CN114375103A - Printed circuit board production assembly and production process - Google Patents
Printed circuit board production assembly and production process Download PDFInfo
- Publication number
- CN114375103A CN114375103A CN202210105667.2A CN202210105667A CN114375103A CN 114375103 A CN114375103 A CN 114375103A CN 202210105667 A CN202210105667 A CN 202210105667A CN 114375103 A CN114375103 A CN 114375103A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- layer
- metal powder
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention relates to the technical field of printed circuit board production and processing, in particular to a printed circuit board production assembly and a production process. According to the invention, a metal powder layer or a metal sheet layer is laid on a printed circuit board base layer, and is pressed at a set position of the metal powder layer or the metal sheet layer by an ultrasonic oscillation pressing die, and the ultrasonic oscillation pressing die is pressed and separated to form the metal powder layer or the metal sheet layer by adopting an ultrasonic oscillation technology, so that the separated metal powder layer or the metal sheet layer is in friction welding with the printed circuit board base layer to form a conductive circuit. According to the invention, the metal conductive circuit of the printed circuit board is formed by pressing and welding the metal powder layer or the metal sheet layer, so that the production process of the printed circuit board is effectively simplified, the production period is saved, the use of chemical reagents in the traditional process is reduced, the purposes of energy conservation and emission reduction are realized, meanwhile, the metal conductive circuit and the base layer of the printed circuit board are stably welded, and the conductive circuit is effectively prevented from falling off.
Description
Technical Field
The invention relates to the technical field of printed circuit board production and processing, in particular to a printed circuit board production assembly and a production process.
Background
Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical interconnection of electronic components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved.
The printed circuit board is usually provided with corresponding metal conducting circuits to replace complex device connecting lines, the existing manufacturing process of the metal conducting circuits of the printed circuit board is mainly completed by adopting an adhering copper-clad plate corrosion engraving technology, the production process is complex, the production period is long, corresponding process chemical reagents are required to be used, the environmental pollution is great, meanwhile, the adhesion and the high temperature resistance of a copper-clad layer of the adhering copper-clad plate are poor, and the phenomenon of copper-clad falling under the high-temperature stress environment is serious.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a printed circuit board production assembly and a production process, which can effectively simplify the layout production process of the conductive circuit of the printed circuit board, save the production period, reduce the use of chemical reagents in the traditional process, stably weld the metal conductive circuit and the base layer of the printed circuit board and effectively prevent the conductive circuit from falling off.
The technical scheme adopted by the invention is as follows:
in a first aspect, the invention provides a printed circuit board production assembly, which comprises a printed circuit board base layer and an ultrasonic oscillation pressing die, wherein a metal powder layer is paved on the printed circuit board base layer, a pressing protruding part is arranged on one side of the ultrasonic oscillation pressing die, and the pressing protruding part is used for abutting against the metal powder layer.
Based on the technical content, the metal powder layer is laid on the printed circuit board base layer, the ultrasonic oscillation pressing die is arranged on the metal powder layer, the pressing protruding portion is pressed at the set position of the metal powder layer, ultrasonic oscillation is applied to the ultrasonic oscillation pressing die through the corresponding ultrasonic oscillator, the metal powder pressed under the pressing protruding portion can rub against each other under the action of the ultrasonic oscillation to be subjected to high-temperature welding, meanwhile, the metal powder and the printed circuit board base layer are subjected to friction welding, and the conductive circuit adhered to the printed circuit board base layer is formed. The metal powder is pressed and welded to form the metal conducting circuit of the printed circuit board, so that the production process of the printed circuit board is effectively simplified, the production period is saved, the use of chemical reagents in the traditional process is reduced, the purposes of energy conservation and emission reduction are realized, meanwhile, the metal conducting circuit and the base layer of the printed circuit board are stably welded, the strength and the high temperature resistance of the metal conducting circuit are both greater than those of the traditional adhesive copper-coated circuit, and the conducting circuit can be effectively prevented from falling off.
