CN212379823U - Pressure sensing film, touch module and electronic equipment - Google Patents
Pressure sensing film, touch module and electronic equipment Download PDFInfo
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- CN212379823U CN212379823U CN202021140374.0U CN202021140374U CN212379823U CN 212379823 U CN212379823 U CN 212379823U CN 202021140374 U CN202021140374 U CN 202021140374U CN 212379823 U CN212379823 U CN 212379823U
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Abstract
The application discloses pressure sensing film, touch module and electronic equipment. The pressure sensing film comprises a first substrate and a second substrate which are oppositely arranged, a supporting piece arranged between the first substrate and the second substrate, a first conductive block and a second conductive block, wherein the surface of at least one conductive block of the first conductive block and the second conductive block, which is adjacent to the other conductive block, is provided with a concave-convex structure. Under the external force pressing, the first conductive block is contacted with the second conductive block, so that the contact impedance between the first conductive block and the second conductive block is changed. Along with the increase of the deformation amount of the pressure, the contact area of the two conductive blocks is larger and smaller, and the contact impedance is smaller and smaller, so that the magnitude of the applied pressure is detected by detecting the change of the contact impedance. The pressure sensing film has a simpler structure.
Description
Technical Field
The application relates to the technical field of pressure sensing, in particular to a pressure sensing film, a touch module and electronic equipment.
Background
In the related art, most of the pressure sensing schemes of the touch display device employ metal gates or semiconductors to detect pressure changes. The metal gate scheme is deformed after pressure is applied to a cover plate of the touch display device, then the metal gate is driven to deform, so that the impedance of the metal gate changes, and the metal gate deforms differently under different pressures, so that different impedance change conditions are obtained. The semiconductor scheme utilizes that when a semiconductor material is acted by an external force in a certain axial direction, the resistivity rho of the semiconductor material is greatly changed, so that the impedance is changed. However, the pressure sensing scheme of the related art has the problems of complicated process and high cost.
SUMMERY OF THE UTILITY MODEL
The application provides a pressure sensing film, a touch module and an electronic device, which can detect the pressure change condition applied to the pressure sensing film by adopting a simple structure.
In a first aspect, an embodiment of the present application provides a pressure sensing film, which includes a first substrate and a second substrate that are disposed opposite to each other, a supporting member disposed between the first substrate and the second substrate, and a first conductive block and a second conductive block, where the first conductive block is disposed on a surface of the first substrate adjacent to one side of the second substrate, and the second conductive block is disposed on a surface of the second substrate adjacent to one side of the first substrate. The surface of at least one of the first conductive block and the second conductive block, which is adjacent to the other conductive block, is provided with a concave-convex structure, and when pressure is applied to at least one of the first substrate and the second substrate, the first conductive block can be contacted with the second conductive block, so that the magnitude of the pressure can be detected by detecting the change of contact resistance caused by the change of the contact area between the first conductive block and the second conductive block.
According to the pressure sensing film of the embodiment of the application, the first conductive blocks on the surface of the first substrate are contacted with the second conductive blocks on the surface of the second substrate under the pressing of an external force. Because the surface of at least one of the first conductive block and the second conductive block is provided with the concave-convex structure, under the action of external pressure, the concave-convex structure on one conductive block is in contact with the concave-convex structure on the other conductive block or the surface of the conductive block and deforms, the deformation amount of the concave-convex structure is larger along with the increase of the pressure, the contact area of the two conductive blocks is larger and larger, so that the contact impedance between the first conductive block and the second conductive block is smaller and smaller, and the contact impedance between the first conductive block and the second conductive block can be detected by detecting the change of the contact impedance so as to detect the magnitude of the applied pressure. Moreover, the pressure sensing film structure in the pressure sensing film scheme is simple.
In some of these embodiments, the roughness of the surface having a textured structure ranges from 0.02 μm to 1 μm.
Based on the above embodiment, the surface roughness of the concave-convex structure is too large or too small, so that the effective contact area change range between the first conductive block and the second conductive block is small, the contact impedance change range between the first conductive block and the second conductive block is small, and the pressure change range for detection is small.
