CN117790419A - Method for processing resin substrate - Google Patents
Method for processing resin substrate Download PDFInfo
- Publication number
- CN117790419A CN117790419A CN202311248467.3A CN202311248467A CN117790419A CN 117790419 A CN117790419 A CN 117790419A CN 202311248467 A CN202311248467 A CN 202311248467A CN 117790419 A CN117790419 A CN 117790419A
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- China
- Prior art keywords
- resin substrate
- cutting
- axis direction
- chuck table
- feeding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 109
- 239000011347 resin Substances 0.000 title claims abstract description 109
- 239000000758 substrate Substances 0.000 title claims abstract description 105
- 238000000034 method Methods 0.000 title claims description 24
- 238000005520 cutting process Methods 0.000 claims abstract description 109
- 238000003672 processing method Methods 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a processing method of a resin substrate, wherein a convex part on the periphery does not become an obstacle when the resin substrate is divided into chips. The processing method of the resin substrate comprises the following steps: a holding step of holding the resin substrate (20) on a chuck table (10 a); a protrusion flattening step in which a cutting tool (83) is positioned on the outer periphery (22) of the resin substrate (20), and the protrusions (23 a-23 d) are cut so that the heights of the protrusions (23 a-23 d) are substantially the same as the height of the central flat portion (21); and a dividing step of dividing the resin substrate (20) into individual chips (24) by operating the X-axis feeding means and the Y-axis feeding means.
Description
Technical Field
The present invention relates to a processing method for dividing a resin substrate into individual chips.
Background
A wafer, which is divided by a dividing line and has a plurality of devices such as ICs and LSIs formed on the front surface thereof, is divided into individual device chips by a dicing apparatus, and is used for electric devices such as mobile phones and personal computers.
In addition, the following techniques have been proposed: after a plurality of devices on which circuits such as LSI are formed are mounted and bonded to a lead frame, a resin substrate sealed with a resin such as glass epoxy is divided into individual chips (for example, refer to patent document 1).
Patent document 1: japanese patent application laid-open No. 2011-114145
However, depending on the type or structure of the resin substrate, there are the following problems: in the step of coating the resin on the substrate on which the plurality of devices are formed, the resin is sometimes accumulated on the outer periphery of the resin substrate, and convex portions such as banks are formed so as to surround the flat portions in the center of the formed resin substrate, and this resin substrate is sometimes obstructed when cut and divided into individual chips.
Disclosure of Invention
The present invention has been made in view of the above-described circumstances, and a main technical object thereof is to provide a method for processing a resin substrate, in which the above-described peripheral convex portions do not interfere when the resin substrate is divided into individual chips.
In order to solve the above-described main technical problems, according to the present invention, there is provided a method for processing a resin substrate, the method including dividing the resin substrate having a convex portion on an outer periphery of a central flat portion into individual chips by a cutting device, the cutting device including: a chuck table capable of holding and rotating a workpiece; a cutting unit for supporting a cutting tool for cutting a workpiece held by the chuck table on a rotation shaft extending in the Y-axis direction; an X-axis feeding unit for relatively feeding the chuck table and the cutting unit in the X-axis direction; a Y-axis feeding unit for relatively feeding the chuck table and the cutting unit in a Y-axis direction perpendicular to the X-axis direction; and a Z-axis feeding unit for feeding the chuck table and the cutting unit in a Z-axis direction perpendicular to the X-axis direction and the Y-axis direction, wherein the processing method of the resin substrate comprises the following steps: a holding step of holding the resin substrate on a chuck table; a protrusion flattening step of positioning the cutting blade on the outer periphery of the resin substrate, and cutting the protrusion so that the height of the protrusion is substantially the same as the height of the central flat portion; and a dividing step of dividing the resin substrate into individual chips by operating the X-axis feeding unit and the Y-axis feeding unit.
