CN114337372A - MEMS energy collector and manufacturing method thereof - Google Patents
MEMS energy collector and manufacturing method thereof Download PDFInfo
- Publication number
- CN114337372A CN114337372A CN202210158870.6A CN202210158870A CN114337372A CN 114337372 A CN114337372 A CN 114337372A CN 202210158870 A CN202210158870 A CN 202210158870A CN 114337372 A CN114337372 A CN 114337372A
- Authority
- CN
- China
- Prior art keywords
- substrate
- magnetic core
- coil
- cantilever beam
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims description 30
- 239000002131 composite material Substances 0.000 claims description 15
- 230000006698 induction Effects 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 8
- 238000011049 filling Methods 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 3
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 2
- 239000000725 suspension Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 238000005530 etching Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Landscapes
- Micromachines (AREA)
Abstract
The invention aims to provide an MEMS energy collector and a manufacturing method thereof, which can improve the conversion efficiency between the vibration mechanical energy and the electric energy of a magnetic element. In order to solve the above problems, the present invention provides a MEMS energy harvester, comprising: the substrate is provided with a hollow part; a magnetic core movably disposed within the hollow portion; a coil embedded in the substrate and disposed around the magnetic core and the hollow portion; the cantilever beam is connected with the magnetic core and the substrate, and a piezoelectric material layer is arranged in the cantilever beam. According to the MEMS energy collector, the magnetic core is accurately arranged in the plane where the coil is located and is suspended through the piezoelectric material layer. Therefore, when the magnetic core moves, kinetic energy can be converted into electric energy through the coil and the piezoelectric material layer at the same time with the maximum efficiency, and the energy collection efficiency is improved.
Description
Technical Field
The invention relates to the field of micro machinery, in particular to an MEMS energy collector and a manufacturing method thereof.
Background
Energy harvesters are an important component in the field of micro-mechanics. The element collects electromagnetic wave energy in the environment through resonance of the magnetic element and converts the electromagnetic wave energy into electric energy. The element can be used for signal acquisition and signal conversion, and can also be reversely used as energy output. An important problem to be solved by the element, regardless of the application, is how efficiently to achieve the conversion between the vibrating mechanical energy and the electrical energy of the magnetic element.
Disclosure of Invention
The invention aims to provide an MEMS energy collector and a manufacturing method thereof, which can improve the conversion efficiency between the vibration mechanical energy and the electric energy of a magnetic element.
In order to solve the above problems, the present invention provides a MEMS energy harvester, comprising: the substrate is provided with a hollow part; a magnetic core movably disposed within the hollow portion; a coil embedded in the substrate and disposed around the magnetic core and the hollow portion; the cantilever beam is connected with the magnetic core and the substrate, and a piezoelectric material layer is arranged in the cantilever beam.
In order to solve the above problems, the present invention provides a method for manufacturing an MEMS energy harvester, comprising the steps of: providing a substrate; embedding a coil in the substrate; forming a cantilever beam on the surface of the coil, wherein the cantilever beam comprises a piezoelectric material layer; and hollowing out the position surrounded by the coil in the substrate to form a hollow part, and forming a suspended magnetic core in the hollow part, wherein the magnetic core is fixedly connected with the suspended part of the cantilever beam.
According to the energy collector, the magnetic core is accurately arranged in the plane where the coil is located and is suspended through the piezoelectric material layer. Therefore, when the magnetic core moves, kinetic energy can be converted into electric energy through the coil and the piezoelectric material layer at the same time with the maximum efficiency, and the energy collection efficiency is improved.
Drawings
Fig. 1 is a schematic diagram illustrating implementation steps of a specific embodiment of a method for manufacturing an MEMS energy harvester according to the present invention.
Fig. 2A to 2H are process flow diagrams illustrating a specific embodiment of a method for manufacturing an MEMS energy harvester according to the present invention.
Fig. 3 is a schematic diagram illustrating implementation steps of a specific embodiment of a method for manufacturing an MEMS energy harvester according to the present invention.
Fig. 4A to 4C are process flow diagrams illustrating a specific embodiment of a method for manufacturing an MEMS energy harvester according to the present invention.
Detailed Description
The following describes in detail specific embodiments of the MEMS energy harvester and the method for manufacturing the same according to the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic diagram illustrating implementation steps of a specific embodiment of a method for manufacturing an MEMS energy harvester according to the present invention, including: step S10, providing a substrate; step S11, forming a trench in the substrate; step S12, burying a metal material in the groove to form a coil; step S13, forming a piezoelectric induction composite layer on the front surface of the substrate; step S14, imaging the piezoelectric induction composite layer to form a cantilever beam; step S15, thinning the back of the substrate; step S16, forming a hollow portion in the substrate where the coil surrounds; step S17, a magnetic mass is bonded to the cantilever beam from the back side to form the magnetic core.
Referring to step S10, shown in fig. 2A, a substrate 20 is provided. The material of the substrate 20 may be monocrystalline silicon, or any other common substrate material.
Referring to step S11, shown in fig. 2B, a trench 21 is formed in the substrate 20. The method for forming the trench 21 includes, but is not limited to, dry etching or wet etching, and a trench 21 of a predetermined shape is formed using a suitable etching gas or etching liquid. Since the groove 21 is used as a housing space for forming the coil, the shape of the groove 21 in a top view should be selected from one of concentric circular, rectangular, polygonal, and other annular closed shapes, and be communicated with the inside and the outside.
Referring to step S12, as shown in fig. 2C, a metal material is embedded in the trench 21 to form the coil 22. The process of embedding the metal material is selected from one of electroplating and liquid metal filling. During the growth process, the surface of the substrate may be first covered with a continuous metal layer, and then the metal layer on the surface is removed by an etching or grinding process, so as to retain the metal material in the trench 21, thereby forming the coil 22.
After the steps S11 and S12 are completed, the coil is embedded in the substrate. In other embodiments, the metal may be buried by sputtering, evaporation, or physical vapor deposition, and the process for forming the trench 21 is not limited to dry etching or wet etching. In other embodiments, the coil 22 may be formed on the substrate surface by forming a continuous metal layer, patterning the metal layer into a coil, and filling the insulating medium in the gap of the coil.
Referring to step S13, as shown in fig. 2D, a piezoelectric induction composite layer 23 is formed on the surface of the coil 22. In the present embodiment, the piezoelectric induction composite layer 23 includes a first insulating layer 221, a first electrode layer 222, a piezoelectric material layer 223, a second electrode layer 224, and a second insulating layer 225 in this order from the surface of the coil 22. The materials of the first insulating layer 221 and the second insulating layer 225 may be independently selected from any one of silicon oxide, silicon nitride, and silicon oxynitride, and are formed by an epitaxial process. The first electrode layer 222 and the second electrode layer 224 are made of metal materials and are formed by sputtering, evaporation, and physical vapor deposition. The material of the piezoelectric material layer 223 is piezoelectric ceramic or aluminum nitride.
Referring to step S14, as shown in fig. 2E, the piezoelectric sensing composite layer 23 is patterned to form a cantilever beam 24. The patterning process uses dry etching or wet etching, and different etching or etching processes are selected for different materials to form the cantilever beam 24 formed by the piezoelectric induction composite layer 23 including the piezoelectric material layer 223. The cantilever beam 24 is particularly connected to the coil 22 and extends to the area surrounded by the coil 22 to facilitate subsequent pattern release.
After the steps S13 and S14 are completed, the cantilever beam 24 is formed on the surface of the coil 22, and the cantilever beam 24 includes the piezoelectric material layer 223 therein. In other embodiments, the cantilever structure may be formed first, and then the piezoelectric composite layer is defined on the cantilever by using photolithography and etching processes, which should also be regarded as an alternative embodiment of the above technical solution.
Referring to step S15, the backside of the substrate 20 is thinned, as shown in fig. 2F. The thinning process can adopt a mechanical grinding mode, a chemical etching mode and a mode of combining the mechanical grinding mode with the chemical etching mode.
As shown in fig. 2G, referring to step S16, a hollow portion 25 is formed in the substrate 20 where it is surrounded by the coil 22. The hollow portion 25 may be formed by dry etching or wet etching using an appropriate etching gas or etching liquid. Since the cantilever beam 24 extends to the region surrounded by the coil 22, the cantilever beam 24 is in a suspended state after the hollow portion 25 is formed. In this embodiment, the free end of the cantilever beam 24 is suspended, but in another embodiment, the two ends of the cantilever beam may be fixed on the surface of the coil 22, and the middle part of the cantilever beam is suspended in the hollow part 25.
Referring to step S17, as shown in fig. 2H, a magnetic mass 26 is bonded to the cantilever beam from the back side to form the magnetic core. The magnetic core is made of metal or magnetic polymer composite materials, and the bonding can be performed by adopting epoxy resin and other adhesives in a micro-assembly mode. In this embodiment, the magnetic mass 26 is a movable magnetic core.
The steps S15 to S17 are performed to form a hollow portion 25 in the substrate 20, which is surrounded by the coil 22, and to form a suspended magnetic core in the hollow portion 25, which is fixed to the suspended portion of the cantilever beam 24. In this embodiment, the magnetic core is a magnetic quality block 26.
After the above steps are completed, a MEMS energy harvester is obtained, as shown in fig. 2H, which includes the substrate 20, the magnetic mass 26, the coil 22, and the cantilever 24. The substrate 20 has a hollow portion 25. A magnetic core, which is a magnetic mass 26 in the present embodiment, is movably disposed in the hollow portion 25. The coil 22 is embedded in the substrate 20 and disposed around the magnetic mass 26 and the hollow portion 25. Cantilever beam 24 connects the magnetic mass 26 to the substrate 20, and the cantilever beam 25 includes a layer 223 of piezoelectric material therein.
In the structure, the magnetic core is accurately arranged in the plane of the coil and is suspended through the piezoelectric material layer. Therefore, when the magnetic core moves, kinetic energy can be converted into electric energy through the coil and the piezoelectric material layer at the same time with the maximum efficiency, and the energy collection efficiency is improved.
Fig. 3 is a schematic diagram illustrating implementation steps of a specific embodiment of a method for manufacturing an MEMS energy harvester according to the present invention, including: step S30, providing a substrate; step S31, forming a trench in the substrate; step S32, burying a metal material in the groove to form a coil; step S33, forming a piezoelectric induction composite layer on the front surface of the substrate; step S34, imaging the piezoelectric induction composite layer to form a cantilever beam; step S35, thinning the back of the substrate; step S36, forming a through hole at a position corresponding to the cantilever beam in the substrate from the back; step S37, filling the through hole with a magnetic material to form a magnetic core; and step S38, removing the substrate material between the magnetic core and the coil, forming a hollow part in the substrate at the position surrounded by the coil, and enabling the magnetic core to be in a suspension shape.
Steps S30 to S35 are described with reference to the previous embodiment.
Referring to step S36, as shown in fig. 4A, a via 36 is formed in the substrate 20 from the back side at a location corresponding to the cantilever beam 24. The via 36 may be formed by dry etching or wet etching using a suitable etching gas or etching liquid.
Referring to step S37, as shown in fig. 4B, the through hole 36 is filled with a magnetic material to form the magnetic core 37. The magnetic core is made of metal or magnetic polymer composite materials and can be formed by adopting electroplating, liquid metal filling, sputtering, evaporation, physical vapor deposition process and other modes. The filling step may be to first form a continuous metal layer and then polish or etch into a filled structure.
Referring to step S38, as shown in fig. 4C, the substrate material between the magnetic core 37 and the coil 22 is removed, a hollow portion 35 is formed in the substrate 20 where the coil 22 surrounds the substrate, and the magnetic core 37 is suspended. The removing process can adopt dry etching or wet etching, and different etching or etching processes are selected for different materials.
The above steps S35 to S38 are performed to form a hollow portion 35 in the substrate 20, where the hollow portion is surrounded by the coil 22, and to form a suspended magnetic core 37 in the hollow portion 35, where the magnetic core 37 is fixed to the suspended portion of the cantilever beam 24.
After the above steps are completed, a MEMS energy harvester is obtained, as shown in fig. 4C, which includes the substrate 20, the magnetic core 37, the coil 22, and the cantilever beam 24. The substrate 20 has a hollow portion 35. The core 37 is movably disposed in the hollow portion 35. The coil 22 is embedded in the substrate 20 and disposed around the magnetic core 37 and the hollow portion 35. Cantilever beam 24 connects magnetic core 37 to substrate 20, and includes a layer 223 of piezoelectric material within cantilever beam 25.
In the structure, the magnetic core is accurately arranged in the plane of the coil and is suspended through the piezoelectric material layer. Therefore, when the magnetic core moves, kinetic energy can be converted into electric energy through the coil and the piezoelectric material layer at the same time with the maximum efficiency, and the energy collection efficiency is improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A MEMS energy harvester, comprising:
the substrate is provided with a hollow part;
a magnetic core movably disposed within the hollow portion;
a coil embedded in the substrate and provided in a three-dimensional manner around the magnetic core and the hollow portion;
the cantilever beam is connected with the magnetic core and the substrate, and a piezoelectric material layer is arranged in the cantilever beam.
2. The MEMS energy harvester of claim 1, wherein the magnetic core is a metal or a magnetic polymer composite.
3. The MEMS energy harvester of claim 1, wherein the substrate is a monocrystalline silicon substrate.
4. A manufacturing method of an MEMS energy harvester is characterized by comprising the following steps:
providing a substrate;
embedding a coil in the substrate;
forming a cantilever beam on the surface of the coil, wherein the cantilever beam comprises a piezoelectric material layer;
and hollowing out the position surrounded by the coil in the substrate to form a hollow part, and forming a suspended magnetic core in the hollow part, wherein the magnetic core is fixedly connected with the suspended part of the cantilever beam.
5. The method of claim 4, wherein the step of forming the hollow portion and the magnetic core further comprises:
thinning the back surface of the substrate;
forming a hollow portion in the substrate where the coil surrounds;
and bonding a magnetic mass block to the cantilever beam from the back side to form the magnetic core.
6. The method of claim 4, wherein the step of forming the hollow portion and the magnetic core further comprises:
thinning the back surface of the substrate;
forming a through hole at a position corresponding to the cantilever beam in the substrate from the back surface;
filling the through hole with a magnetic material to form a magnetic core;
and removing the substrate material between the magnetic core and the coil, forming a hollow part in the substrate where the substrate is surrounded by the coil, and enabling the magnetic core to be in a suspension shape.
7. The method of claim 4, wherein said step of embedding the coil further comprises: forming a trench in the substrate;
and embedding a metal material in the groove to form a coil.
8. The method of claim 7, wherein the process of embedding the metal material is selected from one of electroplating and liquid metal filling.
9. The method of claim 4, wherein the step of forming the cantilever beam further comprises:
forming a piezoelectric induction composite layer on the surface of the coil;
and patterning the piezoelectric induction composite layer to form the cantilever beam.
10. The method of claim 9, wherein the piezoelectric induction composite layer comprises a first insulating layer, a first electrode layer, a piezoelectric material layer, a second electrode layer, and a second insulating layer in this order from the surface of the coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210158870.6A CN114337372A (en) | 2022-02-21 | 2022-02-21 | MEMS energy collector and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210158870.6A CN114337372A (en) | 2022-02-21 | 2022-02-21 | MEMS energy collector and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114337372A true CN114337372A (en) | 2022-04-12 |
Family
ID=81031340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210158870.6A Pending CN114337372A (en) | 2022-02-21 | 2022-02-21 | MEMS energy collector and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114337372A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1132471A (en) * | 1997-07-10 | 1999-02-02 | Matsushita Electric Ind Co Ltd | Semiconductor device, power generator, and electronic equipment provided with them |
| CN101814860A (en) * | 2010-04-09 | 2010-08-25 | 中北大学 | Vibratory drive composite micro-power source based on piezoelectric effect and electromagnetic induction |
| CN101924451A (en) * | 2010-07-30 | 2010-12-22 | 安徽大学 | High-performance micro electromagnetic vibration energy harvester easy for integrated manufacturing |
| CN102868318A (en) * | 2012-09-05 | 2013-01-09 | 北京大学 | Mini-type combined type energy collector based on PVDF (Poly Vinyli Dene Fluoride) and preparation method |
| CN105141177A (en) * | 2015-07-06 | 2015-12-09 | 西安交通大学 | Piezoelectric-electromagnetic composite miniature environmental vibration energy collector |
| CN107817365A (en) * | 2017-11-28 | 2018-03-20 | 吉林大学 | A kind of self-powered 3-axis acceleration sensor and detection method |
| WO2019090601A1 (en) * | 2017-11-09 | 2019-05-16 | 苏州大学 | Micro energy collector based on piezoelectric thick film mems process and preparation method thereof |
| CN110212731A (en) * | 2019-07-07 | 2019-09-06 | 中国人民解放军92578部队 | Electromagnetic vibration energy collector based on folding cantilever beam of special |
| CN113315408A (en) * | 2021-05-21 | 2021-08-27 | 北京临近空间飞行器系统工程研究所 | Highly integrated combined type vibration energy conversion module facing limited space |
| KR20210128646A (en) * | 2020-04-17 | 2021-10-27 | 최천 | Bendable Piezo Actuator w/h Bump |
-
2022
- 2022-02-21 CN CN202210158870.6A patent/CN114337372A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1132471A (en) * | 1997-07-10 | 1999-02-02 | Matsushita Electric Ind Co Ltd | Semiconductor device, power generator, and electronic equipment provided with them |
| CN101814860A (en) * | 2010-04-09 | 2010-08-25 | 中北大学 | Vibratory drive composite micro-power source based on piezoelectric effect and electromagnetic induction |
| CN101924451A (en) * | 2010-07-30 | 2010-12-22 | 安徽大学 | High-performance micro electromagnetic vibration energy harvester easy for integrated manufacturing |
| CN102868318A (en) * | 2012-09-05 | 2013-01-09 | 北京大学 | Mini-type combined type energy collector based on PVDF (Poly Vinyli Dene Fluoride) and preparation method |
| CN105141177A (en) * | 2015-07-06 | 2015-12-09 | 西安交通大学 | Piezoelectric-electromagnetic composite miniature environmental vibration energy collector |
| WO2019090601A1 (en) * | 2017-11-09 | 2019-05-16 | 苏州大学 | Micro energy collector based on piezoelectric thick film mems process and preparation method thereof |
| CN107817365A (en) * | 2017-11-28 | 2018-03-20 | 吉林大学 | A kind of self-powered 3-axis acceleration sensor and detection method |
| CN110212731A (en) * | 2019-07-07 | 2019-09-06 | 中国人民解放军92578部队 | Electromagnetic vibration energy collector based on folding cantilever beam of special |
| KR20210128646A (en) * | 2020-04-17 | 2021-10-27 | 최천 | Bendable Piezo Actuator w/h Bump |
| CN113315408A (en) * | 2021-05-21 | 2021-08-27 | 北京临近空间飞行器系统工程研究所 | Highly integrated combined type vibration energy conversion module facing limited space |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6958255B2 (en) | Micromachined ultrasonic transducers and method of fabrication | |
| EP3169450B1 (en) | Method for manufacturing a capacitive micromachined ultrasonic transducer | |
| US8008105B2 (en) | Methods for fabricating micro-electro-mechanical devices | |
| US8138016B2 (en) | Large area integration of quartz resonators with electronics | |
| US20060116585A1 (en) | Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor | |
| US8763220B2 (en) | Method of manufacturing a MEMS device | |
| JPH10510136A (en) | Electrostatic motor and method of manufacturing the same | |
| EP1217656A1 (en) | Process for manufacturing components in a semiconductor material with reduction in the starting wafer thickness | |
| CN213602620U (en) | MEMS resonator device and resonator structure | |
| EP2747904A2 (en) | Pre-collapsed capacitive micro-machined transducer cell with plug | |
| CN111889341B (en) | Ultrathin flexible silicon-based capacitive micro-machined ultrasonic transducer and processing method | |
| CN107947633B (en) | Piezoelectric-electrcombinedc combinedc vibrational energy collector and preparation method thereof | |
| CN114890372B (en) | Design and preparation method of PMUT with isolation groove | |
| EP2452349A1 (en) | Method for forming mems variable capacitors | |
| TW201813918A (en) | Method for producing a micromechanical pressure sensor | |
| CN114337372A (en) | MEMS energy collector and manufacturing method thereof | |
| CN112565949B (en) | Piezoelectric mems microphone and method of manufacturing the same | |
| US20210140767A1 (en) | Inertial devices with wafer-level integration of higher density proof masses and method of manufacturing | |
| CN1128342C (en) | Method for mfg. vibrating structure gyroscope | |
| CN217392887U (en) | Piezoelectric micromechanical ultrasonic transducer | |
| CN108002341B (en) | Electromagnetic vibration energy collector and preparation method thereof | |
| CN108059123B (en) | Electromagnetic vibration energy collector and preparation method thereof | |
| CN113872545A (en) | MEMS resonator preparation method | |
| Zhang et al. | Microfabricated thousand-turn coils for mW power generation from sub-mm vibrations | |
| JP6199820B2 (en) | Manufacturing method of spring for micro vibration element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |