CN219188920U - Vacuum selective wave soldering machine - Google Patents

Abstract

The utility model discloses a vacuum selective wave soldering machine, which comprises a machine case, a vacuum extraction assembly, a feeding mechanism and a welding mechanism; the inside of the case is provided with a sealing bin; the vacuum extraction assembly is arranged outside the case and is used for vacuumizing the sealed bin; the feeding mechanism comprises a first feeding mechanism and a second feeding mechanism, and the first feeding mechanism and the second feeding mechanism are oppositely arranged in the sealing bin in the front-back direction and used for conveying the PCB; the welding structure comprises a driving seat and a welding piece, wherein the driving seat is arranged in the sealing bin and is connected with the welding piece, and the driving seat is used for driving the welding piece to move in the sealing bin; the welding piece is used for welding electronic components on the PCB. According to the vacuum selective wave soldering machine provided by the utility model, the vacuum pumping assembly is used for vacuumizing the sealing bin, so that the soldering is performed under a vacuum ring shape, the air holes in soldering tin in the soldering process are reduced, and the combination degree of components and a PCB is improved.

Description

Vacuum selective wave soldering machine

Technical Field

The utility model relates to the field of welding equipment, in particular to a vacuum selective wave soldering machine.

Background

The wave soldering machine is used for spraying melted soft soldering material (lead-tin alloy) into solder wave crest required by design through an electric pump or an electromagnetic pump, so that a printed board with components is mechanically and electrically connected with a soldering terminal or a pin of the components and a bonding pad of the printed board through the solder wave crest. Traditional wave soldering essentially belongs to dip soldering, and in the actual soldering process, tin liquid is contacted with air due to the existence of external air, so that a certain amount of bubbles exist in the tin liquid when components are soldered, and the bubbles can directly influence the soldering quality. For some precision equipment, such as automobiles, aerospace, etc., very serious consequences can occur if the components are not firmly soldered due to these bubbles during soldering.

For the above problems, the inventors have conceived of a solution. The utility model creates the application under the condition of consulting a large amount of data and cooperating with other research and development personnel in the company, and can effectively solve the problems.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems in the related art to some extent. Therefore, the utility model aims to provide a vacuum selective wave soldering machine.

To achieve the above object, a vacuum selective wave soldering machine according to an embodiment of the present utility model includes:

the machine case is internally provided with a sealing bin;

the vacuum extraction assembly is arranged outside the case and is used for vacuumizing the sealed bin;

the feeding mechanism comprises a first feeding mechanism and a second feeding mechanism, and the first feeding mechanism and the second feeding mechanism are oppositely arranged in the sealing bin in front and back and are used for conveying the PCB;

the welding mechanism comprises a driving seat and a welding piece, wherein the driving seat is arranged in the sealing bin and is connected with the welding piece, and the welding mechanism is used for driving the welding piece to move in the sealing bin; the welding piece is used for welding electronic components on the PCB.

According to the vacuum selective wave soldering machine provided by the utility model, the vacuum pumping assembly is used for vacuumizing the sealing bin, so that the soldering is performed under a vacuum ring shape, the air holes in soldering tin in the soldering process are reduced, and the combination degree of components and a PCB is improved.

In addition, the vacuum selective wave soldering machine according to the above embodiment of the present utility model may further have the following additional technical features:

according to one embodiment of the utility model, the first feeding mechanism and the second feeding mechanism comprise a conveying component and a driving piece;

two bases are arranged in the sealing bin, and the two bases are oppositely arranged left and right;

the two conveying assemblies are oppositely arranged on the two bases front and back;

the driving piece is connected with the two conveying assemblies and is used for driving the two conveying assemblies to convey the PCB.

According to one embodiment of the utility model, the conveying assembly comprises a mounting seat and a plurality of conveying members;

the mounting seat is provided with a plurality of through holes which are uniformly arranged at intervals along the length direction of the mounting seat;

the plurality of conveying pieces are rotatably arranged in the plurality of through holes, wherein the lower ends of the conveying pieces are provided with supporting parts, the upper ends of the conveying pieces are provided with gear parts, and the front side and the rear side of the PCB board are arranged on the supporting parts; the driving piece is meshed with the gear part and used for driving the gear part to rotate so as to drive the PCB to move from left to right through the conveying piece.