Preferably, the method for processing the resin substrate includes the following integrated steps: the resin substrate is positioned at the opening of the frame having the opening in the center and is integrated with the sheet, and in the holding step, the sheet side is held on the chuck table. The resin substrate may have a rectangular shape, and the step of flattening the convex portion may include the steps of: a positioning step of positioning one side of the resin substrate having the convex portion in the Y-axis direction; a flattening step of positioning the tip of the cutting tool at the convex portion of the resin substrate and relatively moving in the Y-axis direction, thereby flattening the convex portion; an indexing step of indexing and feeding the front end of the cutting tool and the convex part of the resin substrate in the X-axis direction relatively according to the width of the convex part; and a cutting step of relatively cutting and feeding the tip of the cutting tool and the convex portion of the resin substrate in the Z-axis direction according to the height of the convex portion, and repeating the flattening step, the indexing step, and the cutting step as necessary.
The resin substrate processing method of the present invention divides a resin substrate having a convex portion on the outer periphery of a central flat portion into individual chips by a cutting device, the cutting device comprising: a chuck table capable of holding and rotating a workpiece; a cutting unit for supporting a cutting tool for cutting a workpiece held by the chuck table on a rotation shaft extending in the Y-axis direction; an X-axis feeding unit for relatively feeding the chuck table and the cutting unit in the X-axis direction; a Y-axis feeding unit for relatively feeding the chuck table and the cutting unit in a Y-axis direction perpendicular to the X-axis direction; and a Z-axis feeding unit for feeding the chuck table and the cutting unit in a Z-axis direction perpendicular to the X-axis direction and the Y-axis direction, wherein the processing method of the resin substrate comprises the following steps: a holding step of holding the resin substrate on a chuck table; a protrusion flattening step of positioning the cutting blade on the outer periphery of the resin substrate, and cutting the protrusion so that the height of the protrusion is substantially the same as the height of the central flat portion; and a dividing step of dividing the resin substrate into individual chips by operating the X-axis feeding unit and the Y-axis feeding unit, so that, when the dividing step of dividing the resin substrate into individual chips is performed, the convex portions such as the banks are removed from the outer periphery of the resin substrate and flattened substantially, thereby eliminating the problem that the convex portions become an obstacle when dividing the resin substrate into individual chips.
Drawings
Fig. 1 is an overall perspective view of a cutting device.
Fig. 2 is a perspective view showing an embodiment of the integrated process.
Fig. 3 (a) is a perspective view showing an embodiment of the protrusion flattening process, and fig. 3 (b) is a partially enlarged cross-sectional view of the protrusion flattening process shown in fig. 3 (a).
Fig. 4 (a) is a perspective view showing a resin substrate flattened by the convex flattening step, and fig. 4 (b) is a side view of the resin substrate shown in fig. 4 (a) viewed from the side.
Fig. 5 (a) is a perspective view showing an embodiment of the dividing process, and fig. 5 (b) is a perspective view showing a resin substrate divided into individual chips by the dividing process shown in fig. 5 (a).
Description of the reference numerals
1: a cutting device; 2: a housing; 3: a carry-in/out unit; 4: a case; 5: temporarily placing the workbench; 6: a conveying unit; 8: a cutting unit; 81: a rotation shaft housing; 82: a rotation shaft; 83: a cutting tool; 84: a cutter cover; 9: an alignment unit; 10: a holding unit; 10a: a chuck table; 12: a cleaning device; 14: a cleaning and carrying-out unit; 20: a resin substrate; 21: a central flat portion; 22: an outer periphery; 23a to 23d: a convex portion; 24: a chip; 100: a dividing groove; f: a frame; t: a sheet.
Detailed Description
Hereinafter, embodiments of a method for processing a resin substrate according to the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a perspective view showing a whole of a cutting device 1 suitable for carrying out the method for processing a resin substrate according to the present embodiment.
The cutting device 1 includes: a chuck table 10a capable of holding and rotating a workpiece; a cutting unit 8 for supporting a cutting tool 83 rotatably about a rotation axis 82 extending in the Y-axis direction, the cutting tool 83 cutting a workpiece held by the chuck table 10 a; an X-axis feeding unit, not shown, for feeding the chuck table 10a and the cutting unit 8 in the X-axis direction; a Y-axis feeding unit, not shown, for feeding the chuck table 10a and the cutting unit 8 in a machining direction in a Y-axis direction perpendicular to the X-axis direction; and a Z-axis feeding unit, not shown, for feeding the chuck table 10a and the cutting unit 8 in a direction of a Z-axis perpendicular to the X-axis direction and the Y-axis direction. The holding surface of the chuck table 10a is a horizontal surface defined by the X-axis direction and the Y-axis direction.
In addition to the above-described configuration, the cutting device 1 is provided with a substantially rectangular parallelepiped housing 2, a cassette 4 placed on a cassette table 4a of the housing 2, a carry-in/out unit 3 for carrying out a workpiece supported by the frame F from the cassette 4 to a temporary placement table 5, a carrying-in unit 6 for carrying the workpiece carried out to the temporary placement table 5 to the chuck table 10a, an alignment unit 9 for capturing an image of the workpiece held on the chuck table 10a and detecting a region to be machined by the cutting unit 8, and a cleaning carrying-out unit 14 for carrying the workpiece to a cleaning device 12 (details are omitted) from a carry-in position where the chuck table 10a is located in fig. 1. A plurality of jigs 10b are arranged at equal intervals on the outer periphery of the chuck table 10 a. The cutting device 1 is provided with a control unit, a display unit, and the like, which are not shown. The X-axis feeding unit according to the present embodiment is configured to move the chuck table 10a in the X-axis direction, and the Y-axis feeding unit and the Z-axis feeding unit are configured to move the cutting unit 8 in the Y-axis direction and the Z-axis direction, and the X-axis feeding unit, the Y-axis feeding unit, and the Z-axis feeding unit are disposed in the housing 2.
The cutting unit 8 has: a rotation shaft housing 81 rotatably supporting a rotation shaft 82 extending in the Y-axis direction; and a tool cover 84 that is configured from a plurality of members that protect the cutting tool 83 attached to the front end of the rotation shaft 82 (see also fig. 3 (a)). A pair of cutting water supply means 85 (opposite side is not seen) is disposed adjacently to the cutter cover 84 with the cutting tool 83 interposed therebetween, and supplies the cutting water introduced through the cutter cover 84 to the cutting position. A rotary drive source, such as a motor, not shown, is housed at the other end side of the rotary shaft housing 81, and rotates the rotary shaft 82 to rotate the cutting tool 83.
The object to be processed by the processing method of the resin substrate according to the present embodiment is, for example, a rectangular resin substrate 20 shown in fig. 2. The resin substrate 20 is, for example, a substrate sealed with a resin such as glass epoxy resin after a plurality of semiconductor chips are mounted on and bonded to a lead frame. The resin substrate 20 is formed to have a size of 150mm×150mm in plan view, for example, and the central rectangular central flat portion 21 has a thickness of 80 μm, the protruding portions 23a to 23d are provided upright on four sides of the outer periphery 22 of the central flat portion 21, and the protruding portions 23a to 23d have a thickness (height) of 1.5mm to 4.0mm and a width of 2mm to 3mm. The convex portions 23a to 23d are formed so that the resin is accumulated on the outer periphery 22 and surrounds the central flat portion 21 during the process of coating the resin on the substrate on which the plurality of semiconductor chips are formed, and are not intentionally formed, and therefore, there are some variations in size and shape.
In the method for processing a resin substrate according to the present embodiment, it is preferable that an annular frame F having an opening Fa at the center is prepared, the front side of the resin substrate 20 is positioned downward at the center of the opening Fa, and the resin substrate 20 is integrally supported by the frame F via a sheet T having adhesiveness (integral process), as shown in fig. 2. The present invention is not limited to the case where the above-described integrated process is necessary, and for example, when a chuck table having a holding surface conforming to the shape of the resin substrate 20 is disposed on the cutting device 1, the above-described integrated process can be omitted. In the case where the integration step is omitted, it is preferable to prepare a sheet having a size corresponding to that of the resin substrate 20 and attach the sheet to the front surface of the resin substrate 20.
After the resin substrate 20 is prepared as described above, a holding step of holding the resin substrate 20 on the chuck table 10a is performed. More specifically, the sheet T side of the resin substrate 20 is placed on the holding surface of the chuck table 10a so as to face downward, the frame F is gripped by the jigs 10b, and suction means, not shown, is operated to generate negative pressure on the holding surface of the chuck table 10a, thereby sucking and holding the resin substrate 20.
Next, a convex portion flattening step of cutting the convex portions 23a to 23d so that the heights thereof are substantially the same as the height of the central flat portion 21 is performed. The convex portion flattening step will be described in more detail with reference to fig. 3 and 4 in addition to fig. 1 and 2.
The cutting tool 83 attached to the cutting unit 8 for performing the convex portion flattening step of the present embodiment is made of, for example, a resin grinder or a ceramic grinder containing diamond abrasive grains, and a tool having a diameter of 50mm and a thickness of 0.2mm is selected.
In the projection flattening step, first, the resin substrate 20 is positioned immediately below the alignment unit 9, and the shape of the resin substrate 20, the positions of the projections 23a to 23d, and the like are detected. Next, as shown in fig. 3 (a), the resin substrate 20 is moved downward of the cutting unit 8, and one side of the outer periphery 22 of the resin substrate 20 on which any one of the protruding portions 23a to 23d is formed is positioned in the Y-axis direction (positioning step). In the present embodiment, a case will be described below in which one side on which the convex portion 23a shown in the figure is formed first is positioned in the Y-axis direction.
After the positioning step is performed, the X-axis feeding unit and the Y-axis feeding unit are operated, and as shown in fig. 3 (a), the tip of the cutting tool 83 is positioned near one end side of the protruding portion 23a of the resin substrate 20 on the extension line of the protruding portion 23a in the Y-axis direction. Next, the cutting tool 83 is rotated in the direction indicated by the arrow R1 at a predetermined rotational speed (for example, 10000 rpm), and the Z-axis feeding unit is operated, so that the tip of the cutting tool 83 is positioned below the upper surface of the protruding portion 23a by, for example, 0.2mm (the plunge feeding step). Next, cutting water is supplied from the cutting water supply nozzle 85, and the Y-axis feeding means is operated to move the cutting tool 83 in the Y-axis direction indicated by the arrow R2 at a predetermined feeding speed (for example, 50 mm/sec) to the outside of the other end side of the one side, and the upper surface of the convex portion 23a is cut (flattening step) as shown in fig. 3 b. Here, depending on the width and height dimensions of the protruding portion 23a, the protruding portion 23a may be removed by this 1-time planarization step to substantially planarize one side of the resin substrate 20, but the following indexing step may be repeated as necessary.
After the 1 st plunge feeding step and the flattening step are performed, the following indexing step is performed: the Y-axis feeding means is operated, the cutting means 8 is moved to the position shown in fig. 3a at one end side of the protruding portion 23a in the Y-axis direction, the X-axis feeding means is operated according to the width of the protruding portion 23a, and the resin substrate 20 is index-fed to the rear side in the X-axis direction by a predetermined amount (for example, 1 mm). Next, the Y-axis feeding unit and the Z-axis feeding unit were operated, and the above-described cutting feeding step and flattening step were performed, so that the upper surface of the convex portion 23a formed on the outer periphery 22 of the resin substrate 20 was cut at a cutting depth of 0.2mm. Further, the indexing step, the plunge feeding step, and the flattening step are performed again. Thereby, the entire upper surface of the convex portion 23a was cut by 0.2mm. Next, the X-axis feeding unit is operated, and in the resin substrate 20 in the figure, one side of the outer periphery 22 on which the convex portion 23b facing and parallel to the convex portion 23a is formed is positioned at the X-coordinate position of the position where the tip of the cutting tool 83 is located, and the cutting and feeding step, the flattening step, and the indexing step performed on the convex portion 23a are also performed on the convex portion 23b, and the cutting processing of 0.2mm is performed on the entire upper surface of the convex portion 23 b.
Further, the resin substrate 20 is rotated by 90 degrees, and one side of the outer periphery 22 on which the convex portion 23c perpendicular to the convex portion 23b is formed is positioned at the X-coordinate position of the position where the tip of the cutting tool 83 is located. Subsequently, the above-described plunge feed step, flattening step, and indexing step were repeatedly performed, and cutting processing of 0.2mm was performed on the entire upper surface of the protruding portion 23 c. Then, the X-axis feeding unit is operated, and one side of the outer periphery of the convex portion 23d formed in the resin substrate 20 facing and parallel to the convex portion 23c in the figure is positioned at the X-coordinate position of the position where the tip of the cutting tool 83 is located, and the above-described cutting and feeding step, flattening step, and indexing step are repeated, whereby the entire upper surface of the convex portion 23d formed on the outer periphery 22 of the resin substrate 20 is subjected to cutting processing of 0.2mm.
