CN113707699A - Display panel, preparation method thereof and display device - Google Patents

Abstract

The disclosure relates to the technical field of flexible folding display, and particularly discloses a display panel, a preparation method thereof and a display device. The display panel includes: the plurality of pins are positioned in the binding region, each pin comprises a conductive layer, the plurality of pins are configured to transmit electric signals to the plurality of sub-pixels, orthographic projections of the plurality of pins on the substrate base plate are distributed at intervals along a first direction and extend along a second direction, and the first direction is intersected with the second direction; the plurality of extension pads are positioned on one side of the plurality of pins far away from the display area, are distributed at intervals along a first direction and extend along a second direction, each of the plurality of extension pads comprises a signal wire, and the conducting layers of the plurality of pins are electrically connected with the signal wires of the plurality of extension pads; and the partition structures penetrate through the substrate base plate and are configured to electrically insulate the extension pads, and orthographic projections of the partition structures on the substrate base plate are not overlapped with orthographic projections of the extension pads on the substrate base plate.

Description

Display panel, preparation method thereof and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.

Background

For the flexible OLED screen, in the manufacturing process, the connection part of the screen and the circuit board needs to be subjected to laser cutting treatment; because the substrate of the screen is PI, even if the most mature laser process is used at present, a carbonized foreign matter is easily formed on a cutting section after laser cutting, and the carbonized foreign matter has better conductivity, so that adjacent signal lines at the joint of the screen and the circuit board can be in short circuit, and the abnormal Touch Sensor and the poor display are often caused.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

The present disclosure is directed to overcome the above-mentioned deficiencies of the prior art, and provides a display panel, a method for manufacturing the same, and a display device.

According to an aspect of the present disclosure, there is provided a display panel including:

the substrate comprises a display area and a binding area positioned on at least one side of the display area;

a plurality of sub-pixels located in the display area;

a plurality of pins located in the bonding region, each of the plurality of pins including a conductive layer, the plurality of pins being configured to transmit an electrical signal to the plurality of sub-pixels, orthographic projections of the plurality of pins on the substrate being distributed at intervals along the first direction and extending along a second direction, the first direction intersecting the second direction;

the plurality of extension pads are positioned on one side of the plurality of pins far away from the display area, are distributed at intervals along the first direction and extend along the second direction, each of the plurality of extension pads comprises a signal wire, and the conducting layers of the plurality of pins are electrically connected with the signal wires of the plurality of extension pads;

a plurality of partition structures located between the plurality of elongated pads and extending along the second direction, the partition structures penetrating the substrate base plate and configured to electrically insulate the plurality of elongated pads, an orthographic projection of the plurality of partition structures on the substrate base plate and an orthographic projection of the plurality of elongated pads on the substrate base plate do not overlap.

In an exemplary embodiment of the present disclosure, the conductive layers of the plurality of pins and the signal lines of the plurality of extended pads are electrically connected in a one-to-one correspondence.

In an exemplary embodiment of the present disclosure, the plurality of partition structures and the plurality of extension pads are alternately arranged one by one.

In an exemplary embodiment of the present disclosure, the extension pad includes:

and the partition structure penetrates through the at least one first insulating layer.

In an exemplary embodiment of the present disclosure, the extension pad further includes:

and the partition structure also penetrates through the at least one second insulating layer.

In an exemplary embodiment of the present disclosure, the partition structure includes a through groove located between adjacent signal lines, and the through groove penetrates through the at least one first insulating layer, the at least one second insulating layer, and the substrate base plate.

In an exemplary embodiment of the present disclosure, the through slot has a first slot wall and a second slot wall that are oppositely disposed in the first direction, and a third slot wall in the second direction, the third slot wall connecting the first slot wall and the second slot wall.

In an exemplary embodiment of the present disclosure, the display panel includes:

open groove is located bind the district, open groove runs through at least the signal line of a plurality of extension pads is in order to form uncovered, open groove is in the orthographic projection of substrate base plate is followed first direction extends, just open groove is in the orthographic projection of substrate base plate with it is in to cut off the structure orthographic projection on the substrate base plate and intersect.

In an exemplary embodiment of the present disclosure, the material of the substrate base plate includes a polyimide material.

In an exemplary embodiment of the disclosure, an orthographic projection of the partition structure on the substrate base plate has a first length along the second direction, the pin has a second length along the second direction at the bonding region, and a ratio of the first length to the second length is: 0.2 to 1.

