CN114340207B - Lightweight SMD antenna module - Google Patents
Lightweight SMD antenna module Download PDFInfo
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- CN114340207B CN114340207B CN202111501048.7A CN202111501048A CN114340207B CN 114340207 B CN114340207 B CN 114340207B CN 202111501048 A CN202111501048 A CN 202111501048A CN 114340207 B CN114340207 B CN 114340207B
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 229910052742 iron Inorganic materials 0.000 claims abstract description 10
- 238000007689 inspection Methods 0.000 claims description 34
- 238000003466 welding Methods 0.000 claims description 34
- 238000001125 extrusion Methods 0.000 claims description 24
- 230000000694 effects Effects 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 8
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 7
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- 239000006247 magnetic powder Substances 0.000 claims description 7
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- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 6
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- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims description 4
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- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 40
- 238000000034 method Methods 0.000 abstract description 16
- 239000003990 capacitor Substances 0.000 abstract description 7
- 238000004891 communication Methods 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000000428 dust Substances 0.000 description 18
- 239000000843 powder Substances 0.000 description 12
- 238000009413 insulation Methods 0.000 description 9
- 238000002955 isolation Methods 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 5
- 239000006071 cream Substances 0.000 description 3
- 238000011990 functional testing Methods 0.000 description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 230000006386 memory function Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
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Abstract
The invention discloses a lightweight SMD antenna module, which belongs to the field of communication antennas, wherein an SMD module is manufactured by matching a metal bracket body with an antenna produced by a PCB circuit board and a capacitor element, so that the metal bracket body and the mainboard can enter an SMT (surface mount technology) process together to replace the step of bonding with a manual soldering iron, thereby omitting a manual operation flow, and the production raw material has a shorter production period, facilitating automatic production, greatly saving production cost and production period.
Description
Technical Field
The present invention relates to the field of communication antennas, and more particularly, to a lightweight SMD antenna module.
Background
The antenna has wide application in the technical field of wireless communication, especially in the fields of mobile communication, vehicle-mounted communication, satellite communication and the like, most GNSS antennas on the market at present mainly adopt sheet ceramics, the most commonly used GNSS antennas are ceramic antennas with two specifications of 25 x 4 and 25 x 6mm, the ceramic antennas are generally installed by sticking double faced adhesive tape on the bottom and are adhered to a main board, and the main board is inserted and welded through a metal feed pin.
The ceramic antenna has relatively high cost, large heat absorption, slow temperature rise, relatively complex installation process, relatively long production period, inconvenient automatic production, easy transmission and deformation in the production process, influence on the connection between the ceramic antenna and a main board and greatly improve the production cost.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems existing in the prior art, the invention aims to provide a light SMD antenna module, the metal bracket body is matched with an antenna produced by a PCB circuit board and a capacitor element to form the SMD module, and then the SMD module and the main board can enter an SMT (surface mount technology) process together to replace the steps of pasting double faced adhesive tape and welding by a manual soldering iron, so that the manual operation flow is omitted, the production raw materials are short, the automatic production is convenient, the production cost and the production period are greatly saved, meanwhile, when the PCB circuit board is pasted with various elements, the flexible belt is pushed to move by extending through the deformation memory telescopic rod, the guide fan is driven to rotate through the rack and the gear, the blown hot air is led and dispersed everywhere, the PCB circuit board is uniformly heated, the adhesive layer keeps good viscosity at high temperature, the PCB circuit board is adsorbed, the PCB circuit board is not easy to deform, the connection with the elements is prevented from being not embedded due to deformation in the paster process, the processing effect is enhanced, the reject ratio is reduced, the product quality is effectively improved, and the production cost is reduced.
2. Technical proposal
In order to solve the problems, the invention adopts the following technical scheme.
The utility model provides a lightweight SMD antenna module, includes PCB incoming material inspection module, PCB incoming material inspection module outer end is equipped with the screen printing tin cream module, the outer end of screen printing tin cream module is equipped with the tin printing effect inspection module, the outer end of tin printing effect inspection module is equipped with the paster module, the outer end of paster module is equipped with the pre-furnace QC inspection module, the outer end of pre-furnace QC inspection module is equipped with reflow oven welding module, the outer end of reflow oven welding module is equipped with the welding effect inspection module, the outer end of welding effect inspection module is equipped with the back welding module, the outer end of back welding module is equipped with back welding effect inspection module, the outer end of back welding effect inspection module is equipped with the function test module, after the function test module is equipped with finished PCBA and packs and send the inspection module, can realize at first after PCB circuit board through the PCB inspection module detects, the printing of screen printing tin cream module, the various parts are pasted on it, then wait to carry out the comprehensive processing to it through reflow oven welding module and back welding module, the complete processing is carried out to its complete processing to the back welding module, and finally the full-automatic manufacturing cost is gone into with the master board through the full-automatic manufacturing process after the SMT test module, thereby can realize the production and full-automatic manufacturing cost is saved.
Further, a PCB circuit board is arranged in the patch module, a metal bracket body is arranged at the upper end of the PCB circuit board, a plurality of capacitance elements are arranged at the upper end of the PCB circuit board and are positioned at the outer side of the metal bracket body, a fixed frame is arranged at the lower end of the PCB circuit board, an adhesive layer is arranged between the fixed frame and the PCB circuit board, an annular block is fixedly connected with the inner wall of the fixed frame, a laterally symmetrical extrusion cylinder is fixedly connected with the outer end of the annular block, a push plate is slidably connected with the inner wall of the extrusion cylinder, a deformation memory telescopic rod is fixedly connected between the push plate and the inner wall of the extrusion cylinder, a gear is rotationally connected with the inner wall of the extrusion cylinder, a flexible belt is fixedly connected with the outer end of the push plate, a rack is in meshed connection with the gear, a first umbrella-shaped gear is fixedly connected with the outer end of the gear, the inner wall of the extrusion cylinder is rotationally connected with a second bevel gear, the first bevel gear is meshed with the second bevel gear, the outer end of the extrusion cylinder is rotationally connected with a guide fan, the guide fan is fixedly connected with the second bevel gear, ventilation openings are formed in the inner walls of the left end and the right end of the fixed frame, the ventilation openings correspond to the guide fan, the antenna produced by matching the metal support body with the PCB circuit board and the capacitor element is made into an SMD module, and then the SMD module and the main board can be together processed into an SMT process to replace the step of bonding double faced adhesive tape and welding a manual soldering iron, so that the manual operation flow is omitted, the production raw materials are short, the production period is convenient for automatic production, the production cost and the production period are greatly saved, and when the PCB circuit board is attached with various elements, the flexible belt is pushed to move through the extension of the deformation memory telescopic rod, the guide fan is driven to rotate through the rack and the gear, so that the guide fan can dredge and disperse blown hot air around, the PCB circuit board is uniformly heated, the adhesive layer keeps good viscosity at high temperature, the PCB circuit board is adsorbed, deformation is not easy to occur, the phenomenon that the PCB circuit board is not embedded with a component due to the deformation in the process of pasting is avoided, the processing effect is enhanced, the reject ratio is reduced, the product quality is effectively improved, and the production cost is reduced.
Further, the elastic magnetic isolation bag body is fixedly connected between the inner walls of the annular blocks, the magnetic iron sheets are arranged in the elastic magnetic isolation bag body, the magnetic isolation powder is filled in the elastic magnetic isolation bag body, two pull rods which are vertically symmetrical are fixedly connected to one end of the push plate, which is close to the annular blocks, two through holes which are vertically symmetrical are cut between the fixed frame and the annular blocks, one end of the pull rod, which is close to the annular blocks, passes through the through holes and is fixedly connected with the outer ends of the elastic magnetic isolation bag body, a plurality of evenly distributed heat dissipation holes are cut at the lower end of the fixed frame, the pull rods are pulled to move along with the push plate in the moving process of the push plate, the elastic magnetic isolation bag body is pulled to deform and extend to two sides, so that the magnetic isolation powder is diffused, magnetic shielding of the magnetic isolation iron sheets is obtained, and deformation is not easy to occur under high temperature through the adsorption of the magnetic iron sheets to the metal support body.
Furthermore, the adhesive layer is made of super-arranged carbon nano tube film materials, the length and width of the adhesive layer are matched with those of the PCB, and the adhesive layer made of the super-arranged carbon nano tube film materials still keeps good adhesiveness at low temperature or high temperature and is not easily affected by environment.
Furthermore, the deformation memory telescopic rod is made of a shape memory alloy material, the initial state of the deformation memory telescopic rod is a contracted state, the deformation memory telescopic rod made of the shape memory alloy material has a memory function, after the temperature rises, the deformation memory telescopic rod deforms to extend, and after the temperature drops, the deformation memory telescopic rod is restored to the initial contracted state.
Further, the upper and lower both ends of push pedal all open and have spherical groove, spherical inslot rotates and is connected with the ball, the outer end of ball and the inner wall sliding connection of recipient, the outer end of push pedal is the T shape setting, through the setting of ball, makes the push pedal more smooth and easy convenient in the recipient internal sliding, reduces the friction, and establishes the outer end of push pedal to the T shape, makes its lower extreme be difficult for causing the interference to the motion of flexible band.
Further, the U-shaped chute is cut into the inner wall of the rear end of the extrusion barrel, the flexible belt is in sliding connection with the U-shaped chute, and the flexible belt and the racks are smoothly and conveniently meshed with the gears through the arrangement of the U-shaped chute.
Further, the inner wall fixedly connected with dust screen of vent, the surface of dust screen is painted and is had high temperature resistant coating, through the setting of dust screen, makes the dust be difficult for entering into the extrusion section of thick bamboo through the vent in, and high temperature resistant coating's setting, makes the dust screen be difficult for taking place to damage under high temperature environment, prolongs its life.
Furthermore, the magnetic insulation powder is made of Fe-Ni alloy material, the Ni content in the magnetic insulation powder is 80%, and the magnetic influence of the magnet sheet can be effectively shielded in a dense state by using the magnetic insulation powder made of the Fe-Ni alloy material.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) According to the scheme, the metal bracket body is matched with the PCB and the antenna produced by the capacitor element to form the SMD module, the SMD module and the main board can enter the SMT process together to replace the step of pasting double faced adhesive tape and welding by a manual soldering iron, so that the manual operation flow is omitted, the production raw material is short in production period, automatic production is convenient, production cost and production period are greatly saved, meanwhile, when the PCB is pasted with various elements, the flexible tape is pushed to move through the extension of the deformation memory telescopic rod, the flexible tape is enabled to drive the diversion fan to rotate through the rack and the gear, the blown hot air is led and dispersed everywhere, the PCB is enabled to be heated uniformly, the adhesive layer keeps good viscosity at a high temperature, the PCB is adsorbed, deformation is not easy to occur, the connection non-jogging between the adhesive layer and the elements due to deformation in the pasting process is avoided, the processing effect is enhanced, the reject ratio is reduced, the product quality is effectively improved, and the production cost is reduced.
(2) The inner wall fixedly connected with elasticity of annular piece is isolated magnetic bag body, be equipped with the magnet piece in the elasticity is isolated magnetic bag body, the intussuseption of elasticity is isolated magnetic bag body is filled with the absolute magnetic powder, the push pedal is close to two upper and lower symmetrical pull rods of one end fixedly connected with of annular piece, open between fixed frame and the annular piece has two upper and lower symmetrical through-holes, the one end that the pull rod is close to the annular piece passes through-hole and the outer end fixed connection of elasticity is isolated magnetic bag body, the lower extreme of fixed frame is open and is had a plurality of evenly distributed's louvres, in the push pedal removal process, the pull rod is pulled along with its motion together, the extension of pulling elasticity is isolated magnetic bag body to both sides deformation, make the absolute magnetic powder diffuse, get the magnetism shielding of demagnetizing iron sheet, make it be difficult for taking place deformation under the high temperature through the absorption of magnet piece to the metal support body.
(3) The adhesive layer is made of super-arranged carbon nanotube film material, the length and width of the adhesive layer are matched with the length and width of the PCB, and the adhesive layer made of the super-arranged carbon nanotube film material still keeps good adhesiveness at low temperature or high temperature and is not easily affected by environment.
(4) The deformation memory telescopic rod is made of a shape memory alloy material, the initial state of the deformation memory telescopic rod is a contracted state, the deformation memory telescopic rod made of the shape memory alloy material has a memory function, after the temperature rises, the deformation memory telescopic rod can deform and extend, and after the temperature drops, the deformation memory telescopic rod is restored to the initial contracted state.
(5) The upper and lower both ends of push pedal all open and have spherical groove, and spherical inslot rotates and is connected with the ball, and the outer end of ball and the inner wall sliding connection of recipient, the outer end of push pedal are T shape setting, through the setting of ball, make the push pedal more smooth and easy convenient of sliding in the recipient, reduce the friction, and establish the outer end of push pedal into T shape, make its lower extreme be difficult for causing the interference to the motion of flexible band.
(6) The inner wall of the rear end of the extrusion barrel is provided with a U-shaped chute, the flexible belt is in sliding connection with the U-shaped chute, and the flexible belt and the racks are smoothly and conveniently meshed with the gears through the arrangement of the U-shaped chute.
(7) The inner wall fixedly connected with dust screen of vent, the surface of dust screen scribbles high temperature resistant coating, through the setting of dust screen, makes the dust be difficult for entering into the extrusion section of thick bamboo through the vent in, and high temperature resistant coating's setting makes the dust screen be difficult for taking place to damage under high temperature environment, prolongs its life.
(8) The magnetic insulation powder is made of Fe-Ni alloy material, the Ni content in the magnetic insulation powder is 80%, and the magnetic influence of the magnet sheet can be effectively shielded in a dense state by using the magnetic insulation powder made of the Fe-Ni alloy material.
Drawings
Fig. 1 is a flow chart of the SMD antenna module manufacturing process according to the present invention;
fig. 2 is a schematic perspective view of a PCB circuit board according to the present invention;
fig. 3 is a schematic top view of a PCB according to the present invention;
FIG. 4 is a schematic cross-sectional view of a fixing frame according to the present invention;
FIG. 5 is a schematic perspective view of a push plate according to the present invention;
FIG. 6 is a schematic cross-sectional elevation view of a gear according to the present invention;
fig. 7 is a schematic cross-sectional view of a ball according to the present invention.
The reference numerals in the figures illustrate:
12. a PCB circuit board; 13. a metal bracket body; 14. a capacitive element; 15. a fixed frame; 16. an adhesive layer; 17. an annular block; 18. an extrusion cylinder; 1801. a U-shaped chute; 19. a deformation memory telescopic rod; 20. a push plate; 2001. a ball; 21. a flexible belt; 22. a rack; 23. a gear; 24. a first bevel gear; 25. a second bevel gear; 26. a diversion fan; 27. a dust screen; 28. a pull rod; 29. an elastic magnetically isolated capsule; 30. a magnet sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present invention are within the protection scope of the present invention.
In the description of the present invention, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Examples:
referring to fig. 1, a lightweight SMD antenna module includes a PCB incoming material inspection module, a screen printing tin paste module is disposed at an outer end of the PCB incoming material inspection module, a tin printing effect inspection module is disposed at an outer end of the screen printing tin paste module, a patch module is disposed at an outer end of the patch module, a pre-furnace QC inspection module is disposed at an outer end of the pre-furnace QC inspection module, a reflow oven welding module is disposed at an outer end of the reflow oven welding module, a post-welding module is disposed at an outer end of the solder effect inspection module, a post-welding effect inspection module is disposed at an outer end of the post-welding module, a functional test module is disposed at an outer end of the post-welding effect inspection module, and a finished PCBA packaging and inspection module is disposed at an outer end of the functional test module.
Referring to fig. 2-7, a PCB circuit board 12 is disposed in the patch module, a metal bracket body 13 is mounted at an upper end of the PCB circuit board 12, a plurality of capacitor elements 14 are mounted at an upper end of the PCB circuit board 12, the capacitor elements 14 are located at an outer side of the metal bracket body 13, a fixing frame 15 is disposed at a lower end of the PCB circuit board 12, an adhesive layer 16 is disposed between the fixing frame 15 and the PCB circuit board 12, an annular block 17 is fixedly connected to an inner wall of the fixing frame 15, a laterally symmetrical extrusion barrel 18 is fixedly connected to an outer end of the annular block 17, a push plate 20 is slidingly connected to an inner wall of the extrusion barrel 18, a deformation memory telescopic rod 19 is fixedly connected between the push plate 20 and an inner wall of the extrusion barrel 18, a gear 23 is rotatably connected to an inner wall of the extrusion barrel 18, a flexible belt 21 is fixedly connected to an outer end of the push plate 20, a rack 22 is fixedly connected to an outer end of the flexible belt 21, the rack 22 is meshed with the gear 23, the outer end of the gear 23 is fixedly connected with a first bevel gear 24, the inner wall of the extrusion barrel 18 is rotationally connected with a second bevel gear 25, the first bevel gear 24 is in meshed connection with the second bevel gear 25, the outer end of the extrusion barrel 18 is rotationally connected with a guide fan 26, the guide fan 26 is fixedly connected with the second bevel gear 25, ventilation openings are cut on the inner walls of the left end and the right end of the fixed frame 15, and correspond to the guide fan 26, the metal bracket body 13 is matched with the antenna produced by the PCB circuit board 12 and the capacitor element 14 to form an SMD module, and then the SMD module and the main board can enter an SMT process together to replace the steps of double faced adhesive tape pasting and manual soldering iron welding, so that the manual operation flow is omitted, the production raw materials are shortened, the production period is convenient for automatic production, the production cost and the production period are greatly saved, and when the PCB circuit board 12 is pasted with various elements, the flexible belt 21 is pushed to move through the extension of the deformation memory telescopic rod 19, the flexible belt 21 is driven to rotate through the rack 22 and the gear 23, the blown hot air is led and dispersed everywhere, the PCB circuit board 12 is uniformly heated, the adhesive layer 16 keeps good viscosity at high temperature, the PCB circuit board 12 is adsorbed, deformation is not easy to occur, the phenomenon that the flexible belt is not embedded with the connection of elements due to deformation in the process of pasting is avoided, the processing effect is enhanced, the reject ratio is reduced, the product quality is effectively improved, and the production cost is reduced.
Referring to fig. 4, an elastic insulating magnetic bag 29 is fixedly connected between inner walls of the annular blocks 17, a magnet sheet 30 is arranged in the elastic insulating magnetic bag 29, insulating magnetic powder is filled in the elastic insulating magnetic bag 29, two pull rods 28 which are vertically symmetrical are fixedly connected to one end of the push plate 20, which is close to the annular blocks 17, two vertically symmetrical through holes are cut between the fixed frame 15 and the annular blocks 17, one end of the pull rods 28, which is close to the annular blocks 17, passes through the through holes and is fixedly connected with the outer ends of the elastic insulating magnetic bag 29, a plurality of uniformly distributed heat dissipation holes are cut at the lower end of the fixed frame 15, and the pull rods 28 are pulled to move along with the elastic insulating magnetic bag 29 to deform and extend to two sides in the moving process of the push plate 20, so that the insulating magnetic powder is diffused, the magnetic shielding of the magnet sheet 30 is cancelled, and the metal bracket body 13 is not easy to deform under high temperature through the adsorption of the magnet sheet 30.
Referring to fig. 4-7, the adhesive layer 16 is made of super-aligned carbon nanotube film material, the length and width of the adhesive layer 16 are matched with the length and width of the PCB circuit board 12, the adhesive layer 16 made of super-aligned carbon nanotube film material still keeps good adhesion at low temperature or high temperature, is not easily affected by environment, the deformation memory telescopic rod 19 is made of shape memory alloy material, the initial state of the deformation memory telescopic rod 19 is in a contracted state, after the temperature is raised, the deformation memory telescopic rod 19 is deformed and extended, after the temperature is lowered, the deformation memory telescopic rod 19 is restored to the initial contracted state, spherical grooves are formed at the upper end and the lower end of the push plate 20, balls 2001 are rotationally connected in the spherical grooves, the outer ends of the balls 2001 are slidably connected with the inner wall of the extrusion cylinder 18, the outer ends of the push plate 20 are in a T-shaped arrangement, the push plate 20 slides in the extrusion cylinder 18 more smoothly through the arrangement of the balls 2001, friction is reduced, the outer ends of the push plate 20 are set to be in a T-shaped, and the movement of the lower end 21 of the push plate 20 is not easily disturbed by the flexible belt.
Referring to fig. 4, a U-shaped chute 1801 is cut into the inner wall of the rear end of the extrusion barrel 18, the flexible belt 21 is slidably connected with the U-shaped chute 1801, through the arrangement of the U-shaped chute 1801, the meshing movement of the flexible belt 21, the rack 22 and the gear 23 is smoother and more convenient, the inner wall of the vent is fixedly connected with a dust screen 27, the surface of the dust screen 27 is coated with a high temperature resistant coating, dust is not easy to enter the extrusion barrel 18 through the vent through the arrangement of the dust screen 27, and the dust screen 27 is not easy to damage in a high temperature environment through the arrangement of the dust screen 27, so that the service life of the dust screen is prolonged, the magnetic insulation powder is made of Fe-Ni alloy materials, the content of Ni in the magnetic insulation powder is 80%, and the magnetic influence of the magnet sheet 30 can be effectively shielded in a dense state through the use of the magnetic insulation powder made of the Fe-Ni alloy materials.
In the invention, when the related technicians use, firstly, after the PCB incoming material inspection module detects the PCB circuit board 12, the PCB circuit board is printed by the screen printing solder paste module, then various parts are attached to the PCB circuit board by the paste module, and then the PCB circuit board 12 is subjected to comprehensive welding treatment by the reflow oven welding module and the rear welding module, and when the PCB circuit board 12 is attached with various elements and is subjected to welding treatment in the reflow oven welding module, after the PCB circuit board 12 is blown by heated air, the deformation memory telescopic rod 19 in the fixed frame 15 is heated and extended, the push plate 20 is pushed to move away from the annular block 17, so that the push plate 20 drives the flexible belt 21 and the rack 22 to move, the gear 23 is driven to rotate, the gear 23 drives the first umbrella-shaped gear 24 to rotate, the second umbrella-shaped gear 25 drives the guide fan 26 to rotate, so that the blown hot air is dispersed around, the PCB circuit board 12 is uniformly heated, the adhesive layer 16 keeps good adhesion at high temperature, the PCB circuit board 12 is adsorbed, and in the moving process of the push plate 20, the pull rod 28 is pulled to move along with the pull rod, the elastic magnetic insulating bag 29 is pulled to deform and extend to two sides, so that the magnetic insulating powder is diffused, the magnetic shielding of the magnet sheet 30 is cancelled, the magnetic shielding of the magnet sheet 30 is not easy to deform, the metal bracket body 13 is prevented from being connected with a component due to deformation in the attaching process, the processing effect is enhanced, after the finished product after being tested by the functional test module, the finished product is packaged by the finished product PCBA packaging and inspection module and put in storage, the finished product can enter an SMT (surface mounted technology) process together with the main board through the SMD module, all materials of the main board can be finished at one time in the SMT process, thereby saving manual operation flow and facilitating the full-automatic production of the product, greatly saves the production cost and the production period.
The above description is only of the preferred embodiments of the present invention; the scope of the invention is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present invention, and the technical solution and the improvement thereof are all covered by the protection scope of the present invention.
Claims (7)
1. The utility model provides a lightweight SMD antenna module, includes PCB supplied materials inspection module, its characterized in that: the PCB incoming material inspection module is provided with a screen printing tin paste module at the outer end, the outer end of the screen printing tin paste module is provided with a tin printing effect inspection module, the outer end of the tin printing effect inspection module is provided with a patch module, the outer end of the patch module is provided with a stokehold QC inspection module, the outer end of the stokehold QC inspection module is provided with a reflow oven welding module, the outer end of the reflow oven welding module is provided with a welding effect inspection module, the outer end of the welding effect inspection module is provided with a rear welding module, the outer end of the rear welding module is provided with a rear welding effect inspection module, the outer end of the rear welding effect inspection module is provided with a function test module, and the outer end of the function test module is provided with a finished PCBA packaging and sending inspection module;
the patch module is internally provided with a PCB circuit board (12), a metal bracket body (13) is arranged at the upper end of the PCB circuit board (12), a plurality of capacitance elements (14) are arranged at the upper end of the PCB circuit board (12), the capacitance elements (14) are positioned at the outer side of the metal bracket body (13), a fixed frame (15) is arranged at the lower end of the PCB circuit board (12), an adhesive layer (16) is arranged between the fixed frame (15) and the PCB circuit board (12), an annular block (17) is fixedly connected with the inner wall of the fixed frame (15), a push plate (20) is connected with the outer end of the annular block (17) in a sliding manner, a deformation memory telescopic rod (19) is fixedly connected between the push plate (20) and the inner wall of the push plate (18), a gear (23) is rotatably connected with the inner wall of the push plate (20), a flexible belt (21) is fixedly connected with the outer end of the flexible belt (15), a gear rack (22) is fixedly connected with the outer end of the flexible belt (21), a gear (22) is fixedly connected with a second gear (24) and is rotatably connected with the inner wall (23), the first umbrella-shaped gear (24) is meshed with the second umbrella-shaped gear (25), the outer end of the extrusion cylinder (18) is rotationally connected with a guide fan (26), the guide fan (26) is fixedly connected with the second umbrella-shaped gear (25), ventilation openings are formed in the inner walls of the left end and the right end of the fixed frame (15), and the ventilation openings correspond to the guide fan (26).
2. The lightweight SMD antenna module of claim 1, wherein: elastic insulating magnetic bag bodies (29) are fixedly connected between the inner walls of the annular blocks (17), magnetic iron sheets (30) are arranged in the elastic insulating magnetic bag bodies (29), insulating magnetic powder is filled in the elastic insulating magnetic bag bodies (29), the insulating magnetic powder is made of Fe-Ni alloy materials, the Ni content in the insulating magnetic powder is 80%, two pull rods (28) which are vertically symmetrical are fixedly connected with one end of each push plate (20) close to the annular block (17), two vertically symmetrical through holes are formed between each fixing frame (15) and the annular block (17), one end of each pull rod (28) close to the annular block (17) penetrates through the through holes and is fixedly connected with the outer ends of the elastic insulating magnetic bag bodies (29), and a plurality of evenly distributed heat dissipation holes are formed in the lower ends of the fixing frames (15).
3. The lightweight SMD antenna module of claim 1, wherein: the adhesive layer (16) is made of super-arranged carbon nano tube film materials, and the length and width of the adhesive layer (16) are matched with those of the PCB (12).
4. The lightweight SMD antenna module of claim 1, wherein: the deformation memory telescopic rod (19) is made of a shape memory alloy material, and the initial state of the deformation memory telescopic rod (19) is a contracted state.
5. The lightweight SMD antenna module of claim 1, wherein: the upper end and the lower end of the push plate (20) are respectively provided with a spherical groove, a ball (2001) is rotationally connected in the spherical grooves, the outer end of the ball (2001) is in sliding connection with the inner wall of the extrusion barrel (18), and the outer end of the push plate (20) is in a T-shaped arrangement.
6. The lightweight SMD antenna module of claim 1, wherein: the inner wall of the rear end of the extrusion barrel (18) is provided with a U-shaped chute (1801), and the flexible belt (21) is in sliding connection with the U-shaped chute (1801).
7. The lightweight SMD antenna module of claim 1, wherein: the inner wall of the vent is fixedly connected with a dustproof net (27), and the surface of the dustproof net (27) is coated with a high-temperature-resistant coating.
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| CN202111501048.7A CN114340207B (en) | 2021-12-09 | 2021-12-09 | Lightweight SMD antenna module |
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| CN202111501048.7A CN114340207B (en) | 2021-12-09 | 2021-12-09 | Lightweight SMD antenna module |
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| CN114340207A (en) | 2022-04-12 |
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