CN114364149B - An intelligent disassembly method and device for waste high-value circuit board chips - Google Patents

Abstract

The invention discloses an intelligent disassembly method and device for waste high-value circuit board chips. The device includes a heating processing unit and a chip disassembly and sorting unit; the heating processing unit rises through temperature steps to slowly increase the temperature of the circuit board to prevent thermal stress damage due to excessive temperature differences. At the same time, it uses closed-loop temperature control to ensure that the temperature at the preprocessing outlet is At this point, the surface temperature of the circuit board can reach the temperature control point for the best disassembly effect; after the heating processing unit is the chip disassembly and sorting unit. The chip disassembly and sorting unit includes an insulation and heating platform, and the rotating clamp grabs and enters the insulation and heating platform. On the circuit board, the camera determines the specific location of the chip to be disassembled on the circuit board through the positioning point designed on the front. The various components are reversely sucked and recycled by vacuum suction cups to achieve non-destructive disassembly and extract high-value chips. The invention has a high degree of automation, a high yield rate for chip disassembly, and is suitable for disassembling a wide range of circuit board models.

Description

An intelligent disassembly method and device for waste high-value circuit board chips

Technical field

The invention belongs to the field of resources and environmental technology, and specifically relates to an intelligent disassembly method and device for waste high-value circuit board chips.

Background technique

With the rapid development of mobile phone intelligence, people's lives are becoming more and more convenient. Mobile phones are closely connected with all aspects of life and play an increasingly important role in daily life. According to statistics from IDC, an internationally renowned data company, global mobile phone shipments in 2019 were 1.486 billion units, of which the total shipments in the Chinese mobile phone market were 370 million units, accounting for 24.90% of the world's total shipments. The industry predicts that in the next few years, the number of mobile phones updated every year in China will reach 400 million, and the number of discarded mobile phones every year will be 100 to 200 million. Before this, our country has accumulated about 1 billion obsolete mobile phones. Compared with the large amount of obsolete mobile phones deposited, on the contrary, the recycling rate of obsolete mobile phones in my country is less than 2%, and the recycling of obsolete mobile phones in China is mostly in the form of waste products, and there are few professional recycling chains.

Waste circuit boards contain a variety of toxic and harmful substances such as Pb and Cr ⁶⁺ , which are hazardous wastes. Improper treatment will cause serious environmental pollution. The current mainstream method of processing electronic waste is to dismantle the shells of recycled circuit boards and then crush them indiscriminately. Follow-up processes mainly use pickling, smelting, pyrolysis, microbial, mechanical, etc. Through these methods, metals with high contents such as copper, gold, and silver in PCB can be recovered. Although this solution can quickly solve the problem of waste circuits However, there is a problem of low ratio between recycling cost and profit after recycling, which leads to relatively low enthusiasm of enterprises. At the same time, the process of refining precious metals can easily cause serious secondary environmental pollution.

Research shows that the resource utilization technology of chips on PCB has always been a hot research topic due to their large quantity, long life, and high reuse value. The chip life cycle is much longer than the life cycle of mobile phones, and some chips, such as processors, flash memory, baseband, radio frequency, etc., have almost no life limit. The pass rate of standardized recycled chips (98%) is even higher than that of new chips produced (95%). Dismantling, classifying, recycling and reusing chips in PCBs can maximize economic benefits.

The disassembly device published in the Chinese patent "An automatic disassembly device and method for key components of mobile terminal circuit boards" (CN 113613403A) includes a small gantry, a cross slide, a vacuum suction cup, a six-degree-of-freedom robotic arm, a storage box, and a Disassemble the circuit board, robot arm teaching pendant, bracket, heat gun, vision camera, conveyor raceway and electrical cabinet, etc. It mainly realizes the automatic disassembly of key components on the circuit board through the joint action of a six-degree-of-freedom robotic arm and a vision camera as well as a hot air gun and a vacuum suction cup. This invention can realize automated disassembly of specific chips to a certain extent, effectively reduce enterprise labor costs and improve labor productivity. However, this solution is slow to disassemble chips (according to the patent, the disassembly time exceeds 40 seconds), and the selection of disassembled chips is narrow.

Contents of the invention

Based on the advantages and disadvantages of the existing technology, in order to solve the practical problem of recycling and processing high-value circuit board chips, the present invention proposes an intelligent disassembly method and device for waste high-value circuit board chips.

The invention proposes an intelligent disassembly method and device for waste high-value circuit board chips. The device is universally applicable to small and medium-sized circuit board chips such as common mobile phone motherboards and small computer motherboards. Through the overall heating of molten tin, centralized disassembly, and automated sorting processes, work efficiency can be greatly improved. In addition, during the chip disassembly process, the parameters are standardized and systematic, which can fully ensure the quality stability of the disassembled chips and is suitable for large-scale production in factories. Preferably, the electric heating plate is fixed on the insulation tile to prevent a large amount of heat from being conducted to the surface of the box.

The invention provides an intelligent disassembly device for waste high-value circuit board chips, which includes a heating processing unit and a chip disassembly and sorting unit; wherein:

The heating treatment unit includes a feed guide rail, which is installed on the conveyor belt support frame. The feed guide rail includes a fixed guide rail set horizontally and a movable guide rail set vertically on both sides. The two ends of the movable guide rail are connected with screw rods. The two drive motors are connected to each other through a screw pair and the two screw rods respectively, and then the distance between the two movable guide rails is adjusted by synchronously adjusting the length of the two screw rods. A power-adjustable electric heating plate is evenly installed below the fixed guide rail, and a power-adjustable electric heating plate is installed above the fixed guide rail. Temperature sensors are set at the output ends of the conveyor belt and feed rail;

The chip disassembly and sorting unit includes a thermal insulation and heating platform, a three-axis sliding table, a rotating fixture, a camera and a vacuum suction cup; the thermal insulation and heating platform is a liftable platform, which is set on the frame, and the output end of the feed rail is connected to the thermal insulation and heating platform , the bottom of the thermal insulation heating platform is equipped with an electric heating sheet, and the surface is embedded with a thermocouple temperature sensor. A rotating fixture is set above to clamp and fix the circuit boards to be sorted. A three-axis slide is set above the rotating fixture, and a camera is used to treat the problems. The chips on the sorting circuit board are identified and positioned. It is set on the Y-axis of the three-axis slide table. The vacuum suction cup is set on the Z-axis of the three-axis slide table. It moves horizontally along the X-axis or moves up and down along the Z-axis through the vacuum. The suction effect adsorbs and sorts the chips; among them: the rotating clamp includes a clamp body, a rotating motor and a telescopic motor; the clamp body is rectangular and includes a parallel clamp fixing rod and a clamp combination fixing rod, a clamp fixing rod and a clamp combination One side of the fixed rod is connected by a linear guide rail, a linear slider is set on the linear guide rail, and the other side is connected by a screw rod. The rotation of the screw rod is driven by a telescopic motor. A screw pair, a linear slider and a screw pair are set on the screw rod. They are connected through the clamp movable rod. The telescopic motor and the rotating motor are installed on the clamp combination fixed rod. A set of shock-absorbing springs are set opposite each other on the clamp fixed rod and the clamp movable rod. The shock-absorbing spring is connected to the clamp buffer and shock-absorbing plate; during operation , the telescopic motor drives the screw rod to rotate and at the same time drives the movement of the clamp's movable rod, which in turn drives the switch of the rotating clamp. The movement of the rotating motor drives the clamp body to flip 180°.

In the present invention, the adjustable electric heating plates of the heating treatment unit are separated by insulating tiles to achieve adjustable temperature step heating.

In the present invention, a stepped heating system is adopted from the input end to the output end on the feed guide rail, and the control temperature reference parameters are 60°C to 80°C, 130°C to 150°C, and 230°C to 270°C. Preferably, the control temperature reference parameters are 60°C to 80°C, 130°C to 150°C, and 240°C to 260°C.

In the present invention, the heat preservation and heating platform is lifted and lowered by a lifting screw, and the heat preservation and heating platform is installed above the lifting screw.

On the lifting frame, a positioning optical axis is set parallel to both sides of the lifting screw rod. An optical axis pair is set on the positioning optical axis. The optical axis pair is installed on the lifting frame to realize the guiding function.

In the present invention, the vacuum suction cup is connected to a 125-watt high-power vacuum pump, and the tested surface suction force exceeds 20N. For conventional BGA packaged chips, the removal force after preheating is 5N, and the redundant suction force is sufficient; the vacuum suction cup has a vacuum inside The degree detection module prevents leakage during the disassembly and sorting process.

In the present invention, the heating processing unit and the chip disassembly and sorting unit are placed in a semi-sealed stainless steel box, and the box is connected to the exhaust treatment device for VOCs, which can ensure personnel safety and reduce environmental pollution.

The present invention also provides a method based on the above-mentioned intelligent chip disassembly device. The specific steps are as follows:

(1) Arrange the circuit boards to be sorted, determine the dimensions of the circuit boards in the same batch, and adjust the width of the feed guide rail so that the conductive circuit boards can be stuck into the slots on the feed guide rail; take photos of the circuit boards to be sorted Marks are imported and feature recognition is performed in the camera host software to determine the target sorting chip and positioning identification points;

(2) Set the temperature of the output end of the feed guide rail and the temperature of the insulation heating platform; put the circuit boards to be sorted into the feed guide rail in turn, start the preparation for heating operation, and when the temperature at the heating end reaches the standard, start the conveyor belt to start feeding;

(3) The circuit boards enter the thermal insulation and heating platform in sequence, and the rotating clamps clamp and fix the circuit boards. The camera and the host computer software cooperate with the positioning and identification. The vacuum suction cup on the Z-axis of the three-axis slide accurately absorbs the target chip, and implements classified placement for disassembly. After the front chip is removed, the thermal insulation and heating platform is lowered. After the rotating fixture is turned 180°, the thermal insulation and heating platform returns to its original position. The camera and the host computer cooperate to reposition and identify. Repeat the above steps to continue to disassemble the target chip on the reverse circuit board.

In the present invention, a stepped heating system is adopted on the feed guide rail. From the input end to the output end, the control temperature reference parameters are 60°C to 80°C, 130°C to 150°C, and 230°C to 270°C, a total of three stages of heating. process; preferably, the control temperature reference parameters are 60°C to 80°C, 130°C to 150°C, and 240°C to 260°C.

In the present invention, the temperature of the output end of the feed guide rail is set to 230-270°C, and the stable temperature of the heating bottom plate on the thermal insulation heating platform is 235°C to 275°C. Preferably, the temperature at the output end of the feed guide rail is 240-260°C, and the stable temperature of the heating bottom plate on the thermal insulation heating platform is 245°C-265°C.

Compared with the prior art, the beneficial effects of the present invention are:

1. In view of the traditional circuit board recycling method of high-value chips, the present invention realizes the mechanical automatic disassembly of various components, and has a high integrity rate of disassembled chips, solving the problem caused by the difference in manual technical proficiency in the traditional manual chip disassembly process. The problem of low reusability rate.

2. In view of the traditional recycling method of high-value chips of waste circuit boards, the present invention realizes the purpose of automatic sorting and recycling of chips after disassembly. It solves the problem of long manual time and low efficiency when sorting chips in the traditional recycling process.

3. In view of the existing technology, the present invention provides a method and device for automated precise disassembly and intelligent sorting, which can effectively solve the problem of difficulty in high-value recycling of chips caused by indiscriminate destructive disassembly at the current stage. Realizing high-value recycling of chips and targeted resource recycling.

4. In order to realize the precise sorting function, the present invention requires that the circuit boards to be sorted pass through the host computer software in advance to mark the positioning points and chip feature positioning units. Relying on a single-chip microcomputer to drive a high-precision stepper motor, the minimum movement accuracy can be achieved at 0.01mm. It can accurately disassemble most LGA or BGA packaged chips. Common high-value chips, such as CPUs or memory chips, can be disassembled with high precision and sorted for recycling.

5. The invention can realize rapid and large-scale disassembly of chips.

Description of the drawings

Figure 1 is a schematic three-dimensional structural diagram of an intelligent disassembly device for waste high-value circuit board chips in an example of the present invention.

Figure 2 is a top view of an intelligent disassembly device for waste high-value circuit board chips.

Figure 3 is a side view of an intelligent disassembly device for waste high-value circuit board chips.

Figure 4 is a three-dimensional structural view of a rotating clamp of an intelligent disassembly device for waste high-value circuit board chips.

Numbers in the figure: 001-Heating treatment unit; 002-Heating mechanism; 003-Chip disassembly and sorting unit; 004-Rotating fixture; 005-Insulation and heating platform; 006-Rack; 007-Camera sorting module; 101-Conveying With support frame; 102, 104-drive motor; 103-fixed guide rail; 105-temperature sensor; 106-movable guide rail; 201-electric heating plate; 301-Y axis; 302-X axis; 303-X-axis drive of sorting mechanism Motor; 304-Z-axis drive motor of the sorting mechanism; 305-First connector of the sorting mechanism; 306-Second connector of the sorting mechanism; 307-Support beam of the sorting and disassembly mechanism; 308-Y-axis drive of the sorting mechanism Motor; 309-X-axis connector; 401-linear guide rail; 402-linear slider; 403-clamp fixed rod; 404-clamp connector; 405-clamp combination fixed rod; 406-rotary bearing; 407-telescopic motor; 408 -Rotating motor; 409-screw; 410-screw pair; 411-clamp movable rod; 412-clamp buffer and shock-absorbing plate; 413-shock absorbing spring; 501-heating base plate; 502-support frame; 503-lifting frame; 504-Optical axis module; 505-Optical axis positioning module; 506-Lifting screw.

