CN114370782A - Enhanced loop heat pipe heat transfer system adopting field installation process - Google Patents
Enhanced loop heat pipe heat transfer system adopting field installation process Download PDFInfo
- Publication number
- CN114370782A CN114370782A CN202111517170.3A CN202111517170A CN114370782A CN 114370782 A CN114370782 A CN 114370782A CN 202111517170 A CN202111517170 A CN 202111517170A CN 114370782 A CN114370782 A CN 114370782A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat transfer
- condenser
- capillary pump
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 43
- 238000011900 installation process Methods 0.000 title claims abstract description 10
- 238000005219 brazing Methods 0.000 claims abstract description 42
- 238000003466 welding Methods 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 11
- 238000005516 engineering process Methods 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims abstract description 4
- 230000008569 process Effects 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 abstract 1
- 239000000306 component Substances 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
Abstract
The invention discloses an enhanced loop heat pipe heat transfer system adopting a field installation process. The system is used for independently welding and installing heat transfer components through a brazing technology and then connecting the heat transfer components into a whole, so that the problem of limited heat transfer capacity caused by integral forming and unified installation of a loop heat pipe system is solved, the limitation of limited contact area of the loop heat pipe is eliminated, and the heat transfer capacity of the system is improved. The heat collecting component is arranged on a heating surface and used for collecting heat dispersed on the heat radiating surface; the capillary pump cloth is used for driving the operation of the loop heat pipe system and is fixed at the heat collecting end in a low-temperature brazing mode; the condenser is a heat dissipation part and is fixed on a heat dissipation surface by high-temperature brazing; the pipeline is used for connecting the capillary pump and the condenser to form a closed loop; the working medium is used for realizing the heat transfer, and an indirect charging method is adopted during the assembly.
Description
Technical Field
The invention belongs to the technical field of thermal control design of spacecrafts, and particularly relates to an enhanced loop heat pipe heat transfer system adopting a field installation process.
Technical Field
The development of the aerospace technology has higher and higher equipment integration level, and the heat consumption of the equipment is from 10W to hundreds of W, so that the heat dissipation of the equipment is difficult. Especially, heat dissipation of a plurality of distributed high-power devices becomes a constraint factor of configuration layout.
In the configuration layout of the spacecraft, the equipment layout is compact under general conditions, the high-power heating equipment is far away from the effective radiating surface, and the high-power heating equipment are positioned on different directions of the spacecraft, so that the long-distance heat transmission characteristic on a three-dimensional space path is presented. Conventional heat transfer systems, such as externally attached heat pipes, heat conducting cables and the like, have high rigidity and short transmission distance, are widely applied to short-distance heat transmission on a planar path, are difficult to directly and effectively thermally connect heating equipment and a radiating surface into a whole, and are difficult to realize layout. The loop heat pipe is flexible in layout, the heat transfer path is as long as dozens of meters, and the heat transfer capacity of the loop heat pipe is high. In the specific application, the loop heat pipe system is uniformly installed in the spacecraft in a screw mode after the capillary pump, the condenser, the pipeline and the working medium are integrated. However, because the installation area of the capillary pump is limited, the heat exchange coefficient of the interface between the capillary pump and the heating equipment is 1000W/(m)2K) magnitude, large interface temperature difference and poor heat transfer effect, and a plurality of loop heat pipes are required to be configured for heat transfer. Soldering technique, in order of magnitudeThe heat exchange coefficient between the mounting surfaces is improved, and high heat transfer in a small area can be realized. However, the dimensions of the loop heat pipe system are large, and the enduring temperatures of the various components are not uniform, so that brazing cannot be used on the loop heat pipe system as a whole. Therefore, it is necessary to research an enhanced heat transfer system of a brazing-based loop heat pipe, and a single set of system can realize the heat transfer capability of a plurality of sets of traditional loop heat pipes.
Disclosure of Invention
In view of the above, the present invention provides an enhanced loop heat pipe heat transfer system that employs a field installation process. The system is used for independently welding and installing heat transfer components through a brazing technology and then connecting the heat transfer components into a whole, so that the problem of limited heat transfer capacity caused by integral forming and unified installation of a loop heat pipe system is solved, the limitation of limited contact area of the loop heat pipe is eliminated, and the heat transfer capacity of the system is improved. The specific technical scheme is as follows:
the invention comprises five parts assembled on site, namely a heat collecting part, a capillary pump, a condenser, a pipeline and a working medium. The specific functions of the individual components are as follows:
comprises five parts, namely a heat collecting part, a capillary pump, a condenser, a pipeline and a working medium, wherein,
the heat collecting component is arranged on a heating surface and is used for collecting the heat dispersed by the heat radiating surface and collecting the heat at a heat collecting end;
the capillary pump is arranged at the heat collecting end and used for driving the operation of the loop heat pipe system through the internal capillary force, and the capillary pump is fixed at the heat collecting end in a brazing mode;
further, bismuth-based brazing filler metal is adopted, and rosin soldering flux is selected;
further, the brazing specific process is as follows:
a) performing surface treatment on a welding surface of the capillary pump and the collecting end of the heat pipe, and performing nickel plating and silver plating procedures to form a welded substrate;
b) coating brazing filler metal on the welding substrate of the capillary pump and the heat collecting end;
c) the capillary pump and the heat collecting end are used for mounting the welding surfaces together and pressurizing to form a welding body;
d) putting the whole welded body into a heating furnace which is higher than the melting point of the brazing filler metal and lower than 100 ℃, keeping for 6 hours, then closing the furnace temperature, and naturally cooling;
e) the appearance and the size of the welded body are checked, and the brazing rate of the welded body is checked by X-ray.
The condenser is a heat dissipation part and is used for dissipating heat and fixed on a heat dissipation surface in a brazing mode;
furthermore, the solder is tin-lead solder and rosin soldering flux.
Further, the brazing specific process is as follows:
a) performing surface treatment on the welding surface of the condenser and the radiating surface, and performing a nickel plating process to form a welded substrate;
b) coating tin-lead solder on the welding substrate of the condenser and the radiating surface;
c) the condenser and the radiating surface are used for mounting the welding surfaces together and pressurizing to form a welding body;
d) placing the welding body in a heating furnace at 220 ℃, keeping the temperature for 6 hours, then closing the furnace temperature, and naturally cooling;
e) the appearance and the size of the welded body are checked, and the brazing rate of the welded body is checked by X-ray.
The pipeline is used as a connecting part and is used for connecting the capillary pump and the condenser to form a closed loop, and the inside of the closed loop bears working media;
the working medium is a heat transmission carrier, and heat transfer is realized through phase change conversion of the working medium between a gas state and a liquid state.
Because the filling platform size is big, can't carry to the scene, conventional direct filling method can't be implemented, so need adopt mobilizable filling jar, with indirect filling method:
further, working medium filling is carried out at a pipeline filling port of the capillary pump, and the actual working medium filling amount in the pipeline is obtained by measuring the weight of the filling tank twice.
Advantageous effects
By adopting a brazing process, the heat exchange coefficient of the interfaces between the capillary pump and the heat pipe and between the condenser and the heat pipe is from 1000W/(m)2K) to 10000W/(m)2K), the heat dissipation performance of the heat transfer system is greatly improved, the sizes and the use number of contact surfaces of the capillary pump and the condenser are effectively reduced, and the weight reduction effect is obvious. The heat transfer performance of the single set of system can reach 300W, and is equal to the performance of 3 sets of traditional screw mounting modes.
Drawings
FIG. 1 is a diagram of an enhanced heat transfer system based on a loop heat pipe
FIG. 2 is a schematic view of a capillary pump weld assembly;
FIG. 3 is a schematic view of a condenser weld assembly;
FIG. 4 is a schematic fill view;
FIG. 5 is a flow chart of a capillary pump brazing process;
FIG. 6 is a flow chart of a working medium charging process.
Detailed Description
The invention is described in detail below, by way of example, with reference to the accompanying drawings.
The enhanced system based on the loop heat pipe comprises a heat collecting part, a capillary pump, a condenser, a pipeline and a working medium, and is shown in figure 1.
1) A heat collecting member: the scattered heat is collected by a common heat transfer tool such as a heat pipe and collected at a certain position (a heat collecting end);
2) a capillary pump: the core component of the heat transfer system drives the operation of the whole heat transfer system through internal capillary force and is generally arranged in a high-temperature area;
3) a condenser: the heat dissipation part of the heat transfer system, the heat of which is dissipated through the condenser, is generally arranged in a low-temperature area;
4) pipeline: as a connecting part, the capillary pump is connected with the condenser to form a closed loop, and the inside of the closed loop bears working media. Selecting a stainless steel pipe with the diameter phi of 3-5 mm according to the charging amount of the working medium;
5) working medium: the heat transmission carrier of the heat transfer system realizes heat transfer through phase change conversion of the working medium between gas state and liquid state, can be selected according to the using temperature range and pressure, and can select ammonia gas generally within the range of-10 to 50 ℃ commonly used by spacecrafts.
The invention adopts a brazing process, and realizes solid connection between two welding surfaces through high-temperature melting. The method can be divided into low-temperature zone brazing filler metal (80 ℃) and high-temperature zone brazing filler metal (220 ℃) according to the welding temperature;
the three heating devices are arranged on a cabin plate A on the + X side of the spacecraft, the radiating surface is arranged on a cabin plate B on the-X side of the spacecraft, a heat transfer system is needed to transfer the heat of the heating devices from the + X side to the-X side of the spacecraft, and the transmission distance is 6 m.
The device is used for radiating heat of heating equipment, the device is required to be arranged on a plate A and a plate B on site, and then the heating equipment is arranged on a + X side cabin plate A of a spacecraft, and the specific implementation is as follows:
1) the heat collecting component adopts orthogonal heat pipes, 2X heat pipes and 2Z heat pipes are pre-embedded in the honeycomb panel (panel A) and used for leveling the temperature difference of equipment on the honeycomb panel and realizing heat collection; in a particular heat pipe arrangement, the X-direction heat pipe needs to traverse the mounting surface area of the heat generating equipment, and the other side is in contact with the Z-direction heat pipe.
2) When the plate A is produced, the heat collecting end needs to be exposed; the capillary pump and the heat collection end are welded by adopting a brazing process (namely the capillary pump is welded with the plate A), and because the use safety of a product is limited, the brazing filler metal is a bismuth-based brazing filler metal (Sn-Pb-Bi-Cd), the brazing filler metal is a low-melting-point alloy brazing filler metal, the melting point of the brazing filler metal is 70 ℃, rosin scaling powder is selected, the welding temperature is 80 ℃, and the brazing rate is not lower than 80%; the specific welding process is as follows:
a) performing surface treatment on a welding surface of the capillary pump and the collecting end of the heat pipe, and performing nickel plating and silver plating procedures to form a welded substrate;
b) coating a bismuth-based brazing filler metal with the temperature of 80 ℃ on a welding substrate at a capillary pump and a heat collecting end, wherein the coating thickness is 0.1 mm;
c) the capillary pump and the heat collecting end are used for mounting the welding surfaces together and pressurizing in the form of screws and the like to form a welding body;
d) the capillary pump welding combination is integrally placed in a heating furnace at 80 ℃ and kept for 6 hours, and then the furnace temperature is closed and the heating furnace is naturally cooled;
e) the appearance and the size of the capillary pump welding assembly are checked, and the brazing rate of the capillary pump welding assembly is checked by X-ray.
The interface heat exchange coefficient is from 1000W/(m) by brazing2K) to 10000W/(m)2K), the contact area is greatly reduced, and the weight or the number of sets of the capillary pump can be further reduced;
3) the condenser and the heat dissipation plate (plate B) are brazed, according to the safety limit of products, the solder is tin-lead solder (Sn63-Pb37), the solder is tin-lead eutectic solder, the melting point of the solder is 183 ℃, rosin soldering flux is selected, the welding temperature is 220 ℃, and the brazing rate is not lower than 80%;
the specific welding process is as follows:
a) performing surface treatment on the welding surface of the condenser and the radiating surface, and performing a nickel plating process to form a welded substrate;
b) coating a tin-lead solder with the temperature of 220 ℃ on a welding substrate of the condenser and the radiating surface, wherein the coating thickness is 0.1 mm;
c) the condenser and the radiating surface are used for mounting the welding surfaces together and pressurizing in the form of screws and the like to form a welding body;
d) the condenser welding assembly is integrally placed in a heating furnace at 220 ℃, the temperature of the heating furnace is kept for 6 hours, and then the furnace temperature is closed to be naturally cooled;
e) the appearance and the size of the condenser welding assembly are checked, and the brazing rate of the condenser welding assembly is checked by X-ray.
The condenser is connected with the radiating surface by brazing, so that the interface heat exchange coefficient between the condenser and the radiating surface is improved, the length of the condenser can be reduced, and the weight or the number of the condenser can be further reduced;
4) connecting the capillary pump and the condenser into a loop by adopting a stainless steel pipe with the diameter phi of 3mm, wherein the outlet of the capillary pump is connected with the inlet of the condenser, and the outlet of the condenser is connected with the inlet of the capillary pump to finally form a closed loop;
5) according to the working temperature range of the heat transfer system, ammonia gas is selected as a working medium, a certain amount of working medium is filled in the loop, and the normal operation of the system in a high-temperature range and a low-temperature range is ensured.
The capillary pump and the condenser are respectively arranged on two deck boards with the span of 6m, the working medium filling needs to adopt an indirect filling method, and the specific filling process is as follows:
a) a filling port of the capillary pump is opened and is connected with an external filling pipeline system;
b) an external filling pipeline system is vacuumized by a vacuum pump, and air and impurities in the pipeline systems of the capillary pump and the condenser are completely pumped;
c) filling about 110g of high-purity ammonia working medium into a filling tank, weighing and recording the weight M of the whole filling tank1;
d) The filling tank is connected to an external filling pipeline system, and the working medium in the filling tank is filled into pipelines of the capillary pump and the condenser in a heating mode;
e) after the working medium is filled, the filling opening of the capillary pump is closed, the filling tank is removed, and the weight M of the filling tank is weighed again and recorded2;
f) The actual charging quantity of the working medium in the pipelines of the capillary pump and the condenser is M through the weight difference of the two charging tanks1-M2。
Claims (6)
1. An enhanced loop heat pipe heat transfer system adopting a field installation process is characterized in that: the system is characterized in that the components are individually welded and installed on site by a brazing technology and then are connected into a whole to finish heat transfer, the system comprises five parts which are assembled on site and are respectively a heat collecting component, a capillary pump, a condenser, a pipeline and a working medium, wherein,
the heat collecting component is arranged on the heating surface and used for collecting the heat dispersed by the heat radiating surface and collecting the heat at the heat collecting end;
the capillary pump is arranged at the heat collecting end and used for driving the operation of the loop heat pipe system through the internal capillary force, and the capillary pump is fixed at the heat collecting end in a brazing mode;
the condenser is a heat dissipation part and is used for dissipating heat and fixed on a heat dissipation surface in a brazing mode;
the pipeline is used as a connecting part and is used for connecting the capillary pump and the condenser to form a closed loop, and the inside of the closed loop bears working media;
the working medium is a heat transmission carrier, the heat transfer is realized through the phase change conversion of the working medium between gas state and liquid state, and the working medium is filled by adopting an indirect filling method on site.
2. An enhanced loop heat pipe heat transfer system using a field installation process as recited in claim 1 wherein: furthermore, the capillary pump welding solder adopts bismuth-based solder and selects rosin soldering flux.
3. An enhanced loop heat pipe heat transfer system using a field installation process as set forth in claim 2 wherein: further, the specific brazing process of the capillary pump comprises the following steps:
a) performing surface treatment on a welding surface of the capillary pump and the collecting end of the heat pipe, and performing nickel plating and silver plating procedures to form a welded substrate;
b) coating brazing filler metal on the welding substrate of the capillary pump and the heat collecting end;
c) the capillary pump and the heat collecting end are used for mounting the welding surfaces together and pressurizing to form a welding body;
d) putting the whole welded body into a heating furnace which is higher than the melting point of the brazing filler metal and lower than 100 ℃, keeping for 6 hours, then closing the furnace temperature, and naturally cooling;
e) the appearance and the size of the welded body are checked, and the brazing rate of the welded body is checked by X-ray.
4. An enhanced loop heat pipe heat transfer system using a field installation process as recited in claim 1 wherein: furthermore, tin-lead solder and rosin soldering flux are selected as the condenser soldering solder.
5. An enhanced loop heat pipe heat transfer system using field installation technology as claimed in claim 4 wherein: further, the condenser brazing specific process is as follows:
a) performing surface treatment on the welding surface of the condenser and the radiating surface, and performing a nickel plating process to form a welded substrate;
b) coating tin-lead solder on the welding substrate of the condenser and the radiating surface;
c) the condenser and the radiating surface are used for mounting the welding surfaces together and pressurizing to form a welding body;
d) placing the welding body in a heating furnace at 220 ℃, keeping the temperature for 6 hours, then closing the furnace temperature, and naturally cooling;
e) the appearance and the size of the welded body are checked, and the brazing rate of the welded body is checked by X-ray.
6. An enhanced loop heat pipe heat transfer system using a field installation process as recited in claim 1 wherein: further, working medium filling is carried out at a pipeline filling port of the capillary pump, and the actual working medium filling amount in the pipeline is obtained by measuring the weight of the filling tank twice.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111517170.3A CN114370782B (en) | 2021-12-07 | 2021-12-07 | Enhanced loop heat pipe heat transfer system adopting field installation process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111517170.3A CN114370782B (en) | 2021-12-07 | 2021-12-07 | Enhanced loop heat pipe heat transfer system adopting field installation process |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114370782A true CN114370782A (en) | 2022-04-19 |
CN114370782B CN114370782B (en) | 2024-04-09 |
Family
ID=81140982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111517170.3A Active CN114370782B (en) | 2021-12-07 | 2021-12-07 | Enhanced loop heat pipe heat transfer system adopting field installation process |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114370782B (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107529363B (en) * | 2008-08-25 | 2013-07-24 | 北京空间飞行器总体设计部 | A kind of small-sized deep cooling loop circuit heat pipe |
CN103639559A (en) * | 2013-11-14 | 2014-03-19 | 北京航空航天大学 | Loop heat pipe evaporator large-area soldering method |
CN105910479A (en) * | 2016-04-18 | 2016-08-31 | 北京空间机电研究所 | Temperature control type loop heat pipe evaporator assembly |
CN106288901A (en) * | 2016-08-12 | 2017-01-04 | 上海极率热能科技有限公司 | Loop circuit heat pipe system and with stainless steel capillary without the welding technique that subsides |
CN107144160A (en) * | 2017-04-19 | 2017-09-08 | 北京空间飞行器总体设计部 | A kind of 160K that works in is to the double loop deep cooling loop circuit heat pipe of 220K warm areas |
CN210862316U (en) * | 2019-09-20 | 2020-06-26 | 山东兆瓦热能科技有限公司 | Heat transfer system |
CN111397409A (en) * | 2020-03-02 | 2020-07-10 | 北京空间机电研究所 | Coupling phase-change material high-dispersion-ratio loop heat pipe device for spacecraft |
-
2021
- 2021-12-07 CN CN202111517170.3A patent/CN114370782B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107529363B (en) * | 2008-08-25 | 2013-07-24 | 北京空间飞行器总体设计部 | A kind of small-sized deep cooling loop circuit heat pipe |
CN103639559A (en) * | 2013-11-14 | 2014-03-19 | 北京航空航天大学 | Loop heat pipe evaporator large-area soldering method |
CN105910479A (en) * | 2016-04-18 | 2016-08-31 | 北京空间机电研究所 | Temperature control type loop heat pipe evaporator assembly |
CN106288901A (en) * | 2016-08-12 | 2017-01-04 | 上海极率热能科技有限公司 | Loop circuit heat pipe system and with stainless steel capillary without the welding technique that subsides |
CN107144160A (en) * | 2017-04-19 | 2017-09-08 | 北京空间飞行器总体设计部 | A kind of 160K that works in is to the double loop deep cooling loop circuit heat pipe of 220K warm areas |
CN210862316U (en) * | 2019-09-20 | 2020-06-26 | 山东兆瓦热能科技有限公司 | Heat transfer system |
CN111397409A (en) * | 2020-03-02 | 2020-07-10 | 北京空间机电研究所 | Coupling phase-change material high-dispersion-ratio loop heat pipe device for spacecraft |
Also Published As
Publication number | Publication date |
---|---|
CN114370782B (en) | 2024-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Chen et al. | Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module | |
US7265977B2 (en) | Active liquid metal thermal spreader | |
JPH0783077B2 (en) | Integrated heat pipe and electronic circuit assembly and method of integrating them | |
WO2009137653A2 (en) | Heat transfer assembly and methods therefor | |
US11156409B2 (en) | Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover | |
JP2012191043A (en) | Heat transfer apparatus | |
CN207881290U (en) | Flat-plate heat pipe expanded type condensing unit | |
CN102425968B (en) | Compact type loop heat pipe device | |
CN114370782A (en) | Enhanced loop heat pipe heat transfer system adopting field installation process | |
WO2009058515A1 (en) | Method and system for removing heat | |
CN113013120A (en) | Heat dissipation device and electronic equipment | |
CN108195213A (en) | The radiator of heat resistanceheat resistant stream impact | |
CN201467610U (en) | Cavity radiating device with loop heat pipe | |
CN112736046B (en) | Integrated chip heat dissipation device and heat dissipation method thereof | |
CN201773835U (en) | Radiator for loop circuit heat pipe | |
JPH03296241A (en) | Heat insulation device | |
US20230363112A1 (en) | Metallic thermal interface materials and associated devices, systems, and methods | |
CN111336848A (en) | Loop heat pipe evaporator with composite heat sink and loop heat pipe system | |
CN202948728U (en) | Active cooling device for instrument device under non-heat-sink condition | |
JP2847343B2 (en) | Closed system temperature controller | |
CN110864574A (en) | Novel loop heat pipe without compensation cavity and using method thereof | |
US10500661B2 (en) | Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom | |
CN213462774U (en) | Liquid cooling computer configuration cabinet | |
CN218722547U (en) | Hydraulic oil production heat abstractor | |
CN211451990U (en) | Novel loop heat pipe without compensation cavity |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant |