CN114364248A - Automatic paster equipment of SMT piece formula electronic components - Google Patents
Automatic paster equipment of SMT piece formula electronic components Download PDFInfo
- Publication number
- CN114364248A CN114364248A CN202210074917.0A CN202210074917A CN114364248A CN 114364248 A CN114364248 A CN 114364248A CN 202210074917 A CN202210074917 A CN 202210074917A CN 114364248 A CN114364248 A CN 114364248A
- Authority
- CN
- China
- Prior art keywords
- rod
- guide rail
- connecting plate
- rail
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Transmission Devices (AREA)
Abstract
The invention provides automatic chip mounting equipment for SMT chip electronic components, which comprises a linear guide rail, wherein a sliding seat is connected onto the linear guide rail in a sliding manner, an annular guide rail is fixedly connected onto the sliding seat, an outer gear ring is rotatably connected to the outer side of the annular guide rail, an equipment rack is erected on the outer gear ring, a suction pipe is arranged on the equipment rack, and a positioning motor is further arranged on the sliding seat; linear guide's one end fixedly connected with rail brackets, the last slide rail that is equipped with of rail brackets, sliding connection has the connecting plate on the slide rail, be connected with the swing arm on the connecting plate, the movable groove has been seted up in the swing arm, the movable inslot is equipped with the trace, the ejector pin, and roll over to the pole, roll over to the one end of pole and stretch out the movable groove, be equipped with decurrent thimble and be close to the deflector, it is equipped with the stopper to roll over to the other end of pole, roll over to and be connected with first extension spring between pole and the ejector pin, the last locating part that still is equipped with of rail brackets, the microscler via hole has been seted up on the rail brackets, the downthehole action bars that has run through, the action bars passes through actuating lever swing joint trace.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to automatic chip mounting equipment for an SMT chip electronic component.
Background
The automatic paster equipment of SMT piece formula electronic components is the main equipment in the SMT production line. The chip electronic component is quickly and accurately mounted through the processes of drawing, displacement, positioning, placing and the like. Is an important device in the high-end manufacturing field.
In the placing process, for some long chip electronic components, two parallel suction pipes are needed to suck the chip electronic components and then reach a set position, and then under the action of the ejector pins, the vacuum state is broken and the chip electronic components are placed accurately.
The working principle of the placing process is as shown in fig. 1, when the suction pipe (2) for absorbing the chip electronic component (1) reaches a set position, the thimble (4) on the needle rod (3) is pressed on the chip electronic component (1), and then the vacuum state is broken along with the rising of the suction pipe (2), so that the chip electronic component (1) is precisely placed. The direction of the chip electronic component (1) to be placed shown in the figure is perpendicular to the assembly line direction (arrow a direction), so that the needle rod (3) can extend between the suction pipes (2) and act on the chip electronic component (1), and if the direction of the chip electronic component (1) to be placed is parallel to the assembly line direction, the equipment is not applicable, so that the problem that the existing automatic chip mounting equipment for the SMT chip electronic component is small in application range generally exists, and the manufacturing cost is indirectly increased.
Disclosure of Invention
The invention aims to solve the technical problem of how to improve the application range of the chip electronic components arranged in different directions, and provides an automatic chip mounting device for the SMT chip electronic components, which can correspondingly adjust stations to expand the application range.
