CN117341221A - Mask forming method - Google Patents
Mask forming method Download PDFInfo
- Publication number
- CN117341221A CN117341221A CN202310777125.4A CN202310777125A CN117341221A CN 117341221 A CN117341221 A CN 117341221A CN 202310777125 A CN202310777125 A CN 202310777125A CN 117341221 A CN117341221 A CN 117341221A
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- resin layer
- substrate
- plate
- forming
- cutting
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000005520 cutting process Methods 0.000 claims abstract description 106
- 239000011347 resin Substances 0.000 claims abstract description 89
- 229920005989 resin Polymers 0.000 claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 238000002360 preparation method Methods 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 53
- 239000000463 material Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a method for forming a mask, which solves the problem that the operation of arranging the mask with the size corresponding to each chip on each chip is troublesome. The mask forming method comprises the following steps: a board preparation step for preparing a board (20) having a size corresponding to the substrate (10); a resin curing step of forming a resin layer (19') cured to a uniform thickness by coating a liquid resin (19) on the upper surface of the plate; a groove forming step of positioning a cutting tool (81A) on the front surface of the resin layer in correspondence with the line (14) to be divided to form a groove (100); a resin layer adhering step of adhering the front surface of the resin layer to the upper surface of the substrate (10) by making the upper surface of the substrate (10) face the front surface of the resin layer (19') and making the groove correspond to the line to be divided; and a plate removing step of removing the plate (20) from the resin layer (19') to expose the grooves (100) formed in the resin layer.
Description
Technical Field
The present invention relates to a method for forming a mask, which is used when metal plating is performed on a line to be divided into chips on a substrate to be divided by the line to be divided.
Background
A wafer divided by a line to be divided and having a plurality of devices such as ICs and LSIs formed on the front surface thereof is cut into individual device chips by a cutting device rotatably mounted with a cutting tool, and is used in electronic equipment such as a mobile phone and a personal computer.
In addition, when a ceramic substrate having a plurality of regions formed on the front surface thereof and divided by a predetermined dividing line is divided into individual chips for each of the regions, auSn (gold tin) plating is also performed in a lattice shape along the predetermined dividing line to have a width exceeding the thickness of a cutting tool for dividing the ceramic substrate, before cutting processing is performed, using the cutting device described above (for example, see patent document 1).
Patent document 1: japanese patent laid-open No. 2004-039906
However, as described above, in order to perform AuSn plating having a width exceeding the thickness of the cutting tool in a lattice shape along the lines to be divided, it is necessary to provide masks of a size corresponding to each chip, and there is a problem that the masks are not troublesome.
Disclosure of Invention
The present invention has been made in view of the above-described circumstances, and a main technical object thereof is to provide a method for forming a mask, which can solve the problem that it is troublesome to arrange masks having a size corresponding to each chip.
In order to solve the above-described main technical problems, according to the present invention, there is provided a method for forming a mask, which is used when metal plating is performed on a line to be divided into chips of a substrate by the line to be divided, wherein the method for forming a mask comprises the steps of: a board preparation step of preparing a board having a size corresponding to the substrate; a resin curing step of forming a resin layer cured to a uniform thickness by coating a liquid resin on the upper surface of the board; a groove forming step of positioning a cutting tool on the front surface of the resin layer in correspondence with the line to divide, thereby forming a groove; a resin layer adhering step of adhering the front surface of the resin layer to the upper surface of the substrate by making the upper surface of the substrate face the front surface of the resin layer and making the groove correspond to the line to divide; and a plate removing step of removing the plate from the resin layer to expose the grooves formed in the resin layer.
In this plate removal step, the plate can be removed by grinding or spin-cutting. In this plate removing step, the plate can be peeled off from the resin layer and removed.
The method for forming a mask according to the present invention is a method for forming a mask for use in metal plating a line to be divided into chips on a substrate divided into the chips by the line to be divided, wherein the method for forming a mask comprises the steps of: a board preparation step of preparing a board having a size corresponding to the substrate; a resin curing step of forming a resin layer cured to a uniform thickness by coating a liquid resin on the upper surface of the board; a groove forming step of positioning a cutting tool on the front surface of the resin layer in correspondence with the line to divide, thereby forming a groove; a resin layer adhering step of adhering the front surface of the resin layer to the upper surface of the substrate by making the upper surface of the substrate face the front surface of the resin layer and making the groove correspond to the line to divide; and a plate removing step of removing the plate from the resin layer to expose the grooves formed in the resin layer, wherein the grooves are formed along the lines to divide the resin layer, which are covered on the substrate and function as masks, so that it is possible to easily dispose masks of a size corresponding to the respective regions, and it is not necessary to dispose masks of a size corresponding to the respective chips, which are divided in accordance with the regions of the substrate, for the respective chips, thereby solving the problem of being not so hard. In addition, when a mask is formed by forming a groove in a mask sheet by a cutting tool after the mask sheet is attached to a substrate as in the conventional art, the substrate may be damaged by the cutting tool, but according to the present invention, the groove is formed in advance in a resin layer functioning as a mask, and therefore damage to the substrate can be avoided.
Drawings
Fig. 1 is an overall perspective view of a cutting device suitable for the present embodiment.
Fig. 2 is a perspective view of a substrate as a workpiece of the present embodiment.
Fig. 3 is a perspective view of a plate prepared by the plate preparation process, and shows a mode of coating a liquid resin on the plate.
Fig. 4 is a perspective view showing a manner of curing the resin coated on the board.
Fig. 5 (a) is a perspective view showing an embodiment of the groove forming process, fig. 5 (b) is a partial enlarged cross-sectional view of the resin layer and the plate having grooves formed therein, and fig. 5 (c) is an overall perspective view of the plate having the resin layer having the groove forming process performed on the front surface thereof.
Fig. 6 (a) is a perspective view showing an embodiment of the resin layer attaching step, and fig. 6 (b) is a perspective view showing a manner of moving the substrate and the board away from the chuck table.
Fig. 7 (a) is a perspective view showing a manner in which a substrate and a board are placed on a holding table, fig. 7 (b) is a perspective view showing an embodiment of a board removing process, and fig. 7 (c) is a perspective view showing another embodiment of a board removing process.
Fig. 8 (a) is an enlarged partial cross-sectional view of a substrate on which a plate removing process is performed, and fig. 8 (b) is an overall perspective view of a substrate on which a plate removing process is performed.
Fig. 9 is a perspective view showing still another embodiment of the plate removing process.
Fig. 10 (a) is a perspective view showing an embodiment of a dividing process of dividing a substrate into individual chips, and fig. 10 (b) is a partially enlarged cross-sectional view when the dividing process is performed.
Description of the reference numerals
1: a cutting device; 2: a housing; 3: a carry-in/out unit; 4: a case; 4a: a box table; 5: a temporary placing table; 6: a conveying unit; 7: a chuck table; 71: a suction chuck; 72: a clamp; 8: a cutting unit; 80: a spindle housing; 81A: a cutting tool; 81B: a cutting tool; 82: rotating the main shaft; 83: a cutter cover; 84: a cutting water supply nozzle; 9: a photographing unit; 10: a substrate; 12: a region; 14: dividing a predetermined line; 16: a cleaning device; 17: a cleaning and carrying-out unit; 18: a liquid resin supply unit; 19: a liquid resin; 19': a resin layer; 20: a plate; 20a: a front face; 20b: a back surface; 30: a holding table; 32: a holding surface; 34: a liquid resin; 34': a resin layer; 36: an ultraviolet irradiation unit; 40: a grinding device; 42: a grinding unit; 43: rotating the main shaft; 44: a grinding wheel mounting seat; 45: grinding the grinding wheel; 46: grinding tool; 50: a rotary cutting device; 51: a rotary cutting unit; 52: a rotation shaft; 53: a cutter wheel; 54: a cutter; 55: a cutting edge; 60: plating; 100: a groove.
Detailed Description
Hereinafter, embodiments of a method for forming a mask according to the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 shows a cutting device 1, and the cutting device 1 is capable of cutting a substrate 10 shown in the drawing and performing cutting suitable for the mask forming method according to the present embodiment. The cutting device 1 has a substantially rectangular parallelepiped housing 2, and the cutting device 1 includes: a cassette 4 mounted on a cassette table 4a of the housing 2; a carry-in/out unit 3 that carries out the unprocessed substrate 10 supported by the frame F from the cassette 4 to the stocker 5, and carries in the cassette 4 the processed substrate 10 placed on the stocker 5; a carrying unit 6 having a rotating arm for carrying the substrate 10 carried out to the stocker 5 to the chuck table 7; a cutting unit 8 for performing cutting processing on the substrate 10 held by the chuck table 7; an imaging unit 9 for imaging the substrate 10 held on the chuck table 7; a cleaning carry-out unit 17 for carrying the processed substrate 10 from a carry-in and carry-out position positioned by the chuck table 7 in fig. 1 to the cleaning device 16 (detailed description is omitted); and a control unit not shown. The cutting unit 8 can be replaced with a different cutting tool (for example, a cutting tool 81A and a cutting tool 81B having different thicknesses and materials) according to the material of the workpiece and the cutting conditions.
The substrate 10 cut by the cutting device 1 of the present embodiment is a ceramic substrate, and as shown in fig. 2, is a rectangular substrate, and a plurality of regions 12 are formed on the front surface 10a by dividing the same by lines 14. The lines 14 are formed in a lattice shape by dividing lines 14 in a predetermined direction and dividing lines 14 in a direction perpendicular to the dividing lines 14 in the predetermined direction. When the substrate 10 is divided into individual chips for each region 12 by the cutting device 1, the substrate 10 is supported by an annular frame F via a protective tape T and held by the chuck table 7 as shown in fig. 1. The substrate 10 cut by the cutting means 8 is not limited to the above, and the region 12 and the lines 14 may be covered with the molding resin so as not to be exposed to the front surface 10 a.
The cutting device 1 includes: an X-axis moving unit that relatively moves the chuck table 7 and the cutting unit 8 in the X-axis direction; and a Y-axis moving unit that relatively moves the chuck table 7 and the cutting unit 8 in a Y-axis direction perpendicular to the X-axis direction. The X-axis moving means in the present embodiment moves the chuck table 7 in the X-axis direction, and the Y-axis moving means moves the cutting means 8 in the Y-axis direction. The X-axis moving unit and the Y-axis moving unit are disposed inside the housing 2, not shown.
The chuck table 7 has: a suction chuck 71 which constitutes a holding surface of the chuck table 7; and a jig 72 disposed so as to face the outer periphery of the chuck table 7, and configured to hold the frame F supporting the substrate 10. The suction chuck 71 is composed of a member having air permeability, and is connected to a suction source, not shown. By operating the suction source, a negative pressure is generated on the holding surface of the suction chuck 71, and the substrate 10 can be sucked and held.
The control unit is composed of a computer, and comprises: a Central Processing Unit (CPU) that performs an arithmetic process in accordance with a control program; a Read Only Memory (ROM) storing a control program or the like; a read-write Random Access Memory (RAM) for temporarily storing detection values, calculation results, and the like of various sensors; and an input interface and an output interface (both of which are omitted from detailed illustration). The control means is connected to each operation portion of the cutting device 1 to control the same, and the image captured by the imaging means 9 is stored in the control means and displayed on a display means, not shown.
The cutting device 1 shown in fig. 1 has substantially the above-described structure, and a method of forming a mask according to the present embodiment will be described below.
In the mask forming method of the present embodiment, first, as shown in fig. 3, a plate preparation step is performed to prepare a plate 20 having a size corresponding to the substrate 10. The plate 20 is a plate-like material having rigidity such as a glass plate or PET (polyethylene terephthalate). After the board 20 is prepared in this board preparation step, the board 20 is positioned immediately below the liquid resin supply unit 18 shown in fig. 3, and a predetermined amount of liquid resin 19 such as epoxy resin is dropped from the supply nozzle 18a of the liquid resin supply unit 18 onto the front surface 20a, and the liquid resin 19 is spread so as to have a uniform thickness on the front surface 20a of the board 20. In this case, although not shown, it is preferable to rotate a table for holding the plate 20. Next, as shown in fig. 4, a resin curing step is performed, and the liquid resin 19 spread on the front surface 20a of the board 20 is irradiated with Ultraviolet (UV) rays by the ultraviolet irradiation unit 36 to cure the liquid resin 19, thereby forming a resin layer 19' having a uniform thickness on the front surface 20a of the board 20. The liquid resin 19 is not limited to the epoxy resin, but may be an acrylic resin, and may be cured by irradiation with ultraviolet rays, or may be a resin that cures with the passage of time.
After the plate 20 having the resin layer 19 'formed on the front surface 20a and having a size corresponding to the substrate 10 is formed in the plate preparation step and the resin curing step, the resin layer 19' is placed on the chuck table 7 of the cutting device 1 so as to face upward as shown in fig. 5 (a), and the suction source is operated to suction and hold the plate 20. Next, the X-axis moving means of the cutting device 1 is operated, the chuck table 7 is positioned immediately below the imaging means 9, and information on the shape of the outer shape of the board 20 is detected and stored in the control means. Further, since the depth of the groove 100 described later is set to a depth reaching the front surface 20a of the board 20, information about the thickness of the board 20 is input in advance and stored in the control unit. Here, in the control unit, position information of the dividing line 14 formed on the front surface 10a of the substrate 10 as the workpiece is stored in advance in XY coordinates, and a position of the plate 20 corresponding to the dividing line 14 is set as a groove forming line forming a groove 100 described later. The groove forming line is formed in a lattice shape by a groove forming line set in a predetermined direction and a groove forming line (not shown) in a direction perpendicular to the predetermined direction, like the dividing line 14.
After the plate 20 is sucked and held on the chuck table 7 and the external shape of the plate 20 is stored in the control unit, as shown in fig. 5 (a), the predetermined direction of the groove forming predetermined line is aligned with the X-axis direction, and the groove forming predetermined line to be processed is positioned directly below the cutting unit 8. The cutting unit 8 has: a spindle case 80 extending in the Y-axis direction; a rotary spindle 82 rotatably supported by the spindle case 80; a cutting tool 81A fixed to the front end of the rotary spindle 82; a tool cover 83 covering the rotary spindle 82 and the cutting tool 81A; and a cutting water supply nozzle 84 for supplying cutting water to a portion cut by the cutting tool 81A, and rotating the cutting tool 81A in a direction indicated by an arrow R1 by a spindle motor, not shown. The cutting tool 81A is a cutting tool attached to form the groove 100 for cutting the resin layer 19', and is, for example, a cutting tool having a thickness of 100 μm at the cutting edge at the tip end corresponding to the width of the line to divide 14.
The following groove forming process was performed: the cutting tool 81A rotating at a high speed is positioned on the groove forming line aligned with the X axis direction, and the groove 100 is formed by cutting from the side of the plate 20 coated with the resin layer 19' by adjusting the cutting feed amount in the Z axis direction indicated by an arrow Z by a cutting feed unit, not shown, and by machining and feeding the chuck table 7 in the X axis direction. At this time, as is apparent from the partially enlarged sectional view shown in fig. 5 (b), the width of the groove 100 is 100 μm, and is formed to a depth not reaching the rear surface 20b side of the plate 20. The cutting tool 81A of the cutting unit 8 is fed in an indexing manner onto a groove forming line adjacent to the groove forming line on which the groove 100 is formed and on which the groove 100 is not formed in the Y-axis direction, and the groove 100 is formed in the same manner as described above. By repeating these operations, the grooves 100 are formed along all the groove forming predetermined lines in the X-axis direction. Next, the chuck table 7 is rotated by 90 degrees, the direction perpendicular to the direction in which the grooves 100 were formed before is aligned with the X-axis direction, the groove forming process is performed on all grooves newly aligned with the X-axis direction, and the grooves 100 are formed along all grooves of the plate 20 to form the predetermined lines (see fig. 5 (c)). As described above, the groove forming step of the present embodiment is completed by forming the groove 100 along all the grooves on the plate 20 to form the predetermined line.
After the completion of the groove forming step, the following resin layer adhering step is performed: the substrate 10 described with reference to fig. 2 is positioned above the board 20, and as shown in the upper part of fig. 6 (a), the front surface 10a of the substrate 10 on which the lines 14 for dividing are formed is directed downward, the front surface 10a of the substrate 10 is faced with the resin layer 19 'of the board 20 on which the grooves 100 are formed by the groove forming step, and the grooves 100 are made to correspond to the lines 14 for dividing of the substrate 10, and the resin layer 19' of the board 20 is bonded to the substrate 10. In the resin bonding step, for example, the resin layer 19' may be softened by heating the plate 20 to exert adhesive force and thermally press-bonded to bond the plate. However, the present invention is not limited to this, and the adhesive layer may be formed on the upper surface of the resin layer 19' and bonded thereto.
After the resin layer adhering step is performed as described above, the suction source connected to the chuck table 7 is stopped to release the negative pressure generated in the chuck table 7, and as shown in fig. 6 (b), the substrate 10 to which the board 20 is adhered via the resin layer 19' is taken out from the chuck table 7. In order to perform a plate removing process described later, the substrate 10 taken out from the chuck table 7 is carried and placed on a holding table 30 shown in fig. 7 (a). In order to hold the substrate 10, a holding surface 32 configured to correspond to the shape of the substrate 10 is formed on the upper surface of the holding table 30. The holding surface 32 is formed of a material having air permeability, and is connected to a suction source, not shown. By operating the suction source, a negative pressure is generated on the holding surface 32, and the substrate 10 is sucked and held.
The plate removing step is a step of removing the plate 20 from the resin layer 19 'formed on the front surface 10a of the substrate 10 to expose the grooves 100 formed in the resin layer 19' in the groove forming step, and can be performed by, for example, a grinding device 40 shown in fig. 7 (b).
The grinding device 40 includes a grinding unit 42, and the grinding unit 42 is configured to grind and remove the plate 20 attached to the front surface 10a of the substrate 10 sucked and held on the holding surface 32 of the holding table 30. The grinding unit 42 has: a rotation main shaft 43 rotated by a rotation driving mechanism not shown; a grinding wheel mount 44 mounted to a lower end of the rotary spindle 43; and a grinding wheel 45 mounted on the lower surface of the wheel mount 44, and a plurality of grinding tools 46 are annularly arranged on the lower surface of the grinding wheel 45.
After the substrate 10 is sucked and held on the holding table 30, the rotation main shaft 43 of the grinding unit 42 is rotated in a direction indicated by an arrow R2 in fig. 7 (b) at 3000rpm, for example, and the holding table 30 is rotated in a direction indicated by an arrow R3 at 300rpm, for example. Then, the grinding wheel 46 is brought into contact with the back surface 20b of the plate 20, and the grinding wheel 45 is fed at a grinding feed speed of, for example, 1 μm/sec toward the lower side indicated by arrow R4. The amount of the thickness of the plate 20 is removed by grinding, and the grooves 100 formed in the resin layer 19' are exposed as shown in fig. 8 (a) and (b). As described above, the grooves 100 are formed corresponding to the lines 14 to divide the substrate 10, and the grooves 100 are exposed on the upper surface, so that the lines 14 to divide the substrate 10 are also exposed.
The plate removing step of the present invention is not limited to the above-described grinding device 40, and may be performed by rotary cutting (cutter cutting) by the rotary cutting device 50 shown in fig. 7 (c), for example. The rotary cutting device 50 includes a rotary cutting unit 51 for rotary-cutting and removing the plate 20 attached to the back surface 10b of the base plate 10, which is sucked and held on the holding surface 32 of the holding table 30, via the resin layer 19'. The rotary cutting unit 51 includes: a cutter wheel 53 disposed at a lower end of the rotary shaft 52, the rotary shaft 52 being rotatably supported by a unit case, not shown; a motor, not shown, disposed on the upper end side of the rotation shaft 52, for rotating the cutter wheel 53; and a lifting unit that lifts the unit case in the up-down direction. A cutter 54 having a cutting edge 55 made of single crystal diamond or the like at a lower end portion thereof is attached to and fixed to a lower surface side of the cutter wheel 53. The rotary cutting unit 51 having such a structure is moved closer to or farther from the board 20 attached to the substrate 10 held by the holding table 30 by suction by the lifting unit described above. Thereby, the cutting edge 55 of the cutter 54 can be positioned at an arbitrary height.
When the plate 20 is rotated by the rotary cutting device 50, the motor is operated, and as shown in fig. 7 (c), the rotary shaft 52 of the rotary cutting unit 51 is rotated at a predetermined rotational speed (for example, 6000 rpm) in the direction indicated by the arrow R5, and the lifting unit is operated, so that the rotary cutting unit 51 is lowered in the direction indicated by the arrow R6 to be positioned at a desired height position, and the holding table 30 is moved in the direction indicated by the arrow R7 without being rotated. The desired height position is a height position at which the plate 20 is subjected to rotary cutting by the cutter 54, and the plate 20 is removed as shown in fig. 8 (a) and (b), so that the groove 100 is exposed on the upper surface. When the lifting means is operated to perform the rotary cutting by the cutter 54, it is preferable to gradually lower the rotary cutting means 51 to move to the desired height position while performing the rotary cutting process. With such a rotary cutting device 50, a plate removal step of removing the plate 20 to expose the groove 100 can also be performed.
The plate removing step of the present invention is not limited to the above-described grinding or rotary cutting, and may be performed by peeling as shown in fig. 9, in the case where the plate 20 is formed of a flexible material such as PET.
A mask for covering the region 12 formed on the substrate 10 except the lines for division 14 with the resin layer 19' is formed by a mask forming method including the above-described board preparation step, resin curing step, groove forming step, resin layer adhering step, and board removing step. The substrate 10 on which the mask is formed is carried to an appropriate plating apparatus, and a metal (for example, auSn (gold tin)) is plated on the front surface 10a of the substrate 10, and as shown in fig. 10 (a) and (b), a plating layer 60 having an appropriate thickness is formed on the front surface 10 a. In the present embodiment, as described above, the grooves 100 corresponding to the lines to divide 14 are formed in the resin layer 19', and the resin layer 19' functioning as a mask remains on the region 12, so that the plating layer 60 is formed on the resin layer 19' in the region 12 and on the substrate 10 in the lines to divide 14.
After the above-described plating process is performed on the substrate 10, as shown in fig. 10 (a), the substrate 10 is supported by the annular frame F via the protective tape T, and the substrate 10 is sucked and held by the chuck table 7 of the cutting device 1 described with reference to fig. 1, and the frame F is fixed by the jig 72 (in fig. 10, the jig 72 and the like are omitted for convenience of description). Next, the substrate 10 is photographed by the photographing unit 9, and the position of the dividing line 14, which is the groove 100 as the machining position, is detected, and the substrate 10 is positioned immediately below the cutting unit 8. At this time, a cutting tool 81B is attached to the cutting unit 8 in place of the cutting tool 81A, and the cutting tool 81B has a cutting edge thinner than the cutting tool 81A suitable for cutting the substrate 10 and dividing the substrate into chips. The cutting tool 81B has a thickness (for example, 30 μm) smaller than that of the cutting tool 81A and is smaller than the width dimension of the plating layer 60 having a width of 100 μm formed in the groove 100. Then, a dividing step is performed to rotate the cutting tool 81B at a high speed in the direction indicated by R1, and the X-axis feeding mechanism, the Y-axis feeding mechanism, and the cutting feeding mechanism are operated, and as shown in fig. 10 (B), the center in the width direction of the line to be divided 14 is cut from above, and the substrate 10 is divided into individual chips for each region 12. In this dividing step, since the cutting process is performed along the line to divide 14 using the cutting tool 81B having a cutting edge of 30 μm thinner at the tip side than the cutting tool 81A, the plating layer 60 having a width of 35 μm is divided in a state of surrounding the outer periphery of each of the divided chips, as described above.
In the above embodiment, after the mask forming method is performed, the plating process is performed without removing the resin layer 19' on the region 12, and the chips are directly divided by the cutting unit 8. This can prevent chips from being contaminated by adhesion of chips generated by cutting in the dividing step. However, the present invention is not limited thereto, and the resin layer 19' on which the plating layer 60 is formed may be removed from the chips before the substrate 10 is cut into individual chips.
As in the above-described embodiment, by performing the mask forming method including the board preparation step, the groove forming step, the resin layer adhering step, and the board removing step, the grooves 100 corresponding to the lines 14 to divide the board 10 are formed in the resin layer 19' covering the board 10 and functioning as a mask, and thus, it is possible to easily dispose masks of the sizes corresponding to the respective areas 12, and it is not necessary to dispose masks of the sizes corresponding to the chips divided for the respective areas 12 of the board 10, respectively, so that the problem of being not annoyed is solved.
In addition, when it is intended to form a mask by forming a groove in the mask sheet with a cutting tool after the mask sheet is attached to the substrate as in the conventional art, there is a possibility that the substrate is damaged by the cutting tool, but according to the present invention, the groove is formed in advance before the resin layer 19' functioning as a mask is attached to the substrate, and therefore damage to the substrate can be avoided.
Claims (3)
1. A method for forming a mask, which is used when metal plating is performed on a line to be divided into chips of a substrate by the line to be divided, wherein,
the mask forming method comprises the following steps:
a board preparation step of preparing a board having a size corresponding to the substrate;
a resin curing step of forming a resin layer cured to a uniform thickness by coating a liquid resin on the upper surface of the board;
a groove forming step of positioning a cutting tool on the front surface of the resin layer in correspondence with the line to divide, thereby forming a groove;
a resin layer adhering step of adhering the front surface of the resin layer to the upper surface of the substrate by making the upper surface of the substrate face the front surface of the resin layer and making the groove correspond to the line to divide; and
and a plate removing step of removing the plate from the resin layer to expose the grooves formed in the resin layer.
2. The method for forming a mask according to claim 1, wherein,
in this plate removing step, the plate is removed by grinding or spin-cutting.
3. The method for forming a mask according to claim 1, wherein,
in this plate removing step, the plate is peeled off from the resin layer and removed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022107549A JP2024006547A (en) | 2022-07-04 | 2022-07-04 | Mask forming method |
| JP2022-107549 | 2022-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117341221A true CN117341221A (en) | 2024-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310777125.4A Pending CN117341221A (en) | 2022-07-04 | 2023-06-28 | Mask forming method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2024006547A (en) |
| KR (1) | KR20240004103A (en) |
| CN (1) | CN117341221A (en) |
| TW (1) | TW202403848A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3999584B2 (en) | 2002-07-04 | 2007-10-31 | 株式会社ディスコ | Method for dividing ceramic chip capacitor sheet |
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2022
- 2022-07-04 JP JP2022107549A patent/JP2024006547A/en active Pending
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2023
- 2023-06-22 KR KR1020230080403A patent/KR20240004103A/en unknown
- 2023-06-28 CN CN202310777125.4A patent/CN117341221A/en active Pending
- 2023-06-29 TW TW112124283A patent/TW202403848A/en unknown
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| Publication number | Publication date |
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| JP2024006547A (en) | 2024-01-17 |
| KR20240004103A (en) | 2024-01-11 |
| TW202403848A (en) | 2024-01-16 |
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