CN102360685A - Micro spiral coil and manufacturing method thereof - Google Patents
Micro spiral coil and manufacturing method thereof Download PDFInfo
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- CN102360685A CN102360685A CN2011102209060A CN201110220906A CN102360685A CN 102360685 A CN102360685 A CN 102360685A CN 2011102209060 A CN2011102209060 A CN 2011102209060A CN 201110220906 A CN201110220906 A CN 201110220906A CN 102360685 A CN102360685 A CN 102360685A
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- insulating layer
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Abstract
The invention discloses a micro spiral coil and a manufacturing method thereof. The micro spiral coil is characterized in that: an internal heat conduction insulating layer, a spiral coil layer and an external heat conduction insulating layer are sequentially arranged from inside to outside on the surface of a cylindrical core material. The micro spiral coil is manufactured on the surface of a cylindrical core body by a semiconductor micro processing technology, and the micro spiral coils which have different coil diameters and high density turns, do not require substrates for support and can be flexibly moved can be realized; a magnetic field in the micro spiral coil is uniform, and a magnetic field direction has high coherence; and the coil has high heat radiating performance.
Description
Technical field
The present invention designs a kind of coil and preparation method thereof, designs a kind of little helical coil and preparation method thereof especially.
Technical background
Little coil can extensively be used in motor, inductance, transformer and loop aerial and the field system, in equipment such as nulcear magnetic resonance (NMR), magnetic tweezer.Estimate according to specialized market is conservative, coil does not consider that its market scale of application can reach more than 100,000,000 dollars every year, if comprise application, market scale is bigger.Normal coil generally forms around cores such as circle iron core, steel cores with plain conductor, because lead is thick, core volume is big, so the helical coil volume that forms is big, to expend metal material many, costs an arm and a leg.Especially in biological and chemical species analysis detection system, be difficult to satisfy micro substance and high accuracy rigorous analysis requirement.Reduce and work as the coil yardstick, the processing and fabricating of little coil is to realize one of this type key technologies for application.
The fine lead of tradition employing is made little coil around the circle mode and is belonged to Precision Machining, and it is limited around circle density.And the utilization micro-electro-mechanical systems semiconductor fabrication process of unifying is made little coil, and its yardstick can reach 0.01 to 1 inch, and the coil yardstick of making can reach micron dimension, and it is high to make precision, and existing ripe semiconductor fabrication techniques capable of using is present a kind of development trend.
The existing at present little coil that adopts semiconductor fabrication techniques to make is planar structure; Make like the described a kind of double-layer and double-side plane micro coil of publication number CN1533017A patent of invention; The employing silicon chip is substrate; Through steps such as two-sided oxidation, photoetching, metal sputtering, etchings, finally made the double-decker plane micro coil.Can produce the coil of minute yardstick though adopt this technology; But, cause energy loss because structurally the magnetic field of the little coil of this type is perpendicular to substrate, thereby can produce induced current on substrate; Reduce its quality factor, so can't be applied to the microwave circuit of high frequency.In addition, this type of coil can't extend upward because main shaft is vertical with chip substrate, has limited its coil number.Publication number CN1463014A patent of invention has proposed a kind of employing semiconductor fabrication techniques; Make the thick film light resistance structure earlier; Accomplish the required channel of multi-loop micro coil group that is wherein comprised again, low-melting electric conducting material that reinjects gets in the middle of the channel of thick film light resistance structure, finally obtains the multi-loop micro coil that the thick film light resistance structure supports; Though it is parallel with substrate that this method can realize coil magnetic field; But because coil has adopted the low melting point electric conducting material to inject thereby limiting coil electric conductivity and then cause the coil magnetic property limited, in addition since its coil turn density of structural limitations that exists straight lead to link to each other between single coil improve, and coil can not keeping parallelism thereby the coil inside Distribution of Magnetic Field inhomogeneous; And the same base plate supports that all needs of such little coil with plane micro coil, can't flexible Application in the integrated micro system.In addition, do not consider in the coil electricity process to produce how heat dissipation problem of heat in above-mentioned little coil manufacturing process, this can further limit its performance and reduce its reliability.
Summary of the invention
The object of the present invention is to provide a kind of high density number of turn that realizes; Need not substrate support structure; Can adopt little helical coil of high conduction performance material and preparation method thereof, to solve present plane micro coil and to need the coil turn density that little coil was brought of base plate supports not high, little coil needs base plate supports; The little coil magnetic characteristic of made is bad, as: produce magnetic field perpendicular to substrate, shortcoming such as coil inside magnetic field is inhomogeneous, direction is inconsistent.
The present invention adopts following technical scheme for the technical solution problem:
The design feature of the little helical coil of the present invention is to set gradually from inside to outside on the surface of cylindric core to be interior heat conductive insulating layer, helix ring layer and outer heat conductive insulating layer.
The design feature of the little helical coil of the present invention also is:
Said cylindric core adopts magnetic or nonmagnetic substance.
The heat conductive insulating layer is the heat-conducting insulation material layer with outer heat conductive insulating layer in said.
Said helix ring layer is the stack of single-layer spiral coil or multi-layer helical coil.
The characteristics of the manufacture method of the little helical coil of the present invention are to make by following technology:
A, the surface of cylindric core adopt the mode of vacuum coating or electron beam plated film or magnetron sputtering plating or pulsed laser deposition plated film make in the heat conductive insulating layer, or adopt heat conductive insulating to solidify glue to apply to solidify and make interior heat conductive insulating layer;
B, the material that the outer surface of heat conductive insulating layer adopts the mode of vacuum coating or electron beam plated film or magnetron sputtering plating or pulsed laser deposition plated film to form with the helix ring layer in said are the metallic film of material; At the surface-coated photoresist of said metallic film, and carry out whirl coating, oven dry processing;
C, by the helical coil track of helix ring layer to photoresist make public, development and photographic fixing handle, and metallic film is protected by the helical coil track, remainder exposes; Adopt chemistry or physical method to carry out etching to the metallic film that exposes again, form the helix ring layer; Remove residual photoresist on the helix ring layer, through cleaning and the oven dry processing;
D, on the helix ring layer, adopt the mode of vacuum coating or electron beam plated film or magnetron sputtering plating or pulsed laser deposition plated film form outside the heat conductive insulating layer, with said outer heat conductive insulating layer said helix ring layer is covered.
The characteristics of the manufacture method of the little helical coil of the present invention are that also repeating step b-c forms the multilayer overlaying structure of helix ring layer.
Compared with present technology, beneficial effect of the present invention is embodied in:
1, the little helical coil of the present invention can pass through control coil conductor width and pitch, maybe can adopt the structure of lattice coil stack to realize the high-density coils number of turn, thereby realize high-intensity magnetic field;
2, the present invention is based on semiconductor microactuator processing and fabricating technology, can realize having different coil diameters, the high density number of turn need not the substrate support, movable little helical coil; Magnetic field is even in little helical coil, and the high conformity of magnetic direction; Coil has good heat dissipation characteristics, can greatly improve the reliability of coil.
Description of drawings
Fig. 1 is the little helical coil structure sketch map of the present invention;
Label among the figure: 1 cylindric core body; Heat conductive insulating layer in 2; 3 little helix ring layers; 4 outer heat conductive insulating layers.
Embodiment
Referring to Fig. 1, the little helical coil in the present embodiment is to set gradually from inside to outside on the surface of cylindric core 1 to be interior heat conductive insulating layer 2, helix ring layer 3 and outer heat conductive insulating layer 4.
Cylindric core 1 can adopt magnetic or nonmagnetic substance, comprises metal material, alloy material and nonmetallic materials, adopts magnetic material can effectively improve magnetic field intensity;
Interior heat conductive insulating layer 2 is the heat-conducting insulation material layer with outer heat conductive insulating layer 3, and helix ring layer 3 can or be the stack of multi-layer helical coil for single-layer spiral coil, and the stack of multi-layer helical coil can realize higher loop density, is used to produce stronger magnetic field.
Little helical coil following steps for manufacturing:
1, the selection diameter is 125 microns a cylindric core 1; Handle with alcohol sonic oscillation clean surface and oven dry; Heat conductive insulating layer 2 in the mode of the employing vacuum coating of the surface of cylindric core 1 or electron beam plated film or magnetron sputtering plating or pulsed laser deposition plated film is made, or adopt heat conductive insulating curing glue to apply curing and make interior heat conductive insulating layer 2;
Specifically making can be that coating thickness is the epotek-930 heat conductive insulating curing glue of 30-50 micron, in baking oven, solidifies 15 minutes with 150 ℃, and taking-up was cooled off for use after curing was accomplished;
2, the material that adopts the mode of vacuum coating or electron beam plated film or magnetron sputtering plating or pulsed laser deposition plated film to form with helix ring layer 3 at the outer surface of interior heat conductive insulating layer 2 is the metallic film of material; At the surface-coated photoresist of metallic film, and carry out whirl coating, oven dry processing;
Concrete making can be the mode that adopts rotary plating, and at the electroplate film of heat conductive insulating layer 2, silver film thickness is the 40-50 micron, also can be other electric conducting material;
3, by the helical coil track of helix ring layer 3 to photoresist make public, development and photographic fixing handle, and metallic film is protected by the helical coil track, remainder exposes; Adopt chemistry or physical method to carry out etching to the metallic film that exposes again, form helix ring layer 3; Remove residual photoresist on the helix ring layer 3, through cleaning and the oven dry processing;
4, on helix ring layer 3, adopt the mode of vacuum coating or electron beam plated film or magnetron sputtering plating or pulsed laser deposition plated film form outside heat conductive insulating layer 4, heat conductive insulating layer 4 covers helix ring layer 3 in addition.
Concrete making can be that the surface-coated thickness in helix ring layer 3 is that the epotek-930 heat conductive insulating of 30-50 micron solidifies glue, in baking oven with 150 ℃ solidify formed in 15 minutes outside heat conductive insulating layer 4.
Through repeating step 2 and the multilayer overlaying structure of step 3 with formation helix ring layer 3.
Claims (6)
1. little helical coil is characterized in that setting gradually from inside to outside on the surface of cylindric core (1) and is interior heat conductive insulating layer (2), helix ring layer (3) and outer heat conductive insulating layer (4).
2. little helical coil according to claim 1 is characterized in that said cylindric core (1) adopts magnetic or nonmagnetic substance.
3. little helical coil according to claim 1, heat conductive insulating layer (2) and outer heat conductive insulating layer (3) are the heat-conducting insulation material layer in it is characterized in that.
4. little helical coil according to claim 1 is characterized in that said helix ring layer (3) is the single-layer spiral coil or the stack of multi-layer helical coil.
5. the manufacture method of the described little helical coil of claim 1 is characterized in that making by following technology:
A, the surface of cylindric core (1) adopt the mode of vacuum coating or electron beam plated film or magnetron sputtering plating or pulsed laser deposition plated film make in heat conductive insulating layer (2), or adopt heat conductive insulating to solidify glue to apply to solidify and make interior heat conductive insulating layer (2);
B, the material that the outer surface of heat conductive insulating layer (2) adopts the mode of vacuum coating or electron beam plated film or magnetron sputtering plating or pulsed laser deposition plated film to form with helix ring layer (3) in said are the metallic film of material; At the surface-coated photoresist of said metallic film, and carry out whirl coating, oven dry processing;
C, by the helical coil track of helix ring layer (3) to photoresist make public, development and photographic fixing handle, and metallic film is protected by the helical coil track, remainder exposes; Adopt chemistry or physical method to carry out etching to the metallic film that exposes again, form helix ring layer (3); Remove helix ring layer (3) and go up residual photoresist, handle through cleaning and drying;
D, go up to adopt the mode of vacuum coating or electron beam plated film or magnetron sputtering plating or pulsed laser deposition plated film to form outer heat conductive insulating layer (4) in helix ring layer (3), with said outer heat conductive insulating layer (4) with said helix ring layer (3) covering.
6. the manufacture method of little helical coil according to claim 5 is characterized in that repeating step b-c forms the multilayer overlaying structure of helix ring layer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102209060A CN102360685A (en) | 2011-08-03 | 2011-08-03 | Micro spiral coil and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102209060A CN102360685A (en) | 2011-08-03 | 2011-08-03 | Micro spiral coil and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN102360685A true CN102360685A (en) | 2012-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102209060A Pending CN102360685A (en) | 2011-08-03 | 2011-08-03 | Micro spiral coil and manufacturing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428523A (en) * | 2015-12-17 | 2016-03-23 | 华东师范大学 | Miniature off-diagonal sensitive element with giant magneto-impedance effect and preparation method of miniature off-diagonal sensitive element with giant magneto-impedance effect |
| CN105645346A (en) * | 2016-01-19 | 2016-06-08 | 东南大学 | Three dimensional micromechanical spring and manufacturing method thereof |
| CN106128745A (en) * | 2016-08-18 | 2016-11-16 | 中车株洲电机有限公司 | A kind of insulation against ground processing method unshakable in one's determination and Nomex mixing bonding agent |
| CN110600235A (en) * | 2019-09-25 | 2019-12-20 | 深圳振华富电子有限公司 | Surface mount inductor and preparation method thereof |
| CN110619988A (en) * | 2019-09-25 | 2019-12-27 | 深圳振华富电子有限公司 | Surface-mounted electronic component and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649670A (en) * | 1992-08-04 | 1994-02-22 | Canon Inc | Production of spiral member |
| CN1463014A (en) * | 2002-05-29 | 2003-12-24 | 财团法人工业技术研究院 | High density multi-loop micro coil and its manufacturing method |
-
2011
- 2011-08-03 CN CN2011102209060A patent/CN102360685A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649670A (en) * | 1992-08-04 | 1994-02-22 | Canon Inc | Production of spiral member |
| CN1463014A (en) * | 2002-05-29 | 2003-12-24 | 财团法人工业技术研究院 | High density multi-loop micro coil and its manufacturing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428523A (en) * | 2015-12-17 | 2016-03-23 | 华东师范大学 | Miniature off-diagonal sensitive element with giant magneto-impedance effect and preparation method of miniature off-diagonal sensitive element with giant magneto-impedance effect |
| CN105645346A (en) * | 2016-01-19 | 2016-06-08 | 东南大学 | Three dimensional micromechanical spring and manufacturing method thereof |
| CN106128745A (en) * | 2016-08-18 | 2016-11-16 | 中车株洲电机有限公司 | A kind of insulation against ground processing method unshakable in one's determination and Nomex mixing bonding agent |
| CN110600235A (en) * | 2019-09-25 | 2019-12-20 | 深圳振华富电子有限公司 | Surface mount inductor and preparation method thereof |
| CN110619988A (en) * | 2019-09-25 | 2019-12-27 | 深圳振华富电子有限公司 | Surface-mounted electronic component and preparation method thereof |
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Application publication date: 20120222 |