CN114360947A - Setting method of pressure-sensitive key switch with composite sensor - Google Patents
Setting method of pressure-sensitive key switch with composite sensor Download PDFInfo
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- CN114360947A CN114360947A CN202111423085.0A CN202111423085A CN114360947A CN 114360947 A CN114360947 A CN 114360947A CN 202111423085 A CN202111423085 A CN 202111423085A CN 114360947 A CN114360947 A CN 114360947A
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Abstract
The invention discloses a setting method of a pressure-sensitive key switch with a composite sensor, which comprises the steps of setting a strain support substrate part into at least one layer of sheet-shaped rectangular plane structure, and carrying out planarization processing operation on the rectangular plane structure to ensure that the flatness of the rectangular plane structure is not higher than 0.5 mm; arranging a lead line on the rectangular plane structure; the sensor part is arranged on one side of the rectangular plane structure of the strain support base material part or on the front side and the back side of the rectangular plane structure through one or more modes of a thick film printing mode, a thin film printing mode, a conductive layer coating mode or a wire etching mode, and the setting of the pressure-sensitive key switch is completed. The invention solves the problems that the prior pressure-sensitive key switch is difficult to detect and difficult to produce and process by adopting a jogging or dispensing gluing mode in the manufacturing process.
Description
Technical Field
The application relates to the technical field of key structures, in particular to a setting method of a pressure-sensitive key switch with a composite sensor.
Background
Currently, pressure-sensitive key switches including a composite sensor are being used as a switch device in various electronic devices, such as notebook computers, mice, keyboards, TWS headsets, handheld devices, or joysticks, in which the application of the pressure-sensitive key switch to provide an input function is being observed. The TWS earphone switch button is usually provided with a pressure-sensitive button switch at a position close to the earphone handle, and a user can sense the pressing force of the user by pressing the pressure-sensitive button switch with a finger, so that the equipment can generate corresponding actions.
The pressure key switch of the existing compound sensor mainly comprises: the pressure-sensitive display device includes a housing for a fixed key, an operating portion housed in the housing, and a pressure-sensitive detection unit for detecting deformation of the operating portion, wherein the operating portion is integrally formed by an operating portion, a fixed portion, and a deformable portion, the deformable portion is deformable by an operating force applied to the operating portion, the pressure-sensitive detection unit is provided in the deformable portion, the fixed portion is fixed in the housing for a fixed key, and the operating portion and the deformable portion are movable in the housing for a fixed key. The operation part of the input device is fixed inside the fixed key case. Therefore, when the operating force acts on the operating portion of the operating portion and the deformation portion deforms, the pressure-sensitive push switch of the composite sensor is less likely to fall off from the inside of the fixed-key case. Further, since the housing for fixing the key is small in size, it is easy to construct a small-sized input device. The conventional design of the pressure-sensitive key switch of this type of composite sensor mainly combines the deformation portion and the detection component by means of embedding or adhesive dispensing, or directly arranges the pressure-sensitive detection component on the deformation portion. Because a plurality of quality variables occur simultaneously during the embedding or glue dispensing and attaching, including inconsistent stress of the deformation part, micro deformation caused by the embedding or glue dispensing and attaching process, and mutual influence generated in the embedding or glue dispensing and attaching process of the detection assembly and the deformation part; because the characteristics of the embedding or glue dispensing and attaching mode processing lead to a plurality of processing steps, the calibration action is difficult to be continuously realized after the assembly, and the cost is high, thereby being not beneficial to the application and popularization of products.
Therefore, a new technical solution for a method of setting a pressure-sensitive push switch with a composite sensor is needed to solve the above problems.
Disclosure of Invention
The embodiment of the application provides a setting method of a pressure-sensitive key switch with a composite sensor, which solves the problems that in the manufacturing process of the current pressure-sensitive key switch, a plurality of quality variables, including inconsistent stress of a deformation part, micro-deformation caused by an embedding or glue dispensing and attaching process, and mutual influence generated in the embedding or glue dispensing and attaching process of a detection assembly and the deformation part occur simultaneously when an embedding or glue dispensing and attaching mode is adopted; the machining process steps are multiple due to the machining characteristics of the embedding or glue dispensing and attaching mode, the calibration action is difficult to achieve continuously after the assembly, and the cost is high, so that the product application and popularization are not facilitated.
In order to solve the above problem, an embodiment of the present application provides a method for setting a pressure-sensitive key switch having a composite sensor, including: setting the strain support substrate part into at least one layer of sheet-shaped rectangular plane structure, and carrying out planarization processing operation on one surface of the rectangular plane structure of the strain support substrate part or the front and back surfaces of the rectangular plane structure to ensure that the flatness of the one surface of the rectangular plane structure of the strain support substrate part or the front and back surfaces of the rectangular plane structure is not higher than 0.5 mm; arranging lead lines on one surface of the rectangular plane structure or the front surface and the back surface of the rectangular plane structure;
arranging the sensor part on one surface of the rectangular plane structure of the strain support base material part or on the front surface and the back surface of the rectangular plane structure by one or more modes of a thick film printing mode, a thin film printing mode, a conductive layer coating mode or a lead etching mode, and finishing the arrangement of the pressure-sensitive key switch; wherein the sensor part comprises at least one group of Wheatstone bridge pressure-sensitive sensors composed of conductor material and connecting circuit, wherein the conductor material is arranged in one or more of thick film printing, thin film printing, conductive layer coating or etched wire
Further, the method may further include: the wiring circuit is provided with a joint, and the connecting circuit is connected with one surface of the rectangular plane structure of the strain support base material part or the front surface and the back surface of the rectangular plane structure through the joint; wherein, the mode of setting up of laminating contact includes: one or more of a thin film printing mode, a conductive layer coating mode or a wire etching mode.
Further, the method may further include: the rectangular plane structure of the strain support substrate part is also provided with a structure of a through hole and/or a structure of a semi-blind hole, and a conductive material is tightly embedded into the through hole or the semi-blind hole to form a connecting part; the connecting part and the lead circuit form part of a connecting circuit, and the connecting circuit also comprises a flexible circuit board or a hard circuit board connected with the joint; the shape of the structure of the through hole or the structure of the semi-blind hole is adapted to the shape of the corresponding connecting part; the connecting part is set as a positioning point or a contact point, or the connecting part is jointed with the flexible circuit board or the hard circuit board by a strain supporting substrate part provided with a lead circuit, a joint contact point and a sensor part.
Further, the method may further include: the structure of the through hole is used for communicating two surfaces of the rectangular plane structure or positioning as an attaching joint, and the structure of the semi-blind hole is used for positioning the attaching joint; the connecting circuit is connected with the conductor material to form a Wheatstone bridge pressure-sensitive sensor, an ultrasonic sensor or a capacitive sensor, a sensor part formed by the sensors is arranged on one surface of a rectangular plane structure of the strain support base material part or on the front surface and the back surface of the rectangular plane structure, a lead circuit arranged on the strain support base material part is connected with the flexible circuit board or the hard circuit board through a bonding joint, the bonding joint is arranged on the same plane of the strain support base material part or on the front surface and the back surface of the strain support base material part, and the plane formed by the bonding joint and the lead circuit is tightly jointed with the surface of the strain support base material part.
Further, the method may further include: the setting laminating contact is two at least tie points, and a plurality of laminating contacts are arranged on the laminating plane of straining support substrate portion, this laminating plane is for the one side or the tow sides of rectangle planar structure of the strain support substrate portion that contains but not limited to the same layer.
Further, the method may further include: after the completion carries out wire circuit, laminating contact, sensor portion and connecting portion to the one side of the rectangle planar structure of the supporting substrate portion of the correspondence or the tow sides of the rectangle planar structure, carries out conducting material and conductor material's solidification operation to the supporting substrate portion of meeting an emergency that is provided with conducting wire, laminating contact, sensor portion and connecting portion, and wherein the solidification operation mode includes: heating and curing, normal temperature curing and photocuring.
Further, the method may further include: carrying out surface antioxidation protection operation on a strain support base material part provided with a conductive circuit, an attaching contact, a sensor part and a connecting part after curing operation of a conductive material and a conductor material; wherein, the surface oxidation resistance protection operation mode comprises the following steps: an antioxidant protective layer printing mode, an antioxidant protective layer coating mode or an antioxidant protective layer spraying and depositing mode.
Further, the method may further include: the planarization processing operation is carried out to one face of the rectangular planar structure or the positive and negative two faces of the rectangular planar structure of the strain support substrate part, and comprises the following steps: and the flatness of one surface of the rectangular plane structure or the flatness of the front surface and the back surface of the rectangular plane structure of the strain support substrate part are enabled to be not higher than 0.5 mm through a mechanical polishing mode or a plasma surface treatment operation mode.
Further, the method may further include: the sensor part comprises a Wheatstone bridge pressure sensor, an ultrasonic sensor or a capacitance sensor.
Further, the method may further include: the material of the strain support base material portion includes: BT resin substrate material, FR-4 substrate material, Teflon substrate material, CEM-1 substrate material, CEM-3 substrate material, zirconia ceramic material, alumina ceramic material or zirconia and alumina mixture ceramic material.
Compared with the prior art, use this application, through the rectangle planar structure who sets up the laminating contact on the surface of supporting substrate portion that meets an emergency, thereby the accessible contains but not only is limited to SMT, process such as heating pressfitting or Bonding will be equipped with the strain supporting substrate portion that the laminating contact joins together with sensor signal acquisition connecting circuit board, the sensor has been avoided and the shortcoming of gluing laminating flow or physics gomphosis flow is glued in the point, the process has been reduced, the discreteness of product has been reduced, each part is stable after the joint, the generation efficiency is improved, the processing cost is reduced simultaneously.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic structural diagram of a pressure-sensitive key switch with a composite sensor according to an embodiment of the present disclosure;
fig. 2 is a flowchart of a setting method of a pressure-sensitive key switch with a composite sensor according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a schematic diagram of a pressure-sensitive keyswitch with a composite sensor according to an exemplary embodiment, including: a strain support substrate part 201, a sensor part (the sensor part comprises a sensor part 101 which is formed by a capacitor sensor and a lead wire which are provided with conductive materials and a sensor part 301 which is formed by a thick film printing pressure-sensitive sensor), a connecting part 102 which can be provided through the conductive materials (can be provided as a filling hole or a buried hole), the connecting part 102 and a lead wire circuit which is provided form a part of a connecting circuit 103, the connecting circuit 103 can also comprise a flexible circuit board or a hard circuit board and a joint 104, and the connecting part 102 can also be used for positioning points or joints of the joint on the surface of a pressure-sensitive key switch; the strain support substrate part is arranged into at least one layer of sheet-shaped rectangular plane structure, the through hole 202 of the strain support substrate part can be arranged on the rectangular plane structure, the sensor part comprises but is not limited to a conductor material arrangement mode, and one or more groups of connecting circuits of the Wheatstone bridge pressure-sensitive sensor are formed, wherein the conductor material arrangement mode comprises one or more modes of a thick film printing mode, a thin film printing mode, a conducting layer coating mode or an etched wire mode which are arranged on one surface of the rectangular plane structure of the strain support substrate part or on the front surface and the back surface of the rectangular plane structure. The sensor part comprises at least one group of Wheatstone bridge pressure-sensitive sensors consisting of conductor materials and connecting circuits, and is arranged on one surface of the rectangular plane structure of the strain support substrate part or on the front surface and the back surface of the rectangular plane structure in one or more modes of a thick film printing mode, a thin film printing mode, a conductive layer coating mode or a wire etching mode. The conductor material is arranged in one or more of thick film printing mode, thin film printing mode, conducting layer coating mode or etched wire mode.
Through the rectangle planar structure who sets up the laminating on the surface at the support base material portion that meets an emergency in this application to the accessible contains but not only is limited to SMT, process such as heating pressfitting or Bonding will be equipped with the support base material portion that meets an emergency of binding face and sensor signal acquisition connecting circuit board and join together, avoided the sensor to carry out the shortcoming of point gluing laminating flow or physics gomphosis flow, the process has been reduced, the discreteness of product has been reduced, each part is stable after the joint, generation efficiency has been improved, the processing cost has been reduced simultaneously.
The rectangular plane structure of the strain support substrate part can also be provided with a through hole structure and/or a semi-blind hole structure, the through hole structure can be used for arranging a conducting material to be communicated with two surfaces of the rectangular plane structure or a conducting wire circuit formed by the conducting material, and can be used for positioning points or connecting points of joint points on the surface of the pressure-sensitive key switch; the shape of the through hole is adapted to the shape of the corresponding connecting part, and the conductive material corresponding to the through hole is tightly embedded into the through hole; the semi-blind hole is used for filling required conductive materials and can be used for positioning points or connection points of the joint connection points on the surface of the pressure-sensitive key switch. The structure of through-hole or the structure of half blind hole set up and can ensure to fill required conducting material well, easily processing, convenient assemblage, and the setpoint or the contact of the laminating contact that simultaneously is regarded as the pressure and feels key switch surface can reduce the assemblage error, improves production efficiency.
The shape of the through-hole includes: square, polygonal, circular or elliptical; the shape of the semi-blind hole comprises: square, polygonal, circular or elliptical. The through hole is preferably formed by a circular hole, the diameter of the circular hole is larger than or equal to 0.01mm and smaller than or equal to 2.20mm, and the diameter of the circular hole is set in actual operation, so that the circular hole is easy to process, and conductive materials corresponding to the through hole are conveniently and tightly embedded into the through hole.
The rectangular plane structure of the strain support base material part also can be free of a structure of a through hole and/or a structure of a semi-blind hole, and the joint can be connected with the outside in a flying line mode or connected with the front side and/or the back side of the rectangular plane structure.
The sensor portion includes, but is not limited to, a wheatstone bridge pressure sensor, an ultrasonic sensor, or a capacitive sensor; the sensor part is arranged on one side of the rectangular plane structure of the strain support substrate part or on the front side and the back side of the rectangular plane structure in one or more modes of a thick film printing mode, a thin film printing mode, a conductive layer coating mode or a lead etching mode. The sensor is arranged in various modes, so that the device can be applied to scenes of various key switches, and the requirements of production and application are better met.
The connecting circuit comprises a flexible circuit board or a hard circuit board and a bonding joint, and is connected with one surface of the rectangular plane structure of the strain support base material part or the front surface and the back surface of the rectangular plane structure through the bonding joint; wherein, the mode of setting up of laminating contact includes: one or more of thick film printing, thin film printing, conductive layer coating, and etched wire. Through the arrangement mode of the wire circuit, the connection and the accurate positioning are convenient, the production is convenient, and the improvement of the production efficiency is facilitated.
The wire circuit can also comprise a through hole for connecting the front side and the back side of the rectangular plane structure, and the through hole is used for communicating the two sides of the rectangular plane structure or used for positioning a joint of a connecting circuit; the connecting circuit is connected with each sensor part (the sensor parts comprise a Wheatstone bridge pressure-sensitive sensor, an ultrasonic sensor or a capacitance sensor) and arranged on one surface or the front and back surfaces of the rectangular plane structure of the strain support base material part, wherein the lead circuit arranged on the strain support base material part is connected with the flexible circuit board or the hard circuit board through a bonding joint and is arranged on the same plane or the front and back surfaces of the strain support base material part, and the plane formed by the bonding joint and the lead circuit is tightly bonded with the surface of the strain support base material part. The arrangement of the laminating joint avoids the defects of a sensor glue dispensing laminating flow or a physical embedding flow, reduces the processes, reduces the discreteness of products, is stable after the components are jointed, improves the generation efficiency and reduces the processing cost.
The conductor lines are mainly circuits formed on the rectangular plane structure through the arranged conductive materials. The connecting circuit is a whole circuit consisting of a wire circuit, a connecting part and a flexible circuit board or a hard circuit board.
The bonding joints can be arranged into at least two connecting points, and a plurality of bonding joints are arranged on a bonding plane of the strain support base material part, wherein the bonding plane is one surface of a rectangular plane structure or the front surface and the back surface of the rectangular plane structure of the strain support base material part of the same layer or is not limited to the same layer. The mode of setting up of laminating contact can pass through SMT with the supporting substrate portion that meets an emergency that is equipped with binding face location structure and sensor signal acquisition control circuit board, and process such as heating pressfitting or binding is in the same place, has avoided the sensor to carry out the shortcoming of gluing laminating flow or physics gomphosis flow, has reduced the process, has reduced the discreteness of product, and each part is stable after the joint, has improved generation efficiency, has reduced the processing cost simultaneously.
The materials of the strain support substrate portion include, but are not limited to: BT resin substrate material, FR-4 substrate material, Teflon substrate material, CEM-1 substrate material, CEM-3 substrate material, zirconia ceramic material, alumina ceramic material, or zirconia and alumina mixture ceramic material, etc. has heat distortion temperature higher than 200 deg.c, small dielectric constant and dielectric loss tangent, high water resistance, high heat resistance and low creep property. The material of the strain support base material part is convenient to process in actual production, can improve the processing precision and is beneficial to improving the production efficiency.
The strain support substrate part is made of zirconia ceramic materials, alumina ceramic materials or zirconia and alumina mixture ceramic materials, and is not easy to deform, a glue dispensing and attaching process or a physical embedding process is omitted, process variables in the process flow are reduced, the probability of problems in the process flow is greatly avoided, the production efficiency is improved, and the production cost is reduced.
The conductive material and the conductor material are configured to include, but not limited to, a plated conductive material, a warm-dry conductive material, a room-temperature-dry conductive material, a thermal-sintering conductive material, or a photosensitive conductive material. By adopting the conductive material, stable and excellent conductivity is ensured, and good water resistance and heat resistance are achieved, and the bonding strength with the material of the strain support base material part is high.
As shown in fig. 2, the method for setting a pressure-sensitive key switch with a composite sensor of the present application may include the following steps:
through the rectangle planar structure who sets up the laminating on the surface of supporting substrate portion that meets an emergency in this application to the accessible contains but not only is limited to SMT, process such as heating pressfitting or binding will meet an emergency supporting substrate portion and sensor signal acquisition connecting circuit board and join together, avoided the sensor to carry out the shortcoming of gluing laminating flow or physics gomphosis flow, reduced the process, reduced the discreteness of product, each part joint back is stable, generation efficiency is improved, the processing cost is reduced simultaneously.
The planarization processing operation is carried out to one face of the rectangular planar structure or the positive and negative two faces of the rectangular planar structure of the strain support substrate part, and comprises the following steps: and the flatness of one surface of the rectangular plane structure or the front and back surfaces of the rectangular plane structure of the strain support substrate part is not higher than 0.5 mm by a mechanical polishing mode or plasma surface treatment operation. The mechanical polishing mode is low in cost, and the plasma surface treatment operation mode is high in precision.
Carry out the planarization processing operation through the one side of the rectangular plane structure of supporting substrate portion that becomes or the tow sides of rectangular plane structure, make the planar one side of the rectangular structure of supporting substrate portion that meets an emergency or the roughness of the tow sides of rectangular plane structure not more than 0.5 millimeter, in the actual test, when the roughness is not more than 0.5 millimeter, can ensure the precision after each part joint, the pressure is felt key switch and is easily processed, convenient assemblage, generation efficiency has been improved, and the processing cost is reduced simultaneously.
Step 22, arranging a connecting part filled with a conductive material to be tightly embedded into the through hole and/or the semi-blind hole corresponding to the connecting part, wherein the connecting part and the arranged conductor circuit of the conductive material form part of a connecting circuit; a bonding contact is arranged on the lead circuit, and the connecting circuit is connected with one surface of the rectangular plane structure of the strain support base material part or the front surface and the back surface of the rectangular plane structure through the bonding contact; the structure of the through hole is used for communicating two surfaces of the rectangular plane structure or used for positioning the joint, and the structure of the semi-blind hole can be used for positioning the joint; the connecting circuit is connected with each sensor part to form a Wheatstone bridge pressure-sensitive sensor, an ultrasonic sensor or a capacitive sensor, the formed sensors are arranged on one surface of the rectangular plane structure of the strain support base material part or on the front surface and the back surface of the rectangular plane structure, the lead circuit arranged on the strain support base material part is connected with the flexible circuit board or the hard circuit board through a bonding joint and is arranged on the same plane or the front surface and the back surface of the strain support base material part, and the plane formed by the bonding joint and the lead circuit is tightly bonded with the surface of the strain support base material part; wherein, the mode of setting up of laminating contact includes: thick film or thin film printing, conductive layer coating or wire etching; the bonding joints are at least two connecting points, and the bonding joints are arranged on a bonding plane of the strain support base material part, wherein the bonding plane is one surface of a rectangular structure plane or the front surface and the back surface of the rectangular structure plane of the strain support base material part of the same layer;
through the rectangle planar structure who sets up the laminating contact on the surface of supporting substrate portion that meets an emergency in this application, thereby the accessible contains but not only is limited to SMT, process such as heating pressfitting or Bonding will be equipped with the strain supporting substrate portion that the laminating contact joins together with sensor signal acquisition connecting circuit board, the sensor has been avoided and the shortcoming of laminating flow or physics gomphosis flow is glued to the point, the process has been reduced, the discreteness of product has been reduced, each part is stable after the joint, the generation efficiency has been improved, the processing cost is reduced simultaneously.
The material of the lead wire circuit is set to include but not limited to a coating type conductive material, a heating drying type conductive material, a normal temperature drying type conductive material, a thermal sintering type conductive material or a photosensitive type conductive material. The conductive material is adopted as the material of the lead circuit, so that the stable and excellent conductivity is ensured, and the water resistance and the heat resistance are good, and the bonding strength with the material of the strain support base material part is high.
Wherein the curing operation mode comprises the following steps: heating and curing, normal temperature curing and photocuring. Through the curing operation of each part, the mechanical property and the heat resistance of each part are improved, and the stability and the service life of the pressure-sensitive key switch of the composite sensor are further improved.
Wherein, the surface oxidation resistance protection operation mode comprises the following steps: an anti-oxidation protective layer printing mode, an anti-oxidation protective layer coating mode or an anti-oxidation protective layer deposition etching mode. Through the surface anti-oxidation protection operation treatment of each part, the anti-corrosion, anti-oxidation, sealing and wear-resistant protection of the matrix of each part can be protected in a high-temperature environment, the stability is high, and the service life of the pressure-sensitive key switch of the composite sensor is further prolonged.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It should be noted that all the embodiments in the present application are described in a related manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, as for the apparatus embodiment, since it is substantially similar to the method embodiment, the description is relatively simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A method for setting a pressure-sensitive key switch with a composite sensor is characterized by comprising the following steps:
setting the strain support substrate part into at least one layer of sheet-shaped rectangular plane structure, and carrying out planarization processing operation on one surface of the rectangular plane structure of the strain support substrate part or the front and back surfaces of the rectangular plane structure to ensure that the flatness of the one surface of the rectangular plane structure of the strain support substrate part or the front and back surfaces of the rectangular plane structure is not higher than 0.5 mm; arranging lead lines on one surface of the rectangular plane structure or the front surface and the back surface of the rectangular plane structure;
arranging the sensor part on one surface of the rectangular plane structure of the strain support base material part or on the front surface and the back surface of the rectangular plane structure by one or more modes of a thick film printing mode, a thin film printing mode, a conductive layer coating mode or a lead etching mode, and finishing the arrangement of the pressure-sensitive key switch; the sensor part comprises at least one group of Wheatstone bridge pressure-sensitive sensors formed by arranging conductor materials and connecting lines, wherein the arrangement mode of the conductor materials comprises one or more of a thick film printing mode, a thin film printing mode, a conductive layer coating mode or an etched wire mode.
2. The setting method according to claim 1, further comprising:
the wiring circuit is provided with a joint, and the connecting circuit is connected with one surface of the rectangular plane structure of the strain support base material part or the front surface and the back surface of the rectangular plane structure through the joint; wherein, the mode of setting up of laminating contact includes: one or more of a thin film printing mode, a conductive layer coating mode or a wire etching mode.
3. The setting method according to claim 2, further comprising:
the rectangular plane structure of the strain support substrate part is also provided with a structure of a through hole and/or a structure of a semi-blind hole, and a conductive material is tightly embedded into the through hole or the semi-blind hole to form a connecting part; the connecting part and the lead circuit form part of a connecting circuit, and the connecting circuit also comprises a flexible circuit board or a hard circuit board connected with the joint; the shape of the structure of the through hole or the structure of the semi-blind hole is adapted to the shape of the corresponding connecting part; the connecting part is set as a positioning point or a contact point, or the connecting part is jointed with the flexible circuit board or the hard circuit board by a strain supporting substrate part provided with a lead circuit, a joint contact point and a sensor part.
4. The setting method according to claim 3, further comprising:
the structure of the through hole is used for communicating two surfaces of the rectangular plane structure or positioning as an attaching joint, and the structure of the semi-blind hole is used for positioning the attaching joint; the connecting circuit is connected with the conductor material to form a Wheatstone bridge pressure-sensitive sensor, an ultrasonic sensor or a capacitive sensor, a sensor part formed by the sensors is arranged on one surface of a rectangular plane structure of the strain support base material part or on the front surface and the back surface of the rectangular plane structure, a lead circuit arranged on the strain support base material part is connected with the flexible circuit board or the hard circuit board through a bonding joint, the bonding joint is arranged on the same plane of the strain support base material part or on the front surface and the back surface of the strain support base material part, and the plane formed by the bonding joint and the lead circuit is tightly jointed with the surface of the strain support base material part.
5. The setting method according to claim 2 or 4, characterized by further comprising:
the setting laminating contact is two at least tie points, and a plurality of laminating contacts are arranged on the laminating plane of straining support substrate portion, this laminating plane is for the one side or the tow sides of rectangle planar structure of the strain support substrate portion that contains but not limited to the same layer.
6. The setting method according to claim 5, further comprising:
after the completion carries out wire circuit, laminating contact, sensor portion and connecting portion to the one side of the rectangle planar structure of the supporting substrate portion of the correspondence or the tow sides of the rectangle planar structure, carries out conducting material and conductor material's solidification operation to the supporting substrate portion of meeting an emergency that is provided with conducting wire, laminating contact, sensor portion and connecting portion, and wherein the solidification operation mode includes: heating and curing, normal temperature curing and photocuring.
7. The setting method according to claim 6, further comprising:
carrying out surface antioxidation protection operation on a strain support base material part provided with a conductive circuit, an attaching contact, a sensor part and a connecting part after curing operation of a conductive material and a conductor material; wherein, the surface oxidation resistance protection operation mode comprises the following steps: an antioxidant protective layer printing mode, an antioxidant protective layer coating mode or an antioxidant protective layer spraying and depositing mode.
8. The setting method as recited in claim 7,
the planarization processing operation is carried out to one face of the rectangular planar structure or the positive and negative two faces of the rectangular planar structure of the strain support substrate part, and comprises the following steps: and the flatness of one surface of the rectangular plane structure or the flatness of the front surface and the back surface of the rectangular plane structure of the strain support substrate part are enabled to be not higher than 0.5 mm through a mechanical polishing mode or a plasma surface treatment operation mode.
9. The setting method as recited in claim 8,
the sensor part comprises a Wheatstone bridge pressure sensor, an ultrasonic sensor or a capacitance sensor.
10. The setting method as recited in claim 9,
the material of the strain support base material portion includes: BT resin substrate material, FR-4 substrate material, Teflon substrate material, CEM-1 substrate material, CEM-3 substrate material, zirconia ceramic material, alumina ceramic material or zirconia and alumina mixture ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111423085.0A CN114360947A (en) | 2021-11-26 | 2021-11-26 | Setting method of pressure-sensitive key switch with composite sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111423085.0A CN114360947A (en) | 2021-11-26 | 2021-11-26 | Setting method of pressure-sensitive key switch with composite sensor |
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