According to a second aspect of the present disclosure, there is also provided a method of manufacturing a display panel, including:

providing a substrate, wherein the substrate comprises a display area and a binding area positioned on at least one side of the display area;

forming a plurality of sub-pixels and a plurality of pins on one side of the substrate, wherein the plurality of sub-pixels are located in the display area, the plurality of pins are located in the bonding area, each of the plurality of pins comprises a conductive layer, the plurality of pins are configured to transmit electrical signals to the plurality of sub-pixels, orthographic projections of the plurality of pins on the substrate are distributed at intervals along a first direction and extend along a second direction, and the first direction intersects the second direction;

forming a plurality of extension pads, wherein the extension pads are positioned on one sides of the pins far away from the display area, and the extension pads are correspondingly connected with the pins;

performing a cutting process on the extension pad;

and forming a partition structure between the adjacent extension pads, wherein the partition structure penetrates through the substrate base plate.

According to a third aspect of the present disclosure, there is also provided a display device including:

the display panel according to any of the embodiments of the present disclosure;

and the circuit board is provided with a plurality of signal pins which are connected with the plurality of pins in the display panel in a one-to-one correspondence manner.

The display panel provided by the disclosure, through set up the wall structure between the regional adjacent signal line of extension pad for by electrical insulation between the adjacent extension pad, cut off the unusual conducting path that the carbonization foreign matter structure that produces because of the laser cutting screen formed promptly, thereby the unusual short circuit of adjacent pin can't be reproduced to the carbonization foreign matter structure that produces, can solve from this because the display that the carbonization foreign matter that the laser cutting screen produced caused is unusual and/touch unusual problem.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

FIG. 1 is a schematic diagram of the binding of an OLED display panel and a circuit board PCB;

FIG. 2 is a schematic diagram of a display panel before cutting;

FIG. 3 is a cross-sectional view taken along direction AA in FIG. 2;

FIG. 4a is a schematic structural diagram of a display panel;

FIG. 4b is an enlarged view of a portion of the bonding area of FIG. 4a before cutting;

FIG. 4c is a schematic view of FIG. 4b after cutting;

FIG. 4d is a cross-sectional view taken along the YY direction in FIG. 4 a;

FIG. 5a is a cross-sectional view taken along direction BB of FIG. 4 b;

FIG. 5b is a schematic view of one configuration of the through slot of the present disclosure;

FIG. 5c is a schematic view of another embodiment of the through slot of the present disclosure;

FIG. 5d is a schematic view of yet another embodiment of a through slot of the present disclosure;

FIG. 6 is a cross-sectional view taken along the direction CC in FIG. 4 b;

fig. 7 is a flowchart of a method for manufacturing a display panel.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," "said," and "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.

In the related art, as shown in fig. 1, for a display technology of an OLED (Organic Light-Emitting Diode), an external signal is routed through the inside of a PCB (printed circuit board), and then a signal required by a PNL is transmitted to the PNL through a bonding position between the PCB and the PNL (display screen), and a Pad Cut process (cutting a screen with laser) is required to remove an unnecessary portion of a bonding area at the bonding position between the PNL and the PCB due to a bonding requirement. Fig. 2 is a schematic diagram before cutting a display panel, a Pad Cut process is performed before bonding to remove unnecessary PNL portions, fig. 3 is a cross-sectional view along the AA direction in fig. 2, and with reference to fig. 2 and 3, since laser energy generated by the Pad Cut process is large, PI at a cutting section 10 is easily burned and carbonized to form a carbonized foreign substance, and when there is a large amount of carbonized foreign substances, a carbonized foreign substance structure 120 is formed, and the carbonized foreign substance structure 120 connects adjacent Gate layers, and the carbonized foreign substance has good conductivity, thereby causing short circuit of Gate layers in adjacent wirings, and causing functional defects such as touch and/or display abnormality of the display panel. In addition, fig. 2 is only an exemplary illustration of the Pad Cut process, and it should be understood that after the Pad Cut process is performed, the region 20 shown in the figure is a Cut-away portion, which is not included in the final display panel. In addition, since the carbonized foreign substance structure 120 is attached to the substrate and corresponds to a component of the substrate, the carbonized foreign substance structure 120 shown in fig. 3 is integrated with the substrate.

In view of the above technical problem, the present disclosure improves the structure of the display panel in the bonding region, and aims to cut off the carbonized foreign matter structure and the conductive path formed by the carbonized foreign matter by providing the partition structure. The following describes the disclosed embodiments in detail with reference to the accompanying drawings.

The disclosed embodiment provides a display panel, wherein fig. 4a is a schematic structural diagram of the display panel, fig. 4b is a partially enlarged view of a bonding region in fig. 4a, fig. 4d is a cross-sectional view along YY direction in fig. 4a, and fig. 5a is a cross-sectional view along BB direction in fig. 4b, in which a large amount of carbonized foreign matter is generated at a cutting surface 10 generated by Pad Cut process. Referring to fig. 4a, 4b and 5a, the display panel may include:

a substrate base plate 110 including a display region and a binding region located at least one side of the display region; the display panel may further include: a plurality of sub-pixels 40, a plurality of pins 132, a plurality of extension pads 133, and a plurality of partition structures 140, wherein the plurality of sub-pixels 40 are located in the display region; a plurality of pins 132 are located in the bonding region, each of the plurality of pins 132 includes a conductive layer, the plurality of pins 132 are configured to transmit an electrical signal to the plurality of sub-pixels 40, orthographic projections of the plurality of pins 132 on the substrate base 110 are distributed at intervals along a first direction and extend along a second direction, and the first direction intersects with the second direction; the plurality of extension pads 133 are located on one side of the plurality of leads 132 away from the display area, are distributed at intervals along the first direction and extend along the second direction, each of the plurality of extension pads 133 comprises a signal line 134, and the conductive layers of the plurality of leads 132 are electrically connected with the signal lines 134 of the plurality of extension pads 133; the plurality of partition structures 140 are located between the plurality of extension pads 133 and extend along the second direction, the partition structures 140 penetrate the substrate base plate 110 and are configured to electrically insulate the plurality of extension pads 133, and an orthographic projection of the plurality of partition structures 140 on the substrate base plate 110 does not overlap with an orthographic projection of the plurality of extension pads 133 on the substrate base plate 110.

The display panel provided by the exemplary embodiment, by arranging the partition structure between the adjacent signal lines in the extension pad region, the adjacent extension pads are electrically insulated, that is, the partition structure cuts off the abnormal conductive path formed by the carbonized foreign matter structure generated by laser cutting of the screen, so that the generated carbonized foreign matter structure cannot be reproduced into the abnormal short circuit of the adjacent pins, and thus, the problems of abnormal display and/or abnormal touch caused by the carbonized foreign matter generated by laser cutting of the screen can be solved.

In the present exemplary embodiment, the substrate base plate 110 is generally made of an organic material such as PI (polyimide material), and as analyzed above, in the Pad Cut process, the energy generated by the laser burns the organic material such as PI to form a carbonized foreign substance structure, and the carbonized foreign substance structure is formed corresponding to the Cut surface formed at the Pad Cut line 10 in fig. 4 b. As can be seen from fig. 3 and 5a, the formed carbonized foreign material structure 120 is attached to the base substrate 110 and forms an integral structure with the base substrate 110, which is equivalent to a part constituting the base substrate 110. Further, it should be understood that, since the Pad Cut is to completely Cut the substrate base 110, the carbonized foreign substance structure 120 is also present on the lower surface of the substrate base 110, although not shown in the drawings. In the present exemplary embodiment, the first direction is an arrangement direction of the plurality of leads 132, which corresponds to an X direction in fig. 4b, and the second direction is an extending direction of the leads 132, which corresponds to a Y direction in fig. 4 b. Furthermore, it should be understood that fig. 4b is only an exemplary illustration of the Pad Cut process, and the region 20 in the figure is a Cut-away portion, which is not included in the final display panel, i.e., the structure shown in fig. 4c is formed after the Pad Cut process is performed.

In the exemplary embodiment, the extension pads 133 may be understood as the extended leads 132, and the plurality of extension pads 133 may be connected to the plurality of leads 132 in a one-to-one correspondence, and obviously, the plurality of extension pads 133 are also spaced apart in the first direction. As shown in fig. 5a, in the present exemplary embodiment, the extension pad 133 may have a multi-layer structure, such as an interlayer insulating layer 111(TLD), a touch insulating layer 112(TBL), a passivation layer 113(PVX), an interlayer dielectric layer 114(ILD), a first gate insulating layer 115(GI1), a second gate insulating layer 116(GI2), and the like, which are located on a side of the signal line 134 away from the substrate 110. An inorganic layer 135, such as SiN, may also be included on the signal line 134 on the side adjacent to the substrate base 110_XLayer, SiO_XLayers, and the like. In addition, the signal line 134 may beA Gate layer (Gate layer) where the Gate layer is extended from the Gate layer of the leads 132, or a conductive layer of the leads 132 and the signal lines of the plurality of extension pads 133 are electrically connected through vias.

Fig. 4d shows a film structure of one sub-pixel in the display region, and the back plate layer may include a substrate PI layer 1, a Barrier layer 2(Barrier), a Buffer layer 3(Buffer), an active layer 15, a first gate insulating layer 4(GI1), a gate 27/first capacitor electrode 25, a second gate insulating layer 5(GI2), a second capacitor electrode 26, an interlayer dielectric layer 6(ILD), a first source drain metal layer 16(SD1), a passivation layer 7(PVX), and a first planarization layer 8(PLN 1). The light emitting structure layer may include: a pixel defining layer 9(PDL) and spacers 11(PS), the pixel defining layer 9 including a plurality of openings in which the anode layer 17, the organic light emitting layer 28, and the cathode layer 12 are disposed. The encapsulation layer may include an organic encapsulation layer 14 and an inorganic encapsulation layer 13. The FMLOC film layer may include a Buffer layer 18(Buffer), a first touch metal layer 19(Bridge), an interlayer dielectric layer 21(ILD), a second touch metal layer 22, and a protection layer 23 (OC).

In addition, it should be understood that the bonding region and the display region may share a film structure in the present exemplary embodiment, and in conjunction with fig. 4d and fig. 5a, the touch insulating layer 112(TBL) in fig. 5a may correspond to the Buffer layer 18(Buffer) in the FMLOC film layer in fig. 4d, the interlayer insulating layer 111(TLD) in fig. 5a may correspond to the interlayer dielectric layer 21(ILD) in the FMLOC film layer in fig. 4d, and the other film layers in fig. 5a may be disposed at the same layer as the corresponding film layers of the backplane in fig. 4 d.

As shown in fig. 4b and fig. 5a, in the present exemplary embodiment, the conductive layer in the pin 132 may be a Gate layer, and the Gate layer may be used to form a Gate of a transistor in the display panel, and the conductive layer is connected to the pin of the circuit board. It should be understood that as shown in fig. 5a, a barrier layer 135 will typically be provided between the base substrate 110 and the conductive layer, and that the barrier layer 135 may comprise a stack of SiN_XLayer, SiO_XLayers, and the like. Before the partition structure 140 is arranged, the carbonized foreign body structure formed by the Pad Cut process can still partially or completely cross the barrier layer 135 to short-circuit the adjacent conductive layers to cause abnormal short circuit, the carbonized foreign body structure is Cut into a plurality of sub-carbonized structures 121 by arranging the partition structure 140,the sub-carbonized structure 121 crossing the barrier layer 135 is connected only with the signal line 133 thereof in the same sub-bonding region and the connection path with the adjacent signal line 133 is cut off, so that the short circuit abnormality is not caused any more. The sub-bonding regions are a plurality of sub-regions spaced apart from each other by the partition structure 140 in the arrangement direction of the signal lines 133. In practical cases, since the Pad Cut process is performed first and the partition structure 140 is formed later, the carbonized foreign substance structure is generated first, and then the plurality of partition structures 140 are disposed to partition the carbonized foreign substance structure to form the discontinuous sub-carbonized structure 121. Further, it should be understood that the partition structure 140 cuts the carbonized foreign substance structure into a plurality of sub-carbonized structures 121 spaced apart, and thus any of the sub-carbonized structures 121 are not connected to each other. Further, it should be understood that the partition structures 140 shown in fig. 5a are positioned between the adjacent extension pads 133 in a structure in which the partition structures 140 intercept the connection portions between the extension pads 133, such that the extension pads 133 and the partition structures 140 form an arrangement structure staggered one by one in the first direction.

As shown in fig. 4b and 5a, in the present exemplary embodiment, the blocking structures 140 and the extension pads 133 are alternately arranged in the first direction, and the orthographic projection of the blocking structure 140 on the substrate base plate 110 does not overlap with the orthographic projection of the adjacent extension pad 133 on the substrate base plate 110, so as to cut off the abnormal conductive path between the adjacent signal lines 134, and ensure a certain distance between the blocking structure 140 and the adjacent signal lines 134, thereby preventing the blocking structure 140 from damaging the signal lines 134. In the present exemplary embodiment, the partition structure 140 may extend from a side facing away from the substrate base plate 110 toward the substrate base plate 110 until penetrating through each film layer in the extension pad 133 and the substrate base plate 110 to substantially intercept the carbonized foreign substance structure attached to the substrate base plate 110. Obviously, after the partition structure 140 is provided, the carbonized foreign matter structure is partitioned by the partition structure 140 in the arrangement direction of the extension pads 133 into the sub-carbonized structures 121 that are not connected to each other, thereby solving the problem that the carbonized foreign matter generated in the screen production process causes display abnormality and/or touch abnormality. Further, it should be understood that the partition structure 140 should have a certain length in the second direction, i.e., the partition structure 140 extends a certain length from the Pad Cut surface to the display region side, to completely intercept the carbonized foreign substance structure in the second direction. In the present exemplary embodiment, the length of the partition structure 140 in the second direction may be set in conjunction with the length of the signal line 134 in the bonding area extension pad 133. For example, the length of the blocking structure 140 in the second direction may be set to be identical to the length of the signal line 134, or the length of the blocking structure 140 in the second direction may be set to be half of the length of the signal line 134, or the length of the blocking structure 140 in the second direction may be set to be 20% of the length of the signal line 134, or the like.

As shown in fig. 4a and 4b, in the present exemplary embodiment, the display panel further includes a display area located at one side of the binding area along the second direction. External signals of the display panel are routed through the PCB and then transmitted to the PNL through the PCB and the pins 132 of the PNL. It should be understood that, in order to completely intercept the carbonized foreign substance structure, a side of the partition structure 140 facing the display region is closer to the display region than the adjacent sub-carbonized structure 121, so that the partition structure 140 completely isolates the adjacent sub-carbonized structure 121 in the second direction, thereby eliminating the influence of the carbonized foreign substance structure formed by the Pad Cut process on signal transmission.

The partition structure 140 of the present disclosure will be further described with reference to the accompanying drawings.

As shown in fig. 5b, which is a schematic structural diagram of the through groove 200 of the present disclosure, in conjunction with fig. 5a and 5b, in the present exemplary embodiment, the partition structure 140 may include the through groove 200, the through groove 200 is located between adjacent signal lines 134, the through groove 200 penetrates through each film layer of the extension pad 133 to form a first opening 201 on a side facing away from the substrate base 110, and the through groove 200 further penetrates through the substrate base 110 to form a second opening 202 on a side of the substrate base 110. The through grooves 200 completely penetrate the extension pad 133 and the base substrate 110, thereby completely cutting off the formed carbonized foreign substance structures, and finally forming the through grooves 200 distributed at intervals between the respective sub-carbonized structures 121 as shown in fig. 5 a. Illustratively, the extension pad 133 and the base substrate 110 may be completely cut using a laser process to form the through-slots 200. Of course, in other exemplary embodiments, other processes may be used to form the through groove 200, and the partition structure may also be implemented by other structures, such as a partition structure formed by using an electrically insulating material.

It is understood that the carbonized foreign substance structure is located on the side of the substrate base plate 110 in the second direction, and the through groove 200 cuts the cross section formed by the Pad Cut process, so the through groove 200 should have a three-sided opening shape, that is, the through groove 200 has an opening on the side facing away from the display region in addition to the first opening 201 and the second opening 202.

As shown in fig. 5a and 5b, in the present exemplary embodiment, the through slot 200 further has a first slot wall 203 and a second slot wall 204 that are oppositely disposed in the first direction, the first slot wall 203 has a certain distance from the signal line 134 on the side of the first slot wall 203 away from the second slot wall 204, and the second slot wall 204 has a certain distance from the signal line 134 on the side of the second slot wall 204 away from the first slot wall 203. That is, a certain distance is provided between the first slot wall 203 and the adjacent signal line 134 located on the same side of the through slot 200, and a certain distance is provided between the second slot wall 204 and the adjacent signal line 134 located on the same side of the through slot 200, so that the through slot 200 is ensured not to contact with the signal line 134, and the signal line 134 is prevented from being damaged. Furthermore, the through groove 200 should also have a third groove wall 205 in the second direction, the third groove wall 205 connecting the first groove wall 203 and the second groove wall 204, and the third groove wall 205 being closer to the display area than the adjacent sub-carbonized structure 121.

In the present exemplary embodiment, the through groove 200 may be disposed perpendicular to the substrate base plate 110, in which case the first opening 201 of the open groove is opposite to the second opening 202, as shown in fig. 5 b. Of course, in other exemplary embodiments, the through groove 200 may also be disposed obliquely to the substrate base plate 110, in which case, an orthogonal projection of the first opening 201 of the through groove 200 on the substrate base plate 110 and an orthogonal projection of the second opening 202 on the substrate base plate 110 may partially overlap or completely not overlap, as shown in fig. 5 c.

In the present exemplary embodiment, the opening size of the first opening 201 through the slot 200 may be different from the opening size of the second opening 202 (as shown in fig. 5 a), or the opening size of the first opening 201 through the slot 200 may be the same as the opening size of the second opening 202, as shown in fig. 5 d. For example, the first opening 201 is aligned with the second opening 202, and the orthogonal projection of the first opening 201 on the substrate 110 may be located within the orthogonal projection of the second opening 202 on the substrate 110, or the orthogonal projection of the second opening 202 on the substrate 110 is located within the orthogonal projection of the first opening 201 on the substrate 110. Further, it should be understood that the orthogonal projection of the first opening 201 of the through groove 200 on the substrate base 110 and the orthogonal projection of the second opening 202 on the substrate base 110 may be regular patterns such as an ellipse and a rectangle, and of course, may be irregular patterns. Also, the orthographic projection of the first opening 201 on the substrate base 110 and the orthographic projection of the second opening 202 on the substrate base 110 may be the same or different.

As can be seen from the above analysis, the penetrating grooves 200 are provided to separate the carbonized foreign substance structure into discrete sub-carbonized structures 121 that are not connected to each other, and thus, the conductive path formed by the carbonized foreign substance structure is cut off, so that the problem of abnormal display and/or touch caused by the carbonized foreign substance short-circuit signal lines 134 can be solved.

With continued reference to fig. 4b, in some embodiments, in consideration of the influence of the carbonized foreign material formed after the Pad Cut process, an incomplete laser cutting process Trimming is also performed on the PNL to form a Trimming process region 30 shown in fig. 4b, which is intended to Cut off the connection between the short-circuited section caused by the Pad Cut and the pin 132. Fig. 6 is a cross-sectional view along CC direction in fig. 4b, in which the open slot 30 is a Trimming process area, the open slot 30 is located in the region of the extension pad 133 of the bonding area, and penetrates through the signal line 134 of the extension pad 133 to form an opening on a side of the signal line 134 away from the substrate base 110, an orthographic projection of the open slot 30 on the substrate base 110 extends along a first direction, and the orthographic projection of the open slot 30 on the substrate base 110 intersects with an orthographic projection of the partition structure 140 on the substrate base 110. The open slot 30 is a structure formed by the Trimming process, and is intended to partially Cut off the signal line 134 between the cross section formed by the Pad Cut process and the pin 132, so as to Cut off the connection between the signal line 134 in the extension Pad 133 and the pin 132. It can be seen that the open groove 30 is an open region extending in the first direction (the direction in which the signal lines 134 are arranged) and having a certain width in the second direction (the direction in which the signal lines 134 extend). As shown in fig. 6, taking the partition structure 140 as the through groove 200 as an example, the carbonized foreign substance structure 120 formed on one side (the first side 31 in the figure) of the open groove 30 close to the display area may affect the signal, and in this case, the through groove 200 needs to partition the carbonized foreign substance structure 120 on the first side 31 shown in fig. 6, that is, the through groove 200 only divides the carbonized foreign substance structure 120 on the first side 31 into a plurality of sub carbonized structures 121 distributed at intervals in the first direction, and the sub carbonized structures 121 are not connected to each other. It should be understood that when the through-trench 200 intercepts only the carbonized foreign material structure 120 on the first side 31 without intercepting the carbonized foreign material structure formed by the Pad Cut process, the through-trench 200 has a third trench wall and a fourth trench wall opposite to each other in the second direction, the third trench wall is located on the side of the first side 31 of the Trimming region close to the display region, the fourth trench wall is located between the first side 31 and the second side 32 of the Trimming region, the through-trench 200 now has only the first opening 201 and the second opening 202, and the second side 32 is located on the first side 31 away from the display region along the extending direction of the leads 132. Obviously, because the Trimming process has already Cut off a part of the conductive layer on the first side 31 of the Trimming region far from the display region, which is equivalent to cutting off the connection between the carbonized foreign substance structure formed by the Pad Cut process and the pins 132, on this basis, by only cutting off the carbonized foreign substance structure 120 on the first side 31, the display abnormal influence possibly caused by the carbonized foreign substance structure 120 can be eliminated.

Alternatively, in other exemplary embodiments, the through groove 200 may also be configured to completely cut the carbonized foreign substance structures 120 formed by the Trimming process, that is, the carbonized foreign substance structures 120 on the first side 31 and the second side 32 in fig. 6 are both cut into a plurality of sub-carbonized foreign substances distributed at intervals along the first direction, which is equivalent to the through groove 200 shown in fig. 6 having a third groove wall and a fourth groove wall opposite to each other in the second direction, and the carbonized foreign substance structures on the first side 31 and the second side 32 of the Trimming region are located between the third groove wall and the fourth groove wall in the second direction, so as to completely intercept the carbonized foreign substance structures formed in the Trimming region.

Alternatively, in other exemplary embodiments, the through groove 200 may also be configured to Cut the carbonized foreign substance structure of the second side 32 formed by the Trimming process and the carbonized foreign substance structure formed by the Pad Cut process while cutting off the carbonized foreign substance structure of the first side 31, that is, the through groove 200 cuts all the carbonized foreign substance structures 120 generated by the Pad Cut process and the Trimming process into sub-carbonized structures 121 distributed at intervals in the first direction. The third groove wall corresponding to the through groove 200 shown in fig. 5a is located on the side of the Trimming region first side 31 close to the display region, and the through groove 200 has a third opening in addition to the first opening 201 and the second opening 202 at this time, so as to Cut off the carbonized foreign matter structure in the Trimming process region and the carbonized foreign matter structure in the Pad Cut process region, thereby avoiding the possible abnormal influence of conductivity and/or touch due to the residual carbonized foreign matter or cutting error which is splashed in the cutting process.

Furthermore, it should be understood that after the Trimming process is performed on the display panel, the through slot 200 in the exemplary embodiment has a certain distance between the first slot wall 203 and the adjacent signal line 133 in the first direction, and between the second slot wall 204 and the adjacent signal line 133, so as to prevent the through slot 200 from damaging the signal line 133, and ensure that the signal line 133 can normally transmit signals between the display screen and the PCB.

In addition, the present disclosure also provides a preparation method of a display panel, in the production of a flexible OLED screen, a yield loss (mainly poor contact) of the flexible OLED screen still exists by 3% to 5% after the Pad Cut and Trimming process, the method provided by the present disclosure may be applied to repair the flexible OLED screen with a poor detection after the Pad Cut and Trimming process, fig. 7 shows a flowchart of the preparation method, and the method includes the following steps:

s110, providing a substrate base plate which comprises a display area and a binding area positioned on at least one side of the display area;

s120, forming a plurality of sub-pixels and a plurality of pins on one side of a substrate, wherein the plurality of sub-pixels are located in a display area, the plurality of pins are located in a binding area, each of the plurality of pins comprises a conductive layer, the plurality of pins are configured to transmit electric signals to the plurality of sub-pixels, orthographic projections of the plurality of pins on the substrate are distributed at intervals along a first direction and extend along a second direction, and the first direction is intersected with the second direction;

s130, forming a plurality of extension pads, wherein the extension pads are positioned on one sides of the pins far away from the display area and are correspondingly connected with the pins;

s140, cutting the extension pad;

s150, forming a partition structure between the adjacent extension pads, wherein the partition structure penetrates through the substrate base plate.

The cutting process in step S140 is a Pad Cut process performed before binding to Cut off unnecessary portions of the PNL, but the Pad Cut has a large energy, which is very likely to cause burning and carbonization of the PI at the cutting section to form a carbonized foreign substance, and when the carbonized foreign substance is too much, a carbonized foreign substance structure in contact with the substrate is formed, and the carbonized foreign substance structure is likely to cause short circuit of Gate layers in adjacent traces in the binding region, resulting in poor functionality such as abnormal touch/display.

Step S150 is to cut off the carbonized foreign material structure formed in step S140 by providing a trench structure, so that the carbonized foreign material structure is cut into a plurality of sub carbonized foreign materials distributed at intervals along the first direction, and the conductive path formed by the carbonized foreign material structure is cut off by cutting the carbonized foreign material structure into sub carbonized foreign materials which are not connected to each other, thereby solving the problem of abnormal display and/or touch caused by the carbonized foreign material structure. For the specific arrangement of the trenching structure, reference may be made to the above description of the structural embodiments of the display panel, and further description is omitted here.

According to the method provided by the exemplary embodiment, the flexible OLED screen with the defects detected after the Pad Cut and Trimming is subjected to grooving setting, and the defects caused by short circuit of the carbonized foreign matters can be repaired by 100%. In addition, the method has lower cost, can recover higher yield loss without introducing new equipment, and has no risk in reliability verification.

In addition, the present disclosure also provides a display device, which includes the display panel described in any of the above embodiments, and the display device further includes a driver chip (IC) and/or a flexible circuit board (FPC), and a plurality of pins of the bonding area in the display panel are connected to the bonding pins of the driver chip (IC) and/or the flexible circuit board (FPC) in a one-to-one correspondence manner, so as to transmit signals required by the PNL to the PNL through the circuit board. The present exemplary embodiment provides a display device including the display panel of any of the embodiments described above, and thus the present exemplary embodiment also includes the advantageous effects described in any of the embodiments described above.

It should be noted that although the steps of the method for manufacturing a display panel in the present disclosure are depicted in the drawings in a particular order, this does not require or imply that the steps must be performed in this particular order or that all of the depicted steps must be performed to achieve the desired results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims (12)

1. A display panel, comprising:

the substrate comprises a display area and a binding area positioned on at least one side of the display area;

a plurality of sub-pixels located in the display area;

a plurality of pins located in the bonding region, each of the plurality of pins including a conductive layer, the plurality of pins being configured to transmit an electrical signal to the plurality of sub-pixels, orthogonal projections of the plurality of pins on the substrate being distributed at intervals along a first direction and extending along a second direction, the first direction intersecting the second direction;

the plurality of extension pads are positioned on one side of the plurality of pins far away from the display area, are distributed at intervals along the first direction and extend along the second direction, each of the plurality of extension pads comprises a signal wire, and the conducting layers of the plurality of pins are electrically connected with the signal wires of the plurality of extension pads;

a plurality of partition structures located between the plurality of elongated pads and extending along the second direction, the partition structures penetrating the substrate base plate and configured to electrically insulate the plurality of elongated pads, an orthographic projection of the plurality of partition structures on the substrate base plate and an orthographic projection of the plurality of elongated pads on the substrate base plate do not overlap.

2. The display panel according to claim 1, wherein the conductive layers of the plurality of pins and the signal lines of the plurality of extended pads are electrically connected in a one-to-one correspondence.

3. The display panel according to claim 1, wherein the plurality of partition structures and the plurality of extension pads are alternately arranged one by one.

4. The display panel according to claim 1, wherein the extension pad comprises:

and the partition structure penetrates through the at least one first insulating layer.

5. The display panel of any of claims 1-4, wherein the extended pad further comprises:

and the at least one second insulating layer is positioned on one side of the signal line close to the substrate base plate, and the partition structure penetrates through the at least one second insulating layer.

6. The display panel according to claim 5,

the partition structure comprises a through groove, the through groove is located between the adjacent extension pads, and the through groove penetrates through the at least one first insulating layer, the at least one second insulating layer and the substrate base plate.

7. The display panel according to claim 6, wherein the through groove has a first groove wall and a second groove wall that are oppositely arranged in the first direction, and a third groove wall in the second direction, the third groove wall connecting the first groove wall and the second groove wall.

8. The display panel according to claim 1, characterized in that the display panel comprises:

open groove is located bind the district, open groove runs through at least the signal line of a plurality of extension pads is in order to form uncovered, open groove is in the orthographic projection of substrate base plate is followed first direction extends, just open groove is in the orthographic projection of substrate base plate with it is in to cut off the structure orthographic projection on the substrate base plate and intersect.

9. The display panel according to claim 1, wherein the material of the base substrate comprises a polyimide material.

10. The display panel of claim 1, wherein an orthographic projection of the partition structure on the substrate base plate has a first length along the second direction, the pin has a second length along the second direction at the bonding region, and a ratio of the first length to the second length is: 0.2 to 1.

11. A method for manufacturing a display panel, comprising:

providing a substrate, wherein the substrate comprises a display area and a binding area positioned on at least one side of the display area;

forming a plurality of sub-pixels and a plurality of pins on one side of the substrate, wherein the plurality of sub-pixels are located in the display area, the plurality of pins are located in the bonding area, each of the plurality of pins comprises a conductive layer, the plurality of pins are configured to transmit electrical signals to the plurality of sub-pixels, orthographic projections of the plurality of pins on the substrate are distributed at intervals along a first direction and extend along a second direction, and the first direction intersects the second direction;

forming a plurality of extension pads, wherein the extension pads are positioned on one sides of the pins far away from the display area, and the extension pads are correspondingly connected with the pins;

performing a cutting process on the extension pad;

and forming a partition structure between the adjacent extension pads, wherein the partition structure penetrates through the substrate base plate.

12. A display device, comprising:

the display panel of any one of claims 1-10;

and the circuit board is provided with a plurality of signal pins which are connected with the plurality of pins in the display panel in a one-to-one correspondence manner.

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