In some of these embodiments, at least one of the first conductive block and the second conductive block has a surface impedance greater than 100 Ω/cm2。
Based on the above embodiment, the first conductive block and the second conductive block may not be simultaneously made of a material with high conductivity, so as to prevent the contact impedance variation range after the first conductive block and the second conductive block are contacted from being too small, and ensure that the pressure sensing film has sufficient sensitivity.
In some embodiments, one of the first conductive block and the second conductive block is a silver paste conductive block, and the other is a carbon paste conductive block.
Based on the embodiment, the surface impedance range of the silver paste conductive block is 5 omega/cm2～20Ω/cm2The surface impedance range of the carbon paste conductive block is 200 omega/cm2～2000Ω/cm2The required contact resistance variation range requirement can be obtained under the condition that the first conductive block and the second conductive block are contacted.
In some of the embodiments, the first conductive bumps have a thickness in a direction perpendicular to the plate surface of the first substrate in a range of 2 μm to 30 μm, and the second conductive bumps have a thickness in a direction perpendicular to the plate surface of the second substrate in a range of 2 μm to 30 μm.
Based on the embodiment, the concave-convex structure ratio is regulated and controlled by regulating and controlling the thicknesses of the first conductive block and the second conductive block, so that the structural stability of the first conductive block and the second conductive block is facilitated on the one hand, and the thickness of the pressure sensing film is convenient to regulate and control on the other hand under the condition that the requirement of the contact impedance variation range of the first conductive block and the second conductive block is met.
In some of these embodiments, the surface of the first conductive block adjacent to the second conductive block is spaced apart from the surface of the second conductive block adjacent to the first conductive block by a distance in a range from 25 μm to 200 μm.
Based on the above embodiment, a gap is provided between the first conductive block and the second conductive block, so as to prevent the first conductive block and the second conductive block from being touched easily due to too close gap to cause false touch, or prevent the gap between the first conductive block and the second conductive block from being too large to increase the overall thickness of the pressure sensing film.
In some of these embodiments, the support member has a Young's modulus less than or equal to 500 MPa.
Based on the above embodiment, the support member provides support to prevent the first conductive block and the second conductive block from easily contacting, and maintains the stability of the touch film. Under the condition of removing the external force, the supporting piece recovers deformation to separate the first conductive block from the second conductive block.
In some of these embodiments, the number of first and second conductive bumps is at least one. The pressure sensing film further comprises a first conductive lead and a second conductive lead, wherein the first conductive lead and the second conductive lead are used for conducting pressure sensing signals, one end of the first conductive lead is connected with the first conductive block, the other end of the first conductive lead is led out to be connected with an external flexible circuit board through the periphery of the first conductive block or between two adjacent first conductive blocks, one end of the second conductive lead is connected with the second conductive block, and the other end of the second conductive lead is led out to be connected with the flexible circuit board through the periphery of the second conductive block or between two adjacent second conductive blocks.
Based on the above embodiment, the pressure sensing film can be divided into at least one touch area, and the application scenarios of the pressure sensing film can be increased. The first conductive lead and the second conductive lead transmit the detected contact impedance change condition to the flexible circuit board, a processing circuit on the flexible circuit board detects the pressure and detects the position of the touch area to which the pressure is applied.
In some embodiments, the number of the supporting members is at least one and is uniformly distributed at the periphery of the first conductive block and the second conductive block or between two adjacent first conductive blocks and two adjacent second conductive blocks.
Based on the above embodiment, the touch stability of the pressure sensing film can be maintained by the support member, and the support member is flexibly arranged.
In a second aspect, an embodiment of the present application provides a touch module, which includes a flexible circuit board and the pressure sensing film as described above. The first conductive block and the second conductive block are connected with the flexible circuit board through conductive leads, and when pressure is applied to at least one of the first substrate and the second substrate, a contact impedance change signal caused by the change of the contact area between the first conductive block and the second conductive block is transmitted to the flexible circuit board, so that a processing circuit on the flexible circuit board detects the pressure.
Based on the touch module that this application embodiment provided, simple structure assembles the convenience, is suitable for mass production processing, and the range of application is extensive.
In a third aspect, an embodiment of the present application provides an electronic device, which includes a housing and the touch module as described above, where the touch module is disposed in the housing.
Based on the electronic equipment provided by the embodiment of the application, the touch module transmits the contact impedance change condition caused by the pressure applied to the touch module to the flexible circuit board, and the processing circuit on the flexible circuit board analyzes the applied pressure. The touch control die is simple in structure and convenient to assemble, and the assembling efficiency of the electronic equipment is improved conveniently.
According to the pressure sensing film, the touch module and the electronic equipment, under the external force pressing, the first conductive blocks on the surface of the first substrate of the pressure sensing film are in contact with the second conductive blocks on the surface of the second substrate, so that the contact impedance between the first conductive blocks and the second conductive blocks is changed. Because the concave-convex structure is arranged on the surface of at least one of the first conductive block and the second conductive block, the deformation of the concave-convex structure is increased along with the increase of the pressure, the contact area of the two conductive blocks is increased, the contact impedance between the first conductive block and the second conductive block is decreased, and the magnitude of the applied pressure can be detected by detecting the change of the contact impedance between the first conductive block and the second conductive block. The pressure sensing film provided by the embodiment of the application has the advantages of simple structure and wide application range. The touch module and the electronic device provided with the pressure sensing film can also detect the magnitude of the applied pressure by detecting the contact impedance change of the first conductive block and the second conductive block.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of a pressure sensing membrane structure according to an embodiment of the present disclosure;
FIG. 2 is a partial schematic structural diagram illustrating a first conductive block and a second conductive block not in contact according to an embodiment of the present disclosure;
FIG. 3 is a partial schematic diagram of an initial contact of a first conductive block and a second conductive block according to an embodiment of the present disclosure;
FIG. 4 is a partial schematic structural diagram illustrating a first conductive block and a second conductive block in full contact according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural diagram illustrating a pressure sensing film pressed by an external force according to an embodiment of the present disclosure;
FIG. 6 is a schematic perspective view illustrating a pressure sensing film without a first substrate mounted thereon according to an embodiment of the present disclosure;
FIG. 7 is a schematic perspective view of another embodiment of the present disclosure, wherein the first substrate is not mounted on the pressure sensing film;
FIG. 8 is a schematic perspective view of a pressure sensing membrane without a first substrate mounted thereon according to yet another embodiment of the present disclosure;
fig. 9 is a schematic perspective view illustrating an assembled structure of a touch module according to an embodiment of the present disclosure;
FIG. 10 is a flow chart of a pressure sensing method according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The embodiment of the present application provides a pressure sensing film 100, as shown in fig. 1, including a first substrate 111 and a second substrate 112 disposed opposite to each other, a supporting member 130 disposed between the first substrate 111 and the second substrate 112, and a first conductive block 121 and a second conductive block 122, where the first conductive block 121 is disposed on a surface of the first substrate 111 adjacent to a side of the second substrate 112, and the second conductive block 122 is disposed on a surface of the second substrate 112 adjacent to a side of the first substrate 111. At least one of the first conductive block 121 and the second conductive block 122 has a concave-convex structure 123 adjacent to the surface of the other conductive block, and when a pressure is applied to at least one of the first substrate 111 and the second substrate 112, the first conductive block 121 and the second conductive block 122 can be in contact with each other, so that the magnitude of the pressure can be detected by detecting a change in contact resistance caused by a change in contact area between the first conductive block 121 and the second conductive block 122.
The pressure sensing film 100 of the embodiment of the present application presses the first conductive bumps 121 on the surface of the first substrate 111 into contact with the second conductive bumps 122 on the surface of the second substrate 112 under an external force. Because the surface of at least one of the first conductive block 121 and the second conductive block 122 is provided with the concave-convex structure 123, under the action of external pressure, the concave-convex structure 123 on one conductive block contacts with the concave-convex structure 123 on the other conductive block or the surface of the conductive block and deforms. Fig. 2 is a schematic diagram of the first conductive block 121 and the second conductive block 122 when they are not in contact, fig. 3 is a schematic diagram of the first conductive block 121 and the second conductive block 122 when they are in initial contact, and fig. 4 is a schematic diagram of the first conductive block 121 and the second conductive block 122 when they are in complete contact, the contact area of the two conductive blocks becomes larger and larger with the increase of pressure, so that the contact resistance between the first conductive block 121 and the second conductive block 122 becomes smaller and smaller, and therefore, the magnitude of the applied pressure can be detected by detecting the change of the contact resistance between the first conductive block 121 and the second conductive block 122. Also, the pressure sensing diaphragm 100 of the above pressure sensing diaphragm solution is relatively simple in structure.
The first substrate and the second substrate can move in whole or partially deform when pressed by an external force, and correspondingly, the first conductive block 121 and the second conductive block 122 can also move in whole or partially deform.
When the first conductive block 121 and the second conductive block 122 move over the whole surface, the first conductive block 121 contacts with the second conductive block 122 over the whole surface, and the change of the contact area between the two conductive blocks is only affected by the deformation of the concave-convex structure 123. The sensing manner in which the first conductive block 121 and the second conductive block 122 move over the whole surface to make contact is suitable for a structure with a small pressure sensing area or only requiring a single operation, for example, a switch key, a mute key, and the like.
As shown in fig. 5, when the first conductive block 121 and the second conductive block 122 are deformed locally, in addition to the deformation of the concave-convex structure 123 on the surface of the two conductive blocks affecting the contact area, the contact area in the contact plane of the first conductive block 121 and the second conductive block 122 will also affect the total effective contact area between the first conductive block 121 and the second conductive block 122, and further affect the contact impedance. The sensing manner in which the local deformations of the first conductive block 121 and the second conductive block 122 are in contact is suitable for a structure with a large pressure sensing area or a structure that needs to implement multiple touch operations, for example, the first conductive block 121 and the second conductive block 122 may be divided into multiple touch areas, one of the conductive blocks is pressed to make the local deformations of the two conductive blocks in contact with the corresponding touch area, so that the contact impedance in the current touch area changes, but the two conductive blocks in the other touch areas do not contact with each other, and then the change of the contact impedance in all the touch areas is fed back to, for example, a back-end control system of the electronic device to analyze and execute the corresponding operation.
Under the condition that the first base material and the second base material need to be deformed, the first base material and the second base material should be made of materials which can be deformed and can restore to the initial state after being deformed, for example, the first base material and the second base material can be made of one of resin materials such as PET, PP, PC and the like. Under the condition that the first base material and the second base material do not need to deform, the first base material and the second base material can also be made of hard materials. Of course, the first substrate and the second substrate may be made of the same material, or different materials. Specifically, the materials of the first substrate and the second substrate can be selected according to actual operation requirements.
The uneven structure 123 is a main factor affecting the effective contact area of the first conductive bumps 121 and the second conductive bumps 122, in the embodiment of the present application, the roughness of the surface where the first conductive bumps 121 and the second conductive bumps 122 are provided with the uneven structure 123 ranges from 0.02 μm to 1 μm, for example, the roughness of the surface of the uneven structure 123 may be set to 0.02 μm, 0.2 μm, 0.5 μm, or 1 μm. When the roughness of the surface of the rugged structure 123 is less than 0.02 μm, the effective contact area when the first conductive piece 121 and the second conductive piece 122 are in contact is small, and the amount of deformation occurring when the rugged structure 123 is pressed by an external force is small, resulting in a small maximum effective contact area in a state where the first conductive piece 121 and the second conductive piece 122 are in complete contact. When the roughness of the surface of the rugged structure 123 is greater than 1 μm, the interval between two adjacent protruding ends of the rugged structure 123 is too large, which also results in too small effective contact area of the first conductive block 121 and the second conductive block 122 in the complete contact state. Therefore, the surface roughness of the concave-convex structure 123 is too large or too small, which results in a small variation range of the contact resistance between the first conductive block 121 and the second conductive block 122, and thus a small variation range of the detected pressure. Preferably, the roughness of the surface of the rugged structure 123 ranges from 0.05 μm to 0.2 μm, so as to obtain a wider range of contact resistance variation and higher sensitivity in the pressure detection process.
The first conductive block 121 and the second conductive block 122 cause contact resistance change through contact area change, and the material selected for the first conductive block 121 and the second conductive block 122 needs to be oneThe determined surface impedance can be applied to the pressure sensing film 100, and the variation range of the contact impedance after the first conductive block 121 and the second conductive block 122 are contacted cannot be too small, that is, the first conductive block 121 and the second conductive block 122 cannot be made of materials with stronger conductivity at the same time. In the embodiment of the present application, at least one of the surface impedances of the first conductive piece 121 and the second conductive piece 122 is greater than 100 Ω/cm2. For example, the surface impedance range of the carbon paste conductive block is 200 omega/cm2～2000Ω/cm2The surface impedance is more than 100 omega/cm2Then, one of the first conductive block 121 and the second conductive block 122 may be a carbon paste conductive block, and the other may have a surface impedance greater than 100 Ω/cm2Or less than 100 omega/cm2The conductive block of (2) may be used. Specifically, the material of the first conductive block 121 and the second conductive block 122 may be determined according to actual requirements.
In some embodiments, one of the first conductive block 121 and the second conductive block 122 is a conductive block of silver paste, and the other is a conductive block of carbon paste. The surface impedance range of the silver paste conductive block is 5 omega/cm2～20Ω/cm2The silver paste conductive block is used in cooperation with the carbon paste conductive block, so that a desired contact resistance can be obtained when the first conductive block 121 and the second conductive block 122 are in contact.
At least one surface of the first conductive block 121 and the second conductive block 122 is provided with a concave-convex structure 123, the concave-convex structure 123 has a thickness along a direction perpendicular to the plate surface of the first substrate 111 or along a direction perpendicular to the plate surface of the second substrate 112, and further, a ratio range of the thickness of the concave-convex structure 123 to the thicknesses of the first conductive block 121 and the second conductive block 122 needs to be controlled. In some embodiments, the first conductive bumps 121 have a thickness in a direction perpendicular to the plate surface of the first substrate 111 in a range of 2 μm to 30 μm, and the second conductive bumps 122 have a thickness in a direction perpendicular to the plate surface of the second substrate 112 in a range of 2 μm to 30 μm. The concave-convex structure 123 is prevented from being too thick in the direction perpendicular to the plate surface of the first substrate 111 or in the direction perpendicular to the plate surface of the second substrate 112, which affects the structural stability of the first conductive block 121 and the second conductive block 122, or the first conductive block 121 and the second conductive block 122 are prevented from being too thick, which increases the overall thickness of the pressure sensing film 100. Preferably, in the embodiment of the present application, the thickness of the first conductive bump 121 along the direction perpendicular to the plate surface of the first substrate 111 is in a range of 5 μm to 10 μm, and the thickness of the second conductive bump 122 along the direction perpendicular to the plate surface of the second substrate 112 is in a range of 5 μm to 10 μm.
It is understood that the first conductive block 121 and the second conductive block 122 are not in contact without being pressed by an external force, and the distance between the two opposite surfaces of the first conductive block 121 and the second conductive block 122 is greater than zero, but in order to ensure safety of mass assembly in actual assembly, in some embodiments, the distance between the surface of the first conductive block 121 adjacent to the second conductive block 122 and the surface of the second conductive block 122 adjacent to the first conductive block 121 is in a range of 25 μm to 200 μm. The first conductive block 121 and the second conductive block 122 are prevented from being too close to each other to easily contact each other to cause a false touch, or the first conductive block 121 and the second conductive block 122 are prevented from being too large to increase the thickness of the whole pressure sensing film 100. Preferably, in the embodiment of the present invention, the distance between the surface of the first conductive block 121 adjacent to the second conductive block 122 and the surface of the second conductive block 122 adjacent to the first conductive block 121 is in the range of 50 μm to 100 μm.
When the external force presses the first conductive block 121 and the second conductive block 122 to be close to each other, the supporting member 130 disposed between the first substrate and the second substrate is pressed to deform, and after the external pressure is released, the supporting member 130 recovers to deform, so that the first substrate and the second substrate are away from each other, and the first conductive block 121 and the second conductive block 122 are separated. Under the condition of no external force pressing, the supporting member 130 can also provide support to prevent the first conductive block 121 and the second conductive block 122 from easily contacting, so as to maintain the stability of the touch film. In the embodiment of the present application, the young's modulus of the supporting member 130 is less than or equal to 500Mpa, so that the supporting member 130 has sufficient elastic deformation capability in the direction perpendicular to the plate surfaces of the first substrate 111 and the second substrate 112. For example, the supporting member 130 may be made of elastic silicone rubber, foam rubber, or the like, and both ends of the elastic silicone rubber or the foam rubber are provided with a rubber body to adhere the supporting member 130 to the surfaces of the first substrate 111 and the second substrate 112.
According to different application scenarios of the pressure sensing film 100, the pressure sensing film 100 may be divided into at least one touch area, and the number of the first conductive blocks 121 and the second conductive blocks 122 is at least one. As shown in fig. 6, the number of the pieces of the first conductive piece 121 and the second conductive piece 122 is set to one. As shown in fig. 7, the number of the first conductive pieces 121 is four, the number of the second conductive pieces 122 is one, and when the first conductive pieces 121 and the second conductive pieces 122 are completely in contact, the second conductive pieces 122 cover all the first conductive pieces 121. As shown in fig. 8, the number of the first conductive blocks 121 and the second conductive blocks 122 is four, and the first conductive blocks 121 and the second conductive blocks 122 are arranged in a one-to-one correspondence. As shown in fig. 7 and 8, the touch areas are divided into four touch areas, when one touch area is pressed, the first conductive block 121 and the second conductive block 122 of the corresponding touch area are in contact, and the conductive blocks in the other touch areas are not in contact.
According to the different arrangement numbers of the first conductive blocks 121 and the second conductive blocks 122, the number of the corresponding supporting members 130 is at least one and is uniformly distributed at the periphery of the first conductive blocks 121 and the second conductive blocks 122 or between two adjacent first conductive blocks 121 and two adjacent second conductive blocks 122. Referring to fig. 6, when the number of the first conductive blocks 121 and the second conductive blocks 122 is one, the supporting member 130 may be a ring or a plurality of supporting members 130 may be arranged around the first conductive blocks 121 and the second conductive blocks 122. Referring to fig. 7, one end of the supporting member 130 may be installed between two adjacent first conductive blocks 121, and the other end of the supporting member 130 is installed in the hollow region of the second conductive block 122 to provide a space between two adjacent touch regions, so as to prevent one touch region of the pressure sensing film 100 from driving the other regions to be linked when being pressed. Referring to fig. 8, two ends of the supporting member 130 may be respectively disposed between two adjacent first conductive blocks 121 and two adjacent second conductive blocks 122 to form a gap between two adjacent touch areas. It is understood that, when the support 130 is assembled, there may be intersections between the first conductive leads 141 and the second conductive leads 142, and the support 130 may be provided with clearance openings for the first conductive leads 141 and the second conductive leads 142 to ensure smooth routing.
As shown in fig. 9, the present embodiment provides a touch module 200, which includes the pressure sensing film 100 and the flexible circuit board 210. The first conductive block 121 and the second conductive block 122 are connected to the flexible circuit board 210 through conductive leads, and when a pressure is applied to at least one of the first substrate 111 and the second substrate 112, a contact impedance change signal caused by a change in a contact area between the first conductive block 121 and the second conductive block 122 is transmitted to the flexible circuit board, so that a processing circuit on the flexible circuit board 210 detects the pressure.
The embodiment of the present application provides an electronic device, which includes the touch module 200 as described above, and the touch module 200 is disposed in a housing. In the electronic device of the embodiment of the present application, the touch module 200 transmits the contact impedance change condition caused by the pressure applied to the touch module 200 to the flexible circuit board 210, and the processing circuit on the flexible circuit board 210 analyzes the applied pressure.
It is understood that the electronic device is any electronic device with a touch function, for example, the electronic device may be a smart phone, a tablet computer, an e-reader, a remote control, a vehicle-mounted device, a network television, a camera device, a wearable device, or the like.
The embodiment of the present application further provides a pressure sensing method for a pressure sensing film 100, where the pressure sensing film 100 includes a first substrate 111, a second substrate 112 opposite to the first substrate 111, a supporting member 130 connected between the first substrate 111 and the second substrate 112, a first conductive block 121 disposed on a surface of the first substrate 111 adjacent to the second substrate 112, and a second conductive block 122 disposed on a surface of the second substrate 112 adjacent to the first substrate 111, and a surface of at least one of the first conductive block 121 and the second conductive block 122 adjacent to the other conductive block has a concave-convex structure 123, as shown in fig. 10, the pressure sensing method includes the following steps:
at least one of the S101, the first substrate 111, and the second substrate 112 is applied with pressure so that the first conductive bumps 121 are in contact with the second conductive bumps 122.
In the operation process, there are various ways of applying pressure to the pressure sensing film 100, for example, when one of the first substrate 111 or the second substrate 112 is pressed, the pressed substrate drives the conductive blocks thereon to approach the conductive blocks on the other substrate; or the first substrate 111 and the second substrate 112 are pressed to drive the first conductive block 121 and the second conductive block 122 to close each other.
S102, detecting the contact resistance change caused by the contact area between the first conductive block 121 and the second conductive block 122.
There are also a number of situations in which the mode of action exerted on pressure sensing diaphragm 100 is. For example, pressure may be applied to bring the entire surfaces of the two conductive bumps closer together, in which case the effective contact area of the two conductive bumps is only affected by the deformation of the surface roughness 123 of the conductive bumps. Pressure can also be applied to enable the local deformation of the two conductive blocks to be close to each other, and the effective contact area of the two conductive blocks under the action mode is affected by the deformation of the concave-convex structure 123 on the surface of the conductive block and the deformation of the two conductive blocks.
And S103, analyzing the pressure according to the change of the contact impedance.
The detection of the change of the contact impedance of the pressure sensing film 100 can also be used for grading the applied pressure, and when the two conductive blocks are not in contact or the effective contact area is small, the contact impedance between the two conductive blocks can be understood to be close to infinity, and the change range of the contact impedance of the pressure sensing film 100 can be obtained after the minimum value of the contact impedance is detected, so that the change range of the contact impedance can be divided into a plurality of numerical value intervals, and each numerical value interval corresponds to a pressure grade. In the embodiment of the present application, the magnitude of the pressure includes at least two levels, and the step of analyzing the magnitude of the pressure according to the change of the contact resistance includes: the level of pressure is obtained in accordance with the maximum value of the contact resistance.
The method for sensing pressure by the pressure sensing film 100 will be described with reference to an embodiment, wherein the first substrate 111 and the second substrate 112 of the pressure sensing film 100 are both PET substrates with a thickness of 50 μm to 100 μm. The number of the first conductive blocks 121 and the second conductive blocks 122 is one, the first conductive blocks 121 are silver paste conductive blocks with a thickness range of 2 μm to 5 μm, and the second conductive blocks 122 are carbon paste conductive blocks with a thickness range of 5 μm to 8 μm. The surfaces of the first conductive block 121 and the second conductive block 122 are both provided with concave-convex structures 123, the roughness range of the concave-convex structures 123 is 0.05 μm to 0.2 μm, and the area of the first conductive block 121 and the area of the second conductive block 122 along the plane parallel to the second substrate 112 are 1cm2. The distance between the two opposite surfaces of the first conductive bumps 121 and the second conductive bumps 122 is 50 μm to 100 μm. When the anti-aging test is performed on the manufactured pressure sensing film 100, after 10W pressure click tests, the abrasion loss of the surfaces of the first conductive block 121 and the second conductive block 122 is less than 10%.
When the pressure sensing film 100 senses pressure, the pressure is applied to the first substrate 111 to drive the entire first conductive block 121 to move toward the second conductive block 122 on the second substrate 112. The change of the contact resistance from initial contact to complete contact when detecting that the first conductive block 121 and the second conductive block 122 are not in contact is shown in table 1.
TABLE 1
| Pressure (g) | 0 | 5 | 10 | 20 | 30 | 50 | 100 | 200 |
| Contact impedance (omega) | OL | OL | 3780 | 894 | 432 | 365 | 312 | 308 |
In table 1, OL is a case where the device cannot detect, and it can be understood that the contact impedance between the first conductive block 121 and the second conductive block 122 approaches infinity.
Through the range of the contact resistance values between the first conductive block 121 and the second conductive block 122, the range of the change of the contact resistance value caused by applying pressure is divided into a first resistance interval within a range greater than or equal to 3780 Ω, the range of the change of the contact resistance value caused by applying pressure is divided into a second resistance interval within a range less than 3780 Ω, greater than or equal to 308 Ω corresponding to the first pressure level, and the back-end control system of the electronic device is set to perform the triggering action of the second pressure level only when the contact resistance value is within the second resistance interval, so as to prevent the pressure sensing film 100 from being touched by mistake under the action of slight pressure.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (11)
1. A pressure sensing diaphragm, comprising:
a first substrate;
the second substrate is arranged opposite to the first substrate;
a support connected between the first substrate and the second substrate;
the first conductive block is arranged on the surface of one side, adjacent to the second substrate, of the first substrate;
the second conductive block is arranged on the surface of one side, adjacent to the first substrate, of the second substrate;
at least one of the first conductive block and the second conductive block has a concave-convex structure on a surface adjacent to the other conductive block, and when pressure is applied to at least one of the first substrate and the second substrate, the first conductive block can be in contact with the second conductive block, so that the magnitude of the pressure can be detected by detecting a change in contact resistance caused by a change in contact area between the first conductive block and the second conductive block.
2. The pressure-sensing film according to claim 1, wherein the roughness of the surface having the concave-convex structure ranges from 0.02 μm to 1 μm.
3. The pressure sensing membrane of claim 1, wherein at least one of the first conductive mass and the second conductive mass has a surface impedance greater than 100 Ω/cm2。
4. The pressure sensing membrane of claim 1, wherein one of the first conductive bump and the second conductive bump is a conductive bump of silver paste and the other is a conductive bump of carbon paste.
5. The pressure-sensing film of claim 1, wherein the first conductive bump has a thickness in a direction perpendicular to the first substrate plate surface in a range of 2 μm to 30 μm, and the second conductive bump has a thickness in a direction perpendicular to the second substrate plate surface in a range of 2 μm to 30 μm.
6. The pressure sensing membrane of claim 1, wherein a separation between a surface of the first conductive block adjacent the second conductive block and a surface of the second conductive block adjacent the first conductive block ranges from 25 μ ι η to 200 μ ι η.
7. The pressure sensing membrane of claim 1, wherein the support member young's modulus is less than or equal to 500 Mpa.
8. The pressure sensing membrane of claim 1, wherein the number of the first conductive bumps and the second conductive bumps is at least one;
the pressure sensing film further comprises a first conductive lead and a second conductive lead, wherein the first conductive lead and the second conductive lead are used for conducting pressure sensing signals, one end of the first conductive lead is connected with the first conductive block, the other end of the first conductive lead passes through the periphery of the first conductive block or two adjacent first conductive blocks, the first conductive block is led out to be connected with an external flexible circuit board, one end of the second conductive lead is connected with the second conductive block, and the other end of the second conductive lead passes through the periphery of the second conductive block or two adjacent second conductive blocks are led out to be connected with the flexible circuit board.
9. The pressure sensing membrane of claim 8, wherein the number of the supporting members is at least one and is uniformly distributed around the first conductive block and the second conductive block or between two adjacent first conductive blocks and two adjacent second conductive blocks.
10. A touch module, comprising:
the pressure sensing membrane of any one of claims 1-9; and
the first conductive block and the second conductive block are connected with the flexible circuit board through conductive leads, and when pressure is applied to at least one of the first substrate and the second substrate, a contact impedance change signal caused by the change of the contact area between the first conductive block and the second conductive block is transmitted to the flexible circuit board, so that a processing circuit on the flexible circuit board detects the pressure.
11. An electronic device, characterized in that,
comprising a housing and a touch module as claimed in claim 10, said touch module being arranged within said housing.
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| CN202021140374.0U CN212379823U (en) | 2020-06-18 | 2020-06-18 | Pressure sensing film, touch module and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115112276A (en) * | 2022-06-27 | 2022-09-27 | 湃瑞电子科技(苏州)有限公司 | Pressure sensor |
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| CN115112276A (en) * | 2022-06-27 | 2022-09-27 | 湃瑞电子科技(苏州)有限公司 | Pressure sensor |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi oumaisi Microelectronics Co., Ltd Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Patentee before: Oufei Microelectronics Technology Co.,Ltd. |