CN114361087A - Feeding module and die bonder with same - Google Patents

Feeding module and die bonder with same Download PDF

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Publication number
CN114361087A
CN114361087A CN202111642290.6A CN202111642290A CN114361087A CN 114361087 A CN114361087 A CN 114361087A CN 202111642290 A CN202111642290 A CN 202111642290A CN 114361087 A CN114361087 A CN 114361087A
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CN
China
Prior art keywords
push rod
module
feeding
plate
base
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Pending
Application number
CN202111642290.6A
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Chinese (zh)
Inventor
喻泷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Semipeak Technology Co ltd
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Shenzhen Semipeak Technology Co ltd
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Publication date
Application filed by Shenzhen Semipeak Technology Co ltd filed Critical Shenzhen Semipeak Technology Co ltd
Priority to CN202111642290.6A priority Critical patent/CN114361087A/en
Publication of CN114361087A publication Critical patent/CN114361087A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers

Abstract

The application relates to a material loading module and have its solid brilliant machine, wherein, the material loading module includes: a feeding base; the pushing assembly comprises a pushing mounting frame structure, a material box gripper structure and a push rod structure, the pushing mounting frame structure is mounted on the feeding base, and the material box gripper structure is movably mounted on the pushing mounting frame structure; the push rod structure comprises a push rod base, a push rod mounting seat, a driving piece, a first spring and a push rod, the push rod base is installed on the material box gripper structure, the driving piece and the push rod mounting seat are arranged on the push rod base in a sliding mode, the push rod is installed on the push rod mounting seat, the driving piece is connected with the push rod mounting seat through the first spring, and when the push rod meets resistance larger than preset resistance, the driving piece and the push rod mounting seat move relatively. The technical scheme of this application has solved the solid brilliant machine among the prior art effectively when the material loading, because the card dies and the problem of the support plate damage that causes when propelling movement support plate.

Description

Feeding module and die bonder with same
Technical Field
The application relates to the technical field of die bonder, in particular to a feeding module and a die bonder with the same.
Background
Modern electronic information technology is rapidly developed, and increasingly high requirements are put forward on miniaturization, portability, multiple functions, high reliability, low cost and the like of electronic products. At present, electronic packaging is relatively independent in order to meet the requirements of various electronic products, and gradually gets rid of the subordinate status as the post-process of microelectronic manufacturing, various packaging technologies are developed aiming at the special requirements of various electronic products, and a large number of new theories, new materials, new processes, new equipment and new electronic products are developed; electronic package testing technology is driving the development of information-oriented society together with chip design and manufacture.
Among the prior art, solid brilliant machine promotes the support plate through the push rod when the material loading, but screens scheduling problem often can appear in the support plate, and the push rod continues to impel forward this moment, and the support plate can take place to damage, and the support plate that does not discover gets into the process under and can cause bigger potential safety hazard.
Disclosure of Invention
The application provides a material loading module and have its solid brilliant machine to solve the solid brilliant machine among the prior art when material loading, because the card is dead and the problem of the support plate damage that causes when propelling movement support plate.
To achieve the above object, in one aspect, the present application provides a feeding module, including: a feeding base; the pushing assembly comprises a pushing mounting frame structure, a material box gripper structure and a push rod structure, the pushing mounting frame structure is mounted on the feeding base, and the material box gripper structure is movably mounted on the pushing mounting frame structure; the push rod structure comprises a push rod base, a push rod mounting seat, a driving piece, a first spring and a push rod, the push rod base is installed on the material box gripper structure, the driving piece and the push rod mounting seat are arranged on the push rod base in a sliding mode, the push rod is installed on the push rod mounting seat, the driving piece is connected with the push rod mounting seat through the first spring, and when the push rod meets resistance larger than preset resistance, the driving piece and the push rod mounting seat move relatively.
Furthermore, the feeding module further comprises a power assembly, and the power assembly is connected with the driving piece to drive the driving piece to slide on the push rod base.
Furthermore, the feeding module further comprises an alarm assembly, the alarm assembly comprises a sensing piece, a photoelectric sensor and an alarm, the sensing piece and the photoelectric sensor are respectively installed on the driving piece and the push rod installation seat, and the sensing piece corresponds to the photoelectric sensor when the driving piece and the push rod installation seat move relative to each other for a preset distance so that the alarm gives an alarm.
Further, the driving piece is a driving plate, the driving plate is provided with a groove, and the push rod mounting seat is at least partially positioned in the groove.
Further, the push rod structure still includes the second spring and keeps off the position board, and the second spring is installed on the push rod mount pad, keeps off the position board and rotationally installs on the push rod mount pad, and the push rod is located the one side of keeping away from the second spring that keeps off the position board, and the one side that keeps off the position board towards the second spring has the slot, and the second spring has the position of keeping off the position that the slot was left to the second spring and dodges the position, and when keeping off the position board and being in dodging the position, the push rod can be followed the push rod mount pad and demolishd.
Further, a vertical slide rail structure is arranged between the material box gripper structure and the material pushing mounting frame structure, so that the material box gripper structure can move in the vertical direction.
Further, the feeding module further comprises a feeding box conveying assembly, the feeding box conveying assembly comprises a width adjusting structure, the width adjusting structure comprises a feeding baffle, a feeding slide rail and a feeding screw rod, the feeding baffle, the feeding slide rail and the feeding screw rod are arranged on two sides of the feeding base, two ends of the feeding screw rod are connected with the feeding baffle on two sides of the feeding base respectively, and the feeding slide rail is arranged on the feeding baffle in a penetrating mode.
Further, magazine conveying assembly still includes the conveyer belt structure, and the conveyer belt structure sets up on the material loading base.
Further, the feeding module further comprises an empty material box placing part, and the empty material box placing part is located on the feeding base and located on the upper portion of the material box conveying assembly.
On the other hand, the application also provides a die bonder which comprises a feeding module, wherein the feeding module is the feeding module.
Further, the die bonder further comprises: a mounting bracket module; the glue dispensing module is arranged on the mounting frame module; the material waiting module is arranged on the mounting frame module; the die bonding module is arranged on the mounting frame module and comprises a die bonding head structure and a mechanical arm structure, the mechanical arm structure is arranged on the mounting frame module, the die bonding head structure is arranged on the mechanical arm structure, and the mechanical arm structure can drive the die bonding head structure to move; the blanking module is arranged on the mounting frame module; the conveying module is arranged on the mounting frame module and can drive the carrier plate to move on the dispensing module, the material waiting module, the die bonding module and the blanking module; the feeding module is positioned on one side of the dispensing module far away from the die bonding module.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
the technical scheme of this application, in the material loading, the driving piece drives the push rod mount pad and removes, and the push rod mount pad drives the push rod and removes, when the push rod promoted the support plate and meet and be greater than predetermined resistance, the driving piece continues to move forward, because driving piece and push rod mount pad link to each other through first spring, first spring is through tensile like this, can not continue to move forward, and then can not damage the support plate, and the staff can take measures to handle, protection support plate that like this can be fine. The technical scheme of this application has solved the solid brilliant machine among the prior art effectively when the material loading, because the card dies and the problem of the support plate damage that causes when propelling movement support plate.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 shows a schematic perspective structure of a feeding module according to an embodiment of the present application;
FIG. 2 shows a schematic view of another angle of the loading module of FIG. 1;
FIG. 3 shows a schematic structural view of the putter structure of FIG. 1;
fig. 4 shows a schematic perspective structure diagram of a die bonder in an embodiment of the present application;
FIG. 5 is a schematic view showing a flow channel structure of the die bonder of FIG. 4;
FIG. 6 shows a schematic view of a first platen configuration of the die bonder of FIG. 4;
FIG. 7 is a schematic view of a flow channel driving structure of the die bonder of FIG. 4;
FIG. 8 is a partially enlarged schematic view of a die attach module of the die attach machine of FIG. 4;
FIG. 9 shows a mating view of a die attach module of the die attach machine of FIG. 4;
FIG. 10 is a schematic diagram of a solid crystal head storage structure of the solid crystal module of FIG. 9;
FIG. 11 is a schematic diagram showing a die attach structure of the die attach machine of FIG. 4;
fig. 12 shows a schematic view of a die attach head of the die attach structure of fig. 11.
Wherein the figures include the following reference numerals:
10. a mounting bracket module; 11. a base assembly; 12. a guide rail assembly; 13. a flow channel assembly; 131. a limiting support frame structure; 132. a flow channel driving structure; 20. a dispensing module; 30. a material waiting module; 40. a die bonding module; 41. a die bonding head structure; 411. a die bonding head; 412. a die attach head connecting base; 42. a mechanical arm structure; 43. a solid crystal head storage structure; 50. a blanking module; 60. a delivery module; 70. a first platen structure; 71. a first platen; 72. a second elastic member; 80. a first top plate structure; 90. a feeding module; 91. a feeding base; 92. a material pushing assembly; 921. a material pushing mounting frame structure; 922. a material box gripper structure; 923. a push rod structure; 9231. a push rod base; 9232. a push rod mounting seat; 9233. a drive member; 9234. a first spring; 9235. a push rod; 9236. a second spring; 9237. a stop plate; 93. a power assembly; 94. a cartridge delivery assembly.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1 to 3, the feeding module of the present embodiment includes: a feeding base 91 and a pushing assembly 92. The material pushing assembly 92 comprises a material pushing mounting frame structure 921, a material box gripping structure 922 and a push rod structure 923, the material pushing mounting frame structure 921 is mounted on the material feeding base 91, and the material box gripping structure 922 is movably mounted on the material pushing mounting frame structure 921. The push rod structure 923 includes push rod base 9231, push rod mount pad 9232, driving piece 9233, first spring 9234 and push rod 9235, push rod base 9231 installs on magazine tongs structure 922, driving piece 9233 and the equal slidable of push rod mount pad 9232 set up on push rod base 9231, push rod 9235 installs on push rod mount pad 9232, driving piece 9233 links to each other through first spring 9234 with push rod mount pad 9232, when push rod 9235 runs into and is greater than predetermined resistance, driving piece 9233 and push rod mount pad 9232 move relatively.
The technical scheme of this embodiment, in the material loading, driving piece 9233 drives push rod mount pad 9232 and removes, push rod mount pad 9232 drives push rod 9235 and removes, when push rod 9235 promoted the support plate and meet when being greater than predetermined resistance, driving piece 9233 continues to move forward, because driving piece 9233 and push rod mount pad 9232 link to each other through first spring 9234, first spring 9234 is through stretching like this, can not continue to move forward, and then can not damage the support plate, the staff can take measures to handle, the protection support plate that can be fine like this. The technical scheme of this embodiment has solved the solid crystal machine among the prior art effectively when the material loading, because the card is dead and the problem of the support plate damage that causes when propelling movement support plate.
As shown in fig. 3, in the technical solution of this embodiment, the feeding module further includes a power assembly 93, and the power assembly 93 is connected to the driving member 9233 to drive the driving member 9233 to slide on the push rod base 9231. The power assembly 93 may be a hydraulic structure, an electric push rod structure, or a pneumatic structure, and the present embodiment is a pneumatic structure. The structure is compact and the operation is convenient.
As shown in fig. 1 to 3, in the technical solution of this embodiment, the feeding module further includes an alarm component, the alarm component includes a sensing piece, a photoelectric sensor and an alarm, the sensing piece and the photoelectric sensor are respectively installed on the driving piece 9233 and the push rod mounting seat 9232, and the sensing piece corresponds to the photoelectric sensor when the driving piece 9233 and the push rod mounting seat 9232 move relatively by a predetermined distance, so that the alarm gives an alarm. The alarm assembly ensures that an operator can find a fault in time for processing, so that the safety of the feeding module 90 is greatly improved.
As shown in fig. 3, in the solution of this embodiment, the driving member 9233 is a driving plate, the driving plate has a groove, and the push rod mounting seat 9232 is at least partially located in the groove. The structure can form a good limiting effect on the push rod mounting seat 9232. The groove is simple and convenient to arrange and low in cost.
As shown in fig. 3, in the technical solution of this embodiment, the push rod structure 923 further includes a second spring 9236 and a stop plate 9237, the second spring 9236 is installed on the push rod installation seat 9232, the stop plate 9237 is rotatably installed on the push rod installation seat 9232, the push rod 9235 is located on one side of the stop plate 9237 away from the second spring 9236, one side of the stop plate 9237 facing the second spring 9236 has a slot, the second spring 9236 has a stop position inserted into the slot and an avoiding position where the second spring 9236 leaves the slot, and when the stop plate 9237 is in the avoiding position, the push rod 9235 can be detached from the push rod installation seat 9232. The second spring 9236 and the stop plate 9237 are arranged to ensure that maintenance and repair can be carried out when clamping and the like are met. The stop plate is a stop block, and stop rods are all available.
As shown in fig. 1 to 3, in the technical solution of this embodiment, a vertical slide rail structure is further disposed between the magazine gripper structure 922 and the material pushing mounting rack structure 921, so that the magazine gripper structure 922 can move in the vertical direction. Above-mentioned structure makes things convenient for reciprocating of magazine tongs structure 922, and reciprocating of this embodiment includes two aspects: firstly, the magazine tongs structure 922 moves upwards after grabbing the magazine, and secondly, the magazine tongs structure 922 gradually rises along with the release of support plate one deck.
As shown in fig. 1 and fig. 2, in the technical scheme of this embodiment, the feeding module further includes a material box conveying assembly 94, the material box conveying assembly 94 includes a width adjusting structure, the width adjusting structure includes a feeding baffle, a feeding slide rail and a feeding screw rod which are arranged on two sides of the feeding base 91, two ends of the feeding screw rod are respectively connected with the feeding baffle on two sides of the feeding base 91, and the feeding slide rail is arranged on the feeding baffle in a penetrating manner. The structure of material loading lead screw has guaranteed that the baffle of both sides removes simultaneously, no matter like this can both guarantee the symmetry of magazine from the angle of atress or the angle of position.
As shown in fig. 1 and 2, in the solution of the present embodiment, the cartridge conveying assembly 94 further includes a conveyer belt structure, and the conveyer belt structure is disposed on the loading base 91. The structure enables the delivery of the material box to be automatically controlled.
As shown in fig. 1 and 2, in the solution of the present embodiment, the empty material cartridge placing part is located on the feeding base 91 and on the upper part of the cartridge conveying assembly 94. The structure improves the efficiency and saves the space.
As shown in fig. 4 to 12, the present application further provides a die bonder. The die bonder comprises a feeding module, and the feeding module is the feeding module.
As shown in fig. 4 to 8, the die bonder includes: the device comprises a mounting frame module 10, a dispensing module 20, a waiting module 30, a die bonding module 40, a blanking module 50 and a conveying module 60. The dispensing module 20 is disposed on the mount module 10. The standby module 30 is disposed on the mount module 10. The die bonding module 40 is disposed on the mounting frame module 10, the die bonding module 40 includes a die bonding head structure 41 and a robot arm structure 42, the robot arm is mounted on the mounting frame module 10, the die bonding head structure 41 is mounted on the robot arm structure 42, and the robot arm structure 42 can drive the die bonding head structure 41 to move. The blanking module 50 is provided on the mount module 10. The conveying module 60 is disposed on the mounting frame module 10 and can drive the carrier plate to move on the dispensing module 20, the waiting module 30, the die bonding module 40 and the blanking module 50. The feeding module 90 is located on a side of the dispensing module 20 away from the die attach module 40.
According to the technical scheme of the embodiment, the carrier is sequentially dispensed through the dispensing module 20 under the conveying of the conveying module 60, and then enters the waiting module 30 for detection, for example, whether dispensing is qualified is detected. The material waiting module 30 is driven by the conveying module 60 to enter the die bonding module 40, the die bonding module finishes die bonding, and then the material discharging module 50 finishes dispensing, detecting and die bonding through the assembly line of the scheme, so that the working efficiency of the die bonding machine is greatly improved. The technical scheme of this embodiment has solved the problem that solid crystal machine integrates and work efficiency is lower among the prior art effectively. The support plate comprises a support plate body and an object on the support plate body.
As shown in fig. 4 and 5, in the solution of the present embodiment, the mounting frame module 10 includes a base assembly 11, a guide rail assembly 12, and a runner assembly 13, the guide rail assembly 12 is fixed on the base assembly 11, the runner assembly 13 is movably disposed on the guide rail assembly 12, and the carrier plate can be supported on the runner assembly 13. The runner assembly 13 moves on the guide rail assembly 12, and can adapt to carrier plates with different sizes and different models, so that the die bonder has stronger universality. Note that the extending direction of the guide rail assembly 12 is perpendicular to the extending direction of the flow path assembly 13. The die bonder of the embodiment further comprises a guide structure, the guide structure is fixed on the mounting frame module 10, and the flow channel assembly 13 is matched with the guide structure, so that the flow channel assembly 13 moves more stably when the width of the flow channel is adjusted. The guide rail assembly comprises a plurality of guide rail assemblies, and each guide rail assembly is matched with the limiting support frame structure 131 and is positioned at the bottom of the limiting support frame structure 131.
As shown in fig. 5, in the technical solution of this embodiment, the flow channel assembly 13 includes a limiting support frame structure 131, and the limiting support frame structure 131 includes a first limiting support plate and a second limiting support plate, an adjustable predetermined distance is provided between the first limiting support plate and the second limiting support plate to form the flow channel, and both the first limiting support plate and the second limiting support plate extend along the moving direction of the carrier plate. The limiting structure comprises a first limiting supporting plate and a second limiting supporting plate, the distance between the first limiting supporting plate and the second limiting supporting plate can be adjusted to adapt to support plates of different sizes, and the structure is low in manufacturing cost and convenient to operate. It should be noted that, the guide structure: a plurality of guide bars, first spacing backup pad and the spacing backup pad of second all pass each guide bar, and the extending direction of each guide bar is parallel with guide rail set spare 12.
As shown in fig. 5, in the technical solution of this embodiment, the first limiting support plate includes a first limiting plate and a first support plate, the first support plate is located on one side of the first limiting plate close to the second limiting support plate, the upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first step surface, the second limiting support plate includes a second limiting plate and a second support plate, the second support plate is located on one side of the second limiting plate close to the first limiting support plate, and the upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second step surface. The support of the carrier plate can be realized by the matching of the first step surface and the second step surface, so that the upward supporting force of the carrier plate can be realized, and the stress of the conveying module 60 is reduced. The side face of the first limiting plate is matched with the side face of the second limiting plate, so that the carrier plate is prevented from being separated from the runner, and the carrier plate can better move along a preset track. The first limiting support plate and the second limiting support plate of the embodiment are simple in structure and easy to operate. Note that the first step surface and the second step surface have the same height. The first limiting plate comprises a first limiting plate section, a second limiting plate section, a third limiting plate section and a fourth limiting plate section, and the second limiting plate comprises a fifth limiting plate section, a sixth limiting plate section, a seventh limiting plate section and an eighth limiting plate section. The first supporting plate comprises a first supporting plate section, a second supporting plate section, a third supporting plate section and a fourth supporting plate section, and the second supporting plate comprises a fifth supporting plate section, a sixth supporting plate section, a seventh supporting plate section and an eighth supporting plate section. First spacing plate section and first backup pad section link together, and second spacing plate section and second backup pad section link together, and third spacing plate section and third backup pad section link together, and so on. The first limiting plate section, the first supporting plate section, the fifth limiting plate section and the fifth supporting plate section are the same in length and are correspondingly arranged with the glue dispensing modules 20; the second limiting plate section, the second supporting plate section, the sixth limiting plate section and the sixth supporting plate section have the same length and are arranged corresponding to the material waiting module 30; the third limiting plate section, the third supporting plate section, the seventh limiting plate section and the seventh supporting plate section have the same length and are arranged corresponding to the die bonding module 40; the fourth limiting plate section, the fourth supporting plate section, the eighth limiting plate section and the eighth supporting plate section have the same length and are correspondingly arranged with the blanking module 50.
As shown in fig. 5 and fig. 7, in the technical solution of the present embodiment, the flow channel assembly 13 further includes a flow channel driving structure 132, and the flow channel driving structure 132 is connected to the position-limiting supporting frame structure 131 to drive the position-limiting supporting frame structure 131 to change the predetermined distance of the flow channel. The structure is convenient to set and operate.
As shown in fig. 5 and fig. 7, in the technical solution of this embodiment, the flow channel driving structure 132 includes a first motor, a screw rod, and two connecting portions, an output shaft of the first motor is connected to the screw rod, two ends of the screw rod are respectively connected to the two connecting portions through threads, and the first limiting support plate and the second limiting support plate are respectively and fixedly connected to the two connecting portions. The flow channel driving structure 132 with the above structure has low processing cost and relatively balanced applied acting force. Specifically, the two ends of the screw rod connected with the two connecting parts are provided with the same threads, so that the acting force of the screw rod on the two connecting parts is balanced, the two connecting parts can move synchronously and simultaneously, and the two connecting parts respectively drive the first limiting support plate and the second limiting support plate to move synchronously and simultaneously. When the size of the carrier plate is changed and the width of the flow channel needs to be adjusted, the first limiting plate and the second limiting plate on the two sides of the carrier plate simultaneously and synchronously lean against the carrier plate, so that the working precision is improved no matter the carrier plate is stressed or moves away.
As shown in fig. 4 and fig. 6, in the technical solution of this embodiment, the die bonder further includes a first pressing plate structure 70 and a first top plate structure 80, the first pressing plate structure 70 is fixedly connected to the limiting support frame, the first top plate structure 80 is disposed on the mounting frame module 10, the first pressing plate structure 70 is disposed corresponding to the first top plate structure 80, and the first pressing plate structure 70 is matched with the dispensing module 20. The carrier plate is fixed by the first pressing plate structure 70 and the first top plate structure 80, so that the carrier plate can be limited and fixed in multiple directions, and the working precision of the carrier plate is further ensured. The second pressing plate structure and the second top plate structure are arranged at the corresponding positions of the die bonding module 40.
As shown in fig. 4, 6 and 8, in the technical solution of this embodiment, the first top plate structure 80 includes a second motor, a first cam, a first transmission portion and a first top plate, the second motor is connected to the first cam to drive the first cam to rotate, the first cam is matched with the bottom of the first transmission portion, the top of the first transmission portion is fixedly connected to the first top plate, and the first top plate and the first pressing plate structure 70 have a pressing position close to each other or the first top plate and the first pressing plate structure 70 have a disengaging position away from each other. The structure of the first cam ensures that the acting force applied by the first top plate is relatively mild when the first top plate is pressed against the carrier plate, and the first top plate is gently separated from the pressing position to the disengaging position in the same way.
As shown in fig. 7, in the solution of the present embodiment, the first transmission part includes a first engaging block and a first connecting plate, and a bottom surface of the first engaging block has an arc-shaped surface engaged with the first cam. The bottom surface of the first matching block is provided with an arc-shaped surface matched with the first cam, so that the contact surface between the first matching block and the first cam is large, and the matching of the first matching block and the first cam is stable. In addition, the structure that the first matching block is an arc-shaped surface can also ensure that the first transmission part moves at a desired speed.
In the solution of this embodiment, the first top plate structure 80 further includes a first elastic member, one end of the first elastic member is connected to the base assembly 11, and a second end of the first elastic member is connected to the first top plate structure 80 so that the first transmission portion is in contact with the first cam. The arrangement of the first elastic piece ensures that the first cam and the first matching block can have mutually abutted acting force under the action of external force, namely the first transmission part always keeps downward acting force under the action of the spring force. The first elastic piece comprises two springs which are symmetrically arranged on two sides of the first cam so as to balance and even acting force between the first transmission part and the first cam. In particular, the two springs are in tension.
As shown in fig. 7, in the technical solution of the present embodiment, the first pressing plate structure 70 includes a first pressing plate 71 and a second elastic member 72, the second elastic member 72 is disposed on the first pressing plate 71, and when the first top plate and the first pressing plate structure 70 are in the abutting position, the first top plate and the second elastic member 72 jointly abut against the carrier plate. The arrangement of the second elastic element 72 ensures that the carrier plate is not rigidly pressed when the first top plate structure 80 and the first pressing plate structure 70 are pressed together, and the carrier plate has a buffering action force, so that the carrier plate is not easily damaged.
As shown in fig. 7, in the technical solution of the present embodiment, the second elastic element 72 includes a first elastic sheet, and the first elastic sheet is fixed on the first pressing plate 71. The structure is compact and the use is convenient.
As shown in fig. 7, in the technical solution of this embodiment, the first elastic sheet includes a first connecting plate and a first presser foot, a first end of the first presser foot is connected to a side edge of the first connecting plate, the first pressing plate 71 has a hollow hole, the first connecting plate is connected to a surface of the first pressing plate 71 away from the first top plate structure 80, and a second end of the first presser foot passes through the hollow hole. The structure is compact, and the processing cost is low. Specifically, the first connecting plate and the first presser foot are of an integrally formed structure.
As shown in fig. 7, in the technical solution of this embodiment, an angle between a plane of the first connecting plate and a plane of the first presser foot is greater than 90 ° and smaller than 180 °, the second end of the first presser foot is provided with an outward turned-up edge, and the turned-up edge is connected with the first presser foot through an arc-shaped connecting portion. The angle between the plane of the first connecting plate and the plane of the first presser foot is larger than 90 degrees and smaller than 180 degrees, so that the convenience of using the first elastic sheet is ensured, for example, when the first elastic sheet moves downwards, acting force and elastic force on the carrier plate can be realized through the increase of the angle between the plane of the first connecting plate and the plane of the first presser foot. The second shell fragment includes second connecting plate and two second presser feet, two second presser feet set up the both sides at the second connecting plate relatively, the structure of first connecting plate and second connecting plate is the same, the structure of first presser foot and second presser foot is the same, when the fretwork hole is a plurality of, adjacent fretwork hole has the connecting bridge, the second connecting plate is connected on the connecting bridge, the both ends of second connecting plate all have the second presser foot, the both sides of second connecting plate can both form elasticity to the support plate and support the pressure like this. The first elastic sheet is used for the positions of the hollow holes at the two ends, and the second elastic sheet is used for the position of the connecting bridge in the middle of the two adjacent hollow holes.
In the technical solution of this embodiment, the blanking module 50 includes an anti-static push rod, the anti-static push rod pushes the carrier plate away from the flow channel assembly, and the anti-static push rod can also prevent the damage of static electricity to the carrier plate.
As shown in fig. 4, in the technical solution of this embodiment, the conveying module 60 includes a third motor, a conveyor belt, a driven wheel, and a carrier plate clamping structure, the third motor and the driven wheel are respectively disposed at two ends of the installation module, the conveyor belt is matched with the third motor and the driven wheel, and the carrier plate clamping structure is disposed on the conveyor belt. The conveyor belt can ensure that the span of the conveying module 60 is large, and according to the technical scheme of the embodiment, the number of the carrier plate clamping structures can be multiple, so that the efficiency is improved by the multiple carrier plate clamping structures, for example, the dispensing module 20 and the die bonding module 40 can work simultaneously, and different carrier plates can be moved simultaneously. The second top plate structure comprises a fourth motor, a second cam, a second transmission part and a second top plate.
In the technical scheme of this embodiment, support plate clamping structure includes the centre gripping mount pad, fixed clamping part, remove clamping part and centre gripping drive division, and the centre gripping mount pad is installed on the conveyer belt, and fixed clamping part is fixed to be set up on the centre gripping mount pad, and the centre gripping drive division sets up on the centre gripping mount pad, and the centre gripping drive division links to each other with removing the clamping part to the drive removes the clamping part and is in clamping position near fixed clamping part, perhaps the drive removes the clamping part and keeps away from fixed clamping part and be in unclamping position. The position of the support plate clamping structure matched with the support plate is made of PEEK (polyether ether ketone), and the support plate clamping structure with the structure is convenient to operate. It is possible that the movable clamping part is connected with a pneumatic cylinder or a hydraulic cylinder or an electric push rod.
As shown in fig. 8 to 12, in the technical solution of the present embodiment, the die attach head structure 41 includes a die attach head 411 and a die attach head connecting seat 412, the die attach head connecting seat 412 is fixed on the robot arm structure 42, and the die attach head 411 is mounted on the die attach head connecting seat 412 by magnetic force. The mechanical arm structure 42 can drive the die bonder head 411 to work, so that the die bonder work is more accurate and has higher automation degree. The die attach head 411 is magnetically connected to the die attach head connecting base 412, which greatly improves the assembly and disassembly efficiency, and the die attach head 411 is magnetically attracted to the die attach head connecting base 412 to reduce the number of screw assembly and disassembly processes.
In the technical solution of this embodiment, the die attach head 411 includes a die attach head main body and a die attach head mounting base, the die attach head mounting base has a mounting hole, and the die attach head main body is mounted in the mounting hole. The structure of the die attach head main body and the die attach head mounting base is convenient for maintenance and setting a matching structure, for example, the die attach head mounting base is provided with a ferromagnet.
As shown in fig. 9, in the technical solution of this embodiment, the die bonder head mounting base includes a ferromagnetic body, a first mounting section, a limiting section, and a second mounting section, the limiting section is located between the first mounting section and the second mounting section, the ferromagnetic body is located on one side of the first mounting section away from the limiting section, and an outer diameter of the limiting section is greater than an outer diameter of the first mounting section. The ferromagnet is convenient for the matching connection of the die bonding head main body and the die bonding head mounting seat, and the limiting section enables the bottom edge of the die bonding head mounting seat to be abutted against the upper surface of the limiting section. The limiting section is a circular plate, the upper part of the first mounting section is in a cone frustum shape, and the lower part of the first mounting section is in a cylindrical shape, as shown in fig. 12. The second mounting section is fixed with the solid crystal head main body through a pin, a pin through hole is formed in the side wall of the second mounting end, a groove corresponding to the pin hole is formed in the side wall of the solid crystal head main body, and the pin penetrates through the pin through hole and penetrates into the groove.
As shown in fig. 11, in the present embodiment, the die attach head connecting base 412 includes a base and a connecting tube, and the connecting tube is disposed on a sidewall of the base and can be communicated with the die attach head main body. The structure is compact and the connection is convenient. The negative pressure absorbed by the connecting pipe is between 0.1Kpa and 0.8 Kpa.
As shown in fig. 11 and 12, in the solution of the present embodiment, the mounting hole is from the end of the second mounting section far away from the limiting section to the first mounting section, and the side wall of the first mounting section has a communication hole, and the communication hole communicates the mounting hole and the connecting pipe. The die bonding head is compact in structure and convenient to install, and the main body of the die bonding head is a hollow tube.
As shown in fig. 11 and 12, in the technical solution of this embodiment, the die attach head connecting seat 412 further includes a magnet, and the seat body includes an accommodating space, and the magnet is disposed in the accommodating space. The structure is compact, and the assembly and disassembly efficiency is higher. The magnet of this embodiment is permanent magnet, and the ferromagnet is permanent magnet, attracts mutually through two magnets to realize being connected of solid crystal head 411 and solid crystal head mount pad, demolishs solid crystal head 411 from solid crystal head mount pad through external force when demolising. The magnet can also be an electromagnet, and when the magnet needs to be removed, the die bonder head 411 is removed under the action of gravity or external force by powering off the electromagnet.
As shown in fig. 11 and 12, in the solution of the present embodiment, the ferromagnetic body and the first mounting section are located in the accommodating space, and a mutually-matched limiting portion is provided between the first mounting section and the wall surface of the accommodating space. This allows the die attach head 411 and the die attach head connecting seat 412 to be fitted with high precision. The first mounting section is provided with a truncated cone matched with the truncated cone section, so that the matching precision of the base body and the die bonding head 411 is higher, and the processing cost of the structure is lower. The accommodating space comprises a first cylindrical section, a second cylindrical section, a conical frustum section and a cylindrical section in sequence from one side far away from the die bonding head 411 to one side close to the die bonding head 411, and the magnet is installed in the seat body. The side wall of the first mounting seat is provided with a fool-proof surface, the side wall of the seat body is provided with a plane matched with the fool-proof surface, the side wall of the seat body corresponding to the fool-proof surface is provided with a fixing hole, and the first mounting end and the seat body are fixed together by a pin shaft.
As shown in fig. 11 and fig. 12, in the technical solution of this embodiment, the die attach module 40 further includes a die attach head structure and a die attach head storage structure 43, and both the die attach head structure and the die attach head storage structure 43 are disposed on the mounting frame module 10. The structure further improves the automation degree of the die bonder. When the die attach head 411 needs to be replaced, the die attach head 411 is removed by removing the die attach head structure, and then the die attach head 411 of the die attach head storage structure is automatically installed by magnetic force. The structure of the wafer-removing head may be a structure provided separately or may be a structure of a system, for example, the wafer-removing head 411 may be removed by the force of a positive pressure gas blown out from a connecting pipe.
It should be noted that the die bonder of this embodiment has a plurality of cameras, for example, a camera (or a camera as needed) is disposed at the position of the material waiting module 30 to detect the dispensing result, and both the dispensing module 20 and the die bonder module are provided with cameras to detect the dispensing and the die bonder. The embodiment is also provided with a movable camera which can be moved to a position to be detected according to the requirement.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (11)

1. A feeding module, comprising:
a feeding base (91);
the material pushing assembly (92) comprises a material pushing mounting frame structure (921), a material box gripper structure (922) and a push rod structure (923), the material pushing mounting frame structure (921) is mounted on the material loading base (91), and the material box gripper structure (922) is movably mounted on the material pushing mounting frame structure (921);
push rod structure (923) include push rod base (9231), push rod mount pad (9232), driving piece (9233), first spring (9234) and push rod (9235), push rod base (9231) are installed on magazine tongs structure (922), driving piece (9233) with push rod mount pad (9232) all slidable ground sets up on push rod base (9231), push rod (9235) are installed on push rod mount pad (9232), driving piece (9233) with push rod mount pad (9232) pass through first spring (9234) link to each other, when push rod (9235) meet and be greater than predetermined resistance, driving piece (9233) with push rod mount pad (9232) relative movement.
2. The feeding module according to claim 1, further comprising a power assembly (93), wherein the power assembly (93) is connected to the driving member (9233) to drive the driving member (9233) to slide on the push rod base (9231).
3. The feeding module of claim 2, further comprising an alarm assembly, wherein the alarm assembly comprises a sensing piece, a photoelectric sensor and an alarm, the sensing piece and the photoelectric sensor are respectively mounted on the driving piece (9233) and the push rod mounting seat (9232), and when the driving piece (9233) and the push rod mounting seat (9232) move relative to each other for a predetermined distance, the sensing piece corresponds to the photoelectric sensor so that the alarm gives an alarm.
4. A loading module according to claim 3, characterised in that the drive member (9233) is a drive plate having a recess in which the push rod mount (9232) is at least partially located.
5. The feeding module of claim 1, wherein the push rod structure (923) further comprises a second spring (9236) and a stopper plate (9237), the second spring (9236) is installed on the push rod installation seat (9232), the stopper plate (9237) is rotatably installed on the push rod installation seat (9232), the push rod (9235) is located on one side of the stopper plate (9237) away from the second spring (9236), the stopper plate (9237) faces one side of the second spring (9236) and has a slot, the second spring (9236) has a stopper position inserted into the slot and an avoiding position where the second spring (9236) leaves the slot, and when the stopper plate (9237) is located at the avoiding position, the push rod (9235) can be detached from the push rod installation seat (9232).
6. A loading module according to claim 1, wherein a vertical slide rail structure is further provided between the magazine grip structure (922) and the material pushing mount structure (921) to allow the magazine grip structure (922) to be movable in a vertical direction.
7. The feeding module according to claim 6, further comprising a magazine conveying assembly (94), wherein the magazine conveying assembly (94) comprises a width adjusting structure, the width adjusting structure comprises a feeding baffle plate, a feeding slide rail and a feeding screw rod, the feeding baffle plate, the feeding slide rail and the feeding screw rod are arranged on two sides of the feeding base (91), two ends of the feeding screw rod are respectively connected with the feeding baffle plate on two sides of the feeding base (91), and the feeding slide rail is arranged on the feeding baffle plate in a penetrating manner.
8. A loading module according to claim 6, wherein the cartridge delivery assembly (94) further comprises a conveyor belt structure provided on the loading base (91).
9. A loading module according to claim 6, characterized in that it further comprises an empty magazine resting portion, which is located on the loading base (91) and on the upper part of the magazine transport assembly (94).
10. A die bonder, which is characterized by comprising a feeding module, wherein the feeding module is the feeding module in any one of claims 1 to 9.
11. The die bonder of claim 10, further comprising:
a mounting frame module (10);
the dispensing module (20), the dispensing module (20) is arranged on the mounting frame module (10);
the material waiting module (30), the material waiting module (30) is arranged on the mounting frame module (10);
the die bonding module (40) is arranged on the mounting frame module (10), the die bonding module (40) comprises a die bonding head structure (41) and a mechanical arm structure (42), the mechanical arm structure (42) is arranged on the mounting frame module (10), the die bonding head structure (41) is arranged on the mechanical arm structure (42), and the mechanical arm structure (42) can drive the die bonding head structure (41) to move;
a blanking module (50), the blanking module (50) being arranged on the mount module (10);
the conveying module (60) is arranged on the mounting frame module (10) and can drive the carrier plate to move on the dispensing module (20), the material waiting module (30), the die bonding module (40) and the blanking module (50);
the feeding module is positioned on one side of the dispensing module (20) far away from the die bonding module (40).
CN202111642290.6A 2021-12-29 2021-12-29 Feeding module and die bonder with same Pending CN114361087A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111642290.6A CN114361087A (en) 2021-12-29 2021-12-29 Feeding module and die bonder with same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111642290.6A CN114361087A (en) 2021-12-29 2021-12-29 Feeding module and die bonder with same

Publications (1)

Publication Number Publication Date
CN114361087A true CN114361087A (en) 2022-04-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111642290.6A Pending CN114361087A (en) 2021-12-29 2021-12-29 Feeding module and die bonder with same

Country Status (1)

Country Link
CN (1) CN114361087A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115629085A (en) * 2022-12-21 2023-01-20 智翼博智能科技(苏州)有限公司 Full-automatic intelligent flaw detection equipment for semiconductor chip collecting tray

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115629085A (en) * 2022-12-21 2023-01-20 智翼博智能科技(苏州)有限公司 Full-automatic intelligent flaw detection equipment for semiconductor chip collecting tray

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