WO2021147851A1

WO2021147851A1 - Display panel and display device

Info

Publication number: WO2021147851A1
Application number: PCT/CN2021/072683
Authority: WO
Inventors: 马俊超; 李元; 谢嘉铭
Original assignee: 华为技术有限公司
Priority date: 2020-01-21
Filing date: 2021-01-19
Publication date: 2021-07-29

Abstract

The embodiments of the present application provide a display panel and a display device. The display panel comprises: a display region, a first non-display region and at least one through hole, the first non-display region surrounding the through hole, and the display region surrounding the first non-display region; at least one crack detection line located in the first non-display region, the crack detection line being provided along the edge of the first non-display region close to one side of the through hole; and at least two lead-out lines located in the display region, both ends of one crack detection line being electrically connected to the two lead-out lines respectively. The display panel comprises a base substrate, an array layer, a display layer and a packaging layer which are stacked in sequence, wherein the crack detection line and the lead-out lines are all located between the base substrate and the packaging layer. In the present application, cracks at the edge of the through hole can be detected at a module stage, thereby preventing unqualified products from entering into a subsequent working stage, and improving the product yield; moreover, the connection performance between the crack detection line and the lead-out lines is reliable, thereby reducing the risk of disconnection.

Description

Display panel and display device

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on January 21, 2020, the application number is 202010071778.7, and the invention title is "a display panel and display device"; and it is filed in China on November 24, 2020 Patent Office, application number is PCT/CN2020/131129, invention title is "a display panel and display device" international patent application priority. The entire content of the above-mentioned application is incorporated into this application by reference.

Technical field

This application relates to the field of display technology, and more specifically to a display panel and a display device.

Background technique

With the application of display technology in smart wearables and other portable electronic devices, the design of electronic products is constantly pursuing a smooth user experience, and at the same time, it is increasingly pursuing a better visual experience. The high screen-to-body ratio has become the current research Focus. In the current solution, a through hole is formed by cutting the display panel, and a device such as a camera is arranged at a position corresponding to the through hole, so that the screen-to-body ratio can be increased. For organic light-emitting display panels with through holes, when they are impacted and squeezed by external forces during the manufacturing process, cracks may occur in the packaging structure in the panel or the inorganic insulating layer in the array layer, thereby forming water and oxygen channels, and then It causes the luminescent material in the display layer to fail, and it appears as a black spot when the panel is lit, which affects the display effect.

Therefore, to provide a display panel and a display device capable of detecting cracks at the edge of the through hole at the display panel module stage, and avoiding the panel with cracks on the edge from flowing into the subsequent process to affect the product yield, which is a technical problem to be solved urgently in this field.

Summary of the invention

In view of this, the present application provides a display panel and a display device, which solves the technical problem of detecting cracks on the edge of the through hole at the stage of the display panel module.

In a first aspect, an embodiment of the present application provides a display panel. The display panel includes a display area, a first non-display area, and at least one through hole, the first non-display area surrounds the through hole, and the display area surrounds the first non-display area;

At least one crack detection line located in the first non-display area, the crack detection line is arranged along the edge of the first non-display area on the side close to the through hole;

At least two lead wires located in the display area, and both ends of a crack detection line are electrically connected to the two lead wires respectively;

The display panel includes a base substrate, an array layer, a display layer, and an encapsulation layer stacked in sequence; wherein the crack detection line and the lead wire are located between the base substrate and the encapsulation layer.

Optionally, a crack detection line forms a non-closed trace around the through hole, and the extension directions of the two lead wires corresponding to the crack detection line are the same.

Optionally, at least two crack detection lines are respectively routed along different positions of the edge of the through hole, and form a non-closed route around the through hole.

In some optional embodiments, the crack detection line and the lead line are made of the same layer and the same material.

In an embodiment, the display layer includes an anode layer, and the anode layer includes a plurality of mutually insulated anodes; wherein the crack detection line and the lead line are both located in the anode layer, and the lead line is routed between adjacent anodes.

In an embodiment, the array layer includes a gate metal layer, a capacitor metal layer, a source and drain metal layer, and a wiring metal layer arranged in sequence on the base substrate; wherein, the crack detection line and the lead wire are located in the wiring metal layer. Floor.

In an embodiment, the array layer includes a gate metal layer, a capacitor metal layer, and a source-drain metal layer arranged in sequence on the base substrate; the display layer includes an anode layer, and the anode layer includes a plurality of mutually insulated anodes; wherein , The crack detection line and the lead-out line are located in the capacitor metal layer;

The display panel also includes a plurality of initialization signal lines. The initialization signal lines are used to reset the anode. The initialization signal lines are located on the anode layer and are routed between adjacent anodes.

In some optional embodiments, the crack detection line and the lead line are located in different metal layers, and the crack detection line is electrically connected to the lead line through a via hole.

In an embodiment, the array layer includes a gate metal layer, a capacitor metal layer, and a source-drain metal layer arranged in sequence on the base substrate; the display layer includes an anode layer, and the anode layer includes a plurality of mutually insulated anodes; wherein ,

In the crack detection line and the lead line: one is located in the capacitor metal layer, and the other is located in the anode layer.

In an embodiment, the array layer includes a gate metal layer, a capacitor metal layer, a source and drain metal layer, and a wiring metal layer arranged in sequence on the base substrate; wherein,

In the crack detection line and the lead-out line: one is located in the source and drain metal layer, and the other is located in the trace metal layer.

Based on the same inventive concept, in the second aspect, an embodiment of the present application further provides a display device, including the display panel provided by any embodiment of the present application.

The display panel and the display device provided by the present application have the following beneficial effects: a crack detection line is arranged around the through hole, and both ends of the crack detection line are respectively connected to a lead wire, and the lead wire can be connected to the display panel after being routed in the display area. In the non-display area of the frame, the resistance change on the crack detection line between the two lead wires is detected to determine whether there is a crack around the through hole. When there are cracks around the through hole, the crack detection line will break as the crack occurs, and the resistance on the crack detection line will be very large. That is, when the display panel is inspected in the module stage, when the resistance on the crack detection line is very large, the display panel is judged as unqualified, and there is no need to flow into the subsequent work section, so that the inferior products can be screened and improved. Product yield. At the same time, the crack detection line and the lead line are set between the base substrate and the packaging layer. When the crack detection line and the lead line are made of the same layer and the same material, the crack detection line and the lead line are contacted and connected without additional production. The hole process is simple to make; when the crack detection line and the lead line are located in different metal layers, the thickness of the insulating layer between the crack detection line and the lead line is not too thick, and the crack detection line and the lead line can be between The via-hole connection performance is also relatively reliable, and there will be no problem of disconnection.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present invention more clearly, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative work, other drawings can be obtained from these drawings.

FIG. 1A is a schematic diagram of an optional implementation manner of a display panel provided by an embodiment of this application;

FIG. 1B is a schematic diagram of comparison between a display panel provided by an embodiment of the application and the prior art;

Fig. 2 is a schematic cross-sectional view of an alternative embodiment at the position of the tangent line A-A' in Fig. 1A;

FIG. 3 is a schematic diagram of another alternative implementation manner of the display panel provided by the embodiment of the application;

4 is a partial schematic diagram of another alternative implementation method of the display panel provided by the embodiment of the application;

Fig. 5 is a schematic cross-sectional view at the position of the tangent line B-B' in Fig. 4;

Fig. 6 is a schematic cross-sectional view of another alternative embodiment at the position of the tangent line A-A' in Fig. 1A;

FIG. 7 is a schematic diagram of another optional implementation manner of a display panel provided by an embodiment of the application;

FIG. 8 is a partial schematic diagram of another optional implementation manner of a display panel provided by an embodiment of the application; FIG.

Fig. 9 is a schematic cross-sectional view of another alternative embodiment at the position of the tangent line C-C' in Fig. 8;

Fig. 10 is a schematic cross-sectional view of another alternative embodiment at the position of the tangent line A-A' in Fig. 1A;

Fig. 11 is a schematic cross-sectional view of another alternative embodiment at the position of the tangent line A-A' in Fig. 1A;

FIG. 12 is a schematic diagram of a display device provided by an embodiment of the application.

Detailed ways

In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms of "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

The embodiment of the present application provides a display panel and a display device. A crack detection line is arranged around a through hole. The two ends of the crack detection line are respectively connected to a lead wire. After the lead wire is routed in the display area, it can be connected to the frame of the display panel. In the display area, by detecting the resistance change on the crack detection line between the two lead wires, it is judged whether there is a crack around the through hole. When there are cracks around the through hole, the crack detection line will break as the crack occurs, and the resistance on the crack detection line will be very large. That is, when the display panel is inspected in the module stage, when the resistance on the crack detection line is very large, the display panel is judged as unqualified, and there is no need to flow into the subsequent work section, so that the inferior products can be screened and improved. Product yield. At the same time, in the embodiment of the application, the crack detection line and the lead wire are set between the base substrate and the packaging layer. When the crack detection line and the lead wire are made of the same layer and the same material, the crack detection line and the lead wire are in contact and connected , No additional via process is required, and the production is simple; when the crack detection line and the lead line are located in different metal layers, the thickness of the insulating layer between the crack detection line and the lead line is not too thick, and the crack detection line is not too thick. The via connection performance between the lead wires is also relatively reliable, and there will be no problem of disconnection.

The above is the central idea of the application, and the application will be illustrated in detail with specific examples below.

FIG. 1A is a schematic diagram of an optional implementation manner of a display panel provided by an embodiment of the application. FIG. 1B is a schematic diagram of comparison between a display panel provided by an embodiment of this application and the prior art; FIG. 2 is a schematic cross-sectional view of an alternative implementation at the position of the tangent line A-A' in FIG. 1A.

As shown in FIG. 1A, the display panel includes a display area AA, a first non-display area BA1 and at least one through hole K, the first non-display area BA1 surrounds the through hole K, and the display area AA surrounds the first non-display area BA1; FIG. 1A The shape of the middle through hole K is only a schematic representation, and can be designed according to specific requirements in practice. The through hole K penetrates the display panel in the thickness direction of the display panel. When the display panel is assembled into a display device, the position corresponding to the through hole K may be provided with an optical element, such as a camera.

At least one crack detection line LX is located in the first non-display area BA1, and the crack detection line LX is arranged along the edge of the first non-display area BA1 on the side close to the through hole K.

At least two lead wires Y located in the display area AA, and both ends of a crack detection line LX are electrically connected to the two lead wires Y respectively.

FIG. 1B illustrates a partial structure of a display panel in the prior art and a partial structure of a display panel provided by an embodiment of the present application. As shown in FIG. 1B, the display area AA of the display panel has a through hole K. The through hole K is shown as a rectangle. There is a first non-display area BA1 surrounding the through hole K. The inside of the display panel is close to the through hole K. The edge of the package and some signal lines arranged around the through hole K form the first non-display area BA1. A signal line 21 extending in the first direction x and a signal line 22 extending in the second direction y are provided in the display area AA. The figure shows that part of the signal lines 22 extend in the display area AA and cut off at the through hole K, part of the signal lines 21 extend in the display area AA and cut off at the through hole K, and part of the signal line 21 extends to the position of the through hole K. When winding along the edge of the through hole K. Since the display panel has through holes, when the display panel is impacted and squeezed by external forces during the manufacturing process, the packaging structure in the panel or the inorganic insulating layer in the array layer may have cracks, thereby forming water and oxygen pathways, thereby causing the display layer The luminescent material in has failed. The left diagram of FIG. 1B illustrates the structure of the display panel in the prior art, and the right diagram of FIG. 1B illustrates the structure of the display panel provided by an embodiment of the present application. Compared with the prior art, the embodiment of the present application is provided with a crack detection line LX along the edge of the through hole K, and both ends of the crack detection line LX are respectively connected to a lead line Y, and the crack detection between the two lead lines Y is detected. The resistance change on the line LX can determine whether there is a crack around the through hole K, and can realize the detection of the display panel at the module stage, realize the screening of defective products, and improve the yield of the manufactured products.

As shown in FIG. 1A, the display panel also includes a peripheral non-display area BAZ, and the peripheral non-display area BAZ is arranged around the display area AA. The lead line Y connected to the crack detection line LX is drawn from the display area AA and then extends to the peripheral non-display area BAZ.

In one embodiment, a test board (not shown in the figure) is provided in the peripheral non-display area BAZ, and each lead wire Y is electrically connected to one test board, that is, one crack detection line LX corresponds to two test boards. In the detection stage, when the crack detection line LX is not broken, a specific resistance value can be detected through the two test boards; when there is a crack around the through hole, the crack detection line LX is broken with the crack, and the two test boards are tested The resistance value obtained is infinite. Therefore, it is possible to determine whether the crack detection line is broken according to the detection result of the resistance value, and then whether there is a crack around the through hole.

Optionally, the peripheral non-display area BAZ includes the binding area BD, and the test board is located in the binding area, that is, the lead line Y extends from the display area AA to the peripheral non-display area BAZ, and then passes through the peripheral non-display area BAZ. Connect the signal wire to the test board.

With continued reference to FIG. 2, the display panel includes a base substrate 101, an array layer 102, a display layer 103 and an encapsulation layer 104 stacked in sequence. Wherein, the base substrate 101 may be a flexible substrate, and its manufacturing material may be polyimide. The array layer 102 includes a plurality of pixel circuits, and the structure of the pixel circuit is complicated. Only one transistor T in the pixel circuit is shown in the figure. The display layer 103 includes a pixel definition layer PDL and a plurality of light-emitting devices P. The light-emitting device P includes an anode a, a light-emitting layer b, and a cathode layer c. The anode a is located in the anode layer. Normally, the cathode layer c is a whole layer, and the light-emitting layer b Including organic light-emitting materials. The encapsulation layer 104 includes two inorganic encapsulation layers 104w and one organic encapsulation layer 104j. The encapsulation layer 104 covers and surrounds the display layer 103, and is used to isolate water and oxygen to protect the light-emitting device. As shown in the figure, a barrier wall Q is also provided in the first non-display area BA1, and the edge of the organic packaging layer 104j in the packaging layer 104 is located on the side of the barrier wall Q close to the display area AA.

In this application, the crack detection line LX and the lead line Y are both located between the base substrate 101 and the packaging layer 104. The crack detection line LX and the lead line Y can be located in the metal layer in the array layer 102 or the metal layer in the display layer 103. The crack detection line LX and the lead line Y can be in the same layer or in different layers. There are many situations for the setting of the film position of the crack detection line and the lead line, which will be described in the following embodiments. As shown in Figure 2, only the crack detection line LX is located in the source-drain metal layer M3 and the outlet line Y is located in the wiring metal layer M4. The source and drain of the transistor T are located in the source-drain metal layer M3, and the wiring metal layer M4 is located on the side of the source and drain metal layer M3 close to the display layer 103.

The display panel provided by the embodiment of the present application includes a base substrate, an array layer, a display layer, and an encapsulation layer arranged in sequence. The crack detection line is arranged between the base substrate and the encapsulation layer, and the crack detection line is spaced from the inorganic insulating layer in the array layer. The distance between, and the distance from the inorganic encapsulation layer in the encapsulation layer are relatively short. The crack detection line can detect cracks in the inorganic insulating layer in the array layer and can also detect cracks in the inorganic encapsulation layer in the encapsulation layer. The display panel can be tested and screened at the module stage to improve the product yield.

At the same time, the inventor thinks that if the lead wire connecting the crack detection line is arranged on the side of the packaging layer away from the base substrate, there will be a risk of loss of the detection function or a risk of the width of the first non-display area being too large. For example, in a display panel with a touch metal layer on the side of the packaging layer away from the base substrate, the crack detection line is provided in the metal layer of the array layer (such as the gate metal layer, the capacitor metal layer or the source/drain metal layer). Middle), the lead wire located in the display area is arranged on the touch metal layer, and the lead wire is connected with the crack detection line through a via hole. In the panel production process, the array layer, the display layer, the encapsulation layer and the touch metal layer need to be produced in sequence. Taking the crack detection line located in the capacitor metal layer as an example, the film layer spaced between the crack detection line and the lead line is at least Including: the insulating layer between the capacitor metal layer and the source/drain metal layer, the insulating layer between the source/drain metal layer and the display, the pixel definition layer in the display layer, and the encapsulation layer. Therefore, there are many film layers between the crack detection line and the touch metal layer. In particular, the organic encapsulation layer in the encapsulation layer is usually made by an inkjet printing process, and its thickness is much thicker than a general inorganic insulating layer. In order to realize the electrical connection between the crack detection line and the lead-out line, it is necessary to make an opening process on a very thick layer composed of multiple film layers. The depth of the opening is very deep, and it may be possible to use an etching process for etching. There is a risk of incomplete etching of part of the film, resulting in poor electrical connection between the crack detection line and the lead wire at the opening position, resulting in an open circuit, and thus losing the function of detecting cracks. Taking into account that in order to reduce the risk of open circuit and ensure a good connection between the crack detection line and the lead wire, the size of the opening can be increased, but the larger opening size will lead to the area of the first non-display area If it becomes larger, that is, the area of the non-display area (the first non-display area plus the through hole) surrounded by the display area becomes larger, which seriously affects the display effect.

Based on the above problems, in the embodiment of the application, the lead wire is set between the base substrate and the packaging layer. When the lead wire and the crack detection wire are located in the same metal layer, the lead wire and the crack detection wire are made in the same etching process. It is completed to ensure good contact between the lead wire and the crack detection wire. When the lead wire and the crack detection line are located in different metal layers, there is less insulating layer between the film layer where the lead wire is located and the film layer where the crack detection line is located, and the thickness of the insulating layer is relatively thin, which is used to connect the lead wire and the crack. The size of the opening of the detection wire does not need to be large, and a good electrical connection between the lead wire and the crack detection wire can also be ensured. The embodiments of the present application can ensure the reliability of the crack detection function, and will not affect the size of the first non-display area.

In an embodiment, referring to FIG. 1A continuously, a crack detection line LX forms a non-closed trace around the through hole K, and the extension direction of the two lead lines Y corresponding to the crack detection line LX is the same. The display panel includes data lines and scan lines. The extension direction of the lead lines located in the display area can be the same as the extension direction of the data lines, and the extension direction of the lead lines located in the display area can also be the same as the extension direction of the scan lines. In practice It can be designed according to the position of the film layer where the lead wires are located, as long as the wires that transmit different signals are insulated from each other. In this embodiment, a crack detection line is provided around the through hole, which can realize the detection of cracks at the edge of the through hole, and can complete the crack detection by only performing resistance detection once. The detection method is simple and time-consuming.

In some embodiments, at least two crack detection lines LX are respectively routed along different positions of the edge of the through hole K, and form a non-closed route around the through hole K. Specifically, in an embodiment, as shown in FIG. 3, FIG. 3 is a schematic diagram of another optional implementation manner of the display panel provided by the embodiment of the application. Two crack detection lines LX are provided around the through hole K, and each crack detection line LX corresponds to a different position of the detection through hole K. When performing crack detection, selective detection can be performed according to the detection needs of different parts.

In some alternative embodiments, the crack detection wire and the lead wire are made of the same layer and the same material. The crack detection line and the lead wire are made in the same etching process, and the crack detection line and the lead wire are directly connected to each other. There is no problem that the via connection is poor and the circuit breaks and the crack detection function is lost. Among them, the crack detection line and the lead line can be made by using the original metal layer in the display panel, or an additional metal layer can also be added to the panel to make the crack detection line and the lead line.

In an embodiment, FIG. 4 is a partial schematic diagram of another alternative implementation method of the display panel provided by the embodiment of the application. Fig. 5 is a schematic cross-sectional view at the position of the tangent line B-B' in Fig. 4. 4 and 5 at the same time, the display layer 103 includes an anode layer Ca, the anode layer Ca includes a plurality of mutually insulated anodes a; wherein the crack detection line LX and the lead line Y are located in the anode layer Ca, and the lead line Y is routed between adjacent anodes a. In this embodiment, the crack detection line and the lead line can be simultaneously formed in the anode patterning process. The setting of the crack detection line and the lead-out line does not need to increase the new manufacturing process, and it will not affect the manufacturing process of other film layers in the panel, which is a simplified manufacturing process. At the same time, the anode is only located in the display area, that is, there is no metal wire made of the anode layer in the first non-display area surrounding the through hole, and the crack detection line located in the first non-display area is made of the anode layer without affecting the first non-display area. A wiring design in the non-display area; and there is enough space between adjacent anodes, and the lead wires are arranged between adjacent anodes for routing, which will not affect the size of the anodes, and has no effect on the display effect.

In an embodiment, FIG. 6 is a schematic cross-sectional view of another alternative embodiment at the position of the tangent line A-A' in FIG. 1A. As shown in FIG. 6, the array layer 102 includes a gate metal layer M1, a capacitor metal layer (not shown in the figure), a source and drain metal layer M3, and a wiring metal layer M4 arranged in sequence on the base substrate; The scan line and the gate of the transistor are located on the gate metal layer M1, one plate of the pixel capacitor is located on the capacitor metal layer, and the data line in the display panel and the source and drain of the transistor are located on the source/drain metal layer M3. Among them, the crack detection line LX and the lead line Y are located in the wiring metal layer M4. In this embodiment, the trace metal layer is added to make the crack detection line and the lead line. The crack detection line and the lead line are made in the same etching process, and the crack detection line and the lead line are directly contacted and connected. Poor hole connection leads to open circuit and loss of crack detection function. At the same time, there is no need to change the manufacturing process of other film structures, and the manufacturing is relatively simple.

Further, as shown in FIG. 7, FIG. 7 is a schematic diagram of another alternative implementation manner of the display panel provided by the embodiment of the application. The display panel also includes a plurality of positive power supply lines VDD extending along the first direction x. The positive power supply line VDD is located in the source and drain metal layer. When the light emitting device is driven to emit light, the positive power supply line VDD is used to provide the positive power supply voltage to the pixel circuit. Signal. On the basis of the embodiment corresponding to FIG. 6, the auxiliary power line FD can be made by using the added wiring metal layer M4. The auxiliary power line FD extends in the second direction y in the display area, and the auxiliary power line FD is connected to the positive power line VDD. Crossed and electrically connected, that is, connected through a via where the auxiliary power line FD overlaps with the positive power line VDD. When driving the display panel, the auxiliary power line FD also transmits the positive power voltage signal, the auxiliary power line FD The setting of can reduce the voltage drop of the positive power supply voltage signal and reduce the power loss. The auxiliary power line FD is made in the same process as the crack detection line and the lead line, and the extension direction of the lead line is the same as the extension direction of the auxiliary power line FD.

Further, taking the positive power supply line VDD extending along the first direction x in FIG. 7 as an example, the display panel also includes a plurality of initialization signal lines (not shown in FIG. 7), and the initialization signal lines are used to reset the anode. The initialization signal line extends along the second direction y and is located on the capacitor metal layer. Optionally, an additional wiring metal layer M4 is used to make auxiliary initialization signal lines, the auxiliary initialization signal lines extend along the first direction x in the display area, and the auxiliary initialization signal lines cross and are electrically connected to the initialization signal lines, that is, The area where the auxiliary initialization signal line overlaps the initialization signal line is connected by a via hole. When driving the display panel, the auxiliary initialization signal line also transmits the initialization signal. The setting of the auxiliary initialization signal line can reduce the voltage drop of the initialization signal. Power loss.

In an embodiment, FIG. 8 is a partial schematic diagram of another alternative implementation of the display panel provided by the embodiment of the application. Fig. 9 is a schematic cross-sectional view of another alternative embodiment at the position of the tangent line C-C' in Fig. 8. As shown in FIGS. 8 and 9, the array layer 102 includes a gate metal layer M1, a capacitor metal layer M2, and a source-drain metal layer M3 arranged in sequence on the base substrate 101; the display layer 103 includes an anode layer Ca, an anode layer Ca includes a plurality of mutually insulated anodes a; among them, the crack detection line LX and the lead line Y are located in the capacitor metal layer M2; the display panel also includes a plurality of initialization signal lines R, which are used to reset and initialize the anode a The signal line R is located in the anode layer Ca, and is routed between adjacent anodes a. In the pixel circuit structure, the initialization signal line R needs to be connected to the semiconductor layer 1021 in the array layer 102. In this embodiment, the initialization signal line R is located at the anode layer, and the separation distance between the initialization signal line R and the semiconductor layer 1021 is relatively large, and at least one connecting portion LJ can be provided between the initialization signal line R and the semiconductor layer 1021 to connect The portion LJ may be located in at least one of the gate metal layer M1, the capacitor metal layer M2, or the source-drain metal layer M3. In FIG. 9, the connection portion LJ is provided in the capacitor metal layer M2 for illustration. The initialization signal line R is electrically connected to the connection portion LJ through the via hole, and the connection portion LJ is electrically connected to the semiconductor layer 1021 through the via hole, thereby achieving electrical connection between the initialization signal line R and the semiconductor layer 1021. The arrangement of the connecting portion LJ can prevent the hole from being too deep in the etching process to cause incomplete etching, resulting in poor contact and open circuit.

In some optional embodiments, the crack detection line and the lead line are located in different metal layers, and the crack detection line is electrically connected to the lead line through a via hole. The crack detection line and the lead line are located between the base substrate and the packaging layer, so there is less insulating layer between the film layer where the lead line is located and the film layer where the crack detection line is located, and the thickness of the insulating layer is relatively thin. The size of the opening connecting the lead wire and the crack detection line does not need to be large, and a good electrical connection between the lead wire and the crack detection line can also be ensured. Therefore, the reliability of the crack detection function can be ensured, and the size of the first non-display area will not be affected.

In an embodiment, FIG. 10 is a schematic cross-sectional view of another alternative embodiment at the position of the tangent line A-A' in FIG. 1A. As shown in FIG. 10, the array layer 102 includes a gate metal layer M1, a capacitor metal layer M2, and a source-drain metal layer M3 arranged in sequence on the base substrate 101; the display layer 103 includes an anode layer Ca, and the anode layer Ca includes multiple Two mutually insulated anodes a; among them, the crack detection line LX is located in the capacitor metal layer M2, and the lead line Y is located in the anode layer Ca. The plate of the pixel capacitor is located on the capacitor metal layer, and the initialization signal line in the panel can also be located on the capacitor metal layer. The initialization signal line can be set to cut off in the first non-display area, and the capacitor metal layer is not used at the position near the edge of the through hole. To make the signal lines in the panel, the embodiment of the application sets the crack detection line to be located in the capacitor metal layer, the crack detection line will not be short-circuited with other signal lines, and will not affect the frame width of the first non-display area. At the same time, if the lead wires are arranged between adjacent anodes, there are only insulating layers and source and drain metals between the capacitor metal layer and the source and drain metal layers between the film layer where the lead wires are located and the film layer where the crack detection line is located. The insulating layer between the layer and the display layer. The thickness of the insulating layer is small, which reduces the risk of incomplete corrosion at the time of making the via hole and the connection disconnection. The size of the opening connecting the lead wire and the crack detection wire does not need to be large to ensure a good electrical connection, thereby ensuring a good electrical connection. The reliability of the crack detection function.

In another embodiment, the crack detection line is located in the anode layer, and the lead line is located in the capacitor metal layer, which is not shown here.

In an embodiment, FIG. 11 is a schematic cross-sectional view of another alternative embodiment at the position of the tangent line A-A' in FIG. 1A. As shown in FIG. 11, the array layer 102 includes a gate metal layer M1, a capacitor metal layer, a source/drain metal layer M3, and a wiring metal layer M4 arranged in sequence on the base substrate 101; among them, the crack detection line LX is located at the source The drain metal layer M3 and the lead line Y are located on the wiring metal layer M4. The data lines in the display panel are located on the source and drain metal layers. Generally, the data lines located on both sides of the through holes in the extension direction of the data lines are electrically connected by winding wires. The winding wires are located in the first non-display area and arranged halfway around the through holes. When the winding is also located in the source and drain metal layer, the crack detection line is set on the side of the winding away from the display area, that is, the crack detection line is set at the outer edge of the first non-display area, so as to avoid the crack detection line Short circuit with winding wire. The lead wires are located on the wiring metal layer, and there is only one insulating layer between the wiring metal layer and the source and drain metal layers. The thickness of the insulating layer is small, which reduces the risk of incomplete corrosion at the time of making the via hole and the connection open circuit. The size of the opening connecting the lead wire and the crack detection wire does not need to be large to ensure a good electrical connection, thereby ensuring the reliability of the crack detection function.

Further, the auxiliary positive power supply line can be made by using the wiring metal layer, and the arrangement of the auxiliary power supply line can reduce the voltage drop of the positive supply voltage signal and reduce the power consumption loss. Alternatively, the auxiliary initialization signal line can also be made by using a wiring metal layer, and the arrangement of the auxiliary initialization signal line can reduce the voltage drop of the initialization signal and reduce the power loss.

In another embodiment, the crack detection line is located in the wiring metal layer, and the lead-out line is located in the source and drain metal layer, which is not shown here.

Based on the same inventive concept, an embodiment of the present application also provides a display device. FIG. 12 is a schematic diagram of the display device provided by the embodiment of the present application. As shown in Fig. 12, the display device includes the display panel 100 provided by any embodiment of the present application. The specific structure of the display panel 100 has been described in detail in the above-mentioned embodiments, and will not be repeated here. Of course, the display device shown in FIG. 12 is only for schematic illustration, and the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic paper book, or a television.

The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the present invention. Within the scope of protection.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that it is still The technical solutions recorded in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention .

Claims

A display panel, wherein the display panel includes a display area, a first non-display area and at least one through hole, the first non-display area surrounds the through hole, and the display area surrounds the first Non-display area

At least one crack detection line located in the first non-display area, the crack detection line being arranged along the edge of the first non-display area on the side close to the through hole;

At least two lead wires located in the display area, and two ends of the crack detection line are electrically connected to the two lead wires respectively;

The display panel includes a base substrate, an array layer, a display layer, and an encapsulation layer stacked in sequence; wherein,

The crack detection line and the lead line are both located between the base substrate and the packaging layer.
The display panel of claim 1, wherein:

One of the crack detection lines forms a non-closed trace around the through hole, and the extension directions of the two lead wires corresponding to the crack detection line are the same.
The display panel of claim 1, wherein:

At least two of the crack detection lines are respectively routed along different positions of the edge of the through hole, and form a non-closed route around the through hole.
The display panel of claim 1, wherein:

The crack detection wire and the lead wire are made of the same layer and the same material.
The display panel of claim 4, wherein:

The display layer includes an anode layer, and the anode layer includes a plurality of mutually insulated anodes; wherein,

The crack detection line and the lead-out line are both located in the anode layer, and the lead-out line is routed between adjacent anodes.
The display panel of claim 4, wherein:

The array layer includes a gate metal layer, a capacitor metal layer, a source and drain metal layer, and a wiring metal layer arranged in sequence on the base substrate; wherein,

The crack detection wire and the lead wire are located in the wire metal layer.
The display panel of claim 4, wherein:

The array layer includes a gate metal layer, a capacitor metal layer, and a source-drain metal layer arranged in sequence on the base substrate;

The display layer includes an anode layer, and the anode layer includes a plurality of mutually insulated anodes; wherein,

The crack detection line and the lead-out line are located in the capacitor metal layer;

The display panel further includes a plurality of initialization signal lines, the initialization signal lines are used to reset the anode, and the initialization signal lines are located in the anode layer and routed between adjacent anodes.
The display panel of claim 1, wherein:

The crack detection wire and the lead wire are located in different metal layers, and the crack detection wire is electrically connected to the lead wire through a via hole.
8. The display panel of claim 8, wherein:

The array layer includes a gate metal layer, a capacitor metal layer, and a source-drain metal layer arranged in sequence on the base substrate;

The display layer includes an anode layer, and the anode layer includes a plurality of mutually insulated anodes; wherein,

Of the crack detection line and the lead-out line: one is located in the capacitor metal layer, and the other is located in the anode layer.
8. The display panel of claim 8, wherein:

The array layer includes a gate metal layer, a capacitor metal layer, a source and drain metal layer, and a wiring metal layer arranged in sequence on the base substrate; wherein,

Among the crack detection lines and the lead wires: one is located in the source and drain metal layer, and the other is located in the wiring metal layer.
A display device, characterized by comprising the display panel according to any one of claims 1 to 10.