18 having a flat plate-like moving table 18a is provided inside the opening 4 b. The moving unit 18 is, for example, a ball screw type moving mechanism, and moves the moving table 18a in the X-axis direction. Further, on both sides of the moving table 18a, bellows-shaped dust-proof and drip-proof covers 20 are provided, and the dust-proof and drip-proof covers 20 cover a part of the moving unit 18 and extend and contract in the X-axis direction.
A chuck table (holding table) 22 for holding the workpiece 11 is provided on the movable table 18 a. The upper surface of the chuck table 22 is a flat surface substantially parallel to the horizontal direction (XY plane direction), and constitutes a holding surface 22a for holding the workpiece 11. The holding surface 22a is connected to a suction source (not shown) such as an injector via a flow path (not shown) provided inside the chuck table 22. Further, a plurality of jigs 24 for gripping and fixing the frame 15 for supporting the workpiece 11 are provided around the chuck table 22.
The moving unit 18 moves the chuck table 22 together with the moving table 18a in the X-axis direction. The chuck table 22 is positioned by the moving means 18 in a conveying area a where the workpiece 11 is conveyed and a processing area B where the workpiece 11 is processed. A rotation drive source (not shown) such as a motor is connected to the chuck table 22, and the rotation drive source rotates the chuck table 22 about a rotation axis substantially parallel to the Z-axis direction.
In the machining area B, a machining unit (cutting unit) 26 that cuts the workpiece 11 held by the chuck table 22 is provided. The machining unit 26 has a cylindrical main shaft (not shown) arranged along the Y-axis direction. An annular cutting tool 28 for cutting the workpiece 11 is attached to a distal end portion (one end side) of the spindle. A rotation drive source (not shown) such as a motor for rotating the main shaft is connected to a base end portion (the other end side) of the main shaft. The cutting tool 28 is rotated about a rotation axis substantially parallel to the Y-axis direction by power transmitted from a rotary drive source via the spindle.
Further, a moving means (moving mechanism, not shown) for moving the machining unit 26 in the Y-axis direction and the Z-axis direction is connected to the machining unit 26. For example, the moving means is a ball screw type moving mechanism having a Y-axis ball screw arranged along the Y-axis direction and a Z-axis ball screw arranged along the Z-axis direction. The moving means adjusts the positions of the cutting tool 28 attached to the machining means 26 in the Y-axis direction and the Z-axis direction.
As the cutting tool 28, for example, a hub type cutting tool (hub tool) is used. The hub cutter is configured by integrating an annular base formed of metal or the like and an annular cutting blade formed along the outer peripheral edge of the base. The cutting edge of the hub cutter is formed of an electroformed grindstone in which abrasive grains made of diamond or the like are fixed by a bonding material such as nickel plating. However, as the cutting tool 28, a washer-type cutting tool (washer tool) may be used. The gasketing tool is constituted by an annular cutting edge in which abrasive grains are fixed by a bonding material made of metal, ceramic, resin, or the like.
An imaging unit 30 for imaging the workpiece 11 or the like held by the chuck table 22 is provided at a position overlapping the movement path of the chuck table 22 (between the conveying area a and the processing area B). For example, the imaging unit 30 includes a visible light camera having an imaging element that receives visible light and converts the visible light into an electric signal, or an infrared camera having an imaging element that receives infrared light and converts the infrared light into an electric signal. The image acquired by the imaging unit 30 is used for positioning the workpiece 11 and the machining unit 26 (cutting tool 28) and the like.
A cleaning unit (cleaning mechanism) 32 for cleaning the workpiece 11 is provided behind the chuck table 22. For example, the cleaning unit 32 has: a rotary table for holding a workpiece 11; and a nozzle for supplying a cleaning fluid to the workpiece 11 held by the rotary table. As the fluid for cleaning, a mixed fluid obtained by mixing a liquid (pure water or the like) and a gas (air or the like) is used.
A conveyance unit (conveyance mechanism) 34 that conveys the workpiece 11 between the chuck table 22 and the cleaning unit 32 is provided above the cleaning unit 32. For example, the conveyance unit 34 includes a plurality of suction pads for sucking and holding the upper surface side of the frame 15 supporting the workpiece 11.
A support table 36 is provided behind the machining area B, and a display unit (display unit, display device) 38 is mounted on the support table 36. The display unit 38 displays various information related to the processing apparatus 2. For example, an operation screen for operating the machining device 2, the operating state of the machining device 2, an image of the workpiece 11 acquired by the imaging unit 30, and the like are displayed on the display unit 38. An input unit (input means, input device) 40 for inputting various information to the machining device 2 is provided at the distal end of the base 4.
For example, various displays can be used as the display unit 38. As the input unit 40, an operation panel having a plurality of operation keys may be used, or a mouse or a keyboard may be used.
The processing device 2 may have a touch panel that functions as a user interface. In this case, the touch panel functions as the display unit 38 and the input unit 40, and the operator can input information to the processing device 2 by a touch operation of the touch panel.
A reading unit (reading means, reading device) 42 for reading a code for causing the processing device 2 to perform a predetermined operation is provided near the input unit 40. The function, use, and the like of the reading unit 42 will be described in detail later.
The respective components (the cassette support base 6, the conveying unit 10, the guide rail 14, the conveying unit 16, the moving unit 18, the chuck table 22, the jig 24, the processing unit 26, the imaging unit 30, the cleaning unit 32, the conveying unit 34, the display unit 38, the input unit 40, the reading unit 42, and the like) constituting the processing apparatus 2 are connected to a control unit (a control unit, a control device) 44, respectively. The control unit 44 generates a control signal for controlling the operation of each component of the machining apparatus 2, thereby controlling the operation of the machining apparatus 2.
For example, the control unit 44 is a computer, and includes a calculation unit that performs calculations necessary for the operation of the machining device 2, and a storage unit that stores various information (data, programs, and the like) used for the calculations by the calculation unit. The arithmetic Unit includes a processor such as a CPU (Central Processing Unit). The storage unit includes various memories functioning as a main storage device, an auxiliary storage device, and the like.
The workpiece 11 is processed by the processing apparatus 2. Specifically, first, the conveyance unit 10 moves toward the cassette 8, and the end of the frame 15 housed in the cassette 8 is gripped by the grip portion 10 a. Then, the conveyance unit 10 moves so as to be separated from the cassette 8 in the Y-axis direction. Thereby, the workpiece 11 is drawn out from the magazine 8 and is disposed on the pair of guide rails 14.
The pair of guide rails 14 approach each other while supporting the frame 15 from below, and sandwich the frame 15. Thereby, the workpiece 11 is aligned. Then, the workpiece 11 is sucked and held by the conveyance unit 16 and conveyed to the chuck table 22 positioned in the conveyance area a.
The workpiece 11 is disposed on the holding surface 22a of the chuck table 22 via the belt 13. Further, the frame 15 is fixed by a plurality of clamps 24. When the negative pressure of the suction source is applied to the holding surface 22a in this state, the workpiece 11 is sucked and held by the chuck table 22 via the belt 13. The chuck table 22 holding the workpiece 11 is positioned in the processing area B by the moving means 18.
Next, the workpiece 11 is cut by the cutting tool 28 attached to the machining unit 26. For example, the cutting tool 28 is rotated with the lower end of the cutting tool 28 positioned below the upper surface of the workpiece 11, and the chuck table 22 is moved in the X-axis direction (machining feed). Thereby, the chuck table 22 and the machining unit 26 are relatively moved in the X-axis direction, and the rotating cutting tool 28 cuts into the workpiece 11. As a result, the workpiece 11 is linearly cut.
As described above, the moving unit is coupled to the processing unit 26. The machining unit 26 is moved in the Y-axis direction by the moving unit, thereby performing indexing. Further, the cutting depth of the cutting tool 28 into the workpiece 11 is adjusted by moving the machining unit 26 in the Z-axis direction by the moving means.
For example, the cutting tool 28 cuts the workpiece 11 along the planned dividing line according to the cutting depth to the belt 13. Thereby, the workpiece 11 is cut along the line to be divided into a plurality of device chips.
When the processing of the workpiece 11 is completed, the workpiece 11 is conveyed from the chuck table 22 to the cleaning unit 32 by the conveying unit 34, and is cleaned by the cleaning unit 32. The cleaned workpiece 11 is conveyed onto the pair of guide rails 14 by the conveying unit 16, and then held by the holding portion 10a of the conveying unit 10 and stored in the cassette 8.
When the machining device 2 machines the workpiece 11, an operator inputs various kinds of information related to machining into the machining device 2. For example, the operator can input a machining condition (recipe) of the workpiece 11, information on a preparation job to be executed before starting machining of the workpiece 11, and the like by operating the input unit 40. The information input to the input unit 40 is output to the control unit 44, and the control unit 44 controls the operation of the machining device 2 based on the information input from the input unit 40.
The information input to the processing apparatus 2 includes a plurality of items. The machining conditions input to the machining device 2 include, for example, the size and material of the workpiece 11, the machining feed speed, the depth of cut and the number of revolutions of the cutting tool 28, the number of lines to divide, the interval, and the like. The information on the preparation work includes an instruction to execute processing (system initialization) for moving each component included in the machining apparatus 2 to an initial position, an instruction to execute inspection of the cutting tool 28, and the like.
When the input unit 40 is used for inputting a large amount of information as described above, the operator needs to repeat the input operation (input of numerical values or characters, selection of items, and the like) a plurality of times. Therefore, an input error is likely to occur, and there is a possibility that erroneous information is input to the processing device 2.
Therefore, in the present embodiment, information to be input to the machining device 2 is encoded (symbolized) in advance, and the reading unit 42 of the machining device 2 reads the encoded information to input the information to the machining device 2. This enables easy and quick input of information to the machining device 2. Further, the operator can omit the operation of inputting information manually by operating the input unit 40, and the occurrence of input errors can be suppressed. A specific example of the code read by the reading unit 42 will be described below.
Fig. 2 is a front view showing the operation instruction manual 50. When the machining device 2 machines the workpiece 11, the operator is provided with an operation instruction manual 50. The operation instruction book 50 includes a series of operation procedures necessary for processing the workpiece 11 under predetermined conditions using the processing apparatus 2. Then, the operator operates the machining device 2 in the order described in the operation instruction manual 50.
The operation instruction manual 50 is individually created according to the type of the workpiece 11, the processing conditions, and the like. For example, the cassette 8 accommodates a plurality of workpieces 11 of the same type and processing conditions. Then, a skilled manager selects an operation procedure of the machining device 2 so that the machining device 2 machines the workpiece 11 stored in the magazine 8 as desired. Then, the selected series of operations are printed on the paper sheet in a detailed form, and the operation instruction manual 50 corresponding to the cassette 8 is created.
The operation instruction 50 describes a plurality of operation information 52 showing the operation method of the machining apparatus 2. Each of the plurality of operation information pieces 52 includes an operation command 54 that specifies an operation for the processing device 2 and an operation sequence 56 that shows a sequence of executing the operation specified by the operation command 54. That is, the operation instruction manual 50 notifies the operator that the plurality of operation commands 54 should be executed in the operation order 56. Fig. 2 shows an example in which 9 pieces of operation information 52 (operation information 52A to 52I) are listed as a detailed list in the operation instruction manual 50.
The operation information 52A is information about the configuration of the cartridge 8, and includes an operation instruction 54A and an operation order 56A. The operation command 54A is information for instructing the cassette support base 6 to arrange the cassette 8 containing the plurality of workpieces 11 to be processed. In addition, an operation sequence 56A showing the sequence of executing the operation (arrangement of the cassette 8) indicated by the operation instruction 54A is described next to the operation instruction 54A. For example, a numeral "0" is attached adjacent to the operation instruction 54A, the numeral "0" indicating that the configuration of the cartridge 8 is an operation to be performed initially. In addition, the configuration of the cartridge 8 is manually performed by an operator, for example.
The operation information 52B is information related to a preparation operation (system initialization) for moving each component included in the machining apparatus 2 to a predetermined initial position before starting machining of the workpiece 11, and includes an operation command 54B and an operation sequence 56B. The operation instruction 54B is information indicating whether or not the input requires system initialization. For example, when system initialization is required before the machining of the workpiece 11, information indicating that an instruction to execute the system initialization should be input to the machining apparatus 2 is described as the operation command 54B.
The operation information 52C is information related to the preparation work of the cutting tool 28 attached to the machining unit 26, and includes an operation command 54C and an operation sequence 56C. The operation command 54C is information indicating whether or not the input requires the inspection of the cutting tool 28. For example, when the inspection of the cutting tool 28 is required before the machining of the workpiece 11, information indicating that an instruction to execute the inspection of the cutting tool 28 should be input to the machining apparatus 2 is described as the operation command 54C. In the inspection of the cutting tool 28, for example, the position of the tip (outer peripheral edge) of the cutting tool 28 is measured by an optical sensor or the like, and the position of the cutting tool 28 is corrected based on the measurement result.
The operation information 52D is information related to the machining conditions (recipe) of the workpiece 11, and includes an operation command 54D and an operation sequence 56D. The operation command 54D is information for instructing to input a processing condition suitable for the workpiece 11 stored in the magazine 8. For example, information indicating the character string "1118-inch-sample cutting" for specifying the machining conditions selected so as to perform the predetermined cutting process on the workpiece 11 is input to the machining device 2 and described as the operation command 54D.
The operation information 52E is information related to the number of cassettes 8 that store the workpiece 11 to be processed by the processing apparatus 2, and includes an operation command 54E and an operation procedure 56E. The operation command 54E is information indicating the number of cartridges 8 to be successively processed by the processing apparatus 2. That is, the operation command 54E instructs to continuously process the workpieces 11 of several cassettes 8. For example, information indicating that "1" should be selected as the number of cartridges 8 to be processed by the processing apparatus 2 is described as the operation command 54E.
The operation information 52F is information related to updating of the cartridge, and includes an operation instruction 54F and an operation order 56F. The operation command 54F is information indicating whether or not the cartridge 8 placed on the cartridge support base 6 is to be regarded as a new cartridge (whether or not the cartridge 8 needs to be updated). For example, when the cartridge update is necessary, information indicating that the cartridge update execution instruction should be input to the processing apparatus 2 is described as the operation command 54F. When updating the cassette, all the workpieces 11 stored in the cassette 8 are regarded as targets for processing.
The operation information 52G is information related to designation of the first processed workpiece 11 among the plurality of workpieces 11 stored in the cassette 8, and includes an operation command 54G and an operation procedure 56G. Specifically, the cassette 8 includes a plurality of storage shelves for storing the workpieces 11, and the operation command 54G is information for instructing the input of the serial number of the storage shelf in which the workpiece 11 to be processed is stored. For example, when the workpiece 11 to be machined first is the workpiece 11 stored in the storage shelf of the first floor, information indicating that the number "1" should be selected is described as the operation command 54G.
The operation information 52H is information related to designation of the last processed workpiece 11 among the plurality of workpieces 11 stored in the cassette 8, and includes an operation command 54H and an operation procedure 56H. Specifically, the operation command 54H is information for instructing to input the number of the storage shelf in which the workpiece 11 to be processed is stored. For example, when the workpiece 11 to be processed last is the workpiece 11 stored in the storage shelf of the 13 th floor, information indicating that the number "13" should be selected is described as the operation command 54H.
The operation information 52I is information related to the operation mode of the machining device 2 when the workpiece 11 is machined, and includes an operation command 54I and an operation sequence 56I. The operation command 54I is information indicating whether or not the machining device 2 is to perform the machining of the workpiece 11 fully automatically. For example, when the machining device 2 is fully automatically operated to machine the workpiece 11, information indicating that a fully automatic execution instruction should be input to the machining device 2 is described as the operation command 54I.
The operation sequences 56B to 56I included in the operation information 52B to 52I are specified so that the operation commands 54B to 54I are executed in order. Specifically, as the operation sequences 56B to 56I, numbers "1" to "8" corresponding to the sequence of executing the operation are described.
The machining device 2 prepares the cassette 8 containing the workpiece 11 for an operator who is responsible for machining the workpiece 11, and obtains and confirms the operation instruction 50 corresponding to the cassette 8. This enables the operator to grasp the content and the order of information to be input to the machining device 2.
Further, a code 58 is attached to the operation instruction sheet 50, and the code 58 corresponds to the operation information 52 (the operation information 52B to 52I) showing the operation to be performed after the cartridge 8 is placed on the cartridge support base 6. For example, the code 58 is a one-dimensional code (barcode) or a two-dimensional code, and includes information corresponding to the operation information 52B to 52I. It is particularly preferred that the code 58 is a matrix type two-dimensional code. In this case, a large amount of operation information can be read at high speed and space can be saved.
Fig. 3 is a perspective view showing a case where the code 58 is read by the reading section 42. First, the operator prepares the cassette 8 (see fig. 1) placed on the cassette support base 6 and the operation manual 50 corresponding to the cassette 8. Then, the content of the operation instruction manual 50 is confirmed, and the code 58 is read by the reading section 42. The information (read information) read by the reading unit 42 is input to the control unit 44 (see fig. 1).
The type and structure of the reading unit 42 are not limited, and are appropriately selected according to the type of the code 58. For example, when the code 58 is a one-dimensional code (barcode), a one-dimensional code reader (barcode reader) is used as the reading unit 42. In addition, when the code 58 is a two-dimensional code, a two-dimensional code reader is used as the reading unit 42. Although the reading unit 42 that can be held by the operator is shown in fig. 3, a fixedly installed reading unit 42 may be used.
The storage unit (memory) of the control unit 44 (see fig. 1) stores operation information 52 corresponding to the read information in advance. When the read information is input from the reading unit 42 to the control unit 44, the control unit 44 accesses the storage unit and reads the operation command 54 and the operation order 56 corresponding to the input read information. Then, the control unit 44 outputs a control signal to the display unit 38, and displays the operation command 54 and the operation procedure 56 on the display unit 38 by characters or the like.
Fig. 4 is a front view showing the display portion 38. The display unit 38 has a display area 38a capable of displaying various information, and predetermined information is displayed in the display area 38a in accordance with a control signal input from the control unit 44. When the code 58 attached to the operation instruction manual 50 is read by the reading unit 42 (see fig. 3), a control signal including the operation information 52 is input from the control unit 44 to the display unit 38, and a part or all of the operation information 52 described in the operation instruction manual 50 is displayed in the display area 38 a. The operator can also confirm whether or not the operation information 52 has been correctly input to the machining device 2 by visually recognizing the operation information 52 displayed on the display unit 38.
In addition, a selection key 60 for performing an operation in accordance with the operation information 52 is displayed in the display area 38a of the display unit 38. After confirming that the operation information 52 displayed in the display area 38a is correct, the operator selects the selection key 60. The selection of the selection key 60 can be performed by operating the input unit 40 (see fig. 1) while viewing the display unit 38. In the case of using a touch panel in which the display unit 38 and the input unit 40 are integrated, the selection key 60 can be selected by touching the region where the selection key 60 is displayed.
When the selection key 60 is selected, the control unit 44 controls the machining device 2 so that the operation designated by the operation command 54 is executed in accordance with the operation sequence 56. Thus, a series of operations of the machining device 2, which are originally performed by the operator, are autonomously performed by the machining device 2.
Next, a specific operation example of the control unit 44 will be described. Fig. 5 is a flowchart showing the operation of the control unit 44. Hereinafter, a series of operation examples of the control unit 44 will be described mainly with reference to fig. 1, 2, and 5.
First, the control unit 44 outputs a control signal to the reading unit 42 to activate the reading unit 42 (step S1). This allows the reading unit 42 to read the code 58. Before the code 58 is read by the reading unit 42, the reading unit 42 maintains the standby state (no in step S2).
When the operator causes the reading unit 42 to read the code 58 attached to the operation instruction manual 50 (yes in step S2), the reading unit 42 inputs the read information to the control unit 44. Then, the control unit 44 accesses the storage unit (memory) and reads the operation information 52B to 52I corresponding to the read information (step S3).
Next, the control unit 44 outputs a control signal to the display unit 38, and displays the operation information 52 in the display area 38a of the display unit 38 (step S4). Thus, as shown in fig. 4, for example, the operation information 52B to 52I is listed in the display area 38 a. Further, the control unit 44 displays the selection key 60 in the display area 38a of the display unit 38. Until the operator selects the selection key 60, the display of the display unit 38 is maintained (no in step S5).
When the operator selects the selection key 60 (yes in step S5), the control unit 44 first checks whether or not the cartridge 8 is properly disposed on the cartridge support base 6. For example, the cartridge support base 6 includes a sensor (optical sensor or the like) for detecting the cartridge 8. When the cartridge 8 is appropriately disposed on the cartridge support base 6, the cartridge 8 is detected by a sensor. On the other hand, when the cartridge 8 is not disposed on the cartridge support base 6, when the position of the cartridge 8 disposed on the cartridge support base 6 is shifted, when the size of the cartridge 8 disposed on the cartridge support base 6 is incorrect, or the like, the cartridge 8 cannot be detected by the sensor.
The control unit 44 determines whether or not the cartridge 8 is properly arranged based on a signal input from a sensor provided on the cartridge support base 6. When it is determined that cassette 8 is not properly arranged (no in step S6), for example, control unit 44 causes display unit 38 to display a warning message notifying that cassette 8 is not properly arranged, thereby urging the operator to properly arrange cassette 8.
When it is determined that the cartridge 8 is properly arranged (yes in step S6), the control unit 44 controls the processing device 2 so as to execute the operations specified by the operation commands 54B to 54I in the operation order 56B to 56I (step S7).
Specifically, the control unit 44 outputs control signals to the respective components of the machining apparatus 2, and thereby sequentially executes system initialization and inspection of the cutting tool 28. Thus, the operations specified by the operation instructions 54B, 54C are executed in the operation order 56B, 56C.
Next, the control unit 44 accesses the storage unit (memory) and sequentially registers information (processing conditions of the workpiece 11, the number of cassettes 8, whether or not updating of the cassettes 8 is necessary, the number of starting cassette layers, the number of ending cassette layers, whether or not full automation is necessary) determined by reading the code 58 in the storage unit. Thus, the operations specified by the operation instructions 54D to 54I are executed in the operation order 56D to 56I. Then, the control unit 44 outputs a control signal to each component of the processing apparatus 2, thereby fully automatically processing the workpieces 11 stored in the magazine 8 one by one.
The operation of the control unit 44 is realized by executing a program. Specifically, the storage unit of the control unit 44 stores a program for causing the control unit 44 to sequentially execute each process (steps S1 to S7) for operating the processing device 2 based on the read information read by the reading unit 42. When the machining device 2 is operated, the control unit 44 executes the program to perform the operation of the machining device 2 corresponding to the code 58.
As described above, the machining device 2 according to the present embodiment includes the reading unit 42 that reads the code 58, and the code 58 includes information corresponding to the plurality of operation commands 54 and information corresponding to the operation order 56 indicating the order in which the operations designated by the operation commands 54 are executed. The operator can input the operation command 54 and the operation sequence 56 to the machining device 2 without operating the input unit 40 by causing the reading unit 42 to read the code 58. This prevents an input error of information to the machining device 2.
