CN114340207A - Light-weighted SMD antenna module - Google Patents
Light-weighted SMD antenna module Download PDFInfo
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- CN114340207A CN114340207A CN202111501048.7A CN202111501048A CN114340207A CN 114340207 A CN114340207 A CN 114340207A CN 202111501048 A CN202111501048 A CN 202111501048A CN 114340207 A CN114340207 A CN 114340207A
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Abstract
The invention discloses a light SMD antenna module, belonging to the communication antenna field, the scheme is that an SMD module is manufactured by matching a metal support body with an antenna produced by a PCB circuit board and a capacitor element, and then the SMD module can enter an SMT process together with a mainboard to replace the steps of double-sided adhesive pasting and manual soldering iron welding, thereby saving manual operation processes, and the production raw materials are short in production period, convenient for automatic production, and greatly saving production cost and production period, meanwhile, when various elements are pasted on the PCB circuit board, a flow guiding fan is driven to rotate by a deformation memory telescopic rod, so that blown hot air is dispersed to the four places, the PCB circuit board is uniformly heated, a viscous layer keeps good viscosity at high temperature, adsorbs the PCB circuit board, is not easy to deform, and is prevented from being connected with the elements due to deformation in the pasting process, the processing effect is enhanced, the reject ratio is reduced, the product quality is effectively improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the field of communication antennas, in particular to a light SMD antenna module.
Background
The antenna has a wide application in the technical field of wireless communication, particularly in the fields of mobile communication, vehicle-mounted communication, satellite communication and the like, most of GNSS antennas on the market currently mainly use sheet ceramic, the most commonly used GNSS antennas are ceramic antennas with two specifications of 25 × 4 and 25 × 6mm, the ceramic antennas are generally mounted by adhering double-sided adhesive tapes at the bottom to a mainboard, and are inserted into the mainboard through a metal feed pin and welded.
The ceramic antenna has the advantages of relatively high cost, large heat absorption, slow temperature rise, relatively complex mounting process, relatively long production period, inconvenience for automatic production, easiness in sending deformation in the production process, influence on connection between the ceramic antenna and the mainboard and great improvement on the production cost.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a light SMD antenna module, the scheme is that an SMD module is manufactured by matching a metal support body with an antenna produced by a PCB circuit board and a capacitance element, and then the SMD module and a mainboard can enter an SMT process together to replace the steps of double-sided adhesive pasting and manual soldering iron welding, so that the manual operation process is omitted, the production raw materials are short in production period, the automatic production is convenient, the production cost and the production period are greatly saved, and meanwhile, when various elements are pasted on the PCB circuit board, a flexible belt is pushed to move by extending a deformation memory telescopic rod, so that the flexible belt drives a flow guide fan to rotate through a rack and a gear, blown hot air is dispersed to four places, the PCB circuit board is uniformly heated, the adhesive layer keeps good viscosity at high temperature, and adsorbs the PCB circuit board to be difficult to deform, avoid not gomphosis because of deformation and being connected of component at the paster in-process, strengthen the processing effect, reduce the defective rate, the effectual product quality that has improved to reduce its manufacturing cost.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A light SMD antenna module comprises a PCB supplied material inspection module, wherein a screen printing solder paste module is arranged at the outer end of the PCB supplied material inspection module, a solder printing effect inspection module is arranged at the outer end of the screen printing solder paste module, a patch module is arranged at the outer end of the solder printing effect inspection module, a furnace front QC inspection module is arranged at the outer end of the patch module, a reflow furnace welding module is arranged at the outer end of the furnace front QC inspection module, a welding effect inspection module is arranged at the outer end of the reflow furnace welding module, a rear welding module is arranged at the outer end of the welding effect inspection module, a rear welding effect inspection module is arranged at the outer end of the rear welding module, a function test module is arranged at the outer end of the rear welding effect inspection module, a finished PCBA packaging and conveying inspection module is arranged at the outer end of the function test module, and after a PCB circuit board is detected by the PCB supplied material inspection module, printing is carried out through a screen printing solder paste module, various parts are pasted on the surface mounting module through the surface mounting module, then comprehensive welding treatment is carried out on the parts through a reflow furnace welding module and a post welding module, after a welded finished product is tested through a function testing module, the finished product is finally packaged through a finished product PCBA packaging and inspecting module and is stored, the SMT manufacture procedure can be carried out together with the main board through the SMD module, all materials of the main board are completed in the SMT manufacture procedure at one time, therefore, the manual operation flow is omitted, the full-automatic production of the main board is facilitated, and the production cost and the production period are greatly saved.
