CN114351191B - Copper foil surface density adjusting device and acting surface manufacturing method thereof - Google Patents
Copper foil surface density adjusting device and acting surface manufacturing method thereof Download PDFInfo
- Publication number
- CN114351191B CN114351191B CN202210030053.2A CN202210030053A CN114351191B CN 114351191 B CN114351191 B CN 114351191B CN 202210030053 A CN202210030053 A CN 202210030053A CN 114351191 B CN114351191 B CN 114351191B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- shielding
- square
- manufacturing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The invention discloses a copper foil surface density adjusting device and a manufacturing method of an acting surface thereof, wherein the copper foil surface density adjusting device comprises an acute angle plate made of a material with shielding function and corrosion resistance, the acute angle plate comprises a fixed surface for fixing and an acting surface for shielding an electric field, the fixed surface is square, a plurality of screw holes are uniformly distributed on the fixed surface, and the acting surface is in a saw-tooth shape. The device has simple structure and convenient use, can neutralize various factors causing the non-uniform surface density of the copper foil in the existing equipment and production technology, and improves the quality and the production efficiency of the copper foil.
Description
Technical Field
The invention relates to the technical field of electrolytic copper foil production equipment, in particular to a copper foil surface density adjusting device and an acting surface manufacturing method thereof.
Background
The preparation process of the electrolytic copper foil is that a cathode roller connected with a power supply cathode rotates in an electrolytic tank filled with a copper sulfate solution at a certain speed, an anode plate is arranged at the bottom of the electrolytic tank and is directly connected with a power supply anode, copper ions are uniformly deposited on the surface of the cathode roller under the action of an electric field, then the cathode roller rotates out of the electrolytic tank to strip and roll the copper foil from the cathode roller, in the copper foil production process, the instability of the liquid amount and circulation amount on the copper sulfate solution can influence the uniformity of the surface of the copper foil on the cathode roller, and if the surface density is in an uncontrollable state for a long time, the production efficiency and the product quality of the copper foil can be seriously influenced.
The current mode of adjusting the surface density is to adjust the flow rate of 13 liquid inlets of the tank body, and the fact proves that when the surface density is adjusted by adjusting the flow rate of 13 liquid inlets of the tank body, certain defects such as defects caused by micro-control of an anode plate and the like still exist in the surface density of the copper foil due to various comprehensive fine factors in the production process, so that analysis and improvement are needed on the basis of the existing equipment and on the existing produced wool foil samples, and the production efficiency and the product quality are improved.
Disclosure of Invention
In view of the above-mentioned problems in the related art, the present invention provides a copper foil surface density adjusting device and a method for manufacturing an active surface thereof, which can solve the above-mentioned problems.
In order to achieve the technical purpose, the technical scheme of the invention is realized as follows:
the utility model provides a copper foil area density adjusting device, includes an acute angle board that has shielding function, anticorrosion material made, the acute angle board is including the fixed surface that is used for fixed and the action face that is used for shielding the electric field, the fixed surface is square, evenly distributed is a plurality of screw on the fixed surface, the action face is the cockscomb structure, the action face contains a plurality of shielding units.
Further, the length of the sharp corner plate is larger than or equal to the length of the wool foil produced by the electrolytic copper foil producing machine, and the acting surface covers the working surface of the anode plate in the electrolytic copper foil producing machine.
The method for manufacturing the acting surface of the copper foil surface density adjusting device comprises the following steps: taking a blank foil sample with the whole width E produced by an electrolytic copper foil production machine, taking continuous i square samples with the length and the width of 5mm from one end, wherein i is a natural number, recording the basis weight of the i square samples, and calculating the value of shielding data Si according to a formula Si= (Wi-Wmin) C/Wi, wherein Wi is the basis weight of the i square samples; wmin is the minimum of the basis weight or the next minimum of the basis weight in i samples, and C is the total width of the anode plate; selecting a square shielding corrosion-resistant plate with length and width=D+A, wherein D is larger than or equal to E, taking a long side of the square shielding corrosion-resistant plate as a y axis, taking an x axis of a short side of the square shielding corrosion-resistant plate as an origin, selecting i coordinate points on the square shielding corrosion-resistant plate, wherein the x axis coordinate value of the i coordinate point is xi=Si, when Si is smaller than or equal to 0, xi=0, the y axis coordinate value of the i coordinate point is Yi= (D-A)/2+5+ (2 i-1) B/2, and sequentially connecting the i coordinate points into a line graph by using a marker; and cutting along the line graph by using a cutting tool, and cutting off the redundant part.
The invention has the beneficial effects that: the device has simple structure and convenient use, can neutralize various factors causing the non-uniform surface density of the copper foil in the existing equipment and production technology, and improves the quality and the production efficiency of the copper foil.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
The invention is described in further detail below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of an apparatus for adjusting the areal density of a copper foil according to an embodiment of the present invention;
FIG. 2 is a left side view of a copper foil areal density adjustment apparatus according to one embodiment of the invention;
FIG. 3 is a rear view of a copper foil areal density adjustment apparatus of one embodiment of the invention;
FIG. 4 is a schematic view showing the installation of a copper foil areal density adjustment apparatus according to an embodiment of the invention;
FIG. 5 is a schematic drawing of a foil sampling according to an embodiment of the present invention;
fig. 6 is a graph of masked data calculations according to an embodiment of the present invention.
In the figure: 1. a fixing surface; 2. a screw hole; 3. an action surface; 4. an electrolytic copper foil producing machine; 5. an anode plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the invention, fall within the scope of protection of the invention.
As shown in fig. 1 to 4, the copper foil surface density adjusting device according to the embodiment of the invention comprises an acute angle plate made of a material with shielding function and corrosion resistance, wherein the acute angle plate comprises a fixing surface 1 for fixing and an acting surface 3 for shielding an electric field, the fixing surface is square, a plurality of screw holes 2 are uniformly distributed on the fixing surface, the acting surface is in a saw-tooth shape, and the acting surface comprises a plurality of shielding units.
The action principle of the device is as follows: copper ions are uniformly deposited on the surface of a cathode roller under the action of an electric field, and then the cathode roller rotates out of an electrolytic tank to strip and roll copper foil from the cathode roller, so that the produced crude foil can be subjected to quantitative analysis of surface density, and the electric field of an anode plate is correspondingly shielded according to the analysis result, so that the intensity of the electric field is changed, the amount of the copper ions deposited on the surface of the cathode roller is changed, and the effect of changing the surface density is achieved.
In one embodiment of the invention, the sharp corner plate is made of polyvinyl chloride plastic, the thickness of the base material is 3mm, the length of the base material is 1370mm, and the included angle between the acting surface 3 and the fixing surface 1 is 71 degrees. The angle is slightly smaller than the angle formed by two connecting surfaces fixed with the anode plate 5, so that the fixing is convenient and stable.
In one embodiment of the invention, the fixing surface 1 is provided with a plurality of screw holes 2, and one end surface of the anode plate 5 is provided with a screw hole matched with the screw hole, so that the device can be fixed on the anode plate through screws.
In one embodiment of the invention, the action surface is saw-tooth-shaped, and the shielding amount of each shielding unit is selected according to the size of the shielding electric field required.
In one embodiment of the present invention, as shown in fig. 5, a blank foil sample with a whole width of 1360mm produced by an electrolytic copper foil producing machine 4 is taken, 54 rectangular samples with a length of 5mm from one end and a width of=100×25mm are taken (the more rectangular samples are selected, the better the adjusting effect is); as shown in fig. 6, the basis weight of 54 rectangular samples W1-Wi is recorded, shielding data Si is calculated according to the formula si= (Wi-Wmin) ×3136/Wi, where Wi is the basis weight of each of 1-54 samples, wmin is the minimum or sub-minimum of the basis weight of 54 samples, and 3136mm is the total width of the anode plate; selecting corresponding 54 coordinate points on an action surface of the original square shielding plate, wherein xi=Si, yi= (1370-1360)/2+5+ (2 i-1) x 25/2=10+12.5 (2 i-1) in coordinates (Xi, yi), and sequentially connecting the 54 coordinate points into a line graph; the redundant parts are cut off by cutting tools along the line graph in sequence, and then the working surface 3 of the device is successfully manufactured. It should be noted that, because the width of the active surface of the acute angle plate raw material is only 100mm, and sometimes the minimum Wmin is used for calculation, more data exceeds 100mm, because the shielding mainly aims at drawing the difference between the maximum basis weight and the minimum basis weight, so that analysis and comparison can be performed according to the basis weight data of the actual i rectangular samples, sometimes Wmin also takes the next minimum value, and so on, more needs that the integral peak shape of the active surface is unchanged, rather than the higher, the better, as shown in fig. 6, the selected Wmin is 312mm of the next minimum value of the basis weight instead of 309, and the shielding value calculated as a negative value is calculated according to 0, namely, the abscissa is 0.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (2)
1. A method for manufacturing an acting surface of a copper foil surface density adjusting device is characterized by comprising the following steps of: the method for manufacturing the sharp corner plate comprises an sharp corner plate made of a material with shielding function and corrosion resistance, wherein the sharp corner plate comprises a fixing surface for fixing and an action surface for shielding an electric field, the fixing surface is square, a plurality of screw holes are uniformly distributed on the fixing surface, the action surface is serrated, the action surface comprises a plurality of shielding units, and the method for manufacturing the action surface comprises the following steps: taking a blank foil sample with the whole width E produced by an electrolytic copper foil production machine, taking continuous i square samples with the length and the width of 5mm from one end, wherein i is a natural number, recording the basis weight of the i square samples, and calculating the value of shielding data Si according to a formula Si= (Wi-Wmin) C/Wi, wherein Wi is the basis weight of the i square samples; wmin is the minimum of the basis weight or the next minimum of the basis weight in i samples, and C is the total width of the anode plate; selecting a square shielding corrosion-resistant plate with length and width=D+A, wherein D is larger than or equal to E, taking a long side of the square shielding corrosion-resistant plate as a y axis, taking an x axis of a short side of the square shielding corrosion-resistant plate as an origin, selecting i coordinate points on the square shielding corrosion-resistant plate, wherein the x axis coordinate value of the i coordinate point is xi=Si, when Si is smaller than or equal to 0, xi=0, the y axis coordinate value of the i coordinate point is Yi= (D-A)/2+5+ (2 i-1) B/2, and sequentially connecting the i coordinate points into a line graph by using a marker; and cutting along the line graph by using a cutting tool, and cutting off the redundant part.
2. The method for manufacturing the active surface of the copper foil surface density adjusting device according to claim 1, wherein the method comprises the following steps: the length of the acute angle plate is larger than or equal to the length of the raw foil produced by the electrolytic copper foil producing machine, and the acting surface is covered on the working surface of the anode plate in the electrolytic copper foil producing machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210030053.2A CN114351191B (en) | 2022-01-12 | 2022-01-12 | Copper foil surface density adjusting device and acting surface manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210030053.2A CN114351191B (en) | 2022-01-12 | 2022-01-12 | Copper foil surface density adjusting device and acting surface manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114351191A CN114351191A (en) | 2022-04-15 |
| CN114351191B true CN114351191B (en) | 2023-09-12 |
Family
ID=81108784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210030053.2A Active CN114351191B (en) | 2022-01-12 | 2022-01-12 | Copper foil surface density adjusting device and acting surface manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114351191B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0222887A (en) * | 1988-07-12 | 1990-01-25 | Mitsubishi Gas Chem Co Inc | Manufacture of thin copper foil clad circuit board |
| CN2392653Y (en) * | 1999-09-29 | 2000-08-23 | 谌家成 | Automatic dismounting-plate apparatus |
| CN103370824A (en) * | 2010-11-29 | 2013-10-23 | 锂电池科技有限公司 | Method for producing an electrode/separator stack including filling with an electrolyte for use in an electrochemical energy storage cell |
| CN110042441A (en) * | 2019-05-17 | 2019-07-23 | 九江德福科技股份有限公司 | A method of adjusting high tensile copper foil surface density |
| CN209568158U (en) * | 2018-12-29 | 2019-11-01 | 灵宝华鑫铜箔有限责任公司 | It is a kind of for producing the device of homogeneous heavy electrolytic copper foil |
| CN111334824A (en) * | 2020-04-30 | 2020-06-26 | 尹雨晴 | Copper foil production equipment capable of effectively improving uniform density of copper foil surface |
| CN111850628A (en) * | 2020-06-12 | 2020-10-30 | 九江德福科技股份有限公司 | Method for manufacturing punched copper foil of shielding cathode plate |
-
2022
- 2022-01-12 CN CN202210030053.2A patent/CN114351191B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0222887A (en) * | 1988-07-12 | 1990-01-25 | Mitsubishi Gas Chem Co Inc | Manufacture of thin copper foil clad circuit board |
| CN2392653Y (en) * | 1999-09-29 | 2000-08-23 | 谌家成 | Automatic dismounting-plate apparatus |
| CN103370824A (en) * | 2010-11-29 | 2013-10-23 | 锂电池科技有限公司 | Method for producing an electrode/separator stack including filling with an electrolyte for use in an electrochemical energy storage cell |
| CN209568158U (en) * | 2018-12-29 | 2019-11-01 | 灵宝华鑫铜箔有限责任公司 | It is a kind of for producing the device of homogeneous heavy electrolytic copper foil |
| CN110042441A (en) * | 2019-05-17 | 2019-07-23 | 九江德福科技股份有限公司 | A method of adjusting high tensile copper foil surface density |
| CN111334824A (en) * | 2020-04-30 | 2020-06-26 | 尹雨晴 | Copper foil production equipment capable of effectively improving uniform density of copper foil surface |
| CN111850628A (en) * | 2020-06-12 | 2020-10-30 | 九江德福科技股份有限公司 | Method for manufacturing punched copper foil of shielding cathode plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114351191A (en) | 2022-04-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Barkey et al. | Roughness development in metal electrodeposition: II. Stability theory | |
| CN106702441B (en) | A kind of method that continuous electro-deposition prepares lithium band | |
| Wang et al. | Electrochemical drilling inclined holes using wedged electrodes | |
| CN201857434U (en) | Roll-to-roll continuous vertical type high-current electroplating machine | |
| CN114351191B (en) | Copper foil surface density adjusting device and acting surface manufacturing method thereof | |
| CN109585782B (en) | Method for simultaneously producing multiple types of lithium ion battery pole pieces and extrusion coating device | |
| CN202271058U (en) | High-frequency encoding oscillating plate | |
| CN210826398U (en) | Shielding plate for electrolytic copper foil anode tank | |
| CN209568158U (en) | It is a kind of for producing the device of homogeneous heavy electrolytic copper foil | |
| CN116741923A (en) | Preparation method of zinc cathode with high (002) texture coefficient | |
| CN106881508A (en) | A kind of double hyer insulation plate surface texture electrolytic tool negative electrode and preparation method thereof | |
| CN207331085U (en) | A kind of foil machine prevented copper foil hickie and formed | |
| CN207787444U (en) | A kind of special-purpose machinery of lightning protection cold draw net | |
| CN208884008U (en) | A kind of foil machine for preventing the formation of copper foil hickie | |
| CN113025961B (en) | Preparation method of electrode foil for aluminum electrolytic capacitor | |
| CN212955408U (en) | Novel electrode machining equipment | |
| CN111058080B (en) | Double-layer titanium mesh anode for horizontal electroplating of PCB | |
| CN209636362U (en) | A kind of scan-type electro-deposition processing unit (plant) that multi-thread anode is arranged parallel | |
| US11035047B2 (en) | Electrolytic aluminum foil and method of manufacturing same | |
| CN103372718B (en) | A kind of manufacture method of antenna wave guide welding weld tabs | |
| CN219099366U (en) | Hydropower plating device convenient for eliminating anode bubbles | |
| CN219513680U (en) | Cable end processing tool | |
| CN210247180U (en) | Universal air guide plate for anti-welding plug hole of PCB | |
| CN205355087U (en) | Acoustic control extrusion formula electricity generation thin film device | |
| CN217735979U (en) | Prevent falling mounting structure of hua si function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |