CN114340150A

CN114340150A - Pin structure, mold for manufacturing pin structure and circuit board

Info

Publication number: CN114340150A
Application number: CN202111623417.XA
Authority: CN
Inventors: 方珂; 管礼志; 李世军; 刘成涛; 何松; 刘海英
Original assignee: BOE Technology Group Co Ltd; Mianyang BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Mianyang BOE Optoelectronics Technology Co Ltd
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2022-04-12

Abstract

The utility model relates to the technical field of circuit board manufacturing, and provides a pin structure, a die for manufacturing the pin structure and a circuit board, wherein the pin structure comprises a supporting layer; a conductive layer disposed on one side of the support layer; the contact layer is provided with a plurality of contact blocks, the contact blocks are positioned on the surface, away from the supporting layer, of the conducting layer, and a space is reserved between any two adjacent contact blocks. Through this pin structure, can be with the oxide layer of being located on the contact piece get rid of through exerting less effort to can improve the stability and the life that the pin is connected.

Description

Pin structure, mold for manufacturing pin structure and circuit board

Technical Field

The disclosure relates to the technical field of circuit board manufacturing, in particular to a pin structure, a die for manufacturing the pin structure and a circuit board.

Background

In the field, a circuit board is generally used for detecting the OLED touch screen, and pins of the circuit board are in contact connection with pins of the OLED touch screen, so that the OLED touch screen obtains a test signal.

The pin structure of the current circuit board repeatedly contacts the pins of the OLED touch screen and transmits current signals in the use process, so that the surface of the pin structure of the circuit board is subjected to oxidation reaction, an oxidation film appears, and the oxidation film is difficult to remove, so that the connection stability of the pin structure and the transmission accuracy of test signals are influenced, and the service life of the pin structure is also influenced.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

The present disclosure is directed to overcoming the above-mentioned deficiencies in the prior art, and providing a pin structure, a mold for manufacturing the pin structure, and a circuit board, wherein the pin structure can remove an oxide layer on a contact block by applying a small force.

According to a first aspect of the present disclosure, there is provided a pin structure including:

a support layer;

a conductive layer disposed on one side of the support layer;

the contact layer is provided with a plurality of contact blocks, the contact blocks are positioned on the surface, away from the supporting layer, of the conducting layer, and a space is reserved between any two adjacent contact blocks.

In an exemplary embodiment of the present disclosure, the conductive layer has a first edge and a second edge disposed opposite to each other, and a third edge and a fourth edge disposed opposite to each other, both ends of the first edge are connected to one end of the third edge and one end of the fourth edge, respectively, and the second edge is connected to the other end of the third edge and the other end of the fourth edge, respectively;

one end of the contact block is positioned at the first edge, the other end of the contact block is positioned at the second edge, and the contact blocks are arranged at intervals along the first direction;

or one end of the contact block is positioned at the third edge, the other end of the contact block is positioned at the fourth edge, and the contact blocks are arranged at intervals along the second direction;

wherein the first direction is a direction in which the third edge points to the fourth edge, and the second direction is a direction in which the first edge points to the second edge.

In an exemplary embodiment of the present disclosure, one end of the contact block is located at the first edge, and the other end of the contact block is located at the second edge, the contact block including:

a plurality of contact portions arranged at intervals in the second direction, and of the plurality of contact portions, a first one of the contact portions is located at the first edge, and a last one of the contact portions is located at the second edge.

In an exemplary embodiment of the present disclosure, a cross-sectional area of each of the contact blocks is gradually decreased along a third direction, wherein the third direction is a direction in which the support layer points to the contact layer.

In an exemplary embodiment of the present disclosure, a cross-sectional area of each of the contact portions is gradually reduced along the third direction, and the cross-sectional areas of a plurality of the contact portions are the same.

In a second aspect of the present disclosure, there is provided a mold for manufacturing a lead structure, the mold for manufacturing a lead structure being used for manufacturing any one of the lead structures described above, the mold for manufacturing a lead structure including:

a first forming groove which comprises a first side wall, a bottom wall and a second side wall, wherein one end of the bottom wall is connected with the first side wall, the other end of the bottom wall is connected with the second side wall, a first accommodating cavity is enclosed by the first side wall, the bottom wall and the second side wall, and the bottom wall is provided with a plurality of through holes;

a plurality of second forming grooves connected to an inner wall of the through hole and extending in a direction away from the side wall, the second forming grooves having a second receiving chamber, and the second receiving chamber and the first receiving chamber being communicated through the through hole.

In an exemplary embodiment of the present disclosure, the bottom plate has a fifth edge and a sixth edge that are oppositely disposed, and a seventh edge and an eighth edge that are oppositely disposed, two ends of the fifth edge are respectively connected with one end of the seventh edge and one end of the eighth edge, and two ends of the sixth edge are respectively connected with the other end of the seventh edge and the other end of the eighth edge;

the through holes are arranged at intervals along a fourth direction, one end of the second forming groove is positioned at the fifth edge, the other end of the second forming groove is positioned at the sixth edge, and the second forming grooves are arranged at intervals along the fourth direction;

or, the through holes are arranged at intervals along a fifth direction, one end of the second forming groove is positioned at the seventh edge, the other end of the second forming groove is positioned at the eighth edge, and the second forming grooves are arranged at intervals along the fifth direction;

wherein the fourth direction is a direction in which the seventh edge points to the eighth edge, and the fifth direction is a direction in which the fifth edge points to the sixth edge.

In an exemplary embodiment of the present disclosure, the through holes are arranged at intervals along the fourth direction, and each of the through holes includes: a plurality of holes arranged at intervals in the fifth direction;

the second forming tank includes: a plurality of second forming portions arranged at intervals in the fifth direction; a plurality of said second formations, a first of said second formations being located at said fifth edge and a last of said second formations being located at said sixth edge; and each second forming portion is connected with the inner wall of one hole portion, extends towards the direction of keeping away from the side wall, and each second forming portion has a second accommodation cavity.

In an exemplary embodiment of the present disclosure, the cross-sectional area of the second receiving chamber is gradually decreased in a sixth direction, wherein the sixth direction is a direction in which the first forming groove is directed to the second forming groove.

A third aspect of the present disclosure provides a circuit board comprising a pin connection region, the pin connection region comprising:

a plurality of pin structures arranged at intervals, wherein the pin structure is any one of the pin structures.

The technical scheme provided by the disclosure can achieve the following beneficial effects:

the present disclosure provides a pin structure including a support layer, a conductive layer, and a contact layer. The contact layer is provided with a plurality of contact blocks, and a gap is arranged between any two adjacent contact blocks. Therefore, the pin structure provided by the present disclosure is in contact connection with other pin structures through a plurality of contact blocks.

Because the cross-sectional area of each contact block is small relative to the cross-sectional area of the entire layer of contact structures, the contact blocks provided by the present disclosure can be pressed more against other pin structures when the pin structures provided by the present disclosure are connected with other pin structures with the same contact force. Thus, the present disclosure can generate a greater pressure with a smaller contact force to remove the oxide film on the surface of the contact block when the contact block is in contact connection with other pin structures, and the oxide particles removed can fall into the space between two adjacent contact blocks. Therefore, the pin structure provided by the disclosure can have high stability, does not influence signal transmission, and can have long service life.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

FIG. 1 is a schematic diagram illustrating a prior art circuit board connected to an OLED touch screen;

FIG. 2 is an enlarged schematic view of A of FIG. 1;

FIG. 3 shows a schematic structural view of section B-B of FIG. 2;

FIG. 4 shows an enlarged schematic view of A of FIG. 1 according to an embodiment of the present disclosure;

FIG. 5 illustrates a schematic structural view of section C-C of FIG. 4 according to an embodiment of the present disclosure;

FIG. 6 shows an enlarged schematic view of A of FIG. 1 according to another embodiment of the present disclosure;

FIG. 7 illustrates a schematic structural view of section D-D of FIG. 6 according to an embodiment of the present disclosure;

FIG. 8 shows an enlarged schematic view of A of FIG. 1 according to yet another embodiment of the present disclosure;

FIG. 9 illustrates a schematic structural view of section E-E of FIG. 8 according to an embodiment of the present disclosure;

fig. 10 shows a schematic structural diagram of a mold for fabricating a pin structure according to an embodiment of the present disclosure.

