CN114351191A

CN114351191A - Copper foil surface density adjusting device and acting surface manufacturing method thereof

Info

Publication number: CN114351191A
Application number: CN202210030053.2A
Authority: CN
Inventors: 徐尤泉; 张权银; 黄先彬
Original assignee: Jiujiang Defu Technology Co Ltd
Current assignee: Jiujiang Defu Technology Co Ltd
Priority date: 2022-01-12
Filing date: 2022-01-12
Publication date: 2022-04-15
Anticipated expiration: 2042-01-12
Also published as: CN114351191B

Abstract

The invention discloses a copper foil surface density adjusting device and an action surface manufacturing method thereof. The device has simple structure and convenient use, can neutralize various factors causing uneven surface density of the copper foil on the basis of the existing equipment and production technology, and improves the quality and the production efficiency of the copper foil.

Description

Copper foil surface density adjusting device and acting surface manufacturing method thereof

Technical Field

The invention relates to the technical field of electrolytic copper foil production equipment, in particular to a copper foil surface density adjusting device and a method for manufacturing an acting surface of the copper foil.

Background

The electrolytic copper foil is prepared by rotating a cathode roller connected with a negative electrode of a power supply in an electrolytic tank filled with copper sulfate solution at a certain speed, mounting an anode plate at the bottom of the electrolytic tank, directly connecting the anode plate with a positive electrode of the power supply, uniformly depositing copper ions on the surface of the cathode roller under the action of an electric field, then rotating the cathode roller out of the electrolytic tank, stripping and rolling the copper foil from the cathode roller, wherein the instability of the liquid loading and circulation of the copper sulfate solution can influence the uniformity of the foil surface on the cathode roller in the copper foil production process, and if the surface density is in an uncontrollable state for a long time, the production efficiency and the product quality of the copper foil can be seriously influenced.

The current mode of adjusting the surface density is to adjust the liquid flow of 13 liquid feeding ports of the tank body, and the fact proves that when the surface density is adjusted by adjusting the liquid flow of 13 liquid feeding ports of the tank body, the surface density of the copper foil still has the defect of non-uniform surface density due to various comprehensive fine factors in the production process, such as the defect caused by micro out-of-control of an anode plate, and the like, so that the analysis and improvement are needed on the basis of the existing equipment and on the existing produced wool foil samples to improve the production efficiency and the product quality.

Disclosure of Invention

The invention provides a copper foil surface density adjusting device and a method for manufacturing an action surface thereof, which can solve the above technical problems in the related art.

In order to achieve the technical purpose, the technical scheme of the invention is realized as follows:

the utility model provides a copper foil surface density adjusting device, includes the acute scute that a material that has shielding function, anticorrosion made, the acute scute is including the stationary plane that is used for fixing and the working face that is used for shielding the electric field, the stationary plane is square, a plurality of screw of evenly distributed on the stationary plane, the working face is the cockscomb structure, the working face contains a plurality of shielding units.

Further, the length of the acute angle plate is larger than or equal to that of the rough foil produced by the electrolytic copper foil green-forming machine, and the acting surface covers the working surface of the anode plate in the electrolytic copper foil green-forming machine.

A method for manufacturing an acting surface of a copper foil surface density adjusting device comprises the following steps: taking a whole width E of a hair foil sample produced by an electrolytic copper foil raw foil machine, taking i continuous square samples with the length and the width = A and B from a position 5mm from one end, wherein i is a natural number, recording the basis weight of the i square samples, and calculating the value of shielding data Si according to a formula Si = (Wi-Wmin). C/Wi, wherein Wi is the basis weight of the ith square sample; wmin is the minimum basis weight or minimum basis weight of the i samples, and C is the total width of the anode plate; selecting a square shielding anti-corrosion plate with the length and the width = D and A, wherein D is more than or equal to E, taking a long side of the square shielding anti-corrosion plate as a y axis, taking a short side x axis of the square shielding anti-corrosion plate, taking an intersection point of the two sides as an origin, selecting i coordinate points on the square shielding anti-corrosion plate, wherein the x axis coordinate value of the ith coordinate point is Xi = Si, when Si is less than or equal to 0, Xi =0, and the y axis coordinate value of the ith coordinate point is Yi = (D-A)/2 +5+ (2i-1) B/2, and sequentially connecting the i coordinate points into a broken line graph by using a marker pen; the excess portion is cut off by cutting along the line graph with a cutting tool.

The invention has the beneficial effects that: the device has simple structure and convenient use, can neutralize various factors causing uneven surface density of the copper foil on the basis of the existing equipment and production technology, and improves the quality and the production efficiency of the copper foil.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

The invention is explained in further detail below with reference to the drawing.

FIG. 1 is a schematic structural diagram of an apparatus for adjusting areal density of copper foil according to an embodiment of the present invention;

FIG. 2 is a left side view of an apparatus for adjusting areal density of copper foil according to an embodiment of the present invention;

FIG. 3 is a rear view of an apparatus for adjusting areal density of copper foil according to an embodiment of the present invention;

FIG. 4 is a schematic view of an installation of a device for adjusting areal density of copper foil according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a rough foil sampling according to an embodiment of the present invention;

FIG. 6 is a diagram of masked data calculation according to an embodiment of the present invention.

In the figure: 1. a fixed surface; 2. a screw hole; 3. acting surface; 4. electrolytic copper foil forming machine; 5. and (4) an anode plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.

As shown in fig. 1 to 4, the device for adjusting the areal density of copper foil according to the embodiment of the present invention comprises an acute angle plate made of a material having a shielding function and corrosion resistance, wherein the acute angle plate comprises a fixing surface 1 for fixing, which is square, and an action surface 3 for shielding an electric field, which is provided with a plurality of screw holes 2 uniformly distributed thereon, and is saw-toothed, and the action surface comprises a plurality of shielding units.

The function principle of the device is as follows: copper ions are uniformly deposited on the surface of the cathode roller under the action of an electric field, then the cathode roller is rotated out of the electrolytic tank, and the copper foil is stripped and wound from the cathode roller, so that the produced rough foil can be subjected to surface density quantitative analysis, and the electric field of the anode plate is correspondingly shielded according to the analysis result, so that the strength of the electric field is changed, the amount of the copper ions deposited on the surface of the cathode roller is changed, and the effect of changing the surface density is achieved.

In one embodiment of the invention, the acute angle plate is made of polyvinyl chloride plastic, the thickness of the base material is 3mm, the length of the base material is 1370mm, and an included angle between the action surface 3 and the fixed surface 1 is 71 degrees. The angle is slightly smaller than the angle formed by the two connecting surfaces fixed with the anode plate 5, so that the fixing is stable.

In one embodiment of the invention, the fixing surface 1 is provided with a plurality of screw holes 2, and one end face of the anode plate 5 is provided with screw holes matched with the screw holes, so that the device can be fixed on the anode plate through screws.

In one embodiment of the present invention, the active surface is serrated, and the shielding amount of each shielding unit is selected according to the magnitude of the shielding electric field required.

In one embodiment of the present invention, as shown in fig. 5, a sample of a crude foil with a width of 1360mm produced by an electrolytic copper foil forming machine 4 is taken, and 54 rectangular samples with a length × width =100 × 25mm are taken from one end 5mm (the more rectangular samples are selected, the better the adjustment effect is); as shown in fig. 6, 54 rectangular samples W1 were recorded, the basis weight of Wi, and the mask data Si was calculated according to the formula Si = (Wi-Wmin) × 3136/Wi, where Wi is the basis weight of each of 1-54 samples, Wmin is the minimum or next minimum of the basis weights of the 54 samples, and 3136mm is the total width of the anode plate; selecting 54 corresponding coordinate points on the action surface of the original square shielding plate, wherein Xi = Si, Yi = (1370-1360)/2+5+ (2i-1) × 25/2=10+12.5(2i-1) in the coordinates (Xi, Yi), and sequentially connecting the 54 coordinate points into a broken line graph; the cutting tool cuts the work surface along the line graph in sequence, and the redundant parts are cut off, so that the work surface 3 of the device is successfully manufactured. It should be noted that since the width of the active surface of the acute angle board raw material is only 100mm, sometimes when the minimum Wmin is used, there is more data than 100mm, since we mask the main function of narrowing the difference between the maximum basis weight and the minimum basis weight, so we can analyze and compare the basis weight data of the actual i rectangular samples, sometimes Wmin will take the next minimum, and so on, we need more that the overall peak shape of the active surface is unchanged rather than the higher the better, as shown in fig. 6, the selected Wmin is the minimum 312mm of the basis weight instead of the minimum 309 of the basis weight, wherein the mask value calculated as a negative value is calculated as 0, i.e. the abscissa is 0.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides a copper foil surface density adjusting device which characterized in that: the corner plate comprises a sharp corner plate made of a material with a shielding function and an anti-corrosion function, wherein the sharp corner plate comprises a fixing surface and an action surface, the fixing surface is used for fixing, the action surface is used for shielding an electric field, the fixing surface is square, a plurality of screw holes are uniformly distributed in the fixing surface, the action surface is in a sawtooth shape, and the action surface comprises a plurality of shielding units.

2. The device for adjusting the areal density of copper foil according to claim 1, wherein: the length of the acute angle plate is larger than or equal to that of the rough foil produced by the electrolytic copper foil green foil machine, and the acting surface covers the working surface of the anode plate in the electrolytic copper foil green foil machine.

3. A method of producing an active surface of an adjustment device according to claim 1 or 2, characterized in that: the method comprises the following steps: taking a whole width E of a hair foil sample produced by an electrolytic copper foil raw foil machine, taking i continuous square samples with the length and the width = A and B from a position 5mm from one end, wherein i is a natural number, recording the basis weight of the i square samples, and calculating the value of shielding data Si according to a formula Si = (Wi-Wmin). C/Wi, wherein Wi is the basis weight of the ith square sample; wmin is the minimum basis weight or minimum basis weight of the i samples, and C is the total width of the anode plate; selecting a square shielding anti-corrosion plate with the length and the width = D and A, wherein D is more than or equal to E, taking a long side of the square shielding anti-corrosion plate as a y axis, taking a short side x axis of the square shielding anti-corrosion plate, taking an intersection point of the two sides as an origin, selecting i coordinate points on the square shielding anti-corrosion plate, wherein the x axis coordinate value of the ith coordinate point is Xi = Si, when Si is less than or equal to 0, Xi =0, and the y axis coordinate value of the ith coordinate point is Yi = (D-A)/2 +5+ (2i-1) B/2, and sequentially connecting the i coordinate points into a broken line graph by using a marker pen; the excess portion is cut off by cutting along the line graph with a cutting tool.