The expiration date may be set in the code 58 attached to the operation instruction manual 50. For example, when the machining conditions of the workpiece 11 or the operation method of the machining device 2 are periodically updated, the code 58 may include information on the expiration date. When the reading unit 42 reads the code 58 after the expiration date has passed, the machining device 2 notifies the operator that the code 58 has expired by displaying an error on the display unit 38, for example.
In the present embodiment, the description has been given of the machining apparatus (cutting apparatus) 2 that cuts the workpiece 11 by the machining means (cutting means) 26, but the type of the machining apparatus of the present embodiment is not limited. For example, a grinding apparatus having a processing unit (grinding unit) for grinding the workpiece 11 and a polishing apparatus having a processing unit (polishing unit) for polishing the workpiece 11 may be used.
The grinding unit of the grinding device has a main shaft, and an annular grinding wheel including a plurality of grinding stones is attached to a tip portion of the main shaft. The grinding unit grinds the workpiece 11 by bringing the grinding wheel into contact with the workpiece 11 while rotating the grinding wheel. The polishing unit of the polishing apparatus has a spindle, and a disk-shaped polishing pad is attached to a tip of the spindle. The polishing unit then polishes the workpiece 11 by bringing the polishing pad into contact with the workpiece 11 while rotating the polishing pad.
The processing apparatus according to the present embodiment may be a laser processing apparatus including a processing unit (laser irradiation unit) that processes the workpiece 11 by irradiation of a laser beam. The laser irradiation unit includes a laser oscillator that oscillates a laser beam having a predetermined wavelength, and a condenser that condenses the laser oscillated from the laser oscillator. The workpiece 11 is irradiated with a laser beam from a laser irradiation unit, and the workpiece 11 is thereby processed.
In addition, the structure, method, and the like of the above embodiments may be modified and implemented as appropriate without departing from the scope of the object of the present invention.

Claims (6)

1. A processing device for processing a workpiece, characterized in that,
the processing device is provided with:
a chuck table for holding the workpiece;
a machining unit that machines the workpiece held by the chuck table;
a control unit; and
a reading unit that reads a code including information corresponding to a plurality of operation commands specifying operations for the processing device and information corresponding to an order in which the operations specified by the operation commands are executed,
the control unit controls the processing device based on the code read by the reading unit so as to execute the operation specified by the plurality of operation commands in the order.
2. The processing device according to claim 1,
the processing device is also provided with a display part,
the control part makes the display part display a plurality of operation instructions and the sequence according to the codes read by the reading part.
3. Machining device according to claim 1 or 2,
the code is a matrix type two-dimensional code.
4. A method of using a machining apparatus for machining a workpiece, comprising,
the processing device is provided with:
a chuck table for holding the workpiece;
a machining unit that machines the workpiece held by the chuck table; and
a reading unit that reads a code including information corresponding to a plurality of operation commands specifying operations for the processing device and information corresponding to an order in which the operations specified by the operation commands are executed,
the use method of the processing device comprises the following steps:
reading the code by the reading section; and
the processing device is controlled based on the code read by the reading section so as to execute the operation specified by the plurality of operation commands in the order.
5. The use of the processing device according to claim 4,
the processing device is also provided with a display part,
the use method of the processing device also comprises the following steps: and displaying a plurality of operation instructions and the sequence on the display part according to the codes read by the reading part.
6. The use of the processing device according to claim 4 or 5,
the code is a matrix type two-dimensional code.
CN202111126920.4A 2020-10-02 2021-09-26 Machining device and method for using machining device Pending CN114378961A (en)

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JP2020-167469 2020-10-02

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Publication number Priority date Publication date Assignee Title
JP3076179B2 (en) 1993-07-26 2000-08-14 株式会社ディスコ Dicing equipment

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