CN114373704B - Semiconductor triode lead wire support oxidation protection device - Google Patents
Semiconductor triode lead wire support oxidation protection device Download PDFInfo
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- CN114373704B CN114373704B CN202210051883.3A CN202210051883A CN114373704B CN 114373704 B CN114373704 B CN 114373704B CN 202210051883 A CN202210051883 A CN 202210051883A CN 114373704 B CN114373704 B CN 114373704B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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Abstract
The invention discloses an oxidation protection device for a lead wire bracket of a semiconductor triode, which relates to the technical field of oxidation protection and solves the problem of waste in the prior art of nitrogen gas injection, and comprises a processing platform, wherein a plurality of pad strips are equidistantly fixed on the processing platform, the processing platform also comprises two L-shaped plates which are slidably inserted on the pad strips, insertion holes are equidistantly formed in the two L-shaped plates, mounting holes are formed in the L-shaped plates at positions corresponding to the insertion holes, sealing members are mounted in the mounting holes, two bidirectional threaded rods are inserted between the two L-shaped plates in a threaded manner, driving mechanisms are mounted at the outer ends of the two bidirectional threaded rods, two ends of the two bidirectional threaded rods are mounted at two ends of the processing platform through connecting frames, and a recovery mechanism is mounted at the bottom of the processing platform. The gas can be supplemented and recovered in the placing region synchronously, the utilization effect of the gas is improved, and the waste of the gas is reduced.
Description
Technical Field
The invention relates to the technical field of oxidation protection, in particular to an oxidation protection device for a lead wire bracket of a semiconductor triode.
Background
Semiconductor lead frames are used as substrates for manufacturing semiconductor packages, and generally, lead frames are made of iron alloys. However, with the continuous demand for high performance miniaturized packages, more active metals, particularly copper alloy lead frames, are increasingly being used in semiconductor packages. Copper alloy lead frames are more attractive than iron alloy lead frames because of their good heat dissipation, good processability and low cost. On the other hand, copper alloys have the disadvantage of being susceptible to oxidation when exposed to oxygen at high temperatures (i.e., copper reacts with oxygen to form copper oxide). This oxidation results in oxygen forming weak bonds with atoms on the surface of the leadframe, and brittle layers and/or adsorbed oxides. Thus, oxidation leads to reliability problems for microelectronic packages.
In a typical semiconductor packaging process, the oxidation problem is exacerbated when the wire bonds the semiconductor chip to the surface of the leadframe to form a conductive connection. Currently, the industrial method for preventing oxidation of lead frame is to introduce a large amount of inert gas (usually nitrogen) into the lead frame, and by designing one or more nozzles to the bonding area and blowing nitrogen into the bonding area, the nitrogen in the environment around the bonding area can avoid oxidation of the lead frame at high bonding temperature. However, in order to fill the periphery of the lead frame with nitrogen gas quickly during the bonding process, a nozzle with a very high spraying speed is commonly used, so that when the nitrogen gas can be sprayed to the periphery of the lead frame quickly, the nitrogen gas needs to be sprayed again when the lead frame is replaced after the bonding is finished, and when the lead frame is very large, excessive waste of the nitrogen gas is caused.
Disclosure of Invention
The invention aims to provide a semiconductor triode lead support oxidation protection device capable of reasonably recycling nitrogen and reducing waste, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the semiconductor triode lead support oxidation protection device comprises a processing platform, wherein a plurality of cushion strips are fixed on the processing platform at equal intervals, the semiconductor triode lead support oxidation protection device further comprises two L-shaped plates which are inserted into the cushion strips in a sliding mode, the directions of the two L-shaped plates are opposite, insertion holes are formed in the two L-shaped plates at equal intervals, mounting openings are formed in the positions, corresponding to the insertion holes, of the L-shaped plates, sealing members are mounted in the mounting openings, two-way threaded rods are inserted between the two L-shaped plates in a threaded mode, driving mechanisms are mounted at the outer ends of the two-way threaded rods, the two ends of the two-way threaded rods are mounted at the two ends of the processing platform through connecting frames, and a recovery mechanism for recovering and supplying nitrogen is mounted at the bottom of the processing platform; sealing plates are arranged on the two gasket strips, and the two sealing plates respectively penetrate through the two mounting openings in a sliding manner; and the gas injection mechanisms are arranged on the L-shaped plate at equal intervals and are used for injecting gas to the bonding area.
Preferably, actuating mechanism cup joints the mounting panel in two-way threaded rod outsides including sliding, two spacing mouthful one has all been opened in the two-way threaded rod outside, just the mounting panel both ends are all rotated and are installed and cup joint the regulating gear of two-way threaded rod outer end, two regulating gear inboard be fixed with spacing one, and two of a slip grafting of spacing mouthful one the meshing cover in the regulating gear outside has toothed belt one, the mounting panel pass through the inserted bar with the installation of processing platform outer end, just mounting panel both ends bottom is fixed with the connecting plate, be fixed with driving motor through the motor frame in the mounting panel, just the driving motor output through the shaft coupling be fixed with regulating gear engaged with drive gear provides drive power through actuating mechanism.
Preferably, the recovery mechanism includes two recovery barrels fixed in the bottom of the processing platform through a support, two the motion bar is installed in the recovery barrel in a rotating mode, the outer end of the motion bar is in sliding insertion with the connecting plate, the outer side of the motion bar corresponds to the position of the connecting plate is provided with a second limiting port, a linkage gear is sleeved on the outer side of the motion bar, the inner side of the linkage gear is fixed with a second limiting strip in sliding insertion with the second limiting port, the linkage gear is in transmission connection with the outer side of the adjusting gear through a second toothed belt, a track strip is fixed in the recovery barrel, a piston plate in sliding sleeve connection with the track strip is sleeved on the outer side of the motion bar in a threaded mode, the outer end of the recovery barrel is communicated with a plurality of multi-way pipes, a plurality of exhaust ports are formed in the processing platform, the outer ends of the multi-way pipes are communicated with the plurality of exhaust ports in sequence, and active gas supplement is realized through the recovery mechanism after operation and when the recovery of gas is actively used for the operation .
Preferably, the closing member is including fixing the slide bar of installing port both sides inner wall, both sides slide bar outer end all be fixed with the baffle, and the slide bar outside all overlaps and has the propelling movement spring that is used for the outside removal of propelling movement baffle, improves sealed effect through the closing member, avoids gas loss and peripheral gaseous entering.
Preferably, the jet-propelled mechanism is including fixing jet-propelled pipe in the L template, jet-propelled pipe tail end passes through the backup pad to be fixed L template bottom, just jet-propelled intraductal rotation is inserted there is the pivot, and the backup pad outside is fixed with jet-propelled motor through the motor frame, just jet-propelled motor output pass through the shaft coupling with the pivot outer end is fixed, the pivot is located the jet-propelled pipe end outside is fixed with the wind wheel, just install in the jet-propelled pipe and divide the gas head, jet-propelled outside intercommunication of the pipe has the gas-supply pipe, and passes through the gas-supply pipe docks with external air supply equipment, realizes the blowout to gas through jet-propelled mechanism.
Preferably, divide the gas head to include quick nozzle, quick nozzle is located in the jet-propelled pipe, just the pivot outer end pass through the link with quick nozzle one end inner wall is fixed, jet-propelled pipe inboard with the cover has the rotation cover between the quick nozzle outside, just rotate cover one end pass through the link with the pivot outside is fixed, installs porous cover in the other end, realizes spouting respectively to gas through dividing the gas head for the gas flow rate of skin and inlayer is different.
Preferably, the filler strip with the closing plate all adopts the rubber material to make, just the closing plate both ends pass through the screw with the filler strip is connected, and the screw is pegged graft for follow-up can dismantle to install on other filler strips.
Preferably, the outer end of the moving rod is flush with the outer end of the bidirectional threaded rod, so that subsequent adjustment is facilitated.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the existing processing platform is optimized, the L-shaped plates and the sealing plates are additionally arranged to be matched with each other, the lead frames with different sizes are placed and limited, and meanwhile, through the designed recovery mechanism, when the L-shaped plates are opened and closed, the gas in the placement area can be supplemented and recovered synchronously, so that the utilization effect of the gas is improved, and the waste of the gas is reduced.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is another perspective view of the present invention;
FIG. 3 is an enlarged view taken at A in FIG. 2;
FIG. 4 is an enlarged view of FIG. 2 at B;
FIG. 5 is a bottom view of the present invention;
FIG. 6 is a schematic top view of the present invention processing platform;
FIG. 7 is a schematic view of the front and rear faces of an L-shaped panel of the present invention;
FIG. 8 is an enlarged view at C of FIG. 7;
FIG. 9 is a schematic view of the connection structure of the air injection mechanism of the present invention;
FIG. 10 is a partial cross-sectional structural schematic view of the gas injection mechanism of the present invention;
FIG. 11 is a schematic view of the recycling mechanism of the present invention;
FIG. 12 is a partial sectional view of the inner structure of the recycling bin of the present invention.
In the figure: 1-processing a platform; 2-a filler strip; 3-L-shaped plates; 4-insertion opening; 5, mounting a port; 6-a closing member; 7-a bidirectional threaded rod; 8-a drive mechanism; 9-a recovery mechanism; 10-sealing plate; 11-a gas injection mechanism; 12-a mounting plate; 13-a first limiting opening; 14-an adjusting gear; 15-limiting strip one; 16-toothed belt one; 17-a connecting plate; 18-a drive motor; 19-a drive gear; 20-a recovery cylinder; 21-a moving rod; 22-a second limit port; 23-a linkage gear; 24-a second limit strip; 25-a toothed belt II; 26-a track bar; 27-a piston plate; 28-multiway tubes; 29-exhaust port; 30-a slide bar; 31-a baffle; 32-a push spring; 33-a gas lance; 34-a rotating shaft; 35-a jet motor; 36-a wind wheel; 37-gas separation head; 38-gas delivery pipe; 39-quick nozzle; 40-rotating the sleeve; 41-porous cover.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1 and 2, the oxidation protection device for the lead frame of the semiconductor triode in the figure comprises a processing platform 1, wherein a plurality of pad strips 2 are equidistantly fixed on the processing platform 1, the oxidation protection device further comprises two L-shaped plates 3 which are slidably inserted into the pad strips 2, the orientations of the two L-shaped plates 3 are opposite, insertion holes 4 are formed in the two L-shaped plates 3 at equal intervals, mounting holes 5 are formed in the L-shaped plates 3 at positions corresponding to the insertion holes 4, sealing members 6 are mounted in the mounting holes 5, two bidirectional threaded rods 7 are inserted between the two L-shaped plates 3 in a threaded manner, driving mechanisms 8 are mounted at the outer ends of the two bidirectional threaded rods 7, the two ends of the two bidirectional threaded rods 7 are mounted at the two ends of the processing platform 1 through connecting frames, and a recovery mechanism 9 for recovering and supplying nitrogen is mounted at the bottom of the processing platform 1; sealing plates 10 are arranged on the two filler strips 2, and the two sealing plates 10 respectively penetrate through the two mounting openings 5 in a sliding manner; and a plurality of gas injection mechanisms 11 are equidistantly arranged on the L-shaped plate 3, and the gas injection mechanisms 11 are used for injecting gas to the bonding area.
It should be noted that: in this scheme, mutually supporting through two L templates 3 of design and two closing plates 10, realize spacing to the required position of a lead frame, then the jet-propelled mechanism 11 of rethread design can be effectively to the spraying of carrying out nitrogen gas in this scope, after the bonding finishes, can inhale the recovery with the gas in this scope through retrieving mechanism 9 for when the bonding once more next time, can reduce gaseous waste effectively with absorbent gas outgoing.
It is worth noting that: the limitation of the lead frame is the prior art, the limitation of the lead frame and the bonding of the bonding equipment are both the prior mature technologies, and redundant description is omitted here.
Referring to fig. 2-6, the driving mechanism 8 in the figure includes a mounting plate 12 slidably sleeved on the outer sides of two-way threaded rods 7, the outer sides of the two-way threaded rods 7 are both provided with a first limit opening 13, and both ends of the mounting plate 12 are rotatably provided with adjusting gears 14 sleeved on the outer ends of the two-way threaded rods 7, the inner sides of the two adjusting gears 14 are fixed with a first limit strip 15 slidably inserted with the first limit opening 13, the outer sides of the two adjusting gears 14 are engaged and sleeved with a first toothed belt 16, the mounting plate 12 is mounted on the outer end of the processing platform 1 through an inserted bar, the bottoms of both ends of the mounting plate 12 are fixed with connecting plates 17, a driving motor 18 is fixed in the mounting plate 12 through a motor frame, and the output end of the driving motor 18 is fixed with a driving gear 19 engaged with the adjusting gears 14 through a coupler;
it should be noted that: the driving gear 19 and the adjusting gear 14 are driven to rotate by the rotation of the driving motor 18, so that the two bidirectional threaded rods 7 rotate, and the movement adjustment of the two L-shaped plates 3 is realized.
Referring to fig. 11 and 12, the recycling mechanism 9 shown in the figure comprises two recycling cylinders 20 fixed at the bottom of the processing platform 1 through a bracket, a moving rod 21 is rotatably installed in each recycling cylinder 20, the outer end of the movable rod 21 is inserted with the connecting plate 17 in a sliding way, the outer side of the movable rod 21 is provided with a second limit opening 22 corresponding to the position of the connecting plate 17, a linkage gear 23 is sleeved outside the movable rod 21, a second limit strip 24 which is in sliding insertion connection with the second limit opening 22 is fixed inside the linkage gear 23, the linkage gear 23 is in transmission connection with the outer side of the adjusting gear 14 through a toothed belt II 25, a track strip 26 is fixed in the recovery cylinder 20, and the outer side of the moving rod 21 is sleeved with a piston plate 27 which is sleeved with the track bar 26 in a sliding way through screw threads, the outer end of the recovery cylinder 20 is communicated with a plurality of multi-way pipes 28, a plurality of exhaust ports 29 are formed in the processing platform 1, and the outer ends of the multi-way pipes 28 are communicated with the plurality of exhaust ports 29 in sequence;
it should be noted that: the two toothed belts 25 drive the linkage gear 23 to rotate, so that the moving rod 21 is controlled to rotate, the piston plate 27 moves, negative pressure air suction or high pressure air exhaust is realized in the recovery cylinder 20, and air suction and exhaust are met.
It is worth noting that: the first limiting opening 13 and the first limiting strip 15 formed in the bidirectional threaded rod 7 and the second limiting opening 22 and the second limiting strip 24 formed in the moving rod 21 have the effects that the linkage gear 23 and the adjusting gear 14 can move on the moving rod 21 and the bidirectional threaded rod 7 respectively, and the moving range of the L-shaped plate 3 is convenient to improve.
It should also be noted that: in order to facilitate the adjustment of the moving range of the two L-shaped plates 3, the outer end of the moving rod 21 is flush with the outer end of the bidirectional threaded rod 7.
In addition, it should be noted that: the type Y80M1-2 is preferably selected as the driving motor 18, the motor operation circuit is a normal motor forward and reverse rotation control program, the circuit operation is a conventional circuit, the circuits and control related in the scheme are the prior art, and too much description is not repeated herein.
Referring to fig. 7 and 8, the sealing member 6 shown in the figure includes sliding rods 30 fixed on the inner walls of the two sides of the mounting opening 5, the outer ends of the sliding rods 30 on the two sides are fixed with baffle plates 31, and the outer sides of the sliding rods 30 are sleeved with pushing springs 32 for pushing the baffle plates 31 to move outwards;
it should be noted that: the pushing of the baffle 31 by the pushing spring 32 realizes the sealing of the mounting port 5, so that the mounting port 5 in which the sealing plate 10 is not inserted does not leak gas.
Simultaneously, in order to improve sealed effect, design filler strip 2 and closing plate 10 all adopt the rubber material to make, and closing plate 10 both ends are passed through the screw and are connected with filler strip 2.
The principle of reducing nitrogen waste when bonding operation is carried out on a chip on a lead frame; firstly, a person needs to fill nitrogen in the recycling cylinder 20, then the piston plate 27 is positioned at one end far away from the multi-way pipe 28, then the driving motor 18 rotates to drive the adjusting gear 14 to rotate, so as to rotate the two-way threaded rods 7, thereby controlling the two L-shaped plates 3 to synchronously move outwards, after the piston plate moves to a position meeting the placement of a lead frame, the lead frame is placed on the gasket 2, the lead frame is limited through the limiting device, then the chip is placed on the lead frame, the person performs bonding operation on the chip through the bonding device, during the bonding, the nitrogen supply device performs air injection through the air injection mechanism 11 to realize anti-oxidation operation, then after the re-bonding is completed, the driving motor 18 rotates reversely to enable the two L-shaped plates 3 to move inwards, at the moment, the piston plate 27 in the recycling cylinder 20 moves backwards to perform negative pressure air extraction, and the nitrogen around the previous lead frame is pumped in, retrieve, reduce extravagantly, when carrying out the bonding operation next time, can discharge the nitrogen gas of suction, the availability factor of very big improvement nitrogen gas reduces extravagantly.
It is worth noting that: when personnel were through installing in the filler strip 2 of difference to closing plate 10, the outside removal of two L templates 3 of rethread to can satisfy putting to unidimensional lead frame, simultaneously, when closing plate 10 position control, need plug up through the stopper with the gas vent 29 in two closing plate 10 outsides.
In addition, it should be noted that: the type Y80M2-2 is preferably selected as the jet motor 35, the motor operation circuit is a normal motor forward and reverse rotation control program, the circuit operation is the conventional circuit, the circuits and the control related to the scheme are the prior art, and too much description is not repeated herein.
Example 2
Referring to fig. 9 and 10, in this embodiment, as further described in embodiment 1, the illustrated air injection mechanism 11 includes an air injection pipe 33 fixed in an L-shaped plate 3, a tail end of the air injection pipe 33 is fixed at the bottom of the L-shaped plate 3 through a support plate, a rotating shaft 34 is rotatably inserted in the air injection pipe 33, an air injection motor 35 is fixed at an outer side of the support plate through a motor bracket, an output end of the air injection motor 35 is fixed at an outer end of the rotating shaft 34 through a coupler, a wind wheel 36 is fixed at an outer side of the rotating shaft 34 at an end of the air injection pipe 33, an air distribution head 37 is installed in the air injection pipe 33, and an air delivery pipe 38 is communicated with an outer side of the air injection pipe 33 and is butted with an external air supply device through the air delivery pipe 38.
It should be noted that: the air supply equipment that docks through the external world provides inert gas such as nitrogen gas, then 36 rotation negative pressure of rethread wind wheel discharge to can spout through minute gas head 37, realize the provision to bonding region nitrogen gas, jet-propelled mechanism 11 individual design through a plurality of nitrogen gases makes jet-propelled mutual interference can not appear.
Example 3
Referring to fig. 9 and 10, the present embodiment further illustrates other embodiments, in which the gas distributing head 37 includes a fast nozzle 39, the fast nozzle 39 is located in the gas spraying pipe 33, the outer end of the rotating shaft 34 is fixed to the inner wall of one end of the fast nozzle 39 through a connecting frame, a rotating sleeve 40 is sleeved between the inner side of the gas spraying pipe 33 and the outer side of the fast nozzle 39, one end of the rotating sleeve 40 is fixed to the outer side of the rotating shaft 34 through the connecting frame, and a porous sleeve 41 is installed in the other end.
It should be noted that: through the fast nozzle 39 of design and the interact of rotating sleeve 40, make the nitrogen gas through fast nozzle 39 can spout at a high speed, act on chip department fast, make during the bonding, play good anti oxidation effect, and simultaneously, when rotating the nitrogen gas blowout in the sleeve 40, because porous cover 41's effect, speed is slower during the blowout, and can be along with porous cover 41's rotation simultaneously, select the blowout, thereby when having guaranteed high-speed spun nitrogen gas outside negative pressure, only inhale outer porous cover 41 exhaust nitrogen gas, can not inhale the outside air, improve the concentration of bonding region nitrogen gas.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Semiconductor triode lead wire support oxidation protection device includes:
the device comprises a processing platform (1), wherein a plurality of filler strips (2) are fixed on the processing platform (1) at equal intervals;
it is characterized by also comprising:
the two L-shaped plates (3) are inserted into the plurality of the filler strips (2) in a sliding mode, the directions of the two L-shaped plates (3) are opposite, insertion holes (4) are formed in the two L-shaped plates (3) at equal intervals, mounting holes (5) are formed in the positions, corresponding to the insertion holes (4), of the L-shaped plates (3), sealing parts (6) are mounted in the mounting holes (5), two bidirectional threaded rods (7) are inserted between the two L-shaped plates (3) in a threaded mode, driving mechanisms (8) are mounted at the outer ends of the two bidirectional threaded rods (7), the two ends of the two bidirectional threaded rods (7) are mounted at the two ends of the processing platform (1) through connecting frames, and recovery mechanisms (9) used for nitrogen recovery and supply are mounted at the bottom of the processing platform (1);
sealing plates (10) are arranged on the two backing strips (2), and the two sealing plates (10) respectively penetrate through the two mounting openings (5) in a sliding manner;
a plurality of gas injection mechanisms (11) are equidistantly arranged on the L-shaped plate (3), and the gas injection mechanisms (11) are used for injecting gas to the bonding area.
2. The semiconductor triode lead support oxidation protection device of claim 1, wherein: the driving mechanism (8) comprises a mounting plate (12) which is sleeved outside the two bidirectional threaded rods (7) in a sliding manner, the outer sides of the two bidirectional threaded rods (7) are respectively provided with a first limiting opening (13), and both ends of the mounting plate (12) are rotatably provided with adjusting gears (14) sleeved at the outer ends of the two-way threaded rods (7), the inner sides of the two adjusting gears (14) are fixed with first limiting strips (15) which are in sliding insertion with the first limiting openings (13), and a first toothed belt (16) is meshed and sleeved outside the two adjusting gears (14), the mounting plate (12) is mounted with the outer end of the processing platform (1) through an inserted bar, connecting plates (17) are fixed at the bottoms of the two ends of the mounting plate (12), a driving motor (18) is fixed in the mounting plate (12) through a motor frame, and a driving gear (19) meshed with the adjusting gear (14) is fixed at the output end of the driving motor (18) through a coupler.
3. The semiconductor triode lead support oxidation protection device of claim 2, wherein: the recycling mechanism (9) comprises two recycling barrels (20) fixed at the bottom of the processing platform (1) through a support, moving rods (21) are installed in the two recycling barrels (20) in a rotating mode, the outer ends of the moving rods (21) are connected with a connecting plate (17) in a sliding mode in an inserting mode, the outer sides of the moving rods (21) correspond to the position of the connecting plate (17) and are provided with two limiting openings (22), linkage gears (23) are sleeved on the outer sides of the moving rods (21), two limiting strips (24) connected with the two limiting openings (22) in a sliding mode are fixed on the inner sides of the linkage gears (23), the linkage gears (23) are connected with the outer sides of the adjusting gears (14) in a transmission mode through two toothed belts (25), track strips (26) are fixed in the recycling barrels (20), and piston plates (27) connected with the track strips (26) in a sliding mode are sleeved on the outer sides of the moving rods (21) in a threaded mode, the outer end of the recovery cylinder (20) is communicated with a plurality of multi-way pipes (28), the processing platform (1) is provided with a plurality of exhaust ports (29), and the outer ends of the multi-way pipes (28) are communicated with the exhaust ports (29) in sequence.
4. The semiconductor triode lead support oxidation protection device of claim 1, wherein: sealing member (6) are including fixing slide bar (30) of installing port (5) both sides inner wall, both sides slide bar (30) outer end all be fixed with baffle (31), and slide bar (30) outside all overlaps and has propelling movement spring (32) that are used for propelling movement baffle (31) outside.
5. The semiconductor triode lead support oxidation protection device of claim 1, wherein: jet-propelled mechanism (11) is including fixing jet-propelled pipe (33) in L template (3), jet-propelled pipe (33) tail end is fixed through the backup pad L template (3) bottom, just jet-propelled pipe (33) internal rotation has been inserted pivot (34), and the backup pad outside is fixed with jet-propelled motor (35) through the motor frame, just jet-propelled motor (35) output pass through the shaft coupling with pivot (34) outer end is fixed, pivot (34) are located jet-propelled pipe (33) end outside is fixed with wind wheel (36), just install branch gas head (37) in jet-propelled pipe (33), jet-propelled pipe (33) outside intercommunication has gas-supply pipe (38), and passes through gas-supply pipe (38) and external air feeder butt joint.
6. The device of claim 5, wherein: divide gas head (37) to include quick nozzle (39), quick nozzle (39) are located in jet-propelled pipe (33), just pivot (34) outer end pass through the link with quick nozzle (39) one end inner wall is fixed, jet-propelled pipe (33) inboard with the cover has between the quick nozzle (39) outside and rotates cover (40), just rotate cover (40) one end pass through the link with the pivot (34) outside is fixed, installs porous cover (41) in the other end.
7. The semiconductor triode lead support oxidation protection device of claim 1, wherein: the filler strip (2) with the closing plate (10) all adopt the rubber material to make, just closing plate (10) both ends pass through the screw with filler strip (2) are connected.
8. The device of claim 3, wherein the device further comprises: the outer end of the movable rod (21) is flush with the outer end of the bidirectional threaded rod (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210051883.3A CN114373704B (en) | 2022-01-17 | 2022-01-17 | Semiconductor triode lead wire support oxidation protection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210051883.3A CN114373704B (en) | 2022-01-17 | 2022-01-17 | Semiconductor triode lead wire support oxidation protection device |
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| CN114373704A CN114373704A (en) | 2022-04-19 |
| CN114373704B true CN114373704B (en) | 2022-07-05 |
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| CN202210051883.3A Active CN114373704B (en) | 2022-01-17 | 2022-01-17 | Semiconductor triode lead wire support oxidation protection device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3628717A (en) * | 1969-11-12 | 1971-12-21 | Ibm | Apparatus for positioning and bonding |
| CN1510727A (en) * | 2002-12-17 | 2004-07-07 | 先进科技新加坡有限公司 | Conduit for preventing electronic device |
| CN1649085A (en) * | 2004-01-22 | 2005-08-03 | 先进科技新加坡有限公司 | System for reducing oxidation of electronic devices |
| CN101996903A (en) * | 2009-08-13 | 2011-03-30 | 株式会社华祥 | Wire bonding apparatus |
-
2022
- 2022-01-17 CN CN202210051883.3A patent/CN114373704B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3628717A (en) * | 1969-11-12 | 1971-12-21 | Ibm | Apparatus for positioning and bonding |
| CN1510727A (en) * | 2002-12-17 | 2004-07-07 | 先进科技新加坡有限公司 | Conduit for preventing electronic device |
| CN1649085A (en) * | 2004-01-22 | 2005-08-03 | 先进科技新加坡有限公司 | System for reducing oxidation of electronic devices |
| CN101996903A (en) * | 2009-08-13 | 2011-03-30 | 株式会社华祥 | Wire bonding apparatus |
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| Publication number | Publication date |
|---|---|
| CN114373704A (en) | 2022-04-19 |
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