Description of reference numerals:

1. a circuit board; 2. an OLED touch screen; 3. a pin structure; 4. a first forming groove; 5. a second forming groove; 11. a pin connection area; 31. a support layer; 32. a conductive layer; 33. a contact layer; 41. a first side wall; 42. a bottom wall; 43. a second side wall; 44. a first accommodating chamber; 51. a second accommodating chamber; 321. a first edge; 322. a second edge; 323. a third edge; 324. a fourth edge; 331. a contact block; 3311. a contact portion; x, a first direction; y, a second direction; z, a third direction; l, a fourth direction; m, sixth direction.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," "said," and "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.

At present, the circuit board 1 with the pin structure 3 is generally used for providing signals. As shown in fig. 1, a circuit board 1 for testing an OLED touch screen 2 includes, for example: the circuit board 1 with the pin structures 3 is mostly used for detecting the OLED touch screen 2 in the market, and particularly when the touch function of the touch screen is tested, the circuit board 1 is generally required to be connected with a detection jig, the pin structures 3 of the circuit board 1 are in contact connection with the pin structures 3 of the OLED touch screen 2, and the circuit board 1 is used for signal transmission, so that the OLED touch screen 2 obtains test signals, and the test of the OLED touch screen 2 is realized.

In the process of testing the OLED touch screen 2, the OLED touch screen 2 is continuously passed, and the detection jig and the circuit board 1 are always fixedly connected. Therefore, the states of the detection jig and the circuit board 1 determine the accuracy and stability of detection on the OLED touch screen 2, and the pin structure 3 of the circuit board 1 is used as a part which is continuously and repeatedly contacted with the OLED touch screen 2, and the state of the pin structure 3 of the circuit board 1 has a great influence on the whole test, so that the pin structure 3 of the circuit board 1 needs to be constantly ensured to have a better state in the test process.

In the prior art, as shown in fig. 2 and 3, the pin structure 3 on the circuit board 1 uses a fully covered metal contact layer 33, and the pin structure 3 only includes a support layer 31 and the metal contact layer 33 on the support layer 31. However, the inventor of the present disclosure has long studied and found that: in the prior art, the pin structure 3 on the circuit board 1 repeatedly contacts the pin structure 3 of the OLED touch screen 2 and transmits a current signal in the test process, so that the pin structure 3 on the circuit board 1 is easily oxidized to form an oxide film on the pin structure 3, thereby affecting the transmission of test signals and further affecting the accuracy and stability of the test. Meanwhile, because the existing circuit board 1 is a full-coverage metal structure layer, the area of the contact layer 33 is large. When the OLED touch screen 2 is connected, the pressure and the friction force generated by the OLED touch screen are small, so that the oxidation film cannot be removed under the pressure and the friction force.

And even if the acting force between the pin structure 3 of the OLED touch screen 2 and the pin structure 3 of the circuit board 1 is increased, the oxidation film is forcibly removed by using the friction force. Since the area of the metal contact layer 33 is large, the abraded oxide particles remain mostly on the contact layer 33. Therefore, the oxide particles remained on the contact layer 33 still affect the effective contact area between the pin structure 3 of the OLED touch screen 2 and the pin structure 3 of the circuit board 1, and affect the transmission of the test signal, so that the accuracy and stability of the test can not be guaranteed. Meanwhile, due to the fact that the pressure is increased and the friction force is increased in the mode, a part of the contact layer 33 structure can be abraded while oxide particles are abraded, and then the metal contact layer 33 structure is consumed quickly, and therefore the service life of the pin structure 3 of the circuit board 1 is greatly shortened.

In view of the above technical problems discovered by the inventors of the present disclosure, the inventors of the present disclosure have earnestly thought and made great creative efforts, and finally invented a new lead structure 3 as shown in fig. 4 to 9. The pin structure 3 may have high stability without affecting signal transmission, and may have a long service life. The pin structure 3 may be used to perform a test on the OLED touch screen 2 and transmit a test signal to the OLED touch screen 2, but is not limited thereto, and the pin structure 3 may also be connected to pins of other products and provide other signals besides the test signal, which is within the protection scope of the present disclosure.

Specifically, as shown in fig. 4 to 9, the pin structure 3 may include: a support layer 31, a conductive layer 32 and a contact layer 33. The material of the support layer 31 may be an insulating material, and the support layer 31 needs to have good structural strength to isolate electrical signals and support the conductive layer 32 and the contact layer 33.

In an embodiment of the present disclosure, the material of the supporting layer 31 may be polyvinyl chloride, but is not limited thereto, and the material of the supporting layer 31 may also be other materials as long as it is ensured that the supporting layer 31 can isolate electrical signals and can support the conductive layer 32 and the contact layer 33, which can be selected according to actual needs, and this is within the protection scope of the present disclosure.

In addition, the thickness and shape of the support layer 31 are not limited by the present disclosure, for example: the cross-sectional shape of the support layer 31 may be rectangular, but is not limited thereto, and the cross-sectional shape of the support layer 31 may also be square, triangular, circular, etc., and may be set according to actual needs, which is within the protection scope of the present disclosure.

The conductive layer 32 may be disposed on one side of the support layer 31 for connecting with other structures of the circuit board 1 to structure signals transmitted from other structures of the circuit board 1 and transmitting the signals to the contact layer 33. The material of the conductive layer 32 may be a metallic material for better signal transmission.

The thickness of the conductive layer 32 provided by the present disclosure may be smaller than that of the metal contact layer 33 of the related art, but is not limited thereto, and the thickness of the conductive layer 32 may also be the same as that of the metal contact layer 33 of the related art.

In addition, the cross-sectional shape of the conductive layer 32 may be the same as that of the support layer 31, but is not limited thereto, and the cross-sectional shape of the conductive layer 32 may also be different from that of the support layer 31, for example: the cross-sectional shape of the conductive layer 32 may be rectangular, the cross-sectional shape of the support layer 31 may be circular, and the like. Meanwhile, the area of the cross section of the conductive layer 32 may be smaller than the area of the cross section of the support layer 31, i.e., it is understood that the orthographic projection of the conductive layer 32 may be located within the orthographic projection of the support layer 31. But not limited thereto, the area of the cross section of the conductive layer 32 may also be the same as the area of the cross section of the support layer 31, although it is understood that the orthographic projection of the conductive layer 32 may coincide with the orthographic projection of the support layer 31.

The contact layer 33 may be provided with a plurality of contact blocks 331, the plurality of contact blocks 331 may be located on a surface of the conductive layer 32 away from the support layer 31, and any adjacent two contact blocks 331 may have a space therebetween. Since the cross-sectional area of each contact block 331 is small relative to the cross-sectional area of the entire layer of contact structures, the pressure between the contact blocks 331 and the other pin structures 3 provided by the present disclosure may be greater when the pin structures 3 provided by the present disclosure are connected with the other pin structures 3 using the same contact force. Thus, the present disclosure can generate a greater pressure with a smaller contact force to remove the oxide film on the surface of the contact block 331 when the contact block 331 is in contact connection with other pin structures 3, and the oxide particles removed can fall into the space between two adjacent contact blocks 331. That is, therefore, the pin structure 3 provided by the present disclosure may have high stability, may not affect the transmission of signals, and may have a long service life.

In one embodiment of the present disclosure, the material of the contact block 331 may be the same as the material of the conductive layer 32, but is not limited thereto, and the material of the contact block 331 may also be different from the material of the conductive layer 32 as long as the contact block 331 can transmit signals.

In one embodiment of the present disclosure, the cross-sectional area of each contact block 331 may gradually decrease along the third direction Z, i.e., it is understood that the longitudinal section of the contact block 331 is shaped to be "narrow at the top and wide at the bottom". Wherein the third direction Z is the direction in which the support layer 31 points towards the contact layer 33. By providing the cross-sectional area of the contact block 331 to gradually decrease along the third direction Z, the wear thickness of the contact block 331 can be made larger and larger as the pin structure 3 is used for a longer time.

However, when the contact block 331 has a larger thickness with wear, the contact area of the top portion thereof is larger, so that the contact area between the contact block 331 and the other pin structure 3 is increased, and the influence of the transmission resistance is offset, thereby continuously maintaining the accuracy and stability of signal transmission.

In one embodiment of the present disclosure, a side of each contact block 331 away from the conductive layer 32 may be rounded such that the contact between the contact block 331 and the other pin structure 3 is initially a point contact, and gradually changes from a point contact to a surface contact as the contact block 331 is ground.

In addition, the rate of change of the cross-sectional area of the contact block 331 that gradually decreases in the third direction Z is not uniform, and the rate of change of the decrease may gradually increase in the third direction Z, that is, it can be understood that the greater the distance of the contact block 331 from the conductive layer 32, the greater the magnitude of the decrease in the cross-sectional area. With this, the side surface of the contact block 331 can be made arc-shaped, so that the longitudinal sectional shape of the contact block 331 is "peak" type.

Without limitation, the rate of change of the cross-sectional area of the contact block 331 gradually decreasing along the third direction Z may also be uniform, which is within the scope of the disclosure and may be set according to actual needs.

In one embodiment of the present disclosure, conductive layer 32 may have oppositely disposed first and

second edges

321, 322, and oppositely disposed third and

fourth edges

323, 324. Here, both ends of the first edge 321 may be connected to one end of the third edge 323 and one end of the fourth edge 324, respectively, and the second edge 322 may be connected to the other end of the third edge 323 and the other end of the fourth edge 324, respectively.

In one embodiment of the present disclosure, as shown in fig. 4 and 5, one end of the contact block 331 may be located at the first edge 321, the other end of the contact block 331 may be located at the second edge 322, and a plurality of contact blocks 331 may be spaced apart in the first direction X.

In this embodiment, one end of the contact block 331 may be located at the first edge 321, and the other end may extend toward the second edge 322 and be located at the second edge 322. The projection of the contact block 331 on the conductive layer 32 may be rectangular, but is not limited thereto, and the projection of the contact block 331 on the conductive layer 32 may also be other shapes, such as square, etc., which is within the protection scope of the present disclosure. In the present embodiment, the intervals between any two adjacent contact blocks 331 in the plurality of contact blocks 331 arranged at intervals along the first direction X may be equal, but the present invention is not limited thereto.

In addition, in the present embodiment, the cross-sectional areas of the plurality of contact blocks 331 may be the same, but are not limited thereto.

In another embodiment of the present disclosure, as shown in fig. 6 to 7, one end of the contact block 331 may be located at the third edge 323, the other end of the contact block 331 may be located at the fourth edge 324, and the plurality of contact blocks 331 may be spaced apart along the second direction Y.

In this embodiment, one end of the contact block 331 may be located at the third edge 323, and the other end may extend toward the fourth edge 324 and be located at the fourth edge 324. The projection of the contact block 331 on the conductive layer 32 may also be rectangular, but is not limited thereto, and the projection of the contact block 331 on the conductive layer 32 may also be other shapes, such as square, etc., which is within the protection scope of the present disclosure. In the present embodiment, the intervals between any two adjacent contact blocks 331 in the plurality of contact blocks 331 arranged at intervals in the second direction Y may be equal, but the present invention is not limited thereto.

In one embodiment of the present disclosure, as shown in fig. 8 to 9, one end of the contact block 331 may be located at the first edge 321, and the other end of the contact block 331 may be located at the second edge 322, and the contact block 331 may include: the plurality of contacts 3311, the plurality of contacts 3311 may be arranged at intervals along the second direction Y, and of the plurality of contacts 3311, a first one of the contacts 3311 may be located at the first edge 321, and a last one of the contacts 3311 may be located at the second edge 322.

The present disclosure may enable the contact portion 3311 to be in contact connection with other pin structures 3 by providing the contact block 331 with a plurality of contact portions 3311, so that a greater pressure may be generated under the same applied force as in the above embodiments. Therefore, by providing a plurality of the contact portions 3311, it is possible to reduce the force as much as possible while ensuring that the oxide film on the surface of the contact portions 3311 is rubbed off. Moreover, when the acting force between the contact portion and the other pin structures 3 is reduced, the wear rate of the contact portion 3311 can be reduced, so that the service life of the pin structure 3 can be effectively prolonged.

Meanwhile, when the oxide film on the surface of the contact portion 3311 is removed, the abraded minute oxide particles can be more effectively discharged through the gaps around the contact portion 3311, so that the discharging effect of the oxide particles is better.

In one embodiment of the present disclosure, the cross-sectional area of the contact portion 3311 may be gradually reduced along the third direction Z, but it is understood that the longitudinal section of the contact portion 3311 is shaped to be "narrow at the top and wide at the bottom". By providing the cross-sectional area of the contact portion 3311 to gradually decrease along the third direction Z, the wear thickness of the contact portion 3311 can be made larger and larger as the use time of the pin structure 3 increases.

However, when the contact portion 3311 is thicker and thicker along with the wear, the contact area of the top portion thereof is larger and larger, so that the contact area between the contact portion 3311 and the other pin structures 3 is increased, and the influence of the transmission resistance is offset, thereby continuously maintaining the accuracy and stability of signal transmission.

In one embodiment of the present disclosure, a side of each contact portion 3311 away from the conductive layer 32 may be rounded such that the contact portion 3311 initially makes contact with other pin structures 3 as a point contact and gradually changes from a point contact to a surface contact as the contact portion 3311 grinds.

In addition, the rate of change of the cross-sectional area of the contact portion 3311 that gradually decreases in the third direction Z is not uniform, and the rate of change of the decrease thereof may gradually increase in the third direction Z, i.e., it may be understood that the more the contact portion 3311 is away from the conductive layer 32, the greater the magnitude of the decrease of the cross-sectional area thereof is. With this, the side surface of the contact portion 3311 can be made arc-shaped, so that the longitudinal sectional shape of the contact portion 3311 is "peak" type.

But not limited thereto, the rate of change of the cross-sectional area of the contact portion 3311 gradually decreasing in the third direction Z may also be uniform, which is within the scope of the present disclosure and may be set according to actual needs.

In one embodiment of the present disclosure, the cross-sectional area of a plurality of the contact portions 3311 may be the same. Also, in the plurality of contact portions 3311, the interval between any adjacent two contact portions 3311 may be the same, but is not limited thereto.

In addition, when one end of the contact block 331 is located at the third edge 323 and the other end of the contact block 331 may be located at the fourth edge 324, a plurality of contacts 3311 in the contact block 331 may be arranged at intervals in the first direction X, and among the plurality of contacts 3311, a first contact 3311 may be located at the third edge 323 and a last contact 3311 may be located at the fourth edge 324.

As shown in fig. 10, a second aspect of the present disclosure provides a mold for manufacturing a lead structure 3, and the mold for manufacturing the lead structure 3 can be used for manufacturing the lead structure 3 described above. The mold for manufacturing the pin structure 3 may include: a first forming groove 4 and a plurality of second forming grooves 5.

Wherein, the first forming groove 4 may include: a first side wall 41, a bottom wall 42 and a second side wall 43. Wherein one end of the bottom wall 42 may be connected to the first side wall 41, the other end of the bottom wall 42 may be connected to the second side wall 43, and the first side wall 41 and the second side wall 43 may extend away from the bottom wall 42. The first side wall 41, the bottom wall 42 and the second side wall 43 may enclose a first receiving cavity 44, and the bottom wall 42 may be provided with a plurality of through holes. When the support layer 31 and the conductive layer 32 of the lead structure 3 are separately fabricated, the first forming grooves 4 can be used to fabricate the conductive layer 32; when the support layer 31 and the conductive layer 32 of the lead structure 3 are fabricated together, the first forming grooves 4 can be used to fabricate the support layer 31 and the conductive layer 32.

The second forming grooves 5 described above may be connected to the inner wall of the through-hole, and it is understood that the number of the second forming grooves 5 and the number of the through-holes may be the same, and each of the second forming grooves 5 is connected to the inner wall of one through-hole. The second forming groove 5 may extend in a direction away from the side wall, and the second forming groove 5 may have a second receiving chamber 51, and the second receiving chamber 51 may communicate with the first receiving chamber 44 through a through hole. By providing the second forming groove 5, it is possible to make the contact block 331.

In the present embodiment, the cross-sectional area of the second receiving chamber 51 of each second forming groove 5 may be gradually reduced in the sixth direction M. Wherein the sixth direction M may be a direction in which the first forming grooves 4 point to the second forming grooves 5. With this arrangement, the cross-sectional area of the contact block 331 manufactured can be made to gradually decrease in the third direction Z.

In this embodiment, the side of the second forming groove 5 away from the bottom wall 42 may be rounded, such that the side of the contact block 331 away from the conductive layer 32 is rounded.

In addition, the rate of change of the cross-sectional area of the second accommodating chamber 51 gradually decreasing in the sixth direction M is not uniform, and the rate of change of the decrease thereof may gradually increase in the sixth direction M. Thus, the cross-sectional area of the contact block 331 manufactured by the method may gradually decrease along the third direction Z at a decreasing rate that is not uniform.

Without limitation, the rate of change of the cross-sectional area of the second accommodating chamber 51 gradually decreasing along the sixth direction M may also be uniform, which is within the protection scope of the present disclosure and may be set according to actual needs.

In one embodiment of the present disclosure, the bottom plate may have oppositely disposed fifth and sixth edges, and oppositely disposed seventh and eighth edges. Wherein, the two ends of the fifth edge can be respectively connected with one end of the seventh edge and one end of the eighth edge, and the two ends of the sixth edge can be respectively connected with the other end of the seventh edge and the other end of the eighth edge. The fifth edge and the sixth edge may have the same length and the same inclination angle as the first edge 321 and the second edge 322 in the above-described pin structure 3; the seventh edge and the eighth edge may have the same length and the same inclination angle as the third edge 323 and the fourth edge 324 in the above-described pin structure 3. Namely: the fifth and sixth edges may correspond to the first and

second edges

321 and 322, and the seventh and eighth edges may correspond to the third and

fourth edges

323 and 324.

In one embodiment of the present disclosure, the plurality of through holes may be spaced in the fourth direction L, one end of the second forming groove 5 may be located at the fifth edge, the other end of the second forming groove 5 may be located at the sixth edge, and the plurality of second forming grooves 5 may be spaced in the fourth direction L. The fourth direction L may be a direction in which the seventh edge points to the eighth edge.

In the present embodiment, the orthographic projection of the second forming groove 5 may be rectangular, but is not limited thereto.

In the present embodiment, the interval between any adjacent two of the plurality of second forming grooves 5 arranged at intervals in the fourth direction L may be the same, but is not limited thereto.

In another embodiment of the present disclosure, the plurality of through holes may be spaced in the fifth direction, one end of the second forming groove 5 may be located at the seventh rim, the other end of the second forming groove 5 may be located at the eighth rim, and the plurality of second forming grooves 5 may be spaced in the fifth direction. Wherein the fifth direction is a direction in which the fifth edge points to the sixth edge.

In the present embodiment, among the plurality of second forming grooves 5 arranged at intervals in the fifth direction, the interval between any adjacent two second forming grooves 5 may be the same, but is not limited thereto.

In the present embodiment, the orthographic projection of the second forming groove 5 may be a rectangle, but is not limited thereto.

In an embodiment of the present disclosure, the through holes may be arranged at intervals along the fourth direction L, and each of the through holes may include: and a plurality of holes which may be arranged at intervals in the fifth direction. The second forming groove 5 may include: and a plurality of second forming parts which may be arranged at intervals in the fifth direction. In the plurality of second formations, a first one of the second formations may be located at the fifth edge and a last one of the second formations may be located at the sixth edge. And, each second forming portion is connected with an inner wall of a hole portion, each second forming portion extends in a direction away from the side wall, and each second forming portion has a second receiving cavity 51.

In one embodiment of the present disclosure, the cross-sectional area of the second receiving chamber 51 of the second forming portion may be gradually reduced in the sixth direction M.

Also, a side of each of the second forming portions remote from the bottom wall 42 may be rounded, so that a side of the contact portion 3311 remote from the conductive layer 32 is made rounded.

In addition, the rate of change in the cross-sectional area of the second accommodating chamber 51 of the second formation portion that gradually decreases in the sixth direction M is not uniform, and the rate of change in the decrease thereof may gradually increase in the sixth direction M. Thus, the contact portion 3311 may be manufactured such that the cross-sectional area thereof gradually decreases in the third direction Z at a non-uniform rate, and the decreasing rate may gradually increase in the third direction Z

Without being limited thereto, the rate of change of the cross-sectional area of the second receiving cavity 51 of the second forming portion gradually decreasing along the sixth direction M may also be uniform, which is within the protection scope of the present disclosure and may be set according to actual needs.

In one embodiment of the present disclosure, the cross-sectional areas of the second receiving cavities 51 of the plurality of second forming portions may be the same. Also, in the plurality of second forming portions, the interval between any adjacent two of the second forming portions may be the same, but is not limited thereto.

In addition, when the through holes are arranged at intervals in the fifth direction, the plurality of hole parts are arranged at intervals in the fourth direction L, one end of the second forming portion is located at the seventh edge, and the other end of the second forming portion is located at the eighth edge, the plurality of second forming portions in the second forming groove 5 may be arranged at intervals in the fourth direction L, and among the plurality of second forming portions, a first one of the second forming portions may be located at the seventh edge, and a last one of the second forming portions may be located at the eighth edge.

A third aspect of the present disclosure provides a circuit board 1, the circuit board 1 may include a pin connection region 11, and the pin connection region 11 may include: a plurality of pin structures 3 arranged at intervals, wherein the pin structures 3 may be the pin structures 3. By using the above-mentioned pin structure 3, since the cross-sectional area of each contact block 331 is smaller relative to the cross-sectional area of the entire layer of contact structures, when the pin structure 3 provided by the present disclosure is connected with other pin structures 3 by the same force, the pressure between the contact block 331 provided by the present disclosure and other pin structures 3 can be larger. Thus, the present disclosure can generate a greater pressure with a smaller force to remove the oxide film on the surface of the contact block 331 when the contact block 331 is in contact connection with other pin structures 3, and the oxide particles removed can fall into the space between two adjacent contact blocks 331. That is, therefore, the pin structure 3 provided by the present disclosure may have high stability, may not affect the transmission of signals, and may have a long service life. And further improves the working stability and the service life of the circuit board 1.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A pin structure, comprising:

a support layer;

a conductive layer disposed on one side of the support layer;

2. The pin structure according to claim 1, wherein the conductive layer has a first edge and a second edge disposed oppositely, and a third edge and a fourth edge disposed oppositely, two ends of the first edge are respectively connected with one end of the third edge and one end of the fourth edge, and the second edge is respectively connected with the other end of the third edge and the other end of the fourth edge;

3. The pin structure of claim 2, wherein one end of the contact block is located at the first edge and the other end of the contact block is located at the second edge, the contact block comprising:

4. The pin structure of claim 3, wherein the cross-sectional area of each contact block gradually decreases along a third direction, wherein the third direction is a direction in which the support layer points toward the contact layer.

5. The pin structure according to claim 4, wherein a cross-sectional area of each of the contact portions is gradually reduced along the third direction, and the cross-sectional areas of a plurality of the contact portions are the same.

6. A mold for manufacturing a lead structure, wherein the mold for manufacturing a lead structure is used for manufacturing a lead structure according to any one of claims 1 to 5, and the mold for manufacturing a lead structure comprises:

7. The mold for manufacturing a lead frame according to claim 6, wherein the bottom plate has a fifth edge and a sixth edge disposed opposite to each other, and a seventh edge and an eighth edge disposed opposite to each other, two ends of the fifth edge are respectively connected to one end of the seventh edge and one end of the eighth edge, and two ends of the sixth edge are respectively connected to the other end of the seventh edge and the other end of the eighth edge;

8. The die for making a pin structure according to claim 7, wherein the through holes are spaced along the fourth direction, and each of the through holes comprises: a plurality of holes arranged at intervals in the fifth direction;

9. The mold for fabricating a pin structure according to claim 6, wherein the cross-sectional area of the second receiving cavity is gradually reduced in a sixth direction, wherein the sixth direction is a direction in which the first forming grooves are directed to the second forming grooves.

10. A circuit board, comprising a pin connection region, the pin connection region comprising:

a plurality of pin structures arranged at intervals, wherein the pin structures are as claimed in any one of the claims 1 to 5.