CN114300390A - Die bonding module and die bonding machine with same - Google Patents
Die bonding module and die bonding machine with same Download PDFInfo
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- CN114300390A CN114300390A CN202111642332.6A CN202111642332A CN114300390A CN 114300390 A CN114300390 A CN 114300390A CN 202111642332 A CN202111642332 A CN 202111642332A CN 114300390 A CN114300390 A CN 114300390A
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Abstract
The application relates to a solid brilliant module and have its solid brilliant machine, wherein, solid brilliant module includes: a die bonding head structure; the mechanical arm structure comprises a first-stage vertical transmission structure and a second-stage vertical transmission structure, the second-stage vertical transmission structure is installed on the first-stage vertical transmission structure, and the die bonder head structure is installed on the second-stage vertical transmission structure. The technical scheme of this application has solved the problem that the driven precision is not high when the solid crystal head structure among the prior art reciprocates effectively.
Description
Technical Field
The application relates to the technical field of die bonder, in particular to a die bonder module and a die bonder with the same.
Background
Modern electronic information technology is rapidly developed, and increasingly high requirements are put forward on miniaturization, portability, multiple functions, high reliability, low cost and the like of electronic products. At present, electronic packaging is relatively independent in order to meet the requirements of various electronic products, and gradually gets rid of the subordinate status as the post-process of microelectronic manufacturing, various packaging technologies are developed aiming at the special requirements of various electronic products, and a large number of new theories, new materials, new processes, new equipment and new electronic products are developed; electronic package testing technology is driving the development of information-oriented society together with chip design and manufacture.
In the prior art, the die bonding module adopts a hydraulic structure to move a die bonding head up and down, and the precision of the transmission structure is not high.
Disclosure of Invention
The application provides a die bonder module and a die bonder with the same, which aims to solve the problem that a die bonder head structure in the prior art is not high in transmission precision when moving up and down.
To achieve the above object, in one aspect, the present application provides a die bonding module, including: a die bonding head structure; the mechanical arm structure comprises a first-stage vertical transmission structure and a second-stage vertical transmission structure, the second-stage vertical transmission structure is installed on the first-stage vertical transmission structure, and the die bonder head structure is installed on the second-stage vertical transmission structure.
Further, the primary vertical transmission structure comprises a die bonding mounting seat, a die bonding driving motor, a die bonding driving wheel, a die bonding synchronous belt, a die bonding driven wheel and a die bonding transmission screw rod, the die bonding driving motor is fixed on the die bonding mounting seat, the die bonding driving wheel is connected with the die bonding driving motor, the die bonding driving wheel and the die bonding driven wheel are in transmission through the die bonding synchronous belt, the die bonding driven wheel is connected with the die bonding transmission screw rod, and the secondary vertical transmission structure is connected with the die bonding transmission screw rod.
Furthermore, the secondary vertical transmission structure is provided with a die bonding threaded hole matched with the die bonding transmission screw rod, and the die bonding transmission screw rod penetrates through the die bonding threaded hole.
Furthermore, the second-stage vertical transmission structure comprises a voice coil motor, and the die bonding structure is connected with the voice coil motor.
Further, the die bonder head structure comprises a die bonder head and a die bonder head connecting seat, the die bonder head connecting seat is fixed on the mechanical arm structure, and the die bonder head is installed on the die bonder head connecting seat through magnetic force.
Further, the die attach head comprises a die attach head main body and a die attach head mounting base, the die attach head mounting base is provided with a mounting hole, and the die attach head main body is mounted in the mounting hole.
Further, the solid crystal head mounting base comprises a ferromagnet, a first mounting section, a limiting section and a second mounting section, the limiting section is located between the first mounting section and the second mounting section, the ferromagnet is located on one side, far away from the limiting section, of the first mounting section, and the outer diameter of the limiting section is larger than that of the first mounting section.
Furthermore, the die attach head connecting seat comprises a seat body and a connecting pipe, wherein the connecting pipe is arranged on the side wall of the seat body and can be communicated with the die attach head main body.
Further, the mounting hole is to first installation section by the tip of keeping away from spacing section of second installation section, and the lateral wall of first installation section has the intercommunicating pore, intercommunicating pore intercommunication mounting hole and connecting pipe.
Further, the die bonder head connecting seat further comprises a magnet, the seat body comprises an accommodating space, and the magnet is arranged in the accommodating space.
Further, ferromagnet and first installation section are located accommodation space, have the spacing portion of mutually supporting between the wall of first installation section and accommodation space.
Furthermore, the die bonding module further comprises a die bonding head taking structure and a die bonding head storage structure, and the die bonding head taking structure and the die bonding head storage structure are both arranged on the mounting frame module.
According to another aspect of the present application, a die bonder is further provided, which includes the die bonder module.
Further, a mounting frame module, on which the mechanical arm structure is mounted; the glue dispensing module is arranged on the mounting frame module; the material waiting module is arranged on the mounting frame module; the blanking module is arranged on the mounting frame module; and the conveying module is arranged on the mounting frame module and can drive the carrier plate to move at the glue dispensing module, the material waiting module, the die bonding module and the blanking module.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
according to the technical scheme, the mechanical arm structure comprises a first-stage vertical transmission structure and a second-stage vertical transmission structure, the second-stage vertical transmission structure is arranged on the first-stage transmission structure, the die bonding head structure is arranged on the second-stage vertical transmission structure and matched with the second-stage transmission structure, so that the reciprocating of the die bonding head structure can meet the efficiency and the precision requirement. Specifically, the efficiency of the primary transmission structure is high, the precision of the secondary transmission structure is high, the primary transmission structure is used for transmission during primary adjustment, and the secondary transmission structure can be used for adjustment after the primary adjustment is finished. The technical scheme of this application has solved the problem that the driven precision is not high when the solid crystal head structure among the prior art reciprocates effectively.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 shows a schematic perspective view of a die bonder in an embodiment of the present application;
FIG. 2 is a schematic view showing a flow channel structure of the die bonder of FIG. 1;
FIG. 3 shows a schematic view of a first platen configuration of the die bonder of FIG. 1;
FIG. 4 is a schematic view of a flow channel driving structure of the die bonder of FIG. 1;
FIG. 5 is a partially enlarged schematic view of a die attach module of the die attach machine of FIG. 1;
FIG. 6 is a schematic diagram showing the assembly of the die bonder module of the die bonder of FIG. 1;
FIG. 7 is a schematic diagram of a solid crystal head storage structure of the solid crystal module of FIG. 6;
FIG. 8 is a schematic diagram showing a die bonding structure of the die bonder of FIG. 1;
FIG. 9 shows a schematic view of a die attach head of the die attach structure of FIG. 8;
fig. 10 shows a schematic diagram of a robot arm structure of the die bonder of fig. 1.
Wherein the figures include the following reference numerals:
10. a mounting bracket module; 11. a base assembly; 12. a guide rail assembly; 13. a flow channel assembly; 131. a limiting support frame structure; 132. a flow channel driving structure; 20. a dispensing module; 30. a material waiting module; 40. a die bonding module; 41. a die bonding head structure; 411. a die bonding head; 412. a die attach head connecting base; 42. a mechanical arm structure; 421. a first-level vertical transmission structure; 422. a secondary vertical transmission structure; 43. a solid crystal head storage structure; 50. a blanking module; 60. a delivery module; 70. a first platen structure; 71. a first platen; 72. a second elastic member; 80. a first top plate structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1 to 10, a die bonding module of the present embodiment includes: a die bond head structure 41 and a robot arm structure 42. The mechanical arm structure 42 comprises a first-stage vertical transmission structure 421 and a second-stage vertical transmission structure 422, the second-stage vertical transmission structure 422 is installed on the first-stage vertical transmission structure 421, and the die bonder head structure 41 is installed on the second-stage vertical transmission structure 422.
According to the technical scheme of this embodiment, arm structure 42 includes one-level vertical transmission structure 421 and second grade vertical transmission structure 422, and second grade vertical transmission structure 422 sets up on one-level vertical transmission structure 421, and solid crystal head structure 41 sets up on second grade vertical transmission structure 422, cooperatees through one-level vertical transmission structure 421 and second grade vertical transmission structure 422 for reciprocating of solid crystal head structure 41 can enough satisfy efficiency, can satisfy the requirement of precision again. Specifically, one-level vertical transmission structure 421 efficiency is higher, and second grade vertical transmission structure 422's precision is higher, through the transmission of one-level vertical transmission structure 421 in preliminary adjustment, can adjust through second grade vertical transmission structure 422 when preliminary adjustment finishes. The technical scheme of this embodiment has solved the problem that the driven precision is not high when the solid crystal head structure among the prior art reciprocates effectively.
As shown in fig. 10, in the technical solution of this embodiment, the primary vertical transmission structure 421 includes a die bonding mounting seat, a die bonding driving motor, a die bonding driving wheel, a die bonding synchronous belt, a die bonding driven wheel and a die bonding transmission screw rod, the die bonding driving motor is fixed on the die bonding mounting seat, the die bonding driving wheel is connected to the die bonding driving motor, the die bonding driving wheel and the die bonding driven wheel are driven by the die bonding synchronous belt, the die bonding driven wheel is connected to the die bonding transmission screw rod, and the secondary vertical transmission structure 422 is connected to the die bonding transmission screw rod. Through the transmission structure of the die bonding driving motor, the die bonding driving wheel, the die bonding synchronous belt, the die bonding driven wheel and the die bonding transmission screw rod, the transmission efficiency is improved, and the installation is more flexible.
As shown in fig. 10, in the technical solution of this embodiment, the secondary vertical transmission structure 422 has a die bonding threaded hole adapted to the die bonding transmission screw rod, and the die bonding transmission screw rod is inserted into the die bonding threaded hole. The structure is compact and the installation is convenient. Specifically, be provided with slide rail and the spout of mutually supporting between solid brilliant mount pad and the second grade vertical transmission structure 422, such structure makes the cooperation between one-level vertical transmission structure 421 and the second grade vertical transmission structure 422 more stable, and one-level vertical transmission structure 421 and second grade vertical transmission structure 422 are more steady in relative motion. The robotic arm structure 42 also includes a sensing plate, a photosensor, an alignment camera, and the like. The left side of the servo motor (die bonding driving motor) is provided with a linear module (die bonding transmission screw rod), the servo motor and the linear module are arranged at the same parallel height, and an installation plate and an adjusting plate are arranged above the servo motor and the linear module and are connected by a die bonding synchronous belt. The servo motor moves to drive the synchronous belt and the synchronous belt wheel to move and provide power for the linear module at the same time, so that the linear module makes z-up and down movement. Protective covers are arranged around the die bonding synchronous belt, the die bonding driving wheel and the die bonding driven wheel for protection, and a transparent acrylic plate is arranged in front of the protective covers and can be used for observing the tightness of the synchronous belt at any time. When the synchronous belt is found to be loosened, the synchronous belt can be adjusted by using the adjusting plate and the adjusting block. The adjusting plate and the mounting plate are connected with each other by screws, and when the synchronous belt becomes loose, the adjusting plate can be adjusted to the right side and fixed by the adjusting block and the locking block (the left and right of the embodiment are the left and right of a person facing to the figure 10).
The left side of the linear module is provided with a slide block, and when the motor supplies power, the slide block drives the die bonding head structure 41 to move in the z direction. Be provided with the module response piece on the slider, utilize the fixed photoelectric sensor of mount pad on the linear module, can restrict the effectual home range of second grade vertical transmission structure 422.
The die bonding head structure firstly moves in the z direction through the first-stage vertical transmission structure 421, then rotates through the precision rotating platform, and the rotating range can rotate by 360 degrees according to requirements. The voice coil motor is fixed below the precise rotary platform by utilizing the connecting plate and the mounting block, the suction nozzle is arranged below the voice coil motor (the suction nozzle is arranged on the die bonding head structure 41), and the die can be taken and bonded through the suction nozzle. The right side of the die bonding module 40 is provided with an alignment camera, and the alignment camera can be used for correcting before die taking and die bonding, so that the die taking and die bonding precision is improved. The suction nozzle provides vacuum through the micro connector, and the mounting panel top is provided with the manometer, and the adsorption pressure of suction nozzle is observed to the accessible manometer.
As shown in fig. 9 and 10, in the solution of this embodiment, the two-stage vertical transmission structure 422 includes a voice coil motor, and the die bond head structure 41 is connected to the voice coil motor. The voice coil motor has the advantages of large transmission thrust, short response time and high precision.
In the technical solution of this embodiment, the die attach head 411 includes a die attach head main body and a die attach head mounting base, the die attach head mounting base has a mounting hole, and the die attach head main body is mounted in the mounting hole. The structure of the die attach head main body and the die attach head mounting base is convenient for maintenance and setting a matching structure, for example, the die attach head mounting base is provided with a ferromagnet.
As shown in fig. 9, in the technical solution of this embodiment, the die bonder head mounting base includes a ferromagnetic body, a first mounting section, a limiting section, and a second mounting section, the limiting section is located between the first mounting section and the second mounting section, the ferromagnetic body is located on one side of the first mounting section away from the limiting section, and an outer diameter of the limiting section is greater than an outer diameter of the first mounting section. The ferromagnet is convenient for the matching connection of the die bonding head main body and the die bonding head mounting seat, and the limiting section enables the bottom edge of the die bonding head mounting seat to be abutted against the upper surface of the limiting section. The limiting section is a circular plate, the upper part of the first mounting section is in a cone frustum shape, and the lower part of the first mounting section is in a cylindrical shape, as shown in fig. 9. The second mounting section is fixed with the solid crystal head main body through a pin, a pin through hole is formed in the side wall of the second mounting end, a groove corresponding to the pin hole is formed in the side wall of the solid crystal head main body, and the pin penetrates through the pin through hole and penetrates into the groove.
As shown in fig. 8, in the present embodiment, the die attach head connecting base 412 includes a base and a connecting tube, and the connecting tube is disposed on a sidewall of the base and can be communicated with the die attach head main body. The structure is compact and the connection is convenient. The negative pressure absorbed by the connecting pipe is between 0.1Kpa and 0.8 Kpa.
As shown in fig. 8 and 9, in the solution of the present embodiment, the mounting hole is from the end of the second mounting section far away from the limiting section to the first mounting section, and the side wall of the first mounting section has a communication hole, and the communication hole communicates the mounting hole and the connecting pipe. The die bonding head is compact in structure and convenient to install, and the main body of the die bonding head is a hollow tube.
As shown in fig. 8 and 9, in the technical solution of this embodiment, the die attach head connecting seat 412 further includes a magnet, and the seat body includes an accommodating space, and the magnet is disposed in the accommodating space. The structure is compact, and the assembly and disassembly efficiency is higher. The magnet of this embodiment is permanent magnet, and the ferromagnet is permanent magnet, attracts mutually through two magnets to realize being connected of solid crystal head 411 and solid crystal head mount pad, demolishs solid crystal head 411 from solid crystal head mount pad through external force when demolising. The magnet can also be an electromagnet, and when the magnet needs to be removed, the die bonder head 411 is removed under the action of gravity or external force by powering off the electromagnet.
As shown in fig. 8 and 9, in the technical solution of the present embodiment, the ferromagnetic body and the first mounting section are located in the accommodating space, and a mutually-matched limiting portion is provided between the first mounting section and the wall surface of the accommodating space. This allows the die attach head 411 and the die attach head connecting seat 412 to be fitted with high precision. The first mounting section is provided with a truncated cone matched with the truncated cone section, so that the matching precision of the base body and the die bonding head 411 is higher, and the processing cost of the structure is lower. The accommodating space comprises a first cylindrical section, a second cylindrical section, a conical frustum section and a cylindrical section in sequence from one side far away from the die bonding head 411 to one side close to the die bonding head 411, and the magnet is installed in the seat body. The side wall of the first mounting seat is provided with a fool-proof surface, the side wall of the seat body is provided with a plane matched with the fool-proof surface, the side wall of the seat body corresponding to the fool-proof surface is provided with a fixing hole, and the first mounting end and the seat body are fixed together by a pin shaft.
As shown in fig. 8 and fig. 9, in the technical solution of this embodiment, the die attach module 40 further includes a die attach head structure and a die attach head storage structure 43, and both the die attach head structure and the die attach head storage structure 43 are disposed on the mounting frame module 10. The structure further improves the automation degree of the die bonder. When the die attach head 411 needs to be replaced, the die attach head 411 is removed by removing the die attach head structure, and then the die attach head 411 of the die attach head storage structure is automatically installed by magnetic force. The structure of the wafer-removing head may be a structure provided separately or may be a structure of a system, for example, the wafer-removing head 411 may be removed by the force of a positive pressure gas blown out from a connecting pipe.
The application also provides a die bonder comprising: the device comprises a mounting frame module 10, a dispensing module 20, a waiting module 30, a die bonding module 40, a blanking module 50 and a conveying module 60. The dispensing module 20 is disposed on the mount module 10. The standby module 30 is disposed on the mount module 10. The die bonding module 40 is disposed on the mounting frame module 10, the die bonding module 40 includes a die bonding head structure 41 and a robot arm structure 42, the robot arm is mounted on the mounting frame module 10, the die bonding head structure 41 is mounted on the robot arm structure 42, and the robot arm structure 42 can drive the die bonding head structure 41 to move. The blanking module 50 is provided on the mount module 10. The conveying module 60 is disposed on the mounting frame module 10 and can drive the carrier plate to move on the dispensing module 20, the waiting module 30, the die bonding module 40 and the blanking module 50.
According to the technical scheme of the embodiment, the carrier is sequentially dispensed through the dispensing module 20 under the conveying of the conveying module 60, and then enters the waiting module 30 for detection, for example, whether dispensing is qualified is detected. The material waiting module 30 is driven by the conveying module 60 to enter the die bonding module 40, the die bonding module finishes die bonding, and then the material discharging module 50 finishes dispensing, detecting and die bonding through the assembly line of the scheme, so that the working efficiency of the die bonding machine is greatly improved. The technical scheme of this embodiment has solved the problem that solid crystal machine integrates and work efficiency is lower among the prior art effectively. The support plate comprises a support plate body and an object on the support plate body.
As shown in fig. 1 and 2, in the solution of the present embodiment, the mounting frame module 10 includes a base assembly 11, a guide rail assembly 12, and a runner assembly 13, the guide rail assembly 12 is fixed on the base assembly 11, the runner assembly 13 is movably disposed on the guide rail assembly 12, and the carrier plate can be supported on the runner assembly 13. The runner assembly 13 moves on the guide rail assembly 12, and can adapt to carrier plates with different sizes and different models, so that the die bonder has stronger universality. Note that the extending direction of the guide rail assembly 12 is perpendicular to the extending direction of the flow path assembly 13. The die bonder of the embodiment further comprises a guide structure, the guide structure is fixed on the mounting frame module 10, and the flow channel assembly 13 is matched with the guide structure, so that the flow channel assembly 13 moves more stably when the width of the flow channel is adjusted. The guide rail assembly comprises a plurality of guide rail assemblies, and each guide rail assembly is matched with the limiting support frame structure 131 and is positioned at the bottom of the limiting support frame structure 131.
As shown in fig. 2, in the technical solution of this embodiment, the flow channel assembly 13 includes a limiting support frame structure 131, and the limiting support frame structure 131 includes a first limiting support plate and a second limiting support plate, an adjustable predetermined distance is provided between the first limiting support plate and the second limiting support plate to form the flow channel, and both the first limiting support plate and the second limiting support plate extend along the moving direction of the carrier plate. The limiting structure comprises a first limiting supporting plate and a second limiting supporting plate, the distance between the first limiting supporting plate and the second limiting supporting plate can be adjusted to adapt to support plates of different sizes, and the structure is low in manufacturing cost and convenient to operate. It should be noted that, the guide structure: a plurality of guide bars, first spacing backup pad and the spacing backup pad of second all pass each guide bar, and the extending direction of each guide bar is parallel with guide rail set spare 12.
As shown in fig. 2, in the technical solution of this embodiment, the first limiting support plate includes a first limiting plate and a first support plate, the first support plate is located on one side of the first limiting plate close to the second limiting support plate, the upper surface of the first support plate is lower than the upper surface of the first limiting plate to form a first step surface, the second limiting support plate includes a second limiting plate and a second support plate, the second support plate is located on one side of the second limiting plate close to the first limiting support plate, and the upper surface of the second support plate is lower than the upper surface of the second limiting plate to form a second step surface. The support of the carrier plate can be realized by the matching of the first step surface and the second step surface, so that the upward supporting force of the carrier plate can be realized, and the stress of the conveying module 60 is reduced. The side face of the first limiting plate is matched with the side face of the second limiting plate, so that the carrier plate is prevented from being separated from the runner, and the carrier plate can better move along a preset track. The first limiting support plate and the second limiting support plate of the embodiment are simple in structure and easy to operate. Note that the first step surface and the second step surface have the same height. The first limiting plate comprises a first limiting plate section, a second limiting plate section, a third limiting plate section and a fourth limiting plate section, and the second limiting plate comprises a fifth limiting plate section, a sixth limiting plate section, a seventh limiting plate section and an eighth limiting plate section. The first supporting plate comprises a first supporting plate section, a second supporting plate section, a third supporting plate section and a fourth supporting plate section, and the second supporting plate comprises a fifth supporting plate section, a sixth supporting plate section, a seventh supporting plate section and an eighth supporting plate section. First spacing plate section and first backup pad section link together, and second spacing plate section and second backup pad section link together, and third spacing plate section and third backup pad section link together, and so on. The first limiting plate section, the first supporting plate section, the fifth limiting plate section and the fifth supporting plate section are the same in length and are correspondingly arranged with the glue dispensing modules 20; the second limiting plate section, the second supporting plate section, the sixth limiting plate section and the sixth supporting plate section have the same length and are arranged corresponding to the material waiting module 30; the third limiting plate section, the third supporting plate section, the seventh limiting plate section and the seventh supporting plate section have the same length and are arranged corresponding to the die bonding module 40; the fourth limiting plate section, the fourth supporting plate section, the eighth limiting plate section and the eighth supporting plate section have the same length and are correspondingly arranged with the blanking module 50.
As shown in fig. 2 and fig. 4, in the technical solution of the present embodiment, the flow channel assembly 13 further includes a flow channel driving structure 132, and the flow channel driving structure 132 is connected to the position-limiting supporting frame structure 131 to drive the position-limiting supporting frame structure 131 to change the predetermined distance of the flow channel. The structure is convenient to set and operate.
As shown in fig. 2 and fig. 4, in the technical solution of this embodiment, the flow channel driving structure 132 includes a first motor, a screw rod, and two connecting portions, an output shaft of the first motor is connected to the screw rod, two ends of the screw rod are respectively connected to the two connecting portions through threads, and the first limiting support plate and the second limiting support plate are respectively and fixedly connected to the two connecting portions. The flow channel driving structure 132 with the above structure has low processing cost and relatively balanced applied acting force. Specifically, the two ends of the screw rod connected with the two connecting parts are provided with the same threads, so that the acting force of the screw rod on the two connecting parts is balanced, the two connecting parts can move synchronously and simultaneously, and the two connecting parts respectively drive the first limiting support plate and the second limiting support plate to move synchronously and simultaneously. When the size of the carrier plate is changed and the width of the flow channel needs to be adjusted, the first limiting plate and the second limiting plate on the two sides of the carrier plate simultaneously and synchronously lean against the carrier plate, so that the working precision is improved no matter the carrier plate is stressed or moves away.
As shown in fig. 1 and fig. 3, in the technical solution of this embodiment, the die bonder further includes a first pressing plate structure 70 and a first top plate structure 80, the first pressing plate structure 70 is fixedly connected to the limiting support frame, the first top plate structure 80 is disposed on the mounting frame module 10, the first pressing plate structure 70 is disposed corresponding to the first top plate structure 80, and the first pressing plate structure 70 is matched with the dispensing module 20. The carrier plate is fixed by the first pressing plate structure 70 and the first top plate structure 80, so that the carrier plate can be limited and fixed in multiple directions, and the working precision of the carrier plate is further ensured. The second pressing plate structure and the second top plate structure are arranged at the corresponding positions of the die bonding module 40.
As shown in fig. 1, 3 and 4, in the technical solution of this embodiment, the first top plate structure 80 includes a second motor, a first cam, a first transmission portion and a first top plate, the second motor is connected to the first cam to drive the first cam to rotate, the first cam is matched with the bottom of the first transmission portion, the top of the first transmission portion is fixedly connected to the first top plate, and the first top plate and the first pressing plate structure 70 have a pressing position close to each other or the first top plate and the first pressing plate structure 70 have a disengaging position away from each other. The structure of the first cam ensures that the acting force applied by the first top plate is relatively mild when the first top plate is pressed against the carrier plate, and the first top plate is gently separated from the pressing position to the disengaging position in the same way.
As shown in fig. 4, in the solution of the present embodiment, the first transmission portion includes a first engaging block and a first connecting plate, and a bottom surface of the first engaging block has an arc-shaped surface engaged with the first cam. The bottom surface of the first matching block is provided with an arc-shaped surface matched with the first cam, so that the contact surface between the first matching block and the first cam is large, and the matching of the first matching block and the first cam is stable. In addition, the structure that the first matching block is an arc-shaped surface can also ensure that the first transmission part moves at a desired speed.
In the solution of this embodiment, the first top plate structure 80 further includes a first elastic member, one end of the first elastic member is connected to the base assembly 11, and a second end of the first elastic member is connected to the first top plate structure 80 so that the first transmission portion is in contact with the first cam. The arrangement of the first elastic piece ensures that the first cam and the first matching block can have mutually abutted acting force under the action of external force, namely the first transmission part always keeps downward acting force under the action of the spring force. The first elastic piece comprises two springs which are symmetrically arranged on two sides of the first cam so as to balance and even acting force between the first transmission part and the first cam. In particular, the two springs are in tension.
As shown in fig. 3, in the technical solution of the present embodiment, the first pressing plate structure 70 includes a first pressing plate 71 and a second elastic member 72, the second elastic member 72 is disposed on the first pressing plate 71, and when the first top plate and the first pressing plate structure 70 are in the abutting position, the first top plate and the second elastic member 72 jointly abut against the carrier plate. The arrangement of the second elastic element 72 ensures that the carrier plate is not rigidly pressed when the first top plate structure 80 and the first pressing plate structure 70 are pressed together, and the carrier plate has a buffering action force, so that the carrier plate is not easily damaged.
As shown in fig. 3, in the technical solution of the present embodiment, the second elastic element 72 includes a first elastic sheet, and the first elastic sheet is fixed on the first pressing plate 71. The structure is compact and the use is convenient.
As shown in fig. 3, in the technical solution of this embodiment, the first elastic sheet includes a first connecting plate and a first presser foot, a first end of the first presser foot is connected to a side edge of the first connecting plate, the first pressing plate 71 has a hollow hole, the first connecting plate is connected to a surface of the first pressing plate 71 away from the first top plate structure 80, and a second end of the first presser foot passes through the hollow hole. The structure is compact, and the processing cost is low. Specifically, the first connecting plate and the first presser foot are of an integrally formed structure.
As shown in fig. 3, in the technical solution of this embodiment, an angle between a plane of the first connecting plate and a plane of the first presser foot is greater than 90 ° and smaller than 180 °, the second end of the first presser foot is provided with an outward turned-up edge, and the turned-up edge is connected with the first presser foot through an arc-shaped connecting portion. The angle between the plane of the first connecting plate and the plane of the first presser foot is larger than 90 degrees and smaller than 180 degrees, so that the convenience of using the first elastic sheet is ensured, for example, when the first elastic sheet moves downwards, acting force and elastic force on the carrier plate can be realized through the increase of the angle between the plane of the first connecting plate and the plane of the first presser foot. The second shell fragment includes second connecting plate and two second presser feet, two second presser feet set up the both sides at the second connecting plate relatively, the structure of first connecting plate and second connecting plate is the same, the structure of first presser foot and second presser foot is the same, when the fretwork hole is a plurality of, adjacent fretwork hole has the connecting bridge, the second connecting plate is connected on the connecting bridge, the both ends of second connecting plate all have the second presser foot, the both sides of second connecting plate can both form elasticity to the support plate and support the pressure like this. The first elastic sheet is used for the positions of the hollow holes at the two ends, and the second elastic sheet is used for the position of the connecting bridge in the middle of the two adjacent hollow holes.
In the technical solution of this embodiment, the blanking module 50 includes an anti-static push rod, the anti-static push rod pushes the carrier plate away from the flow channel assembly, and the anti-static push rod can also prevent the damage of static electricity to the carrier plate.
As shown in fig. 1, in the technical solution of this embodiment, the conveying module 60 includes a third motor, a conveyor belt, a driven wheel, and a carrier plate clamping structure, the third motor and the driven wheel are respectively disposed at two ends of the installation module, the conveyor belt is matched with the third motor and the driven wheel, and the carrier plate clamping structure is disposed on the conveyor belt. The conveyor belt can ensure that the span of the conveying module 60 is large, and according to the technical scheme of the embodiment, the number of the carrier plate clamping structures can be multiple, so that the efficiency is improved by the multiple carrier plate clamping structures, for example, the dispensing module 20 and the die bonding module 40 can work simultaneously, and different carrier plates can be moved simultaneously. The second top plate structure comprises a fourth motor, a second cam, a second transmission part and a second top plate.
In the technical scheme of this embodiment, support plate clamping structure includes the centre gripping mount pad, fixed clamping part, remove clamping part and centre gripping drive division, and the centre gripping mount pad is installed on the conveyer belt, and fixed clamping part is fixed to be set up on the centre gripping mount pad, and the centre gripping drive division sets up on the centre gripping mount pad, and the centre gripping drive division links to each other with removing the clamping part to the drive removes the clamping part and is in clamping position near fixed clamping part, perhaps the drive removes the clamping part and keeps away from fixed clamping part and be in unclamping position. The position of the support plate clamping structure matched with the support plate is made of PEEK (polyether ether ketone), and the support plate clamping structure with the structure is convenient to operate. It is possible that the movable clamping part is connected with a pneumatic cylinder or a hydraulic cylinder or an electric push rod.
As shown in fig. 5 to 9, in the technical solution of the present embodiment, the die attach head structure 41 includes a die attach head 411 and a die attach head connecting seat 412, the die attach head connecting seat 412 is fixed on the robot arm structure 42, and the die attach head 411 is mounted on the die attach head connecting seat 412 by magnetic force. The mechanical arm structure 42 can drive the die bonder head 411 to work, so that the die bonder work is more accurate and has higher automation degree. The die attach head 411 is magnetically connected to the die attach head connecting base 412, which greatly improves the assembly and disassembly efficiency, and the die attach head 411 is magnetically attracted to the die attach head connecting base 412 to reduce the number of screw assembly and disassembly processes.
It should be noted that the die bonder of this embodiment has a plurality of cameras, for example, a camera (or a camera as needed) is disposed at the position of the material waiting module 30 to detect the dispensing result, and both the dispensing module 20 and the die bonder module are provided with cameras to detect the dispensing and the die bonder. The embodiment is also provided with a movable camera which can be moved to a position to be detected according to the requirement.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (14)
1. A die bonding module, comprising:
a die bond head structure (41);
mechanical arm structure (42), mechanical arm structure (42) include one-level vertical transmission structure (421) and second grade vertical transmission structure (422), second grade vertical transmission structure (422) are installed on one-level vertical transmission structure (421), gu crystal head structure (41) are installed on second grade vertical transmission structure (422).
2. The die bonding module according to claim 1, wherein the primary vertical transmission structure (421) comprises a die bonding mounting seat, a die bonding driving motor, a die bonding driving wheel, a die bonding synchronous belt, a die bonding driven wheel and a die bonding transmission screw rod, the die bonding driving motor is fixed on the die bonding mounting seat, the die bonding driving wheel is connected with the die bonding driving motor, the die bonding driving wheel and the die bonding driven wheel are driven by the die bonding synchronous belt, the die bonding driven wheel is connected with the die bonding transmission screw rod, and the secondary vertical transmission structure (422) is connected with the die bonding transmission screw rod.
3. The die bonding module according to claim 2, wherein the secondary vertical transmission structure (422) has a die bonding threaded hole matched with the die bonding transmission screw rod, and the die bonding transmission screw rod is inserted into the die bonding threaded hole.
4. The die bonding module according to claim 1, wherein the secondary vertical transmission structure (422) comprises a voice coil motor, and the die bonding head structure (41) is connected to the voice coil motor.
5. The die bond module according to any one of claims 1 to 4, wherein the die bond head structure (41) comprises a die bond head (411) and a die bond head connecting seat (412), the die bond head connecting seat (412) is fixed on the mechanical arm structure (42), and the die bond head (411) is mounted on the die bond head connecting seat (412) through magnetic force.
6. The die attach module of claim 5, wherein the die attach head (411) comprises a die attach head body and a die attach head mount, the die attach head mount having a mounting hole, the die attach head body being mounted in the mounting hole.
7. The die bonding module according to claim 6, wherein the die bonding head mounting seat comprises a ferromagnetic body, a first mounting section, a limiting section and a second mounting section, the limiting section is located between the first mounting section and the second mounting section, the ferromagnetic body is located on one side of the first mounting section far away from the limiting section, and the outer diameter of the limiting section is larger than that of the first mounting section.
8. The die attach module of claim 7, wherein the die attach head connecting base (412) comprises a base and a connecting tube, the connecting tube is disposed on a sidewall of the base and is capable of communicating with the die attach head body.
9. The die bonding module according to claim 8, wherein the mounting hole extends from the end of the second mounting section far away from the limiting section to the first mounting section, and a side wall of the first mounting section is provided with a communication hole which communicates the mounting hole and the connecting pipe.
10. The die attach module of claim 9, wherein the die attach head connector (412) further comprises a magnet, and the base comprises a receiving space, the magnet being disposed in the receiving space.
11. The die bonding module of claim 10, wherein the ferromagnetic member and the first mounting section are located in the accommodating space, and a mutually-matched limiting portion is provided between the first mounting section and a wall surface of the accommodating space.
12. The die bonding module according to claim 5, wherein the die bonding module (40) further comprises a die bonding head structure and a die bonding head storage structure, and the die bonding head structure and the die bonding head storage structure are both disposed on the mounting frame module (10).
13. A die bonder, comprising a die bonder module (40), wherein the die bonder module (40) is the die bonder module (40) according to any one of claims 1 to 12.
14. The die bonder of claim 13,
a mounting frame module (10), said robot arm structure (42) being mounted on said mounting frame module (10);
the dispensing module (20), the dispensing module (20) is arranged on the mounting frame module (10);
the material waiting module (30), the material waiting module (30) is arranged on the mounting frame module (10);
a blanking module (50), the blanking module (50) being arranged on the mount module (10);
the conveying module (60) is arranged on the mounting frame module (10) and can drive the carrier plate to move on the dispensing module (20), the material waiting module (30), the die bonding module (40) and the blanking module (50).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111642332.6A CN114300390A (en) | 2021-12-29 | 2021-12-29 | Die bonding module and die bonding machine with same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111642332.6A CN114300390A (en) | 2021-12-29 | 2021-12-29 | Die bonding module and die bonding machine with same |
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| CN114300390A true CN114300390A (en) | 2022-04-08 |
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