CN114373409A - Testing method of display module, display module and manufacturing method of display panel - Google Patents

Testing method of display module, display module and manufacturing method of display panel Download PDF

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Publication number
CN114373409A
CN114373409A CN202011103232.1A CN202011103232A CN114373409A CN 114373409 A CN114373409 A CN 114373409A CN 202011103232 A CN202011103232 A CN 202011103232A CN 114373409 A CN114373409 A CN 114373409A
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China
Prior art keywords
test
circuit
display module
functional
substrate
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Pending
Application number
CN202011103232.1A
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Chinese (zh)
Inventor
赵约瑟
颜金成
王凯
王士敏
朱泽力
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Shenzhen Laibao Hi Tech Co Ltd
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Shenzhen Laibao Hi Tech Co Ltd
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Application filed by Shenzhen Laibao Hi Tech Co Ltd filed Critical Shenzhen Laibao Hi Tech Co Ltd
Priority to CN202011103232.1A priority Critical patent/CN114373409A/en
Publication of CN114373409A publication Critical patent/CN114373409A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/54—Testing for continuity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/58—Testing of lines, cables or conductors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention relates to the technical field of display defect testing, and discloses a testing method of a display module, the display module and a manufacturing method of a display panel, which aim to solve the technical problem that a large amount of matching materials are wasted in manufacturing defective products in the related technology. The test method of the display module comprises the following steps: providing a substrate; manufacturing a functional circuit and a test circuit on the substrate, wherein the functional circuit is electrically connected with the test circuit, and the free end of the test circuit forms a wiring terminal which is distributed in the edge area of the substrate; and detecting whether the functional line is defective or not through the test line. The invention can be used for defect testing of display products.

Description

Testing method of display module, display module and manufacturing method of display panel
Technical Field
The invention relates to the technical field of display defect testing, in particular to a testing method of a display module, the display module and a manufacturing method of a display panel.
Background
With the maturity of Display technology, various types of Display panels, such as Liquid Crystal Displays (LCDs), Organic Light-Emitting diodes (OLEDs), etc., appear, and the product fineness is higher and finer, and the internal circuits are finer and finer. In order to ensure the product performance, the display product needs to detect whether the internal circuit of the product has defects before leaving the factory.
Currently, most display products are tested by powering on to display to determine whether the internal circuit is defective or not after the display products are finished. However, although this detection method can accurately determine whether the display product has defects, the defect product is already manufactured, which results in a great waste of manpower and material resources. Therefore, how to detect the defects of the internal circuit in time and avoid the loss and later investment of the matching materials becomes a problem to be solved urgently.
Disclosure of Invention
The invention aims to provide a test method of a display module, the display module and a manufacturing method of a display panel, and the display module with defects detected in time, so as to avoid the loss of matching materials caused by the subsequent manufacturing of display products.
In a first aspect, an embodiment of the present invention provides a method for testing a display module, including:
providing a substrate;
manufacturing a functional circuit and a test circuit on the substrate, wherein the functional circuit is electrically connected with the test circuit, and the free end of the test circuit forms a wiring terminal which is distributed in the edge area of the substrate;
and detecting whether the functional line is defective or not through the test line.
Further, the step of fabricating functional lines and test lines on the substrate includes:
depositing a conductive film layer on the substrate;
and patterning the conductive film layer to form the electrically connected functional circuit and the electrically connected test circuit.
Further, after the electrically connecting the functional line and the test line is formed, the method further includes:
manufacturing an insulating layer above the functional circuit and the test circuit;
and manufacturing a through hole on the insulating layer, wherein the through hole exposes out of the wiring terminal.
Further, the step of fabricating functional lines and test lines on the substrate includes:
manufacturing a test circuit on the substrate;
manufacturing an insulating layer above the test circuit, and manufacturing a via hole on the insulating layer;
and manufacturing a functional circuit above the insulating layer, wherein the test circuit is electrically connected with the functional circuit through the via hole.
Further, detecting whether the functional line is defective by the test line includes:
electrically connecting the wiring terminal with a test instrument;
starting the test instrument for detection, and obtaining a test signal;
and judging whether the functional circuit has defects according to the test signal.
Further, electrically connecting the connection terminal with the test instrument includes:
one end of the electric connecting piece is pressed and contacted on the wiring terminal, and the other end of the electric connecting piece is connected into the testing instrument;
the electric connecting piece is a flexible circuit board or a metal probe.
According to the testing method of the display module, the electrically connected functional circuit and the testing circuit are formed on the substrate, and the defect detection is carried out after the circuits are formed, so that the display module with the defect can be detected in time through simple testing at the early stage of product manufacturing, the loss of matched materials in the subsequent production process is effectively avoided, and the waste of manpower and material resources at the later stage is reduced.
In a second aspect, an embodiment of the present invention provides a display module, which includes a substrate, a functional circuit and a test circuit, where the functional circuit and the test circuit are located on the substrate, the test circuit is electrically connected to the functional circuit and is used to transmit test information to the functional circuit, and a connection terminal is further formed at a free end of the test circuit and located in an edge region of the substrate.
Furthermore, the functional circuit and the test circuit are distributed on the same layer, an insulating layer is formed on the functional circuit and the test circuit, a through hole is formed in the insulating layer, and the through hole is exposed out of the wiring terminal.
According to the display module provided by the embodiment of the invention, the substrate of the display module is provided with the electrically connected functional circuit and the electrically connected test circuit, and the test circuit is used for providing test information for the functional circuit, so that when the circuit is formed on the display module, a defect test can be carried out, and detection does not need to be carried out after all components are assembled. The display module adopting the structural design is convenient for carrying out defect detection in the early stage of product manufacturing, reduces the productivity of defective products, and can effectively reduce the loss of matched materials in the production process.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including:
obtaining the display module according to the second aspect;
testing whether the display module has defects;
if the defect is not existed, removing the edge area of the substrate;
and preparing a display panel by using the display module.
According to the manufacturing method of the display panel, provided by the embodiment of the invention, the defect detection is carried out on the display module before the display module is used for preparing the display panel, and the subsequent processing is carried out after the defect of the display module is confirmed, so that the problem that the display panel cannot be used due to the defect of the display module can be effectively avoided, the shipment yield of the display panel is ensured, and the market competitiveness of the display panel is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a method for testing a display module according to an embodiment of the present invention;
FIG. 2 is a second flowchart of a method for testing a display module according to an embodiment of the present invention;
FIG. 3 is a third flowchart of a testing method for a display module according to an embodiment of the present invention;
FIG. 4 is a fourth flowchart of a testing method for a display module according to an embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention;
fig. 6 is a schematic structural diagram of a display module according to an embodiment of the present invention;
FIG. 7 is an enlarged view of a portion of the area A in FIG. 6;
fig. 8 is a partially enlarged view of an area B shown in fig. 6.
The designations in the figures mean:
10. a display module; 20. a substrate; 30. a functional circuit; 40. testing the circuit; 50. and a terminal.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the patent. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
In a first aspect, as shown in fig. 1 and fig. 6, an embodiment of the present invention provides a method for testing a display module 10, including:
s100: a substrate 20 is provided.
S200: the functional circuit 30 and the test circuit 40 are fabricated on the substrate 20, the functional circuit 30 is electrically connected to the test circuit 40, the free end of the test circuit 40 forms a connection terminal 50, and the connection terminal 50 is distributed in the edge region of the substrate 20.
The connection terminal 50 is used to amplify the test line 40 so that it can be easily connected to a test instrument.
S300: the functional circuit 30 is detected as defective by the test circuit 40.
The test method provided by the embodiment comprises the steps of forming the electrically connected functional circuit 30 and the test circuit 40 on the substrate 20, detecting the defects after the circuits are formed, and detecting the display module 10 with the defects in time through simple tests in the early stage of product manufacturing, so that the loss of matched materials in the subsequent production process is effectively avoided, and the waste of later-stage manpower and material resources is reduced.
Meanwhile, as shown in fig. 6 and 7, by forming the connection terminal 50 at the free end of the test line 40, the connection capacity of the test line 40 can be effectively increased, so that the connection of the test line 40 is more convenient. In addition, the wiring terminals 50 are disposed at the edge region of the substrate 20, so that the functional lines 30 and the testing lines 40 in the display region (i.e., the region where the functional lines 30 are located) can be prevented from being affected, thereby ensuring that the defect testing of the display module 10 is not affected and ensuring that the display module 10 without defects can be normally used after the detection is completed.
Among them, the method of forming the functional wiring 30 and the test wiring 40 on the substrate 20 is not exclusive.
For example, in some embodiments, as shown in fig. 2 and 6, step S200 may include:
s211: a conductive film layer (not shown) is deposited on the substrate 20.
S212: the conductive film layer is patterned to form electrically connected functional lines 30 and test lines 40.
It should be noted that the type of the deposited conductive film layer is not unique, and according to actual needs, a deposited metal layer or other materials with a conductive function, such as metal alloy, conductive compound (ITO, ZnO, etc.), graphene, organic conductive material, superconducting material, etc., may be selected specifically according to actual situations, and is not limited herein.
In the above embodiment, the functional circuit 30 and the testing circuit 40 are designed in the same layer, and this structure has fewer layers and is easy to manufacture.
Further, in order to avoid mutual interference between the functional line 30 and the test line 40, as shown in fig. 2 and fig. 6, in the above embodiment, after the step S212, the method further includes:
s213: an insulating layer (not shown) is formed over the functional lines 30 and the test lines 40.
Specifically, the insulating layer can be formed by coating film lithography, screen printing, etc., and the material of the insulating layer includes OC photoresist and SIO2、SINx、SIONxAt least one of (1).
S214: through holes (not shown) are formed in the insulating layer, and the through holes expose a portion of the terminals 50.
The exposed connecting terminals 50 are used for connecting with external devices to perform defect testing on the display module 10.
Alternatively, in another embodiment, as shown in fig. 3 and fig. 6, step S200 may further include:
s221: test lines 40 are fabricated on the substrate 20.
S222: an insulating layer is formed over the test line 40 and a via (not shown) is formed over the insulating layer.
S223: the functional circuit 30 is formed on the insulating layer, and the test circuit 40 is electrically connected to the functional circuit 30 through the via hole.
In the above embodiments, the functional circuit 30 and the test circuit 40 are designed vertically, so that the integration density of the structure is high, and the mutual interference between the functional circuit 30 and the test circuit 40 can be effectively avoided.
In one embodiment of the present invention, as shown in fig. 4 and 6, step S300 includes:
s310: the terminals 50 are electrically connected to the test instrument.
S320: and starting a test instrument for detection, and obtaining a test signal.
S330: it is determined whether the functional line 30 is defective or not based on the test signal.
Wherein, different test instruments are utilized to obtain different types of test signals.
For example, it is possible to determine whether the functional wiring 30 has a defect by using a multimeter and by a resistance value. Specifically, the wiring terminal 50 on the test circuit 40 is connected to a multimeter, so that the functional circuit 30, the test circuit 40 and the multimeter form a loop, at the moment, data information displayed on the multimeter is a test signal, when a display number is close to 0, the circuit is communicated, and the display module 10 has no defect; when the display number is 1, it indicates that the line is interrupted, and the display module 10 has a defect.
Alternatively, whether or not the functional line 30 has a defect can be judged by the energization condition. Specifically, an external power supply is connected to the test line 40, so that the external power supply, the functional line 30 and the test line 40 form a loop, and an indicator lamp capable of being normally used is arranged on the loop, and at this time, the light emitting condition of the indicator lamp is a test signal. After the power supply is started, if the indicator lamp can normally emit light, the circuit is proved to be connected, and the display module 10 has no defects; if the indicator light cannot emit light normally, the circuit is interrupted, and the display module 10 has defects.
Further, in order to facilitate connection of the test line 40 to the test instrument, step S310 includes:
one end of the electrical connector is pressed onto the terminal 50 and the other end is connected to the test instrument. The electrical connector can be a flexible circuit board or a metal probe.
In a second aspect, as shown in fig. 6 to 8, an embodiment of the invention provides a display module 10, which includes a substrate 20, a functional circuit 30 and a test circuit 40, where the functional circuit 30 is located on the substrate 20, the test circuit 40 is electrically connected to the functional circuit 30 for transmitting test information to the functional circuit 30, a connection terminal 50 is further formed at a free end of the test circuit 40, and the connection terminal 50 is located at an edge region of the substrate 20.
In the display module 10 provided by the embodiment of the invention, the substrate 20 of the display module 10 is provided with the electrically connected functional circuit 30 and the test circuit 40, and the test circuit 40 is used for providing test information for the functional circuit 30, so that when a circuit is formed on the display module 10, a defect test can be performed without performing detection after all components are assembled. The display module 10 adopting the structural design is convenient for defect detection in the early stage (namely after a circuit is formed), and reduces the productivity of defective products, thereby effectively reducing the loss of matched materials in the production process.
Meanwhile, as shown in fig. 6, the connection terminals 50 are further formed at the free ends of the test lines 40, and the connection terminals 50 are located at the edge region of the substrate 20, as shown in fig. 7, the connection terminals 50 are further connected with the plurality of groups of test lines 40 in a one-to-one correspondence manner, so that when the defect detection needs to be performed on the display module 10, a test instrument can be directly connected with the connection terminals 50. Since the connection terminal 50 can effectively increase the connection capacity of the test line 40, it is more convenient to connect using the connection terminal 50. In addition, the wiring terminal 50 is located at the edge region of the substrate 20, so that interference of the wiring terminal on the functional circuit 30 and the test circuit 40 during use can be effectively reduced, and the wiring terminal can be conveniently cut off after detection is completed.
Here, when the test circuit 40 and the functional circuit 30 are formed on the substrate 20, the structure of the display module 10 is not unique.
For example, in some embodiments, the functional lines 30 and the test lines 40 may be distributed vertically, an insulating layer is formed between the functional lines 30 and the test lines 40, and vias are formed on the insulating layer to electrically connect the functional lines 30 and the test lines 40. The functional circuit 30 and the test circuit 40 are designed to be distributed vertically, so that the integration level is high, and the mutual interference between the functional circuit 30 and the test circuit 40 is small.
Alternatively, in some embodiments, as shown in fig. 6, the functional circuit 30 and the test circuit 40 may also be distributed in the same layer, an insulating layer is formed on the functional circuit 30 and the test circuit 40, and a through hole is formed on the insulating layer and exposes the connection terminal 50. The functional circuit 30 and the test circuit 40 are designed to be distributed on the same layer, so that the design and the manufacture are simple, and the subsequent division is convenient. In this embodiment, after the insulating layer is formed, the through hole of the insulating layer corresponds to the connection terminal 50, so that defect detection is performed through the connection terminal 50.
In a third aspect, as shown in fig. 5 and 6, an embodiment of the present invention provides a method for manufacturing a display panel, including:
s410: the display module 10 is obtained.
S420: the display module 10 is tested for defects.
S430: if there is no defect, the edge region of the substrate 20 is removed.
S440: the display panel is prepared using the display module 10.
When the edge area of the substrate 20 is removed, the test line 40 and the connection terminal 50 located on the edge of the substrate 20 are removed together.
The display panel may be an electrophoretic display panel, an LCD display panel, an OLED display panel, or the like.
According to the manufacturing method of the display panel provided by the embodiment of the invention, before the display panel is prepared by using the display module 10, the defect detection is carried out on the display module 10, and the subsequent processing is carried out after the defect of the display module 10 is confirmed, so that the problem that the display panel cannot be used due to the defect of the display module 10 can be effectively avoided, the shipment yield of the display panel is ensured, and the market competitiveness of the display panel is effectively improved. In addition, before carrying out follow-up processing, with the marginal area of display module assembly 10 and be located the circuit and the binding post 50 excision on the marginal area to keep the circuit in display area, under the prerequisite that guarantees that display module assembly 10 can normally be used, can also effectively promote the ratio in display area, optimize display panel's structure.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims (10)

1. A method for testing a display module is characterized by comprising the following steps:
providing a substrate;
manufacturing a functional circuit and a test circuit on the substrate, wherein the functional circuit is electrically connected with the test circuit, and the free end of the test circuit forms a wiring terminal which is distributed in the edge area of the substrate;
and detecting whether the functional line is defective or not through the test line.
2. The method for testing a display module according to claim 1, wherein the step of forming the functional circuit and the test circuit on the substrate comprises:
depositing a conductive film layer on the substrate;
and patterning the conductive film layer to form the electrically connected functional circuit and the electrically connected test circuit.
3. The method for testing a display module according to claim 2, wherein after the electrically connecting the functional circuit and the test circuit are formed, the method further comprises:
manufacturing an insulating layer above the functional circuit and the test circuit;
and manufacturing a through hole on the insulating layer, wherein the through hole exposes out of the wiring terminal.
4. The method for testing a display module according to claim 1, wherein the step of forming the functional circuit and the test circuit on the substrate comprises:
manufacturing a test circuit on the substrate;
manufacturing an insulating layer above the test circuit, and manufacturing a via hole on the insulating layer;
and manufacturing a functional circuit above the insulating layer, wherein the test circuit is electrically connected with the functional circuit through the via hole.
5. The method for testing a display module according to claim 1, wherein the step of detecting whether the functional circuit is defective or not through the test circuit comprises:
electrically connecting the wiring terminal with a test instrument;
starting the test instrument for detection, and obtaining a test signal;
and judging whether the functional circuit has defects according to the test signal.
6. The method for testing the display module according to claim 5, wherein electrically connecting the connection terminal with the testing instrument comprises:
one end of the electric connecting piece is pressed and contacted on the wiring terminal, and the other end of the electric connecting piece is connected into the testing instrument;
the electric connecting piece is a flexible circuit board or a metal probe.
7. The utility model provides a display module assembly, its characterized in that includes the base plate, is located functional circuit and test circuit on the base plate, the test circuit with functional circuit electric connection for to functional circuit transmission test information, the free end of test circuit still is formed with binding post, just binding post is located the border region of base plate.
8. The display module assembly according to claim 7, wherein the functional lines and the test lines are vertically distributed, an insulating layer is formed between the functional lines and the test lines, and vias are formed on the insulating layer to electrically connect the functional lines and the test lines.
9. The display module according to claim 7, wherein the functional circuit and the test circuit are distributed on the same layer, an insulating layer is formed on the functional circuit and the test circuit, and a through hole is formed in the insulating layer and exposes the connection terminal.
10. A method for manufacturing a display panel is characterized by comprising the following steps:
obtaining a display module according to any one of claims 7-9;
testing whether the display module has defects;
if the defect is not existed, removing the edge area of the substrate;
and preparing a display panel by using the display module.
CN202011103232.1A 2020-10-15 2020-10-15 Testing method of display module, display module and manufacturing method of display panel Pending CN114373409A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011103232.1A CN114373409A (en) 2020-10-15 2020-10-15 Testing method of display module, display module and manufacturing method of display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011103232.1A CN114373409A (en) 2020-10-15 2020-10-15 Testing method of display module, display module and manufacturing method of display panel

Publications (1)

Publication Number Publication Date
CN114373409A true CN114373409A (en) 2022-04-19

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060170447A1 (en) * 2005-02-02 2006-08-03 Seiko Epson Corporation Electronics device, optical panel, inspection probe, inspection device for the optical panel and inspection method for the optical panel
US20150144940A1 (en) * 2013-11-22 2015-05-28 Samsung Display Co., Ltd. Display panel and method of manufacturing the same
CN109841181A (en) * 2017-11-24 2019-06-04 上海和辉光电有限公司 Array substrate, display panel and display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060170447A1 (en) * 2005-02-02 2006-08-03 Seiko Epson Corporation Electronics device, optical panel, inspection probe, inspection device for the optical panel and inspection method for the optical panel
US20150144940A1 (en) * 2013-11-22 2015-05-28 Samsung Display Co., Ltd. Display panel and method of manufacturing the same
CN109841181A (en) * 2017-11-24 2019-06-04 上海和辉光电有限公司 Array substrate, display panel and display device

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Application publication date: 20220419