CN114334335A - Magnetic element with multilayer magnetic core - Google Patents
Magnetic element with multilayer magnetic core Download PDFInfo
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- CN114334335A CN114334335A CN202111661214.XA CN202111661214A CN114334335A CN 114334335 A CN114334335 A CN 114334335A CN 202111661214 A CN202111661214 A CN 202111661214A CN 114334335 A CN114334335 A CN 114334335A
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Abstract
The invention relates to a magnetic component having a multilayer composite core formed by alternately stacking soft magnetic alloy thin films and polymer layers. The technology adopted by the invention comprises a metal seed layer sputtering process, a thick metal layer electroplating process, a soft magnetic alloy and polymer layer electroplating process, a soft magnetic alloy chemical plating process, a thick photoresist photoetching process, an etching process and the like to realize the manufacturing of the magnetic element. The multilayer composite material based on MEMS technology is used for manufacturing the multilayer magnetic core with anisotropic characteristics, and the multilayer magnetic core is prepared by a method of direct electroplating or a method of combining electroplating and chemical plating. The multilayer magnetic core is composed of alternating soft magnetic alloy thin films and polymer layers, the magnetic core has required anisotropy, the high-frequency performance of the magnetic element is improved, the volume and the high-frequency eddy current loss of the magnetic element are reduced, and compared with the traditional electroplating process combined with the layer-by-layer deposition of the seed layer, the manufacturing method reduces a large number of steps of photoetching, etching and the like, and greatly saves the manufacturing cost.
Description
Technical Field
The invention relates to the field of integrated circuit manufacturing, in particular to a multilayer magnetic core magnetic element formed by alternating soft magnetic alloy thin films and polymer layers, wherein the soft magnetic alloy thin films and the polymer layers are manufactured by electroplating or a process combining electroplating and chemical plating.
Background
In life, people have higher and higher requirements on the volume and the performance of electronic products, wherein a power supply is used as an important component of electronic equipment, a plurality of R, L, C passive devices and the like are used, the occupied area of the power supply is greatly increased, and great challenges are brought to further miniaturization of the electronic equipment.
With the development of microelectronic technology, conventional power supplies composed of discrete components or power modules are gradually being replaced by highly integrated on-chip power supplies. On-chip power supplies also place higher demands on the volume of the passive devices therein due to their small size. Therefore, the passive device is integrated on the material substrate such as silicon and the like through the MEMs micro-nano processing technology, and the integration and the miniaturization of the passive device are very necessary. The integrated magnetic component on the chip has the advantages of low cost, easy integration, low noise and low power consumption compared with the traditional magnetic component, and more importantly, the manufacturing process is compatible with the current CMOS process. In recent years, with the development of miniaturization and low power consumption of mobile communication and wearable equipment, research on manufacturing high-quality on-chip passive devices compatible with CMOS processes is increasing. However, most of inductors, transformers and other devices have relatively simple processes, but have relatively obvious defects, and the coil thickness is limited by the structure and the process, so that the direct-current resistance is relatively large, the conduction loss is also high, and the conversion efficiency of a power supply is adversely affected; and secondly, the eddy current loss of the single-layer magnetic core is large, the inductance density is small, and the device performance of the magnetic element is far inferior to that of a multilayer magnetic core magnetic element. In addition, the traditional method needs a large number of process steps such as photoetching, electrodeposition, etching and the like for realizing the laminated magnetic core, is tedious, time-consuming and difficult to manufacture, and simultaneously greatly improves the manufacturing cost.
Disclosure of Invention
The invention aims to provide a multilayer magnetic core magnetic element formed by alternately overlapping soft magnetic alloy thin films and polymer layers, and aims to solve the problems that the traditional single-layer magnetic core magnetic element is large in eddy current loss and small in inductance density, and the traditional method for realizing the multilayer magnetic core magnetic element is complicated in steps, high in cost, difficult to manufacture and the like.
The invention provides a magnetic element with a multilayer magnetic core, comprising:
at least one copper coil, at least one multilayer magnetic core structure and a dielectric layer,
the dielectric layer is arranged between the copper coil and the multilayer magnetic core structure;
the multilayer magnetic core structure comprises: the soft magnetic alloy thin films and the polymer layers are alternately stacked.
Preferably, the first soft magnetic alloy thin film of the multilayer magnetic core structure is formed using electrodeposition.
Preferably, the second soft magnetic alloy film and the subsequent soft magnetic alloy film layer of the multilayer magnetic core structure are formed by electroplating or chemical plating.
Preferably, the multilayer magnetic core structure further comprises a conductive thin film layer between the first polymer layer and the electroplated second soft magnetic alloy thin film and between the subsequent polymer layer and the subsequent soft magnetic alloy thin film;
the conductive thin film layer is made of soft magnetic materials and is arranged between the soft magnetic alloy thin film and the polymer layer;
the conductive thin film layer is formed using electroplating or electroless plating.
Preferably, the copper coil is wrapped on the outer layer of the multilayer magnetic core structure to form a copper-clad magnetic structure.
Preferably, the multilayer magnetic core structure forms an annular closed magnetic core, and the copper coil penetrates through the multilayer magnetic core structure to form a magnetic copper-clad structure.
Preferably, the copper coil, the multilayer magnetic core structure, the dielectric layer and the conductive film layer are all manufactured through a MEMs micro-nano process.
Preferably, the soft magnetic alloy thin film layer is made of NiFe, CoNiFe, CoFe, CoFeB, CoP, CoFeP or CoFeCu with the thickness of 0.1-10 microns;
the polymer layer is made of polyethylene dioxythiophene (PEDOT) or polypyrrole (PPy) and has a thickness of 0.1-10 microns; the conductive film layer is made of Ni, NiFe or CoFe.
In order to achieve the above object, various manufacturing processes can be adopted, and the present invention adopts the following optimal technical scheme (taking a single coil as an example, the scheme is also adopted for manufacturing a magnetic core of a multi-coil coupled magnetic element):
step 1, selecting materials such as silicon, glass, ceramics and the like as substrate materials, and manufacturing an insulating layer on the substrate, wherein the insulating layer materials can be silicon dioxide, silicon nitride, organic polymer materials and the like;
step 9, selecting a process to prepare a multilayer magnetic core structure, wherein the first process is to completely adopt an electrodeposition process to alternately electroplate the soft magnetic alloy thin film and the polymer in sequence, and the second process is to adopt an electroplating and chemical plating combined process to alternately electroplate the polymer and chemically plate the soft magnetic alloy thin film after electroplating the first layer of soft magnetic alloy material;
in order to realize another magnetic element with a ring-shaped closed multilayer magnetic core, the following technical scheme can be adopted (taking a racetrack single-coil inductor as an example, the scheme is also adopted for manufacturing a magnetic element magnetic core with multiple coils coupled):
step 1, using the traditional PCB process or manufacturing a copper coil, an upper insulating layer and a lower insulating layer on an insulating substrate and then stripping the coil, the upper insulating layer and the lower insulating layer;
and 6, etching the NiFe seed layer after the step 5.
The substantial advantages of the invention are: the multilayer magnetic core is composed of alternating soft magnetic alloy thin films and polymer layers, the magnetic core has required anisotropy, the high-frequency performance of the magnetic element is improved, the volume and the high-frequency eddy current loss of the magnetic element are reduced, and compared with the traditional electroplating process combined with the layer-by-layer deposition of the seed layer, the manufacturing method reduces a large number of steps of photoetching, etching and the like, and greatly saves the manufacturing cost. The magnetic element can meet the requirements of various fields such as integrated switching power supplies, wireless charging, planar antennas, signal isolators, planar spiral inductance resonators and the like.
Drawings
FIG. 1 is a perspective view of a single coil magnetic element of the present invention;
FIG. 2 is a top view of a single coil magnetic element of the present invention;
FIG. 3 is a cross-sectional view of a single structure of a silicon substrate in the present invention;
FIG. 4 is a cross-sectional view of a single structure of a completed insulating layer in accordance with the present invention;
FIG. 5 is a cross-sectional view of a single structure of the completed underlying copper coil of the present invention;
FIG. 6 is a cross-sectional view of a single structure of the present invention completing the insulation between the copper coil and the magnetic core;
FIG. 7 is a cross-sectional view of a single structure in accordance with the present invention to accomplish photoresist patterning and a multilayer core;
FIG. 8 is a cross-sectional view of a single structure of the present invention with the residual photoresist removed and the magnetic core and upper and lower coil insulation layers completed;
FIG. 9 is a cross-sectional view of a single structure of the present invention with a through hole being drilled;
FIG. 10 is a cross-sectional view of a completed magnetic element of the present invention with the electrodeposition of copper pillars and overlying copper coils completed;
FIG. 11 is a top view of a magnetic component of the annularly closed multilayer core of the present invention;
FIG. 12 is a cross-sectional view of a magnetic element of an annularly closed multilayer magnetic core of the present invention showing the completed insulation between the copper coil and the core;
FIG. 13 is a cross-sectional view of the complete structure of the magnetic component of the annular closed multilayer magnetic core of the present invention;
Detailed Description
The invention is further described below with reference to fig. 1-13 and the specific embodiments.
Example 1
A multilayer core magnetic component having soft magnetic alloy thin films and polymer layers is shown in figures 1 and 2 and comprises a copper coil 2, a dielectric layer 1, and alloy soft magnetic thin film layers of NiFe, CoNiFe, CoFe, CoFeB, CoP, CoFeP, CoFeCu, etc., and polymer layers of polyethylene dioxythiophene (PEDOT), polypyrrole (PPy), etc. The copper coil 2 spirally surrounds the multilayer magnetic cores 3, 4, 5 and 6, and the dielectric layer 1 is used as an insulating layer between the copper coil and the multilayer magnetic cores. The magnetic element can also be coupled by multiple inductance coils to form a transformerThe process and the material are the same as those of a single coil. A process diagram illustrating the fabrication of the structure shown in fig. 1 and 2 is described with reference to fig. 3-10. The process comprises the following steps: an insulating substrate 7 (silicon, glass, ceramic, etc.) is selected as a base as shown in fig. 3, an insulating layer 8 is spin-coated on a silicon wafer as shown in fig. 4, and the material of the insulating layer 8 can be silicon dioxide, silicon nitride, organic polymer material, etc. Then sputtering a Ti/Cu seed layer on the insulating layer 8; spin-coating photoresist on the Ti/Cu seed layer, and carrying out photoetching exposure to pattern the Ti/Cu seed layer; electrodepositing an underlying copper coil 9 on the Ti/Cu seed layer as shown in FIG. 5; then removing the residual photoresist and etching the seed layer; spin coating an insulating layer as shown in fig. 6; then sputtering a NiFe seed layer, spin-coating a photoresist as shown in FIG. 7, baking, exposing, and developing to pattern the NiFe seed layer into a structure of a photoresist 11; then preparing multilayer magnetic cores 12, 13, 14 and 15 (only four layers of magnetic cores are shown in the drawing, the number of the layers of the multilayer magnetic cores can be randomly combined), and electrodepositing a soft magnetic alloy thin film layer 15 at a current density of 5-20mA/cm2And electrodepositing a polymer layer 14 at a current density of 1-10mA/cm2Followed by surface activation of the polymer layer at a low current density (0.1-1 mA/cm)2) And electrodepositing a thin uniform conductive alloy film under the condition of high-temperature water bath (30-60 ℃), wherein the conductive alloy film can be made of Ni, NiFe and CoFe. Repeating the steps and performing magnetic core electrodeposition again to prepare the thin film layers 12 and 13; removing the residual photoresist 11 as shown in fig. 8, spin-coating the insulating layer 16, baking, curing, and exposing; as shown in fig. 9, digging out through holes 17, 18 (the size of the through hole can be adjusted according to actual conditions) for connecting the upper layer and the bottom layer copper coil, and then sputtering a Ti/Cu seed layer; the copper pillars 19 and the upper copper coil 20 are electrodeposited as shown in fig. 10 to form the complete device. Each layer of magnetic core is prepared under the condition of applying a direct current magnetic field, so that the magnetic core exerts the advantage of anisotropy, keeps the magnetic conductivity under high frequency, and reduces the losses of magnetic hysteresis, eddy current and the like under the high frequency.
Example 2
The structure is the same as that of the embodiment 1, a plurality of inductance coils can be coupled to form the transformer, and the used process and materials are the same as those of a single coil. The difference is in the process of the multilayer magnetic core 12, 13, 14, 15. This embodiment also employs a process as shown in fig. 7, in which a seed layer is formed, a first soft magnetic alloy thin film 15 is electrodeposited, and a polymer layer 14 is electrodeposited. The subsequent soft magnetic alloy thin film layers are prepared by electroless plating in a soft magnetic alloy plating solution having a PH of 5.5 to 7.5 and a temperature of 75 to 95 c, such as the alloy soft magnetic thin film layer 13, and then the polymer layer 12 is electrodeposited, as a cycle. After each preparation, the device is heat treated at 60-80 deg.C for 6-8h in order to increase the resistivity of the polymer layer and further cure the polymer at higher temperature. The number of the layers of the magnetic cores can be adjusted according to the step of the step; each layer of magnetic core is also prepared under an external direct current magnetic field, so that the high-frequency performance of the device is improved.
Example 3
The multilayer magnetic core in this embodiment can be manufactured by the processes in the two embodiments, except that the magnetic element structure is a copper-clad magnetic structure, unlike the two embodiments. As shown in fig. 11, the copper coil 21 is a track type, and is directly manufactured by using a conventional PCB process as shown in fig. 12, or after the copper coil 21 and the insulating layer 25 are manufactured on the insulating substrate, three deep grooves 22, 23, and 24 around the copper coil are dug out by using an etching method, and then the coil plus insulating layer structure is peeled off to manufacture a ring-shaped closed multilayer magnetic core, and then a NiFe seed layer 26 is sputtered on the insulating layer, and the subsequent preparation and post-processing of the ring-shaped closed multilayer magnetic core 27, 28, 29, and 30 can be divided into two manufacturing methods with reference to embodiment 1 and embodiment 2. In this embodiment, each magnetic core and insulating layer is in an annular closed structure, and by adding a photolithography process, a part of the seed layer 26 can be covered, so that a non-closed magnetic core structure is realized. Each layer of magnetic core is prepared under an external direct current magnetic field, so that the high-frequency performance of the device is improved. This embodiment can also be used for fabrication on an insulating substrate, but the fabricated core does not achieve the desired closed structure.
Claims (9)
1. A magnetic component having a multilayer core, comprising:
at least one copper coil, at least one multilayer magnetic core structure and a dielectric layer,
the dielectric layer is arranged between the copper coil and the multilayer magnetic core structure;
the multilayer magnetic core structure comprises: the soft magnetic alloy thin films and the polymer layers are alternately stacked.
2. A magnetic component having a multilayer core in accordance with claim 1, wherein said first soft magnetic alloy thin film of said multilayer core structure is formed using an electrodeposition method.
3. A magnetic component having a multilayer magnetic core as claimed in claim 1, wherein the polymer layers of the multilayer magnetic core structure are formed using an electrodeposition process.
4. A magnetic component having a multilayer core according to claim 2 or 3, wherein the second and subsequent soft magnetic alloy thin films of the multilayer core structure are formed by electroplating or electroless plating.
5. A magnetic component having a multilayer magnetic core in accordance with claim 4, wherein said multilayer magnetic core structure further comprises a conductive thin film layer;
the conductive thin film layer is arranged between the soft magnetic alloy thin film and the polymer layer;
the conductive thin film layer is formed using electroplating or electroless plating.
6. A magnetic component having a multilayer magnetic core as claimed in claim 4, wherein the copper coil is wrapped around the outer layer of the multilayer magnetic core structure to form a copper clad magnetic structure.
7. A magnetic component having a multilayer magnetic core as claimed in claim 4, wherein the multilayer magnetic core structure forms a closed loop magnetic core, and the copper coil is passed through the multilayer magnetic core structure to form a copper-in-magnetic structure.
8. The magnetic element with the multilayer magnetic core according to claim 5, wherein the copper coil, the multilayer magnetic core structure, the dielectric layer and the conductive film layer are all manufactured by MEMs micro-nano technology.
9. A magnetic component having a multilayer core according to claim 5, wherein the soft magnetic alloy thin film layer is of a material selected from the group consisting of NiFe, CoNiFe, CoFe, CoFeB, CoP, CoFeP and CoFeCu and has a thickness of 0.1 to 10 μm;
the polymer layer is made of polyethylene dioxythiophene (PEDOT) or polypyrrole (PPy) and has a thickness of 0.1-10 microns;
the conductive thin film layer between the soft magnetic alloy thin film and the polymer layer is made of Ni, NiFe and CoFe.
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| CN202111661214.XA CN114334335A (en) | 2021-12-30 | 2021-12-30 | Magnetic element with multilayer magnetic core |
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| CN202111661214.XA CN114334335A (en) | 2021-12-30 | 2021-12-30 | Magnetic element with multilayer magnetic core |
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Citations (8)
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| EP0725407A1 (en) * | 1995-02-03 | 1996-08-07 | International Business Machines Corporation | Three-dimensional integrated circuit inductor |
| CN1564280A (en) * | 2004-04-22 | 2005-01-12 | 上海交通大学 | Prepn. process for magnetic core solenoidal microinduction element of micro-electromechanical system |
| CN1619724A (en) * | 2003-10-06 | 2005-05-25 | 松下电器产业株式会社 | Magnetic device |
| CN102789967A (en) * | 2012-08-16 | 2012-11-21 | 中国电子科技集团公司第五十五研究所 | Manufacturing method for soft magnetic core spiral micro-inductor |
| CN103043599A (en) * | 2012-12-07 | 2013-04-17 | 北京大学 | Preparation method of flexible polymer substrate-based spiral inductor |
| CN109416973A (en) * | 2016-05-26 | 2019-03-01 | 宾夕法尼亚州大学理事会 | Stacked core |
| CN112216469A (en) * | 2019-07-12 | 2021-01-12 | 株式会社村田制作所 | Magnetic laminate, magnetic structure comprising same, electronic component comprising laminate or structure, and method for producing magnetic laminate |
| CN113226726A (en) * | 2018-10-26 | 2021-08-06 | 宾夕法尼亚州大学理事会 | Patterned magnetic core |
-
2021
- 2021-12-30 CN CN202111661214.XA patent/CN114334335A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0725407A1 (en) * | 1995-02-03 | 1996-08-07 | International Business Machines Corporation | Three-dimensional integrated circuit inductor |
| CN1619724A (en) * | 2003-10-06 | 2005-05-25 | 松下电器产业株式会社 | Magnetic device |
| CN1564280A (en) * | 2004-04-22 | 2005-01-12 | 上海交通大学 | Prepn. process for magnetic core solenoidal microinduction element of micro-electromechanical system |
| CN102789967A (en) * | 2012-08-16 | 2012-11-21 | 中国电子科技集团公司第五十五研究所 | Manufacturing method for soft magnetic core spiral micro-inductor |
| CN103043599A (en) * | 2012-12-07 | 2013-04-17 | 北京大学 | Preparation method of flexible polymer substrate-based spiral inductor |
| CN109416973A (en) * | 2016-05-26 | 2019-03-01 | 宾夕法尼亚州大学理事会 | Stacked core |
| CN113226726A (en) * | 2018-10-26 | 2021-08-06 | 宾夕法尼亚州大学理事会 | Patterned magnetic core |
| CN112216469A (en) * | 2019-07-12 | 2021-01-12 | 株式会社村田制作所 | Magnetic laminate, magnetic structure comprising same, electronic component comprising laminate or structure, and method for producing magnetic laminate |
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