Further, a PCB (printed circuit board) is arranged in the chip module, a metal support body is installed at the upper end of the PCB, a plurality of capacitance elements are installed at the upper end of the PCB, the capacitance elements are located on the outer side of the metal support body, a fixing frame is arranged at the lower end of the PCB, a viscous layer is arranged between the fixing frame and the PCB, an annular block is fixedly connected to the inner wall of the fixing frame, the outer end of the annular block is fixedly connected with bilaterally symmetrical extrusion cylinders, push plates are slidably connected to the inner wall of the extrusion cylinders, deformation memory telescopic rods are fixedly connected between the push plates and the inner wall of the extrusion cylinders, gears are rotatably connected to the inner wall of the extrusion cylinders, flexible belts are fixedly connected to the outer ends of the push plates, racks are fixedly connected to the outer ends of the flexible belts, the racks are connected with gears in a meshed manner, and first umbrella-type gears are fixedly connected to the outer ends of the gears, the inner wall of the extrusion cylinder is rotatably connected with a second bevel gear, the first bevel gear is meshed with the second bevel gear, the outer end of the extrusion cylinder is rotatably connected with a guide fan, the guide fan is fixedly connected with the second bevel gear, the inner walls of the left end and the right end of the fixing frame are provided with vents, the vents correspond to the guide fan, the scheme prepares an SMD module by matching a metal support body with an antenna produced by a PCB circuit board and a capacitor element, and then the SMD module can enter an SMT process together with a main board to replace the step of double-sided adhesive pasting and manual soldering iron welding, thereby saving manual operation processes, saving production raw materials, having short production period, facilitating automatic production, greatly saving production cost and production period, and pushing the flexible belt to move by deformation memory telescopic rod extension when various elements are pasted on the PCB circuit board, make it rotate through rack and gear drive water conservancy diversion fan, make its hot-air that will blow dredge the dispersion to everywhere, make PCB circuit board thermally equivalent, and the viscous layer keeps good viscidity under high temperature, adsorb the PCB circuit board, make its difficult emergence deformation, avoid not gomphosis because of deformation is connected with the component at the paster in-process, reinforcing machining effect reduces the defective rate, the effectual product quality that has improved to reduce its manufacturing cost.
Further, fixedly connected with elasticity magnetic insulation utricule between the inner wall of annular piece, elasticity is equipped with the magnet piece in the magnetic insulation utricule, elasticity magnetic insulation utricule intussuseption is filled with magnetic insulation powder, the push pedal is close to the pull rod of two longitudinal symmetries of the one end fixedly connected with of annular piece, it has two longitudinal symmetries's through-hole to cut between fixed frame and the annular piece, the pull rod is close to the one end of annular piece and passes the outer end fixed connection of through-hole and elasticity magnetic insulation utricule, the lower extreme of fixed frame is cut and is dug the louvre that has a plurality of evenly distributed, and at the push pedal removal in-process, the pull rod is pulled along with its simultaneous movement, and the elasticity magnetic insulation utricule is stretched to both sides deformation, makes magnetic insulation powder diffuse, cancels the magnetic screen of magnet piece, makes its difficult emergence deformation under high temperature through the absorption of magnet piece to the metal support body.
Furthermore, the adhesive layer is made of the super-aligned carbon nanotube film material, the length and the width of the adhesive layer are matched with those of the PCB, and the adhesive layer made of the super-aligned carbon nanotube film material still keeps good viscosity at low temperature or high temperature and is not easily influenced by the environment.
Further, the shape memory telescopic link adopts shape memory alloy material to make, the initial state of shape memory telescopic link is the contraction state, and the shape memory telescopic link of making through using shape memory alloy material has the memory function, and after the temperature rose, it can take place the deformation, extends, and after the temperature reduced, shape memory telescopic link resumes its initial contraction state again.
Further, spherical groove has all been dug at the upper and lower both ends of push pedal, the spherical inslot internal rotation is connected with the ball, the outer end of ball and the inner wall sliding connection of recipient, the outer end of push pedal is T shape setting, and through the setting of ball, it is more smooth and easy convenient to make the push pedal gliding in the recipient, reduces the friction, and establishes the outer end of push pedal into the T shape, makes its lower extreme be difficult for causing the interference to the motion of flexible band.
Furthermore, the inner wall of the rear end of the extrusion container is provided with a U-shaped sliding groove in a chiseled mode, the flexible belt is connected with the U-shaped sliding groove in a sliding mode, and the flexible belt, the rack and the gear are meshed more smoothly and conveniently through the U-shaped sliding groove.
Furthermore, the inner wall fixedly connected with dust screen of vent, the surface coating of dust screen has high temperature resistant coating, through the setting of dust screen, makes the dust be difficult for entering into the recipient through the vent in, and the setting of high temperature resistant coating makes the dust screen be difficult for taking place to damage under high temperature environment, prolongs its life.
Further, the magnetism insulation powder is made of Fe-Ni alloy materials, the content of Ni in the magnetism insulation powder is 80%, and the magnetism influence of the magnet pieces can be effectively shielded in a dense state by using the magnetism insulation powder made of the Fe-Ni alloy materials.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the scheme prepares the metal bracket body into the SMD module by matching with the antenna produced by the PCB circuit board and the capacitor element, and then the SMD module and the mainboard can enter into the SMT process together to replace the steps of double-sided adhesive pasting and manual soldering iron welding, thereby saving the manual operation process, and the production raw materials thereof have shorter production period, are convenient for automatic production, greatly saving the production cost and the production period, simultaneously, when various elements are pasted on the PCB circuit board, the flexible belt is pushed to move by extending the deformation memory telescopic rod, the flexible belt is driven to rotate by the rack and the gear, the blown hot air is dispersed to the four places, the PCB circuit board is uniformly heated, the viscous layer keeps good viscosity at high temperature, adsorbs the PCB circuit board, is not easy to deform, avoids non-embedding with the connection of the elements due to deformation in the pasting process, and enhances the processing effect, the reject ratio is reduced, the product quality is effectively improved, and the production cost is reduced.
(2) Fixedly connected with elasticity magnetic isolation utricule between the inner wall of annular piece, elasticity is equipped with the magnet piece in the magnetic isolation utricule, elasticity is filled with magnetic powder that insulates against heat, the push pedal is close to the pull rod of two longitudinal symmetries of the one end fixedly connected with of annular piece, cut between fixed frame and the annular piece has the through-hole of two longitudinal symmetries, the pull rod is close to the one end of annular piece and passes the outer end fixed connection of through-hole and elasticity magnetic isolation utricule, the lower extreme of fixed frame is cut and is dug the louvre that has a plurality of evenly distributed, remove the in-process in the push pedal, the pull rod is pulled along with its motion together, the pulling elasticity magnetic isolation utricule extends to the deformation of both sides, make magnetic powder spread, cancel the magnetic screen of magnet piece, it is difficult for taking place deformation under high temperature to the absorption of metal support body through the magnet piece.
(3) The adhesive layer is made of the super-aligned carbon nanotube film material, the length and the width of the adhesive layer are matched with those of the PCB, and the adhesive layer made of the super-aligned carbon nanotube film material still keeps good viscosity at low temperature or high temperature and is not easily influenced by the environment.
(4) The deformation memory telescopic link is made of shape memory alloy materials, the initial state of the deformation memory telescopic link is a contraction state, the deformation memory telescopic link made of the shape memory alloy materials has a memory function, and can deform and extend after the temperature rises, and the deformation memory telescopic link returns to the initial contraction state after the temperature falls.
(5) Spherical groove has all been dug at the upper and lower both ends of push pedal, and the spherical inslot rotation is connected with the ball, the outer end of ball and the inner wall sliding connection of recipient, and the outer end of push pedal is T shape setting, through the setting of ball, makes the push pedal gliding more smooth and easy convenient in the recipient, reduces the friction, and establishes the outer end of push pedal into the T shape, makes its lower extreme be difficult for causing the interference to the motion of flexible band.
(6) The inner wall of the rear end of the extrusion container is provided with a U-shaped sliding groove in a chiseled mode, the flexible belt is connected with the U-shaped sliding groove in a sliding mode, and the flexible belt, the rack and the gear are meshed more smoothly and conveniently through the U-shaped sliding groove.
(7) The inner wall fixedly connected with dust screen of vent, the surface coating of dust screen has high temperature resistant coating, through the setting of dust screen, makes the dust be difficult for entering into the recipient through the vent in, and the setting of high temperature resistant coating makes the dust screen be difficult for taking place to damage under high temperature environment, prolongs its life.
(8) The magnetic insulation powder is made of Fe-Ni alloy materials, the content of Ni in the magnetic insulation powder is 80%, and the magnetic influence of the magnet sheets can be effectively shielded in a dense state by using the magnetic insulation powder made of the Fe-Ni alloy materials.
Drawings
Fig. 1 is a flow chart of the manufacturing process of the SMD antenna module of the present invention;
FIG. 2 is a schematic perspective view of a PCB of the present invention;
FIG. 3 is a schematic top view of the PCB of the present invention;
FIG. 4 is a schematic sectional view of the fixing frame according to the present invention;
FIG. 5 is a schematic perspective view of a push plate according to the present invention;
FIG. 6 is a schematic front sectional view of a gear according to the present invention;
fig. 7 is a schematic cross-sectional view of the ball of the present invention.
The reference numbers in the figures illustrate:
1. a PCB incoming material inspection module; 2. screen printing a solder paste module; 3. a tin printing effect checking module; 4. a patch module; 5. a furnace QC inspection module; 6. welding through a reflow furnace; 7. checking the welding effect; 8. postwelding the module; 9. a post-welding effect inspection module; 10. a functional test module; 11. a finished product PCBA packaging submission module; 12. a PCB circuit board; 13. a metal stent body; 14. a capacitive element; 15. a fixing frame; 16. an adhesive layer; 17. a ring block; 18. an extrusion cylinder; 1801. a U-shaped chute; 19. memorizing a telescopic rod; 20. pushing the plate; 2001. a ball bearing; 21. a flexible band; 22. a rack; 23. a gear; 24. a first bevel gear; 25. a second bevel gear; 26. a flow guiding fan; 27. a dust screen; 28. a pull rod; 29. an elastic magnetic isolation capsule body; 30. and a magnet piece.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
referring to fig. 1, a light SMD antenna module includes a PCB incoming material inspecting module 1, a screen printing solder paste module 2 is disposed at an outer end of the PCB incoming material inspecting module 1, a solder printing effect inspecting module 3 is disposed at an outer end of the screen printing solder paste module 2, a chip mounting module 4 is disposed at an outer end of the solder printing effect inspecting module 3, a front QC inspecting module 5 is disposed at an outer end of the chip mounting module 4, a reflow oven welding module 6 is disposed at an outer end of the front QC inspecting module 5, a welding effect inspecting module 7 is disposed at an outer end of the reflow oven welding module 6, a rear welding module 8 is disposed at an outer end of the welding effect inspecting module 7, a rear welding effect inspecting module 9 is disposed at an outer end of the rear welding effect inspecting module 9, a functional testing module 10 is disposed at an outer end of the functional testing module 10, a finished product PCBA package inspecting module 11 is disposed at an outer end of the functional testing module 10, after a PCB circuit board 12 is first detected by the PCB incoming material inspecting module 1, printing is carried out through a screen printing solder paste module 2, various parts are pasted on the chip mounting module 4, then comprehensive welding treatment is carried out on the parts through a reflow oven welding module 6 and a post welding module 8, after a welded finished product is tested through a function testing module 10, the finished product is packaged through a finished product PCBA packaging and inspecting module 11 and is stored, SMT manufacture procedures can be carried out together with the main board through the SMD module, all materials of the main board are completed in one time in the SMT manufacture procedures, manual operation procedures are omitted, full-automatic production of the main board is facilitated, and production cost and production period are greatly saved.
Referring to fig. 2-7, a PCB 12 is disposed in a chip module 4, a metal frame body 13 is disposed at the upper end of the PCB 12, a plurality of capacitor elements 14 are disposed at the upper end of the PCB 12, the capacitor elements 14 are disposed at the outer side of the metal frame body 13, a fixing frame 15 is disposed at the lower end of the PCB 12, an adhesive layer 16 is disposed between the fixing frame 15 and the PCB 12, an annular block 17 is fixedly connected to the inner wall of the fixing frame 15, bilaterally symmetrical extrusion cylinders 18 are fixedly connected to the outer ends of the annular block 17, a push plate 20 is slidably connected to the inner wall of the extrusion cylinder 18, a deformation memory telescopic rod 19 is fixedly connected between the push plate 20 and the inner wall of the extrusion cylinder 18, a gear 23 is rotatably connected to the inner wall of the extrusion cylinder 18, a flexible belt 21 is fixedly connected to the outer end of the push plate 20, a rack 22 is fixedly connected to the outer end of the flexible belt 21, the rack 22 is engaged with the gear 23, the outer end of the gear 23 is fixedly connected with a first bevel gear 24, the inner wall of the extrusion cylinder 18 is rotatably connected with a second bevel gear 25, the first bevel gear 24 is meshed with the second bevel gear 25, the outer end of the extrusion cylinder 18 is rotatably connected with a guide fan 26, the guide fan 26 is fixedly connected with the second bevel gear 25, the inner walls of the left end and the right end of the fixing frame 15 are provided with vents, and the vents correspond to the guide fan 26, the scheme prepares an SMD module by matching the metal support body 13 with the antenna produced by the PCB circuit board 12 and the capacitor element 14, and further can enter an SMT process together with a mainboard to replace the step of welding double-faced adhesive and a manual soldering iron, thereby saving the manual operation flow, and the production raw materials, the production period is shorter, the automatic production is convenient, the production cost and the production period are greatly saved, and simultaneously when various elements are pasted on the PCB circuit board 12, extend through deformation memory telescopic link 19 and promote the motion of flexible band 21, make it drive water conservancy diversion fan 26 through rack 22 and gear 23 and rotate, make its hot-air that will blow dredge the dispersion everywhere, make PCB circuit board 12 thermally equivalent, and adhesive linkage 16 keeps good viscidity under high temperature, adsorb PCB circuit board 12, make it be difficult for taking place deformation, avoid not gomphosis because of being connected of deformation and component at the paster in-process, the reinforcing process effect, reduce the defective rate, the effectual product quality that has improved, and reduce its manufacturing cost.
Referring to fig. 4, an elastic magnetism isolating bag body 29 is fixedly connected between the inner walls of the annular blocks 17, magnet pieces 30 are arranged in the elastic magnetism isolating bag body 29, magnetism isolating powder is filled in the elastic magnetism isolating bag body 29, two pull rods 28 which are symmetrical up and down are fixedly connected at one end of the push plate 20 close to the annular blocks 17, two through holes which are symmetrical up and down are cut between the fixing frame 15 and the annular blocks 17, one end of each pull rod 28 close to the annular blocks 17 penetrates through the through hole to be fixedly connected with the outer ends of the elastic magnetism isolating bag body 29, a plurality of heat dissipation holes which are uniformly distributed are cut at the lower end of the fixing frame 15, during the movement of the push plate 20, the pull rod 28 is pulled to move along with the push plate, the elastic magnetism isolating bag body 29 is pulled to deform and extend towards two sides, magnetism isolating powder is diffused, the magnetic shielding of the magnet sheets 30 is cancelled, the magnet piece 30 is attracted to the metal holder body 13 so as to be less likely to be deformed at high temperatures.
Referring to fig. 4-7, the adhesive layer 16 is made of a super-aligned carbon nanotube film, the length and width of the adhesive layer 16 are matched with those of the PCB 12, the adhesive layer 16 made of the super-aligned carbon nanotube film still maintains good adhesion at low or high temperature and is not easily affected by the environment, the shape-change memory telescopic rod 19 is made of a shape-memory alloy material, the initial state of the shape-change memory telescopic rod 19 is a contracted state, the shape-change memory telescopic rod 19 made of the shape-memory alloy material has a memory function, and is deformed and extended after the temperature rises, and the shape-change memory telescopic rod 19 returns to its initial contracted state after the temperature drops, grooves are drilled at the upper and lower ends of the push plate 20, balls 2001 are rotatably connected in the spherical grooves, and the outer ends of the balls 2001 are slidably connected with the inner wall of the extrusion tube 18, the outer end of the push plate 20 is T-shaped, the push plate 20 can slide more smoothly and conveniently in the extrusion container 18 through the arrangement of the balls 2001, friction is reduced, the outer end of the push plate 20 is T-shaped, and the lower end of the push plate is not prone to interfering with the movement of the flexible belt 21.
Referring to fig. 4, a U-shaped chute 1801 is drilled in the inner wall of the rear end of the extrusion barrel 18, the flexible belt 21 is slidably connected with the U-shaped chute 1801, the flexible belt 21, the rack 22 and the gear 23 are more smoothly and conveniently engaged with each other through the U-shaped chute 1801, the inner wall of the vent is fixedly connected with a dust screen 27, the surface of the dust screen 27 is coated with a high temperature resistant coating, through the arrangement of the dust screen 27, dust is not easy to enter the extrusion barrel 18 through the vent, and the dust screen 27 is not easy to be damaged in a high temperature environment due to the arrangement of the high temperature resistant coating, so that the service life of the dust screen is prolonged.
In the invention, when the relevant technicians use the PCB, firstly, the PCB 12 is detected by the PCB incoming material inspection module 1, then the PCB is printed by the screen printing tin paste module 2, then various parts are pasted on the PCB by the patch module 4, then the PCB is subjected to the overall welding treatment by the reflow oven welding module 6 and the rear welding module 8, after various elements are pasted on the PCB 12 and the PCB is subjected to the welding treatment in the reflow oven welding module 6, after the PCB 12 is blown by heated gas, the deformation memory telescopic rod 19 in the fixing frame 15 is heated and extended, the push plate 20 is pushed to move away from the annular block 17 to drive the flexible belt 21 and the rack 22 to move, the gear 23 drives the gear 23 to rotate, the gear 23 drives the first bevel gear 24 to rotate, the gear 23 drives the guide fan 26 to rotate by the second bevel gear 25, and the blown hot air is dispersed to the four places, the PCB 12 is heated uniformly, the viscous layer 16 keeps good viscosity at high temperature, the PCB 12 is adsorbed, in the moving process of the push plate 20, the pull rod 28 is pulled to move along with the movement, the elastic magnetism isolating bag body 29 is pulled to deform and extend towards two sides, magnetism isolating powder is diffused, the magnetic shielding of the magnet sheet 30 is cancelled, the metal support body 13 is not easy to deform due to the adsorption of the magnet sheet 30, the phenomenon that the metal support body is not embedded with elements due to deformation in the pasting process is avoided, the processing effect is enhanced, after a welded finished product is tested by the function testing module 10, the finished product is finally packaged by the finished product PCBA packaging and conveying module 11 and is put in storage, the SMT process can be achieved by the SMD module and enters the SMT process together, all materials of the mainboard are completed at one time in the SMT process, so that the manual operation process is omitted, and the full-automatic production is facilitated, greatly saving the production cost and the production period.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (9)
1. The utility model provides a light-weighted SMD antenna module, includes PCB supplied materials inspection module (1), its characterized in that: a screen printing solder paste module (2) is arranged at the outer end of the PCB incoming material inspection module (1), the outer end of the screen printing solder paste module (2) is provided with a solder printing effect inspection module (3), a chip mounting module (4) is arranged at the outer end of the tin printing effect inspection module (3), a furnace front QC inspection module (5) is arranged at the outer end of the chip mounting module (4), the outer end of the stokehole QC inspection module (5) is provided with a reflow oven welding module (6), the outer end of the welding module (6) of the over-reflow oven is provided with a welding effect checking module (7), the outer end of the welding effect checking module (7) is provided with a rear welding module (8), a rear welding effect checking module (9) is arranged at the outer end of the rear welding module (8), the outer end of the back welding effect checking module (9) is provided with a function testing module (10), and a finished product PCBA packaging and inspecting module (11) is arranged at the outer end of the function testing module (10).
2. The SMD antenna module of claim 1, wherein the SMD antenna module further includes: be equipped with PCB circuit board (12) in paster module (4), metal support body (13) are installed to the upper end of PCB circuit board (12), a plurality of capacitive element (14) are installed to the upper end of PCB circuit board (12), and capacitive element (14) are located the outside of metal support body (13), the lower extreme of PCB circuit board (12) is equipped with fixed frame (15), be equipped with adhesive layer (16) between fixed frame (15) and PCB circuit board (12), the inner wall fixedly connected with annular piece (17) of fixed frame (15), the outer end fixedly connected with bilateral symmetry's recipient (18) of annular piece (17), the inner wall sliding connection of recipient (18) has push pedal (20), fixedly connected with deformation memory telescopic link (19) between the inner wall of push pedal (20) and recipient (18), the inner wall rotation of recipient (18) is connected with gear (23), the outer end fixedly connected with flexible band (21) of push pedal (20), the outer end fixedly connected with rack (22) of flexible band (21), rack (22) are connected with gear (23) meshing, the first umbellate form gear of outer end fixedly connected with (24) of gear (23), the inner wall of recipient (18) rotates and is connected with second umbellate form gear (25), first umbellate form gear (24) are connected with second umbellate form gear (25) meshing, the outer end of recipient (18) rotates and is connected with water conservancy diversion fan (26), water conservancy diversion fan (26) and second umbellate form gear (25) fixed connection, the vent has all been dug to both ends inner wall about fixed frame (15), and the vent is corresponding with water conservancy diversion fan (26).
3. The SMD antenna module of claim 2, wherein the SMD antenna module further includes: fixed connection has elasticity to be had a magnetic insulation utricule (29) between the inner wall of annular piece (17), be equipped with magnet piece (30) in elasticity magnetic insulation utricule (29), elasticity magnetic insulation utricule (29) intussuseption is filled with magnetic powder, pull rod (28) that push pedal (20) are close to two longitudinal symmetries of one end fixedly connected with of annular piece (17), it has two longitudinal symmetries's through-hole to open between fixed frame (15) and annular piece (17), the outer end fixed connection of through-hole and elasticity magnetic insulation utricule (29) is passed to the one end that pull rod (28) are close to annular piece (17), the lower extreme of fixed frame (15) is opened and is dug the louvre that has a plurality of evenly distributed.
4. The SMD antenna module of claim 2, wherein the SMD antenna module further includes: the adhesive layer (16) is made of a super-aligned carbon nanotube film material, and the length and the width of the adhesive layer (16) are matched with those of the PCB (12).
5. The SMD antenna module of claim 2, wherein the SMD antenna module further includes: the shape memory telescopic rod (19) is made of shape memory alloy materials, and the initial state of the shape memory telescopic rod (19) is a contraction state.
6. The SMD antenna module of claim 2, wherein the SMD antenna module further includes: spherical grooves are formed in the upper end and the lower end of the push plate (20), balls (2001) are connected in the spherical grooves in a rotating mode, the outer ends of the balls (2001) are connected with the inner wall of the extrusion container (18) in a sliding mode, and the outer end of the push plate (20) is arranged in a T shape.
7. The SMD antenna module of claim 2, wherein the SMD antenna module further includes: the inner wall of the rear end of the extrusion cylinder (18) is provided with a U-shaped sliding groove (1801) in a chiseled mode, and the flexible belt (21) is in sliding connection with the U-shaped sliding groove (1801).
8. The SMD antenna module of claim 2, wherein the SMD antenna module further includes: the inner wall of the ventilation opening is fixedly connected with a dust screen (27), and the surface of the dust screen (27) is coated with a high-temperature-resistant coating.
9. The SMD antenna module of claim 3, in which: the magnetic isolation powder is made of Fe-Ni alloy materials, and the content of Ni in the magnetic isolation powder is 80%.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111501048.7A CN114340207B (en) | 2021-12-09 | 2021-12-09 | Lightweight SMD antenna module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111501048.7A CN114340207B (en) | 2021-12-09 | 2021-12-09 | Lightweight SMD antenna module |
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| CN114340207A true CN114340207A (en) | 2022-04-12 |
| CN114340207B CN114340207B (en) | 2023-10-27 |
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| CN114340207B (en) | 2023-10-27 |
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