CN114335562A - Processing equipment of composite current collector and processing method of micro blind hole composite current collector - Google Patents
Processing equipment of composite current collector and processing method of micro blind hole composite current collector Download PDFInfo
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- CN114335562A CN114335562A CN202210105502.5A CN202210105502A CN114335562A CN 114335562 A CN114335562 A CN 114335562A CN 202210105502 A CN202210105502 A CN 202210105502A CN 114335562 A CN114335562 A CN 114335562A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y02E60/10—Energy storage using batteries
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Abstract
The invention discloses a processing device of a composite current collector and a processing method of a micro blind hole composite current collector, wherein the processing device comprises: the unwinding mechanism is used for unwinding the composite current collector to be punched; laser mechanism of punching, laser mechanism of punching establishes unwinding mechanism's low reaches are used for right the compound mass flow body that unwinding mechanism delivers punches, laser mechanism of punching constructs to be in when punching on the compound mass flow body form the blind hole on the compound mass flow body, the blind hole link up first metal level with the second metal level just does not link up the insulating layer. According to the processing equipment of the composite current collector, the blind holes are punched on the composite current collector by adopting the laser punching mechanism, so that the processing process flow can be simplified, the processing efficiency is improved, the active material leakage can be avoided, and the weight reduction effect on the composite current collector is better.
Description
Technical Field
The invention relates to the technical field of batteries, in particular to a processing device of a composite current collector and a processing method of a micro blind hole composite current collector.
Background
In the related art, in the process of processing the composite current collector, before magnetron sputtering, vapor deposition, chemical plating, and the like, a layer of dot-shaped oil film is printed on an original film, the original film coated with the dot-shaped oil film is plated with a pre-plating layer in a magnetron sputtering, vapor deposition, or chemical plating manner, and then water electroplating is performed. Because the adhesion force of the copper layer coated with the point-shaped oil film area is poor, the copper layer is dissolved in acid liquor after acid cleaning, and therefore the acid cleaning tank is arranged in front of the electroplating tank for water electroplating to directly electroplate and thicken the copper layer of the area which is not coated with the point-shaped oil film after the copper layer on the point-shaped oil film is cleaned. However, in the process, oil films are easily adhered to equipment roller bodies to pollute the equipment. Before electroplating, the film surface needs to be cleaned, and the copper layer on the point-shaped oil film and the oil film are cleaned to carry out electroplating. Therefore, the electroplating solution is easily polluted, and the coated oil film also increases the process cost.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides processing equipment of a composite current collector, which cancels the processes of oiling and cleaning and can punch blind holes on the composite current collector.
The invention also provides a processing method of the micro blind hole composite current collector.
According to the processing equipment of the composite current collector in the first aspect of the invention, the composite current collector comprises an insulating layer, and a first metal layer and a second metal layer which are arranged on two sides of the insulating layer, wherein the insulating layer is a transparent insulating layer, and the processing equipment comprises: the unwinding mechanism is used for unwinding the composite current collector to be punched; laser mechanism of punching, laser mechanism of punching establishes unwinding mechanism's low reaches are used for right the compound mass flow body that unwinding mechanism delivers punches, laser mechanism of punching constructs to be in when punching on the compound mass flow body form the blind hole on the compound mass flow body, the blind hole link up first metal level with the second metal level just does not link up the insulating layer.
According to the processing equipment of the composite current collector, the blind holes are punched on the composite current collector by adopting the laser punching mechanism, so that the processing process flow can be simplified, the processing efficiency is improved, the active material leakage can be avoided, and the weight reduction effect on the composite current collector is better.
In some embodiments, the transparent insulating layer has a light transmittance of 70% or more.
In some embodiments, the laser punch mechanism comprises: laser generator and rotation type shake the mirror at a high speed, laser generator is used for emitting at least one in infrared light, ultraviolet ray or the green glow, the rotation type shakes at a high speed the mirror and is used for with jet out on the light of laser instrument transmission extremely compound mass flow body.
In some embodiments, the laser generator is configured to emit infrared light.
In some embodiments, the blind holes have a pore size in the range of 10um to 200um, and/or the spacing between the blind holes in the plane of the composite current collector is in the range of 200um to 2000 um.
In some embodiments, the laser punch mechanism further comprises: the dust removal assembly is arranged on the upper side and the lower side of a composite current collector punched in the laser punching mechanism and used for sucking dust and air flow of the composite current collector at the punching position.
In some embodiments, the processing equipment for composite current collector further comprises a transfer mechanism, the transfer mechanism comprises a plurality of transfer rollers, the transfer rollers are arranged at intervals in the transfer direction of the composite current collector and are used for transferring the composite current collector, and the transfer rollers comprise: the first roller and the second roller are sequentially arranged in the conveying direction of the composite current collector, the first roller is positioned at the upstream of the laser punching mechanism, and the second roller is positioned at the downstream of the laser punching mechanism; the laser punching mechanism further comprises: at least two centre gripping roller sets of interval arrangement in the direction of transfer of the compound mass flow body, at least two centre gripping roller sets are established first cross the roller with the second is crossed between the roller, every the centre gripping roller set includes two clamp rollers that the thickness direction of the compound mass flow body arranged in proper order, compound mass flow body presss from both sides and locates every two in the centre gripping roller set between the clamp roller.
In some embodiments, the processing equipment of the composite current collector further comprises: electroplating mechanism, electroplating mechanism locates laser mechanism's low reaches are used for electroplating in order to thicken the compound mass flow body after punching first metal level with second metal level is to predetermined thickness.
In some embodiments, the electroplating mechanism includes a plurality of electroplating baths sequentially arranged in a transfer direction of the composite current collector, and the electroplating baths are V-shaped film-running electroplating baths, horizontal film-running electroplating baths, or vertical film-running electroplating baths.
In some embodiments, the processing equipment of the composite current collector further comprises: the isolation wall is arranged between the electroplating mechanism and the laser punching mechanism and used for completely isolating the electroplating mechanism from the laser punching mechanism.
In some embodiments, the processing equipment of the composite current collector further comprises: the cleaning mechanism, the passivation mechanism, the drying mechanism and the winding mechanism are sequentially arranged in the conveying direction of the composite current collector.
According to the second aspect of the invention, the processing method of the micro blind hole composite current collector comprises the following steps: s1, obtaining a current collector preparation part, wherein the current collector preparation part comprises a transparent film-shaped insulating layer and metal layers with first initial thicknesses on two sides of the insulating layer; s2, drilling a blind hole in the current collector preparation part through a laser punching mechanism, wherein the blind hole penetrates through the metal layers on the two sides of the insulating layer and does not penetrate through the insulating layer to obtain the blind hole current collector preparation part; s3, electroplating the thickness of the metal layer on the two sides of the blind hole current collector preparation part until the thickness reaches the preset thickness; and S4, carrying out anti-oxidation treatment on the metal layers on the two sides to obtain the micro blind hole composite current collector.
According to the processing method of the micro blind hole composite current collector, the blind holes are punched on the composite current collector by adopting the laser punching mechanism, so that the processing process flow can be simplified, the processing efficiency is improved, the active material leakage can be avoided, and the weight reduction effect on the composite current collector is better.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic view of a processing apparatus for a composite current collector according to an embodiment of the present invention;
FIG. 2 is an enlarged view of the unwind mechanism and the laser punch mechanism shown in FIG. 1;
FIG. 3 is a schematic view of the laser punch mechanism shown in FIG. 1;
FIG. 4 is a schematic view of the laser punch mechanism shown in FIG. 1;
FIG. 5 is an enlarged view of the area circled A in FIG. 1;
FIG. 6 is an enlarged view of FIG. 1 at circled B;
fig. 7 is a schematic view of the composite current collector after completion of processing by the processing equipment of the composite current collector according to an embodiment of the present invention.
Reference numerals:
the processing apparatus 100 is provided with a processing device,
the unwinding mechanism 10 is provided with a winding mechanism,
a laser punching mechanism 20, a laser generator 21, a high-speed vibrating mirror 22 during rotation, a dust removing component 23, a first dust removing piece 231, a second dust removing piece 232, a clamping roller 24,
a conveying mechanism 30, a conveying roller 31, a first roller 311, a second roller 312,
the plating mechanism 40, the plating tank 41,
a partition wall 50, a cleaning mechanism 60, a passivating mechanism 70, a drying mechanism 80, a winding mechanism 90,
the composite current collector comprises a composite current collector 200, an insulating layer 201, a first metal layer 202, a second metal layer 203 and a blind hole 204.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
The processing apparatus 100 of the composite current collector 200 according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1 to 7, wherein, as shown in fig. 7, the composite current collector 200 includes: an insulating layer 201, and a first metal layer 202 and a second metal layer 203 disposed on both sides of the thickness of the insulating layer 201 (e.g., the upper and lower sides of the composite current collector 200 shown in fig. 7), the insulating layer 201 being a transparent insulating layer 201.
As shown in fig. 1, the processing apparatus 100 for a composite current collector 200 according to an embodiment of the first aspect of the present invention includes: an unwinding mechanism 10 and a laser punching mechanism 20.
Specifically, as shown in fig. 2, the unwinding mechanism 10 is configured to unwind the composite current collector 200 to be punched, the laser punching mechanism 20 is disposed downstream of the unwinding mechanism 10, the laser punching mechanism 20 is configured to punch the composite current collector 200 unwound from the unwinding mechanism 10, and the laser punching mechanism 20 may be configured to form a blind hole 204 on the composite current collector 200 when punching is performed on the composite current collector 200, where the blind hole 204 penetrates through the first metal layer 202 and the second metal layer 203 and does not penetrate through the insulating layer 201. Here, the blind hole 204 refers to a blind hole 204 that is formed by the laser punching mechanism 20 not as a through hole or a through hole in the thickness direction of the composite current collector 200 but is closed at one end and open at the other end.
That is, when the laser punching mechanism 20 punches a hole in the composite current collector 200 to be punched, the laser generated by the laser punching mechanism 20 melts and penetrates through the first metal layer 202 and the second metal layer 203 of the composite current collector 200, and a hole penetrating through the first metal layer 202 and the second metal layer 203 in the thickness direction is formed in the first metal layer 202 and the second metal layer 203, and at the same time, the laser generated by the laser punching mechanism 20 may directly penetrate through the insulating layer 201 and not act on the insulating layer 201 at all, or the laser generated by the laser punching mechanism 20 may punch a pit in the insulating layer 201 but not penetrate through the insulating layer 201.
At this time, two blind holes 204 opposite in the thickness direction are formed at the same position on the composite current collector 200, one end of the blind hole 204 located on the first metal layer 202 side facing the first metal layer 202 is open and closed toward the other end of the insulating layer 201, one end of the blind hole 204 located on the second metal layer 203 side facing the second metal layer 203 is open and closed toward the other end of the insulating layer 201, and the two blind holes 204 are separated by the insulating layer 201.
In this way, the processing equipment 100 for the composite current collector 200 according to the embodiment of the present invention can directly punch the blind hole 204 on the composite current collector 200 through the laser punching mechanism 20, so as to simplify the processing process, and the processing efficiency is higher, and meanwhile, the oil coating and cleaning processes are not required, so that the waste of materials is reduced, and the process cost is saved.
Meanwhile, compared with the related art in which a through hole penetrating through the composite current collector is processed on the composite current collector, the processing equipment 100 for the composite current collector 200 according to the embodiment of the present invention processes the blind hole 204 on the composite current collector 200, and the blind hole 204 not only can prevent the active material coated on both sides of the composite current collector 200 from leaking when the aperture of the through hole is too large, but also can set the aperture of the blind hole 204 to be larger than that of the through hole, so that the weight reduction effect of the blind hole 204 on the composite current collector 200 is better.
According to the processing equipment 100 of the composite current collector 200 provided by the embodiment of the invention, the blind holes 204 are punched on the composite current collector 200 by adopting the laser punching mechanism 20, so that the processing process flow can be simplified, the processing efficiency can be improved, the active material leakage can be avoided, and the weight reduction effect on the composite current collector 200 is better.
In one embodiment of the present invention, the light transmittance of the transparent insulating layer 201 may be 70% or more. For example, the light transmittance of the insulating layer 201 may be 75%, 80%, 85%, 90%, 95%, 100%, or the like. The higher the light transmittance of the transparent insulating layer 201 is, the less the transparent insulating layer 201 absorbs light, and when the laser punching mechanism 20 emits light to the composite current collector 200 to be punched, most of laser can directly penetrate through the transparent insulating layer 201, so that damage to the insulating layer 201 is reduced, the tensile strength of an original film of the insulating layer 201 is kept to be the original state, and the strength of the composite current collector 200 is ensured.
Preferably, the light transmittance of the transparent insulating layer 201 may be 98% or more. This embodiment sets up the luminousness through insulating layer 201 to be more than or equal to 98%, and when laser punching mechanism 20 transmitted light to the composite current collector 200 of waiting to punch, the laser can basically see through transparent insulating layer 201 completely, and at this moment, insulating layer 201 was very little to the absorption of light, and like this, can not produce destruction to insulating layer 201 basically, can make the tensile strength of the former membrane of insulating layer 201 keep the original form to guarantee composite current collector 200's intensity. For example, the light transmittance of the insulating layer 201 may be 98%, 99%, 100%, or the like.
In some embodiments of the present invention, as shown in fig. 3 and 4, the laser punch mechanism 20 may include: the laser collector comprises a laser generator 21 and a rotary high-speed vibrating mirror 22, wherein the laser generator 21 is used for emitting at least one of infrared light, ultraviolet light or green light, the rotary high-speed vibrating mirror 22 is used for emitting light emitted by a laser to the composite current collector 200 to punch a blind hole 204 on the composite current collector 200, namely, the rotary high-speed vibrating mirror 22 emits light emitted by the laser to the composite current collector 200 and respectively punches through holes on a first metal layer 202 and a second metal layer 203 of the composite current collector 200. In the embodiment, by providing the rotary high-speed galvanometer 22, the blind holes 204 with a predetermined arrangement rule can be punched on the composite current collector 200 to be punched through rotation.
Wherein the wavelength of the infrared light emitted by the laser generator 21 may be in the range of 1030nm to 1080 nm. The wavelength of the ultraviolet light is within the range of 10nm-400 nm; the wavelength of the green light is in the range of 515nm-523 nm.
In some embodiments of the invention, the laser generator 21 is configured to emit infrared light. Because the insulating layer 201 is the transparent insulating layer 201, when infrared light is emitted to the transparent insulating layer 201, the transparent insulating layer 201 does not substantially absorb infrared light, and the infrared light can directly and completely penetrate through the insulating layer 201, so that the insulating layer 201 can be substantially not damaged, the tensile strength of an original film of the insulating layer 201 can be kept, and the strength of the composite current collector 200 can be ensured.
According to some embodiments of the present invention, the aperture of the blind hole 204 may be in a range of 10um to 200um, that is, the maximum aperture of the blind hole 204 may reach 200um, so that the range of the aperture of the machinable blind hole 204 on the composite current collector 200 may be increased, and a user may also set the aperture of the blind hole 204 according to actual requirements of the composite current collector 200, such as actual weight reduction requirements, without a material leakage problem of the active material coated on both sides of the composite current collector 200 due to an excessively large aperture.
For example, the aperture of the blind hole 204 can be 30um, 60um, 90um, 110um, 130um, 160um, or 190um, and so on.
Alternatively, the aperture of the blind hole 204 may be larger than 50um and smaller than 200 um.
In some embodiments of the present invention, the spacing between adjacent blind holes 204 may be in the range of 200-2000 um in the plane of the composite current collector 200. Therefore, a user can set the distance between the blind holes 204 according to actual requirements, and the processing application range of the composite current collector 200 processing equipment 100 is enhanced.
For example, in the plane of the composite current collector 200, the spacing between adjacent blind holes 204 may be 300um, 400um, 500um, 600um, 800um, 1000um, 1300um, 1500um, 1800um, or the like.
According to some embodiments of the present invention, as shown in fig. 2 and 3, the laser punch mechanism 20 may further include: and the dust removing assembly 23 is arranged on the upper side and the lower side of the composite current collector 200 punched at the position of the laser punching mechanism 20, and is used for sucking dust and air flow of the composite current collector 200 at the punching position. Like this, dust removal component 23 can directly take away the dust that produces among the punching process to the dust quantity of adhesion on the effective reduction mass flow body, thereby can improve the safety in utilization of compound mass flow body.
As shown in fig. 3, the dust removing assembly 23 may include a first dust removing part 231 and a second dust removing part 232, the composite current collector 200 at the punching position of the laser punching mechanism 20 is horizontally disposed, the first dust removing part 231 is disposed right below the composite current collector 200 at the punching position, and the air draft direction is from top to bottom, so that the suction force applied by the first dust removing part 231 is directly applied to the blind hole 204 at the lower side of the composite current collector 200, and the waste and dust generated by punching at the lower side of the composite current collector 200 may be directly drawn away, so as to improve the dust removing efficiency. Second dust removal piece 232 establishes the upside at the compound mass flow body 200 of punching the position, and the convulsions direction is from lower to upper, can make the suction that second dust removal piece 232 applyed directly act the blind hole 204 position that is located compound mass flow body 200 upside like this for compound mass flow body 200 upside can be directly taken away owing to waste material and the dust that punches the production, in order to improve dust collection efficiency.
In addition, the dust removing assembly 23 can effectively remove waste and dust generated by punching of the composite current collector 200, and can also play a role in heat dissipation of the composite current collector 200, thereby ensuring the stability of the composite current collector 200.
Further, first dust removal piece 231 includes first suction hood, and first suction hood cover is established in the below of the compound mass flow body 200 of punching the position, and first suction hood can guarantee the convulsions space of first suction piece, guarantees that the dust can be taken away according to the convulsions route of setting for smoothly, improves the stability of dust removal in-process. The second dust removing part 232 comprises a second air draft cover, the second air draft cover is arranged above the composite current collector 200 at the punching position, the second air draft cover can ensure the air draft space of the second air draft part, the dust can be smoothly drawn away according to the set air draft path, and the stability in the dust removing process is improved.
According to some embodiments of the present invention, the processing apparatus 100 for processing the composite current collector 200 may further include a transfer mechanism 30, the transfer mechanism 30 may include a plurality of transfer rollers 31, the plurality of transfer rollers 31 are spaced in a transfer direction (for example, a left-to-right direction shown in fig. 1) of the composite current collector 200 and are used for transferring the composite current collector 200, and the plurality of transfer rollers 31 not only serve to support the composite current collector 200, but also serve as a guide to ensure that the composite current collector 200 is transferred along a designated transfer path.
Among them, the plurality of conveying rollers 31 include therein: a first roller 311 and a second roller 312 sequentially arranged in the conveying direction of the composite current collector 200, wherein the first roller 311 is located upstream of the laser punching mechanism 20, and the second roller 312 is located downstream of the laser punching mechanism 20; that is, the first passing roller 311 and the second passing roller 312 are respectively located on both sides of the laser punching mechanism 20. The first roller 311 and the second roller 312 support the composite current collector 200 at the position of the laser punching mechanism 20, so as to facilitate the punching operation of the composite current collector 200 by the laser punching mechanism 20.
Further, as shown in fig. 4, the laser punching mechanism 20 may further include: at least two nip roller sets arranged at intervals in the conveying direction of the composite current collector 200, the at least two nip roller sets being arranged between the first roller 311 and the second roller 312, each nip roller set comprising two nip rollers 24 arranged in sequence in the thickness direction (for example, the up-down direction shown in fig. 4) of the composite current collector 200, the composite current collector 200 being sandwiched between the two nip rollers 24 in each nip roller set. In this way, the clamping roller 24 can stably clamp the composite current collector 200 at the punching position, so as to effectively prevent the air flow generated by the dust removal assembly 23 from disturbing the composite current collector 200, thereby preventing the disturbance from affecting the punching quality of the laser punching mechanism 20.
In some embodiments within the present invention, as shown in fig. 1 and 5, the processing equipment 100 of the composite current collector 200 may further include: and the electroplating mechanism 40, the electroplating mechanism 40 is arranged at the downstream of the laser punching mechanism 20, and the electroplating mechanism 40 is used for electroplating the punched composite current collector 200 to thicken the first metal layer 202 and the second metal layer 203 to a preset thickness. Further, the electroplating mechanism 40 may include a plurality of electroplating baths 41 sequentially arranged in the conveying direction of the composite current collector 200, and the electroplating bath 41 may be a V-shaped film-feeding electroplating bath 41, a horizontal film-feeding electroplating bath 41, or a vertical film-feeding electroplating bath 41.
In some embodiments within the present invention, as shown in fig. 1 and 2, the processing equipment 100 of the composite current collector 200 may further include: and the separation wall 50 is arranged between the electroplating mechanism 40 and the laser punching mechanism 20, and is used for completely separating the electroplating mechanism 40 from the laser punching mechanism 20. Wherein, a via hole may be formed on the partition wall 50, and the composite current collector 200 located at one side of the partition wall 50 passes through the via hole to travel to the electroplating mechanism 40 located at the other side of the partition wall 50. The embodiment of the invention can prevent the electroplating acid mist of the electroplating mechanism 40 from corroding the laser punching mechanism 20 by arranging the isolation wall 50, thereby ensuring the service life of the laser punching mechanism 20.
In some embodiments within the present invention, as shown in fig. 1 and 2, the processing equipment 100 of the composite current collector 200 may further include: the cleaning mechanism 60, the passivation mechanism 70, the drying mechanism 80 and the winding mechanism 90 are sequentially arranged in the conveying direction of the composite current collector 200. The cleaning mechanism 60 is used for cleaning the liquid remained on the surface of the composite current collector 200 during electroplating in the electroplating mechanism 40. The passivation mechanism 70 is used for adding a protective film layer on the surface of the composite current collector 200 after the electroplating is completed and the cleaning is completed, and the protective film layer can effectively protect the first metal layer 202 and the second metal layer 203 of the composite current collector 200, so as to prevent the second metal layer 203 and the second metal layer 203 from being oxidized. The drying mechanism 80 is used for drying the composite current collector 200, and the winding mechanism 90 is used for winding the composite current collector 200 again.
According to the second aspect of the invention, the processing method of the micro blind hole composite current collector comprises the following steps:
s1, obtaining a current collector preparation part, wherein the current collector preparation part comprises a transparent film-shaped insulating layer and metal layers with first initial thicknesses on two sides of the insulating layer;
s2, drilling a blind hole in the current collector preparation part through a laser punching mechanism, wherein the blind hole penetrates through the metal layers on the two sides of the insulating layer and does not penetrate through the insulating layer to obtain the blind hole current collector preparation part;
s3, electroplating the thickness of the metal layer on the two sides of the blind hole current collector preparation part until the thickness reaches the preset thickness;
and S4, carrying out anti-oxidation treatment on the metal layers on the two sides to obtain the micro blind hole composite current collector.
That is, first, a current collector preparation is obtained, which includes a transparent film-shaped insulating layer and metal layers having a first initial thickness on both sides of the insulating layer, in other words, the insulating layer of the composite current collector is transparent film-shaped and is a transparent film substrate, and the light transmittance of the insulating layer may be 98% or more. And metal layers are formed on two sides of the insulating layer in the thickness direction, and the metal layers can be pre-plated with one metal layer, wherein the thickness of the pre-plated metal layer is a first initial thickness, and the first initial thickness can be in the range of 10nm-30 nm. For example, the first initial thickness is 15nm, 20nm, 25nm or 30 nm. The pre-plated metal layer can be formed through magnetron sputtering, and a current collector preparation part is formed after pre-plating is completed.
And then, conveying the current collector preparation part to a laser punching mechanism, and punching a blind hole on the current collector preparation part by using the laser punching mechanism, wherein the blind hole penetrates through the metal layers on two sides and does not penetrate through the insulating layer, and the aperture of the blind hole can be in the range of 10nm to 200 nm. Preferably, the laser generator of the laser punching mechanism emits infrared light. And forming the micro blind hole current collector preparation part after punching the blind hole on the current collector preparation part.
And then, the preparation piece of the micro blind hole current collector is conveyed to an electroplating mechanism, the metal layers on two sides of the insulating layer are thickened by the electroplating mechanism in an electroplating mode, the thickness of the metal layer after the electroplating of the electroplating mechanism is preferably 1000nm, wherein in the electroplating process of the electroplating mechanism, the thickness of the metal layer can be gradually increased to 1000nm through multiple electroplating processes, and therefore the stability and the finished product quality of the metal layer can be improved.
And finally, performing protection treatment on the metal layers on the two sides of the insulating layer, for example, performing oxidation treatment on the metal layers, thereby effectively preventing the metal layers from being oxidized and ensuring the stability of the composite current collector. And finally obtaining the composite current collector with the micro blind holes.
According to the processing method of the micro blind hole composite current collector, the blind holes are punched on the composite current collector by adopting the laser punching mechanism, so that the processing process flow can be simplified, the processing efficiency is improved, the active material leakage can be avoided, and the weight reduction effect on the composite current collector is better.
In a specific embodiment of the method for processing a blind micro-hole composite current collector, the method comprises:
s00, preparing a transparent film-like insulating layer;
s10, pre-plating metal layers with first initial thicknesses on two sides of the insulating layer respectively to obtain a current collector preparation part, wherein the first initial thicknesses are within the range of 10nm-30 nm;
s20, drilling blind holes on the current collector preparation part through a laser punching mechanism, wherein the blind holes penetrate through the metal layers on the two sides of the insulating layer and do not penetrate through the insulating layer to obtain the blind hole current collector preparation part, and the aperture of the blind holes can be in the range of 10nm to 200 nm;
s30, electroplating the metal layer thickness on the two sides of the blind hole current collector prefabricated part until the preset thickness is reached, wherein the preset thickness is 1000 nm;
s40, cleaning the residual electroplating solution on the composite current collector;
s50, carrying out anti-oxidation treatment on the metal layers on the two sides;
s60, drying the composite current collector;
and S70, rolling the composite current collector.
According to the processing method of the micro blind hole composite current collector, the blind holes are punched on the composite current collector by adopting the laser punching mechanism, so that the processing process flow can be simplified, the processing efficiency is improved, the active material leakage can be avoided, and the weight reduction effect on the composite current collector is better.
The processing equipment for the composite current collector of the embodiment of the first aspect of the invention can process the composite current collector of the blind via by using the processing method for the composite current collector of the second aspect of the invention.
A processing apparatus 100 for a composite current collector 200 according to an embodiment of the present invention will be described with reference to fig. 1 to 7.
Referring to fig. 1, the processing apparatus 100 for the composite current collector 200 includes an unwinding mechanism 10, a laser punching mechanism 20, an electroplating mechanism 40, a cleaning mechanism 60, a passivation mechanism 70, a drying mechanism 80, and a winding mechanism 90, which are sequentially arranged in a conveying direction of the composite current collector 200. The electroplating mechanism 40 comprises a plurality of electroplating baths 41 which are sequentially arranged, the cleaning mechanism 60 is a rinsing bath, the passivation mechanism 70 is a passivation bath, and the drying mechanism 80 is an oven.
Specifically, as shown in fig. 2 to 4, the laser punching mechanism 20 includes a laser generator 21, a lens 22, a dust removing assembly 23, a first roller 311, a second roller 312, and a nip roller 24. The laser light source of the laser generator 21 is an external light source, the lens 22 is a rotary high-speed vibrating mirror, the dust removal assembly 23 comprises a first dust removal piece 231 and a second dust removal piece 232 which are respectively arranged on the upper side and the lower side of the composite current collector 200, the first roller 311 and the second roller 312 are arranged at intervals in the horizontal direction, two pairs of clamping rollers 24 are arranged between the first roller 311 and the second roller 312, and the two pairs of clamping rollers 24 can prevent the disturbance of the airflow of the dust removal assembly 23 on the membrane surface of the composite current collector 200 from influencing the quality of laser drilling.
After laser drilling, the membrane surface of the composite current collector 200 enters the electroplating mechanism 40 for electroplating, the electroplating mechanism 40 comprises a plurality of electroplating baths 41, and the electroplating baths 41 are not limited to electroplating in a V-shaped membrane running mode, and can also be in a vertical electroplating mode or a horizontal electroplating mode. The electroplated composite current collector 200 enters a rinsing bath to clean the residual electroplating solution, then enters a passivation bath for anti-oxidation treatment, then enters an oven for drying, and finally enters a winding mechanism 90 for winding.
Wherein, unwinding mechanism 10 and laser mechanism of punching 20 separate with electroplating mechanism 40 through the partition wall, prevent that electroplating acid mist from corroding the laser mechanism of punching.
According to the processing equipment 100 of the composite current collector 200, compared with the traditional oil coating process, the oil coating and cleaning processes are omitted, the process flow is simplified, the waste of materials is reduced, the process cost is saved, the process of the processing equipment does not obviously damage the original film of the insulating layer, and the tensile strength of the original film can be kept.
In addition, according to the processing equipment 100 for the micro blind hole composite current collector of the embodiment of the invention, after unreeling the rolled current collector preparation parts, the rolled current collector preparation parts directly pass through the laser punching mechanism 20, the electroplating mechanism 40, the cleaning mechanism 60, the passivation mechanism 70 and the drying mechanism 80 in sequence, and finally are directly rolled by the rolling mechanism 90, so that the exposure time of the metal layer of the composite current collector 200 in the air is shortened, and the yield and the finished product quality of the composite current collector 200 are improved.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (12)
1. The utility model provides a processing equipment of the mass flow body that compounds, the mass flow body that compounds includes the insulating layer and establishes the first metal level and the second metal level of insulating layer thickness both sides, the insulating layer is transparent insulating layer, processing equipment includes:
the unwinding mechanism is used for unwinding the composite current collector to be punched;
laser mechanism of punching, laser mechanism of punching establishes unwinding mechanism's low reaches are used for right the compound mass flow body that unwinding mechanism delivers punches, laser mechanism of punching constructs to be in when punching on the compound mass flow body form the blind hole on the compound mass flow body, the blind hole link up first metal level with the second metal level just does not link up the insulating layer.
2. The processing equipment of the composite current collector as claimed in claim 1, wherein the light transmittance of the transparent insulating layer is 70% or more.
3. The machining equipment of composite current collector of claim 1, wherein the laser punching mechanism comprises: laser generator and rotation type shake the mirror at a high speed, laser generator is used for emitting at least one in infrared light, ultraviolet ray or the green glow, the rotation type shakes at a high speed the mirror and is used for with jet out on the light of laser instrument transmission extremely compound mass flow body.
4. The processing equipment of the composite current collector as claimed in claim 3, wherein the laser generator is configured to emit infrared light.
5. The processing equipment of the composite current collector of any one of claims 1 to 4, wherein the diameter of the blind holes is in the range of 10um to 200um, and/or the spacing between the blind holes in the plane of the composite current collector is in the range of 200um to 2000 um.
6. The machining equipment of composite current collector of any one of claims 1 to 4, wherein the laser punching mechanism further comprises: the dust removal assembly is arranged on the upper side and the lower side of a composite current collector punched in the laser punching mechanism and used for sucking dust and air flow of the composite current collector at the punching position.
7. The processing equipment of the composite current collector as claimed in claim 6, further comprising a transfer mechanism, wherein the transfer mechanism comprises a plurality of transfer rollers, the transfer rollers are arranged at intervals in the transfer direction of the composite current collector for transferring the composite current collector, and the transfer rollers comprise: the first roller and the second roller are sequentially arranged in the conveying direction of the composite current collector, the first roller is positioned at the upstream of the laser punching mechanism, and the second roller is positioned at the downstream of the laser punching mechanism;
the laser punching mechanism further comprises: at least two centre gripping roller sets of interval arrangement in the direction of transfer of the compound mass flow body, at least two centre gripping roller sets are established first cross the roller with the second is crossed between the roller, every the centre gripping roller set includes two clamp rollers that the thickness direction of the compound mass flow body arranged in proper order, compound mass flow body presss from both sides and locates every two in the centre gripping roller set between the clamp roller.
8. The machining equipment of the composite current collector as claimed in any one of claims 1 to 4, further comprising: electroplating mechanism, electroplating mechanism locates laser mechanism's low reaches are used for electroplating in order to thicken the compound mass flow body after punching first metal level with second metal level is to predetermined thickness.
9. The processing equipment of the composite current collector as claimed in claim 8, wherein the electroplating mechanism comprises a plurality of electroplating baths sequentially arranged in the conveying direction of the composite current collector, and the electroplating baths are V-shaped film-walking electroplating baths, horizontal film-walking electroplating baths or vertical film-walking electroplating baths.
10. The machining apparatus of the composite current collector as claimed in claim 8, further comprising: the isolation wall is arranged between the electroplating mechanism and the laser punching mechanism and used for completely isolating the electroplating mechanism from the laser punching mechanism.
11. The machining apparatus of the composite current collector as claimed in claim 8, further comprising: the cleaning mechanism, the passivation mechanism, the drying mechanism and the winding mechanism are sequentially arranged in the conveying direction of the composite current collector.
12. A processing method of a micro blind hole composite current collector is characterized by comprising the following steps:
s1, obtaining a current collector preparation part, wherein the current collector preparation part comprises a transparent film-shaped insulating layer and metal layers with first initial thicknesses on two sides of the insulating layer;
s2, drilling a blind hole in the current collector preparation part through a laser punching mechanism, wherein the blind hole penetrates through the metal layers on the two sides of the insulating layer and does not penetrate through the insulating layer to obtain the blind hole current collector preparation part;
s3, electroplating the thickness of the metal layer on the two sides of the blind hole current collector preparation part until the thickness reaches the preset thickness;
and S4, carrying out anti-oxidation treatment on the metal layers on the two sides to obtain the micro blind hole composite current collector.
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