CN110619988A - Surface-mounted electronic component and preparation method thereof - Google Patents
Surface-mounted electronic component and preparation method thereof Download PDFInfo
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- CN110619988A CN110619988A CN201910912180.3A CN201910912180A CN110619988A CN 110619988 A CN110619988 A CN 110619988A CN 201910912180 A CN201910912180 A CN 201910912180A CN 110619988 A CN110619988 A CN 110619988A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
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- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The embodiment of the invention provides a surface mount electronic component and a preparation method thereof, wherein the surface mount electronic component comprises a magnetic core, a coil winding and a plurality of end electrodes, the end electrodes and the coil winding are formed by etching a conductive layer formed on the magnetic core, the coil winding comprises a primary winding and a plurality of secondary windings which are arranged on the magnetic core side by side along the length direction of the magnetic core, and the end electrodes are respectively arranged at two ends of the magnetic core. A conductive layer is formed on the surface of the magnetic core, and the conductive layer is etched to form a coil winding and an end electrode, so that no welding spot exists at the connecting part of the end electrode and the coil winding, the performance consistency and reliability of the surface mount type electronic component are effectively improved, the assembly process of the coil winding and the coil winding with the end electrode is reduced, and the production efficiency is improved; in addition, the coil winding is formed by etching the conducting layer, and the coil winding radially extends along the magnetic core, so that the size is reduced, and the surface mount type electronic component is convenient to miniaturize.
Description
Technical Field
The invention relates to the technical field of electronic components, and particularly provides a surface-mounted electronic component and a preparation method thereof.
Background
With the continuous progress of science and technology and the rapid development of information industry, large-scale and ultra-large scale integrated circuits become mainstream and trend of development, the surface mount electronic component has the characteristics of small volume, high space utilization rate and the like, is suitable for surface assembly and high-density surface mounting, can well meet the requirements of the integrated circuits, and has high practical value. At present, chip electronic components such as common mode inductors, radio frequency transformers, power dividers and the like are mainly prepared on the basis of a lamination process and a winding process, wherein the electronic components prepared on the basis of the lamination process have certain advantages in small size and size standardization, but cannot well meet the use requirements of high inductance and large current; the electronic component prepared based on the winding process has the characteristics of wide inductance coverage range, large working current and the like, but the aspects of product performance consistency, production efficiency, small size and the like cannot well meet the use requirements, so that the wide application and popularization of the surface mount type electronic component are hindered.
Disclosure of Invention
The invention aims to provide a surface mount type electronic component, and aims to solve the technical problems of large volume, low production efficiency and poor performance consistency of the surface mount type electronic component in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a SMD electronic components, include the magnetic core, locate coil winding on the magnetic core and with each of coil winding draws forth a plurality of end electrode of end electric connection, and is a plurality of end electrode with coil winding by being formed at conducting layer sculpture on the magnetic core forms, coil winding includes along the length direction of magnetic core locates primary winding and a plurality of secondary winding on this magnetic core side by side, and is a plurality of end electrode is located respectively the both ends of magnetic core.
Optionally, the number of the secondary windings is one, and the secondary windings and the primary windings are arranged in a double-thread structure along the length direction of the upper magnetic core; alternatively, the first and second electrodes may be,
the secondary winding is a plurality of, and a plurality of secondary winding and the primary winding are arranged side by side along the axial direction of the magnetic core.
Optionally, the magnetic core includes a base for supporting the coil winding and two supporting seats for supporting the base, and the two supporting seats are symmetrically disposed at two ends of the base.
Optionally, the support seats are respectively provided with the end electrodes at two sides of the end portion of the magnetic core, and each end electrode is electrically connected with the leading-out end corresponding to the coil winding.
Optionally, the end electrode includes a first connection portion electrically connected to the leading-out end of the coil winding and a second connection portion extending from a free end of the first connection portion to the side surface of the support body, the first connection portion is disposed on the support seat facing the coil winding, and the second connection portion covers the support seat facing away from the side surface of the coil winding.
Optionally, the patch type electronic component further comprises a protective layer covering the periphery of the coil winding, and chamfers are arranged at four corners of the protective layer respectively.
Optionally, the electronic component further includes a housing for protecting the magnetic core, and the magnetic core is accommodated in the accommodating cavity of the housing.
Optionally, the housing is formed by curing magnetic glue or plastic package glue.
One object of the present invention is to provide a method for manufacturing a surface mount device, including the following steps:
s1: providing a magnetic core, and covering a conductive layer on the outer surface of the magnetic core;
s2: removing redundant metal on the conducting layer, and leaving a conducting pattern for forming a coil winding and a plurality of end electrodes on the magnetic core, wherein the coil winding comprises a primary winding and a plurality of secondary windings which are arranged on the magnetic core side by side along the length direction of the magnetic core, and the end electrodes are respectively arranged at two ends of the magnetic core;
s3: and coating or packaging the surface-mounted electronic component main body by using curing glue.
Optionally, after forming the conductive pattern, the method further includes S21:
and thickening the conductive pattern.
The invention has the beneficial effects that: compared with the prior art, the surface-mounted electronic component has the advantages that the conducting layer is formed on the surface of the magnetic core, and the conducting layer is etched to form the coil winding and the plurality of end electrodes, so that the end electrodes and the coil winding are integrally formed, connecting welding spots or heterogeneous connecting points do not exist at the connecting positions of the end electrodes and the coil winding, the performance consistency and the reliability of the surface-mounted electronic component are effectively improved, the processes of winding the coil winding and assembling the coil winding and the end electrodes are reduced, and the production efficiency is improved; in addition, the coil winding is formed by etching the conducting layer, and the coil winding radially extends along the magnetic core to reduce the size, so that the size of the surface mount type electronic component is small, and the surface mount type electronic component is convenient to miniaturize.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a patch type electronic component according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a packaged structure of a patch type electronic component according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a packaged structure of a chip mounted electronic component according to another embodiment of the present invention;
fig. 4 is a schematic diagram of a surface mount electronic component according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a chip mounted electronic component according to another embodiment of the present invention;
fig. 6 is a schematic flow chart of a method for manufacturing a surface mount electronic component according to an embodiment of the present invention.
Wherein, in the drawings, the reference numerals are mainly as follows:
1-a magnetic core; 11-a substrate; 12-a support base;
2-a coil winding; 21-a primary winding; 22-a secondary winding;
3-terminal electrode; 31-a first connection; 32-a second connection;
4-a signboard;
5-a protective layer; 51-chamfering;
6-outer shell.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1 to fig. 2, a chip-mounted electronic component according to an embodiment of the invention will now be described. The adjustable surface mount electronic component comprises a magnetic core 1, a coil winding 2 and a plurality of end electrodes 3, wherein the coil winding 2 is arranged on the magnetic core 1, and the end electrodes 3 are electrically connected with the leading-out ends of the coil winding 2, so that external current passes through the coil winding 2. Specifically, the core 1 may be composed of a soft magnetic core such as a ferrite core, an iron powder core, a soft magnetic powder-doped polymer material core, or the like, or a nonmagnetic core such as an alumina ceramic core, a dielectric ceramic core, a nonmagnetic polymer material. Specifically, coil winding 2 and a plurality of end electrode 3 are formed by the conducting layer (not shown) sculpture that forms on magnetic core 1, can understand, the conducting layer that has certain thickness is formed on the magnetic core 1 surface with the coating of conductive paste, remove unnecessary metal material in order to form coil winding 2 and a plurality of end electrode 3 on this conducting layer after that, make end electrode 3 and coil winding 2 integrated into one piece like this, there is not connection solder joint or heterogeneous tie point in the junction of end electrode 3 and coil winding 2, effectively promote SMD electronic components's performance uniformity and reliability, and reduce winding coil winding 2 and the technology of assembling coil winding 2 with end electrode 3, improve production efficiency. This coil winding 2 includes primary winding 21 and a plurality of secondary winding 22, and wherein secondary winding 22 can be one or more, and primary winding 21 and secondary winding 22 establish side by side on this magnetic core 1 along the length direction of magnetic core 1, and a plurality of end electrodes 3 are established respectively at the both ends of magnetic core 1 to reduce the volume, thereby guaranteed that this SMD electronic components volume is less, be convenient for this SMD electronic components miniaturized setting.
Compared with the prior art, the surface mount type electronic component of the embodiment of the invention has the structure that the conducting layer is processed on the outer surface of the magnetic core 1, then the conducting layer is etched on the magnetic core 1 according to the spiral line mode or the coil pattern, a plurality of guiding strips or windings are left on the spiral channel according to requirements, the coil winding 2 is formed by the plurality of guiding strips and windings, then the conducting layers at two ends of the magnetic core 1 are etched to form the end electrode 3, which can be understood that the end electrode 3 is formed by etching outwards along the end part of the coil winding 2 after the coil winding 2 is manufactured, so that the coil winding 2 and the end electrode 3 are integrally processed and formed by the same conducting layer, no connecting welding spot or connecting point heterogeneous exists at the connecting part of the coil winding 2 and the end electrode 3, the performance consistency and reliability of the surface mount type electronic component are effectively improved, and the processes of winding the coil winding 2 and assembling the coil winding 2 and the end electrode 3 are reduced, the production efficiency is improved; in addition, the coil winding 2 comprises a primary winding 21 and a plurality of secondary windings 22 formed by etching conductive layers, and the primary winding 21 and the plurality of secondary windings 22 extend along the radial direction of the magnetic core 1, so that the volume of the chip electronic component is reduced, and the chip electronic component is convenient to miniaturize.
Specifically, the conductive layer may be made of a conductive paste, such as a silver paste, a copper paste, a gold paste, a carbon-based composite paste, a graphene-doped composite paste, or a carbon nanotube-doped composite paste, and the conductive paste may be coated on the surface of the magnetic core 1 by a screen printing, directional coating, or trench filling manner, or a coating technique, or a chemical deposition technique, or a physical vapor deposition technique, or a surface spraying technique, or a combination manner of a mask plate and a surface spraying technique, or by a conductive paste coating technique, or a chemical deposition technique, or a physical vapor deposition technique, or a surface spraying technique, so that the outer surface of the magnetic core 1 forms a conductive layer. Of course, the conductive layer can also be made of metal powder. Specifically, firstly, conductor powder with a certain thickness is applied on the surface of the magnetic core 1, and then a part of the conductor powder is melted and coated on the surface of the magnetic core 1 by adopting a surface cladding technology to form a conductor layer with a certain thickness. Preferably, the conductive layer is a metal layer, such as copper or aluminum.
Alternatively, referring to fig. 1 to 5 together, as a specific implementation manner of the chip electronic component according to the embodiment of the present invention, the number of the secondary windings 22 is one, one secondary winding 22 and the primary winding 21 are arranged in a double-thread structure along the length direction of the upper magnetic core 1, and two ends of the secondary winding 22 and the primary winding 21 are respectively connected to the corresponding terminal electrodes 3, so that the number of turns of the secondary winding 22 is the same as the number of turns of the primary winding 21, thereby forming the common mode inductor.
When the number of the secondary windings 22 is plural, specifically, the number of the secondary windings 22 is two or three, the plurality of primary windings 21 and the primary windings 21 are arranged side by side along the axial direction of the magnetic core 1, wherein the turn ratio of the primary winding 21 to each secondary winding 22 can be changed to manufacture electronic components such as a radio frequency transformer or a power divider. In this embodiment, the primary winding 21 and the secondary winding 22 are formed by etching the conductive layer, and the primary winding 21 and the secondary winding 22 extend along the radial direction of the magnetic core 2 to reduce the volume, so that the size of the surface mount electronic component is ensured to be small, and the surface mount electronic component is convenient to be miniaturized.
Optionally, referring to fig. 1 to fig. 2 together, as a specific implementation manner of the chip electronic component according to the embodiment of the invention, the magnetic core 1 includes a base 11 and two supporting bases 12, where the two supporting bases 12 are symmetrically disposed at two ends of the base 11, the coil winding 2 is wound around an outer surface of the base 11, so that the base 11 supports the coil winding 2, the supporting bases 12 and the base 11 are both of a rectangular parallelepiped structure, and a height of the base 11 is smaller than a height of the supporting bases 12, so that the two supporting bases 12 bear a weight of the base 11, so that the base 11 is suspended, the coil winding 2 wrapped on the base 11 is suspended, and the coil winding 2 is separated from the printed circuit board when the electronic component is mounted on the printed circuit board.
Optionally, referring to fig. 1 to fig. 3 together, as a specific implementation manner of the chip electronic component according to the embodiment of the present invention, two ends of each supporting seat 12 are respectively provided with a terminal electrode 3, and each terminal electrode 3 is electrically connected to a corresponding leading-out terminal of the coil winding 2. So, through being equipped with end electrode 3 respectively at the both ends face of supporting seat 12, effectively promote the efficiency of discerning end electrode 3 in the product automated production process to improve production efficiency. In addition, the two end faces of the supporting seat 12 are respectively provided with the end electrodes 3, that is, the two ends of the coil winding 2 are respectively provided with a plurality of output ends, so that the electronic component can output signals in multiple ways, and further can be electrically connected with a plurality of external devices at the same time.