By performing the above-described plunge feeding step, flattening step, and indexing step on the four sides of the outer periphery 22 on which the convex portions 23a to 23d are formed, the upper surfaces of the convex portions 23a to 23d are cut by 0.2mm. Next, an plunge step of further lowering the position of the tip of the cutting tool 83 by 0.2mm by operating the Z-axis feeding unit to perform plunge feeding is performed, and a flattening step and an indexing step for the convex portions 23a to 23d are performed. By performing the above-described cutting and feeding step, flattening step, and indexing step on the above-described convex portions 23a to 23d, the upper surfaces of the convex portions 23a to 23d were further cut by 0.2mm. The above-described cutting and feeding step, flattening step, and indexing step are repeated until the heights of the outer circumferences 22 of the four sides of the resin substrate 20 become substantially the same as the height of the central flat portion 21, whereby the resin substrate 20 is flattened by removing the convex portions 23a to 23d as shown in fig. 4 (a) and (b), and the convex portion flattening step is completed. The order of the convex portions 22a to 22d in the convex portion flattening step according to the present invention is not particularly limited, and may be performed in any order.
The smaller the cutting feed amount in the one-time cutting step and the index feed amount in the index step are set, the less the burden on the cutting tool 83 is, and the flatness of the outer periphery 22 of the resin substrate 20 is improved. However, in this case, since the number of times required for the flattening step increases and the production efficiency decreases, the cutting feed amount in the cutting step and the indexing feed amount in the indexing step are set as small as possible in consideration of the durability of the cutting tool 83, the required processing quality (flatness), and the like.
After the completion of the above-described convex portion flattening step, a dividing step of dividing the resin substrate 20 into individual chips by operating the X-axis feeding unit and the Y-axis feeding unit is performed. In the present embodiment, the dividing step is performed directly using the cutting tool 83 of the cutting unit 8 to which the above-described convex portion flattening step is performed.
In the dividing step shown in fig. 5, first, the chuck table 10a is rotated based on the information on the resin substrate 20 detected by the alignment unit 9, so that one side of the outer periphery 22 of the resin substrate 20 held by the chuck table 10a coincides with the X-axis direction. Next, alignment of the line to be divided along the X-axis direction, which is the cutting start position, with the cutting tool 83 is performed based on position information of the line to be divided (not shown) of the resin substrate 20 stored in advance in the control unit. Next, the cutting tool 83 rotated at a predetermined rotational speed (for example, 20000 rpm) in the direction indicated by the arrow R1 is positioned on a predetermined dividing line aligned with the X-axis direction, and is cut into the resin substrate 20 from the upper surface at a depth of, for example, 0.1mm, and the X-axis feeding means is operated to perform processing and feeding at a feeding speed of, for example, 10 mm/sec in the X-axis direction, thereby forming the dividing grooves 100. Further, the Y-axis feeding means is operated to index and feed the cutting tool 83 to the dividing line adjacent to the dividing line where the dividing groove 100 is formed and where the dividing groove 100 is not formed in the Y-axis direction, and the cutting process for forming the dividing groove 100 is performed in the same manner as described above. By repeating these processes, the grooves 100 are formed along all the predetermined line shapes for division in the X-axis direction. Next, the resin substrate 20 is rotated by 90 degrees so that the direction perpendicular to the direction in which the dividing grooves 100 were formed coincides with the X-axis direction, and the cutting process is performed on all the dividing lines newly coinciding with the X-axis direction, thereby dividing the grooves 100 along all the dividing lines of the resin substrate 20. By performing the dividing step in this way, as shown in fig. 5 (b), the resin substrate 20 can be divided into individual chips 24 (dividing step). Thus, the method for processing a resin substrate according to the present embodiment is completed.
According to the above embodiment, when the dividing step of dividing the resin substrate 20 into the chips is performed, the protruding portions 23a to 23d such as the bank are removed from the outer periphery 22 of the resin substrate 20 and are substantially flattened, and the problem that the protruding portions 23a to 23d become an obstacle when dividing the resin substrate 20 into the chips is eliminated.
In the above-described embodiment, the cutting tool 83 is not changed in the protrusion flattening step and the dividing step, but the cutting tool may be changed in each step as appropriate. In addition, the following operations are not excluded with respect to the planarization step performed in the protrusion planarization step of the present invention: the orientation of the cutting tool 83 is set so that any one of the outer circumferences 22 of the resin substrate 20 is oriented in the X-axis direction, and the convex portion formed on the outer circumference 22 is set so as to be moved relatively in the X-axis direction, and the convex portion is cut and flattened by repeating these operations. However, as in the above embodiment, it is preferable that the tip of the cutting tool 83 is positioned on the convex portions 23a to 23d of the resin substrate 20 and relatively moved in the Y-axis direction, so that the convex portions are flattened.
Claims (3)
1. A method for processing a resin substrate, wherein the resin substrate having a convex portion on the outer periphery of a central flat portion is divided into individual chips by a cutting device, the cutting device comprising:
a chuck table capable of holding and rotating a workpiece;
a cutting unit for supporting a cutting tool for cutting a workpiece held by the chuck table on a rotation shaft extending in the Y-axis direction;
an X-axis feeding unit for relatively feeding the chuck table and the cutting unit in the X-axis direction;
a Y-axis feeding unit for relatively feeding the chuck table and the cutting unit in a Y-axis direction perpendicular to the X-axis direction; and
a Z-axis feeding unit for feeding the chuck table and the cutting unit in a Z-axis direction perpendicular to the X-axis direction and the Y-axis direction,
wherein,
the processing method of the resin substrate comprises the following steps:
a holding step of holding the resin substrate on a chuck table;
a protrusion flattening step of positioning the cutting blade on the outer periphery of the resin substrate, and cutting the protrusion so that the height of the protrusion is substantially the same as the height of the central flat portion; and
and a dividing step of dividing the resin substrate into individual chips by operating the X-axis feeding unit and the Y-axis feeding unit.
2. The method for processing a resin substrate according to claim 1, wherein,
the processing method of the resin substrate comprises the following integrated steps: the resin substrate is positioned at the opening of the frame having the opening in the center and integrated by the sheet,
in the holding step, the sheet side is held on the chuck table.
3. The method for processing a resin substrate according to claim 1, wherein,
the resin substrate is of a rectangular shape,
the step of flattening the convex portion includes the steps of:
a positioning step of positioning one side of the resin substrate having the convex portion in the Y-axis direction;
a flattening step of positioning the tip of the cutting tool at the convex portion of the resin substrate and relatively moving in the Y-axis direction, thereby flattening the convex portion;
an indexing step of indexing and feeding the front end of the cutting tool and the convex part of the resin substrate in the X-axis direction relatively according to the width of the convex part; and
a cutting step of relatively cutting and feeding the front end of the cutting tool and the convex part of the resin substrate in the Z-axis direction according to the height of the convex part,
the planarization step, the indexing step, and the dicing step are repeatedly performed as needed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022155749A JP2024049497A (en) | 2022-09-29 | 2022-09-29 | Resin substrate processing method |
| JP2022-155749 | 2022-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117790419A true CN117790419A (en) | 2024-03-29 |
Family
ID=90391739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311248467.3A Pending CN117790419A (en) | 2022-09-29 | 2023-09-25 | Method for processing resin substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2024049497A (en) |
| KR (1) | KR20240045095A (en) |
| CN (1) | CN117790419A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5709370B2 (en) | 2009-11-26 | 2015-04-30 | 株式会社ディスコ | Cutting apparatus and cutting method |
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2022
- 2022-09-29 JP JP2022155749A patent/JP2024049497A/en active Pending
-
2023
- 2023-08-28 KR KR1020230112951A patent/KR20240045095A/en unknown
- 2023-09-25 CN CN202311248467.3A patent/CN117790419A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240045095A (en) | 2024-04-05 |
| JP2024049497A (en) | 2024-04-10 |
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