CN114335092A

CN114335092A - Display module and display device

Info

Publication number: CN114335092A
Application number: CN202111586396.9A
Authority: CN
Inventors: 梁恒镇; 肖云瀚; 刘练彬; 严志辉; 石慧男; 李聪聪
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-04-12

Abstract

The invention provides a display module and a display device, wherein the display module comprises: the display panel comprises a display panel, a heat dissipation structure, a main flexible circuit board and a driving chip, wherein the heat dissipation structure is positioned on one side of the display panel, which is far away from the light emergent surface, the main flexible circuit board is positioned on one side of the heat dissipation structure, which is far away from the light emergent surface, and the driving chip is arranged at a certain interval with the main flexible circuit board; the main flexible circuit board comprises a copper leakage area and a non-copper leakage area surrounding the copper leakage area, and a spacing area is arranged between the copper leakage area and the non-copper leakage area of the first metal layer and used for preventing static electricity from being transmitted to the driving chip. According to the display module provided by the embodiment of the invention, the interval area is arranged on the metal layer of the main flexible circuit board, so that static electricity released from the external environment can be prevented from directly entering the driving chip, and further abnormal display or damage to the driving chip can be prevented.

Description

Display module and display device

Technical Field

The invention relates to the technical field of display, in particular to a display module and a display device.

Background

In the field of Organic Light-Emitting Diode (OLED) display, Electrostatic Discharge (ESD) of the external environment is ubiquitous, and electronic products need to consider an ESD-prevention design scheme. In a competitive market environment, people consider improving the product competitiveness, wherein, the reduction of the production cost is important. Therefore, in the OLED field, it is a trend to reduce the lamination of a Main Flexible Printed Circuit (MFPC). In the related art, MFPCs generally adopt a two-layer board design scheme, which may cause a grounding point and a bonding layer to be in the same layer, and an ESD release path is very close and is easily led to a driving chip (Integrated Circuit, abbreviated as IC), resulting in abnormal display.

Disclosure of Invention

The embodiment of the invention provides a display module and a display device, which can prevent static electricity of an external environment from directly entering a driving chip and solve the problem of abnormal display or damage of the driving chip.

In a first aspect of the present invention, a display module is provided, which includes:

display panel, display panel includes the display area and is located the binding region of display area one side, binding region towards deviating from one side bending type of display panel goes out the plain noodles, binding region includes: a first portion connected to the display area, a second portion opposite to the first portion, and a bent portion connecting the first portion and the second portion;

the heat dissipation structure is positioned on one side of the display panel, which is far away from the light emergent surface;

the main flexible circuit board is positioned on one side of the heat dissipation structure, which is far away from the light emergent surface, and is connected with the second part;

the driving chip is positioned on one side of the second part, which is far away from the light emergent surface, and a certain distance is reserved between the driving chip and the main flexible circuit board; wherein the content of the first and second substances,

the main flexible circuit board comprises a first protective layer, a first metal layer, an insulating layer, a second metal layer and a second protective layer which are sequentially stacked, wherein the first protective layer is connected with the second part of the display panel;

the main flexible circuit board comprises a copper leakage area and a non-copper leakage area surrounding the copper leakage area, and a spacing area is arranged between the copper leakage area and the non-copper leakage area of the first metal layer and used for preventing static electricity from being transmitted to the driving chip.

Optionally, the display module further includes at least one blind hole, in the copper leakage area, the at least one blind hole extends from one side of the second metal layer close to the second protection layer to the first metal layer, and a depth of the at least one blind hole is greater than a thickness of the second metal layer and is less than or equal to a sum of thicknesses of the second metal layer, the insulation layer and the first metal layer.

Optionally, one end of the first metal layer is provided with a point discharge structure.

Optionally, the point discharge structure includes a lead and a point discharge portion, the point discharge portion is connected to the first metal layer through the lead, the point discharge portion includes a body and a point extended from the body, the point is connected to the body in a straight line, a bent line or a winding manner, and the lead intersects with the point.

Optionally, the heat dissipation structure sequentially includes, on a side of the display panel departing from the light exit surface: the first bonding layer, the foam layer and the third metal layer.

Optionally, the display module further includes: and the second bonding layer is used for bonding the first protective layer and the third metal layer.

Optionally, the display module further includes: a conductive structure to couple the third metal layer and the first metal layer through a copper leakage region of the first protection layer.

Optionally, the material of the insulating layer includes: and (3) a polyimide.

Optionally, the material of the first metal layer includes: copper and aluminum;

the first metal layer, the second metal layer and the third metal layer are made of the same material.

The second aspect of the invention provides a display device, which includes the display module.

The embodiment of the invention has the following beneficial effects:

according to the display module provided by the embodiment of the invention, the interval area is arranged on the metal layer of the main flexible circuit board, so that static electricity released from the external environment can be prevented from directly entering the driving chip, and further abnormal display or damage to the driving chip can be prevented.

Drawings

FIG. 1 is a schematic diagram of an electrostatic discharge path of a display module according to the related art;

FIG. 2 is a schematic diagram of an electrostatic discharge path of a first display module according to an embodiment of the disclosure;

FIG. 3 is a schematic diagram of an electrostatic discharge path of a second display module according to an embodiment of the disclosure;

fig. 4 is a top view of a main flexible printed circuit board of a second display module according to an embodiment of the disclosure;

fig. 4A to 4E are schematic diagrams of a first protection layer, a first metal layer, an insulation layer, a second metal layer, and a second protection layer of a grounding structure of a main flexible printed circuit board of a second display module according to an embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating an electrostatic discharge path of a third display module according to an embodiment of the invention;

FIG. 6 is a top view of a main flexible printed circuit board of a third display module according to an embodiment of the present invention;

fig. 6A to 6E are schematic diagrams of a first protection layer, a first metal layer, an insulation layer, a second metal layer, and a second protection layer of a grounding structure of a main flexible printed circuit board of a third display module according to an embodiment of the present invention;

fig. 7A is a first structure diagram of a tip discharge structure of a display module according to an embodiment of the invention;

fig. 7B is a structural diagram of a second type of point discharge of the display module according to the embodiment of the invention;

FIG. 7C is a diagram of a third structure of point discharge structure of the display module according to the embodiment of the invention;

fig. 8A to 8E are schematic diagrams of a first protection layer, a first metal layer, an insulation layer, a second metal layer, and a second protection layer of a grounding structure of a main flexible printed circuit board of a fourth display module according to an embodiment of the present invention.

Reference numerals

C-copper leakage region D-spacer region

1-display Panel

2-heat dissipation structure 21-first adhesive layer 22-third metal layer

3-drive chip

4-ground structure 41-first passivation layer 42-first metal layer 43-insulating layer 44-second metal layer 45-second passivation layer

5 conductive structure

61-first via 62-blind via

7-second adhesive layer

8-point discharge structure 81-lead 82-point discharge part 821-body 822-point

9-connector

Detailed Description

In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.

The OLED display screen may generate electrostatic discharge (ESD) when it is rubbed by external contact, or in dry air, or in contact with a human body.

Fig. 1 is a schematic view of an electrostatic discharge path of a display module according to the related art, as shown in fig. 1, the display module according to the related art includes:

the display panel 1, the display panel 1 includes a display Area (Active Area, AA) and a binding Area (binding Area, BA) located on one side of the display Area, the binding Area is bent toward a side away from a light emitting surface of the display panel 1, and the binding Area includes: a first portion connected to the display area, a second portion opposite to the first portion, and a bent portion connecting the first portion and the second portion;

the heat dissipation structure 2 is positioned on one side of the display panel 1, which is far away from the light emergent surface;

the main flexible circuit board is positioned on one side, away from the light emergent surface, of the heat dissipation structure 2 and is connected with the second part;

the driving chip 3 is positioned on one side of the second part, which is deviated from the light emergent surface, and a certain distance is reserved between the driving chip and the main flexible circuit board;

the main flexible printed circuit 4 includes a first protective layer 41, a first metal layer 42, an insulating layer 43, a second metal layer 44, and a second protective layer 45, which are sequentially stacked, and the first protective layer 41 is connected to the second portion of the display panel 1. The insulating layer 43 located between the first metal layer 42 and the second metal layer 44 is provided with a first via hole 61, and the via hole 61 is filled with metal to realize electrical connection between the first metal layer 42 and the second metal layer 44.

Wherein, heat radiation structure 2 deviates from at display panel 1 one side of going out the plain noodles includes in proper order: a first adhesive layer 21, a foam layer (not shown), and a third metal layer 23.

Wherein, the display module assembly still includes: a conductive structure 5 for coupling the third metal layer 22 and the first metal layer 42 through the copper leakage region C of the first protection layer 41. The conductive structure 5 is a conductive paste.

A second adhesive layer 7 is arranged between the first protective layer 41 and the third metal layer 23, the second adhesive layer 7 is non-conductive, and a PET double-faced adhesive material is selected.

As shown in fig. 1, the external static electricity is transmitted to the first metal layer 42 through the third metal layer 22 of the heat dissipation structure via the conductive adhesive, the first metal layer 42 is coupled to the display panel 1, and the display panel 1 is coupled to the driving chip 3, so that the static electricity is transmitted to the driving chip, thereby causing abnormal display.

The display module provided by the embodiment of the invention comprises:

the driving chip is positioned on one side of the second part, which is far away from the light emergent surface, and a certain distance is reserved between the driving chip and the main flexible circuit board; it is characterized in that the preparation method is characterized in that,

FIG. 2 is a schematic diagram of an electrostatic discharge path of a first display module according to an embodiment of the disclosure; as shown in fig. 3, the display module provided in the embodiment of the present invention includes: the display device comprises a display panel 1, a heat dissipation structure 2, a main flexible circuit board 4 and a driving chip 3.

The display panel 1 includes a display Area (Active Area, AA) and a binding Area (binding Area, BA) located on one side of the display Area, the binding Area is bent toward a side away from a light emitting surface of the display panel 1, and the binding Area includes: the display device includes a first portion connected to the display area, a second portion opposite to the first portion, and a bent portion connecting the first portion and the second portion. In the bonding area, the signal traces in the display area AA are connected to the driving chip 3.

The heat dissipation structure 2 is located on a side of the display panel 1 departing from the light emitting surface.

The main flexible circuit board is located on one side, away from the light emitting surface, of the heat dissipation structure 2 and connected with the second portion 2.

The driving chip 3 is located on one side of the second portion, which is far away from the light emergent surface, and a certain distance is reserved between the driving chip and the main flexible circuit board. The driving chip 3 may be a source driving chip, and in other embodiments, the driving chip 3 may be a gate driving chip, or may be an integrated chip of the source driving chip and the gate driving chip.

The main flexible printed circuit board 4 includes a first protective layer 41, a first metal layer 42, an insulating layer 43, a second metal layer 44, and a second protective layer 45, which are sequentially stacked, wherein the first protective layer 41 is connected to the second portion 12 of the display panel 1.

The main flexible circuit board comprises a copper leakage area C and a non-copper leakage area surrounding the copper leakage area, and a spacing area D is arranged between the copper leakage area C and the non-copper leakage area of the first metal layer 42 and used for preventing static electricity from being transmitted to the driving chip.

By having the spacing region D between the copper leakage region C and the non-copper leakage region of the first metal layer 42, when ESD occurs, static electricity cannot be directly discharged toward the driver chip; the ESD can be released only in the opposite direction of the driving chip, and the ESD is led out of the MFPC or the influence is reduced.

Among them, the first protective layer 41 includes a covering layer and an electromagnetic shielding layer. The covering layer is made of PI material and colloid. Wherein the second protective layer 45 includes a covering layer and an electromagnetic shielding layer. The covering layer is made of PI material and colloid.

Optionally, the material of the insulating layer includes: and (3) a polyimide.

Among them, polyimide has good heat resistance, moisture resistance, and insulation properties.

Optionally, the material of the first metal layer includes: copper and aluminum; the first metal layer, the second metal layer and the third metal layer are made of the same material. Specifically, the first metal layer and the second metal layer may be copper foils or aluminum foils. The first metal layer and the second metal layer are plated with copper or aluminum on the whole surface.

Among them, copper and aluminum have good conductivity.

Optionally, the heat dissipation structure sequentially includes, on a side of the display panel departing from the light exit surface: the first protective layer of ground structure is adjacent with the third metal level.

Wherein, adhesive linkage 31 is the grid glue, the grid glue can laminate the exhaust, and has the flexibility, does not influence display module's flexible design.

Wherein, the foam layer 32 can be foam, which can play a role in buffering and shading.

The third metal layer can be made of one of copper and aluminum or an alloy structure thereof, and plays a role in heat dissipation. Specifically, the third metal layer may be a copper foil or an aluminum foil.

As shown in fig. 2, the heat dissipation structure 2 sequentially includes, on a side of the display panel 1 departing from the light emitting surface: a first adhesive layer 21, a foam layer (not shown), and a third metal layer 22.

The electrostatic discharge path can be formed by removing the covering layer of the first protection layer in the copper leakage area and the electromagnetic shielding layer, and coupling the third metal layer and the first metal layer through the copper leakage area.

It should be noted that the shape, number and position of the conductive regions are not limited in the present application.

The embodiment of the invention can enable the second metal layer 44 to form electrostatic discharge paths in two directions by providing at least one blind hole and extending the at least one blind hole from the side of the second metal layer close to the second protection layer to the first metal layer.

The point discharge structure is arranged at one end of the first metal layer, so that static electricity can be conveniently discharged. Because the curvature of the tip is larger, the electric field strength is larger under the same potential difference, and the discharge phenomenon is easier to generate.

Because the electric field that produces during point discharge is stronger, the point adopts sharp line, kinks or wire winding's mode and body coupling, can increase the impedance of point discharge portion, weakens electric field strength.

Fig. 7A is a first structure diagram of a tip discharge structure of a display module according to an embodiment of the invention; the tip discharge part 82 includes a body 821 and a tip 822 extended from the body, and the tip 822 is connected to the body 821 in a linear manner. Wherein the body 821 corresponds to the copper leakage area.

Fig. 7B is a first structure diagram of a tip discharge display module according to an embodiment of the invention; the tip discharge part 82 includes a body 821 and a tip 822 extended from the body, and the tip 822 is connected to the body 821 in a zigzag manner. Wherein the body 821 corresponds to the copper leakage area.

Fig. 7C is a first structure diagram of a tip discharge structure of a display module according to an embodiment of the invention; the tip discharge portion 82 includes a body 821 and a tip 822 extended from the body, and the tip 822 is connected to the body 821 in a wire winding manner. Wherein the body 821 corresponds to the copper leakage area.

The display module provided by the embodiment of the invention comprises a second bonding layer which is used for bonding the first protective layer and the third metal layer and can also play a supporting role between the first protective layer and the third metal layer.

FIG. 3 is a schematic diagram of an electrostatic discharge path of a second display module according to an embodiment of the disclosure; in contrast to fig. 2, the spacer region of the first metal layer separates the first metal layer not only in the direction toward the driver chip, but also in the direction away from the driver chip.

The gap region can block a conduction path between the copper foils, but the first protective layer is attached to the outer portion, the first protective layer is soft in material, and the section difference of the partition structure is filled after the first protective layer is attached, so that the gap region position can be filled with the first protective layer.

Fig. 4 is a top view of a main flexible printed circuit board of a second display module according to an embodiment of the disclosure. The direction of the plan view shown in fig. 4 is a direction from the first protective layer 41 to the second protective layer 45. As shown in fig. 4, the main flexible printed circuit 4 includes a connector 9, wherein static electricity is lost during the transmission of ESD static electricity conduction path to the connector 9. The copper leakage area C can be seen in top view, as well as the blind via 62.

Fig. 4A to 4E are schematic diagrams of a first protection layer, a first metal layer, an insulation layer, a second metal layer, and a second protection layer of a grounding structure of a main flexible printed circuit board of a second display module according to an embodiment of the present invention. The first protection layer 41 shown in fig. 4A includes a copper leakage region C. The first metal layer 42 shown in fig. 4B has a spacing region D between the copper leakage region and the non-copper leakage region, and the blind via 62 penetrates the first metal layer. The insulating layer 43 shown in fig. 4C has a first via 61 thereon. There is a thin copper layer (not shown) between the first via 61 and the blind via 62. The diameter of the first via hole 61 is larger than the diameter of the blind hole 62. The second metal layer 44 shown in fig. 4D has a spacing region D between the copper leakage region and the non-copper leakage region, and the blind via 62 penetrates the second metal layer. The second protection layer 45 shown in fig. 4E includes a copper leakage region C.

FIG. 5 is a schematic diagram illustrating an electrostatic discharge path of a third display module according to an embodiment of the invention; fig. 5 differs from fig. 2 and 3 in that fig. 5 is not provided with a blind hole 62.

Fig. 6 is a top view of a main flexible printed circuit board of a third display module according to an embodiment of the disclosure. The direction of the plan view shown in fig. 6 is a direction from the first protective layer 41 to the second protective layer 45. As shown in fig. 6, the main flexible printed circuit 4 includes a connector 9, wherein static electricity is lost during the transmission of ESD static electricity conduction path to the connector 9. The copper leakage area C can be seen from the top view.

Fig. 6A to 6E are schematic diagrams of a first protection layer, a first metal layer, an insulation layer, a second metal layer, and a second protection layer of a grounding structure of a main flexible printed circuit board of a second display module according to an embodiment of the present invention. The first protection layer 41 shown in fig. 6A includes a copper leakage region C. The first metal layer 42 shown in fig. 6B has a tip discharge structure 8, and in conjunction with fig. 7A to 7C, the tip discharge structure 8 includes a lead 81 and a tip discharge portion 82, the tip discharge portion 82 is connected to the first metal layer 42 through the lead 81, the tip discharge portion 82 includes a body 821 and a tip 822 extending from the body, the tip 822 is connected to the body 821 by a straight line, a bent line or a winding line, and the lead 81 intersects with the tip 822. The insulating layer 43 shown in fig. 6C is not provided with the first via in the copper leakage region, but it should be noted that: the other part of the insulating layer is provided with a first via hole for conducting a line between the first metal layer and the second metal layer. The second metal layer 44 shown in fig. 4D is not provided with blind vias 62 in the copper leakage areas. The second protection layer 45 shown in fig. 6E includes a copper leakage region C.

The fourth display module combines two static electricity guiding modes of blind hole opening and point discharge setting. The structure of fig. 8A is the same as fig. 6A; FIG. 8B is the same as FIG. 6B; FIG. 8C is the same as FIG. 6C; FIG. 8D is the same as FIG. 4B; fig. 8E is the same as fig. 6E.

The first metal layer is a copper foil, and the first metal layer is realized by a copper plating process. The first metal layer includes a copper leakage region and a non-copper leakage region.

When the copper plating process of the first metal layer is carried out, a separate copper plating process is adopted for a copper leakage area and a non-copper leakage area; meanwhile, at the junction of the two areas, copper cannot be lapped with each other, a certain distance is required to be reserved, and the distance is required to ensure that a passage cannot be formed between the copper foils, so that current cannot be conducted between the copper foils of the two areas; the number of the copper leakage areas is not limited and is determined according to the actual situation.

After the copper plating isolation of the copper leakage area and the non-copper leakage area is realized, the copper plating of the copper leakage area is communicated with the copper plating of the second metal layer in a blind hole mode to form a passage, and static electricity is conducted into the second metal layer from the copper plating of the copper leakage area, so that the static electricity is guided to the far end side of the driving chip.

The embodiment of the invention does not limit the position, the number and the shape of the blind holes.

The embodiment of the invention does not limit the main flexible circuit board to be a plurality of layers of boards, and is suitable for double-layer boards, multi-layer boards and other circuit boards.

The embodiment of the invention also provides a display device which comprises the display module.

The display device includes but is not limited to: radio frequency unit, network module, audio output unit, input unit, sensor, display unit, user input unit, interface unit, memory, processor, and power supply. It will be appreciated by those skilled in the art that the above described configuration of the display device does not constitute a limitation of the display device, and that the display device may comprise more or less of the components described above, or some components may be combined, or a different arrangement of components. In the embodiment of the present invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.

The display device may be: any product or component with a display function, such as a television, a display, a digital photo frame, a mobile phone, a tablet computer and the like.

In the embodiments of the methods of the present invention, the sequence numbers of the steps are not used to limit the sequence of the steps, and for those skilled in the art, the sequence of the steps is not changed without creative efforts.

It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and the relevant points can be referred to the partial description of the product embodiments.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.

In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display module, comprising:

2. The display module of claim 1,

the display module further comprises at least one blind hole, the at least one blind hole extends from one side, close to the second protective layer, of the second metal layer to the first metal layer in the copper leakage area, and the depth of the at least one blind hole is larger than the thickness of the second metal layer and smaller than or equal to the sum of the thicknesses of the second metal layer, the insulating layer and the first metal layer.

3. The display module according to claim 1, wherein one end of the first metal layer is provided with a point discharge structure.

4. The display module according to claim 3, wherein the point discharge structure comprises a lead and a point discharge portion, the point discharge portion is connected with the first metal layer through the lead, the point discharge portion comprises a body and a point extending from the body, the point is connected with the body in a straight line, a bent line or a winding manner, and the lead intersects with the point.

5. The display module assembly according to claim 1, wherein the heat dissipation structure sequentially comprises, on a side of the display panel away from the light emitting surface: the first bonding layer, the foam layer and the third metal layer.

6. The display module of claim 1, further comprising: and the second bonding layer is used for bonding the first protective layer and the third metal layer.

7. The display module of claim 1, further comprising: a conductive structure to couple the third metal layer and the first metal layer through a copper leakage region of the first protection layer.

8. The display module of claim 1, wherein the material of the insulating layer comprises: and (3) a polyimide.

9. The display module of claim 1, wherein the material of the first metal layer comprises: copper and aluminum;

10. A display device, comprising the display module according to any one of claims 1 to 9.