Alternatively, referring to fig. 1 to fig. 2 together, as a specific implementation manner of the chip electronic component according to the embodiment of the invention, each terminal electrode 3 includes a first connection portion 31 and a second connection portion 32, the second connection portion 32 extends from the first connection portion 31 to a side surface of the supporting base 12, wherein the first connection portion 31 is closely attached to a surface of the supporting base 12 facing the coil winding 2 and is electrically connected to the leading end of the coil winding 2, and the second connection portion 32 covers a side surface of the supporting base 12 facing away from the coil winding 2. Through being provided with second connecting portion 32 on end electrode 3 to realize this end electrode 3 and coil winding 2's leading-out terminal electric connection, and be close to the first connecting portion 31 of coil winding 2 one side and directly extend to coil winding 2's leading-out terminal, eliminated the length of coil winding 2 with the wiring part of end electrode 3 like this, consequently just eliminated and led to the Q value to reduce and the parasitic loss that the inductance value reduces, thereby make this electronic components and parts and coil winding 2 have inductance and Q value that basically equals.
Optionally, referring to fig. 1 to fig. 3 together, as another specific implementation manner of the chip mounted electronic component according to the embodiment of the present invention, the chip mounted electronic component further includes a protective layer 5, where the protective layer 5 covers around the coil winding 2, so as to effectively reduce the influence of the diffused magnetic flux and protect the coil winding 2, and the protective layer 5 may be made of magnetic glue or plastic glue, so that the protective layer 5 has a small stress and a good buffering effect, thereby improving the vibration and shock resistance of the electronic component. Preferably, the four corners of the protection layer 5 are respectively provided with chamfers 51, so that stress concentration at the transition of the protection layer 5 is reduced to prolong the service life of the protection layer 5.
Optionally, referring to fig. 4 to 5 together, as another specific implementation manner of the chip electronic component according to the embodiment of the present invention, the chip electronic component further includes a housing 6, the housing 6 is used for protecting the magnetic core 1, the magnetic core 1 is accommodated in an accommodating cavity (not shown) of the housing 6, wherein a depth of the accommodating cavity is smaller than a height of the magnetic core 1, specifically, the depth of the accommodating cavity is half of the height of the magnetic core 1, so that when the housing 6 is covered on the magnetic core 1, a part of the magnetic core 1 is exposed to the external environment, and thus, while protecting the electronic component, the electronic component is also convenient to be attached to the printed circuit board. Preferably, the housing 6 can be formed by curing magnetic glue or plastic package glue, wherein the plastic package glue can protect and reinforce the main body of the electronic component, so that the reliability of the electronic component is effectively improved; by adopting the magnetic glue, the inductance performance index can be improved, the magnetic shielding effect can be realized, and meanwhile, the main body of the electronic component can be protected and reinforced, so that the electrical performance index, the environmental adaptability and the reliability of the electronic component can be effectively improved.
Optionally, referring to fig. 2 and fig. 3 together, as a specific implementation manner of the chip-mounted electronic component according to the embodiment of the present invention, the chip-mounted electronic component further includes a signboard 4, where the signboard 4 is disposed on the magnetic core 1, specifically, the signboard 4 is disposed on the housing 6 or the protective layer 5, that is, an electronic component mark may be formed on the surface of the cladding or the package body by printing ink, spraying paint, laser engraving, mechanical finishing engraving, and the like, for example, "100/100" is etched on the signboard 4, where two "100" s are nominal inductance values when 1 turn is expressed, so that electronic components with different electrical performance indexes are distinguished and identified.
In the present invention, a method for manufacturing a patch type electronic component is also provided, as shown in fig. 1 and 6, specifically, the method includes the following steps:
s1: providing a magnetic core 1, and covering a conductive layer on the outer surface of the magnetic core 1;
specifically, the core 1 may be made of a soft magnetic core such as a ferrite core, an iron powder core, a soft magnetic powder-doped polymer material core, or the like, or a nonmagnetic core such as an alumina ceramic core, a dielectric ceramic core, a nonmagnetic polymer material core, or the like, without being limited thereto. The conductive layer covered on the magnetic core 1 may be formed by firing conductive paste, such as silver paste, copper paste, gold paste, carbon-based composite paste, graphene-doped composite paste, carbon nanotube-doped composite paste, and the like, and the conductive paste may be covered on the surface of the magnetic core 1 by means of screen printing, directional coating, trench burying, or a coating technique, or a chemical deposition technique, or a physical vapor deposition technique, or a surface spraying technique, or a combination of a mask plate and a surface spraying technique, or by means of a conductive paste coating technique, a chemical deposition technique, or a physical vapor deposition technique, or a surface spraying technique, so that the conductive layer with a certain thickness is formed on the outer surface of the magnetic core 1. Of course, the conductive layer may also be made of metal powder, specifically, the conductive powder with a certain thickness is applied on the surface of the magnetic core 1, and then a portion of the conductive powder is melt-coated on the surface of the magnetic core 1 by using a surface cladding technology to form a conductive layer with a certain thickness.
S2: removing redundant metal on the conducting layer, and leaving a conducting pattern which forms a coil winding 2, a plurality of end electrodes 3 and the like on the magnetic core 1, wherein the coil winding 2 comprises a primary winding 21 and a plurality of secondary windings 22, the primary winding 21 and the plurality of secondary windings 22 are arranged side by side along the length direction of the magnetic core 1, and the plurality of end electrodes 3 are respectively arranged at two ends of the magnetic core 1;
specifically, the redundant metal on the surface of the magnetic core can be removed by adopting a high-energy beam modification engraving technology or a yellow light etching technology, and it can be understood that the conductive layer is etched on the magnetic core 1 according to a spiral line mode or a coil pattern, a plurality of guide strips or windings are left on a spiral channel according to requirements, the coil winding 2 is formed by the plurality of guide strips and windings, then the conductive layers on the two ends of the magnetic core 1 are engraved, and the end electrodes 3 are formed, namely, after the coil winding 2 is manufactured, the conductive layers are respectively outwardly etched along the end parts of the coil winding 2, so as to form the sheet-shaped end electrodes 3 on the two end parts of each supporting seat 12, so that the coil winding 2 and the end electrodes 3 are integrally formed by the same conductive layer, no connecting welding spot or heterogeneous connecting point exists at the connecting part of the coil winding 2 and the end electrodes 3, and the performance consistency and reliability of the, the processes of winding the coil winding 2 and assembling the coil winding 2 and the end electrode 3 are reduced, and the production efficiency is improved; in addition, the coil winding 2 is composed of a primary winding 21 and a plurality of secondary windings 22 formed by etching conductive layers, and the primary winding 21 and the plurality of secondary windings 22 extend along the radial direction of the magnetic core 1, so that the size of the surface mount electronic component is reduced, and the surface mount electronic component is convenient to miniaturize.
S3: and coating or packaging the surface-mounted electronic component main body by using curing glue.
Specifically, in this embodiment, a plastic sealing compound or a curing compound such as magnetic glue can coat or encapsulate the electronic component main body, that is, a protective layer 5 or a housing 6 is formed on the outer surface of the coil winding 2 to protect the magnetic core, so as to protect the electronic component and improve the compression resistance and impact resistance of the electronic component. The plastic sealing adhesive can play a role in protecting and reinforcing the electronic components, so that the reliability of the electronic components is effectively improved; by adopting the magnetic glue, the inductance performance index can be improved, the magnetic shielding effect can be realized, and meanwhile, the electronic components can be protected and reinforced, so that the electrical performance index, the environmental adaptability and the reliability of the electronic components can be effectively improved. The coating or packaging is completed, and the method further comprises the step of forming a signboard 4 on the surface of the coating or packaging layer by adopting printing ink, paint spraying, laser engraving, mechanical fine engraving and other modes, wherein information such as nominal inductance of the electronic component is recorded in the signboard 4, so that the electronic component with different electrical performance indexes can be distinguished and identified conveniently.
Optionally, the method for manufacturing a patch type electronic component further includes, after the conductive pattern is formed, S21:
the conductive pattern is thickened.
Specifically, the conductive layer may be thickened by an electrodeposition technique, that is, the diameter of each winding in the coil winding 2 and the diameter of the terminal electrode 3 are increased, so as to reduce the resistance of the coil winding 2 and improve the electrical property index.
In the invention, the conducting layer is processed on the outer surface of the magnetic core 1, then the conducting layer is etched on the base body 11 according to the spiral line mode or the coil pattern, a plurality of guide strips or windings are left on the spiral channel according to requirements, the coil winding 2 is formed by a plurality of guide strips and windings, then the conducting layer on each supporting seat 12 is carved and etched to form the end electrode 3, which can be understood that after the coil winding 2 is manufactured, the conducting layers on the two ends of each magnetic core 1 are respectively etched outwards along the end part of the coil winding 2 to form the end electrode 3, so that the coil winding 2 and the end electrode 3 are integrally processed and formed by the same conducting layer, no connecting welding spot or heterogeneous connecting point exists at the connecting part of the coil winding 2 and the end electrode 3, the performance consistency and the reliability of the surface mount type electronic component are effectively improved, and the processes of the coil winding 2 and the assembly of the coil winding 2 and the end electrode 3 are reduced, the production efficiency is improved; in addition, the coil winding 2 comprises a primary winding 21 and a plurality of secondary windings 22 formed by etching conductive layers, and the primary winding 21 and the plurality of secondary windings 22 extend along the radial direction of the magnetic core 1, so that the volume of the chip electronic component is reduced, and the chip electronic component is convenient to miniaturize.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a SMD electronic components, includes the magnetic core, locates coil winding on the magnetic core and with each of coil winding draws forth a plurality of end electrode of end electric connection, its characterized in that, a plurality of the end electrode with coil winding by form in conducting layer sculpture on the magnetic core forms, coil winding includes along the length direction of magnetic core locates primary winding and a plurality of secondary winding on this magnetic core side by side, and is a plurality of the end electrode is located respectively the both ends of magnetic core.
2. The surface mount electronic component according to claim 1, wherein the number of the secondary windings is one, and the secondary windings and the primary windings are arranged in a double-thread structure along a length direction of the magnetic core; alternatively, the first and second electrodes may be,
the secondary winding is a plurality of, and a plurality of secondary winding and the primary winding are arranged side by side along the axial direction of the magnetic core.
3. The surface mount electronic component according to claim 2, wherein the magnetic core includes a base for supporting the coil winding and two supporting bases for supporting the base, and the two supporting bases are symmetrically disposed at two ends of the base.
4. The surface mount electronic component according to claim 3, wherein the support bases are respectively provided with the terminal electrodes at two sides of the end portion of the magnetic core, and each of the terminal electrodes is electrically connected to a terminal corresponding to the coil winding.
5. The surface mount electronic component as recited in claim 3, wherein the terminal electrode includes a first connecting portion electrically connected to the terminal of the coil winding and a second connecting portion extending from the first connecting portion to a side surface of the support base, the first connecting portion being provided on a surface of the support base facing the coil winding.
6. The surface mount device according to any one of claims 1 to 5, further comprising a protective layer covering the periphery of the coil winding, wherein chamfers are respectively disposed at four corners of the protective layer.
7. The surface mount electronic component according to any one of claims 1-5, wherein the electronic component further includes a housing for protecting the magnetic core, and the magnetic core is received in a receiving cavity of the housing.
8. The surface mount electronic component according to claim 7, wherein the housing is formed by curing magnetic glue or plastic glue.
9. A preparation method of a surface mount type electronic component is characterized by comprising the following steps:
s1: providing a magnetic core, and covering a conductive layer on the outer surface of the magnetic core;
s2: removing redundant metal on the conducting layer, and leaving a conducting pattern for forming a coil winding and a plurality of end electrodes on the magnetic core, wherein the coil winding comprises a primary winding and a plurality of secondary windings which are arranged on the magnetic core side by side along the length direction of the magnetic core, and the end electrodes are respectively arranged at two ends of the magnetic core;
s3: and coating or packaging the surface-mounted electronic component main body by using curing glue.
10. The method for manufacturing a surface mount electronic component as recited in claim 9, further comprising, after the forming of the conductive pattern, S21:
and thickening the conductive pattern.
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| CN201910912180.3A CN110619988A (en) | 2019-09-25 | 2019-09-25 | Surface-mounted electronic component and preparation method thereof |
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| CN201910912180.3A CN110619988A (en) | 2019-09-25 | 2019-09-25 | Surface-mounted electronic component and preparation method thereof |
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