CN106293280B - Touch display device and pressure touch unit - Google Patents
Touch display device and pressure touch unit Download PDFInfo
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- CN106293280B CN106293280B CN201510295961.4A CN201510295961A CN106293280B CN 106293280 B CN106293280 B CN 106293280B CN 201510295961 A CN201510295961 A CN 201510295961A CN 106293280 B CN106293280 B CN 106293280B
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Abstract
The invention relates to a pressure touch unit and a touch display device adopting the same. The pressure touch control unit comprises a flexible circuit board and a piezoelectric film sensor arranged on the flexible circuit board, wherein the flexible circuit board comprises a first base layer, a first circuit layer and a second base layer which are sequentially arranged, and holes are formed in the second base layer and part of the first circuit layer is exposed; the piezoelectric film sensor comprises a piezoelectric film, and upper conductive adhesive and lower conductive adhesive which are respectively positioned on two sides of the piezoelectric film, wherein the piezoelectric film sensor is arranged at the hole of the flexible circuit board, the upper conductive adhesive is adhered to the first circuit layer, the upper conductive adhesive is used as an upper electrode of the piezoelectric film sensor, and the lower conductive adhesive is used as a lower electrode of the piezoelectric film sensor. The piezoelectric film sensor is integrally arranged on the flexible circuit board, so that the flat cable design of the piezoelectric film sensor can be simplified, and meanwhile, the assembly of the pressure touch control unit in the touch control display device is facilitated.
Description
Technical Field
The present invention relates to a touch display device, and more particularly to a touch display device with pressure sensing function.
Background
Currently, electronic products such as mobile phones, tablet computers, televisions and the like with touch control functions increasingly adopt capacitive touch control schemes. However, there are also many drawbacks to capacitive touch screens, such as misjudgment of the capacitive touch screen when a larger area palm or conductor is close to the capacitive touch screen rather than touching; in a moist environment or when water drops and stains exist on the surface of the capacitive touch screen, misoperation or insensitive operation of the capacitive touch screen can be caused; in addition, a capacitive touch screen cannot be operated normally with a gloved hand or a non-conductive object.
Aiming at the problem that the capacitive touch screen can cause misoperation when the surface of the capacitive touch screen is wet or dirt is stored, no satisfactory scheme exists at present. Some manufacturers improve the touch operation effect when the capacitive touch screen is provided with a glove by improving the sensitivity and the like, but the scheme can cause misoperation caused by the fact that the capacitive touch screen is too sensitive when the capacitive touch screen is operated without the glove, and in addition, the scheme cannot solve the touch operation of a non-conductive object. Some manufacturers use touch schemes using pressure sensors in combination, but have the disadvantages of difficult assembly and manufacturing, high cost, and the like.
Disclosure of Invention
Accordingly, in order to solve the above-mentioned problems, it is necessary to provide a pressure touch unit and a touch display device using the same.
The utility model provides a pressure touch unit, includes flexible circuit board and sets up the piezoelectric thin film sensor on flexible circuit board, wherein:
the flexible circuit board comprises a first base layer, a first circuit layer and a second base layer which are sequentially arranged, wherein holes are formed in the second base layer, and part of the first circuit layer is exposed;
the piezoelectric film sensor comprises a piezoelectric film, and upper conductive adhesive and lower conductive adhesive which are respectively positioned on two sides of the piezoelectric film, wherein the piezoelectric film sensor is arranged at the hole of the flexible circuit board, the upper conductive adhesive is adhered to the first circuit layer, the upper conductive adhesive is used as an upper electrode of the piezoelectric film sensor, and the lower conductive adhesive is used as a lower electrode of the piezoelectric film sensor.
According to the pressure touch control unit, the piezoelectric film sensor is integrally arranged on the flexible circuit board, so that the flat cable design of the pressure sensor can be simplified, and meanwhile, the pressure touch control unit is convenient to assemble in the touch control display device. Furthermore, the thickness of the piezoelectric film sensor can be reduced by using the conductive adhesive as the electrode of the piezoelectric film sensor, so that the thickness of the touch display device with the pressure touch unit can also be reduced.
In one embodiment, the interface end of the flexible circuit board further forms a reinforcing plate outside the first base layer.
The utility model provides a touch display device, includes display element, foretell pressure touch unit and casing, the casing is electrically conductive and ground connection, pressure touch unit's piezoelectric film sensor's lower conductive adhesive bonds with the casing, display element has metal frame or conducting layer, pressure touch unit's first basic unit passes through the viscose and bonds with display element.
In one embodiment, the second base layer of the pressure touch unit is adhered to the casing through an adhesive layer.
The utility model provides a pressure touch unit, includes flexible circuit board and sets up the piezoelectric thin film sensor on flexible circuit board, wherein:
the flexible circuit board comprises a first base layer, a first circuit layer, a packaging layer, a second circuit layer and a second base layer which are sequentially arranged, wherein holes are formed in the second base layer, and part of the second circuit layer is exposed;
the piezoelectric film sensor comprises a piezoelectric film, and upper conductive adhesive and lower conductive adhesive which are respectively positioned on two sides of the piezoelectric film, wherein the piezoelectric film sensor is arranged at the hole of the flexible circuit board, the upper conductive adhesive is adhered to the second circuit layer, the upper conductive adhesive is used as an upper electrode of the piezoelectric film sensor, and the lower conductive adhesive is used as a lower electrode of the piezoelectric film sensor.
In one embodiment, the second circuit layer is used as a charge signal transmission layer of the piezoelectric film sensor, the second circuit layer leads out a signal antenna at an interface end of the flexible circuit board, the first circuit layer is connected with a part of circuits in the second circuit layer, and then leads out a grounding antenna at the interface end of the flexible circuit board, and the signal antenna and the grounding antenna are located on the same plane.
In one embodiment, the first circuit layer is an entire conductive layer to serve as an electromagnetic shielding layer, and the encapsulation layer is provided with a channel, so that a part of the circuits in the first circuit layer and the second circuit layer are connected and grounded through the part of the circuits.
In one embodiment, the interface end of the flexible circuit board further forms a reinforcing plate outside the first base layer.
The touch display device comprises a shell and any pressure touch unit, wherein the shell is conductive and grounded, and the lower conductive adhesive of the piezoelectric film sensor of the pressure touch unit is adhered to the shell.
In one embodiment, the touch screen further comprises a display unit, a capacitive touch unit and a protective cover plate, wherein the display unit, the capacitive touch unit and the protective cover plate are sequentially arranged on the first base layer of the flexible circuit board of the pressure touch unit.
The touch display device comprises any one of the pressure touch units and a display unit, wherein the display unit is provided with a metal frame or a conductive layer, the metal frame or the conductive layer is grounded, and the lower conductive adhesive of the piezoelectric film sensor of the pressure touch unit is adhered to the display unit and is conducted with the metal frame or the conductive layer.
Drawings
Fig. 1 is a schematic structural diagram of a touch display device according to an embodiment of the invention;
FIG. 2 is a schematic cross-sectional view of the touch display device shown in FIG. 1;
fig. 3 and fig. 4 are schematic cross-sectional structures of touch display devices according to different embodiments of the invention;
fig. 5 is a schematic structural diagram of a pressure touch unit according to an embodiment of the invention;
FIG. 6 is a schematic cross-sectional view of the pressure touch unit shown in FIG. 5;
FIG. 6A is a schematic diagram similar to FIG. 6, showing a cross-sectional structure of a pressure touch unit according to another embodiment;
FIG. 7 is a schematic diagram of a piezoelectric thin film sensor according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a flexible circuit board for integrating a piezoelectric thin film sensor according to an embodiment of the present invention;
fig. 9 and 10 are a cross-sectional view and a front view of the interface end of the flexible circuit board shown in fig. 8;
FIG. 11 is a flowchart of a method for fabricating a flexible circuit board for integrating a piezoelectric thin film sensor according to an embodiment of the present invention;
fig. 12 is a schematic cross-sectional structure of a pressure touch unit according to another embodiment of the invention;
fig. 13 and 14 are a cross-sectional view and a front view of a flexible circuit board at an interface end in the pressure touch unit shown in fig. 12;
FIG. 15 is a schematic cross-sectional view of a touch display device using the pressure touch unit of FIG. 12;
fig. 16 is a schematic cross-sectional structure of a pressure touch unit according to another embodiment of the invention;
fig. 17 and 18 are a cross-sectional view and a front view of the flexible circuit board at the interface end in the pressure touch unit shown in fig. 16;
FIG. 19 is a schematic cross-sectional view of a touch display device using the pressure touch unit of FIG. 16;
FIG. 20 is a schematic cross-sectional view of a pressure touch unit according to another embodiment of the present invention;
fig. 21 and 22 are a cross-sectional view and a front view of a flexible circuit board at an interface end in the pressure touch unit shown in fig. 20;
FIG. 23 is a schematic cross-sectional view of a touch display device using the pressure touch unit of FIG. 20;
fig. 24 and 25 are schematic structural diagrams of touch display devices with different viewing angles according to another embodiment of the invention.
Detailed Description
As shown in fig. 1 and 2, a touch display device according to an embodiment of the invention includes a protective cover 10, a capacitive touch unit 20, a pressure touch unit 30 and a display unit 40. When a user operates the touch display device, the position information of the touch point can be judged through the capacitive touch unit 20, meanwhile, the pressure information applied by the touch point is judged through the pressure touch unit 30, and then a specific function is realized by utilizing the pressure information.
The protective cover 10 may be a reinforced glass cover, a plastic cover, a polymethyl methacrylate (PMMA) cover, or the like.
The capacitive touch unit 20 includes a capacitive sensor 21, a flexible circuit board 22 connected to the capacitive sensor 21, and a capacitive touch chip (not shown). The capacitive sensor 21 includes a plurality of driving electrodes and sensing electrodes, and the two touch electrodes (not shown) may be distributed on the same substrate (not shown) or may be distributed on two different substrates, and the two touch electrodes may be formed on the inner side surface of the protective cover 10, so that the protective cover 10 has the function of a capacitive sensor. Or may be formed on the surface of the insulating base material bonded to the protective cover 10. The capacitive sensor 21 further includes a lead electrode (not shown, for example, silver paste) electrically connected to the touch electrode, the lead electrode leading the touch electrode to one place and being bound to the flexible circuit board 22 by anisotropic conductive Adhesive (ACF). The capacitive touch chip may be disposed on the flexible circuit board 22 of the capacitive touch unit 20, or may be disposed on a motherboard of the touch display device, for example, when the touch display device is a mobile phone, the capacitive touch chip of the capacitive touch unit 20 may be integrally disposed on the motherboard of the mobile phone.
The capacitive touch unit 20 may detect and obtain accurate position information of a plurality of touch points by a capacitive coupling manner.
The pressure touch unit 30 includes a flexible circuit board 32, three or more pressure sensors 31 disposed on the flexible circuit board 32, and a control chip (not shown). The pressure sensor 31 may be a piezoelectric thin film sensor, a resistive force sensor, a capacitive force sensor, a metallic strain gauge, or the like.
In the present embodiment, the pressure touch unit 30 is located at a side of the capacitive touch unit 20 away from the protective cover 10. In other words, in the present embodiment, the protective cover 10, the capacitive touch unit 20, the pressure touch unit 30 and the display unit 40 in the touch display device are sequentially disposed.
As shown in fig. 3, in some embodiments, the pressure touch unit 30 may also be located on a side of the display unit 40 away from the capacitive touch unit 20, and the display unit 40 is located on a side of the capacitive touch unit 20 away from the protective cover 10. In this embodiment, the protective cover 10, the capacitive touch unit 20, the display unit 40 and the pressure touch unit 30 in the touch display device are sequentially disposed.
As shown in fig. 4, in some embodiments, the pressure touch unit 30 may also be directly located on one side of the protective cover 10. In this embodiment, the protective cover 10, the pressure touch unit 30, the capacitance touch unit 20 and the display unit 40 in the touch display device are sequentially disposed.
The pressure sensors 31 may be distributed at corners of the pressure touch unit 30. As shown in fig. 1, the four pressure sensors 31 are respectively disposed at four end points of the flexible circuit board 32, and the pressure sensors 31 are distributed at four corners of the touch display device.
The control chip of the pressure touch unit 30 may be integrally disposed on the motherboard of the touch display device or disposed on the flexible circuit board 32, and electrically connected to the flexible circuit board 32.
According to the pressure touch control unit 30, the pressure sensor 31 is combined and arranged on the flexible circuit board 32, and the circuit on the flexible circuit board 32 electrically conducts the pressure sensor 31 with an external control chip, so that the integration level of the pressure touch control unit 30 can be improved, and subsequent assembly is facilitated.
The specific structure and arrangement of the pressure touch unit 30 will be further described below by taking the piezoelectric thin film sensor as an example of the pressure sensor 31.
As shown in fig. 5 and 6, in an embodiment, the pressure touch unit 30 includes a piezoelectric thin film sensor 310, a flexible circuit board 32, and a control chip. The control chip may include an operational amplifier 33, a single chip (including an a/D converter, not shown), and other components.
According to the specific setting position of the pressure touch unit 30, the pressure touch unit can be attached to a casing (not shown) of the touch display device, the protective cover 10, the capacitive touch unit 20 or the display unit 40 through double-sided adhesive tape, water gel or foam gel.
To reduce the cost of the pressure touch unit 30 and increase the utilization of the flexible circuit Board 32, the flexible circuit Board 32 with the integrated piezoelectric thin film sensor 310 may be a single piece, or as shown in fig. 5, may include two or more flexible circuit boards 32, and the flexible circuit boards 32 may be connected by a connection structure 320, such as a zero insertion force (Zero Insertion Force, ZIF) socket structure or a Board To Board (BTB) snap structure.
A schematic cross-sectional view of the connection of the flexible circuit board 32 and the piezoelectric film sensor 310 is shown in fig. 6. The piezoelectric thin film sensor 310 includes a piezoelectric thin film 311 and upper and lower electrodes 312 and 313 respectively located at both sides of the piezoelectric thin film 311.
The flexible circuit board 32 includes two layers of double-sided metal sheathing and adhesive for bonding the two layers of double-sided metal sheathing. Specifically, the flexible circuit board 32 includes, in order from top to bottom, a first base layer 321, a first wiring layer 322, a first encapsulation layer 323, a second wiring layer 324, an adhesive layer 325, a third wiring layer 326, a second encapsulation layer 327, a fourth wiring layer 328, and a second base layer 329. Wherein the materials of the first base layer 321, the first encapsulation layer 323, the second encapsulation layer 327 and the second base layer 329 may be polyimide or polyester PET. The first, second, third, and fourth wire layers 322, 324, 326, 328 may be copper layers.
Corresponding channels are disposed on the first packaging layer 323, the second packaging layer 327 and the adhesive layer 325, so that part of the wires on the first circuit layer 322, the fourth circuit layer 328 and the second circuit layer 324 are conducted and grounded.
Holes 320 are disposed at corresponding positions of the adhesive layer 325 to expose portions of the second circuit layer 324 and the third circuit layer 326. The piezoelectric thin film sensor 310 is disposed in the hole 320, and the upper electrode 312 of the piezoelectric thin film sensor 310 is electrically connected to the second circuit layer 324 through the conductive paste 330, and the lower electrode 313 is electrically connected to the third circuit layer 326 through the other conductive paste 330.
When the piezoelectric thin film sensor 310 is integrally disposed in the flexible circuit board 32, the first and fourth wiring layers 322 and 328 in the flexible circuit board 32 serve as shielding layers of the piezoelectric thin film sensor 310, and external electric and magnetic fields do not affect charge signals of the piezoelectric thin film sensor 310 due to grounding of the shielding layers.
The operational amplifier 33 (including the charge primary and voltage secondary amplifying circuits, not shown) and the single chip microcomputer may be integrally disposed on the flexible circuit board 32, or may be disposed on a motherboard of the touch display device. In the embodiment shown in fig. 5, the operational amplifier 33 is integrally disposed on the flexible circuit board 32 and is proximate to the interface end of the flexible circuit board 32. The singlechip is arranged on a main board of the touch display device.
When the piezoelectric film 311 of the piezoelectric film sensor 310 is stressed, induced charges are generated on the upper and lower surfaces thereof, and charge signals are transmitted to the operational amplifier 33 through the upper and lower electrodes 312 and 313, the conductive adhesive 330, and the second and third circuit layers 324 and 326 in the flexible circuit board 32. The signal amplified by the operational amplifier 33 is transmitted to the singlechip for analog-to-digital conversion to be converted into a digital signal, and the corresponding relation between the touch pressure and the signal is established.
When a user touches the touch display device with a finger or other conductors, the capacitance of the capacitive touch unit 20 will change due to the coupling capacitance generated between the user and the capacitive touch unit 20 of the touch display device, and accurate position information of the touch point can be detected and obtained according to the basic principle of capacitive touch. Meanwhile, since the protective cover plate 10 of the touch display device is also stressed, the force is conducted to the pressure touch control unit 30, the pressure touch control unit 30 can detect component force information of the positions of the pressure sensors 31, and the information can be voltage change information, capacitance change information, resistance change information and the like according to different types of the selected pressure sensors 31. Based on the pressure information obtained by each pressure sensor 31, a specific function can be realized. For example, in one embodiment, the position information of the touch point may be accurately acquired according to the magnitudes of the four signals and the position where the pressure sensor 31 is located. When the capacitive touch unit 20 and the pressure touch unit 30 both acquire related information, the detection of the capacitive touch unit 20 is subject to control. When the capacitive touch unit 20 does not detect a signal and the pressure touch unit 30 detects a signal, the touch information acquired by the pressure touch unit 30 is determined. I.e. the touch display device preferentially responds to the detection signal of the capacitive touch unit 20. It should be noted that the use of the obtained pressure information to determine the position of the touch point is only one application of the pressure touch unit 30, and in other embodiments, other functions may be implemented using the obtained pressure information, for example, the operation in some applications may directly set the feedback on the pressure.
In general, the piezoelectric thin film sensor 310 is also provided with a package layer, a shielding layer and a base layer outside the upper and lower electrodes. Since the flexible circuit board 32 may use a wiring layer (e.g., the first wiring layer 322 and the fourth wiring layer 328 in fig. 6) as the shielding layer, the shielding layer in the piezoelectric thin film sensor 310 may be replaced by the shielding layer of the flexible circuit board 32 when the piezoelectric thin film sensor 310 is integrated with the flexible circuit board 32.
Fig. 6A is a further simplified embodiment of the embodiment shown in fig. 6, in which the upper electrode 312 and the lower electrode 313 of the piezoelectric film 311 in fig. 6 are omitted, and the piezoelectric film 311 is directly adhered between the upper double-sided conductive paste 330 and the lower double-sided conductive paste 330. As shown in fig. 6A, the upper and lower conductive adhesives 330 are directly used as the upper and lower electrodes of the piezoelectric film 311, further simplifying the pressure touch unit.
The method for manufacturing the pressure touch unit 30 is described below with reference to fig. 7 to 11.
As shown in fig. 7, the piezoelectric thin film sensor 310 includes a piezoelectric thin film 311, an upper electrode 312 and a lower electrode 313 respectively located at both sides of the piezoelectric thin film 311, and an upper release film 314 and a lower release film 315 respectively located at outer sides of the upper electrode 312 and the lower electrode 313.
The piezoelectric film 311 comprises an inorganic piezoelectric film material and an organic piezoelectric film material, wherein the inorganic piezoelectric film material can be a zinc oxide film, an aluminum doped zinc oxide film, a lead lanthanum zirconate titanate ceramic (PLZT) piezoelectric film and other piezoelectric ceramic materials, and the organic piezoelectric film can be a polyvinylidene fluoride (PVDF), a porous polypropylene piezoelectric film, a polylactic acid piezoelectric film and other polyester piezoelectric films. Wherein the piezoelectric film is very thin and has a thickness of 0.05-2 μm.
The specific preparation steps of the piezoelectric thin film sensor 310 are as follows: providing a piezoelectric film; plating electrodes on the surfaces of the two sides of the piezoelectric film through evaporation type film plating, magnetron sputtering type film plating, spraying and other film plating processes; obtaining a piezoelectric film element with upper and lower electrodes in a round, square or other fixed shape by using a die cutting die or other modes; and coating release films on the surfaces of the upper electrode and the lower electrode. The piezoelectric thin film sensor 310 shown in fig. 7 is thus formed. In the preparation step, the surface of the upper electrode and the surface of the lower electrode are coated with release films, and then die cutting is carried out.
As shown in fig. 8, the flexible circuit board 32 includes, in order from top to bottom, a first base layer 321, a first wiring layer 322, a first encapsulation layer 323, a second wiring layer 324, an adhesive layer 325, a third wiring layer 326, a second encapsulation layer 327, a fourth wiring layer 328, and a second base layer 329. Wherein holes 320 are provided at positions for disposing the piezoelectric thin film sensor 310, that is, corresponding positions of the adhesive layer 325, and portions of the second wiring layer 324 and the third wiring layer 326 are exposed. Before the piezoelectric film sensor 310 is not disposed on the flexible circuit board 32, the conductive paste 330 is disposed at the hole 320 to be in conduction with the second circuit layer 324, and the other conductive paste 330 is disposed to be in conduction with the third circuit layer 326. A release film 331 is disposed between the two conductive adhesives 330.
Corresponding channels are disposed on the first packaging layer 323, the second packaging layer 327 and the adhesive layer 325, so that part of the wires on the first circuit layer 322, the fourth circuit layer 328 and the second circuit layer 324 are conducted, and are grounded after being applied to the touch display device.
As shown in fig. 9 and 10, a cross-sectional view and a front view of the interface end of the flexible circuit board 32 are shown. At the interface end, the second wiring layer 324 on the flexible circuit board 32, which connects the upper electrodes 312 of the respective piezoelectric thin film sensors 310, is guided to the same plane as the third wiring layer 326 through the corresponding channels, forming a plurality of signal antennas 333, and thus, four piezoelectric thin film sensors 310 are integrally disposed on the flexible circuit board 32, and thus, four signal antennas 333 are provided. In addition, part of the wires on the first wire layer 322, the fourth wire layer 328 and the second wire layer 324 are conducted and extended to form a grounding antenna 334 for grounding. The ground antenna 334 and the signal antenna 333 are in the same plane so as to be connectable with an external connector.
In some embodiments, the interface end of the flexible circuit board 32 further forms a stiffener 332 on the outside of the second base layer 329. The stiffening plate 332 is used for strengthening the physical strength of the interface end, and is convenient to connect with an external connector. The reinforcing plate 332 may be made of Polyimide (PI) or polyethylene terephthalate (PET).
Referring to fig. 11, the flexible circuit board 32 of one embodiment is prepared as follows: preparing a base material, drilling holes in the base material, then carrying out copper deposition and copper plating, pasting a dry film, exposing, developing and etching the copper layer, and stripping the film to prepare a second circuit layer containing electrode patterns; preparing a third wiring layer containing an electrode pattern on another substrate in the same manner as the above steps; performing lamination and lamination protection on the second circuit layer and the third circuit layer; partially adhering two base materials (corresponding to two packaging layers) by using an adhesive, wherein electrode patterns of a second route layer and a third route layer are oppositely arranged in parallel; drilling a grounded through hole on the two adhered substrates, and carrying out whole-surface copper plating to form a first circuit layer and a fourth circuit layer, wherein partial circuits of the first circuit layer, the fourth circuit layer and the second circuit layer are conducted; sticking PI material or PET material on the surfaces of the first circuit layer and the fourth circuit layer for lamination operation to form a first base layer and a second base layer; forming a reinforcing plate formed by PI or PET on the outer side of the second base layer; and finally blanking, and attaching upper and lower double-sided conductive adhesives with release films at the positions (namely, the non-adhered parts of the two base materials) for placing the piezoelectric film sensor to obtain the flexible circuit board with the structure shown in figure 8. And packaging the prepared flexible circuit board.
The integration steps of the piezoelectric thin film sensor 310 and the flexible circuit board 32 are: tearing off a part of the release film 331 of the flexible circuit board 32 shown in fig. 8 together with the structure (including the conductive adhesive 330, the second circuit layer 324, the first encapsulation layer 323, the first circuit layer 322 and the first base layer 321) on the release film 331, tearing off the lower release film 315 of the piezoelectric film sensor 310 shown in fig. 7, and bonding the exposed piezoelectric film 311 to the conductive adhesive 330 of the flexible circuit board 32 located below the release film 331; the upper release film 314 in the piezoelectric film sensor 310 and the release film 331 in the flexible circuit board 32 are then peeled off, respectively, and the piezoelectric film 311 is bonded to the other conductive paste 330 in the flexible circuit board 32.
When the piezoelectric thin film sensor 310 is integrated into the flexible circuit board 32, the first and fourth wiring layers 322 and 328 in the flexible circuit board 32 serve as shielding layers, and an external electric field does not affect the charge signal of the piezoelectric thin film sensor 310 due to the grounding process of the shielding layers.
The pressure sensors and the flexible circuit board are integrated, so that the problems of complex wire arrangement, inconvenient installation and the like when a plurality of pressure sensors are used can be solved, and the pressure sensor can be applied to detection of forces of curved surfaces or objects with multiple surfaces. Meanwhile, the double-sided conductive adhesive is adopted to glue, so that the integration of the piezoelectric sensing element and the flexible circuit board can be realized rapidly and conveniently at a lower temperature.
In some embodiments, the upper electrode and the lower electrode of the piezoelectric film sensor in the pressure touch unit provided by the invention can also be made of double-sided conductive adhesive materials, and the double-sided conductive adhesive materials are used as electrode materials of the piezoelectric film besides being used as connecting materials of the piezoelectric film and the flexible circuit board.
Although the piezoelectric film generates induced charges on its surface when it is stressed, the surface of the piezoelectric film is not conductive, so that a conductive material is required to transmit the induced charge signals on its surface. The double-sided conductive adhesive adheres the piezoelectric film and the flexible circuit board, and also transmits induction charge signals generated on the surface of the piezoelectric film through a circuit layer in the flexible circuit board. The area of the double-sided conductive adhesive is the same as the surface area of the piezoelectric film or slightly smaller than the surface area of the piezoelectric film (i.e. the double-sided conductive adhesive has a certain inward contraction).
On the other hand, according to the touch display device provided by the invention, the pressure touch unit is attached to the conductive substrate, and the shielding layer arranged in the piezoelectric film sensor for resisting electromagnetic shielding can be omitted by utilizing the conductivity and the grounding property of the substrate, so that the thickness of the pressure touch unit is reduced, and the overall thickness of the touch display device is further reduced. For example, the pressure touch unit can be attached to a middle frame of a shell of a mobile phone or a tablet personal computer through double-sided conductive adhesive, or a display unit with a metal shell or a conductive layer on the surface, and the conductive layer is used as an electromagnetic shielding layer of a piezoelectric film sensor.
The pressure touch control unit can detect the information of the force applied to the position of the piezoelectric film sensor through the plurality of piezoelectric film sensors. Meanwhile, the pressure touch control unit can integrate two or more piezoelectric film sensors through the flexible circuit board, so that the pressure touch control unit has the effect of detecting the magnitude information of a plurality of forces simultaneously, and meanwhile, the wire arrangement complexity and the assembly redundancy of the piezoelectric film sensors are simplified.
In an embodiment, the flexible circuit board in the pressure touch unit may be a two-layer circuit layer structure, wherein one circuit layer is used as the electromagnetic shielding layer, and the other circuit layer is used as the signal layer of the piezoelectric thin film sensor. As shown in fig. 12, a cross-sectional structure of a pressure touch unit 50 in which a piezoelectric thin film sensor 510 is integrated onto a flexible circuit board 52 is illustrated.
The flexible circuit board 52 includes, from top to bottom, a first base layer 521, a first circuit layer 522, an adhesive layer 523, a second circuit layer 524, and a second base layer 525. The first and second base layers 521 and 525 may be made of polyimide or polyester PET, and the first and second wiring layers 522 and 524 may be made of copper or other metal/alloy materials. Holes 520 are disposed at corresponding positions of the adhesive layer 523 and expose portions of the first circuit layer 522 and the second circuit layer 524. The hole 520 is used to accommodate the piezoelectric thin film sensor 510.
The piezoelectric film sensor 510 includes a piezoelectric film 511, and an upper conductive paste 512 and a lower conductive paste 513 respectively located at both sides of the piezoelectric film 511. The upper conductive paste 512 is adhered to the first circuit layer 522, the lower conductive paste 513 is adhered to the second circuit layer 524, and the upper conductive paste 512 and the lower conductive paste 513 serve as both electrodes of the piezoelectric thin film sensor 510 and also serve as a connection member with the flexible circuit board 52, and transmit induced charge signals generated by the piezoelectric thin film sensor 510 to the circuit layer of the flexible circuit board 52. In the structure shown in fig. 12, the first circuit layer 522 may be an electromagnetic shielding layer, which is a conductive layer on the whole surface, and through holes are provided at appropriate positions of the adhesive layer 523, so that the first circuit layer 522 is connected to a part of the circuits in the second circuit layer 524.
Fig. 13 and 14 show a cross-section and a front view, respectively, of the flexible circuit board 52 at the interface end. After the first circuit layer 522 is connected to a part of the circuits in the second circuit layer 524, the grounding antenna 534 is led out from the interface end of the flexible circuit board 52. In addition, when the flexible circuit board 52 integrates the plurality of piezoelectric thin film sensors 510, the charge signal transmission of the plurality of piezoelectric thin film sensors 510 occurs in the second circuit layer 524, and a signal antenna 533 is respectively led out at the interface end of the flexible circuit board 52. Four signal antennas 533 are shown in fig. 14, with four piezoelectric film sensors 510 integrated on the flexible circuit board 52. In some embodiments, the interface end of the flexible circuit board 52 further forms a stiffener 532 on the outside of the second substrate 525. The reinforcing plate 532 is used to strengthen the physical strength of the interface end, and facilitates connection with an external connector. The reinforcing plate 532 may be made of Polyimide (PI) or polyethylene terephthalate (PET).
Fig. 15 is a schematic diagram of the pressure touch unit 50 applied to a touch display device. One side surface (for example, the lower surface in fig. 15) of the pressure touch unit 50 is attached to the surface of the casing 90 of the touch display device through an adhesive such as an optical adhesive OCA, a water adhesive, etc., and the casing 90 with the conductive grounding process plays a role of electromagnetic shielding; meanwhile, the other side (e.g., the upper surface in fig. 15) of the pressure touch unit 50 is attached to one side of the capacitive touch unit 20, and the capacitive touch unit 20 may be various capacitive touch solutions including in-cell and on-cell structures. Of course, in some embodiments, the other side of the pressure touch unit 50 may also be attached to one side of the protective cover, or attached to one side of the display module.
In other embodiments, the flexible circuit board in the pressure touch unit may have only one circuit layer, and the first base layer and the second base layer are formed on two sides of the circuit layer respectively. Because the circuit layer of the flexible circuit board is only used as a signal transmission layer for transmitting charge signals generated by the piezoelectric film sensor, the pressure touch control unit is applied to a touch control display device which is attached to both sides of the pressure touch control unit and is conductive and grounded, and the electromagnetic shielding effect is realized by utilizing the conductive structure of the touch control display device. The proposal omits an electromagnetic shielding layer in the piezoelectric film sensor, thus having smaller thickness.
As shown in fig. 16 in particular, the flexible circuit board 62 in the pressure touch unit 60 includes a first base layer 621, a first circuit layer 622, and a second base layer 623 from top to bottom in order. The first and second base layers 621, 623 may be made of polyimide or polyester PET, and the first circuit layer 622 may be made of copper or other metal/alloy material. Holes 620 are provided at corresponding positions of the second base layer 623 and a portion of the first circuit layer 622 is exposed. The hole 620 is used to receive the piezoelectric film sensor 610.
The piezoelectric film sensor 610 includes a piezoelectric film 611, and an upper conductive paste 612 and a lower conductive paste 613 respectively located at both sides of the piezoelectric film 611. The upper conductive adhesive 612 is adhered to the first circuit layer 622. The lower conductive adhesive 613 is used to adhere to a corresponding structure in the touch display device. The upper conductive paste 612 and the lower conductive paste 613 serve as two electrodes of the piezoelectric thin film sensor 610.
Fig. 17 and 18 show a cross-section and a front view, respectively, of the flexible circuit board 62 at the interface end. The first circuit layer 622 leads out the signal antenna 633 at the interface end of the flexible circuit board 62. Since the first wiring layer 622 serves only as a signal transmission, it does not function as an electromagnetic shield, and thus there is no corresponding wiring lead-out grounding antenna. When the flexible circuit board 56 integrates the plurality of piezoelectric thin film sensors 610, the charge signal transmission of the plurality of piezoelectric thin film sensors 610 all occurs in the first wiring layer 622. Five signal antennas 633 are shown in fig. 18, and five piezoelectric thin film sensors 610 are integrated on the flexible circuit board 62. In some embodiments, the interface end of the flexible circuit board 62 also forms a stiffening plate 632 on the outside of the second base layer 623. The reinforcing plate 632 is used for reinforcing the physical strength of the interface end, so as to be convenient for connection with an external connector. The reinforcing plate 632 may be made of Polyimide (PI) or polyethylene terephthalate (PET).
Fig. 19 is a schematic diagram of the pressure touch unit 60 applied to a touch display device. One side (for example, the lower surface in fig. 19) of the pressure touch unit 60 is attached to the surface of the casing 90 of the touch display device, and the casing 90 with the conductive grounding process plays a role of electromagnetic shielding; meanwhile, the other side surface (e.g., the upper surface in fig. 19) of the pressure touch unit 60 is attached to one side of the display unit 40 with a metal frame by using an adhesive 41 such as an optical adhesive OCA, a water adhesive, etc. Shielding the surrounding electromagnetic environment from interference with the charge signals in the piezoelectric thin film sensor 610 and the first wiring layer 622 in the flexible circuit board 62 is achieved by the grounded nature of the chassis 90 and the display unit 40. Further, an adhesive layer 91, such as foam, double sided tape, etc., may be disposed between the casing 90 and the second base layer 623 of the flexible circuit board 62 to fix the flexible circuit board 62 and the casing 90.
It should be understood that the display unit 40 may be a non-metal frame display module, and a conductive layer is plated on the surface of the non-metal frame display module and grounded. It will be appreciated that, in other embodiments, the other side of the pressure touch unit 60 may be attached to a capacitive touch unit, and the capacitive touch unit may be various types of capacitive touch solutions, or may be a capacitive touch display module integrated with a capacitive touch display module.
As shown in fig. 20, a piezoelectric film sensor 710 included in a pressure touch unit 70 according to another embodiment of the invention includes a piezoelectric film 711, and an upper electrode 712 and a lower electrode 713 respectively disposed on two sides of the piezoelectric film 711. The upper electrode 712 and the lower electrode 713 are conductive paste. The double-sided conductive adhesive on both sides of the piezoelectric film 711 functions not only as upper and lower electrodes of the piezoelectric film, but also as adhesion when assembled with the flexible circuit board 72 and with other substrates. The surface area of the upper electrode 712 and the lower electrode 713 is the same as that of the piezoelectric film 711 or slightly smaller than that of the piezoelectric film 711.
In another embodiment of the present invention, the flexible circuit board 72 included in the pressure touch unit 70 includes a first base layer 721, a first circuit layer 722, an encapsulation layer 723, a second circuit layer 724 and a second base layer 725 from top to bottom. The encapsulation layer and the base layer can be made of polyimide or polyester PET, etc. The first wiring layer 722, the second wiring layer 724 may be a copper layer or a conductive layer of other metals or alloys. The first circuit layer 722 is a whole conductive layer, and a channel is arranged at a corresponding position of the packaging layer 723 to conduct part of circuits in the first circuit layer 722 and the second circuit layer 724, and the part of circuits are grounded to play a role of electromagnetic shielding. The second circuit layer 724 is a signal transmission layer of the flexible circuit board 72, and the electrical signal generated by the piezoelectric thin film sensor 710 is transmitted to the interface end of the flexible circuit board 72 through the second circuit layer 724. The second substrate 725 has a hole 720 for accommodating the piezoelectric thin film sensor 710. The hole 720 exposes a portion of the second circuit layer 724 for connection to the upper electrode 712 of the piezoelectric thin film sensor 710.
As shown in fig. 21 and 22, a cross-sectional view and a front view of the interface end of the flexible circuit board 72 are shown. At the interface end, the second wiring layer 724 on the flexible circuit board 72 connecting the upper electrodes 712 of the respective piezoelectric thin film sensors 710 leads out a plurality of signal antennas 733. In addition, part of the wires in the first wire layer 722 and the second wire layer 724 are conducted and lead out the grounding antenna 734 for grounding treatment. The ground antenna 734 and the signal antenna 733 are located on the same plane, so that connection with an external connector is possible.
The induced charges generated by the piezoelectric thin film sensor 710 are transferred to the second wiring layer 724 in the flexible circuit board 72 through the upper electrode 712; the lower electrode 713 is directly connected to the substrate of the touch display device, and in order to enable the piezoelectric thin film sensor 710 to resist electromagnetic interference, the lower electrode 713 should be connected to a conductive ground substrate to achieve a grounding effect, so that the lower electrode 713 may be bonded to a metal or alloy chassis, or to a display unit with a metal frame, or to a display unit plated with a conductive layer such as a metal and grounded, so that the lower electrode 713 is electrically connected to the metal frame or the conductive layer.
In the pressure touch unit 70, the first circuit layer 722 in the flexible circuit board 72 and the lower electrode 713 in the piezoelectric thin film sensor 710 are used as the grounding shielding layer of the piezoelectric thin film sensor 710, so that the thickness of the pressure touch unit 70 is reduced while the electromagnetic interference of the pressure touch unit 70 is effectively reduced.
The integration of the piezoelectric film sensor 710 and the flexible circuit board 72 in the present invention can simultaneously assemble a plurality of piezoelectric film sensors 710 into one flexible circuit board 72, and the charge signal generated by each piezoelectric film sensor 710 is transmitted to the interface end of the flexible circuit board 72 through the second circuit layer 724. The first wiring layer 722 is led into a part of the wiring of the second wiring layer 724 of the flexible circuit board 72 by providing a via on the first encapsulation layer 723, and thus the signal feeler 733 eventually connected to the upper electrode 712 of each piezoelectric film sensor 710 and the ground feeler 734 for grounding are located on the same plane at the interface end, thereby realizing a ZIF plug-in type or BTB snap-in type connection with another connector.
In some embodiments, the interface end of the flexible circuit board 32 further forms a stiffener 732 outside the first base layer 721. The reinforcing plate 732 is used to strengthen the physical strength of the interface end, and facilitates connection with an external connector. The reinforcing plate 732 may be made of Polyimide (PI) or polyethylene terephthalate (PET).
The following describes the integration step of the pressure touch unit 70 in the touch display device with reference to fig. 23. Fig. 23 shows that the piezoelectric thin film sensor 710 in the pressure touch unit 70 is bonded to the conductive substrate in the touch display device by means of the lower electrode 713. The conductive substrate may be a conductive chassis 90, a display unit 40 with a metal frame, or a display unit 40 plated with a conductive layer. The second substrate 725 of the flexible circuit board 72 is adhered and fixed to the casing 90 or the display unit 40 by an adhesive layer 91, such as a foam, a double sided tape, or the like.
The method for integrating the piezoelectric film sensor 710 and the flexible circuit board 72 included in the pressure touch unit 70 may include the following steps:
1. preparation of a flexible circuit board comprising two circuit layers was prepared according to the process described above. The first circuit layer and the second circuit layer are conducted with part of circuits in the second circuit layer through channels arranged in the packaging layer, and a grounding antenna is led out at the interface end of the flexible circuit board and used for grounding. And the second circuit layer is used for carrying out running line design according to the number and the positions of the planned integrated piezoelectric film sensors. Wherein a hole is provided at a proper position of the second base layer to expose a part of the second circuit layer, and the hole is used for mounting the piezoelectric film sensor.
2. Respectively attaching double-sided conductive adhesive tapes to two side surfaces of the piezoelectric film;
3. attaching the piezoelectric film attached with the upper conductive adhesive and the lower conductive adhesive to the hole of the flexible circuit board, and adhering and fixing one conductive adhesive and the exposed second circuit layer; the specific sequence of the second step and the third step can be flexibly adjusted, for example, the conductive adhesive can be adhered to the hole of the flexible circuit board and the second circuit layer, and then the piezoelectric film is adhered to the conductive adhesive;
4. Attaching foam rubber to the lower surface of the second base layer of the flexible circuit board, wherein the piezoelectric film sensor on the flexible circuit board is exposed outside and is not covered by the foam rubber; then the pressure touch control unit is attached to a display unit with the surface of a conductive shell or a rear cover grounded, and when the thickness of foam rubber is slightly larger than that of a piezoelectric film sensor containing two layers of conductive rubber, a convex structure can be arranged at the joint position of the shell and the piezoelectric film sensor; meanwhile, the thickness of the piezoelectric film sensor and the thickness of the foam rubber are similar to the thickness of the foam rubber by increasing the thickness of the piezoelectric film sensor and reducing the thickness of the foam rubber, so that the shell or the display unit can be attached to the pressure touch unit without additionally arranging a convex structure.
Fig. 24 and 25 show a specific application of the pressure touch unit in a touch display device. The touch display device includes a casing 90 and a protective cover 10, and the capacitive touch unit 20, the display unit 40 and the pressure touch unit 70 are disposed in a receiving cavity formed by the casing and the protective cover 10. The pressure touch unit 70 may be disposed between the display unit 40 and the casing 90. The capacitive touch unit 20 may be a plug-in touch scheme, or an in-cell or on-cell structure scheme, that is, the capacitive touch unit 20 and the display unit 40 are integrally disposed. In some embodiments, the housing 90 is provided with a protrusion 92 at a position corresponding to the piezoelectric film sensor 710 of the pressure touch unit 70, so as to avoid the problem of different heights of the pressure touch unit 70 due to the structure of the adhesive layer, etc. from affecting the assembly accuracy. In order to reduce the influence of the projection 92 on the display effect of the display unit 40 when the screen is pressed, the display unit 40 preferably employs a display module with a metal frame.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (11)
1. The utility model provides a pressure touch unit which characterized in that includes flexible circuit board and sets up the piezoelectric thin film sensor on flexible circuit board, wherein:
the flexible circuit board comprises a first base layer, a first circuit layer and a second base layer which are sequentially arranged, wherein holes are formed in the second base layer, and part of the first circuit layer is exposed;
the piezoelectric film sensor comprises a piezoelectric film, and upper conductive adhesive and lower conductive adhesive which are respectively positioned at two sides of the piezoelectric film, wherein the piezoelectric film sensor is arranged at the hole of the flexible circuit board, the upper conductive adhesive is adhered to the first circuit layer, the upper conductive adhesive is used as an upper electrode of the piezoelectric film sensor, and the lower conductive adhesive is used as a lower electrode of the piezoelectric film sensor;
The materials of the first base layer and the second base layer comprise polyimide or polyester PET.
2. The pressure touch unit of claim 1, wherein the interface end of the flexible circuit board further forms a stiffening plate on the outside of the first base layer.
3. The touch display device comprises a display unit, the pressure touch unit and a shell, wherein the shell is conductive and grounded, the lower conductive adhesive of the piezoelectric film sensor of the pressure touch unit is adhered to the shell, the display unit is provided with a metal frame or a conductive layer, and the first base layer of the pressure touch unit is adhered to the display unit through adhesive.
4. The touch display device according to claim 3, wherein the second base layer of the pressure touch unit is adhered to the casing through an adhesive layer.
5. The utility model provides a pressure touch unit which characterized in that includes flexible circuit board and sets up the piezoelectric thin film sensor on flexible circuit board, wherein:
the flexible circuit board comprises a first base layer, a first circuit layer, a packaging layer, a second circuit layer and a second base layer which are sequentially arranged, wherein holes are formed in the second base layer, and part of the second circuit layer is exposed;
The piezoelectric film sensor comprises a piezoelectric film, and upper conductive adhesive and lower conductive adhesive which are respectively positioned at two sides of the piezoelectric film, wherein the piezoelectric film sensor is arranged at the hole of the flexible circuit board, the upper conductive adhesive is adhered to the second circuit layer, the upper conductive adhesive is used as an upper electrode of the piezoelectric film sensor, and the lower conductive adhesive is used as a lower electrode of the piezoelectric film sensor;
the materials of the first base layer and the second base layer comprise polyimide or polyester PET.
6. The pressure touch unit of claim 5, wherein the second circuit layer is used as a charge signal transmission layer of the piezoelectric thin film sensor, the second circuit layer leads out a signal antenna at an interface end of the flexible circuit board, the first circuit layer is connected with a part of circuits in the second circuit layer, and then leads out a grounding antenna at the interface end of the flexible circuit board, and the signal antenna and the grounding antenna are located on the same plane.
7. The pressure touch unit according to claim 5, wherein the first circuit layer is an entire conductive layer to serve as an electromagnetic shielding layer, and the encapsulation layer is provided with a channel to connect the first circuit layer with and to ground a portion of the circuit in the second circuit layer.
8. The pressure touch unit of claim 5, wherein the interface end of the flexible circuit board further forms a stiffening plate on the outside of the first base layer.
9. A touch display device comprising a casing and the pressure touch unit according to any one of claims 5 to 8, wherein the casing is conductive and grounded, and the lower conductive adhesive of the piezoelectric thin film sensor of the pressure touch unit is adhered to the casing.
10. The touch display device of claim 9, further comprising a display unit, a capacitive touch unit, and a protective cover, wherein the display unit, the capacitive touch unit, and the protective cover are sequentially disposed on the first base layer of the flexible circuit board of the pressure touch unit.
11. A touch display device comprising the pressure touch unit of any one of claims 5-8, and a display unit having a metal frame or a conductive layer, the metal frame or the conductive layer being grounded, the lower conductive paste of the piezoelectric thin film sensor of the pressure touch unit being bonded to the display unit and being in conductive communication with the metal frame or the conductive layer.
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| KR102361436B1 (en) * | 2017-06-13 | 2022-02-11 | 삼성디스플레이 주식회사 | Display apparatus |
| CN107300999B (en) * | 2017-07-07 | 2022-11-25 | 安徽精卓光显技术有限责任公司 | Pressure-sensitive touch display screen, pressure-sensitive touch screen and manufacturing method thereof |
| KR20200114912A (en) | 2019-03-29 | 2020-10-07 | 엘지디스플레이 주식회사 | Display panel and display apparatus comprising the same |
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Address after: 330000 Huang Jia Hu Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: Ophiguang Group Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330000 Huang Jia Hu Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: OFilm Tech Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330000 Huang Jia Hu Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: OFilm Tech Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330000 Huang Jia Hu Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: Shenzhen OFilm Tech Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210305 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Applicant after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 330000 Huang Jia Hu Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: Ophiguang Group Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
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