CN112176284B - Method for manufacturing vapor deposition mask, organic semiconductor element, and organic EL display, vapor deposition mask preparation body, and vapor deposition mask - Google Patents
Method for manufacturing vapor deposition mask, organic semiconductor element, and organic EL display, vapor deposition mask preparation body, and vapor deposition mask Download PDFInfo
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- CN112176284B CN112176284B CN202010960637.0A CN202010960637A CN112176284B CN 112176284 B CN112176284 B CN 112176284B CN 202010960637 A CN202010960637 A CN 202010960637A CN 112176284 B CN112176284 B CN 112176284B
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Abstract
The application provides a method for manufacturing an evaporation mask, which comprises the following steps: a vapor deposition mask preparation body is prepared in which a metal mask is provided on one surface of a resin plate for obtaining a resin mask, a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm in accordance with JIS Z-0237:2009 is provided on the other surface of the resin plate, a laser beam is irradiated from the metal mask side to the resin plate with respect to the vapor deposition mask preparation body, a resin mask opening corresponding to a pattern to be vapor deposited is formed in the resin plate, and the protective sheet is peeled from the resin mask having the resin mask opening corresponding to the pattern to be vapor deposited.
Description
The present application is a divisional application of application number 201680036462.6, which is entitled "vapor deposition mask manufacturing method, vapor deposition mask preparation, organic semiconductor device manufacturing method, organic EL display manufacturing method, and vapor deposition mask", from year 2016, month 6, and 29.
Technical Field
Embodiments of the present invention relate to a method for manufacturing a vapor deposition mask, a vapor deposition mask preparation body, a method for manufacturing an organic semiconductor element, a method for manufacturing an organic EL display, and a vapor deposition mask.
Background
With the increase in size of products using organic EL elements and the increase in size of substrates, there is an increasing demand for the increase in size of vapor deposition masks. Among them, the metal plate used for manufacturing the vapor deposition mask made of metal also realizes an increase in size. However, in the conventional metal working technique, it is difficult to form an opening portion in a large-sized metal plate with high precision, and it is not possible to make the opening portion compatible with high definition. In addition, when a vapor deposition mask made of only metal is manufactured, the mass thereof increases with an increase in size, and the total mass including the frame increases, which causes an obstacle to the operation.
Under such a background, patent document 1 proposes a method for manufacturing a vapor deposition mask in which a metal mask having slits (metal mask openings) and a resin mask having openings corresponding to a pattern to be vapor deposited and arranged vertically and horizontally on the surface of the metal mask are stacked. According to the method for manufacturing a vapor deposition mask proposed in patent document 1, the accuracy of the opening of the resin mask can be improved by irradiating the resin mask with laser light, and a vapor deposition mask capable of forming a high-definition vapor deposition pattern can be manufactured. Patent documents 2 to 4 relate to the method for manufacturing the vapor deposition mask proposed in patent document 1.
Prior art literature
Patent literature
Patent document 1: japanese patent No. 5288037
Patent document 2: japanese patent application laid-open No. 2015-67891
Patent document 3: japanese patent laid-open publication No. 2014-133938
Patent document 4: japanese patent application laid-open No. 2015-67892
Disclosure of Invention
Problems to be solved by the invention
The main object of the embodiments of the present invention is to provide a vapor deposition mask manufacturing method capable of simply and efficiently manufacturing a vapor deposition mask satisfying both high definition and light weight even in the case of large size, a vapor deposition mask preparation body used in the vapor deposition mask manufacturing method, a method for manufacturing an organic semiconductor element and a vapor deposition mask capable of manufacturing an organic semiconductor element with high precision, and a method for manufacturing an organic EL display with high precision.
Means for solving the problems
An embodiment of the present invention relates to a method for manufacturing a vapor deposition mask by laminating a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening, the method comprising: a step of preparing a vapor deposition mask preparation body in which the metal mask is provided on one surface of a resin plate for obtaining the resin mask, and a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate; a step of irradiating the resin plate with laser light from the metal mask side with respect to the vapor deposition mask preparation body, and forming the resin mask opening corresponding to the pattern to be vapor deposited on the resin plate; and peeling the protective sheet from the resin mask having the resin mask openings corresponding to the pattern to be vapor deposited.
The vapor deposition mask preparation body may be one in which the metal mask is provided on one surface of a resin plate for obtaining the resin mask, and a plurality of the protective sheets are provided on the other surface of the resin plate.
The vapor deposition mask preparation body according to one embodiment of the present invention is a vapor deposition mask preparation body for obtaining a vapor deposition mask in which a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening are laminated, wherein the metal mask is provided on one surface of a resin plate for obtaining the resin mask, and a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237 is provided on the other surface of the resin plate.
The vapor deposition mask preparation body according to one embodiment of the present invention is a vapor deposition mask preparation body for obtaining a vapor deposition mask in which a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening are laminated, wherein a metal plate for obtaining the metal mask is provided on one surface of a resin plate for obtaining the resin mask, and a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate.
In addition, a method for manufacturing an organic semiconductor device according to an embodiment of the present invention includes a step of forming a vapor deposition pattern on a vapor deposition target using a vapor deposition mask having a frame body and a vapor deposition mask fixed to the frame body, wherein in the step of forming the vapor deposition pattern, the vapor deposition mask fixed to the frame body is a vapor deposition mask manufactured by a method for manufacturing the vapor deposition mask.
The method for manufacturing an organic EL display according to an embodiment of the present invention can use an organic semiconductor element manufactured by the method for manufacturing an organic semiconductor element described above.
Further, one embodiment of the present invention relates to a method for manufacturing a vapor deposition mask by laminating a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening, the method comprising: a step of preparing a vapor deposition mask preparation body in which the metal mask is provided on one surface of a resin plate for obtaining the resin mask, and a protective sheet having self-absorption and peeling properties is adsorbed on the other surface of the resin plate; a step of irradiating the resin plate with laser light from the metal mask side with respect to the vapor deposition mask preparation body, and forming the resin mask opening corresponding to the pattern to be vapor deposited on the resin plate; and peeling the protective sheet from the resin mask having the resin mask openings corresponding to the pattern to be vapor deposited.
The protective sheet attached to the other surface of the resin sheet may be a protective sheet containing one or both of a silicone resin and a urethane resin. The vapor deposition mask preparation body may be one in which the metal mask is provided on one surface of a resin plate for obtaining the resin mask, and a plurality of the protective sheets are adsorbed on the other surface of the resin plate.
The vapor deposition mask preparation body according to one embodiment of the present invention is a vapor deposition mask preparation body for obtaining a vapor deposition mask in which a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening are laminated, wherein the metal mask is provided on one surface of a resin plate for obtaining the resin mask, and a protective sheet having self-adsorption property and peeling property is adsorbed on the other surface of the resin plate.
The vapor deposition mask preparation body according to one embodiment of the present invention is a vapor deposition mask preparation body for obtaining a vapor deposition mask in which a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening are laminated, wherein a metal plate for obtaining the metal mask is provided on one surface of a resin plate for obtaining the resin mask, and a protective sheet having self-adsorption property and peeling property is adsorbed on the other surface of the resin plate.
In addition, a method for manufacturing an organic semiconductor device according to an embodiment of the present invention includes a step of forming a vapor deposition pattern on a vapor deposition target using a vapor deposition mask having a frame body and a vapor deposition mask fixed to the frame body, wherein in the step of forming the vapor deposition pattern, the vapor deposition mask fixed to the frame body is a vapor deposition mask manufactured by a method for manufacturing the vapor deposition mask.
The method for manufacturing an organic EL display according to an embodiment of the present invention can use an organic semiconductor element manufactured by the method for manufacturing an organic semiconductor element described above.
In addition, the vapor deposition mask according to one embodiment of the present invention is provided with a metal mask having a metal mask opening on one surface of a resin mask having a resin mask opening, and a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin mask.
In addition, in the vapor deposition mask according to one embodiment of the present invention, a metal mask having a metal mask opening is provided on one surface of a resin mask having a resin mask opening, and a protective sheet having self-absorption and peeling properties is attached to the other surface of the resin mask.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the vapor deposition mask manufacturing method of the present invention and the vapor deposition mask preparation body of the present invention, a vapor deposition mask that can satisfy both high definition and light weight can be manufactured simply and with good yield even in the case of large size. In addition, according to the method for manufacturing an organic semiconductor element and the vapor deposition mask of the present invention, the organic semiconductor element can be manufactured with high precision. In addition, according to the method for manufacturing an organic EL display of the present invention, the EL display can be manufactured with high accuracy.
Drawings
Fig. 1 is a process flow diagram for explaining an example of a method for manufacturing a vapor deposition mask according to an embodiment.
Fig. 2 is a schematic cross-sectional view showing an example of a comparative vapor deposition mask.
Fig. 3 is an enlarged front view of the vicinity of the resin mask opening when the vapor deposition mask manufactured using the comparative vapor deposition mask preparation body is viewed from the resin mask side.
FIG. 4 is a process flow diagram for explaining an example of a method for forming a vapor deposition mask preparation body.
Fig. 5 (a) is a front view of an example vapor deposition mask preparation body in plan view from the protective sheet 30 side, and (b) is a schematic cross-sectional view of the vapor deposition mask preparation body of (a).
Fig. 6 (a) is a front view of an example vapor deposition mask preparation body in plan view from the protective sheet 30 side, and (b) is a schematic cross-sectional view of the vapor deposition mask preparation body of (a).
Fig. 7 (a) to (c) are front views of an example vapor deposition mask preparation body when viewed from the protective sheet 30 side.
Fig. 8 is a front view of an example of the housing.
Fig. 9 (a) is a front view of a vapor deposition mask manufactured by the method for manufacturing a vapor deposition mask according to one embodiment, in plan view from the metal mask side, and (b) is a schematic cross-sectional view of A-A of (a).
Fig. 10 is a front view of the vapor deposition mask of embodiment (a) in plan view from the metal mask side.
Fig. 11 is a front view of the vapor deposition mask of embodiment (a) in plan view from the metal mask side.
Fig. 12 is a front view of the vapor deposition mask of embodiment (a) in plan view from the metal mask side.
Fig. 13 (a) and (b) are front views of the vapor deposition mask according to embodiment (a) when viewed from the metal mask side.
Fig. 14 is a front view of the vapor deposition mask of embodiment (B) in plan view from the metal mask side.
Fig. 15 is a front view of the vapor deposition mask of embodiment (B) in plan view from the metal mask side.
Fig. 16 is a front view of the vapor deposition mask with the frame body in a plan view from the resin mask side.
Fig. 17 is a front view of the vapor deposition mask with the frame body in a plan view from the resin mask side.
Fig. 18 is a diagram showing an example of a device having an organic EL display.
FIG. 19 is a schematic cross-sectional view of an evaporation mask according to an embodiment.
Symbol description
100 … vapor deposition mask
10A … metal plate
10 … Metal mask
15 … Metal mask opening
20A … resin plate
20 … resin mask
30 … protective sheet
25 … resin mask opening
60 … vapor deposition mask preparation body
62 … resist material
64 … resist pattern
Detailed Description
Embodiments of the present application will be described below with reference to the drawings. The present application may be embodied in many different forms, and the explanation thereof is not limited to the descriptions of the embodiments illustrated below. In addition, in order to make the description more clear, the width, thickness, shape, and the like of each portion are shown schematically in comparison with the actual embodiment, but these are merely examples, and do not limit the explanation of the present application. In the present description and the drawings, the same elements as those described in the foregoing drawings are denoted by the same reference numerals, and detailed description thereof may be omitted as appropriate. For convenience of explanation, the description will be given using terms such as upper and lower, but the vertical direction may be reversed. The same applies to the left-right direction.
Method for producing vapor deposition mask
Hereinafter, a method for manufacturing a vapor deposition mask according to an embodiment of the present invention will be specifically described with reference to the drawings. As shown in fig. 1, the vapor deposition mask manufacturing method according to the embodiment of the present invention is a method for manufacturing a vapor deposition mask 100 in which a metal mask 10 having a metal mask opening 15 formed therein and a resin mask 20 having a resin mask opening 25 corresponding to a pattern to be vapor deposited formed therein are stacked at a position overlapping the metal mask opening 15, the method comprising: as shown in fig. 1 (a), a step of preparing a vapor deposition mask preparation body 60 in which a metal mask 10 is provided on one surface of a resin plate 20A for obtaining a resin mask, and a protective sheet 30 having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate 20A; as shown in fig. 1 (b), a step of irradiating the resin plate 20A with laser light from the metal mask 10 side with respect to the vapor deposition mask preparation body 60, and forming a resin mask opening 25 corresponding to a pattern to be vapor-deposited on the resin plate 20A; and a step of peeling the protective sheet 30 from the resin mask 20 having the resin mask openings 25 corresponding to the pattern to be vapor-deposited, in other words, a step of peeling the protective sheet 30 from the vapor deposition mask 100 as the final object to be produced, as shown in fig. 1 (c).
The peel strength described in the present specification is synonymous with 180 ° peel adhesion based on JIS Z-0237:2009, and the peel strength can be measured based on (method 2) in JIS Z-0237:2009, that is, based on 180 ° peel adhesion to the back surface. Specifically, a test sheet in which a test tape (polyimide film (polyimide tape 5413 (manufactured by 3M Japan) corporation)) having an adhesive on the surface thereof was bonded to a stainless steel plate so that the stainless steel plate faced the adhesive was used, a protective sheet as a test piece was bonded to the polyimide film of the test sheet, and the peel strength (to polyimide) at 180 ° of peeling the protective sheet as a test piece from the polyimide film as a test sheet was measured by a method based on JIS Z-0237:2009, whereby the peel strength of the protective sheet was measured.
In the description of each step, first, the advantage of the vapor deposition mask manufacturing method according to the embodiment of the present application will be described by taking as an example a case where a vapor deposition mask is manufactured using a "comparative vapor deposition mask preparation body 60A" that does not satisfy the requirements of the vapor deposition mask preparation body 60 used in the vapor deposition mask manufacturing method according to the embodiment of the present application. As shown in fig. 2, the "comparative vapor deposition mask preparation 60A" differs from the vapor deposition mask preparation 60 (see fig. 1 (a)) used in the vapor deposition mask manufacturing method according to the embodiment of the present application only in that the protective sheet 30 is not provided on the other surface of the resin plate 20A.
The formation of the resin mask openings in the resin plate 20A in the "comparative vapor deposition mask preparation", and the formation of the resin mask openings 25 in the resin plate 20A in the vapor deposition mask preparation 60 used in the vapor deposition mask manufacturing method according to the embodiment of the present application can be performed by irradiating the resin plate 20A with laser light from the metal mask 10 side, and decomposing the resin plate 20A.
Here, in a stage of focusing on the halfway of forming the resin mask opening 25 by irradiating the resin plate 20A of the "comparative vapor deposition mask preparation", in other words, in a stage of focusing on the existence of the recess which finally becomes the resin mask opening 25 in the resin plate 20A, the thickness from the bottom surface of the resin plate 20A to the bottom surface of the recess is continuously thinned along with the progress of the laser processing based on the laser irradiation, and the strength of the resin plate 20A in the recess or the vicinity of the recess is continuously reduced. Further, with this decrease in strength, a part of the resin plate 20A is likely to break into pieces immediately before the resin mask opening 25 is formed, and "burrs" or "dregs" are generated. In addition, with the thickness between the bottom surface of the resin plate 20A and the bottom surface of the concave portion becoming thinner, "burrs" and "dregs" due to focus blur are also liable to occur. Specifically, the laser-based resin plate 20A is not normally decomposed due to the blurring of the focus, and a "burr" is likely to be generated at the edge portion of the resin mask opening 25, or a part of the incompletely decomposed resin plate 20A remains as "dross". The "dross" in the present specification is synonymous with "chip".
In addition, when the "comparative vapor deposition mask preparation" is placed on the processing table 70 and the resin mask opening 25 is formed in the resin plate 20A of the "comparative vapor deposition mask preparation", a gap of a certain degree exists between the processing table 70 and the resin plate 20A of the "comparative vapor deposition mask preparation", and this gap also becomes a factor of focus blur when laser light is irradiated. In order to reduce the gap between the processing table 70 and the resin plate 20A of the "comparative vapor deposition mask preparation", that is, to improve the adhesion between the processing table 70 and the resin plate 20A of the "comparative vapor deposition mask preparation", various adsorption methods, such as electrostatic adsorption, vacuum adsorption, and adsorption by a magnet, may be employed. However, in the case of using these adsorption methods, there are cases where the smoothness of the resin plate 20A of the "comparative vapor deposition mask preparation" is lowered, points where the adsorption portions are damaged by the irradiation of the laser light, or portions where the resin plate 20A and the processing table 70 are not completely adhered (microscopically) are generated, which is not preferable.
The "burrs" and "residues" generated when the resin mask opening 25 is formed in the resin plate 20A of the "comparative vapor deposition mask preparation" tend to protrude toward the inner periphery of the resin mask opening 25 as shown in fig. 3 (a) and/or adhere to the surface of the resin mask 20 on the side not in contact with the metal mask 10 as shown in fig. 3 (b). When "burrs" and "residues" as shown in fig. 3 (a) are generated, the "burrs" and "residues" cause so-called pattern defects that block the vapor deposition material discharged from the vapor deposition source and cause insufficient formation of a pattern on the vapor deposition object when the vapor deposition pattern is formed on the vapor deposition object using the vapor deposition mask produced. In addition, in order to perform pattern deposition with good accuracy on a deposition target using a deposition mask, it is considered that the deposition mask needs to be sufficiently adhered to the deposition target, but when "burrs" and "residues" as shown in fig. 3 (b) are generated, the occurrence of adhesion failure between the deposition mask and the deposition target and the occurrence of pixel blurring are a factor. Fig. 3 is an enlarged front view of the vicinity of the resin mask opening 25 when the vapor deposition mask manufactured using the "comparative vapor deposition mask preparation body" is viewed from the resin mask side.
< step of preparing vapor deposition mask preparation body >
Therefore, in the vapor deposition mask manufacturing method according to the embodiment of the present invention, as a vapor deposition mask preparation body including the resin plate 20A for forming the resin mask opening 25 by irradiating laser light, there may be used a vapor deposition mask preparation body 60 in which the metal mask 10 is provided on one surface of the resin plate 20A, and the protective sheet 30 having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate 20A. In other words, as the vapor deposition mask preparation 60 for obtaining the vapor deposition mask 100, the vapor deposition mask preparation 60 having the following (feature 1) and (feature 2) can be used.
(feature 1): the metal mask 10 is provided on one surface of the resin plate 20A for obtaining the resin mask 20, and the protective sheet 30 is provided on the other surface of the resin plate 20A.
(feature 2): in the vapor deposition mask preparation body 60 having the structure described above (feature 1), the protective sheet provided on the other surface of the resin plate 20A has a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm in accordance with JIS Z-0237:2009.
According to the vapor deposition mask preparation body 60 having this feature (in particular, feature 1), when the resin plate 20A of the vapor deposition mask preparation body 60 is irradiated with laser light to decompose the resin plate 20A and form the resin mask opening 25, the occurrence of "burrs" and "residues" can be suppressed. This can provide the vapor deposition mask 100 capable of forming a high-definition vapor deposition pattern. Specifically, the protective sheet 30 provided on the other surface of the resin plate 20A can suppress blurring of the focus when the resin mask opening 25 is formed by irradiating the resin plate 20A with laser light, and can suppress occurrence of "burrs" and "residues" caused by insufficient decomposition of the resin plate 20A due to blurring of the focus. In addition, according to the vapor deposition mask preparation body 60 having this feature (in particular, feature 1), even when a gap is generated between the processing table 70 and the vapor deposition mask preparation body 60 when the resin mask opening 25 is formed by placing the vapor deposition mask preparation body 60 on the processing table 70, for example, the focal blurring at the time of forming the resin mask opening 25 by irradiating the resin plate 20A with laser light can be suppressed.
In addition, according to the vapor deposition mask preparation body 60 having the above-described feature (in particular, the above-described feature 1), in addition to the suppression of blurring of the focus when forming the resin mask opening 25 in the resin plate 20A, the strength of the resin plate 20A itself can be improved, and thus the occurrence of "burrs" and "dregs" can be suppressed. Specifically, the presence of the protective sheet 30 provided on the other surface of the resin plate 20A can prevent the reduction in strength of the resin plate 20A that eventually becomes the recess of the resin mask opening 25 and the vicinity of the recess. Specifically, assuming that the protective sheet 30 is a resin plate, the apparent thickness of the resin plate 20A can be increased. That is, the protective sheet 30 can function not only to prevent blurring of the focus but also to serve as a support to prevent a decrease in strength of the resin plate. The protection sheet 30 provided on the other surface of the resin plate 20A can prevent the reduction in strength of the resin plate 20A in the recess portion that eventually becomes the resin mask opening 25 and in the vicinity of the recess portion, thereby suppressing the breakage of a part of the resin plate 20A or the like at the stage of forming the resin mask opening in the resin plate 20A by irradiation with the laser beam.
In the case where the resin mask opening 25 is formed in the resin plate 20A in a state where the vapor deposition mask preparation is fixed to the frame in order to reduce the alignment error between the frame and the vapor deposition mask, when the vapor deposition mask preparation is a "comparative vapor deposition mask preparation" in which the protective sheet 30 is not attached to the other surface of the resin plate 20A, the existence of the frame may cause the resin plate 20A of the "comparative vapor deposition mask preparation" to be in close contact with the processing table 70 when the laser beam is irradiated, and when the formation of the resin mask opening 25 is performed in a state where the frame is fixed, the degree of focus blur may be increased. On the other hand, in the vapor deposition mask manufacturing method according to the embodiment of the present invention, even when there is a gap between the vapor deposition mask preparation body 60 and the processing table 70, the presence of the protective sheet 30 adsorbed on the other surface of the resin plate 20A can prevent the occurrence of focus blur when the resin mask opening 25 is formed in the resin plate 20A.
That is, according to the method for manufacturing a vapor deposition mask according to the embodiment of the present invention having the above-described features (particularly, feature 1), the occurrence of "burrs" and "residues" when forming the resin mask openings 25 in the resin plate 20A can be suppressed, and the resin mask openings 25 can be formed on the resin plate 20A with high accuracy.
Further, in the vapor deposition mask manufacturing method according to the embodiment of the present invention, since the vapor deposition mask preparation body 60 having (feature 2) in addition to the above-described (feature 1) is used, it is possible to suppress damage to the resin plate 20A in the step of peeling the protective sheet 30 from the vapor deposition mask preparation body 60, which will be described later, and occurrence of unwanted peeling of the protective sheet 30 before the step of peeling the protective sheet 30.
In the vapor deposition mask manufacturing method according to the embodiment of the present invention, as the above (feature 2), it is necessary to provide the following protective sheet 30 on the other surface of the resin plate 20A: a protective sheet 30 having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009. In other words, it is necessary to use a protective sheet 30 having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 as the protective sheet 30 provided on the other side surface of the resin plate 20A. This is caused by that, when a protective sheet having a peel strength of 0.2N/10mm or more in accordance with JIS Z-0237:2009 is provided on the other surface of the resin plate 20A, the resin plate 20A is damaged when the protective sheet is peeled off from the resin plate 20A, that is, the size and position of the resin mask opening 25 formed in the resin plate 20A are changed due to the application of high stress to the resin plate 20A. In addition, peeling marks and the like are easily generated on the resin plate 20A. On the other hand, it is caused by the following reason: when a protective sheet having a peel strength of less than 0.0004N/10mm in accordance with JIS Z-0237:2009 is provided on the other surface of the resin sheet 20A, an undesirable peeling of the protective sheet occurs before the step of peeling the protective sheet.
The vapor deposition mask preparation body of the preferred embodiment is provided with a protective sheet having a peel strength of 0.0012N/10mm or more and 0.012N/10mm or less, based on JIS Z-0237:2009, on the other surface of the resin plate 20A. The vapor deposition mask preparation body 60 according to a more preferred embodiment is provided with a protective sheet having a peel strength of 0.002N/10mm or more and 0.04N/10mm or less, based on JIS Z-0237:2009, on the other surface of the resin plate 20A. The vapor deposition mask preparation body 60 according to a particularly preferred embodiment is provided with a protective sheet 30 having a peel strength of 0.002N/10mm or more and 0.02N/10mm or less in accordance with JIS Z-0237:2009 on the other surface of the resin plate 20A.
While the above description has been made taking as an example the case where the resin mask opening 25 is formed in a state where the vapor deposition mask preparation body 60 is mounted on the processing table 70, the vapor deposition mask manufacturing method according to the embodiment of the present invention does not require that the vapor deposition mask preparation body 60 is mounted on the processing table 70, and for example, the resin mask opening 25 may be formed by irradiating the resin plate 20A of the vapor deposition mask preparation body with laser light in a state where the vapor deposition mask preparation body 60 is not mounted on the processing table 70 but the vapor deposition mask preparation body 60 is fixed to the frame body, or by a method other than that.
(example of a method for producing a vapor deposition mask preparation)
The vapor deposition mask preparation body 60 used in the vapor deposition mask manufacturing method according to the embodiment of the present invention is not limited in any way as long as the conditions that the metal mask 10 is provided on one surface of the resin plate 20A and the protective sheet 30 satisfying the above (feature 2) is provided on the other surface of the resin plate 20A are satisfied.
For example, the vapor deposition mask preparation body 60 can be obtained by preparing the metal mask 10 having the metal mask opening 15 formed in advance, bonding the metal mask 10 to the surface of one side of the resin plate 20A by a conventionally known method, for example, using an adhesive or the like, and bonding the protective sheet 30 directly or indirectly to the surface of the other side of the resin plate 20A using an adhesive or the like so as to satisfy the condition described above (feature 2). After the protective sheet 30 is provided on the other surface of the resin plate 20A, the metal mask 10 may be attached to the one surface of the resin plate 20A. In addition to directly or indirectly bonding the protective sheet 30 to the resin plate 20A, a layer to be the protective sheet 30 may be formed on the resin plate 20A by various printing methods or the like.
A metal plate for obtaining the metal mask 10 may be prepared, and the metal plate may be bonded to one surface of the resin plate 20A to form the metal mask opening 15 penetrating only the metal plate, and then the protective sheet 30 may be provided to the other surface of the resin plate 20A so as to satisfy the above (feature 2) condition. The resin plate 20A and the protective sheet 30 may be bonded to each other before the resin plate 20A and the metal plate are bonded to each other, or may be bonded to each other after the resin plate 20A and the metal plate are bonded to each other and before the metal mask opening 15 is formed. That is, the resin plate 20A and the protective sheet 30 may be bonded at any stage before the resin mask opening 25 is formed in the resin plate 20A.
Fig. 4 (a) to (d) are schematic cross-sectional views showing an example of a method of forming the vapor deposition mask preparation body 60, and in the illustrated embodiment, after the resin plate 20A is provided on the metal plate 10A, the metal mask opening 15 is formed on the metal plate 10A, and thereafter, a protective sheet is provided on the surface of the resin plate 20A on the side not in contact with the metal mask. Any layer may be provided between the resin plate 20A and the protective sheet 30 so as to satisfy the above (feature 2).
As a method of forming the resin sheet 20A on the metal sheet 10A, there are mentioned a method in which a coating liquid obtained by dispersing or dissolving a resin serving as a material of the resin sheet 20A in an appropriate solvent is coated and dried by a conventionally known coating method. The resin plate 20A may be bonded to the metal plate 10A with an adhesive layer or the like interposed therebetween. In this method, as shown in fig. 4 (a), after the resin plate 20A is provided on the metal plate 10A, a resist material 62 is applied to the surface of the metal plate 10A, and the resist material is masked with a mask 63 having a metal mask opening pattern formed thereon, exposed, and developed. As a result, as shown in fig. 4 (b), a resist pattern 64 is formed on the surface of the metal plate 10A. Next, using the resist pattern 64 as an etching-resistant mask, only the metal plate 10A is etched, and after the etching is completed, the resist pattern is washed and removed. As a result, as shown in fig. 4 (c), a laminate of the metal mask 10 having the metal mask opening 15 formed in the metal plate 10A is obtained on the surface of the resin plate 20A. Next, as shown in fig. 4 (d), a protective sheet 30 is bonded to the other surface of the resin plate 20A of the obtained laminate, or a layer to be the protective sheet 30 is formed by various printing methods, to thereby obtain a vapor deposition mask preparation body 60.
The masking method of the resist material is not particularly limited, and as shown in fig. 4 a, the resist material 62 may be applied only to the surface of the metal plate 10A which is not in contact with the resin plate 20A, or the resist material 62 may be applied to the surfaces of the resin plate 20A and the metal plate 10A (not shown). Further, a dry film method of bonding a dry film resist to the surface of the metal plate 10A which is not in contact with the resin plate 20A, or to the surfaces of the resin plate 20A and the metal plate 10A may be used. The method of applying the resist material 62 is not particularly limited, and spin coating or spray coating may be employed in the case where the resist material 62 is applied only to the surface of the metal plate 10A which is not in contact with the resin plate 20A. On the other hand, when the material in which the resin plate 20A and the metal plate 10A are laminated is in the form of a long sheet, a dip coating method or the like capable of applying a resist material in a roll-to-roll manner is preferably used. In the dip coating method, the surfaces of the resin plate 20A and the metal plate 10A are coated with the resist material 62.
As the resist material, a material having good handling properties and desired sharpness is preferably used. The etching material used in the etching process is not particularly limited, and a known etching material may be appropriately selected.
The etching method of the metal plate 10A is not particularly limited, and for example, may be used: a spray etching method in which an etching material is sprayed from a spray nozzle at a predetermined spray pressure, a wet etching method such as a dipping etching method in which an etching solution filled with an etching material is immersed, a spin etching method in which an etching material is dropped, or a dry etching method using a gas, a plasma, or the like.
(protective sheet)
The protective sheet 30 provided on the other surface of the resin plate 20A is not limited as long as it is a material that satisfies the condition described above (feature 2), that is, a material that satisfies the condition that the peel strength is 0.0004N/10mm or more and less than 0.2N/10mm in accordance with JIS Z-0237:2009.
The protective sheet 30 is (i) directly provided on the other surface of the resin plate 20A and (ii) indirectly provided on the other surface of the resin plate 20A with an arbitrary layer interposed therebetween so as to satisfy the condition of the above (feature 2).
The protective sheet 30 directly provided on the other surface of the resin sheet 20A may be a protective sheet 30 having self-absorption property or self-adhesion property on the surface thereof.
The self-absorption property of the protective sheet 30 described herein means a property that the protective sheet 30 itself can be absorbed on the other surface of the resin plate 20A by its own mechanism. Specifically, the adhesive, or the like is not required between the other surface of the resin plate 20A and the protective sheet, and the resin plate 20A and the protective sheet can be adhered to the other surface of the resin plate 20A without sucking the protective sheet by an external mechanism such as a magnet. With such a protective sheet 30 having self-adsorption property, when in contact with the resin plate 20A, the protective sheet 30 can be adsorbed to the resin plate 20A while expelling air.
As the protective sheet 30 having self-absorption property, for example, there can be used: the self-adsorption property is exhibited by the function of the resin material itself constituting the protective sheet 30.
The resin material of the protective sheet 30 is not particularly limited, and a material having a peel strength that satisfies the above condition (feature 2) when the protective sheet 30 is peeled from the resin plate 20A can be appropriately selected and used. As an example of the protective sheet 30, the resin capable of exhibiting self-absorption properties includes an acrylic resin, a silicone resin, a polyurethane resin, a polyester resin, an epoxy resin, a polyvinyl alcohol resin, a cycloolefin resin, a polyethylene resin, and the like, and the peel strength of the protective sheet 30 when peeled from the resin plate 20A satisfies the condition (feature 2) described above. As the resin material of the protective sheet having a honeycomb suction cup structure described later, those resin materials may also be used. The protective sheet 30 may contain 1 resin alone or 2 or more resins. For example, a resin material having high peelability may be used in combination, so that the peel strength of the protective sheet 30 may be adjusted to satisfy the condition (feature 2) described above. The same applies to the protective sheet 30 of various embodiments described later. As the protective sheet 30 having the adsorptivity of the resin material itself, for example, a sheet-like material having the adsorptivity of the material itself described in japanese patent application laid-open No. 2008-36895 can be used.
In addition to the protective sheet 30 having self-absorption property by the action of the resin material itself, the protective sheet 30 having a honeycomb structure on the surface thereof may be used. In the case of using the protective sheet 30 having the honeycomb suction cup structure, it is conditional that the peel strength at the time of peeling the protective sheet 30 from the resin plate 20A satisfies the condition described above (feature 2). The honeycomb suction cup structure is a continuous fine concave-convex structure formed on the surface, and the continuous fine concave-convex structure functions as a suction cup, thereby imparting self-absorption properties to the protective sheet 30. Examples of such a protective sheet 30 include: japanese patent application laid-open No. 2008-36895 discloses a sheet-like article having a honeycomb suction structure.
The surface of the protective sheet 30 on the side contacting the resin plate 20A may be subjected to an adhesion treatment to cause the protective sheet 30 to exhibit adhesiveness (also referred to as "adhesiveness"). Examples of the bonding treatment include: corona discharge treatment, flame treatment, ozone treatment, ultraviolet treatment, radiation treatment, surface roughening treatment, chemical treatment, plasma treatment, low-temperature plasma treatment, priming treatment, grafting treatment, and the like.
In addition to the protective sheet 30 being directly provided on the other surface of the resin plate 20A, the protective sheet 30 may be indirectly provided on the other surface of the resin plate 20A through a layer having adhesiveness or tackiness (hereinafter also referred to as an intermediate layer). In the case of the embodiment in which the protective sheet 30 is indirectly provided, the peel strength when the protective sheet 30 is peeled from the resin sheet 20A is required to satisfy the above (feature 2).
When the protective sheet 30 itself does not have self-adsorption property or self-adhesion property, the intermediate layer functions to adhere the resin sheet 20A to the protective sheet 30. That is, as the intermediate layer, a layer having adhesiveness or tackiness may be used. In the case where the protective sheet 30 is directly provided on the other surface of the resin sheet 20A, if the condition (feature 2) described above cannot be satisfied, an intermediate layer may be provided between the resin sheet 20A and the protective sheet 30 as a layer for adjusting the peel strength when the protective sheet 30 is peeled from the resin sheet 20A. In the case where the protective sheet 30 is directly provided on the other surface of the resin sheet 20A, for example, the intermediate layer for adjusting the peel strength may be provided between the resin sheet 20A and the protective sheet 30 as a layer for reducing the peel strength when the peel strength of the protective sheet 30 is 0.2N/10mm or more, and may be provided between the resin sheet 20A and the protective sheet 30 as a layer for improving the peel strength when the peel strength of the protective sheet 30 is less than 0.0004N/10 mm.
The intermediate layer may have a single-layer structure of 1 layer or a laminated structure of 2 or more laminated layers. For example, an intermediate layer formed by laminating an adhesive layer for adhering the resin plate 20A to the protective sheet 30 and a release layer for adjusting the release strength at the time of peeling the protective sheet in this order from the resin plate 20A side may be provided between the resin plate 20A and the protective sheet 30.
The intermediate layer may be a layer that is peeled from the resin plate 20A together with the protective sheet 30 when the protective sheet 30 is peeled from the resin plate 20A, or may be a layer that remains on the side of the resin plate 20A. In the step of forming the resin mask opening 25 by irradiating the resin plate 20A with laser light, when the protective sheet 30 and the intermediate layer are decomposed by the laser light, they become sources of new "burrs" and "residues", and therefore, as described later, the protective sheet 30 and the intermediate layer are preferably materials which are not decomposed by the laser light or are not easily decomposed. In the case where an intermediate layer is formed that does not decompose by laser light or is less likely to decompose, and the intermediate layer remains on the resin plate 20A side in the step of peeling the protective sheet 30 from the resin plate 20A, the remaining intermediate layer is not preferable because it blocks the resin mask opening 25 formed in the resin plate 20A. In view of this, it is preferable to use a material that does not decompose or is less likely to decompose by laser light, that satisfies the above-described condition (feature 2) in terms of peel strength when the protective sheet 30 is peeled from the resin plate 20A, and that has higher adhesion to the protective sheet 30 than to the resin plate 20A. According to this embodiment, the protective sheet 30 can be peeled from the resin plate 20A together with the intermediate layer.
As the protective sheet 30 indirectly provided on the other side surface of the resin plate 20A, for example, there may be mentioned: polyesters such as polyethylene terephthalate, polyarylates, polycarbonates, polyurethanes, polyimides, polyetherimides, cellulose derivatives, polyethylene, ethylene-vinyl acetate copolymers, polypropylene, polystyrene, acrylic, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polyvinyl butyral, nylon, polyether ether ketone, polysulfone, polyether sulfone, tetrafluoroethylene-perfluoroalkyl vinyl ether, polyvinyl fluoride, tetrafluoroethylene-ethylene, tetrafluoroethylene-hexafluoropropylene, chlorotrifluoroethylene, polyvinylidene fluoride, and various plastic films or sheets.
Examples of the material of the intermediate layer include: acrylic resins, vinyl chloride resins, vinyl acetate resins, vinyl chloride/vinyl acetate copolymer resins, polyester resins, polyamide resins, and the like.
The thickness of the intermediate layer is not particularly limited, but is preferably in the range of 1 μm to 50 μm, more preferably in the range of 3 μm to 20 μm.
The method for forming the intermediate layer is not particularly limited, and the intermediate layer may be formed by, for example, applying and drying an intermediate layer coating liquid obtained by dissolving or dispersing 1 or 2 or more types of the resin material (feature 2) described above and, if necessary, an additive material added thereto in an appropriate solvent, wherein the peel strength of the intermediate layer coating liquid is capable of satisfying the peel strength of the protective sheet 30 when the protective sheet 30 is peeled from the resin sheet 20A. In addition to the method of forming the intermediate layer by coating, an adhesive sheet or the like having a peel strength that satisfies the above (feature 2) when the protective sheet 30 is peeled from the resin sheet 20A may be attached to form the intermediate layer.
The protective sheet 30 provided on the intermediate layer may be formed by the following method: a protective sheet or film having a peel strength satisfying the above (feature 2) when the protective sheet 30 is peeled from the resin sheet 20A is bonded to the intermediate layer; the protective sheet 30 may be formed by applying a coating liquid, which is obtained by dissolving or dispersing 1 or 2 or more kinds of the resin materials (characteristic 2) and optionally added additive materials, in an appropriate solvent, to the other surface of the resin sheet 20A, and drying the coating liquid, wherein the peel strength of the resin material is satisfactory to the above-described (characteristic 2) when the protective sheet 30 is peeled from the resin sheet 20A.
In the protective sheet 30 of the preferred embodiment, the transmittance of the laser light for forming the resin mask opening 25 in the resin plate 20A is 70% or more, preferably 80% or more, regardless of whether the protective sheet 30 is directly provided on the resin plate 20A or indirectly provided on the resin plate 20A via an intermediate layer or the like. In the case where the protective sheet 30 is provided on the resin plate 20A indirectly through the intermediate layer, the transmittance of the laser beam for forming the resin mask opening 25 in the resin plate 20A is preferably 70% or more, particularly preferably 80% or more, in addition to the protective sheet 30. According to the protective sheet 30 of the preferred embodiment, when the resin mask opening 25 is formed in the resin plate 20A and laser light is irradiated thereto, the intermediate layer and the protective sheet 30 can be prevented from being decomposed by the laser light. Accordingly, various problems caused by the decomposition of the intermediate layer and the protective sheet 30, for example, "residue" generated by the decomposition of the intermediate layer and the protective sheet 30, can be suppressed from adhering to the inner wall surface of the resin mask opening 25 formed in the resin plate 20A. The wavelength of the laser light differs depending on the type of laser light used, and for example, in the case of using a polyimide resin as the material of the resin plate 20A, a YAG laser light, an excimer laser light, or the like may be used. In the case of micromachining, a YAG laser (third harmonic) having a laser beam wavelength of 355nm or an excimer laser (KrF) having a laser beam wavelength of 248nm is preferable. Therefore, when selecting the protective sheet 30, the material of the protective sheet 30 may be appropriately set so that the transmittance of the laser light reaches the above-described preferable transmittance according to the type of the laser light used. As a method for achieving the above-described preferable transmittance of the protective sheet 30 that can satisfy the above-described condition (feature 2), there may be mentioned a method for adjusting the thickness of the protective sheet 30, specifically, a method for reducing the thickness of the protective sheet 30, a method for using a resin material having high transparency, or the like, as the resin material of the protective sheet 30.
The thickness of the protective sheet 30 is not particularly limited, but is preferably in the range of 1 μm or more and 100 μm or less, more preferably 2 μm or more and 75 μm or less, still more preferably 2 μm or more and 50 μm or less, particularly preferably 3 μm or more and 30 μm or less. By setting the thickness of the protective sheet 30 to 1 μm or more, the strength of the protective sheet 30 can be sufficiently improved, and when the resin mask opening is formed by irradiating the resin plate 20A with laser light, the risk of breakage of the protective sheet 30, cracking of the protective sheet 30, or the like can be reduced. In particular, when the thickness of the protective sheet 30 is 3 μm or more, this risk can be further reduced.
As the protective sheet 30, a protective sheet (not shown) integrated with a support member for supporting the protective sheet 30 by a support member may be used. By forming the support member-integrated protective sheet, even when the thickness of the protective sheet 30 itself is reduced, the operability of the protective sheet 30 and the like can be improved. The thickness of the support member is not particularly limited and may be appropriately set according to the thickness of the protective sheet 30, but is preferably 3 μm or more and 200 μm or less, more preferably 3 μm or more and 150 μm or less, still more preferably 3 μm or more and 100 μm or less, and particularly preferably 10 μm or more and 75 μm or less.
The material of the support member is not particularly limited, and a resin material, a glass material, or the like may be used, but from the viewpoint of flexibility or the like, a resin material is preferably used.
The protective sheet 30 is provided on the other side surface of the resin plate 20A at a position overlapping the resin mask opening 25 finally formed in the resin plate 20A in the thickness direction. On the other side surface of the resin plate 20A, 1 protective sheet 30 may be provided, or a plurality of protective sheets 30 may be provided. In the embodiment shown in fig. 5 (a) and (b), 1 protective sheet 30 is provided on the other surface of the resin plate 20A. Fig. 5 (a) is a front view of an exemplary vapor deposition mask preparation body 60 from the side of the protective sheet 30, and (b) is a schematic cross-sectional view. In the embodiment shown in fig. 5, the length of the protective sheet 30 in the lateral direction (the left-right direction in the drawing) is shorter than the length of the resin plate 20A in the lateral direction, but the length of the protective sheet 30 in the lateral direction may be the same as the length of the resin plate 20A so that the surface positions of the end face of the protective sheet 30 and the end face of the resin plate 20A coincide, or the length of the protective sheet 30 in the lateral direction may be longer than the length of the resin plate 20A so that the outer periphery of the protective sheet 30 protrudes with respect to the resin plate 20A. The same applies to the longitudinal length of the protective sheet 30. The same applies to the protective sheet 30 of various embodiments described later.
As shown in fig. 6 (a) and (b), the protective sheet 30 of the preferred embodiment is provided with a plurality of protective sheets 30 on the other surface of the resin plate 20A. According to this embodiment, even when the resin plate 20A is enlarged, that is, when the vapor deposition mask 100 to be finally manufactured is enlarged, the protective sheet 30 can be easily provided on the other surface of the resin plate 20A. In particular, in the case where the protective sheet 30 is a protective sheet 30 having self-absorption properties, the risk of air remaining between the resin sheet 20A and the protective sheet 30 increases as the size of the protective sheet 30 increases, but by dividing the protective sheet 30 into a plurality of pieces and reducing the size thereof, the risk of air remaining between the other surface of the resin sheet 20A and each protective sheet 30 can be reduced, and the adhesion between the resin sheet 20A and the protective sheet 30 can be easily improved. In addition, even when the protective sheet 30 provided on the other surface of the resin plate 20A must be peeled off before the step of forming the resin mask opening 25 in the resin plate 20A due to human error or the like when the protective sheet 30 is attached to the resin plate 20A, it is sufficient to peel off only the protective sheet 30 to be the object, and it is preferable in terms of work efficiency.
The size of the protective sheet 30 in the case where a plurality of protective sheets 30 are provided on the other surface of the resin plate 20A is not particularly limited, and may be, for example, 1 or more resin mask openings 25 which can cover the resin mask openings to be finally formed, or may be a size which can cover "1 screen" or a plurality of screens which will be described later. In the protective sheet 30 of the preferred embodiment, the plurality of protective sheets 30 are each of a size overlapping with "1 screen" or a plurality of screens finally formed on the resin plate 20A. In particular, in the vapor deposition mask of the preferred embodiment described later, since the interval between the respective screens is wider than the interval of the resin mask openings 25, the protective sheet 30 is preferably provided so as to cover the size of "1 screen" or a plurality of screens and so as to overlap the "1 screen" or a plurality of screens in the thickness direction from the viewpoint of workability. In fig. 6, the area enclosed by the broken line is an area to be allocated of "1 screen".
In the embodiment shown in fig. 6, when the vapor deposition mask preparation body 60 is viewed from the side of the protective sheet 30, a plurality of protective sheets 30 are provided in order in the longitudinal direction and the lateral direction (up-down direction and left-right direction in the drawing) of the vapor deposition mask preparation body, but as shown in fig. 7 (a), a plurality of protective sheets 30 extending in the longitudinal direction may be provided in the lateral direction, or as shown in fig. 7 (b), a plurality of protective sheets 30 extending in the lateral direction may be provided in the longitudinal direction. As shown in fig. 7 (c), a plurality of protection sheets 30 may be randomly arranged so as to be different from each other.
< step of Forming openings of resin mask >
As shown in fig. 1 (b), this step is a step of irradiating the resin plate 20A with laser light from the metal mask 10 side through the metal mask opening 15 with respect to the vapor deposition mask preparation body 60 prepared as described above, and forming the resin mask opening 25 corresponding to the pattern to be vapor deposited on the resin plate 20A. In the illustrated embodiment, the laser irradiation is performed with respect to the vapor deposition mask preparation body 60 mounted on the processing table 70, but the processing table 70 is any configuration in the vapor deposition mask manufacturing method according to the embodiment of the present application, and the formation of the resin mask opening 25 may be performed without mounting the vapor deposition mask preparation body 60 on the processing table 70.
The laser device used in the present step is not particularly limited, and a conventionally known laser device may be used. The pattern to be produced by vapor deposition in the present specification refers to a pattern to be produced by using the vapor deposition mask, and is, for example, in the case where the vapor deposition mask is used for forming an organic layer of an organic EL element, the shape of the organic layer.
< step of fixing vapor deposition mask preparation to frame >
In the vapor deposition mask manufacturing method according to the embodiment of the present application, the vapor deposition mask preparation body 60 may be fixed to the frame body between any steps before the formation of the resin mask opening 25 or after the formation of the resin mask opening. The present step is an arbitrary step in the vapor deposition mask manufacturing method of the present application, but by fixing the vapor deposition mask preparation body 60 to the frame body in advance at a stage before the resin plate 20A is irradiated with the laser light to form the resin mask opening 25, the mounting error occurring when the resulting vapor deposition mask 100 is fixed to the frame body can be made zero. In addition to fixing the vapor deposition mask preparation body 60 to the frame, a laminate in which the metal mask 10 is provided on one surface of the resin plate 20A or a laminate in which the metal plate 10A for obtaining the metal mask is provided on one surface of the resin plate 20A may be fixed to the frame, and then the protective sheet 30 may be provided on the other surface of the resin plate 20A of the laminate.
The fixation of the frame and the vapor deposition mask preparation body may be performed on the surface of the frame or may be performed on the side surface of the frame.
When the vapor deposition mask preparation body 60 is laser-machined in a state of being fixed to the frame, depending on the state of adhesion between the frame and the vapor deposition mask preparation body 60, a gap may be generated between the vapor deposition mask preparation body 60 and the machining table 70, or the adhesion between the vapor deposition mask preparation body 60 and the machining table 70 may become insufficient to cause a gap to be generated microscopically, but since the vapor deposition mask preparation body 60 is provided with the protective sheet 30 on the other surface of the resin plate 20A, the strength of the resin plate 20A may be prevented from being lowered by the presence of the protective sheet 30, or a focus may be blurred due to the gap between the resin plate 20A and the machining table 70. Therefore, the method for manufacturing a vapor deposition mask according to the embodiment of the present invention is particularly suitable for a case where the resin mask opening 25 is formed in a state where the vapor deposition mask preparation body 60 is fixed to the frame.
As shown in fig. 8 (a), the frame body 40 is a substantially rectangular frame member, and has through holes for exposing the resin mask openings 25 of the resin mask 20 provided in the finally obtained vapor deposition mask 100 to the vapor deposition source side. The material of the frame is not particularly limited, but a metal material having high rigidity, such as SUS, invar alloy material, ceramic material, or the like, may be used. Among them, the metal frame is preferable in terms of easiness of welding to the metal mask of the vapor deposition mask and small influence of deformation.
The thickness of the frame is not particularly limited, but is preferably in the range of 10mm to 30mm from the viewpoint of rigidity and the like. The width between the inner peripheral end face of the opening of the frame and the outer peripheral end face of the frame is not particularly limited as long as the width is a width at which the frame and the metal mask of the vapor deposition mask can be fixed, and for example, a width in a range of 10mm to 70mm is exemplified.
As shown in fig. 8 (b) to (d), the frame 40 may be provided with a reinforcing frame 45 or the like in the region of the through hole so as not to interfere with the exposure of the resin mask opening 25 formed in the resin plate 20A. In other words, the opening of the frame 40 may be formed by dividing the reinforced frame. By providing the reinforcing frame 45, the frame 40 and the vapor deposition mask preparation member 60 can be fixed by the reinforcing frame 45. Specifically, when a plurality of the vapor deposition mask preparation bodies 60 described above are fixed in parallel in the longitudinal direction and the lateral direction, the vapor deposition mask preparation bodies 60 can be fixed to the frame 40 even at the position where the reinforcing frame body overlaps the vapor deposition mask preparation bodies 60.
The method for fixing the frame 40 and the vapor deposition mask preparation body 60 is not particularly limited, and may be performed by spot welding, an adhesive, a screw, or other methods.
< step of peeling off protective sheet >
In this step, as shown in fig. 1 (c), the resin mask 20 is obtained by forming the resin mask opening 25 in the resin plate 20A of the vapor deposition mask preparation body 60, and then the protective sheet 30 is peeled off from the resin mask 20. In other words, the protective sheet 30 is peeled off from the vapor deposition mask. By this step, the vapor deposition mask 100 is obtained by laminating the metal mask 10 having the metal mask opening and the resin mask 20 having the resin mask opening 25 corresponding to the pattern to be vapor deposited formed at the position overlapping the metal mask opening 15.
As described above, in the vapor deposition mask manufacturing method according to the embodiment of the present invention, since the protective sheet 30 having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate 20A, the protective sheet 30 can be easily peeled from the resin mask 20 having the resin mask opening 25 formed therein by merely lifting up the protective sheet 30 without performing any additional process such as a dissolving process for removing the protective sheet or a UV process. In addition, by making the upper limit value of the peel strength lower than 0.2N/10mm, it is possible to suppress the application of stress to the resin plate 20A when the protective sheet 30 is peeled.
When a protective sheet having a peel strength of 0.2N/10mm or more in accordance with JIS Z-0237:2009 is provided on the other surface of the resin plate 20A, the stress applied to the resin plate 20A becomes excessively high, and dimensional changes and misalignment tend to occur in the resin mask opening 25 formed in the resin plate 20A in the step of forming the resin mask opening. In addition, peeling marks and the like are also easily generated on the other surface of the resin plate 20A.
In addition, even when "residues" of the resin plate 20A adhere to the surface of the protective sheet 30 or the like due to the decomposition of the resin plate 20A in the step of forming the resin mask opening 25, the "residues" can be peeled off together with the protective sheet 30 in this step. In addition, in the case of using the protective sheet 30 having self-adsorption property as the protective sheet 30, when the protective sheet 30 is peeled from the resin plate 20A, the surface of the resin plate 20A (resin mask 20) on which the resin mask opening 25 is formed is not contaminated with the material of the protective sheet 30 or the like, and no washing treatment or the like is required.
According to the vapor deposition mask manufacturing method according to the embodiment of the present invention described above, the existence of the protective sheet 30 can manufacture a vapor deposition mask having a laminate of the resin mask 20 having the high-definition resin mask opening 25 and the metal mask with good yield.
Next, an advantage of the vapor deposition mask manufacturing method according to the embodiment of the present invention, in which a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate 20A of the vapor deposition mask preparation body 60, and a resin mask opening is formed in the resin plate 20A, and then the protective sheet is peeled from the resin mask having the resin mask opening formed, will be described.
The support member-integrated protective sheet (samples 1 to 7) shown in table 1 below was attached to the other surface of the resin plate of the vapor deposition mask preparation body so that the resin plate faced the protective sheet, and laser light was irradiated from the metal mask side to form the resin mask opening 25, and the laser resistance of the protective sheet and the presence or absence of burrs and residues were confirmed at this time. In addition, the peelability was also confirmed when the protective sheet was peeled from the resin plate (resin mask having the resin mask opening formed) after the laser processing. In sample a, a protective sheet was not provided, and a resin mask opening was formed in the resin plate. In addition, samples 6 and 7 were evaluated only for peelability.
As vapor deposition mask preparation bodies, a metal mask (invar material thickness 40 μm) having a metal mask opening formed in one surface of a resin plate (polyimide resin thickness 5 μm) and a support member-integrated protective sheet having a support member-integrated protective sheet shown in table 1 below were used. YAG laser light with a wavelength of 355nm was used for the laser processing. The supporting member of the protective sheet constituting the supporting member-integrated type, the thickness of the protective sheet, and the transmittance of the protective sheet at a wavelength of 355nm are shown in table 1 below. The peel strength was measured as follows: the test sheet obtained by bonding a test tape (polyimide film having an adhesive on the surface thereof (polyimide tape 5413 (manufactured by 3M Japan)) to a stainless steel plate so that the stainless steel plate faces the adhesive was used in accordance with JIS Z-0237:2009, and the protective sheets (samples 1 to 7) as test pieces were bonded to the polyimide film of the test sheet, and the peel strength (polyimide) of the protective sheets as test pieces when 180 ° peeling was performed from the polyimide film as test sheet was measured by an electromechanical universal tester (manufactured by 5900 series Instron corporation), and the evaluation results are shown in table 1.
In order to show the relationship between the thickness of the protective sheet provided on the other surface of the resin plate 20A and the damage to the protective sheet during laser processing, a layer (layer having no self-absorption property) having a thickness of 1 μm and a transmittance of 1% with respect to a wavelength of 355nm was formed by coating on the other surface of the resin plate 20A. A layer (layer having no self-absorption property) having a thickness of 0.5 μm and a transmittance of 1% with respect to a wavelength of 355nm was formed on the other surface of the resin plate 20A by coating, and this was referred to as sample C. For this sample B, C, the presence or absence of burrs and dross and the resistance of the coating layer during laser processing were evaluated. As a material of the coating layer, polyimide resin (photo electronics DL-1602Toray (ltd)) was used.
Test report
a) Standard name: JIS Z-0237:2009
b) The test method comprises the following steps: method 2
The tape was polyimide tape 5413 (3M manufactured by Japan Co., ltd.)
c) Identification of materials: the product numbers (product names) are as shown in the table
d) Day of test and test site: 9 months, 3 days, 12 months, 7 days, qianye county, cypress city in 2015
e) Test results: interface disruption
Other measuring devices: electromechanical universal testing machine (5900 series Instron company)
As is apparent from the results of table 1 below, samples 1 to 5, in which the vapor deposition mask preparation body having the protective sheet 30 provided on the other surface of the resin plate 20A had the resin mask opening formed in the resin plate 20A, were able to suppress the occurrence of burrs and dregs and form high-definition resin mask openings, as compared with sample a, in which the protective sheet 30 was not provided on the other surface of the resin plate 20A and the resin mask opening was formed in the resin plate 20A. In addition, according to sample 7 in which a protective sheet having a peel strength of 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate 20A, and 1 to 6 in which a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate 20A, damage to the resin mask can be suppressed. In sample B, in which a coating layer having a thickness of 1 μm was provided in addition to the protective sheet having self-absorption property, cracks were generated in the coating layer during laser processing, and in sample C, in which a coating layer having a thickness of 0.5 μm was provided, the coating layer was broken during laser processing. In the sample B, C having a transmittance of less than 70%, the coating layer was laser-processed by absorbing the laser light, and burrs and dregs were slightly generated due to the laser light.
Method for producing vapor deposition mask
Next, a method for manufacturing a vapor deposition mask according to another embodiment of the present invention will be described in detail with reference to the drawings. A vapor deposition mask manufacturing method according to another embodiment of the present invention is a method for manufacturing a vapor deposition mask 100 formed by laminating a metal mask 10 having a metal mask opening 15 formed therein and a resin mask 20 having a resin mask opening 25 formed therein at a position overlapping the metal mask opening 15, the resin mask opening 25 corresponding to a pattern to be vapor deposited, wherein the method includes: as shown in fig. 1 (a), a step of preparing a vapor deposition mask preparation body 60 in which a metal mask 10 is provided on one surface of a resin plate 20A for obtaining a resin mask, and a protective sheet 30 having self-absorption and peeling properties is adsorbed on the other surface of the resin plate 20A; as shown in fig. 1 (b), a step of irradiating the resin plate 20A with laser light from the metal mask 10 side with respect to the vapor deposition mask preparation body 60, and forming a resin mask opening 25 corresponding to a pattern to be vapor-deposited on the resin plate 20A; and a step of peeling the protective sheet 30 from the resin mask 20 having the resin mask openings 25 corresponding to the pattern to be vapor-deposited, that is, a step of peeling the protective sheet 30 from the vapor deposition mask 100, which is the final object to be manufactured, as shown in fig. 1 (c). The following description focuses on differences from the vapor deposition mask manufacturing method according to the embodiment of the present invention described above. The description of the vapor deposition mask manufacturing method according to the embodiment of the present invention can be appropriately selected, except when specifically described, and the description of the "vapor deposition mask manufacturing method according to the embodiment of the present invention" can be interpreted as "vapor deposition mask manufacturing method according to the other embodiment of the present invention".
< step of preparing vapor deposition mask preparation body >
In the vapor deposition mask manufacturing method according to another embodiment of the present invention, as a vapor deposition mask preparation body including the resin plate 20A for forming the resin mask opening 25 by irradiation with laser light, there may be used a vapor deposition mask preparation body 60 in which the metal mask 10 is provided on one surface of the resin plate 20A and the protective sheet 30 having self-absorption property is further absorbed by its self-absorption property on the other surface of the resin plate 20A. With the vapor deposition mask manufacturing method according to the other embodiment of the present invention, the presence of the protective sheet 30 adsorbed on the other surface of the resin plate 20A can prevent the occurrence of the blurring of the focus when the laser beam is irradiated to the resin plate 20A, and the occurrence of "burrs" and "dregs" caused by the blurring of the focus can be suppressed. For example, when the vapor deposition mask preparation body 60 is placed on the processing table 70 to form the resin mask opening 25, even when a gap is generated between the processing table 70 and the vapor deposition mask preparation body 60, the focus can be prevented from being blurred when the laser beam is irradiated to the resin plate 20A.
In the vapor deposition mask manufacturing method according to the other embodiment of the present invention, since the protective sheet 30 having self-adsorption property can be used as the protective sheet 30 constituting the vapor deposition mask preparation body 60, the protective sheet 30 can be closely adhered to the other surface of the resin plate 20A without any gap by utilizing the self-adsorption property. This can sufficiently suppress blurring of the focus when forming the resin mask openings 25 in the resin plate 20A, and can form the resin mask openings 25 that can realize formation of a high-definition vapor deposition pattern. The protective sheet 30 adsorbed on the other surface of the resin plate 20A serves to cover the other surface of the resin plate 20A, and even when the resin plate 20A is insufficiently decomposed and "dregs" of the resin plate 20A are generated at the stage of forming the resin mask opening 25 in the resin plate 20A, the adhesion of the "dregs" directly to the other surface of the resin plate 20A can be suppressed.
Further, in the vapor deposition mask manufacturing method according to the other embodiment of the present invention using the protective sheet 30 having self-adsorption property as the protective sheet 30 constituting the vapor deposition mask preparation body 60, the other surface of the resin plate 20A can be brought into close contact with the protective sheet 30 without causing strain or the like to the resin plate 20A. When a strain or the like is generated in the resin plate 20A when the protective sheet 30 is adhered to the resin plate 20A, the dimensional accuracy, positional accuracy, and the like of the resin mask opening 25 formed in the resin plate 20A tend to be reduced due to the strain or the like.
In the vapor deposition mask manufacturing method according to the other embodiment of the present invention, the recess portion that eventually becomes the resin mask opening 25 and the strength of the resin plate 20A in the vicinity of the recess portion can be prevented from decreasing, and in this regard, the occurrence of "burrs" and "residues" can be prevented. Specifically, in the case where the protective sheet 30 is assumed to be a resin plate, the thickness of the resin plate 20A in appearance can be increased. That is, the protective sheet 30 functions as a support that prevents the strength of the resin plate from being lowered, as well as preventing the focus from being blurred. The protection sheet 30 provided on the other surface of the resin plate 20A can prevent the reduction in strength of the resin plate 20A in the recess portion and the vicinity of the recess portion which eventually become the resin mask opening 25, and can suppress chipping and the like of a part of the resin plate 20A at the stage of forming the resin mask opening in the resin plate 20A by irradiation of the laser beam.
In the case where the resin mask opening 25 is formed in the resin plate 20A in a state where the vapor deposition mask preparation is fixed to the frame in order to reduce the alignment error between the frame and the vapor deposition mask, when the vapor deposition mask preparation is a "comparative vapor deposition mask preparation" in which the protective sheet 30 is not attached to the other surface of the resin plate 20A, the existence of the frame causes the "comparative vapor deposition mask preparation" to fail to adhere to the processing table 70 when the laser is irradiated, and when the formation of the resin mask opening 25 is performed in a state where the frame is fixed, the degree of focus blur increases. On the other hand, in the vapor deposition mask manufacturing method according to the other embodiment of the present invention, even when there is a gap between the vapor deposition mask preparation body 60 and the processing table 70, the presence of the protective sheet 30 adsorbed on the other surface of the resin plate 20A can prevent the occurrence of focus blur when the resin plate 20A forms the resin mask opening 25.
In the above description, the case where the resin mask opening 25 is formed in a state where the vapor deposition mask preparation body 60 is mounted on the processing table 70 has been described as an example, but the vapor deposition mask manufacturing method according to another embodiment of the present invention is not limited to the case where the vapor deposition mask preparation body 60 is mounted on the processing table 70, and the resin mask opening 25 may be formed by irradiating the resin plate 20A of the vapor deposition mask preparation body with laser light in a state where the vapor deposition mask preparation body 60 is not mounted on the processing table 70 but the vapor deposition mask preparation body 60 is fixed to the frame, or by a method other than that.
(example of a method for producing a vapor deposition mask preparation)
The vapor deposition mask preparation body 60 used in the vapor deposition mask manufacturing method according to the other embodiment of the present invention is not limited in any way as long as the conditions that the metal mask 10 is provided on one surface of the resin plate 20A and the protective sheet 30 having self-adsorption property is adsorbed on the other surface of the resin plate 20A are satisfied.
For example, the vapor deposition mask preparation body 60 can be obtained by preparing the metal mask 10 having the metal mask opening 15 formed in advance, adhering the metal mask 10 to the surface of one side of the resin plate 20A by a conventionally known method, for example, using an adhesive or the like, and adsorbing the protective sheet 30 having self-adsorption property to the surface of the other side of the resin plate 20A. The metal mask 10 may be attached to the surface of the resin plate 20A after the protective sheet 30 having self-absorption property is adsorbed to the surface of the other side of the resin plate 20A.
Further, a metal plate for obtaining the metal mask 10 may be prepared, and the metal plate may be bonded to one surface of the resin plate 20A to form the metal mask opening 15 penetrating only the metal plate, and then the protective sheet 30 having self-adsorption property may be adsorbed to the other surface of the resin plate 20A. The adsorption of the protective sheet 30 having self-adsorption property may be performed before the resin plate 20A is bonded to the metal plate, or may be performed at a stage after the resin plate 20A is bonded to the metal plate and before the metal mask opening 15 is formed. That is, the protective sheet 30 may be adsorbed at any stage before the resin mask opening 25 is formed in the resin plate 20A by irradiation with laser light.
Fig. 4 (a) to (d) are schematic cross-sectional views showing an example of a method of forming the vapor deposition mask preparation body 60, in the illustrated embodiment, after the resin plate 20A is provided on the metal plate 10A, the metal mask opening 15 is formed in the metal plate 10A, and thereafter, the protective sheet 30 having self-adsorption property is adsorbed on the surface of the resin plate 20A on the side not in contact with the metal mask.
As a method of forming the resin sheet 20A on the metal sheet 10A, there are mentioned a method in which a coating liquid obtained by dispersing or dissolving a resin serving as a material of the resin sheet 20A in an appropriate solvent is coated by a conventionally known coating method, and then dried. The resin plate 20A may be bonded to the metal plate 10A with an adhesive layer or the like interposed therebetween. In this method, as shown in fig. 4 (a), after the resin plate 20A is provided on the metal plate 10A, a resist material 62 is applied to the surface of the metal plate 10A, and the resist material is masked with a mask 63 having a pattern of metal mask openings formed thereon, and then exposed and developed. As a result, as shown in fig. 4 (b), a resist pattern 64 is formed on the surface of the metal plate 10A. Further, using the resist pattern 64 as an etching mask, only the metal plate 10A is etched, and after the etching is completed, the resist pattern is washed and removed. As a result, as shown in fig. 4 (c), a laminate in which the metal mask 10 having the metal mask opening 15 formed in the metal plate 10A is provided on the surface of the resin plate 20A is obtained. Next, as shown in fig. 4 (d), the protective sheet 30 having self-absorption property is adsorbed by its self-absorption property on the other surface of the resin plate 20A of the obtained laminate, thereby obtaining a vapor deposition mask preparation body 60.
The masking method of the resist material is not particularly limited, and as shown in fig. 4 a, the resist material 62 may be applied only to the surface of the metal plate 10A which is not in contact with the resin plate 20A, or the resist material 62 may be applied to the surfaces of the resin plate 20A and the metal plate 10A (not shown). Further, a dry film method of bonding a dry film resist to the surface of the metal plate 10A which is not in contact with the resin plate 20A, or to the surfaces of the resin plate 20A and the metal plate 10A may be used. The method of applying the resist material 62 is not particularly limited, and spin coating or spray coating may be employed in the case where the resist material 62 is applied only to the surface of the metal plate 10A which is not in contact with the resin plate 20A. On the other hand, when the material in which the resin plate 20A and the metal plate 10A are laminated is in the form of a long sheet, a dip coating method or the like capable of applying a resist material by a roll-to-roll method is preferably used. In the dip coating method, the resist material 62 is applied to the surfaces of the resin plate 20A and the metal plate 10A.
As the resist material, a material having good handling properties and desired sharpness is preferably used. The etching material used in the etching process is not particularly limited, and a known etching material may be appropriately selected.
The etching method of the metal plate 10A is not particularly limited, and for example, may be used: a spray etching method in which an etching material is sprayed from a spray nozzle at a predetermined spray pressure, a wet etching method such as a dipping etching method in an etching liquid filled with the etching material, a spin etching method in which the etching material is dropped, or a dry etching method using gas, plasma, or the like.
(protective sheet)
The protective sheet 30 constituting the vapor deposition mask preparation body 60 has self-adsorption property and peelability. The self-adsorption property of the protective sheet 30 described in the present specification means a property that the protective sheet 30 itself can be adsorbed to the other surface of the resin plate 20A by its own mechanism. Specifically, the present application refers to a property that the protective sheet can be adhered to the other surface of the resin sheet 20A without an adhesive material, an adhesive agent, or the like between the other surface of the resin sheet 20A and the protective sheet, and without the need to attract the resin sheet 20A and the protective sheet by an external mechanism, for example, by a magnet or the like. With such a protective sheet 30 having self-adsorption property, when in contact with the resin plate 20A, the protective sheet 30 can be adsorbed to the resin plate 20A while air is removed. The peelability of the protective sheet 30 is a property in which the protective sheet 30 adsorbed to the resin plate 20A is peeled off by lifting one end of the protective sheet 30 adsorbed to the resin plate 20A and continuing to lift the protective sheet 30 at an appropriate peeling angle. When the protective sheet 30 is peeled off, the protective sheet 30 is preferably lifted up at an appropriate peeling angle that does not accompany the deformation of the resin plate 20A. Suitable angles are, for example, to the extent of 45 ° or more and 180 ° or less, preferably 90 ° or more and 180 ° or less.
As the protective sheet 30 having self-absorption property, for example, there can be used: the protective sheet 30 exhibits self-adsorption by the action of the resin material itself constituting the protective sheet 30.
The resin material of the protective sheet 30 is not particularly limited as long as it can exhibit self-adsorption by the action of the resin material itself, and for example, conventionally known resin materials such as acrylic resin, silicone resin, polyurethane resin, polyester resin, epoxy resin, polyvinyl alcohol resin, cycloolefin resin, and polyethylene resin, which can exhibit self-adsorption, can be appropriately selected and used. Among them, the protective sheet 30 containing a silicone resin or polyurethane resin capable of exhibiting self-adsorption is excellent in air-expelling property when the protective sheet 30 is adsorbed to the resin plate 20A, and the protective sheet 30 can be adsorbed to the resin plate 20A with good adhesion as compared with the protective sheet 30 containing another resin material. Further, by using the protective sheet 30 containing a silicone resin or polyurethane resin capable of exhibiting self-adsorption, the peel strength between the resin sheet 20A and the protective sheet 30 can be reduced, and the protective sheet 30 can be peeled off without damaging the resin sheet 20A (resin mask 20) in which the resin mask opening 25 is finally formed. In this regard, silicone-based resins and polyurethane-based resins capable of exhibiting self-adsorption are preferable resin materials as the material of the protective sheet 30. Among them, polyurethane resins capable of imparting higher air-release properties are preferable. The protective sheet 30 may contain 1 resin alone or 2 or more resins. As the protective sheet 30 having the adsorptivity of the resin material itself, for example, a sheet-like material having the adsorptivity of the material itself described in japanese patent application laid-open No. 2008-36895, or the like can be used.
In addition to the protective sheet 30 having self-absorption property by the action of the resin material itself, the protective sheet 30 having a honeycomb structure on the surface thereof may be used. The honeycomb suction cup structure refers to a continuous fine concave-convex structure formed on the surface, which imparts self-absorption property to the protective sheet 30 by functioning as a suction cup. Examples of such a protective sheet 30 include a sheet having a honeycomb suction structure described in japanese patent application laid-open No. 2008-36895. As the resin material of the protective sheet 30 having the honeycomb suction cup structure, silicone resin and urethane resin are preferable.
The protective sheet 30 has self-adsorption property and peelability, and in the step of peeling the protective sheet 30 described later, the protective sheet 30 can be peeled off from the resin mask 20 having the resin mask openings 25 corresponding to the pattern to be vapor-deposited formed without performing another treatment, for example, dissolution treatment, UV irradiation treatment, or the like. When the peelability of the protective sheet 30 from the vapor deposition mask preparation body 60 is low, there is a risk that the resin plate 20A (resin mask 20) having the resin mask opening 25 formed therein may be damaged during peeling of the protective sheet 30, and the accuracy of the dimensions, positions, and the like of the formed resin mask opening 25 may be lowered. Further, there is a possibility that peeling marks or the like remain on the resin mask 20 having the resin mask openings 25 (synonymous with the resin plate 20A having the resin mask openings). In view of this, as the protective sheet 30, a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is preferably used, a protective sheet having a peel strength of 0.0012N/10mm or more and 0.012N/10mm or less is more preferably used, a protective sheet having a peel strength of 0.002N/10mm or more and 0.04N/10mm or less is more preferably used, and a protective sheet having a peel strength of 0.002N/10mm or more and 0.02N/10mm or less is more preferably used. By forming the vapor deposition mask preparation body 60 in which the protective sheet 30 having such peel strength is adsorbed on the other surface of the resin plate 20A, it is possible to suppress damage to the resin mask 20 in which the resin mask opening 25 is formed, occurrence of peeling marks on the resin mask 20, and the like when the protective sheet 30 is peeled from the resin mask 20 in which the resin mask opening 25 is formed.
The protective sheet 30 of the preferred embodiment has a transmittance of 70% or more, preferably 80% or more, at the wavelength of the laser light used to form the resin mask opening 25 in the resin plate 20A. With the protective sheet 30 of the preferred embodiment, when the laser beam is irradiated to form the resin mask opening 25 in the resin plate 20A, the protective sheet 30 can be prevented from being decomposed by the laser beam. Accordingly, various problems caused by the decomposition of the protective sheet 30, for example, the adhesion of "dross" generated by the decomposition of the protective sheet 30 to the inner wall surface of the resin mask opening 25 formed in the resin plate 20A, etc. can be suppressed. The wavelength of the laser light varies depending on the type of laser light used, and for example, in the case of using a polyimide resin as the material of the resin plate 20A, YAG laser light, excimer laser light, or the like may be used. In the micromachining, a YAG laser (third harmonic) having a laser beam wavelength of 355nm and an excimer laser (KrF) having a laser beam wavelength of 248nm are suitable. Therefore, when selecting the protective sheet 30, the material of the protective sheet 30 may be appropriately set so that the transmittance of the laser light reaches the above-described preferable transmittance according to the type of the laser light used. The method of setting the transmittance of the protective sheet 30 containing the silicone-based resin or polyurethane-based resin capable of exhibiting self-adsorption, which is exemplified as the preferable resin material, to the above-mentioned preferable transmittance range includes a method of reducing the thickness of the protective sheet 30 containing the silicone-based resin or polyurethane-based resin. The same applies to the case of using a resin material other than silicone resin or polyurethane resin as the resin material capable of exhibiting self-adsorption. In addition, the transmittance may be adjusted to the above-described preferable range using a resin material or the like which exhibits self-adsorption and high transparency.
The thickness of the protective sheet 30 is not particularly limited, but is preferably in the range of 1 μm or more and 100 μm or less, more preferably 2 μm or more and 75 μm or less, still more preferably 2 μm or more and 50 μm or less, particularly preferably 3 μm or more and 30 μm or less. By setting the thickness of the protective sheet 30 to the above-described preferred range, specifically, by setting the lower limit value of the thickness of the protective sheet 30 to the above-described preferred thickness, the follow-up property of the protective sheet 30 with respect to the resin plate 20A can be improved, and thus the adhesion between the resin plate 20A and the protective sheet 30 can be further improved. Further, by setting the thickness of the protective sheet 30 to 1 μm or more, the strength of the protective sheet 30 can be sufficiently improved, and the risk of breakage of the protective sheet 30, cracking of the protective sheet 30, or the like can be reduced when the resin mask opening is formed by irradiating the resin plate 20A with laser light. In particular, when the thickness of the protective sheet 30 is 3 μm or more, this risk can be further reduced. Further, by setting the upper limit value of the thickness of the protective sheet 30 to the above-described preferable thickness, transfer of the components constituting the protective sheet 30 to the resin plate 20A side can be sufficiently suppressed, and air-expelling performance can be further improved.
As the protective sheet 30, a protective sheet (not shown) integrated with a support member for supporting the protective sheet 30 by a support member may be used. By forming the support member-integrated protective sheet, even when the thickness of the protective sheet 30 itself is reduced, the operability of the protective sheet 30 and the like can be improved. The thickness of the support member is not particularly limited and may be appropriately set according to the thickness of the protective sheet 30, but is preferably 3 μm or more and 200 μm or less, more preferably 3 μm or more and 150 μm or less, still more preferably 3 μm or more and 100 μm or less, and particularly preferably 10 μm or more and 75 μm or less.
The material of the support member is not particularly limited, and a resin material, a glass material, or the like may be used, but from the viewpoint of flexibility or the like, a resin material is preferably used.
The protective sheet 30 is adsorbed to the other surface of the resin plate 20A at a position overlapping the resin mask opening 25 formed in the resin plate 20A in the thickness direction. As the protective sheet 30, 1 protective sheet 30 may be used alone, or a plurality of protective sheets 30 may be used. In the embodiment shown in fig. 5 (a) and (b), 1 protective sheet 30 is attached to the other surface of the resin plate 20A. Fig. 5 (a) is a front view of an exemplary vapor deposition mask preparation body 60 from the side of the protective sheet 30, and (b) is a schematic cross-sectional view. In the embodiment shown in fig. 5, the length of the protective sheet 30 in the lateral direction (the left-right direction in the drawing) is made smaller than the length of the resin plate 20A in the lateral direction, but the length of the protective sheet 30 in the lateral direction may be made the same as the length of the resin plate 20A in the lateral direction so that the surface positions of the end face of the protective sheet 30 and the end face of the resin plate 20A coincide, or the length of the protective sheet 30 in the lateral direction may be made larger than the length of the resin plate 20A in the lateral direction so that the outer periphery of the protective sheet 30 protrudes with respect to the resin plate 20A. The same applies to the longitudinal length of the protective sheet 30. The same applies to the protective sheet 30 of various embodiments described later.
As shown in fig. 6 (a) and (b), the protective sheet 30 of the preferred embodiment has a plurality of protective sheets 30 adsorbed on the other surface of the resin plate 20A. According to this embodiment, even when the resin plate 20A is enlarged, that is, when the vapor deposition mask 100 to be finally manufactured is enlarged, the risk of air or the like remaining between the other surface of the resin plate 20A and each protective sheet 30 can be reduced by miniaturizing the protective sheets 30, and the adhesion between the resin plate 20A and the protective sheets 30 can be easily improved. Further, when the protective sheet 30 is adsorbed on the other side surface of the resin sheet 20A, even if air or the like remains between the resin sheet 20A and a part of the protective sheets 30 among the plurality of protective sheets 30, it is sufficient to adsorb the protective sheet 30 having the air or the like remaining on the other side surface of the resin sheet 20A only by itself, and it is also preferable in terms of work efficiency.
The size of the protective sheet 30 in the case where a plurality of protective sheets 30 are attached is not particularly limited, and may be, for example, a size capable of covering 1 or more resin mask openings 25 among the resin mask openings finally formed, or may be a size capable of covering "1 screen" or a plurality of screens described later. The protective sheet 30 of the preferred embodiment has a size such that the plurality of protective sheets 30 overlap with "1 screen" or a plurality of screens that are finally formed on the resin plate 20A. In particular, in the vapor deposition mask of the preferred embodiment described later, since the interval between the respective screens is wider than the interval of the resin mask openings 25, it is preferable that the protective sheet 30 is made to cover the size of "1 screen" or a plurality of screens and is adsorbed at a position overlapping with "1 screen" or a plurality of screens in the thickness direction from the viewpoint of workability. In fig. 6, the area enclosed by the broken line is a predetermined area for arrangement of "1 screen".
In the embodiment shown in fig. 6, the vapor deposition mask preparation body 60 is sequentially adsorbed with the plurality of protective sheets 30 in the longitudinal direction and the lateral direction (up-down direction and left-right direction in the drawing) when viewed from the protective sheet 30 side, but as shown in fig. 7 (a), the plurality of protective sheets 30 extending in the longitudinal direction may be adsorbed in the lateral direction, or as shown in fig. 7 (b), the plurality of protective sheets 30 extending in the lateral direction may be adsorbed in the longitudinal direction. As shown in fig. 7 (c), a plurality of protective sheets 30 may be randomly adsorbed in a staggered manner.
< step of Forming openings of resin mask >
As shown in fig. 1 (b), this step is a step of irradiating the resin plate 20A with laser light from the metal mask 10 side through the metal mask opening 15 with respect to the vapor deposition mask preparation body 60 prepared as described above, and forming the resin mask opening 25 corresponding to the pattern to be vapor deposited on the resin plate 20A. In the illustrated embodiment, the laser irradiation is performed with respect to the vapor deposition mask preparation body 60 mounted on the processing table 70, but the processing table 70 may be any configuration in the vapor deposition mask manufacturing method according to another embodiment of the present invention, and the formation of the resin mask opening 25 may be performed without mounting the vapor deposition mask preparation body 60 on the processing table 70.
The laser device used in the present step is not particularly limited, and a conventionally known laser device may be used. In the present specification, the pattern to be vapor deposited refers to a pattern to be produced using the vapor deposition mask, and is, for example, in the case where the vapor deposition mask is used for forming an organic layer of an organic EL element, the shape of the organic layer.
< step of fixing vapor deposition mask preparation to frame >
In the vapor deposition mask manufacturing method according to another embodiment of the present application, a step of fixing the vapor deposition mask preparation body 60 to the frame body may be provided after any step or after any step before the formation of the resin mask opening 25. The present step is an arbitrary step in the vapor deposition mask manufacturing method of the present application, but by fixing the vapor deposition mask preparation body 60 to the frame body in advance at a stage before the resin plate 20A is irradiated with the laser beam to form the resin mask opening 25, the mounting error occurring when the vapor deposition mask 100 is fixed to the frame body can be made zero. Instead of fixing the vapor deposition mask preparation body 60 to the frame, a laminate in which the metal mask 10 is provided on one surface of the resin plate 20A or a laminate in which the metal plate 10A for obtaining a metal mask is provided on one surface of the resin plate 20A may be fixed to the frame, and then the protective sheet 30 having self-adsorption property may be adsorbed on the other surface of the resin plate 20A in the laminate.
The fixation of the frame and the vapor deposition mask preparation body may be performed on the surface of the frame or may be performed on the side surface of the frame.
When the vapor deposition mask preparation body 60 is laser-machined in a state of being fixed to the frame, depending on the state of adhesion between the frame and the vapor deposition mask preparation body 60, a gap may be generated between the vapor deposition mask preparation body 60 and the machining table 70, or the adhesion between the vapor deposition mask preparation body 60 and the machining table 70 may become insufficient to cause a gap to be generated microscopically, but since the vapor deposition mask preparation body 60 is configured such that the protective sheet 30 is adsorbed on the other surface of the resin plate 20A, the strength of the resin plate 20A may be prevented from being lowered by the presence of the protective sheet 30, or the focus may be blurred due to the gap between the resin plate 20A and the machining table 70. Therefore, the vapor deposition mask manufacturing method according to another embodiment of the present invention is particularly suitable for a case where the resin mask opening 25 is formed in a state where the vapor deposition mask preparation body 60 is fixed to the frame. As the frame, the frame described in the method for manufacturing a vapor deposition mask according to the embodiment of the present invention can be appropriately selected and used, and a detailed description thereof will be omitted.
< step of peeling off protective sheet >
In this step, as shown in fig. 1 (c), the resin mask 20 is obtained by forming the resin mask opening 25 in the resin plate 20A of the vapor deposition mask preparation body 60, and then the protective sheet 30 is peeled off from the resin mask 20. In other words, the protective sheet 30 is peeled off from the vapor deposition mask. By this step, the vapor deposition mask 100 is obtained by laminating the metal mask 10 having the metal mask opening and the resin mask 20 having the resin mask opening 25 corresponding to the pattern to be vapor deposited formed at the position overlapping the metal mask opening 15.
As described above, since the protective sheet 30 has peelability, it is unnecessary to perform a separate process, for example, a dissolving process for removing the protective sheet, a UV process, or the like, and the protective sheet 30 can be easily peeled from the resin mask 20 having the resin mask opening 25 formed therein by merely lifting up the protective sheet 30. Further, since the protective sheet 30 is adsorbed to the other surface of the resin plate 20A by its self-adsorption property, the surface of the resin plate 20A (resin mask 20) on which the resin mask opening 25 is formed is not contaminated with the material of the protective sheet 30 and the like, and no washing treatment or the like is required.
According to the vapor deposition mask manufacturing method according to the other embodiment of the present invention described above, the existence of the protective sheet 30 can manufacture a vapor deposition mask having a laminate of the resin mask 20 having the high-definition resin mask opening 25 and the metal mask with good yield.
Next, the advantages of the vapor deposition mask manufacturing method according to another embodiment of the present invention in which the resin plate 20A is provided with the resin mask opening in a state in which the protective sheet 30 having self-absorption property is attached to the other surface of the resin plate 20A of the vapor deposition mask preparation body 60 will be described.
The support member-integrated protective sheet (samples (1-1) to (1-7)) shown in table 2 below was attached to the other surface of the resin sheet of the vapor deposition mask preparation body so that the resin sheet faced the protective sheet, and laser light was irradiated from the metal mask side to form the resin mask opening 25, and the adsorptivity of the resin sheet 20A to the protective sheet, air-release property, resistance of the protective sheet at the time of laser processing, and presence or absence of burrs/residues were confirmed. In addition, the peelability was also confirmed when the support member-integrated protective sheet was peeled from the resin plate (resin mask having the resin mask opening formed therein) after the laser processing. In the sample (1-a), the resin mask opening was formed in the resin plate without providing a support member-integrated protective sheet. In addition, samples (1-6) and (1-7) were evaluated for only adsorptivity, air-release property and peelability.
As vapor deposition mask preparation bodies, a metal mask (invar material thickness 40 μm) having a metal mask opening formed in one surface of a resin plate (polyimide resin thickness 5 μm) and a support member-integrated protective sheet shown in table 2 below were used. YAG laser light with a wavelength of 355nm was used for the laser processing. The supporting member of the protective sheet constituting the supporting member-integrated type, the thickness of the protective sheet, and the transmittance of the protective sheet at a wavelength of 355nm are shown in table 2 below. The peel strength was measured as follows: the test sheet having a test tape (polyimide film having an adhesive on its surface (polyimide tape 5413 (manufactured by 3M Japan)) was bonded to a stainless steel plate such that the stainless steel plate faced the adhesive, and the test sheet was bonded to the polyimide film of the test sheet (samples (1-1) to (1-7)), and the peel strength (polyimide) of the test sheet when the test sheet was peeled 180 ° from the polyimide film of the test sheet was measured by an electromechanical universal tester (manufactured by 5900 series Instron corporation) in accordance with JIS Z-0237:2009.
In order to show the relationship between the thickness of the protective sheet provided on the other surface of the resin plate 20A and the damage to the protective sheet during laser processing, a layer (layer having no self-absorption property) having a thickness of 1 μm and a transmittance of 1% with respect to a wavelength of 355nm was formed by coating on the other surface of the resin plate 20A, and this was taken as a sample (1-B). Further, a layer (layer having no self-absorption property) having a thickness of 0.5 μm and a transmittance of 1% with respect to a wavelength of 355nm was formed on the other surface of the resin plate 20A by coating, and this was used as a sample (1-C). For these samples (1-B) and (1-C), the presence or absence of burrs and dross and the resistance of the coating layer during laser processing were evaluated. As a material of the coating layer, polyimide resin (photo electronics DL-1602Toray (ltd)) was used.
Test report
a) Standard name: JIS Z-0237:2009
b) The test method comprises the following steps: method 2
The tape was polyimide tape 5413 (3M Japan Co., ltd.)
c) Identification of materials: the product numbers (product names) are as shown in the table
d) Day of test and test site: 9 months, 3 days, 12 months, 7 days, qianye county, cypress city in 2015
e) Test results: interface disruption
Other) measuring device: electromechanical universal testing machine (5900 series Instron company)
As is apparent from the results of table 2 below, in comparison with the sample (1-a) in which the protective sheet 30 is not provided on the other surface of the resin plate 20A and the resin mask opening is formed in the resin plate 20A, the formation of burrs and residues can be suppressed and the high-definition resin mask opening can be formed by the vapor deposition mask preparation body in which the protective sheet 30 is provided on the other surface of the resin plate 20A and the samples (1-1) to (1-5) in which the resin mask opening is formed in the resin plate 20A. In addition, by using a protective sheet having self-adsorption property as the protective sheet 30, the protective sheet can be easily peeled off after forming the resin mask opening. Particularly, in the samples (1-1), (1-2) and (1-4) using the protective sheet made of the polyurethane resin or the silicone resin as the protective sheet having the self-absorption property, excellent results were obtained in the evaluation of the air release property and the peeling property. In addition, in the samples (1-1) to (1-6) using the protective sheet having a peel strength of less than 0.2N/10mm, damage to the resin mask at the time of peeling the protective sheet can be reduced as compared with the samples (1-7) using the protective sheet having a peel strength of 0.2N/10mm or more. In addition, according to samples (1-1) to (1-5), particularly samples (1-1), (1-2) and (1-4), in which a protective sheet having a peel strength of 0.04N/10mm or less, particularly 0.02N/10mm or less is used, damage to the resin mask at the time of peeling can be further reduced. In addition, in the sample (1-B) provided with a coating layer having a thickness of 1 μm in addition to the protective sheet having self-absorption property, cracks were generated in the coating layer at the time of laser processing, and in the sample (1-C) provided with a coating layer having a thickness of 0.5 μm, breakage was generated in the coating layer at the time of laser processing. In the samples (1-B) and (1-C) having a transmittance of less than 70%, the coating layer was laser-processed by absorbing the laser light, and burrs and dregs were slightly generated due to the laser light.
(vapor deposition mask produced by a method for producing a vapor deposition mask)
Fig. 9 (a) is a front view of a vapor deposition mask manufactured by the method for manufacturing a vapor deposition mask according to each embodiment of the present invention, when viewed from the metal mask side, and fig. 9 (b) is a schematic cross-sectional view of fig. 9 (a) from a section A-A.
In the illustrated embodiment, the opening shape of the resin mask opening 25 is rectangular, but the opening shape is not particularly limited, and the opening shape of the resin mask opening 25 may be diamond-shaped, polygonal-shaped, or a shape having curvature such as a circle or ellipse. The rectangular or polygonal opening shape is a preferable opening shape of the resin mask opening 25 in that the light emitting area can be increased as compared with an opening shape having a curvature such as a circle or an ellipse.
(resin mask)
The material of the resin mask 20 is not limited, and a material that can form the high-definition resin mask opening 25 by laser processing or the like, has a small dimensional change rate when heated or elapsed time, has a small moisture absorption rate, and is lightweight is preferably used. As such a material, there may be mentioned: polyimide resins, polyamide resins, polyamideimide resins, polyester resins, polyethylene resins, polyvinyl alcohol resins, polypropylene resins, polycarbonate resins, polystyrene resins, polyacrylonitrile resins, ethylene vinyl acetate copolymer resins, ethylene vinyl alcohol copolymer resins, ethylene methacrylic acid copolymer resins, polyvinyl chloride resins, polyvinylidene chloride resins, cellophane, ionomer resins, and the like. Among the above-mentioned materials, a resin material having a thermal expansion coefficient of 16 ppm/DEG C or less is preferable, a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material having both of these conditions is particularly preferable. By forming a resin mask using the resin material, the dimensional accuracy of the resin mask opening 25 can be improved, and the dimensional change rate and moisture absorption rate at the time of heat and time can be reduced. Therefore, as the resin plate 20A that finally becomes the resin mask 20 and constitutes the vapor deposition mask preparation body, for example, a resin plate made of a preferable resin material as exemplified above is preferably used.
The thickness of the resin mask 20 is not particularly limited, but in the case of further improving the effect of suppressing occurrence of shadows, the thickness of the resin mask 20 is preferably 25 μm or less, more preferably less than 10 μm. The preferable range of the lower limit value is not particularly limited, but when the thickness of the resin mask 20 is less than 3 μm, defects such as pinholes are likely to occur, and the risk of deformation and the like increases. In particular, by making the thickness of the resin mask 20 3 μm or more and less than 10 μm, more preferably 4 μm or more and 8 μm or less, the influence of shadow when forming a high-definition pattern exceeding 400ppi can be more effectively prevented. Further, the resin mask 20 and the metal mask 10 described later may be bonded directly or via an adhesive layer, but when the resin mask 20 and the metal mask 10 are bonded via an adhesive layer, the total thickness of the resin mask 20 and the adhesive layer is preferably within the above-described preferable thickness range. The shadow refers to a phenomenon in which a part of the vapor deposition material discharged from the vapor deposition source does not collide with the metal mask opening of the metal mask and the inner wall surface of the resin mask opening of the resin mask and reaches the vapor deposition target, and thus a non-vapor deposition portion having a film thickness smaller than the target vapor deposition film thickness is generated. Therefore, it is preferable that the resin mask 20 is finally formed, and the thickness of the resin plate 20A constituting the vapor deposition mask preparation body is set to the above thickness. The resin plate 20A may be bonded to the metal mask 10 with an adhesive layer or an adhesive layer interposed therebetween, or the resin plate 20A and the metal plate may be directly bonded to each other, but in the case of bonding the resin plate and the metal mask 10 with an adhesive layer or an adhesive layer interposed therebetween, in view of the above-described shadow, it is preferable to set the total thickness of the resin plate 20A, the adhesive layer or the resin plate 20A and the adhesive layer within the above-described preferable range.
The cross-sectional shape of the resin mask opening 25 is not particularly limited, and the end surfaces of the resin mask forming the resin mask opening 25 may be substantially parallel to each other, but as shown in fig. 9 (b), the cross-sectional shape of the resin mask opening 25 is preferably a shape that expands toward the vapor deposition source. In other words, it is preferable to have a tapered surface that expands toward the metal mask 10 side. The taper angle may be appropriately set in consideration of the thickness of the resin mask 20, but is preferably an angle formed by a straight line connecting the bottom end of the resin mask opening of the resin mask and the top end of the resin mask opening of the same resin mask and the bottom surface of the resin mask, that is, an angle formed by the inner wall surface of the resin mask opening 25 and the surface of the resin mask 20 (in the illustrated embodiment, the lower surface of the resin mask) on the side not in contact with the metal mask 10 in the thickness direction cross section of the inner wall surface of the resin mask opening 25 constituting the resin mask 20 is preferably in the range of 5 ° to 85 °, more preferably in the range of 15 ° to 75 °, and even more preferably in the range of 25 ° to 65 °. In particular, in this range, an angle smaller than the vapor deposition angle of the vapor deposition machine used is preferable. In the illustrated embodiment, the end surface of the resin mask opening 25 is formed in a straight line shape, but the shape is not limited to this, and the resin mask opening 25 may be formed in a curved shape protruding outward, that is, the entire shape of the resin mask opening 25 may be formed in a bowl shape. The resin mask opening 25 having such a cross-sectional shape can be formed by appropriately adjusting the irradiation position of the laser light or the irradiation energy of the laser light when the resin mask opening 25 is formed in the resin plate 20A, or by performing multi-stage laser irradiation in which the irradiation position is changed in stages.
(Metal mask)
As shown in fig. 9 (b), a metal mask 10 is laminated on one surface of the resin mask 20. The metal mask 10 is made of metal, and is provided with a metal mask opening portion 15 extending in the longitudinal direction or in the lateral direction. The metal mask opening 15 is synonymous with an opening, and is sometimes referred to as a slit. The arrangement example of the metal mask openings is not particularly limited, and the metal mask openings extending in the longitudinal direction and the transverse direction may be arranged in a plurality of rows in the longitudinal direction and the transverse direction, the metal mask openings extending in the longitudinal direction may be arranged in a plurality of rows in the transverse direction, and the metal mask openings extending in the transverse direction may be arranged in a plurality of rows in the longitudinal direction. In addition, only 1 column may be arranged in the longitudinal direction or the transverse direction. The terms "longitudinal" and "transverse" as used herein refer to the vertical direction and the horizontal direction of the drawing, and may be any of the longitudinal direction and the width direction of the vapor deposition mask, the resin mask, and the metal mask. For example, the longitudinal direction of the vapor deposition mask, the resin mask, and the metal mask may be regarded as "longitudinal direction", or the width direction may be regarded as "longitudinal direction". In the present application, the case where the shape of the vapor deposition mask is rectangular in plan view is described as an example, but other shapes such as a polygon such as a circle or a diamond may be used. In this case, the longitudinal direction, the radial direction, or any direction of the diagonal line may be referred to as a "longitudinal direction", and a direction perpendicular to the "longitudinal direction" may be referred to as a "width direction (also referred to as a" short side direction ").
The material of the metal mask 10 is not particularly limited, and materials conventionally known in the field of vapor deposition masks can be appropriately selected and used, and examples thereof include metal materials such as stainless steel, iron-nickel alloy, and aluminum alloy. Among them, invar alloy materials, which are iron-nickel alloys, are suitable for use because of their low deformation by heat.
The thickness of the metal mask 10 is not particularly limited, but is preferably 100 μm or less, more preferably 50 μm or less, and particularly preferably 35 μm or less in order to more effectively prevent occurrence of shadows. If the thickness is less than 5 μm, the risk of fracture and deformation increases, and handling tends to become difficult.
In the embodiment shown in fig. 9 (a), the opening shape of the metal mask opening 15 is rectangular in plan view, but the opening shape is not particularly limited, and the opening shape of the metal mask opening 15 may be any shape such as trapezoid, circle, or the like.
The cross-sectional shape of the metal mask opening 15 formed in the metal mask 10 is not particularly limited, but is preferably a shape that expands toward the vapor deposition source as shown in fig. 9 (b). More specifically, the angle formed by the straight line connecting the bottom end of the metal mask opening 15 of the metal mask 10 and the top end of the metal mask opening 15 of the same metal mask 10 and the bottom surface of the metal mask 10, that is, the angle formed by the inner wall surface of the metal mask opening 15 and the surface of the metal mask 10 on the side contacting the resin mask 20 (in the illustrated embodiment, the lower surface of the metal mask) in the thickness direction cross section of the inner wall surface of the metal mask opening 15 constituting the metal mask 10 is preferably in the range of 5 ° to 85 °, more preferably in the range of 15 ° to 80 °, and even more preferably in the range of 25 ° to 65 °. In particular, in this range, an angle smaller than the vapor deposition angle of the vapor deposition machine used is preferable.
Hereinafter, the vapor deposition mask according to a preferred embodiment manufactured by the vapor deposition mask manufacturing method according to each embodiment of the present invention will be described by taking the embodiment (a) and the embodiment (B) as examples.
< vapor deposition mask of embodiment (A) >
As shown in fig. 10, the vapor deposition mask 100 of the embodiment (a) is a vapor deposition mask for forming vapor deposition patterns of a plurality of screen portions at the same time, the metal mask 10 having a plurality of metal mask openings 15 is laminated on one surface of the resin mask 20, the resin mask 20 has resin mask openings 25 necessary for forming a plurality of screens, and each metal mask opening 15 is provided at a position overlapping at least the whole of 1 screen.
The vapor deposition mask 100 according to embodiment (a) is used for forming vapor deposition patterns in a plurality of screen portions at the same time, and vapor deposition patterns corresponding to a plurality of products can be formed simultaneously in 1 vapor deposition mask 100. The "resin mask opening" in the vapor deposition mask of the embodiment (a) means: when the vapor deposition mask 100 according to embodiment (a) is used for forming an organic layer in an organic EL display, the shape of the resin mask opening 25 is the shape of the organic layer. In addition, the "1 screen" is composed of an aggregate of the resin mask openings 25 corresponding to 1 product, and in the case where the 1 product is an organic EL display, the aggregate of the organic layers necessary for forming 1 organic EL display, that is, the aggregate of the resin mask openings 25 to be the organic layers is "1 screen". Further, in the vapor deposition mask 100 according to embodiment (a), in order to simultaneously form vapor deposition patterns of a plurality of screen portions, the aforementioned "1 screen" of the plurality of screen portions is arranged at a predetermined interval in the resin mask 20. That is, the resin mask 20 is provided with a resin mask opening 25 necessary for forming a plurality of screens.
The vapor deposition mask of embodiment (a) is provided with a metal mask 10 on one surface of the resin mask, and the metal mask 10 is provided with a plurality of metal mask openings 15, and each metal mask opening 15 is provided at a position overlapping at least 1 screen as a whole. In other words, between the resin mask openings 25 necessary for constituting 1 screen, there is no metal line portion having the same length as the longitudinal length of the metal mask openings 15 and the same thickness as the metal mask 10 between the resin mask openings 25 adjacent in the lateral direction, or there is no metal line portion having the same length as the transverse length of the metal mask openings 15 and the same thickness as the metal mask 10 between the resin mask openings 25 adjacent in the longitudinal direction. Hereinafter, the metal line portion having the same length as the longitudinal direction of the metal mask opening 15 and the same thickness as the metal mask 10, and the metal line portion having the same length as the lateral direction of the metal mask opening 15 and the same thickness as the metal mask 10 are also collectively referred to simply as metal line portions.
According to the vapor deposition mask 100 of the embodiment (a), even when the size of the resin mask openings 25 and the pitch between the resin mask openings 25 are extremely small for forming a screen exceeding 400ppi, for example, in the case where the size of the resin mask openings 25 and the pitch between the resin mask openings 25 necessary for forming 1 screen are narrowed, interference due to the metal line portions can be prevented, and a high-definition image can be formed. When 1 screen is divided by a plurality of metal mask openings, that is, when a metal line portion having the same thickness as the metal mask 10 is present between the resin mask openings 25 constituting 1 screen, the metal line portion present between the resin mask openings 25 becomes an obstacle when forming a vapor deposition pattern on a vapor deposition object as the pitch between the resin mask openings 25 constituting 1 screen becomes narrower, and it becomes difficult to form a high-definition vapor deposition pattern. In other words, when a metal line portion having the same thickness as the metal mask 10 is present between the resin mask openings 25 constituting 1 screen, the metal line portion causes shadow generation at the time of manufacturing the vapor deposition mask with a frame, and it is difficult to form a high-definition screen.
Next, an example of the resin mask opening 25 constituting 1 screen will be described with reference to fig. 10 to 13. In the illustrated embodiment, the area enclosed by the broken line is 1 screen. In the illustrated embodiment, for convenience of explanation, the aggregate of a small number of the resin mask openings 25 is taken as 1 screen, but the present invention is not limited to this embodiment, and for example, when 1 resin mask opening 25 is taken as 1 pixel, millions of pixels of the resin mask openings 25 may be present in 1 screen.
In the embodiment shown in fig. 10, 1 screen is constituted by an aggregate of the resin mask openings 25 formed by providing a plurality of resin mask openings 25 in the longitudinal direction and the lateral direction. In the embodiment shown in fig. 11, 1 screen is constituted by an aggregate of the resin mask openings 25 formed by providing a plurality of resin mask openings 25 in the lateral direction. In the embodiment shown in fig. 12, 1 screen is constituted by an aggregate of the resin mask openings 25 formed by providing a plurality of resin mask openings 25 in the longitudinal direction. Further, in fig. 10 to 12, a metal mask opening 15 is provided at a position overlapping with the entire 1 screen.
As described above, the metal mask opening 15 may be provided at a position overlapping only 1 screen, or may be provided at a position overlapping the entire screen of 2 or more screens as shown in fig. 13 (a) and (b). In fig. 13 (a), in the vapor deposition mask 100 shown in fig. 10, a metal mask opening 15 is provided at a position overlapping the entire 2 consecutive frames in the lateral direction. In fig. 13 (b), a metal mask opening 15 is provided at a position overlapping the entire 3 frames continuous in the longitudinal direction.
Next, an example of the embodiment shown in fig. 10 will be described with respect to the pitch between the resin mask openings 25 constituting 1 screen and the pitch between the screens. The pitch between the resin mask openings 25 constituting 1 screen and the size of the resin mask openings 25 are not particularly limited, and may be appropriately set according to the pattern to be vapor-deposited. For example, in the case of forming a high-definition vapor deposition pattern of 400ppi, the pitch (P1) in the lateral direction and the pitch (P2) in the longitudinal direction of the adjacent resin mask openings 25 are about 60 μm in the resin mask openings 25 constituting 1 screen. In addition, the size of the resin mask opening was 500. Mu.m 2 Above and 1000 μm 2 The following ranges. The number of pixels is not limited to 1 and 1 resin mask opening 25 corresponds to 1 pixel, and a plurality of pixels may be collected into 1 resin mask opening 25, for example, according to the pixel arrangement.
The lateral pitch (P3) and the vertical pitch (P4) between the frames are not particularly limited, but when 1 metal mask opening 15 is provided at a position overlapping with 1 frame as a whole, as shown in fig. 10, a metal line portion exists between the frames. Therefore, when the vertical pitch (P4) and the horizontal pitch (P3) between the respective screens are smaller than or substantially equal to the vertical pitch (P2) and the horizontal pitch (P1) of the resin mask openings 25 provided in 1 screen, the metal line portions existing between the respective screens are likely to be broken. Therefore, in view of this, it is preferable to make the pitch (P3, P4) between the screens wider than the pitch (P1, P2) between the resin mask openings 25 constituting 1 screen. As an example of the inter-screen pitch (P3, P4), the range is 1mm or more and 100mm or less. The inter-screen pitch refers to a pitch between adjacent resin mask openings in 1 screen and other screens adjacent to the 1 screen. The same applies to the pitch of the resin mask openings 25 and the pitch between the screens in the vapor deposition mask according to embodiment (B) described below.
As shown in fig. 13, when 1 metal mask opening 15 is provided at a position overlapping the entire 2 or more frames, no metal line portion constituting the inner wall surface of the metal mask opening is present between the frames provided in 1 metal mask opening 15. Therefore, in this case, the pitch between 2 or more frames provided at the position overlapping with 1 metal mask opening 15 is substantially equal to the pitch between resin mask openings 25 constituting 1 frame.
The resin mask 20 may be formed with grooves (not shown) extending in the longitudinal direction or the transverse direction of the resin mask 20. When heat is applied during vapor deposition, there is a possibility that the resin mask 20 thermally expands to change the size and position of the resin mask opening 25, and by forming the grooves, expansion of the resin mask can be absorbed, and the resin mask 20 can be prevented from expanding in a given direction as a whole due to accumulation of thermal expansion generated at each portion of the resin mask, thereby changing the size and position of the resin mask opening 25. The position of the groove is not limited, and may be set between the resin mask openings 25 constituting 1 screen or at a position overlapping the resin mask openings 25, but is preferably set between the screens. The grooves may be provided only on the surface of the resin mask, for example, on the surface of the resin mask that is in contact with the metal mask, or may be provided only on the surface of the resin mask that is not in contact with the metal mask. Alternatively, it may be provided on both sides of the resin mask 20.
In addition, grooves extending in the longitudinal direction may be formed between adjacent pictures, or grooves extending in the lateral direction may be formed between adjacent pictures. Further, grooves may be formed in an embodiment in which these are combined.
The depth and width of the groove are not particularly limited, but in the case where the depth of the groove is too deep or the case where the width is too wide, there is a tendency that the rigidity of the resin mask 20 is lowered, and therefore, it is necessary to set in consideration of this. The cross-sectional shape of the groove is not particularly limited, and may be U-shaped, V-shaped, or the like, and may be arbitrarily selected in consideration of a processing method or the like. The same applies to the vapor deposition mask of embodiment (B).
< vapor deposition mask of embodiment (B) >
The vapor deposition mask according to embodiment (B) will be described below. As shown in fig. 14, the vapor deposition mask of embodiment (B) has a metal mask 10 having 1 metal mask opening (1 hole 16) formed therein laminated on the surface of the resin mask 20 having a plurality of resin mask openings 25 corresponding to the pattern to be vapor deposited, and all of the plurality of resin mask openings 25 are formed at positions overlapping with the 1 holes formed in the metal mask 10.
The resin mask openings 25 in the vapor deposition mask of the embodiment (B) are resin mask openings necessary for forming a vapor deposition pattern on the vapor deposition object, and resin mask openings unnecessary for forming a vapor deposition pattern on the vapor deposition object may be provided at positions not overlapping with 1 hole 16. Fig. 14 is a front view of a vapor deposition mask showing an example of the vapor deposition mask of embodiment (B) as viewed from the metal mask side.
The vapor deposition mask 100 of embodiment (B) includes a metal mask 10 having 1 hole 16 provided on a resin mask 20 having a plurality of resin mask openings 25, and the plurality of resin mask openings 25 are all provided at positions overlapping the 1 hole 16. In the vapor deposition mask 100 of the embodiment (B) having such a configuration, since the metal line portion having the same thickness as the metal mask or a thickness thicker than the metal mask does not exist between the resin mask openings 25, as described in the vapor deposition mask of the embodiment (a), a highly precise vapor deposition pattern can be formed in accordance with the size of the resin mask openings 25 provided in the resin mask 20 without being disturbed by the metal line portion.
Further, according to the vapor deposition mask of the embodiment (B), even when the thickness of the metal mask 10 is increased, the metal mask 10 is not substantially affected by shadows, so that the thickness of the metal mask 10 can be increased to sufficiently satisfy durability and operability, and the durability and operability can be improved while forming a high-definition vapor deposition pattern.
As shown in fig. 14, the resin mask 20 in the vapor deposition mask of embodiment (B) is formed of resin, and a plurality of resin mask openings 25 corresponding to the pattern to be vapor deposited are provided at positions overlapping with 1 hole 16. The resin mask opening 25 corresponds to a pattern to be vapor-deposited, and a vapor deposition pattern corresponding to the resin mask opening 25 can be formed in the vapor deposition target by passing a vapor deposition material discharged from a vapor deposition source through the resin mask opening 25. In the illustrated embodiment, the resin mask openings are arranged in a plurality of rows in the longitudinal direction, but may be arranged only in the longitudinal direction or the lateral direction.
The "1 screen" in the vapor deposition mask 100 of the embodiment (B) refers to an aggregate of the openings 25 corresponding to 1 product, and in the case where the 1 product is an organic EL display, an aggregate of the organic layers necessary for forming 1 organic EL display, that is, an aggregate of the resin mask openings 25 to be the organic layers is "1 screen". The vapor deposition mask of embodiment (B) may be composed of only "1 screen", or may be configured with "1 screen" of a plurality of screen portions, and in the case of "1 screen" of a plurality of screen portions, it is preferable that the resin mask openings 25 are provided at predetermined intervals per unit screen (see fig. 10 of the vapor deposition mask of embodiment (a)). The embodiment of "1 screen" is not particularly limited, and for example, when 1 resin mask opening 25 is 1 pixel, 1 screen may be constituted by millions of resin mask openings 25.
The metal mask 10 in the vapor deposition mask 100 of embodiment (B) has 1 hole 16 made of metal. In the present invention, the 1 hole 16 is arranged at a position overlapping with all of the resin mask openings 25 when viewed from the front of the metal mask 10, that is, at a position where all of the resin mask openings 25 arranged in the resin mask 20 can be observed.
The metal portions constituting the metal mask 10, that is, the portions other than the 1 hole 16 may be provided along the outer edge of the vapor deposition mask 100 as shown in fig. 14, or the outer peripheral portion of the resin mask 20 may be exposed by making the size of the metal mask 10 smaller than that of the resin mask 20 as shown in fig. 15. In addition, the metal mask 10 may be larger in size than the resin mask 20, so that a part of the metal portion protrudes laterally outward or longitudinally outward of the resin mask. In any case, the size of 1 hole 16 is smaller than the size of the resin mask 20.
The width (W1) in the lateral direction and the width (W2) in the longitudinal direction of the metal portion of the metal mask 10 forming the wall surfaces of 1 hole 16 shown in fig. 14 are not particularly limited, but durability and operability tend to be reduced as the widths of W1 and W2 become narrower. Therefore, W1 and W2 are preferably wide enough to satisfy durability and operability. Although a suitable width may be appropriately set according to the thickness of the metal mask 10, as an example of a preferable width, W1 and W2 are each in a range of 1mm to 100mm as in the metal mask in the vapor deposition mask of embodiment (a).
Therefore, in the vapor deposition mask manufacturing method according to the embodiment of the present invention, it is preferable to specify the position of the protective sheet 30 on the other surface of the resin plate 20A, the laser irradiation in the step of forming the resin mask opening 25, and the like so that the finally manufactured vapor deposition mask is the preferred embodiment described above. In the case where the protective sheet 30 is provided on the other surface of the resin plate 20A, the size and arrangement position of the final vapor deposition mask are preferably determined so that the final vapor deposition mask is the preferred embodiment described above.
In the vapor deposition mask manufacturing method according to another embodiment of the present invention, it is preferable to specify the position of the protective sheet 30 to be adsorbed on the other surface of the resin plate 20A, the laser irradiation in the step of forming the resin mask opening 25, and the like so that the finally manufactured vapor deposition mask is the preferred embodiment described above. In the case where the protective sheet 30 is adsorbed onto the other surface of the resin plate 20A, the size and the adsorption position of the finally produced vapor deposition mask are preferably determined so that the finally produced vapor deposition mask is the preferred embodiment described above.
The vapor deposition mask with a frame can also be obtained by using the method for manufacturing a vapor deposition mask according to the embodiment of the present invention and the method for manufacturing a vapor deposition mask according to another embodiment of the present invention. Fig. 16 and 17 are front views of a vapor deposition mask 200 with a frame, the vapor deposition mask 200 with a frame being formed by fixing a vapor deposition mask obtained by a method for manufacturing a vapor deposition mask according to an embodiment of the present invention and a method for manufacturing a vapor deposition mask according to another embodiment of the present invention to a frame 40, as viewed from the resin mask side. As shown in fig. 16, 1 vapor deposition mask 10 may be fixed to the frame 40, or as shown in fig. 17, a plurality of vapor deposition masks 100 may be fixed to the frame 40. The vapor deposition mask with frame 200 according to the embodiment of the present invention may be obtained by fixing a vapor deposition mask obtained by the method for manufacturing a vapor deposition mask according to another embodiment of the present invention to the frame 40, or may be obtained by fixing a vapor deposition mask preparation body to the frame 40 in advance. The vapor deposition mask with a frame according to the embodiment shown in fig. 17 may be obtained by fixing a plurality of vapor deposition masks obtained by the vapor deposition mask manufacturing method according to the embodiment of the present invention or the vapor deposition mask manufacturing method according to another embodiment of the present invention to the frame 40, or may be obtained by fixing a plurality of vapor deposition mask preparation bodies 60 to the frame 40 in advance.
< vapor deposition mask preparation body >
Next, a vapor deposition mask preparation body according to an embodiment of the present invention will be described. The vapor deposition mask preparation according to the embodiment of the present invention is a vapor deposition mask preparation for obtaining a vapor deposition mask comprising a laminate of a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening, wherein the metal mask 10 is provided on one surface of a resin plate 20A for obtaining a resin mask 20, and wherein a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate 20A. The vapor deposition mask preparation body according to the embodiment of the present invention corresponds to the vapor deposition mask preparation body 60 (see fig. 1 (a)) described in the "step of preparing the vapor deposition mask preparation body" in the vapor deposition mask manufacturing method according to the embodiment of the present invention, and a detailed description thereof is omitted here. According to the vapor deposition mask preparation body 60 according to the embodiment of the present invention, the resin mask 20 is obtained by forming the resin mask opening 25 in the resin plate 20A of the vapor deposition mask preparation body 60, and then the protective sheet 30 is peeled off from the resin mask 20, whereby the vapor deposition masks according to the various embodiments described above can be obtained.
The vapor deposition mask preparation according to the embodiment of the present invention is a preparation for obtaining a vapor deposition mask comprising a laminate of a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening, in which a metal plate 10A for obtaining a metal mask 10 is provided on one surface of a resin plate 20A for obtaining a resin mask 20, and a protective sheet having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 is provided on the other surface of the resin plate 20A, similarly to the vapor deposition mask preparation according to the embodiment of the present invention. That is, the vapor deposition mask preparation body 60 of the modified embodiment differs from the vapor deposition mask preparation body according to the embodiment of the present invention only in that: instead of the metal mask 10 having the metal mask opening 15 formed therein, the metal plate 10A before the metal mask opening 15 is formed is provided on the surface of the resin plate 20A on one side. According to the vapor deposition mask preparation of the modified embodiment, the metal mask 10 is obtained by forming the metal mask opening in the metal plate 10A of the vapor deposition mask preparation, and then the resin mask 20 is obtained by irradiating the resin plate 20A with laser light from the metal mask 10 side through the metal mask opening 15 formed, thereby forming the resin mask opening 25, and then the protective sheet 30 is peeled off from the resin mask 20, thereby obtaining the vapor deposition masks of the various embodiments described above.
According to the vapor deposition mask preparation body according to the embodiment of the present invention described above, when the resin mask opening 25 is formed in the resin plate 20A by the laser beam, the occurrence of "burrs" and "residues" in the formed resin mask 20 can be suppressed, and a vapor deposition mask in which the resin mask 20 having the high-definition resin mask opening 25 and the metal mask 10 having the metal mask opening 15 are laminated can be obtained.
The vapor deposition mask preparation according to another embodiment of the present invention is a preparation for obtaining a vapor deposition mask formed by laminating a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening, wherein the metal mask 10 is provided on one surface of a resin plate 20A for obtaining a resin mask 20, and a protective sheet 30 having self-absorption and peeling properties is adsorbed on the other surface of the resin plate 20A. The vapor deposition mask preparation body according to another embodiment of the present invention corresponds to the vapor deposition mask preparation body 60 (see fig. 1 (a)) described in the "process for preparing a vapor deposition mask preparation body" in the vapor deposition mask manufacturing method according to another embodiment of the present invention, and a detailed description thereof is omitted here. According to the vapor deposition mask preparation body 60 according to another embodiment of the present invention, the resin mask 20 is obtained by forming the resin mask opening 25 in the resin plate 20A of the vapor deposition mask preparation body 60, and then the protective sheet 30 is peeled off from the resin mask 20, whereby the vapor deposition masks according to the various embodiments described above can be obtained.
A modification of the vapor deposition mask preparation according to another embodiment of the present invention (hereinafter referred to as another modification of the vapor deposition mask preparation) is a preparation for obtaining a vapor deposition mask comprising a laminate of a metal mask having a metal mask opening and a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited at a position overlapping the metal mask opening, in which a metal plate 10A for obtaining a metal mask 10 is provided on one surface of a resin plate 20A for obtaining a resin mask 20, and a protective sheet 30 having self-absorption and peeling properties is adsorbed on the other surface of the resin plate 20A, similarly to the vapor deposition mask preparation according to the other embodiment of the present invention. That is, the vapor deposition mask preparation body 60 according to another modification is different from the vapor deposition mask preparation body according to the other embodiment of the present invention described above only in that the metal plate 10A before the formation of the metal mask opening 15 is provided on the surface of the resin plate 20A instead of the metal mask 10 in which the metal mask opening 15 is formed. According to another modified vapor deposition mask preparation, a metal mask 10 is obtained by forming a metal mask opening in a metal plate 10A of the vapor deposition mask preparation, then a resin mask 20 is obtained by irradiating a resin plate 20A with laser light from the metal mask 10 side through the metal mask opening 15 thus formed to form a resin mask opening 25, and then the protective sheet 30 is peeled off from the resin mask 20, whereby the vapor deposition masks of the various embodiments described above are obtained.
According to the vapor deposition mask preparation body according to the other embodiment of the present invention described above, when the resin mask opening 25 is formed in the resin plate 20A by the laser beam, the occurrence of "burrs" and "residues" in the formed resin mask 20 can be suppressed, and a vapor deposition mask in which the resin mask 20 having the high-definition resin mask opening 25 and the metal mask 10 having the metal mask opening 15 are laminated can be obtained.
< vapor deposition mask >
Next, a vapor deposition mask according to an embodiment of the present invention will be described. The vapor deposition mask 100 according to the embodiment of the present invention has a metal mask 10 having a metal mask opening 15 provided on one surface of a resin mask 20 having a resin mask opening 25, and a protective sheet 30 having a peel strength of 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009 provided on the other surface of the resin mask 20 (see fig. 19).
The vapor deposition mask 100 according to the embodiment of the present invention is the same as the vapor deposition mask preparation body according to the embodiment of the present invention described above except that the resin plate 20A is the resin mask 20 having the resin mask opening 25, and a detailed description thereof is omitted here.
As shown in fig. 19, the vapor deposition mask according to another embodiment of the present invention is provided with a metal mask 10 having a metal mask opening 15 on one surface of a resin mask 20 having a resin mask opening 25, and a protective sheet 30 having self-adsorption and peeling properties is adsorbed on the other surface of the resin mask 20.
The vapor deposition mask according to the other embodiments of the present invention is the same as the vapor deposition mask preparation body according to the other embodiments of the present invention described above except that the resin plate 20A is made of the resin mask 20 having the resin mask opening 25, and a detailed description thereof is omitted here.
Method for producing organic semiconductor device
Next, a method for manufacturing an organic semiconductor device according to an embodiment of the present invention will be described. The method for manufacturing an organic semiconductor device according to an embodiment of the present invention includes a step of forming a vapor deposition pattern on a vapor deposition target using a vapor deposition mask with a frame to which a vapor deposition mask is fixed, and in the step of forming a vapor deposition pattern, the vapor deposition mask fixed to the frame is a vapor deposition mask manufactured by the method for manufacturing a vapor deposition mask according to the embodiment of the present invention described above.
The method for manufacturing an organic semiconductor device according to another embodiment of the present invention includes a step of forming a vapor deposition pattern on a vapor deposition target using a vapor deposition mask with a frame to which a vapor deposition mask is fixed, and in the step of forming a vapor deposition pattern, the vapor deposition mask fixed to the frame is a vapor deposition mask manufactured by the method for manufacturing a vapor deposition mask according to another embodiment of the present invention described above.
The method for manufacturing an organic semiconductor device according to an embodiment of the present invention, which includes a step of forming a vapor deposition pattern by a vapor deposition method using a vapor deposition mask with a frame, and the method for manufacturing an organic semiconductor device according to another embodiment of the present invention, include an electrode forming step of forming an electrode on a substrate, an organic layer forming step, a counter electrode forming step, a sealing layer forming step, and the like, and in each arbitrary step, a vapor deposition pattern can be formed on a substrate by a vapor deposition method using a vapor deposition mask with a frame. For example, in the case where a vapor deposition method using a vapor deposition mask with a frame is used in the process of forming the light-emitting layers of the respective colors R (red), G (green), and B (blue) of the organic EL device, vapor deposition patterns of the light-emitting layers of the respective colors can be formed on the substrate. The method for manufacturing an organic semiconductor element according to the embodiment of the present invention and the method for manufacturing an organic semiconductor element according to another embodiment of the present invention are not limited to these steps, and can be applied to any step in the manufacture of a conventionally known organic semiconductor element by vapor deposition.
The vapor deposition mask with a frame having a vapor deposition mask fixed to the frame, which is used in the step of forming the vapor deposition pattern, is manufactured by the method for manufacturing a vapor deposition mask according to the embodiment of the present invention described above, and the method for manufacturing a vapor deposition mask according to the other embodiment of the present invention, and detailed description thereof is omitted here. According to the method for manufacturing a vapor deposition mask according to the embodiment of the present invention and the method for manufacturing a vapor deposition mask according to another embodiment of the present invention, a vapor deposition mask having a resin mask 20 in which a resin mask opening 25 corresponding to a pattern to be vapor-deposited is formed with high accuracy can be obtained, and therefore, according to the method for manufacturing an organic semiconductor element using a vapor deposition mask having a frame body in which the vapor deposition mask is fixed to a frame body, an organic semiconductor element having a high-definition pattern can be formed. Examples of the organic semiconductor device manufactured by the method for manufacturing an organic semiconductor device according to the embodiment of the present invention include the method for manufacturing an organic semiconductor device according to another embodiment of the present invention: an organic layer, a light-emitting layer, a cathode electrode, and the like of the organic EL element. In particular, the method for manufacturing an organic semiconductor device according to the embodiment of the present invention can be suitably used for manufacturing R (red), G (green), and B (blue) light-emitting layers of an organic EL device requiring high fine pattern accuracy.
Method for producing organic EL display
Next, a method for manufacturing an organic EL display (organic electroluminescent element display) according to an embodiment of the present invention (hereinafter referred to as a method for manufacturing an organic EL display according to the present invention) will be described. The method for manufacturing an organic EL display of the present invention can use the organic semiconductor element manufactured by the method for manufacturing an organic semiconductor element of the present invention described above in the step of manufacturing an organic EL display.
In addition, in the method for manufacturing an organic EL display according to another embodiment of the present invention, the organic semiconductor element manufactured by the method for manufacturing an organic semiconductor element according to another embodiment of the present invention described above can be used in the step for manufacturing an organic EL display.
Examples of the organic EL display that can use the organic semiconductor element manufactured by the method for manufacturing an organic semiconductor element according to the present invention and the method for manufacturing an organic EL display according to another embodiment of the present invention include: an organic EL display for a notebook computer (see fig. 18 (a)), a tablet terminal (see fig. 18 (b)), a mobile phone (see fig. 18 (c)), a smart phone (see fig. 18 (d)), a video camera (see fig. 18 (e)), a digital camera (see fig. 18 (f)), a smart watch (see fig. 18 (g)), and the like.
Claims (18)
1. A vapor deposition mask with a protective sheet, comprising a vapor deposition mask comprising a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited and a protective sheet provided on the vapor deposition mask,
the protective sheet is a sheet-like object,
the protective sheet is directly attached to the vapor deposition mask,
the peel strength of the protective sheet is 0.0004N/10mm or more and less than 0.2N/10mm based on JIS Z-0237:2009.
2. A vapor deposition mask with a protective sheet, comprising a vapor deposition mask comprising a resin mask having a resin mask opening corresponding to a pattern to be vapor deposited and a protective sheet provided on the vapor deposition mask,
the protective sheet comprises a silicone resin having self-adsorption property and peelability.
3. The vapor deposition mask with protective sheet according to claim 1 or 2, wherein,
the vapor deposition mask includes a metal layer provided on one surface side of the resin mask,
the protective sheet is located on the other surface side of the resin mask.
4. The vapor deposition mask with protective sheet according to claim 1 or 2, wherein,
the vapor deposition mask is provided with a plurality of the protective sheets.
5. The vapor deposition mask with protective sheet according to claim 1 or 2, wherein,
the vapor deposition mask is provided with 1 protective sheet.
6. The vapor deposition mask with protective sheet according to claim 1 or 2, wherein,
the resin mask opening is formed by irradiating a laser beam to the resin plate.
7. The vapor deposition mask with protective sheet according to claim 6, wherein,
the protective sheet has a transmittance of 70% or more with respect to the wavelength of the laser light.
8. The vapor deposition mask with protective sheet according to claim 6, wherein,
the protective sheet has a transmittance of 80% or more with respect to the wavelength of the laser light.
9. The vapor deposition mask with protective sheet according to claim 1, wherein,
the resin sheet contains at least one selected from the group consisting of an acrylic resin, a polyester resin, an epoxy resin, a polyvinyl alcohol resin, a cycloolefin resin, and a polyethylene resin.
10. The vapor deposition mask with protective sheet according to claim 1, wherein,
the protective sheet comprises any one or both of silicone resin and urethane resin.
11. The vapor deposition mask with protective sheet according to claim 1 or 2, wherein,
the resin mask side surface of the protective sheet has a concave-convex structure.
12. The vapor deposition mask with protective sheet according to claim 1 or 2, wherein,
the thickness of the protective sheet is 1 μm or more and 100 μm or less.
13. The vapor deposition mask with protective sheet according to claim 1 or 2, wherein,
a support member is provided on a surface of the protective sheet opposite to the resin mask.
14. The vapor deposition mask with protective sheet according to claim 13, wherein,
the support member includes a glass material or a resin material.
15. The vapor deposition mask with protective sheet according to claim 13, wherein,
the thickness of the support member is 3 μm or more and 200 μm or less.
16. The vapor deposition mask with protective sheet according to claim 1, wherein,
the protective sheet has self-adsorption property.
17. A frame-integrated vapor deposition mask with a protective sheet, wherein the vapor deposition mask with a protective sheet according to any one of claims 1 to 16 is fixed to a frame.
18. A frame-integrated vapor deposition mask with a protective sheet, wherein a plurality of the vapor deposition masks with protective sheets according to any one of claims 1 to 16 are fixed to a frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010960637.0A CN112176284B (en) | 2015-07-03 | 2016-06-29 | Method for manufacturing vapor deposition mask, organic semiconductor element, and organic EL display, vapor deposition mask preparation body, and vapor deposition mask |
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015134805 | 2015-07-03 | ||
| JP2015-134806 | 2015-07-03 | ||
| JP2015134806 | 2015-07-03 | ||
| JP2015-134805 | 2015-07-03 | ||
| JP2016-128114 | 2016-06-28 | ||
| JP2016128114A JP6160747B2 (en) | 2015-07-03 | 2016-06-28 | Vapor deposition mask manufacturing method, vapor deposition mask preparation, organic semiconductor element manufacturing method, and vapor deposition mask |
| PCT/JP2016/069250 WO2017006821A1 (en) | 2015-07-03 | 2016-06-29 | Method for producing deposition mask, deposition mask preparation body, method for producing organic semiconductor element, method for producing organic el display, and deposition mask |
| CN201680036462.6A CN107709602B (en) | 2015-07-03 | 2016-06-29 | Method for manufacturing vapor deposition mask, method for manufacturing organic semiconductor element, method for manufacturing organic EL display, vapor deposition mask preparation body, and vapor deposition mask |
| CN202010960637.0A CN112176284B (en) | 2015-07-03 | 2016-06-29 | Method for manufacturing vapor deposition mask, organic semiconductor element, and organic EL display, vapor deposition mask preparation body, and vapor deposition mask |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| WO2018142464A1 (en) | 2017-01-31 | 2018-08-09 | 堺ディスプレイプロダクト株式会社 | Production method for vapor deposition mask, vapor deposition mask, and production method for organic semiconductor element |
| JP6588125B2 (en) * | 2018-04-26 | 2019-10-09 | 堺ディスプレイプロダクト株式会社 | Vapor deposition mask manufacturing method, vapor deposition mask, and organic semiconductor element manufacturing method |
| CN110512172A (en) * | 2018-05-21 | 2019-11-29 | 鸿富锦精密工业（深圳）有限公司 | The manufacturing method of vapor deposition mask and the evaporation coating method of luminous organic material |
| US20220181594A1 (en) * | 2019-03-27 | 2022-06-09 | Sakai Display Products Corporation | Method for manufacturing resin film having fine pattern, method for manufacturing organic el display device, base material film for use in formation of fine pattern, and resin film having support member attached thereto |
| KR20210120175A (en) * | 2020-03-25 | 2021-10-07 | 삼성디스플레이 주식회사 | Mask assembly, apparatus for manufacturing a display apparatus, and method for manufacturing a display apparatus |
| CN116162893A (en) * | 2023-02-17 | 2023-05-26 | 京东方科技集团股份有限公司 | Mask plate and evaporation device |
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| CN112267091A (en) | 2021-01-26 |
| WO2017006821A1 (en) | 2017-01-12 |
| CN112267091B (en) | 2023-02-17 |
| CN112176284A (en) | 2021-01-05 |
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