According to one embodiment of the utility model, the two bases are provided with linear motors, and the linear motors are connected with the two conveying assemblies and are used for adjusting the distance between the two conveying assemblies.

According to one embodiment of the utility model, the driving seat comprises an X-axis linear module, a Y-axis linear module and a Z-axis linear module;

the X-axis linear module is arranged at the bottom of the sealed bin;

the Y-axis linear module is arranged on the X-axis linear module and can move along the X-axis direction under the drive of the X-axis linear module;

the Z-axis linear module is arranged on the Y-axis linear module and can move along the Y-axis direction under the drive of the Y-axis linear module;

the welding piece is arranged on the Z-axis linear module and can move along the Z-axis direction under the drive of the Z-axis linear module.

According to one embodiment of the utility model, the soldering part is an electromagnetic pump, and a heating part is arranged in the soldering part and is used for heating soldering tin to be in a liquid state, and the soldering part is used for conveying the soldering tin in the liquid state onto the PCB.

According to one embodiment of the utility model, a fixed seat is arranged on the Z-axis linear module, and two fastening pieces are oppositely arranged on the fixed seat;

two bearing seats are oppositely arranged on the welding piece, and the two fastening pieces are detachably fastened on the two bearing seats respectively so as to fix the welding piece on the fixing seat.

According to one embodiment of the utility model, a feeding hole is formed in the left side wall of the sealing bin, a discharging hole is formed in the right side wall of the sealing bin, and automatic bin gates are arranged below the feeding hole and the discharging hole and are used for sealing the feeding hole and the discharging hole.

According to one embodiment of the utility model, the automatic bin gate comprises a bin gate, a guide seat and a driving cylinder;

the guide seats are arranged on two sides of the feeding hole and the discharging hole;

the bin gate is movably connected with the guide seat;

the driving cylinder is connected with the bin gate and is used for driving the bin gate to move up and down so as to open or close the feed inlet and the discharge outlet.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an embodiment of the present utility model;

FIG. 2 is a schematic view of the internal structure of a seal cartridge in an embodiment of the utility model;

FIG. 3 is a schematic view of a feeding mechanism according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of a transfer assembly according to an embodiment of the present utility model;

FIG. 5 is a schematic view of a welding mechanism according to an embodiment of the present utility model;

fig. 6 is a partial enlarged view at a in fig. 5.

Reference numerals:

a housing 10;

a seal bin 11;

a base 111;

a linear motor 1111;

a feed inlet 112;

an automatic bin gate 113;

a vacuum extraction assembly 20;

a feeding mechanism 30;

a first feeding mechanism 31;

a transfer assembly 311;

a mounting base 3111;

a transfer member 3112;

a gear portion 31121;

a support portion 31122;

a second feeding mechanism 32;

a welding mechanism 40;

a drive seat 41;

an X-axis linear module 411;

a Y-axis straight line module 412;

a Z-axis linear module 413;

a holder 4131;

a clasp 41311;

a welding member 42;

a socket 421.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below are exemplary and intended to illustrate the present utility model and should not be construed as limiting the utility model, and all other embodiments, based on the embodiments of the present utility model, which may be obtained by persons of ordinary skill in the art without inventive effort, are within the scope of the present utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The vacuum selective wave soldering machine according to the embodiment of the present utility model includes a chassis 10, a vacuum pumping assembly 20, a feeding mechanism 30 and a soldering mechanism 40.

Different spaces can be arranged in the case 10, a sealing bin 11 is arranged in one space, and the left side wall of the sealing bin 11 can be overlapped with the left side wall of the case 10, so that a PCB (printed Circuit Board) is conveniently placed in the sealing bin 11.

The vacuum extraction assembly 20 is disposed outside the chassis 10, and is used for evacuating the sealed cabin 11. The vacuum extraction assembly 20 comprises a negative pressure piece and a pipe body, wherein the negative pressure piece is arranged in the space at the rear side of the case 10, and the pipe body is communicated with the negative pressure piece and the sealing bin 11, so that air in the sealing bin 11 is extracted under the action of the negative pressure piece.

The feeding mechanism 30 comprises a first feeding mechanism 31 and a second feeding mechanism 32, and the first feeding mechanism 31 and the second feeding mechanism 32 are oppositely arranged in the sealing bin 11 in front-back direction and are used for conveying the PCB.

The welding mechanism comprises a driving seat 41 and a welding piece 42, wherein the driving seat 41 is arranged in the sealing bin 11 and is connected with the welding piece 42, and is used for driving the welding piece 42 to move in the sealing bin 11; the solder member 42 is used for soldering electronic components on a PCB board.

Specifically, when in use, firstly, the PCB board inserted with the electronic components is transferred to the feeding mechanism 30 in the sealed bin 11, the transfer mode can be manual transfer, and also can be transferred through an automatic device, further, the vacuum extraction assembly 20 is started, the vacuum extraction assembly 20 is utilized to vacuumize the sealed bin 11, so that no air exists in the sealed wiping bin, further, the feeding mechanism 30 drives the PCB board to move in the sealed bin 11, finally, the driving seat 41 of the welding mechanism 40 drives the welding piece 42 to move according to a preset movement track, so that the electronic components on the PCB board are welded on the PCB board, and the PCB board is taken out after the welding is completed. In the welding process, the sealed bin 11 is in a vacuum environment, so that air does not exist, and therefore, when the welding assembly points soldering tin onto the PCB, bubbles in the soldering tin are fewer, and correspondingly, the welding effect on the PCB and electronic components is better.

According to the vacuum selective wave soldering machine provided by the utility model, the vacuum pumping assembly 20 is used for vacuumizing the sealing bin 11, so that the soldering is performed under a vacuum ring shape, the air holes in soldering tin in the soldering process are reduced, and the combination degree of components and a PCB is improved.

Advantageously, in one embodiment of the present utility model, the first feeding mechanism 31 and the second feeding mechanism 32 each comprise a conveying assembly 311 and a driving member; two bases 111 are arranged in the sealed bin 11, and the two bases 111 are oppositely arranged left and right; the two conveying assemblies 311 are oppositely arranged on the two bases 111 in front and back;

the driving piece is connected with the two conveying assemblies 311 and is used for driving the two conveying assemblies 311 to convey the PCB.

The two driving parts are used as power mechanisms and are respectively connected with the first feeding mechanism 31 and the second feeding mechanism 32 and used for driving the first feeding mechanism 32 and the second feeding mechanism 32 to move respectively so as to convey the PCB, and then the electronic components at different positions of the PCB are welded.

Preferably, the conveying assembly 311 includes a mounting base 3111 and a plurality of conveying members 3112; the mounting seat 3111 is provided with a plurality of through holes, and the through holes are uniformly arranged at intervals along the length direction of the mounting seat 3111; the plurality of conveying members 3112 are rotatably disposed in the plurality of through holes, wherein a supporting portion 31122 is disposed at a lower end of the conveying members 3112, a gear portion 31121 is disposed at an upper end of the conveying members 3112, and front and rear sides of the PCB board are mounted on the supporting portion 31122; the driving member is engaged with the gear part 31121 for driving the gear part 31121 to rotate, so that the PCB board is driven to move from left to right by the transmission member 3112.

That is, the driving member is a driving chain, when the driving member rotates, the driving member can drive the gear portion 31121 engaged with the driving member to rotate, further, the gear portion 31121 drives the plurality of conveying members 3112 on the mounting base 3111 to rotate synchronously, and the PCB board is mounted on the supporting portion 31122 of the conveying members 3112, so that when the plurality of conveying members 3112 on the two conveying assemblies 311 rotate, the conveying members 3112 drive the supporting members at the bottom of the conveying members to rotate synchronously, and further drive the PCB board to move slowly, thereby completing the PCB board transmission, so as to facilitate welding of electronic components by the welding mechanism 40 in the process of conveying the PCB board.

Advantageously, in another embodiment of the present utility model, a linear motor 1111 is disposed on each of the two bases 111, and the linear motor 1111 is connected to the two conveying assemblies 311 for adjusting the distance between the two conveying assemblies 311.

By arranging the linear motor 1111 to adjust the distance between the two conveying assemblies 311, the conveying mechanism can convey the PCBs with different sizes. For example, when the size of the PCB is large, the distance between the two transfer assemblies 311 may be increased using the linear motor 1111 so as to transfer the size of the PCB, whereas when the size of the PCB is small, the distance between the two transfer assemblies 311 may be decreased using the linear motor 1111 so as to transfer the size of the PCB.

Advantageously, in some embodiments of the present utility model, the driving seat 41 includes an X-axis linear module 411, a Y-axis linear module 412 and a Z-axis linear module 413; the X-axis linear module 411 is disposed at the bottom of the seal bin 11; the Y-axis linear module 412 is disposed on the X-axis linear module 411, and can move along the X-axis direction under the driving of the X-axis linear module 411; the Z-axis linear module 413 is disposed on the Y-axis linear module 412, and is capable of moving along the Y-axis direction under the driving of the Y-axis linear module 412; the welding member 42 is disposed on the Z-axis linear module 413 and is movable along the Z-axis direction under the driving of the Z-axis linear module 413.

Therefore, the X-axis linear module 411, the Y-axis linear module 412 and the Z-axis linear module 413 are used as driving devices, so that the welding piece 42 can be driven to move in a plurality of different directions, and the welding device is beneficial to welding a plurality of electronic components on the PCB. Preferably, the X-axis linear module 411, the Y-axis linear module 412 and the Z-axis linear module 413 can all adopt linear motors 1111, which has good linear effect and is beneficial to use.

Advantageously, in some embodiments of the present utility model, the soldering member 42 is an electromagnetic pump, and a heating member is disposed inside the soldering member, the heating member heats the solder to a liquid state, and the soldering member 42 is used to transfer the solder in the liquid state onto the PCB board.

The heating element inside the electromagnetic pump can heat the metal soldering tin to be in a liquid state with fluidity, so that the liquid soldering tin is conveyed to the PCB board through the electromagnetic pump during welding, after the liquid soldering tin is solidified, components inserted on the PCB board can be welded on the PCB board, and the components are welded in a vacuum environment, therefore, air bubbles in the soldering tin are less, and the welding effect is better.

Advantageously, in other embodiments of the present utility model, a fixing seat 4131 is provided on the Z-axis linear module 413, and two fastening pieces 41311 are provided on the fixing seat 4131 in an opposite manner;

two sockets 421 are oppositely disposed on the welding member 42, and the two fastening members 41311 are detachably fastened to the two sockets 421, respectively, so as to fix the welding member 42 to the fixing base 4131.

In this way, the welding member 42 is mounted on the fixing seat 4131 through the snap connection of the fastening member 41311 and the receiving seat 421, so that the welding member 42 is easy to detach or mount, thereby facilitating the addition of solder to the inside of the welding member 42.

Advantageously, in other embodiments of the present utility model, a feeding port 112 is formed on the left side wall of the sealed cabin 11, a discharging port is formed on the right side wall, and an automatic cabin door 113 is disposed below the feeding port 112 and the discharging port, and the automatic cabin door 113 is used for sealing the feeding port 112 and the discharging port.

Preferably, the automatic bin gate 113 includes a bin gate, a guide seat and a driving cylinder; the guide seats are arranged on two sides of the feeding hole 112 and the discharging hole;

the bin gate is movably connected with the guide seat; the driving cylinder is connected with the bin gate and is used for driving the bin gate to move up and down so as to open or close the feed inlet 112 and the discharge outlet.

Thus, the driving cylinder can be used for controlling the opening or closing of the bins, for example, when feeding is needed, the driving cylinder can be used for driving the bin gate to move downwards along the guide seat so as to open the feed inlet 112, and after feeding is finished, the driving cylinder can be used for driving the bin gate to move upwards along the guide seat so as to close the feed inlet 112. Likewise, the discharge port can be opened or closed according to the method, which is beneficial to use.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (9)

1. A vacuum selective wave soldering machine, comprising:

the machine case is internally provided with a sealing bin;

the vacuum extraction assembly is arranged outside the case and is used for vacuumizing the sealed bin;

the feeding mechanism comprises a first feeding mechanism and a second feeding mechanism, and the first feeding mechanism and the second feeding mechanism are oppositely arranged in the sealing bin in front and back and are used for conveying the PCB;

the welding mechanism comprises a driving seat and a welding piece, wherein the driving seat is arranged in the sealing bin and is connected with the welding piece, and the welding mechanism is used for driving the welding piece to move in the sealing bin; the welding piece is used for welding electronic components on the PCB.

2. The vacuum selective wave soldering machine of claim 1, wherein the first and second feed mechanisms each comprise a transfer assembly and a drive;

two bases are arranged in the sealing bin, and the two bases are oppositely arranged left and right;

the two conveying assemblies are oppositely arranged on the two bases front and back;

the driving piece is connected with the two conveying assemblies and is used for driving the two conveying assemblies to convey the PCB.

3. The vacuum selective wave soldering machine of claim 2, wherein the transfer assembly comprises a mount and a plurality of transfer members;

the mounting seat is provided with a plurality of through holes which are uniformly arranged at intervals along the length direction of the mounting seat;

the plurality of conveying pieces are rotatably arranged in the plurality of through holes, wherein the lower ends of the conveying pieces are provided with supporting parts, the upper ends of the conveying pieces are provided with gear parts, and the front side and the rear side of the PCB board are arranged on the supporting parts; the driving piece is meshed with the gear part and used for driving the gear part to rotate so as to drive the PCB to move from left to right through the conveying piece.

4. A vacuum selective wave soldering machine according to claim 3, wherein the two bases are each provided with a linear motor, and the linear motors are connected to the two conveying assemblies for adjusting the distance between the two conveying assemblies.

5. The vacuum selective wave soldering machine of claim 1, wherein the drive base comprises an X-axis linear module, a Y-axis linear module, and a Z-axis linear module;

the X-axis linear module is arranged at the bottom of the sealed bin;

the Y-axis linear module is arranged on the X-axis linear module and can move along the X-axis direction under the drive of the X-axis linear module;

the Z-axis linear module is arranged on the Y-axis linear module and can move along the Y-axis direction under the drive of the Y-axis linear module;

the welding piece is arranged on the Z-axis linear module and can move along the Z-axis direction under the drive of the Z-axis linear module.

6. The vacuum selective wave soldering machine of claim 5, wherein the soldering member is an electromagnetic pump and is internally provided with a heating member, the heating member heats the soldering tin to a liquid state, and the soldering member is used for conveying the liquid soldering tin onto the PCB board.

7. The vacuum selective wave soldering machine according to claim 6, wherein a fixing seat is arranged on the Z-axis linear module, and two fastening pieces are oppositely arranged on the fixing seat;

two bearing seats are oppositely arranged on the welding piece, and the two fastening pieces are detachably fastened on the two bearing seats respectively so as to fix the welding piece on the fixing seat.

8. The vacuum selective wave soldering machine of claim 1, wherein a feed port is formed in a left side wall of the sealed bin, a discharge port is formed in a right side wall of the sealed bin, and automatic bin gates are arranged below the feed port and the discharge port, and are used for sealing the feed port and the discharge port.

9. The vacuum selective wave soldering machine of claim 8, wherein the automatic bin gate comprises a bin gate, a guide seat and a driving cylinder;

the guide seats are arranged on two sides of the feeding hole and the discharging hole;

the bin gate is movably connected with the guide seat;

the driving cylinder is connected with the bin gate and is used for driving the bin gate to move up and down so as to open or close the feed inlet and the discharge outlet.

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