In one possible design, one end of the pressing projection for abutting against the metal powder layer is provided with a shaping groove. When its was used, set up moulding slot through the one end at suppression protruding portion butt metal powder layer, be convenient for with the metal powder cladding in moulding slot in the pressing process, quick butt fusion plasticity forms the metal conducting wire.
In a possible design, the production assembly further comprises a containing die plate, the containing die plate is provided with a containing through groove, the containing die plate is laid on the printed circuit board base layer, the metal powder layer is laid in the containing through groove and is in contact with the printed circuit board base layer, and the pressing protruding portion is used for extending into the containing through groove and abutting against the metal powder layer. During its application, through laying on printed circuit board basic unit and holding the mould board, lay metal powder layer and hold logical inslot to when required metal powder layer thickness is great, it is spacing to utilize and hold the mould board and carry out metal powder, supplementary moulding, when improving the suppression protruding ultrasonic wave vibration suppression, the moulding efficiency of welding and the quality of metal powder.
In one possible design, the depth of the containing channel is greater than the thickness of the metal powder layer. When it is used, the depth of holding through groove is greater than the thickness of metal powder layer through the messenger, can prevent effectively that metal powder from overflowing to holding outside the through groove in the ultrasonic oscillation pressing process.
In a second aspect, the invention provides a printed circuit board production assembly, which comprises a printed circuit board base layer and an ultrasonic oscillation pressing die, wherein a metal sheet layer is laid on the printed circuit board base layer, a pressing protruding part is arranged on one side of the ultrasonic oscillation pressing die and used for abutting against the metal sheet layer, a shaping groove is arranged at one end of the pressing protruding part, which is used for abutting against the metal sheet layer, and the groove wall of the shaping groove is used for cutting the metal sheet layer.
Based on above-mentioned technical content, through laying the sheetmetal at printed circuit board basic unit, arrange the ultrasonic oscillation embossing mold utensil in the sheetmetal on, make the suppression protruding portion suppression in the settlement position of sheetmetal, adopt corresponding ultrasonic oscillator to exert ultrasonic oscillation on the ultrasonic oscillation embossing mold utensil, just can make the cell wall cutting sheetmetal of the moulding slot in suppression protruding portion bottom, make the sheetmetal that moulding slot cladding was cut out, make the sheetmetal and the friction weld of printed circuit board basic unit of cutting out simultaneously, form the conducting wire of adhesion on printed circuit board basic unit. The metal conductive circuit of the printed circuit board is formed by cutting, pressing and welding the metal sheet layer, the production process of the printed circuit board is effectively simplified, the production period is saved, the use of chemical reagents in the traditional process is reduced, the purposes of energy conservation and emission reduction are achieved, meanwhile, the metal conductive circuit and the base layer of the printed circuit board are stably welded, the strength and the high temperature resistance of the metal conductive circuit are both greater than those of a traditional adhesive-coated copper circuit, and the conductive circuit can be effectively prevented from falling off.
In one possible design, the depth of the shaping trench is equal to the thickness of the sheet metal layer. When its is used, the degree of depth through making moulding slot equals sheet metal layer's thickness, and the sheet metal layer cladding that is convenient for make and cuts out is in moulding slot, and with moulding slot abundant butt, the ultrasonic wave of being convenient for vibrates the conduction to the sheet metal layer of cutting out, makes its and printed circuit board basic unit friction butt joint.
In a third aspect, the present invention provides a printed circuit board production process applicable to the printed circuit board production assembly described in the first aspect, comprising:
laying a metal powder layer on a printed circuit board base layer;
placing an ultrasonic oscillation pressing die on the metal powder layer to enable the pressing protruding part to abut against the set position of the metal powder layer;
applying ultrasonic oscillation on the ultrasonic oscillation pressing die to generate surface friction between the metal powder pressed under the pressing protrusion part for high-temperature welding, and simultaneously welding the metal powder and the printed circuit board base layer to form a conductive circuit adhered on the printed circuit board base layer;
and removing the metal powder which is not welded on the printed circuit board base layer.
In a fourth aspect, the present invention provides a printed circuit board production process applicable to the printed circuit board production assembly described in the second aspect, comprising:
laying a metal sheet layer on a printed circuit board base layer;
placing an ultrasonic oscillation pressing mould on the metal sheet layer to enable the pressing protruding part to abut against the set position of the metal sheet layer;
applying ultrasonic oscillation on an ultrasonic oscillation pressing die, so that the groove wall of the shaping groove at the bottom end of the pressing protrusion part is cut into a metal sheet layer, the cut metal sheet layer is coated in the shaping groove, and meanwhile, the cut metal sheet layer is in friction welding with the printed circuit board base layer to form a conductive circuit adhered on the printed circuit board base layer;
and removing the metal sheet layer which is not cut and welded on the printed circuit board base layer.
In a fifth aspect, the present invention provides a printed circuit board production process applicable to the printed circuit board production assembly described in the first aspect, comprising:
adhering and prefabricating metal powder into a metal powder layer, wherein the metal powder layer is arranged in a manner of setting a conductive circuit;
laying a metal powder layer at a set position on a base layer of the printed circuit board;
and applying ultrasonic oscillation to the metal powder layer to generate surface friction between the metal powder of the metal powder layer for high-temperature welding, and simultaneously welding the metal powder layer and the printed circuit board base layer to form a conductive circuit adhered on the printed circuit board base layer.
The invention has the beneficial effects that:
according to the invention, the metal conductive circuit of the printed circuit board is formed by pressing and welding the metal powder or the metal sheet layer, so that the production process of the printed circuit board is effectively simplified, the production period is saved, the use of chemical reagents in the traditional process is reduced, the purposes of energy conservation and emission reduction are realized, meanwhile, the metal conductive circuit and the base layer of the printed circuit board are stably welded, the strength and the high temperature resistance of the metal conductive circuit are both higher than those of the traditional adhesive copper-coated circuit, and the conductive circuit can be effectively prevented from falling off.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a first production assembly of the present invention;
FIG. 2 is a schematic representation of the use of a first production assembly of the present invention;
FIG. 3 is a schematic diagram of a second production assembly of the present invention;
FIG. 4 is a schematic representation of the use of a second production assembly of the present invention;
FIG. 5 is a schematic diagram of a third production assembly of the present invention;
FIG. 6 is a schematic representation of the use of a third production assembly of the present invention;
FIG. 7 is a schematic diagram of a fourth production assembly of the present invention;
FIG. 8 is a schematic representation of the use of a fourth production assembly of the present invention.
In the figure: 1. a printed circuit board base layer; 2. ultrasonic oscillation pressing mould; 3. a metal powder layer; 4. Pressing the protrusion; 5. shaping a groove; 6. receiving a mold plate; 7. a metal sheet layer.
Detailed Description
The invention is further described with reference to the following figures and specific embodiments. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Specific structural and functional details disclosed herein are merely illustrative of example embodiments of the invention. This invention may, however, be embodied in many alternate forms and should not be construed as limited to the embodiments set forth herein.
It is to be understood that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the following description, specific details are provided to facilitate a thorough understanding of example embodiments. However, it will be understood by those of ordinary skill in the art that the example embodiments may be practiced without these specific details. For example, systems may be shown in block diagrams in order not to obscure the examples in unnecessary detail. In other instances, well-known processes, structures and techniques may be shown without unnecessary detail in order to avoid obscuring example embodiments.
Example 1:
the embodiment provides a printed circuit board production assembly, as shown in fig. 1 to 2, including printed circuit board basic unit 1 and ultrasonic oscillation pressing die 2, metal powder layer 3 has been laid on printed circuit board basic unit 1, one side of ultrasonic oscillation pressing die 2 is equipped with pressing protruding portion 4, pressing protruding portion 4 is used for the butt on metal powder layer 3.