The technical scheme includes that the automatic chip mounting equipment for the SMT chip type electronic components comprises a linear guide rail, wherein a sliding seat is connected onto the linear guide rail in a sliding mode, an annular guide rail is fixedly connected onto the sliding seat, an outer gear ring is rotatably connected to the outer side of the annular guide rail, an equipment rack is erected on the outer gear ring, two suction pipes which extend downwards side by side are arranged on the equipment rack, and a position adjusting motor used for driving the outer gear ring to rotate is further arranged on the sliding seat; one end of the linear guide rail is fixedly connected with a guide rail bracket perpendicular to the linear guide rail, the guide rail bracket is provided with a slide rail along the guide rail bracket, the slide rail is connected with a connecting plate in a sliding manner, the connecting plate is connected with a swing arm extending to one side of the slide seat from the lower part of the guide rail bracket, a movable groove is formed in the swing arm, a linkage rod, an ejector rod and a deflecting rod which are sequentially connected in a rotating manner are arranged in the movable groove, one end of the deflecting rod extends out of the movable groove, is provided with a downward ejector pin and is close to a guide plate arranged on the swing arm, the other end of the deflecting rod is provided with a limiting block which limits the deflecting rod when the deflecting rod rotates to be perpendicular to the ejector rod, a first tension spring positioned in the movable groove is connected between the deflecting rod and the ejector rod, and the guide rail bracket is further provided with a limiting part for limiting the sliding of the connecting plate, the guide rail bracket is provided with a long through hole positioned between the slide rails, an operating rod penetrates through the through hole, and the operating rod is movably connected with the linkage rod through a driving rod; when the limiting part is right after the connecting plate is limited, the operating rod can enable the linkage rod, the ejector rod and the deflecting rod to move to one side where the notch of the movable groove is located, the deflecting rod is opposite to the ejector rod in the moving process, and the first tension spring moves out of the movable groove in the moving process to enable the deflecting rod to be perpendicular to the ejector rod.
In one embodiment, a support frame is arranged on the outer gear ring, and the equipment rack is erected on the outer gear ring through the support frame.
As an implementation mode, the rotating shaft of the positioning motor is provided with rotating teeth, and the rotating teeth are meshed with the outer gear ring.
As an implementation mode, a laminate is arranged on the equipment frame, a lifting motor is arranged on the laminate, the lifting motor is in transmission connection with a rack penetrating through the laminate, the suction pipe penetrates through the laminate, and a lifting seat for connecting the rack is connected to the suction pipe; wherein, the rotation of the lifting motor can drive the suction pipe to lift.
As an implementation mode, the suction pipe is rotationally connected with the lifting seat, a gear is connected to the suction pipe, a rotating motor is further arranged on the layer plate, and the rotating motor is in transmission connection with the gear; wherein, the rotation of the rotating motor can drive the suction pipe to rotate.
In one embodiment, the laminate includes two sheets that are offset one above the other.
In one embodiment, the connecting plate is provided with an eccentric rotating wheel, the connecting plate is further provided with a rotating arm driven by the eccentric rotating wheel to rotate, and the rotating arm is fixedly connected with the swinging arm.
As an implementation mode, a holding groove connected with the via hole is formed in the connecting plate, the operating rod is hollow, a second tension spring connected to the holding groove is arranged in the operating rod, a station baffle is rotatably connected to one side in the via hole, and a rotating groove matched with the station baffle is formed in the other side in the via hole; when the operating rod passes through the station baffle along the via hole, the station baffle rotates out of the rotary groove, and when the operating rod passes through the station baffle along the via hole, the station baffle is abutted against the position of the operating rod in the rotary groove to limit the operating rod.
As an implementation mode, the limiting blocks comprise two limiting blocks which are arranged at intervals, and the first tension spring penetrates through the two limiting blocks.
In one embodiment, the annular rail and the outer ring gear are connected by balls.
Compared with the prior art, the invention has the beneficial effect that when the direction of the chip electronic component to be placed is vertical to the direction of the production line, the deflecting rod extends to the middle position of the two suction pipes. When the direction that makes the piece formula electronic components who treats the placing through the positioning is parallel with the assembly line direction, make the connecting plate slide to one side along the slide rail and the connecting plate finally receives the stopper spacing through the pulling action bars, continue the pulling action bars and can make trace, ejector pin and roll over to the equal notch place one side removal to the movable groove of pole, roll over to the pole and rotate at the relative ejector pin of removal in-process, first extension spring shifts out the movable groove and makes to roll over to pole and ejector pin perpendicular at the removal in-process. The length of the deflecting rod is equal to the sliding distance of the connecting plate along the sliding rail, so that the deflecting rod still extends to the middle position of the two suction pipes. Therefore, the chip electronic component can be applied to chip electronic components in different directions (perpendicular to or parallel to the direction of the production line).
Drawings
FIG. 1 is a schematic view of a placement process in the prior art;
fig. 2 is a schematic diagram of a first structure of a placement process of an automated SMT chip component placement device according to an embodiment of the present invention;
fig. 3 is a second schematic structural diagram of a placement process of an automated SMT chip component mounting apparatus according to an embodiment of the present invention;
fig. 4 is a partial cross-sectional view of a placement process of an automated SMT chip component placement machine according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a third structure of a placement process of an automated SMT chip component mounting apparatus according to an embodiment of the present invention;
FIG. 6 is an enlarged view of a via provided in accordance with an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a joint of the push rod and the deflecting rod according to the embodiment of the invention.
In the figure: 5. a linear guide rail; 6. a slide base; 7. an annular guide rail; 8. an outer ring gear; 9. an equipment rack; 10. a straw; 11. a positioning motor; 12. a rail bracket; 13. a slide rail; 14. a connecting plate; 15. swinging arms; 16. a movable groove; 17. a linkage rod; 18. a top rod; 19. a deflecting bar; 20. a thimble; 21. a guide plate; 22. a limiting block; 23. a first tension spring; 24. a limiting member; 25. a via hole; 26. an operating lever; 27. a drive rod; 28. a support frame; 29. rotating the teeth; 30. laminating the board; 31. a lifting motor; 32. a rack; 33. a lifting seat; 34. a gear; 35. a rotating electric machine; 36. an eccentric runner; 37. a rotating arm; 38. a holding groove; 39. a second tension spring; 40. a station baffle; 41. rotating the groove; 42. and a ball.
Detailed Description
The foregoing and additional embodiments and advantages of the present invention are described more fully hereinafter with reference to the accompanying drawings. It is to be understood that the described embodiments are merely some, and not all, embodiments of the invention.
In one embodiment, as shown in fig. 2-3.
This embodiment provides an automatic paster equipment of SMT piece formula electronic components, it includes linear guide 5, sliding connection has slide 6 on linear guide 5, fixedly connected with annular rail 7 on the slide 6, the annular rail 7 outside is rotated and is connected with outer ring gear 8, the outer ring gear 8 is put on the shelf and is equipped with equipment rack 9, be equipped with side by side and downwardly extending's two straw 10 on the equipment rack 9, still be equipped with on the slide 6 and be used for driving outer ring gear 8 pivoted positioning motor 11. A guide rail bracket 12 perpendicular to the linear guide rail 5 is fixedly connected to one end of the linear guide rail 5, a slide rail 13 along the guide rail bracket 12 is arranged on the guide rail bracket 12, a connecting plate 14 is connected to the slide rail 13 in a sliding manner, a swing arm 15 extending from the lower part of the guide rail bracket 12 to one side of the slide carriage 6 is connected to the connecting plate 14, a movable groove 16 is arranged in the swing arm 15, a linkage rod 17, a push rod 18 and a folding rod 19 which are sequentially connected in a rotating manner are arranged in the movable groove 16, one end of the folding rod 19 extends out of the movable groove 16, a downward push rod 20 is arranged and is close to a guide plate 21 arranged on the swing arm 15, a limit block 22 for limiting the folding rod 19 when the folding rod 19 rotates to be perpendicular to the push rod 18 is arranged at the other end of the folding rod 19, a first tension spring 23 located in the movable groove 16 is connected between the folding rod 19 and the push rod 18, and a limit block 24 for limiting the connecting plate 14 in a sliding manner is further arranged on the guide rail bracket 12, the guide rail bracket 12 is provided with a long through hole 25 positioned between the slide rails 13, an operating rod 26 penetrates through the through hole 25, and the operating rod 26 is movably connected with the linkage rod 17 through a driving rod 27. After the limiting member 24 limits the connecting plate 14, the operation rod 26 is pulled to move the linkage rod 17, the ejector rod 18 and the deflecting rod 19 to one side of the notch of the movable groove 16, the deflecting rod 19 rotates relative to the ejector rod 18 in the moving process, and the first tension spring 23 moves out of the movable groove 16 in the moving process to enable the deflecting rod 19 and the ejector rod 18 to be perpendicular.
In the present embodiment, the annular guide rail 7 and the external gear ring 8 are arranged on the sliding base 6, so that the equipment rack 9 can be driven to rotate by the positioning motor 11. Through such positioning, the direction of the chip electronic component to be placed can be parallel to the direction of the assembly line, and the direction of the chip electronic component to be placed can also be perpendicular to the direction of the assembly line. When the direction of the chip electronic component to be placed is perpendicular to the flow line direction, the deflecting bar 19 extends to the intermediate position of the two suction pipes 10, similarly to the state shown in fig. 1. In this embodiment, when the direction of the chip electronic component to be placed is parallel to the direction of the assembly line by positioning, the connecting plate 14 slides to one side along the slide rail 13 by pulling the operating rod 26, and the connecting plate 14 is finally limited by the limiting block 22, the linking rod 17, the ejector rod 18, and the deflecting rod 19 can all move to one side of the notch of the movable groove 16 by continuously pulling the operating rod 26, the deflecting rod 19 rotates relative to the ejector rod 18 during the moving process, and the first tension spring 23 moves out of the movable groove 16 during the moving process, so that the deflecting rod 19 is perpendicular to the ejector rod 18. The length of the deflecting bar 19 is equal to the distance that the connecting plate 14 slides along the slide rail 13, so that the deflecting bar 19 still extends to the middle position of the two straws 10. Only the linkage rod 17, the ejector rod 18 and the deflecting rod 19 which are in a straight line shape originally when the direction corresponding to the chip electronic component to be placed is vertical to the assembly line direction are changed into the linkage rod 17, the ejector rod 18 and the deflecting rod 19 which are in an L shape when the direction corresponding to the chip electronic component to be placed is parallel to the assembly line direction. When the driving rod 27 pulls along with the operating rod 26 to push the linkage rod 17, the ejector rod 18 and the deflecting rod 19 to one side of the notch of the movable groove 16, after the movable groove 16 is pushed out of the connecting part of the deflecting rod 19 and the ejector rod 18, one end of the deflecting rod 19 is deflected relative to the ejector rod 18 under the action of the guide plate 21, and then the deflecting rod 19 rotates under the action of the first tension spring 23 until the deflecting rod 19 is perpendicular to the ejector rod 18.
In this embodiment, through the common cooperation of the above technical features, both the chip electronic components with different orientations (perpendicular or parallel to the assembly line direction) can be applied, and the technical problem that the automatic chip mounting device for the SMT chip electronic component proposed in the background art is small in application range is solved.
In one embodiment, as shown in FIG. 2.
In the automatic chip mounting device for the SMT sheet type electronic component provided by the present embodiment, the supporting frame 28 is arranged on the outer gear ring 8, and the device frame 9 is erected on the outer gear ring 8 through the supporting frame 28. In the present embodiment, the equipment carrier 9 and the outer ring gear 8 are fixed by the bracket 28, so that when the outer ring gear 8 rotates, the equipment carrier 9 also rotates.
In one embodiment, as shown in FIG. 2.
In the automatic chip mounting device for the SMT chip type electronic component provided by the embodiment, the rotating shaft of the positioning motor 11 is provided with the rotating teeth 29, and the rotating teeth 29 are meshed with the outer gear ring 8. In the present embodiment, the positioning motor 11 drives the external ring gear 8 to rotate through the rotating teeth 29.
In one embodiment, as shown in FIG. 4.
In the automatic chip mounting device for the SMT chip electronic component provided by the embodiment, the device frame 9 is provided with the laminate 30, the laminate 30 is provided with the lifting motor 31, the lifting motor 31 is in transmission connection with the rack 32 penetrating through the laminate 30, the straw 10 penetrates through the laminate 30, and the straw 10 is connected with the lifting seat 33 for connecting the rack 32; wherein, the rotation of the lifting motor 31 can drive the suction pipe 10 to lift. In the present embodiment, the elevation of the suction pipe 10 is controlled by an elevation motor 31, and in a preferred embodiment, the layer 30 includes two layers which are staggered up and down. Namely, the two lifting motors 31 respectively control the lifting of the two suction pipes 10. Specifically, when the elevation motor 31 rotates, the elevation motor drives the rack 32 to ascend and descend, and the elevation base 33 drives the pipette 10 to ascend and descend.
In one embodiment, as shown in FIG. 4.
According to the automatic chip mounting equipment for the SMT chip type electronic components, the suction pipe 10 is rotatably connected with the lifting seat 33, the suction pipe 10 is connected with the gear 34, the layer plate 30 is further provided with the rotating motor 35, and the rotating motor 35 is in transmission connection with the gear 34; wherein, the rotation of the rotating motor 35 can drive the straw 10 to rotate. In the present embodiment, the suction pipe 10 and the elevation base 33 are rotatably connected to each other, and may be connected to each other by a bearing. The rotation of the suction pipe 10 can be controlled by the rotation motor 35.
In one embodiment, as shown in FIG. 2.
In the automatic chip mounting device for SMT chip electronic components provided by this embodiment, the connecting plate 14 is provided with the eccentric runner 36, the connecting plate 14 is further provided with the rotating arm 37 driven by the eccentric runner 36 to rotate, and the rotating arm 37 is fixedly connected with the swing arm 15. In the present embodiment, the rotation of the eccentric wheel 36 can drive the rotation arm 37 to rotate, the rotation of the rotation arm 37 can drive the swing arm 15 to swing up and down by rotating the rotation arm, the swing down can contact the chip electronic component, and then the vacuum state is broken when the suction pipe 10 is lifted up.
In one embodiment, as shown in fig. 5-6.
In the automatic chip mounting device for the SMT chip type electronic component provided by the present embodiment, the connecting plate 14 is provided with a holding groove 38 connected to the via hole 25, the operating rod 26 is hollow, and a second tension spring 39 connected to the holding groove 38 is disposed in the operating rod 26, one side in the via hole 25 is rotatably connected to a station baffle 40, and the other side in the via hole 25 is provided with a rotating groove 41 for the station baffle 40 to cooperate with; when the operation rod 26 passes through the station baffle 40 along the through hole 25, the station baffle 40 is rotated out of the rotary groove 41, and after the operation rod 26 passes through the station baffle 40 along the through hole 25, the station baffle 40 is abutted in the rotary groove 41 to limit the position of the operation rod 26.
In the present embodiment, since the second tension spring 39 is connected between the operating lever 26 and the grip groove 38, the operating lever 26 can be held in the grip groove 38 in a normal state, that is, corresponding to one station. When the station is to be changed, the operating rod 26 is pulled to the other side, when the operating rod 26 passes through the station baffle 40 along the through hole 25, the station baffle 40 is rotated out of the rotary groove 41, and after the operating rod 26 passes through the station baffle 40 along the through hole 25, the station baffle 40 is of an elastic hinge structure and can automatically abut against the rotary groove 41, so that the position of the operating rod 26 is limited, namely, the operating rod corresponds to another station.
In one embodiment, as shown in FIG. 7.
This embodiment provides an automatic paster equipment of SMT piece formula electronic components, its stopper 22 includes two that the interval set up, and first extension spring 23 passes between two stoppers 22. In the present embodiment, a position structure of the first tension spring 23 and the stopper 22 is provided.
In one embodiment, as shown in FIG. 4.
In the automatic chip mounting device for the SMT chip electronic component provided by the present embodiment, the annular guide rail 7 and the external gear ring 8 are connected through the ball 42. In the present embodiment, a connecting structure of the ring rail 7 and the outer ring gear 8 is provided.
The above embodiments further describe the object, technical means, and advantageous effects of the present invention in detail. It should be understood that the above are only specific embodiments of the present invention, and are not intended to limit the scope of the present invention. It should be understood that any modifications, equivalents, improvements and the like, which come within the spirit and principle of the invention, may occur to those skilled in the art and are intended to be included within the scope of the invention.
Claims (10)
1. The automatic chip mounting equipment for the SMT chip type electronic components is characterized by comprising a linear guide rail (5), wherein a sliding seat (6) is connected onto the linear guide rail (5) in a sliding manner, an annular guide rail (7) is fixedly connected onto the sliding seat (6), an outer gear ring (8) is rotatably connected to the outer side of the annular guide rail (7), an equipment rack (9) is erected on the outer gear ring (8), two suction pipes (10) which extend downwards side by side are arranged on the equipment rack (9), and a positioning motor (11) for driving the outer gear ring (8) to rotate is further arranged on the sliding seat (6);
the one end fixedly connected with of linear guide (5) with linear guide (5) vertically rail brackets (12), be equipped with on rail brackets (12) along slide rail (13) of rail brackets (12), sliding connection has connecting plate (14) on slide rail (13), be connected with on connecting plate (14) follow rail brackets (12) below stretch to swing arm (15) of slide (6) place one side, movable groove (16) have been seted up in swing arm (15), be equipped with in proper order in movable groove (16) and rotate link lever (17), ejector pin (18) and the book pole (19) of connecting, the one end of book pole (19) is stretched out movable groove (16), be equipped with decurrent thimble (20) and be close to and establish deflector (21) on swing arm (15), the other end of book pole (19) be equipped with it is right when book pole (19) rotate to with ejector pin (18) are perpendicular to roll over to pole (19) ) A limiting block (22), a first tension spring (23) located in the movable groove (16) is connected between the deflecting rod (19) and the ejector rod (18), a limiting block (24) for limiting the sliding of the connecting plate (14) is further arranged on the guide rail support (12), a long through hole (25) located between the slide rails (13) is formed in the guide rail support (12), an operating rod (26) penetrates through the through hole (25), and the operating rod (26) is movably connected with the linkage rod (17) through a driving rod (27);
when the limiting piece (24) is used for limiting the connecting plate (14), the operating rod (26) is pulled to enable the linkage rod (17), the ejector rod (18) and the deflecting rod (19) to move towards one side where the notch of the movable groove (16) is located, the deflecting rod (19) rotates relative to the ejector rod (18) in the moving process, and the first tension spring (23) moves out of the movable groove (16) in the moving process to enable the deflecting rod (19) to be perpendicular to the ejector rod (18).
2. An automated SMT chip component mounting device according to claim 1, wherein a support frame (28) is arranged on the outer gear ring (8), and the device rack (9) is mounted on the outer gear ring (8) through the support frame (28).
3. An automatic paster device for SMT chip electronic components according to claim 1, wherein a rotating gear (29) is arranged on a rotating shaft of the positioning motor (11), and the rotating gear (29) is meshed with the outer gear ring (8).
4. An automatic paster device for SMT chip electronic components according to claim 1, wherein a laminate (30) is arranged on the device frame (9), a lifting motor (31) is arranged on the laminate (30), the lifting motor (31) is in transmission connection with a rack (32) penetrating through the laminate (30), the suction tube (10) penetrates through the laminate (30), and a lifting seat (33) for connecting the rack (32) is connected to the suction tube (10); wherein, the lifting motor (31) rotates to drive the suction pipe (10) to lift.
5. An automatic SMT chip type electronic component mounting device according to claim 4, wherein the suction tube (10) is rotatably connected with the lifting seat (33), a gear (34) is connected to the suction tube (10), a rotating motor (35) is further arranged on the layer plate (30), and the rotating motor (35) is in transmission connection with the gear (34); wherein, the rotation of the rotating motor (35) can drive the suction pipe (10) to rotate.
6. An automated chip mounting apparatus for SMT chip electronic components according to claim 5, wherein the laminate (30) comprises two layers that are staggered one above the other.
7. An automatic paster device for SMT chip electronic components according to claim 1, wherein the connecting plate (14) is provided with an eccentric wheel (36), the connecting plate (14) is further provided with a rotating arm (37) driven by the eccentric wheel (36) to rotate, and the rotating arm (37) is fixedly connected with the swinging arm (15).
8. An automatic chip mounting device for SMT chip electronic components according to claim 1, wherein the connecting plate (14) is provided with a holding groove (38) connected to the via hole (25), the operating rod (26) is hollow and is provided with a second tension spring (39) inside thereof, the second tension spring is connected to the holding groove (38), one side inside the via hole (25) is rotatably connected to a station baffle (40), and the other side inside the via hole (25) is provided with a rotating groove (41) for the station baffle (40) to be matched with; when the operating rod (26) passes through the station baffle (40) along the through hole (25), the station baffle (40) is rotated out of the rotary groove (41), and after the operating rod (26) passes through the station baffle (40) along the through hole (25), the station baffle (40) is abutted against the rotary groove (41) to limit the position of the operating rod (26).
9. An automatic SMT chip type electronic component mounting device according to claim 1, wherein the limiting blocks (22) comprise two limiting blocks (22) arranged at intervals, and the first tension spring (23) penetrates through the two limiting blocks (22).
10. An automated chip mounting device for SMT chip electronic components according to claim 1, wherein the ring rail (7) and the outer ring gear (8) are connected via balls (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210074917.0A CN114364248B (en) | 2022-01-21 | 2022-01-21 | Automatic paster equipment of SMT piece formula electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210074917.0A CN114364248B (en) | 2022-01-21 | 2022-01-21 | Automatic paster equipment of SMT piece formula electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114364248A true CN114364248A (en) | 2022-04-15 |
| CN114364248B CN114364248B (en) | 2022-09-13 |
Family
ID=81091773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210074917.0A Active CN114364248B (en) | 2022-01-21 | 2022-01-21 | Automatic paster equipment of SMT piece formula electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114364248B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009259910A (en) * | 2008-04-14 | 2009-11-05 | Tdk Corp | Mounting device and method of electronic device |
| CN110002266A (en) * | 2019-04-03 | 2019-07-12 | 东莞市浩信精密机械有限公司 | A kind of automatic mounting lining chip mounter |
| CN110381722A (en) * | 2019-07-18 | 2019-10-25 | 安徽天通精电新科技有限公司 | A kind of self-positioning chip mounter and its working method |
| CN110491809A (en) * | 2019-08-30 | 2019-11-22 | 恩纳基智能科技无锡有限公司 | High-accuracy multifunctional loader and its application method |
| CN110989226A (en) * | 2019-12-31 | 2020-04-10 | 深圳市比亚迪电子部品件有限公司 | Paster equipment and paster process |
| CN212876545U (en) * | 2020-08-12 | 2021-04-02 | 天津奇思奥特科技有限公司 | SMT bulk cargo adsorption equipment |
| CN113382625A (en) * | 2021-06-07 | 2021-09-10 | 惠州西文思技术股份有限公司 | Full-automatic SMT paster equipment |
| CN215222910U (en) * | 2021-04-29 | 2021-12-17 | 深圳市健仕达电子有限公司 | Remove and deposit formula SMT paster equipment |
| WO2021258730A1 (en) * | 2020-06-23 | 2021-12-30 | 东莞市冠佳电子设备有限公司 | Inserting apparatus and inserting machine |
-
2022
- 2022-01-21 CN CN202210074917.0A patent/CN114364248B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009259910A (en) * | 2008-04-14 | 2009-11-05 | Tdk Corp | Mounting device and method of electronic device |
| CN110002266A (en) * | 2019-04-03 | 2019-07-12 | 东莞市浩信精密机械有限公司 | A kind of automatic mounting lining chip mounter |
| CN110381722A (en) * | 2019-07-18 | 2019-10-25 | 安徽天通精电新科技有限公司 | A kind of self-positioning chip mounter and its working method |
| CN110491809A (en) * | 2019-08-30 | 2019-11-22 | 恩纳基智能科技无锡有限公司 | High-accuracy multifunctional loader and its application method |
| CN110989226A (en) * | 2019-12-31 | 2020-04-10 | 深圳市比亚迪电子部品件有限公司 | Paster equipment and paster process |
| WO2021258730A1 (en) * | 2020-06-23 | 2021-12-30 | 东莞市冠佳电子设备有限公司 | Inserting apparatus and inserting machine |
| CN212876545U (en) * | 2020-08-12 | 2021-04-02 | 天津奇思奥特科技有限公司 | SMT bulk cargo adsorption equipment |
| CN215222910U (en) * | 2021-04-29 | 2021-12-17 | 深圳市健仕达电子有限公司 | Remove and deposit formula SMT paster equipment |
| CN113382625A (en) * | 2021-06-07 | 2021-09-10 | 惠州西文思技术股份有限公司 | Full-automatic SMT paster equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114364248B (en) | 2022-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210189838U (en) | Automatic material stirring and sucking mechanism | |
| CN108000031B (en) | Position changing machine | |
| CN114364248B (en) | Automatic paster equipment of SMT piece formula electronic components | |
| CN114162606A (en) | Car glass fixes a position piece equipment down | |
| CN208728561U (en) | Flat cable bending molding machine | |
| CN217859476U (en) | Laser marking device for ball valve | |
| CN113385859B (en) | Auxiliary welding device for circuit board for producing OLED flexible panel | |
| CN214934024U (en) | Glass plate conveying and positioning device and vacuum glass metalized paste printing equipment | |
| CN210283574U (en) | Be applied to climbing mechanism of screen printing equipment | |
| CN108861556B (en) | Novel material moving and turning plate mechanism | |
| CN211077623U (en) | Clamping and moving device | |
| CN107175504A (en) | Assembling automobile gear shifting device device | |
| CN112173235A (en) | Automatic film coating machine and full-automatic film coating method | |
| CN208922000U (en) | A kind of contraposition module | |
| CN206868788U (en) | A kind of material transmission device of full-automatic LCD terminal cleaning machine | |
| KR100217285B1 (en) | Die transferring apparatus | |
| CN111924536A (en) | Vertical piece device about glass substrate | |
| CN220568667U (en) | Automatic product detection equipment | |
| CN215158988U (en) | Motor material moving and delivering mechanism | |
| CN213342855U (en) | Spline transmission mechanism and plug-in module | |
| CN219542252U (en) | Automatic assembly machine for moving contact deflector rod | |
| CN216736475U (en) | Automatic turn-over conveying equipment for glass | |
| CN215707517U (en) | Bag taking rotary moving and bag picking device for packaging bags | |
| CN215710008U (en) | Pick-and-place mechanism | |
| CN214398572U (en) | Transmission mechanism and production line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220824 Address after: No. 875, Xinbianhe Road, Xinzhan District, Hefei City, Anhui Province, 230000 Applicant after: HEFEI SINMING ELECTRONIC TECHNOLOGY CO.,LTD. Address before: 744099 Liu Hu Xiang Shi Li Pu Cun, Kongtong District, Pingliang City, Gansu Province Applicant before: Pan Xucui |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |