CN114364149B - Intelligent disassembling method and device for waste high-value circuit board chips - Google Patents
Intelligent disassembling method and device for waste high-value circuit board chips Download PDFInfo
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- CN114364149B CN114364149B CN202210057811.XA CN202210057811A CN114364149B CN 114364149 B CN114364149 B CN 114364149B CN 202210057811 A CN202210057811 A CN 202210057811A CN 114364149 B CN114364149 B CN 114364149B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
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Abstract
The application discloses an intelligent disassembling method and device for waste high-value circuit board chips. The device comprises a heating treatment unit and a chip disassembling and sorting unit; the heating processing unit realizes the slow increase of the temperature of the circuit board through the temperature gradient rise, prevents the thermal stress damage caused by overlarge temperature difference, and ensures that the surface temperature of the circuit board can reach a temperature control point with the optimal disassembly effect at a pretreatment outlet through the temperature closed-loop control; the chip disassembly and separation unit comprises a heat-insulation heating platform, a rotary clamp grabs a circuit board entering the heat-insulation heating platform, and a camera determines the specific position of a chip to be disassembled on the circuit board through a locating point of a front-end design. The components are reversely sucked, classified and recovered through the vacuum chuck, so that the purpose of nondestructive disassembly and high-value chip extraction is realized. The application has high degree of automation, high yield of disassembled chips and wide range of circuit board type numbers suitable for disassembling.
Description
Technical Field
The application belongs to the technical field of resources and environments, and particularly relates to an intelligent disassembling method and device for waste high-value circuit board chips.
Background
Along with the intelligent rapid development of mobile phones, people live more and more conveniently. The mobile phone is closely related to various aspects of life and plays an increasingly important role in daily life. IDC statistics of the international known data company show that the global mobile phone sales volume in 2019 is 14.86 hundred million, wherein the total sales volume in China mobile phone market is 3.7 hundred million, and the total sales volume in the world is 24.90%. The industry predicts that the number of mobile phones updated annually in the next few years is up to 4 hundred million, and the number of mobile phones abandoned annually is 1 to 2 hundred million, and about 10 hundred million obsolete mobile phones have been deposited in China before. Compared with a large amount of deposited obsolete mobile phones, the method has the advantages that the resource recovery rate of the obsolete mobile phones in China is less than 2%, and most of obsolete mobile phones in China are recovered in a waste product form, so that the professional recovery chain is few.
The waste circuit board contains Pb and Cr 6+ And various toxic and harmful substances, which belong to dangerous wastes, and serious environmental pollution is caused by improper treatment. The current mainstream method for treating electronic waste is as follows: and (5) intensively disassembling the recovered circuit boards into shells, and then crushing the shells indiscriminately. The subsequent process mainly adopts an acid washing method, a smelting method, a pyrolysis method, a microbiological method, a mechanical method and the like, and metals with higher contents of copper, gold, silver and the like in the PCB can be recovered by the methods. And simultaneously, serious secondary environmental pollution is very easy to cause in the process of refining noble metals.
Research shows that the recycling technology of chips on the PCB is always a research hot spot due to the large quantity, long service life, high reuse value and the like. The life cycle of the chip is far longer than the service cycle of the mobile phone, and the life limit of some chips such as a processor, a flash memory, a baseband, a radio frequency and the like is almost not limited. The chip qualification rate (98%) of standard recovery is even higher than that of a new chip (95%) produced, and the chip in the PCB is disassembled, classified and recovered and reused, so that the economic benefit can be maximized.
The device comprises a small portal frame, a cross sliding table, a vacuum chuck, a six-degree-of-freedom mechanical arm, a storage box, a circuit board to be disassembled, a mechanical arm demonstrator, a bracket, a hot air gun, a vision camera, a conveying roller path, an electric cabinet and the like. The automatic disassembly of key devices on the circuit board is realized mainly through the combined action of the six-degree-of-freedom mechanical arm, the visual camera, the hot air gun and the vacuum chuck. The application can realize the automatic disassembly of specific chips to a certain extent, effectively reduce the labor cost of enterprises and improve the labor production efficiency. However, the method has slow chip disassembling speed (according to the patent, the disassembling time exceeds 40 seconds), and the selection surface of the detachable chip is narrow.
Disclosure of Invention
The application provides an intelligent disassembling method and device for waste high-value circuit board chips, which are used for solving the practical problem of recycling and processing the high-value circuit board chips.
The application provides an intelligent disassembling method and device for waste high-value circuit board chips, which are universal for circuit board chips with small and medium sizes such as common mobile phone mainboards and small computer mainboards. Through the whole heating tin melting, the process of automatic sorting can be greatly improved by centralized disassembly. In the chip disassembling process, parameters are standardized and systematic, so that the quality stability of the disassembled chips can be fully ensured, and the method is suitable for large-scale production in factories. Preferably, the electric heating plate is fixed on the heat insulating tile to prevent a great deal of heat conduction to the surface of the box.
The application provides an intelligent disassembling device for waste high-value circuit board chips, which comprises a heating treatment unit and a chip disassembling and sorting unit; wherein:
the heating treatment unit comprises a feeding guide rail which is erected on the conveyor belt support frame, the feeding guide rail comprises a fixed guide rail which is horizontally arranged and movable guide rails which are vertically arranged above two sides, two ends of the movable guide rail are respectively connected with each other through screw rods, two driving motors are respectively connected with the two screw rods through screw rod pairs, the distance between the two movable guide rails is adjusted by synchronously adjusting the length of the two screw rods, a power-adjustable electric heating plate is uniformly arranged below the fixed guide rail, a conveyor belt is arranged above the fixed guide rail, and a temperature sensor is arranged at the output end of the feeding guide rail;
the chip disassembling and sorting unit comprises a heat preservation and heating platform, a triaxial slipway, a rotary clamp, a camera and a vacuum chuck; the heat-preserving heating platform is a liftable platform and is arranged on the frame, the output end of the feeding guide rail is connected with the heat-preserving heating platform, the bottom of the heat-preserving heating platform is provided with an electric heating sheet, the surface of the heat-preserving heating platform is embedded with a thermocouple temperature sensor, a rotary clamp for clamping and fixing a circuit board to be sorted is arranged above the heat-preserving heating platform, a three-axis sliding table is arranged above the rotary clamp, a camera is used for identifying and positioning a chip on the circuit board to be sorted and is arranged on a Y axis of the three-axis sliding table, a vacuum chuck is arranged on a Z axis of the three-axis sliding table and horizontally moves along an X axis or moves up and down along the Z axis to adsorb and sort the chip through a vacuum suction effect; wherein: the rotary clamp comprises a clamp body, a rotary motor and a telescopic motor; the clamp body is rectangular and comprises a clamp fixing rod and a clamp combination fixing rod which are arranged in parallel, one sides of the clamp fixing rod and the clamp combination fixing rod are connected through a linear guide rail, a linear sliding block is arranged on the linear guide rail, the other sides of the clamp fixing rod and the clamp combination fixing rod are connected through a screw rod, the screw rod is driven by a telescopic motor to rotate, a screw rod pair is arranged on the screw rod, the linear sliding block is connected with the screw rod pair through a clamp movable rod, the telescopic motor and the rotary motor are arranged on the clamp combination fixing rod, a group of damping springs are oppositely arranged on the clamp fixing rod and the clamp movable rod, and the damping springs are connected with a clamp buffering damping plate; when the rotary clamp works, the telescopic motor drives the screw rod to rotate and simultaneously drives the motion of the movable rod of the clamp to drive the switch of the rotary clamp, and the motion of the rotary motor drives the clamp body to turn over by 180 degrees.
In the application, the adjustable electric heating plates of the heating treatment units are separated by the heat insulation tiles so as to realize temperature gradient heating adjustment.
In the application, a step heating system is adopted on the feeding guide rail from the input end to the output end, and the temperature reference parameter is controlled to be 60-80 ℃, 130-150 ℃ and 230-270 ℃. Preferably, the temperature reference parameter is controlled to be 60-80 ℃, 130-150 ℃ and 240-260 ℃.
In the application, the heat-preserving heating platform is lifted by the lifting screw rod, and the heat-preserving heating platform is arranged above the lifting screw rod
The lifting frame is characterized in that two sides of the lifting screw rod are provided with positioning optical axes in parallel, an optical axis pair is arranged on the positioning optical axis, and the optical axis pair is arranged on the lifting frame to realize a guiding function.
In the application, a 125W high-power vacuum suction pump is connected behind the vacuum chuck, the suction force of the tested surface exceeds 20N, the chip is packaged by a conventional BGA, the pulling-out force after the preheating treatment is 5N, and the redundant suction force is enough; the vacuum chuck is internally provided with a vacuum degree detection module, so that the suction leakage in the disassembly and separation process is prevented.
In the application, the heating treatment unit and the chip disassembling and sorting unit are arranged in the semi-sealed stainless steel box body, and the box body is connected with the VOCs device for air extraction treatment, so that the personnel safety can be ensured, and the environmental pollution can be reduced.
The application also provides a method based on the intelligent chip disassembling device, which comprises the following specific steps:
(1) The circuit boards to be sorted are sorted, the outline dimension of the circuit boards in the same batch is determined, and the width of the feeding guide rail is adjusted, so that the conductive circuit board can be clamped into the clamping groove on the feeding guide rail; leading the shooting marks of the circuit boards to be sorted into the upper computer software of the camera to perform characteristic recognition, and determining a target sorting chip and positioning recognition points;
(2) Setting the temperature of the output end of the feeding guide rail and the temperature of the heat preservation and heating platform; sequentially placing the circuit boards to be sorted into a feeding guide rail, starting to prepare for heating operation, enabling the temperature of the tail end to be heated to reach the standard, and starting a conveyor belt to start feeding;
(3) The circuit board sequentially enters the heat-preserving and heating platform, the rotating clamp clamps and fixes the circuit board, the camera and the upper computer are matched for positioning and identification, the vacuum chuck on the Z axis of the three-axis sliding table accurately adsorbs the target chip, classified throwing is implemented, after the front chip is disassembled, the heat-preserving and heating platform descends, the rotating clamp is turned over for 180 degrees, the heat-preserving and heating platform is restored to the original position, the camera and the upper computer are matched for repositioning and identification, the steps are repeated, and the target chip on the back circuit board is continuously disassembled.
In the application, a step heating system is adopted on the feeding guide rail, and the temperature reference parameter is controlled to be 60-80 ℃, 130-150 ℃, 230-270 ℃ from the input end to the output end, and the heating process is carried out in 3 stages; preferably, the reference temperature parameter is controlled to be 60-80 ℃, 130-150 ℃ and 240-260 ℃.
In the application, the temperature of the output end of the feeding guide rail is set to be 230-270 ℃, and the stable temperature of the heating bottom plate on the heat preservation and heating platform is 235-275 ℃. Preferably, the temperature of the output end of the feeding guide rail is 240-260 ℃, and the stable temperature of a heating bottom plate on the heat preservation heating platform is 245-265 ℃.
Compared with the prior art, the application has the beneficial effects that:
1. aiming at the recovery mode of the high-value chip of the traditional circuit board, the application realizes mechanical automatic disassembly of various components and parts, has high chip disassembly perfection rate, and solves the problem of low reutilization rate caused by the difference of manual technical proficiency in the traditional manual chip disassembly process.
2. Aiming at the traditional recovery mode of the high-value chips of the waste circuit boards, the application realizes the purpose of automatic separation and recovery of the disassembled chips. The problems of long labor consumption and low efficiency in the traditional chip recycling process during chip classification are solved.
3. Aiming at the prior art, the application provides an automatic and accurate disassembly and intelligent separation method and device, which can effectively solve the problem of high-value recovery difficulty of chips caused by indiscriminate destructive disassembly at the present stage. Realizes the high-valued recovery and the targeted recycling recovery of the chip.
4. In order to realize the accurate sorting function, the circuit board to be sorted passes through the upper computer software in advance to mark the locating points and the chip characteristic locating units. The high-precision stepping motor is driven by the singlechip, so that the minimum movement precision is 0.01mm. The precise disassembly can be realized for most LGA or BGA packaged chips. Common high-value chips such as a CPU (Central processing Unit) or a memory chip can be disassembled with high precision and classified and recycled.
5. The application can realize the rapid large-scale disassembly of the chip.
Drawings
Fig. 1 is a schematic perspective view of an intelligent disassembling device for waste high-value circuit board chips in the embodiment of the application.
Fig. 2 is a top view of an intelligent disassembling device for waste high-value circuit board chips.
Fig. 3 is a side view of an intelligent disassembling device for waste high-value circuit board chips.
Fig. 4 is a perspective structure diagram of a rotary clamp of the intelligent disassembling device for the waste high-value circuit board chips.
Reference numerals in the drawings: 001-a heat treatment unit; 002-heating mechanism; 003-chip disassembling and sorting unit; 004-rotating a clamp; 005-heat preservation and heating platform; 006-a frame; 007-camera sorting module; 101-a conveyor belt support frame; 102 104-driving a motor; 103-fixing the guide rail; 105-a temperature sensor; 106-a movable guide rail; 201-an electric heating plate; 301-Y axis; 302-X axis; 303-X-axis driving motor of sorting mechanism; 304-a Z-axis driving motor of the sorting mechanism; 305-sorting mechanism first connector; 306-a sorting mechanism second connector; 307-supporting cross beams of the sorting and disassembling mechanism; 308-Y-axis driving motor of sorting mechanism; 309-X axis connection; 401-linear guide rail; 402-linear slides; 403-clamp fixing bar; 404-clamp connection; 405-clamp combined fixing rod; 406-a swivel bearing; 407-telescoping motor; 408-a rotating electric machine; 409-screw rod; 410-screw pair; 411-clamp movable bar; 412-clamp cushioning shock absorbing plate; 413-a shock absorbing spring; 501-heating a bottom plate; 502-supporting frames; 503-lifting frame; 504-an optical axis module; 505-an optical axis positioning module; 506-lifting screw rod.
Detailed Description
The following examples are presented to further illustrate the practice of the application, but are not intended to limit the practice and protection of the application. It should be noted that the following processes, if not specifically described in detail, can be realized or understood by those skilled in the art with reference to the prior art. The reagents or apparatus used were not manufacturer-specific and were considered conventional products commercially available.
An intelligent disassembling device for waste high-value circuit board chips is shown in fig. 1-4, the whole shell of the intelligent disassembling device is a semi-sealing mechanism, an air extractor is arranged at the discharge end of the intelligent disassembling device, VOCS (volatile organic compounds) gas generated by a heating circuit board is sucked into an active carbon adsorption tank for adsorption treatment, so that environmental pollution can be avoided, and the safety of site operators can be greatly protected. Specifically, the device comprises a heating processing unit 001 and a chip disassembling and sorting unit 003. Wherein the heat treatment unit 001 includes a conveying mechanism, a heating mechanism, a temperature control mechanism, and the like. The chip disassembling and sorting unit 003 comprises a clamping mechanism, a heat preservation mechanism, an identification mechanism, a grabbing mechanism, a feeding and collecting device and a control module.
In the heat treatment unit 001, a conveying mechanism includes a fixed rail 103, movable rails 106 provided on both sides, and a conveyor belt on the fixed rail 103, the conveying mechanism being provided on the conveyor belt support frame 101; first, the circuit boards to be processed are batched and classified, so that the circuit boards of the same type are arranged in the fixed guide rail 103, and the process is a feeding pretreatment stage. The guide rail of transmission circuit board passes through both ends lead screw, two driving motor 102, 104 combined action automatically regulated movable guide rail 106's width, ensures that different circuit board sizes homoenergetic get into the transmission groove in order, and its design maximum width is: 400mm. The circuit board is supported by the conveying belt through the clamping groove on the guide rail to slowly feed the chip disassembling and sorting unit 003. Meanwhile, the structure is sealed by a stainless steel plate, and the tail part is provided with a device for exhausting and treating VOCS volatile organic compounds. The heating treatment unit 001 comprises a heating mechanism 002, the heating mechanism 002 adopts an electric heating plate 201, the electric heating plate 201 is uniformly distributed below the fixed guide rail 103 and is separated by a heat insulation tile, the adjustable heating of temperature steps is realized, the reference temperature parameters of the step heating control are 60 ℃ to 80 ℃,130 ℃ to 150 ℃,230 ℃ to 270 ℃, and the heating process of 3 stages is totally carried out; the junction of the heating processing unit 001 and the chip disassembling and sorting unit 003 is additionally provided with a temperature sensor 105 serving as a temperature control mechanism for feeding back the actual temperature at the outlet of the circuit board in real time, and once the actual temperature is lower than or exceeds a warning value, a stop alarm is triggered, so that the solder on all the preprocessed circuit boards is completely melted, and the chips are not damaged by high temperature. The embodiment realizes the closed-loop accurate adjustment of the temperature gradient through PID control, ensures the safe and controllable heating process, avoids the damage of the chip due to overhigh local temperature and the loss of disassembly and recovery values, and simultaneously ensures that the air at the inlet forms negative pressure without leakage of polluted gas through the suction effect of the air extractor.
In the chip disassembling and sorting unit 003, the preheated circuit board is pushed into the heat-preserving and heating platform 005 by the feeding guide rail, the heat-preserving and heating platform 005 is arranged above the frame 006, the circuit board is fixed by a rotary clamp 004 in the platform, and meanwhile, the clamp realizes a 180-degree turn-over function through a rotary motor 408, and can also realize disassembly for a double-layer main board; the camera is used for determining the specific position of the chip to be disassembled on the circuit board through the positioning point designed in advance, and reversely absorbing, classifying and recycling each component through the grabbing mechanism. The heat preservation heating platform 005 rear side is provided with stainless steel classification collection box, and the chip of all kinds of needs on the circuit board is unified classification collection, and the abandoned circuit board of disassembling also gets into the collection box through the next door guide slot, waits for other processes to utilize.
The clamping structure in the chip disassembling and sorting unit 003 adopts a rotary clamp 004, and the rotary clamp 004 mainly comprises a clamp part and a motion driving part. The clamp mainly comprises a linear guide rail 401, a linear slide block 402, a clamp fixing rod 403, a supporting connecting piece 404, a clamp combination fixing rod 405, a clamp movable rod 411, a clamp buffer damping plate 412 and a damping spring 413, which jointly form a mechanical movable part of the rotary clamp. The motion driving part mainly drives the screw rod 409 to rotate by the telescopic motor 407, and the screw rod pair 410 and the clamp movable rod 411 are connected to move together while the screw rod rotates, so that the purpose of telescopic clamping is realized. Meanwhile, in order to realize the overturning function of the clamp, the whole structure is driven by the rotating motor 408, and in consideration of moment balance, the stability of mechanical action is realized by adding the rotating bearing 406 at the joint of the motor and the clamp component.
In order to prevent solder solidification phenomenon during cooling in the disassembling and sorting process, a heat preservation mechanism is arranged in the chip disassembling and sorting unit 003, specifically, an electric heating plate is additionally arranged at the bottom of a heat preservation and heating platform 005, a thermocouple temperature sensor is embedded on the surface (a heating bottom plate 501), closed-loop control of temperature is realized, the stability of the temperature of the heat preservation and heating platform is ensured, and the heat preservation function is realized; in addition, in order to avoid the interference of the heating platform to the movement path of the rotary clamp 004 in the movement process of the heat-preserving heating platform 005, the heat-preserving heating platform 005 is provided with a lifting function. When the lifting screw rod 506 of the heat preservation heating platform 005 rotates, the heating bottom plate 501 is driven to synchronously lift or descend. To ensure stability of the motion, the positioning optical axis 504 is additionally arranged on two sides. The optical axis pair 505 is fixed on the lifting frame 503 to realize a guiding function, and the heat preservation heating platform 005 is connected with the lifting frame through the supporting frame 502.
The recognition mechanism in the chip disassembling and sorting unit 003 adopts a camera sorting module 007, namely a camera for processing, and the upper computer adopts OPEN PNP software to carry out motion control in cooperation with a motion control card. But are not limited to, other control software or programs, control cards. The linear motion modules such as the synchronous belt and the synchronous wheel are not limited to other forms, such as a ball screw matched with a servo motor.
The grabbing mechanism in the chip disassembling and sorting unit 003 is a vacuum chuck, a high-power vacuum suction pump is connected behind the vacuum chuck, the suction force of the tested surface exceeds 20N, the chip is packaged by a conventional BGA, the pulling force after the preheating treatment is 5N, and the redundant suction force is enough; the vacuum chuck is internally provided with a vacuum degree detection module, so that the suction leakage in the disassembly and separation process is prevented. The vacuum chuck is arranged on a three-axis sliding table, the X-axis 302, the Y-axis 301, the Z-axis, an X-axis connecting piece 309 and the like form the three-axis sliding table together, the three-axis sliding table is operated by auxiliary motions of a sorting mechanism X-axis driving motor 303, a sorting mechanism Y-axis driving motor 308 and a sorting mechanism Z-axis driving motor 304, a final chip disassembling and sorting unit 003 accurately identifies and positions by using a camera, and the chips on a circuit board to be sorted are accurately pulled out and sorted by means of vacuum suction by means of the three-axis sliding table driving vacuum chuck.
The control module comprises OPEN PNP software with an OPEN source, and identifies the appearance characteristics of the components and parts through the lower camera and performs motion control on the grabbing mechanism. When the appearance characteristics of the components are identified, an OPEN source OPEN CV source code library is adopted as visual identification software to process image information. The specific position structure of the visual positioning circuit board is used for marking the position of the target detaching chip in advance, so that the purpose of directional detaching is realized.
The intelligent disassembling device for the waste high-value circuit board chips comprises the following specific implementation steps:
(1) firstly, after the collection and treatment of the circuit boards to be treated are finished in different types, the circuit boards with the same type are sequentially arranged in a supply chain, and test work can be carried out after finalization by a series of actions of debugging the width, heating temperature, disassembling the width and the like of the circuit boards in advance.
(2) The disassembled circuit board chip can be subjected to sampling detection to judge the appearance of the chip and the signal pin is good, and even through an X-ray shooting internal circuit and the like, the continuous nondestructive disassembly and high-value recovery of the chip are realized.
The application realizes full-process automation, protects the environment through semi-sealed fixed assembly line operation, can greatly improve the recovery yield of disassembled chips through a standardized process, has high economic value and no obvious pollution to the environment, and is suitable for industrial application.
The foregoing is merely illustrative of the embodiments of this application and it will be appreciated by those skilled in the art that variations and modifications may be made without departing from the principles of the application, and it is intended to cover all modifications and variations as fall within the scope of the application.
Example 1
And 3 positioning points on the surface of the main board are led into an upper computer of the rear end chip disassembling and sorting unit 003 after the width of the feeding movable guide rail 106 is adjusted to 66mm by taking the main board chip (Hua) as a disassembling target, and meanwhile, the positions of the CPU and the memory chips of the main board are marked by a metal shielding cover on the upper part of the CPU chip of the main board. First, the temperature of the temperature sensor 105 at the outlet of the heat treatment unit 001 was set to 230 ℃, and the temperature of the heating floor 501 of the heat retaining heating platform 005 was set to 235 ℃. The mobile phone main boards are sequentially placed in the fixed guide rail 103, and the mobile phone main boards are started to be ready for heating operation. And after the temperature of the heating tail end reaches the standard and the indicator lamp becomes bright, starting the conveyor belt to start feeding. The circuit board gets into rear end heat preservation heating platform 005 in proper order, and rotatory anchor clamps 004 centre gripping is fixed, and camera sorting module 007 location discernment, and vacuum chuck accurately adsorbs the target chip to carry out categorised input, after disassembling positive chip, heat preservation heating platform 005 can descend 200mm automatically through lift lead screw 506, and rotatory anchor clamps 004 upset 180 back, heat preservation heating platform 005 resumes the normal position, and the vision camera is repositioned, repeats above-mentioned step, continues to disassemble the target chip on the reverse side circuit board. Through the steps, the metal shielding cover of the CPU which is the P90 main board chip is successfully pulled out, but the chip cannot be pulled out.
Example 2
And 3 positioning points on the surface of the main board are led into an upper computer of the rear end chip disassembling and sorting unit 003 after the width of the feeding movable guide rail 106 is adjusted to 66mm by taking the main board chip (Hua) as a disassembling target, and meanwhile, the positions of the CPU and the memory chips of the main board are marked by a metal shielding cover on the upper part of the CPU chip of the main board. First, the temperature 105 at the outlet of the heat treatment unit 001 was set to 240℃and the temperature of the heating floor 501 of the heat-retaining heating stage 005 was set to 245 ℃. The mobile phone main boards are sequentially placed in the fixed guide rail 103, and the mobile phone main boards are started to be ready for heating operation. And after the temperature of the heating tail end reaches the standard and the indicator lamp becomes bright, starting the conveyor belt to start feeding. The circuit board gets into rear end heat preservation heating platform 005 in proper order, and rotatory anchor clamps 004 centre gripping is fixed, and camera sorting module 007 location discernment, and vacuum chuck accurately adsorbs the target chip to carry out categorised input, after disassembling positive chip, heat preservation heating platform 005 can descend 200mm automatically through lift lead screw 506, and rotatory anchor clamps 004 upset 180 back, heat preservation heating platform 005 resumes the normal position, and the vision camera is repositioned, repeats above-mentioned step, continues to disassemble the target chip on the reverse side circuit board. Through the steps, the metal shielding cover of the CPU which is the P90 main board chip is successfully pulled out, but part of chips cannot be pulled out.
Example 3
And 3 positioning points on the surface of the main board are led into an upper computer of the rear end chip disassembling and sorting unit 003 after the width of the feeding movable guide rail 106 is adjusted to 66mm by taking the main board chip (Hua) as a disassembling target, and meanwhile, the positions of the CPU and the memory chips of the main board are marked by a metal shielding cover on the upper part of the CPU chip of the main board. First, the temperature of the temperature sensor 105 at the outlet of the heat treatment unit 001 was set to 250 ℃, and the temperature of the heating floor 501 of the heat retaining heating platform 005 was set to 255 ℃. The mobile phone main boards are sequentially placed in the fixed guide rail 103, and the mobile phone main boards are started to be ready for heating operation. And after the temperature of the heating tail end reaches the standard and the indicator lamp becomes bright, starting the conveyor belt to start feeding. The circuit board gets into rear end heat preservation heating platform 005 in proper order, and rotatory anchor clamps 004 centre gripping is fixed, and camera sorting module 007 location discernment, and vacuum chuck accurately adsorbs the target chip to carry out categorised input, after disassembling positive chip, heat preservation heating platform 005 can descend 200mm automatically through lift lead screw 506, and rotatory anchor clamps 004 upset 180 back, heat preservation heating platform 005 resumes the normal position, and the vision camera is repositioned, repeats above-mentioned step, continues to disassemble the target chip on the reverse side circuit board. Through the steps, the metal shielding cover of the CPU which is the P90 main board chip is successfully pulled out, and the target chip is completely pulled out.
Example 4
And 3 positioning points on the surface of the main board are led into an upper computer of the rear end chip disassembling and sorting unit 003 after the width of the feeding movable guide rail 106 is adjusted to 66mm by taking the main board chip (Hua) as a disassembling target, and meanwhile, the positions of the CPU and the memory chips of the main board are marked by a metal shielding cover on the upper part of the CPU chip of the main board. First, the temperature of the temperature sensor 105 at the outlet of the heat treatment unit 001 was set to 260 ℃, and the temperature of the heating floor 501 of the heat-retaining heating stage 005 was set to 265 ℃. The mobile phone main boards are sequentially placed in the fixed guide rail 103, and the mobile phone main boards are started to be ready for heating operation. And after the temperature of the heating tail end reaches the standard and the indicator lamp becomes bright, starting the conveyor belt to start feeding. The circuit board gets into rear end heat preservation heating platform 005 in proper order, and rotatory anchor clamps 004 centre gripping is fixed, and camera sorting module 007 location discernment, and vacuum chuck accurately adsorbs the target chip to carry out categorised input, after disassembling positive chip, heat preservation heating platform 005 can descend 200mm automatically through lift lead screw 506, and rotatory anchor clamps 004 upset 180 back, heat preservation heating platform 005 resumes the normal position, and the vision camera is repositioned, repeats above-mentioned step, continues to disassemble the target chip on the reverse side circuit board. Through the steps, the metal shielding cover of the CPU of the P90 main board chip is successfully pulled out, the target chip is completely pulled out, and the surface of the chip is deformed to a certain extent
Example 5
And 3 positioning points on the surface of the main board are led into an upper computer of the rear end chip disassembling and sorting unit 003 after the width of the feeding movable guide rail 106 is adjusted to 66mm by taking the main board chip (Hua) as a disassembling target, and meanwhile, the positions of the CPU and the memory chips of the main board are marked by a metal shielding cover on the upper part of the CPU chip of the main board. First, the temperature of the temperature sensor 105 at the outlet of the heat treatment unit 001 was set to 270 ℃, and the temperature of the heating floor 501 of the heat-retaining heating stage 005 was set to 275 ℃. The mobile phone main boards are sequentially placed in the fixed guide rail 103, and the mobile phone main boards are started to be ready for heating operation. And after the temperature of the heating tail end reaches the standard and the indicator lamp becomes bright, starting the conveyor belt to start feeding. The circuit board gets into rear end heat preservation heating platform 005 in proper order, and rotatory anchor clamps 004 centre gripping is fixed, and camera sorting module 007 location discernment, and vacuum chuck accurately adsorbs the target chip to carry out categorised input, after disassembling positive chip, heat preservation heating platform 005 can descend 200mm automatically through lift lead screw 506, and rotatory anchor clamps 004 upset 180 back, heat preservation heating platform 005 resumes the normal position, and the vision camera is repositioned, repeats above-mentioned step, continues to disassemble the target chip on the reverse side circuit board. Through the steps, the metal shielding cover of the CPU of the P90 main board chip is successfully pulled out, the target chip is completely pulled out, the surface of the chip is deformed to a certain extent, part of contacts drop, and the chip is obviously damaged.
Table 1 shows the statistics of the temperatures at the heating outlet at the time of disassembly of the respective examples. Experiments prove that in the embodiment 3, the complete disassembly is realized under the condition that the temperature of the heating end is 250 ℃ and the temperature of the heat preservation heating platform is 255 ℃, no obvious damage is caused by appearance inspection, and the special test board can be used for normal reading and writing after the ball is planted again, and the damage is not caused. Compared with single disassembly of the patent CN113613403A, the disassembly speed of the scheme is more than 5 times of that of the single-board to-be-disassembled chips, and the number of the chips to be disassembled of the single-board is increased.
Experimental results of examples 1 to 5 are shown in table 1:
| sequence number | Heating outlet temperature | Temperature of heat-preserving heating platform | Disassembly condition | Chip health |
| Example 1 | 230 | 235 | And the shielding cover is removed, and the chip is not removed. | Intact (good) |
| Example 2 | 240 | 245 | And (5) removing the shielding case and partially removing the chip. | Intact (good) |
| Example 3 | 250 | 255 | And (5) removing the metal shielding cover and removing the chip. | Intact (good) |
| Example 4 | 260 | 265 | And (5) removing the metal shielding cover and removing the chip. | Slightly deformed surface |
| Example 5 | 270 | 275 | And (5) removing the metal shielding cover and removing the chip. | Obvious damage to |
The above examples are only preferred and inferior embodiments of the present application, and are merely for illustrating the present application, not for limiting the present application, and those skilled in the art should not be able to make any changes, substitutions, modifications, etc. without departing from the spirit of the present application.
Claims (10)
1. The intelligent disassembling device for the waste high-value circuit board chips is characterized by comprising a heating treatment unit and a chip disassembling and sorting unit; wherein:
the heating treatment unit comprises a feeding guide rail which is erected on the conveyor belt support frame, the feeding guide rail comprises a fixed guide rail which is horizontally arranged and movable guide rails which are vertically arranged above two sides, two ends of the movable guide rail are respectively connected with each other through screw rods, two driving motors are respectively connected with the two screw rods through screw rod pairs, the distance between the two movable guide rails is adjusted by synchronously adjusting the length of the two screw rods, a power-adjustable electric heating plate is uniformly arranged below the fixed guide rail, a conveyor belt is arranged above the fixed guide rail, and a temperature sensor is arranged at the output end of the feeding guide rail;
the chip disassembling and sorting unit comprises a heat preservation and heating platform, a triaxial slipway, a rotary clamp, a camera and a vacuum chuck; the heat-preserving heating platform is a liftable platform and is arranged on the frame, the output end of the feeding guide rail is connected with the heat-preserving heating platform, the bottom of the heat-preserving heating platform is provided with an electric heating sheet, the surface of the heat-preserving heating platform is embedded with a thermocouple temperature sensor, a rotary clamp for clamping and fixing a circuit board to be sorted is arranged above the heat-preserving heating platform, a three-axis sliding table is arranged above the rotary clamp, a camera is used for identifying and positioning a chip on the circuit board to be sorted and is arranged on a Y axis of the three-axis sliding table, a vacuum chuck is arranged on a Z axis of the three-axis sliding table and horizontally moves along an X axis or moves up and down along the Z axis to adsorb and sort the chip through a vacuum suction effect; wherein: the rotary clamp comprises a clamp body, a rotary motor and a telescopic motor; the clamp body is rectangular and comprises a clamp fixing rod and a clamp combination fixing rod which are arranged in parallel, one sides of the clamp fixing rod and the clamp combination fixing rod are connected through a linear guide rail, a linear sliding block is arranged on the linear guide rail, the other sides of the clamp fixing rod and the clamp combination fixing rod are connected through a screw rod, the screw rod is driven by a telescopic motor to rotate, a screw rod pair is arranged on the screw rod, the linear sliding block is connected with the screw rod pair through a clamp movable rod, the telescopic motor and the rotary motor are arranged on the clamp combination fixing rod, a group of damping springs are oppositely arranged on the clamp fixing rod and the clamp movable rod, and the damping springs are connected with a clamp buffering damping plate; when the rotary clamp works, the telescopic motor drives the screw rod to rotate and simultaneously drives the motion of the movable rod of the clamp to drive the switch of the rotary clamp, and the motion of the rotary motor drives the clamp body to turn over by 180 degrees.
2. The intelligent chip disassembling device according to claim 1, wherein the adjustable electric heating plates of the heating processing units are separated by heat insulating tiles so as to realize temperature gradient heating adjustment.
3. The intelligent chip disassembling device according to claim 1, wherein the heat-preserving and heating platform is provided with a lifting screw rod
Realize going up and down, heat preservation heating platform installs on the crane of lift lead screw top, and the both sides parallel arrangement of lift lead screw fixes a position the optical axis, sets up the optical axis on the location optical axis and vice install on the crane in order to realize the direction function.
4. The intelligent chip disassembling device according to claim 1, wherein the vacuum chuck and the large area of 125 watts or more
The power vacuum pump is connected, and the vacuum chuck is internally provided with a vacuum degree detection module.
5. The intelligent chip disassembling device according to claim 1, wherein the heating processing unit and the chip disassembling part
The selecting unit is arranged in a semi-sealed stainless steel box body, and the box body is connected with the VOCs device for air extraction treatment.
6. A method based on the intelligent chip disassembling device as claimed in claim 1, characterized by comprising the following specific steps:
the circuit boards to be sorted are sorted, the outline dimension of the circuit boards in the same batch is determined, and the width of the feeding guide rail is adjusted, so that the conductive circuit board can be clamped into the clamping groove on the feeding guide rail; leading the shooting marks of the circuit boards to be sorted into the upper computer software of the camera to perform characteristic recognition, and determining a target sorting chip and positioning recognition points;
setting the temperature of the output end of the feeding guide rail and the temperature of the heat preservation and heating platform; sequentially placing the circuit boards to be sorted into a feeding guide rail, starting to prepare for heating operation, enabling the temperature of the tail end to be heated to reach the standard, and starting a conveyor belt to start feeding;
the circuit board sequentially enters the heat-preserving and heating platform, the rotating clamp clamps and fixes the circuit board, the camera and the upper computer are matched for positioning and identification, the vacuum chuck on the Z axis of the three-axis sliding table accurately adsorbs the target chip, classified throwing is implemented, after the front chip is disassembled, the heat-preserving and heating platform descends, the rotating clamp is turned over for 180 degrees, the heat-preserving and heating platform is restored to the original position, the camera and the upper computer are matched for repositioning and identification, the steps are repeated, and the target chip on the back circuit board is continuously disassembled.
7. The method of claim 6, wherein a step heating system is used on the feed rail, and the temperature reference parameter is controlled to be 60 ℃ to 80 ℃,130 ℃ to 150 ℃ and 230 ℃ to 270 ℃ from the input end to the output end, and the heating process is performed in 3 stages.
8. The method of claim 6, wherein a step heating system is used on the feed rail from the input end to the output end, wherein the step heating system controls the temperature reference parameter to be 60 ℃ to 80 ℃,130 ℃ to 150 ℃ and 240 ℃ to 260 ℃ for a total of 3 stages of heating processes.
9. The method of claim 6, wherein the temperature at the output end of the feed rail is 230-270 ℃ and the stabilizing temperature of the heated floor on the insulated heating platform is 235-275 ℃.
10. The method of claim 6, wherein the temperature at the output end of the feed rail is 240-260 ℃ and the stabilizing temperature of the heated floor on the insulated heating platform is 245-265 ℃.
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| CN116037606A (en) * | 2022-12-08 | 2023-05-02 | 东信和平科技股份有限公司 | Smart card chip take-out device |
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| CN113613403A (en) * | 2021-07-16 | 2021-11-05 | 上海第二工业大学 | Automatic disassembling device and method for key devices of circuit board of mobile terminal |
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