During concrete implementation, through laying metal powder layer 3 at printed circuit board basic unit 1, arrange ultrasonic oscillation embossing mold utensil 2 in on metal powder layer 3, make suppression protruding portion 4 suppression in the settlement position of metal powder layer 3, adopt corresponding ultrasonic oscillator to apply ultrasonic oscillation on ultrasonic oscillation embossing mold utensil 2, just can make the metal powder of suppression protruding portion 4 lower suppression rub each other under the ultrasonic oscillation effect and carry out the high temperature butt fusion, make metal powder and printed circuit board basic unit 1 friction weld simultaneously, form the conducting wire of adhesion on printed circuit board basic unit 1. The metal powder is pressed and welded to form the metal conducting circuit of the printed circuit board, so that the production process of the printed circuit board is effectively simplified, the production period is saved, the use of chemical reagents in the traditional process is reduced, the purposes of energy conservation and emission reduction are realized, meanwhile, the metal conducting circuit and the base layer of the printed circuit board are stably welded, the strength and the high temperature resistance of the metal conducting circuit are both greater than those of the traditional adhesive copper-coated circuit, and the conducting circuit can be effectively prevented from falling off.
Further, as shown in fig. 3 to 4, one end of the pressing protrusion 4 for abutting against the metal powder layer 3 is provided with a shaping groove 5. During specific implementation, set up moulding slot 5 through the one end at 4 butt metal powder layer 3 of suppression protruding portion, be convenient for with the metal powder cladding at the suppression in-process quick butt fusion plasticity in moulding slot 5, form the metal conducting wire.
Further, as shown in fig. 5 to 6, the production assembly further comprises a containing mold plate 6, a containing through groove is formed in the containing mold plate 6, the containing mold plate 6 is laid on the printed circuit board base layer 1, the metal powder layer 3 is laid in the containing through groove and is in contact with the printed circuit board base layer 1, and the pressing protruding portion 4 is used for extending into the containing through groove and abutting against the metal powder layer 3. During concrete implementation, through laying on printed circuit board basic unit 1 and holding mould board 6, lay metal powder layer 3 and hold logical inslot to when 3 thickness on required metal powder layer are great, it is spacing to utilize and hold mould board 6 to carry out metal powder, and it is supplementary moulding, metal powder's butt fusion moulding efficiency and quality when improving 4 ultrasonic oscillation pressing of suppression protruding portion.
Further, the depth of the containing through groove is greater than the thickness of the metal powder layer 3. During specific implementation, the depth of the accommodating through groove is larger than the thickness of the metal powder layer 3, so that the metal powder can be effectively prevented from overflowing out of the accommodating through groove in the ultrasonic oscillation pressing process.
The embodiment also provides a printed circuit board production process, which can be applied to the printed circuit board production assembly, and the process comprises the following steps:
s101, laying a metal powder layer 3 on a printed circuit board base layer 1;
s102, placing the ultrasonic oscillation pressing die 2 on the metal powder layer 3 to enable the pressing protruding part 4 to abut against a set position of the metal powder layer 3;
s103, applying ultrasonic oscillation on the ultrasonic oscillation pressing die 2 to enable surface friction to be generated between the metal powder pressed under the pressing protruding part 4 for high-temperature welding, and meanwhile welding the metal powder with the printed circuit board base layer 1 to form a conductive circuit adhered to the printed circuit board base layer 1;
and S104, removing the metal powder which is not welded on the printed circuit board base layer 1.
The embodiment also provides a printed circuit board production process, which can be applied to the printed circuit board production assembly, and the process comprises the following steps:
s201, adhering and prefabricating metal powder into a metal powder layer 3, wherein the metal powder layer 3 is provided with a set conductive circuit;
s202, laying a metal powder layer 3 at a set position on a printed circuit board base layer 1;
and S203, applying ultrasonic vibration to the metal powder layer 3 to generate surface friction between metal powder of the metal powder layer 3 for high-temperature welding, and simultaneously welding the metal powder layer 3 and the printed circuit board base layer 1 to form a conductive circuit adhered to the printed circuit board base layer 1.