Detailed ways

The specific implementation of the present invention will be further described below with reference to examples, but the implementation and protection of the present invention are not limited thereto. It should be pointed out that any process that is not specifically described in detail below can be implemented or understood by those skilled in the art with reference to the existing technology. If the manufacturer of the reagents or instruments used is not indicated, they are regarded as conventional products that can be purchased commercially.

An intelligent disassembly device for waste high-value circuit board chips is shown in Figures 1 to 4. Its overall shell is a semi-sealed mechanism. An air extraction device is provided at the discharge end of the device to remove VOCS (volatile gas) generated by heating the circuit board. Organic matter) gas is sucked into the activated carbon adsorption tank for adsorption treatment, which can not only avoid environmental pollution but also greatly protect the safety of on-site operators. Specifically, it includes a heat treatment unit 001 and a chip disassembly and sorting unit 003. The heat treatment unit 001 includes a conveying mechanism, a heating mechanism, a temperature control mechanism, etc. The chip disassembly and sorting unit 003 includes a clamping mechanism, a heat preservation mechanism, an identification mechanism, a grabbing mechanism, a feeding and collection device and a control module.

In the heating treatment unit 001, the conveying mechanism includes a fixed guide rail 103, movable guide rails 106 provided on both sides, and a conveyor belt on the fixed guide rail 103. The conveying mechanism is arranged on the conveyor belt support frame 101; first, the circuit boards to be processed are divided into batches and classified, Arranging circuit boards of the same type in the fixed guide rail 103 is a process of feeding preprocessing. The guide rail of the transmission circuit board automatically adjusts the width of the movable guide rail 106 through the joint action of the screw rods at both ends and the two drive motors 102 and 104 to ensure that circuit boards of different sizes can enter the transmission slot in sequence. The maximum designed width is: 400mm. The circuit board is slowly fed to the chip disassembly and sorting unit 003 through the slot on the guide rail and relying on the conveyor belt. At the same time, the structure is sealed by a stainless steel plate, and a device for exhausting and treating VOCS volatile organic compounds is installed at the rear. The heating treatment unit 001 includes a heating mechanism 002. The heating mechanism 002 adopts an electric heating plate 201. The electric heating plate 201 is evenly distributed under the fixed guide rail 103 and separated by heat-insulating tiles to achieve step-level adjustable heating and step-level heating to control the temperature. The reference parameters are 60°C to 80°C, 130°C to 150°C, and 230°C to 270°C, a total of 3 stages of heating process; a temperature sensor 105 is installed at the junction of the heating processing unit 001 and the chip disassembly and sorting unit 003 As a temperature control mechanism, it is used to provide real-time feedback on the actual temperature at the exit of the circuit board. Once it is lower than or exceeds the warning value, a shutdown alarm will be triggered to ensure that the solder on all pre-processed circuit boards is completely melted and the chip is not damaged by high temperature. . The embodiment uses PID control to achieve closed-loop precise adjustment of the temperature gradient, ensuring that the heating process is safe and controllable, avoiding chip damage and loss of disassembly and recycling value due to excessive local temperature, and at the same time, through the suction effect of the air extraction device, the temperature at the entrance is The negative pressure formed by the air will not leak polluted gases.

In the chip disassembly and sorting unit 003, the preheated circuit board is pushed to the insulation and heating platform 005 by the feeding guide rail. The insulation and heating platform 005 is set above the rack 006. The rotating clamp 004 in the platform fixes the circuit board. At the same time, the clamp passes through The rotating motor 408 realizes a 180° turning function, and can also disassemble the double-layer motherboard; the camera determines the specific position of the chip to be disassembled on the circuit board through the positioning point designed on the front, and reverses each component through the grabbing mechanism Absorb, sort and recycle. There is a stainless steel classification collection box on the back side of the thermal insulation and heating platform 005, which collects all types of required chips on the circuit board in a unified manner. The disassembled waste circuit boards also enter the recycling box through the side guide channel, waiting for use in other processes.

The clamping structure in the chip disassembly and sorting unit 003 adopts a rotating clamp 004. The rotating clamp 004 is mainly composed of a clamp part and a motion drive part. The clamp mainly consists of linear guide rail 401, linear slider 402, clamp fixed rod 403, support connector 404, clamp combination fixed rod 405, clamp movable rod 411, clamp buffer and shock absorbing plate 412, and shock absorbing spring 413 to form a rotating clamp. Mechanical moving parts. The movement driving component mainly drives the screw rod 409 to rotate by the telescopic motor 407. While the screw rod rotates, the screw pair 410 and the clamp movable rod 411 are connected to move together to achieve the purpose of telescopic clamping. At the same time, in order to realize the flipping function of the clamp, the entire structure is driven by a rotating motor 408. Considering the torque balance, a rotating bearing 406 is added at the connection between the motor and the clamp member to achieve the stability of the mechanical action.

In order to prevent solder solidification due to cooling during the disassembly and sorting process, the chip disassembly and sorting unit 003 is equipped with a heat preservation mechanism. Specifically, an electric heating sheet is installed at the bottom of the heat preservation and heating platform 005, and the surface (heating bottom plate 501) It is embedded with a thermocouple temperature sensor to achieve closed-loop control of temperature, ensuring the stability of the temperature of the insulation and heating platform, and has the function of insulation; in addition, the insulation and heating platform 005 is specially designed to avoid the interference of the heating platform on its movement path during the movement of the rotating fixture 004. The thermal insulation and heating platform 005 is equipped with a lifting function. When the lifting screw 506 of the heat preservation and heating platform 005 rotates, the heating bottom plate 501 is driven to rise or fall synchronously. In order to ensure the stability of the action, positioning optical axes 504 are installed on both sides. The optical axis pair 505 is fixed on the lifting frame 503 to realize the guiding function, and the thermal insulation and heating platform 005 is connected to the lifting frame through the support frame 502 .

The identification mechanism in the chip disassembly and sorting unit 003 uses the camera sorting module 007, which is camera processing. The host computer uses OPEN PNP software and cooperates with the motion control card for motion control. But not limited to other control software or programs and control cards. The linear motion modules such as synchronous belts and synchronous wheels are not limited to other forms, such as ball screws combined with servo motors, etc.

The grabbing mechanism in the chip disassembly and sorting unit 003 is a vacuum suction cup. The vacuum suction cup is followed by a high-power vacuum pump. The tested surface suction force exceeds 20N. For conventional BGA packaged chips, the removal force after preheating is 5N. Redundant The suction power is sufficient; the vacuum suction cup is equipped with a vacuum detection module to prevent suction leakage during the disassembly and sorting process. The vacuum suction cup is set on a three-axis sliding table. The X-axis 302, Y-axis 301, Z-axis, and X-axis connector 309 together form a three-axis sliding table. The three-axis sliding table is driven by the X-axis driving motor 303 of the sorting mechanism, and the sorting mechanism. The Y-axis drive motor 308 of the sorting mechanism and the Z-axis drive motor 304 of the sorting mechanism assist in the movement operation. The final chip disassembly and sorting unit 003 uses a camera to accurately identify and position, and relies on a three-axis slide to drive a vacuum suction cup to remove the chips on the circuit board to be sorted. The chips are accurately pulled out by vacuum suction and placed in categories.

The control module includes the open source OPEN PNP software, which uses the lower camera to identify the shape characteristics of the components and control the motion of the grabbing mechanism. When identifying the appearance features of components, the open source OPEN CV source code library is used as visual recognition software to process image information. By visually locating the specific position and structure of the circuit board, the location of the target chip to be removed is marked in advance to achieve the purpose of directional removal.

The specific implementation steps of an intelligent disassembly device for waste high-value circuit board chips based on the present invention are as follows:

① First, the circuit boards to be processed are collected and processed by type, and circuit boards of the same type are arranged in the supply chain in sequence. Through a series of actions such as adjusting the width of the circuit board, heating temperature, and disassembly width in advance, the process can be carried out after the finalization is completed. Test work.

② The disassembled circuit board chips can be sampled and inspected to determine the appearance of the chip, the integrity of the signal pins, and even X-ray photography of the internal circuits, etc., to achieve continuous non-destructive disassembly and high-value recycling of the chips.

The invention realizes full automation, and through semi-sealed and fixed assembly line operations, while protecting the environment, it can greatly improve the recovery rate of disassembled chips through standardized processes, has high economic value and no obvious pollution to the environment, and is suitable for industrialization. application.

The above are only specific embodiments of the present application. It should be noted that those of ordinary skill in the technical field can also make several improvements and modifications without departing from the principles of the present application. These improvements and modifications can also be made. should be regarded as the scope of protection of this application.

Example 1

Taking the Huawei P9 motherboard chip as the disassembly target, after adjusting the width of the feed movable guide rail 106 to 66mm, introduce the three positioning points on the surface of the motherboard into the host computer of the back-end chip disassembly and sorting unit 003, and at the same time, remove the upper part of the motherboard CPU chip Metal shielding cover, position marks of CPU and memory chips. First, the temperature of the temperature sensor 105 at the outlet of the heating processing unit 001 is set to 230°C, and the temperature of the heating bottom plate 501 of the heat preservation and heating platform 005 is set to 235°C. Put the mobile phone motherboard into the fixed guide rail 103 in sequence, and start preparing for heating operation. When the temperature at the heating end reaches the standard and the indicator light turns on, start the conveyor belt to start feeding. The circuit board enters the back-end thermal insulation and heating platform 005 in sequence, and is clamped and fixed by the rotating clamp 004. The camera sorting module 007 is positioned and recognized. The vacuum suction cup accurately absorbs the target chip and implements classified placement. After the front chip is disassembled, the thermal insulation and heating platform 005 The lifting screw 506 will automatically descend 200mm. After the rotating fixture 004 is flipped 180°, the thermal insulation and heating platform 005 returns to its original position, the vision camera is repositioned, repeat the above steps, and continue to disassemble the target chip on the reverse circuit board. After the above steps, the metal shielding cover of the Huawei P90 motherboard chip CPU was successfully pulled out, but the chip could not be removed.

Example 2

Taking the Huawei P9 motherboard chip as the disassembly target, after adjusting the width of the feed movable guide rail 106 to 66mm, introduce the three positioning points on the surface of the motherboard into the host computer of the back-end chip disassembly and sorting unit 003, and at the same time, remove the upper part of the motherboard CPU chip Metal shielding cover, position marks of CPU and memory chips. First, the temperature 105 at the outlet of the heating processing unit 001 is set to 240°C, and the temperature of the heating bottom plate 501 of the heat preservation and heating platform 005 is set to 245°C. Put the mobile phone motherboard into the fixed guide rail 103 in sequence, and start preparing for heating operation. When the temperature at the heating end reaches the standard and the indicator light turns on, start the conveyor belt to start feeding. The circuit board enters the back-end thermal insulation and heating platform 005 in sequence, and is clamped and fixed by the rotating clamp 004. The camera sorting module 007 is positioned and recognized. The vacuum suction cup accurately absorbs the target chip and implements classified placement. After the front chip is disassembled, the thermal insulation and heating platform 005 The lifting screw 506 will automatically descend 200mm. After the rotating fixture 004 is flipped 180°, the thermal insulation and heating platform 005 returns to its original position, the vision camera is repositioned, repeat the above steps, and continue to disassemble the target chip on the reverse circuit board. After the above steps, the metal shielding cover of the Huawei P90 motherboard chip CPU was successfully pulled out, but some chips could not be pulled out.

Example 3

Taking the Huawei P9 motherboard chip as the disassembly target, after adjusting the width of the feed movable guide rail 106 to 66mm, introduce the three positioning points on the surface of the motherboard into the host computer of the back-end chip disassembly and sorting unit 003, and at the same time, remove the upper part of the motherboard CPU chip Metal shielding cover, position marks of CPU and memory chips. First, the temperature of the temperature sensor 105 at the outlet of the heating processing unit 001 is set to 250°C, and the temperature of the heating bottom plate 501 of the heat preservation and heating platform 005 is set to 255°C. Put the mobile phone motherboard into the fixed guide rail 103 in sequence, and start preparing for heating operation. When the temperature at the heating end reaches the standard and the indicator light turns on, start the conveyor belt to start feeding. The circuit board enters the back-end thermal insulation and heating platform 005 in sequence, and is clamped and fixed by the rotating clamp 004. The camera sorting module 007 is positioned and recognized. The vacuum suction cup accurately absorbs the target chip and implements classified placement. After the front chip is disassembled, the thermal insulation and heating platform 005 The lifting screw 506 will automatically descend 200mm. After the rotating fixture 004 is flipped 180°, the thermal insulation and heating platform 005 returns to its original position, the vision camera is repositioned, repeat the above steps, and continue to disassemble the target chip on the reverse circuit board. After the above steps, the metal shielding cover of the Huawei P90 motherboard chip CPU was successfully pulled out, and all target chips were removed.

Example 4

Taking the Huawei P9 motherboard chip as the disassembly target, after adjusting the width of the feed movable guide rail 106 to 66mm, introduce the three positioning points on the surface of the motherboard into the host computer of the back-end chip disassembly and sorting unit 003, and at the same time, remove the upper part of the motherboard CPU chip Metal shielding cover, position marks of CPU and memory chips. First, the temperature of the temperature sensor 105 at the outlet of the heating processing unit 001 is set to 260°C, and the temperature of the heating bottom plate 501 of the heat preservation and heating platform 005 is set to 265°C. Put the mobile phone motherboard into the fixed guide rail 103 in sequence, and start preparing for heating operation. When the temperature at the heating end reaches the standard and the indicator light turns on, start the conveyor belt to start feeding. The circuit board enters the back-end thermal insulation and heating platform 005 in sequence, and is clamped and fixed by the rotating clamp 004. The camera sorting module 007 is positioned and recognized. The vacuum suction cup accurately absorbs the target chip and implements classified placement. After the front chip is disassembled, the thermal insulation and heating platform 005 The lifting screw 506 will automatically descend 200mm. After the rotating fixture 004 is flipped 180°, the thermal insulation and heating platform 005 returns to its original position, the vision camera is repositioned, repeat the above steps, and continue to disassemble the target chip on the reverse circuit board. After the above steps, the metal shielding cover of the Huawei P90 motherboard chip CPU was successfully pulled out, all target chips were removed, and a certain degree of deformation appeared on the chip surface.

Example 5

Taking the Huawei P9 motherboard chip as the disassembly target, after adjusting the width of the feed movable guide rail 106 to 66mm, introduce the three positioning points on the surface of the motherboard into the host computer of the back-end chip disassembly and sorting unit 003, and at the same time, remove the upper part of the motherboard CPU chip Metal shielding cover, position marks of CPU and memory chips. First, the temperature of the temperature sensor 105 at the outlet of the heating processing unit 001 is set to 270°C, and the temperature of the heating bottom plate 501 of the heat preservation and heating platform 005 is set to 275°C. Put the mobile phone motherboard into the fixed guide rail 103 in sequence, and start preparing for heating operation. When the temperature at the heating end reaches the standard and the indicator light turns on, start the conveyor belt to start feeding. The circuit board enters the back-end thermal insulation and heating platform 005 in sequence, and is clamped and fixed by the rotating clamp 004. The camera sorting module 007 is positioned and recognized. The vacuum suction cup accurately absorbs the target chip and implements classified placement. After the front chip is disassembled, the thermal insulation and heating platform 005 The lifting screw 506 will automatically descend 200mm. After the rotating fixture 004 is flipped 180°, the thermal insulation and heating platform 005 returns to its original position, the vision camera is repositioned, repeat the above steps, and continue to disassemble the target chip on the reverse circuit board. After the above steps, the metal shield of the Huawei P90 motherboard chip CPU was successfully pulled out, and all the target chips were removed. The surface of the chip was deformed to a certain extent, some contacts fell off, and the chip was obviously damaged.

Table 1 is a statistical table of heating outlet temperatures during disassembly of each embodiment. Experiments have shown (as shown in Table 1) that in Example 3, complete disassembly was achieved under the conditions of a heating end temperature of 250°C and an insulation heating platform of 255°C, with no obvious damage through visual inspection. After re-balling, The special test board can be used to read and write normally without being damaged. Compared with the single disassembly of the patent CN113613403A, the disassembly speed of this solution is more than 5 times, and will expand as the number of chips to be disassembled on a single board increases.

The experimental results of Examples 1 to 5 are shown in Table 1:

serial number Heating outlet temperature Insulation heating platform temperature Disassembly Chip integrity Example 1 230 235 The shielding cover is removed, but the chip is not removed. intact Example 2 240 245 Remove the shielding cover and partially remove the chip. intact Example 3 250 255 Remove the metal shield and remove the chip. intact Example 4 260 265 Remove the metal shield and remove the chip. Surface slightly deformed Example 5 270 275 Remove the metal shield and remove the chip. obvious damage

The above embodiments are only better and worse embodiments of the present invention, and are only used to explain the present invention, but not to limit the present invention. Changes, substitutions, modifications, etc. made by those skilled in the art without departing from the spirit and essence of the present invention are all without limitation. should fall within the protection scope of the present invention.

Claims (10)

1. An intelligent disassembly device for waste high-value circuit board chips, characterized in that it includes a heating processing unit and a chip disassembly and sorting unit; wherein: The heating treatment unit includes a feed guide rail, which is installed on the conveyor belt support frame. The feed guide rail includes a fixed guide rail set horizontally and a movable guide rail set vertically on both sides. The two ends of the movable guide rail are connected with screw rods. The two drive motors are connected to each other through a screw pair and the two screw rods respectively, and then the distance between the two movable guide rails is adjusted by synchronously adjusting the length of the two screw rods. A power-adjustable electric heating plate is evenly installed below the fixed guide rail, and a power-adjustable electric heating plate is installed above the fixed guide rail. Temperature sensors are set at the output ends of the conveyor belt and feed rail; The chip disassembly and sorting unit includes a thermal insulation and heating platform, a three-axis sliding table, a rotating fixture, a camera and a vacuum suction cup; the thermal insulation and heating platform is a liftable platform, which is set on the frame, and the output end of the feed rail is connected to the thermal insulation and heating platform , the bottom of the thermal insulation heating platform is equipped with an electric heating sheet, and the surface is embedded with a thermocouple temperature sensor. A rotating fixture is set above to clamp and fix the circuit boards to be sorted. A three-axis slide is set above the rotating fixture, and a camera is used to treat the problems. The chips on the sorting circuit board are identified and positioned. It is set on the Y-axis of the three-axis slide table. The vacuum suction cup is set on the Z-axis of the three-axis slide table. It moves horizontally along the X-axis or moves up and down along the Z-axis through the vacuum. The suction effect adsorbs and sorts the chips; among them: the rotating clamp includes a clamp body, a rotating motor and a telescopic motor; the clamp body is rectangular and includes a parallel clamp fixing rod and a clamp combination fixing rod, a clamp fixing rod and a clamp combination One side of the fixed rod is connected by a linear guide rail, a linear slider is set on the linear guide rail, and the other side is connected by a screw rod. The rotation of the screw rod is driven by a telescopic motor. A screw pair, a linear slider and a screw pair are set on the screw rod. They are connected through the clamp movable rod. The telescopic motor and the rotating motor are installed on the clamp combination fixed rod. A set of shock-absorbing springs are set opposite each other on the clamp fixed rod and the clamp movable rod. The shock-absorbing spring is connected to the clamp buffer and shock-absorbing plate; during operation , the telescopic motor drives the screw rod to rotate and at the same time drives the movement of the clamp's movable rod, which in turn drives the switch of the rotating clamp. The movement of the rotating motor drives the clamp body to flip 180°. 2. The chip intelligent disassembly device according to claim 1, characterized in that the adjustable electric heating plates of the heating processing unit are separated by insulation tiles to achieve adjustable temperature step heating. 3. The chip intelligent disassembly device according to claim 1, characterized in that the heat preservation and heating platform passes through a lifting screw To achieve lifting, the heat preservation and heating platform is installed on the lifting frame above the lifting screw. A positioning optical axis is set parallel to both sides of the lifting screw. An optical axis pair is installed on the positioning optical axis. The optical axis pair is installed on the lifting frame to realize the guiding function. . 4. The chip intelligent disassembly device according to claim 1, characterized in that a vacuum suction cup and a large power supply of more than 125 watts are used. The power vacuum pump is connected, and the vacuum suction cup is equipped with a vacuum detection module. 5. The chip intelligent disassembly device according to claim 1, characterized in that the heating processing unit and the chip disassembly analyzer The selection unit is placed in a semi-sealed stainless steel box, and the box is connected to the exhaust treatment VOCs device. 6. A method based on the chip intelligent disassembly device of claim 1, characterized in that the specific steps are as follows: Arrange the circuit boards to be sorted, determine the dimensions of the circuit boards in the same batch, and adjust the width of the feed guide rail so that the conductive circuit boards can be stuck into the slots on the feed guide rail; import the photo marks of the circuit boards to be sorted into and Feature recognition is performed in the camera host computer software to determine the target sorting chip and positioning identification points; Set the temperature of the output end of the feeding guide rail and the temperature of the insulation heating platform; put the circuit boards to be sorted into the feeding guide rail in turn, start the preparation for heating operation, and when the temperature at the heating end reaches the standard, start the conveyor belt to start feeding; The circuit boards enter the thermal insulation and heating platform in turn, and the rotating clamps clamp and fix the circuit boards. The camera and the host computer software cooperate with the positioning and recognition. The vacuum suction cup on the Z-axis of the three-axis slide accurately absorbs the target chip and implements classified placement. After the front side is disassembled, After the chip, the thermal insulation and heating platform is lowered. After the rotating fixture is flipped 180°, the thermal insulation and heating platform returns to its original position. The camera and the host computer cooperate to reposition and identify. Repeat the above steps to continue to disassemble the target chip on the reverse circuit board. 7. The method according to claim 6, characterized in that a stepped heating system is adopted on the feed guide rail. From the input end to the output end, the control temperature reference parameters are 60°C to 80°C, 130°C to 150°C, and 230°C. ℃ ~ 270 ℃, a total of 3 stages of heating process. 8. The method according to claim 6, characterized in that a stepped heating system is adopted from the input end to the output end on the feed guide rail, and the control temperature reference parameters are 60°C to 80°C, 130°C to 150°C, and 240°C. ~260℃, a total of 3 stages of heating process. 9. The method according to claim 6, characterized in that the temperature of the output end of the feeding guide rail is 230-270°C, and the stable temperature of the heating bottom plate on the thermal insulation heating platform is 235°C-275°C. 10. The method according to claim 6, characterized in that the temperature at the output end of the feed guide rail is 240-260°C, and the stable temperature of the heating bottom plate on the thermal insulation heating platform is 245°C-265°C.