Example 2:
this embodiment provides second kind of printed circuit board production subassembly, as shown in fig. 7 to 8, vibrate embossing mold utensil 2 including printed circuit board basic unit 1 and ultrasonic wave, 1 upper berth of printed circuit board basic unit is equipped with sheet metal layer 7, one side of ultrasonic wave vibrates embossing mold utensil 2 is equipped with suppression protruding portion 4, suppression protruding portion 4 is used for the butt on sheet metal layer 7, the one end that suppression protruding portion 4 is used for butt sheet metal layer 7 is equipped with moulding slot 5, the cell wall of moulding slot 5 is used for cutting sheet metal layer 7.
During specific implementation, through laying sheet metal layer 7 at printed circuit board basic unit 1, arrange ultrasonic oscillation embossing mold utensil 2 in on sheet metal layer 7, make 4 suppression of suppression protruding portion set for the position at sheet metal layer 7, adopt corresponding ultrasonic oscillator to apply ultrasonic oscillation on ultrasonic oscillation embossing mold utensil 2, just can make the cell wall cutting sheet metal layer 7 of the moulding slot 5 in 4 bottoms of suppression protruding portion, make the sheet metal layer 7 of the cladding cutting out of moulding slot 5, make the sheet metal layer 7 of cutting out and the 1 friction welding of printed circuit board basic unit of the sheet metal layer 7 of cutting out simultaneously, form the conducting wire of adhesion on printed circuit board basic unit 1. The metal conductive circuit of the printed circuit board is formed by cutting, pressing and welding the metal sheet layer, the production process of the printed circuit board is effectively simplified, the production period is saved, the use of chemical reagents in the traditional process is reduced, the purposes of energy conservation and emission reduction are achieved, meanwhile, the metal conductive circuit and the base layer of the printed circuit board are stably welded, the strength and the high temperature resistance of the metal conductive circuit are both greater than those of a traditional adhesive-coated copper circuit, and the conductive circuit can be effectively prevented from falling off.
Further, the depth of the shaping groove 5 is equal to the thickness of the metal sheet layer 7. During concrete implementation, the depth of the molding groove 5 is equal to the thickness of the metal sheet layer 7, so that the cut metal sheet layer 7 is wrapped in the molding groove 5, the metal sheet layer 7 is fully abutted to the molding groove 5, ultrasonic oscillation conduction to the cut metal sheet layer 7 is facilitated, and the metal sheet layer 7 and the printed circuit board base layer 1 are in friction welding
The embodiment also provides a printed circuit board production process, which can be applied to the printed circuit board production assembly, and the process comprises the following steps:
s301, laying the metal sheet layer 7 on the printed circuit board base layer 1;
s302, placing the ultrasonic oscillation pressing die 2 on the metal sheet layer 7 to enable the pressing protruding part 4 to abut against a set position of the metal sheet layer 7;
s303, applying ultrasonic oscillation on the ultrasonic oscillation pressing die 2 to enable the groove wall of the shaping groove 5 at the bottom end of the pressing protrusion 4 to cut the metal sheet layer 7, coating the cut metal sheet layer 7 in the shaping groove 5, and meanwhile enabling the cut metal sheet layer 7 to be in friction welding with the printed circuit board base layer 1 to form a conductive circuit adhered to the printed circuit board base layer 1;
s304, removing the metal sheet layer 7 which is not cut and welded on the base layer 1 of the printed circuit board.
The present invention is not limited to the above-described alternative embodiments, and various other forms of products can be obtained by anyone in light of the present invention. The above detailed description should not be taken as limiting the scope of the invention, which is defined in the claims, and which the description is intended to be interpreted accordingly.
Claims (9)
1. A printed circuit board production assembly, comprising: including printed circuit board basic unit (1) and ultrasonic oscillation embossing mold utensil (2), the metal powder layer (3) are laid on printed circuit board basic unit (1), one side of ultrasonic oscillation embossing mold utensil (2) is equipped with suppression protruding portion (4), suppression protruding portion (4) are used for the butt on metal powder layer (3).
2. A printed circuit board production assembly according to claim 1, wherein: one end of the pressing protruding part (4) used for being abutted to the metal powder layer (3) is provided with a shaping groove (5).
3. A printed circuit board production assembly according to claim 1, wherein: the production subassembly is still including holding mould board (6), it holds logical groove to hold to be equipped with on mould board (6), it lays on printed circuit board basic unit (1) to hold mould board (6), metal powder layer (3) are laid and are held logical inslot and printed circuit board basic unit (1) contact, suppression protruding portion (4) are used for stretching into and hold logical inslot butt metal powder layer (3).
4. A printed circuit board production assembly according to claim 3, wherein: the depth of the containing through groove is larger than the thickness of the metal powder layer (3).
5. A printed circuit board production assembly, comprising: including printed circuit board basic unit (1) and ultrasonic oscillation embossing mold utensil (2), printed circuit board basic unit (1) upper berth is equipped with sheet metal layer (7), one side of ultrasonic oscillation embossing mold utensil (2) is equipped with suppression protruding portion (4), suppression protruding portion (4) are used for the butt on sheet metal layer (7), the one end that suppression protruding portion (4) are used for butt sheet metal layer (7) is equipped with moulding slot (5), the cell wall of moulding slot (5) is used for cutting sheet metal layer (7).
6. A printed circuit board production assembly according to claim 5, wherein: the depth of the shaping groove (5) is equal to the thickness of the metal sheet layer (7).
7. A printed circuit board production process applicable to the printed circuit board production assembly of any one of claims 1 to 4, comprising:
laying a metal powder layer (3) on a printed circuit board base layer (1);
placing the ultrasonic oscillation pressing die (2) on the metal powder layer (3) to enable the pressing protruding part (4) to be abutted against the set position of the metal powder layer (3);
applying ultrasonic oscillation on the ultrasonic oscillation pressing die (2) to generate surface friction between the metal powder pressed under the pressing protrusion part (4) for high-temperature welding, and simultaneously welding the metal powder and the printed circuit board base layer (1) to form a conductive circuit adhered on the printed circuit board base layer (1);
removing the metal powder which is not welded on the printed circuit board base layer (1).
8. A printed circuit board production process applicable to the printed circuit board production assembly of claim 5 or 6, comprising:
laying a metal sheet layer (7) on a printed circuit board base layer (1);
placing the ultrasonic oscillation pressing die (2) on the metal sheet layer (7) to enable the pressing protruding part (4) to abut against the set position of the metal sheet layer (7);
applying ultrasonic oscillation on an ultrasonic oscillation pressing die (2), cutting a metal sheet layer (7) on the groove wall of a shaping groove (5) at the bottom end of a pressing protrusion (4), coating the cut metal sheet layer (7) in the shaping groove (5), and simultaneously enabling the cut metal sheet layer (7) and a printed circuit board base layer (1) to be in friction welding to form a conductive circuit adhered to the printed circuit board base layer (1);
and removing the metal sheet layer (7) which is not cut and welded on the printed circuit board base layer (1).
9. A printed circuit board production process applicable to the printed circuit board production assembly of any one of claims 1 to 4, comprising:
adhering and prefabricating metal powder into a metal powder layer (3), wherein the metal powder layer (3) is provided with a set conductive circuit;
laying a metal powder layer (3) at a set position on a printed circuit board base layer (1);
ultrasonic oscillation is applied to the metal powder layer (3), so that surface friction is generated between metal powder of the metal powder layer (3) for high-temperature welding, and meanwhile, the metal powder layer (3) is welded with the printed circuit board base layer (1) to form a conductive circuit adhered to the printed circuit board base layer (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210105667.2A CN114375103A (en) | 2022-01-28 | 2022-01-28 | Printed circuit board production assembly and production process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210105667.2A CN114375103A (en) | 2022-01-28 | 2022-01-28 | Printed circuit board production assembly and production process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114375103A true CN114375103A (en) | 2022-04-19 |
Family
ID=81145532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210105667.2A Pending CN114375103A (en) | 2022-01-28 | 2022-01-28 | Printed circuit board production assembly and production process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114375103A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2757443A (en) * | 1953-01-21 | 1956-08-07 | Erie Resistor Corp | Method of making printed circuits |
| JPH11111905A (en) * | 1997-10-02 | 1999-04-23 | Matsushita Electric Ind Co Ltd | Electrical connection and bump electrode formed body |
| CN1640213A (en) * | 2001-09-10 | 2005-07-13 | 3M创新有限公司 | Method for making conductive circuits using powdered metals |
| US20110300305A1 (en) * | 2010-05-03 | 2011-12-08 | Applied Nanotech Holdings, Inc. | Mechanical sintering of nanoparticle inks and powders |
| DE102013200697A1 (en) * | 2013-01-17 | 2014-07-17 | Rwth Aachen | Method for producing structured electrical support materials to manufacture flexible circuit board, involves attaching support material to raised structures on tool, and moving support material to form two planes |
-
2022
- 2022-01-28 CN CN202210105667.2A patent/CN114375103A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2757443A (en) * | 1953-01-21 | 1956-08-07 | Erie Resistor Corp | Method of making printed circuits |
| JPH11111905A (en) * | 1997-10-02 | 1999-04-23 | Matsushita Electric Ind Co Ltd | Electrical connection and bump electrode formed body |
| CN1640213A (en) * | 2001-09-10 | 2005-07-13 | 3M创新有限公司 | Method for making conductive circuits using powdered metals |
| US20110300305A1 (en) * | 2010-05-03 | 2011-12-08 | Applied Nanotech Holdings, Inc. | Mechanical sintering of nanoparticle inks and powders |
| DE102013200697A1 (en) * | 2013-01-17 | 2014-07-17 | Rwth Aachen | Method for producing structured electrical support materials to manufacture flexible circuit board, involves attaching support material to raised structures on tool, and moving support material to form two planes |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20200245495A1 (en) | Method of fixing flexible printed circuit and mobile terminal | |
| CN102254685B (en) | Electrochemical device and manufacturing method thereof, circuit board and housing tray | |
| CN106304607B (en) | Rigid-flex combined board and preparation method thereof | |
| CN102883549A (en) | Circuit board with heat collection structure and manufacturing method for circuit board | |
| GB2356087A (en) | Wiring board where a soldered connection between a bus bar and an electrical component can be inspected | |
| CN114375103A (en) | Printed circuit board production assembly and production process | |
| CN110324991A (en) | A kind of preparation method of composite circuit board | |
| CN107484342A (en) | A kind of ceramic PCB support plates preparation method of the materials of FR 4 | |
| CN108055767B (en) | PCB and manufacturing method thereof | |
| JP3225670U (en) | Joint assembly | |
| CN109514063A (en) | A kind of motor winding welding technique | |
| CN106650627B (en) | Biological recognition module mounting structure and mounting method thereof | |
| CN115134998A (en) | PCB and manufacturing method thereof | |
| WO2021057320A1 (en) | Thick-metal led long lamp strip and manufacturing method | |
| CN102630130A (en) | Electric connection and method for building electric connection | |
| CN202178913U (en) | Half hollow type metal-base copper coated board | |
| CN214429772U (en) | Multilayer immersion gold circuit board | |
| CN217336015U (en) | Rigid-flex circuit board structure | |
| CN111674123B (en) | Fiber metal laminated plate, preparation method and resistance welding method | |
| CN218772602U (en) | Long board circuit board and circuit board module | |
| KR860001486B1 (en) | Process for manufacturing printed circuit | |
| CN216016830U (en) | Low-pass filter | |
| CN219999674U (en) | Double-sided metal-based circuit board | |
| CN105318296B (en) | A kind of LED lamp circuit plate and preparation method thereof | |
| CN215647605U (en) | FPC structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |