JP2020088243A - Electronic component and method for manufacturing the same - Google Patents

Abstract

To enhance the function of decreasing noise of an electronic component, overvoltage and the like, which are to be reduced.SOLUTION: An electronic component comprises: a magnetic body 4 including a first magnetic body 4-1 and a second magnetic body 4-2 different from the first magnetic body, and having a hollow part 10; a conductor 6 extending through the hollow part 10 of the magnetic body 4 and protruding from the hollow part 10; a dielectric layer 30 formed on a surface of the conductor 6; a solid electrolyte layer 32-2 formed on a surface of the dielectric layer 30; and a lead layer electrically connected to the solid electrolyte layer 32-2.SELECTED DRAWING: Figure 3

Description

The technique of the present disclosure relates to an electronic component having a magnetic body and a conductor arranged in a hollow portion thereof, and a method for manufacturing the electronic component.

In an electronic component in which a conductor is arranged in a hollow portion of a magnetic body, the conductor and the magnetic body are linked to each other to form an inductor. Regarding such an electronic component, it is known that an air-core portion is provided at the center of a toroidal magnetic core, and a conductor is inserted and arranged in the air-core portion of the toroidal core (for example, Patent Document 1). Such an electronic component is used as a noise filter, for example.

JP-A-7-226639

By the way, an inductor may be used as an LC electronic component in combination with a capacitor, for example. When an overvoltage is applied to this LC electronic component, there is a problem that the functions of the capacitance such as the noise filtering function are impaired.

Then, the technique of this indication aims at improving the function which reduces the reduction object, such as noise and overvoltage.

To achieve the above object, according to one aspect of the present disclosure, an electronic component includes a magnetic body including a first magnetic material and a second magnetic material different from the first magnetic material, and having a hollow portion, A conductor penetrating the hollow part of the magnetic body and protruding from the hollow part, a dielectric layer formed on the surface of the conductor, and a solid electrolyte layer formed on the surface of the dielectric layer, An extraction layer electrically connected to the solid electrolyte layer.

In the above electronic component, the first magnetic material and the second magnetic material may have a band shape, and the first magnetic material having the band shape and the second magnetic material having the band shape may be wound in a laminated state. It may have been done.

In the above electronic component, the first magnetic material may have a strip shape and may be wound, and the second magnetic material may have a strip shape and may be wound or may be wound. The first magnetic material and the wound second magnetic material may be arranged adjacent to each other.

In the electronic component, the conductor and the magnetic body may form an inductor, and by including the first magnetic material, an overvoltage applied to the electronic component may be reduced.

In the electronic component, the magnetic body includes a first magnetic body that includes the first magnetic material and has a part of the hollow portion, and a second magnetic material that includes another part of the hollow portion. The second magnetic body may be included, and the first magnetic body may be arranged next to the second magnetic body.

In the electronic component, the first magnetic body may be joined to the second magnetic body.

In the electronic component, the magnetic body may include a first magnetic foil containing the first magnetic material and a second magnetic foil containing the second magnetic material. The foil and the second magnetic foil may be laminated and wound together.

In the electronic component, the first magnetic material and the second magnetic material may be silicon steel, a soft magnetic crystal material, a nanocrystal material, an amorphous metal or an amorphous alloy.

To achieve the above object, according to another aspect of the present disclosure, a method of manufacturing an electronic component includes a hollow portion that includes a first magnetic material and a second magnetic material different from the first magnetic material. A step of forming a magnetic body, a step of forming a dielectric layer, a solid electrolyte layer and an extraction layer in that order on the surface of the conductor, the dielectric layer, the solid electrolyte layer and the extraction layer formed conductor Inserting the conductor into the hollow portion of the magnetic body, arranging the conductor in the hollow portion, and projecting an end portion of the conductor from the hollow portion.

According to the technique of the present disclosure, since the magnetic body includes the first magnetic material and the second magnetic material different from the first magnetic material, the electronic component may have a plurality of reduction targets such as noise and overvoltage. It is possible to reduce the number of types of reduction target, and to enhance the reduction function of the reduction target.

It is a figure which shows an example of the electronic component which concerns on 1st Embodiment. It is a figure which shows an example of the equivalent circuit of an electronic component. It is a figure which shows an example of the electronic component which concerns on 2nd Embodiment. It is a figure which shows an example of the equivalent circuit represented as an electronic component and its distributed constant circuit. It is a figure which shows the other example of the equivalent circuit represented as an electronic component and its distributed constant circuit. It is a figure which shows an example of the manufacturing procedure of an electronic component. It is a figure which shows an example of the manufacturing procedure of an electronic component. It is a figure showing an example of a change of the surface of a conductor, and a formation process of a lamination part. It is a figure showing an example of a change of the surface of a conductor, and a formation process of a lamination part. It is a figure which shows an example of the electronic component which concerns on 3rd Embodiment. It is a figure which shows an example of the manufacturing procedure of an electronic component. It is a figure which shows an example of the electronic component which concerns on 4th Embodiment. It is a figure which shows an example of an impedance characteristic. It is a figure which shows an example of the electronic component which concerns on a modification.

Hereinafter, embodiments will be described with reference to the drawings.

First embodiment

FIG. 1 shows an example of an electronic component according to the first embodiment. 1B is a view of the electronic component viewed from the IB direction shown in A of FIG. In FIG. 1C, the front surface of the magnetic body 4 is omitted to show the inside of the electronic component.

The electronic component 2 includes a magnetic body 4 and a conductor 6. The magnetic body 4 has, for example, a cylindrical shape and has a hollow portion 10 inside. The hollow portion 10 reaches the end of the cylinder of the magnetic body 4 and penetrates the inside of the magnetic body 4. The conductor 6 is arranged in the hollow portion 10 of the magnetic body 4, protrudes from the hollow portion 10, and is exposed at the end portion of the magnetic body 4. That is, the conductor 6 penetrates the hollow portion 10 of the magnetic body 4. With such a configuration, the magnetic body 4 is linked to the conductor 6, and the magnetic body 4 and the conductor 6 form an inductor. The electronic component 2 has an inductor and is used as, for example, a noise filter. In the electronic component 2, a voltage is applied to the two ends of the conductor 6.

The conductor 6 has, for example, a cylindrical shape, and the magnetic body 4 and the conductor 6 are coaxially arranged. That is, the central axis of the magnetic body 4 having a tubular shape is aligned with the central axis of the conductor 6. Therefore, in the cross section of the electronic component 2, the conductor 6 and the magnetic body 4 form, for example, concentric circles. As a result, it is possible to obtain an inductor that is efficient and stable against the attenuation of signals such as noise. Further, by adjusting the length or thickness of the magnetic body 4, the inductance of the inductor formed can be adjusted. That is, the electronic component 2 has a high inductance adjusting function. A dielectric layer is formed on the surface of the conductor 6, a solid electrolyte layer is formed on the surface of the dielectric layer, and a lead layer is electrically connected to the solid electrolyte layer to form a capacitance.

The magnetic body 4 includes a first magnetic body 4-1 containing a first magnetic material and a second magnetic body 4-2 containing a second magnetic material. The first magnetic body 4-1 is arranged, for example, next to the second magnetic body 4-2. For example, the first magnetic material and the second magnetic material are arranged adjacent to each other. The end of the cylinder of the first magnetic body 4-1 may be joined to the end of the cylinder of the second magnetic body 4-2 by a joining means such as an adhesive or spot welding. The first magnetic body 4-1 has a part of the hollow portion 10, and the second magnetic body 4-2 has another part of the hollow portion 10.

The first magnetic body 4-1 and the conductor 6 form a first inductor, and the second magnetic body 4-2 and the conductor 6 form a second inductor. Therefore, in the electronic component 2, for example, as shown in FIG. 2, the first inductor L1 and the second inductor L2 are connected in series. In the circuit shown in FIG. 2, the capacitor formed on the surface of the conductor 6 is omitted.

The first magnetic material and the second magnetic material are different magnetic materials, and therefore,
The first magnetic body 4-1 and the second magnetic body 4-2 have different magnetic characteristics (for example, magnetic permeability characteristics), and the first inductor L1 and the second inductor L2 have different inductance characteristics. Have. Therefore, the electronic component 2 can reduce a plurality of types of reduction targets among reduction targets such as noise and overvoltage. For example, the first inductor L1 reduces overvoltage and the second inductor L2 reduces noise. Overvoltage is a high voltage (e.g. 20-30 volts) that can occur momentarily when the voltage of the power supply fluctuates (e.g. 12 volts). The electronic component 2 may reduce a plurality of reduction targets among the reduction targets of the same type. In the electronic component 2, the degree of freedom in adjusting functions such as noise cutting is increased.

The first magnetic body 4-1 and the second magnetic body 4-2 are foils having magnetism, for example, and are formed by winding a band-shaped magnetic foil, for example. The first magnetic body 4-1 and the second magnetic body 4-2 include a magnetic material such as silicon steel, a soft magnetic crystal material, a nanocrystal material, an amorphous metal or an amorphous alloy. The first magnetic body 4-1 and the second magnetic body 4-2 are magnetic materials such as an iron-based amorphous material, a cobalt-based amorphous material, an iron-based nanocrystal material, an iron-nickel-based alloy, and an iron-silicon alloy. May be The magnetic material is determined according to, for example, the function, purpose or characteristic of the first inductor or the second inductor.

The iron-based amorphous material is an example of an iron-based amorphous metal or an iron-based amorphous alloy, and is a material that is hard to magnetically saturate. Since the electronic component 2 including the iron-based amorphous material has the inductance even when the current is superimposed, the electronic component 2 can have the inductance while outputting the current. The maximum current of the electronic component 2 including the iron-based amorphous material is, for example, 100 to 200 amperes, and the frequency of the electronic component 2 is, for example, 0 to 100 MHz.

Since the magnetic foil containing the iron-based amorphous material has a thin thickness of, for example, 20 micrometers or about 20 micrometers, the magnetic foil containing the iron-based amorphous material is suitable for winding the magnetic foil. The magnetic permeability of the magnetic foil containing the iron-based amorphous material can be controlled in a wide range of 150 to 5000 [H/m] by heat treatment. A magnetic foil containing an iron-based amorphous material has excellent availability and cost performance.

The cobalt-based amorphous material is an example of an amorphous metal or an amorphous alloy, and has a square BH curve (magnetic hysteresis curve) at high frequencies. The maximum current of the electronic component 2 including the cobalt-based amorphous material is, for example, 100 to 200 amperes, and the electronic component 2 is suitable for, for example, a saturable coil, and is suitable for suppressing spike noise generated during switching of a semiconductor element. .. Further, the electronic component 2 including the cobalt-based amorphous material has a high impedance in a wide frequency range, for example, 0.01 to 30 MHz.

A magnetic foil containing a cobalt-based amorphous material is suitable for winding a magnetic foil. With a magnetic foil containing a cobalt-based amorphous material, a square BH curve is easily obtained by heat treatment, and a flat BH curve is easily obtained by magnetic field heat treatment perpendicular to the magnetic path. That is, the magnetic foil containing the cobalt-based amorphous material has a high ability to adjust the BH curve.

An iron-based nanocrystal material is an example of a nanocrystal material, has a square BH curve at high frequencies, has a high saturation magnetic flux density, and can absorb high energy pulses. The maximum current of the electronic component 2 including the iron-based nanocrystal material is, for example, 100 to 200 amperes, and the electronic component 2 is suitable for, for example, a saturable coil, and is suitable for suppressing spike noise generated during switching of a semiconductor element. There is. Further, the electronic component 2 including the iron-based nanocrystal material has high impedance in a wide frequency range, for example, 0.01 to 30 MHz.

The magnetic foil containing the iron-based nanocrystal material is suitable for winding the magnetic foil. With a magnetic foil containing an iron-based nanocrystal material, a rectangular BH curve is easily obtained by magnetic field heat treatment, and a flat BH curve is easily obtained by magnetic field heat treatment perpendicular to the magnetic path. That is, the magnetic foil containing the iron-based nanocrystal material has a high ability to adjust the BH curve. Magnetic foils containing iron-based nanocrystal materials have good availability and cost performance.

An iron-nickel alloy is an example of a soft magnetic crystal material, has a square BH curve, has a high saturation magnetic flux density, and can absorb high energy pulses. The maximum current of the electronic component 2 including the iron-nickel alloy is 100 to 200 amperes, for example. Further, the electronic component 2 containing the iron-nickel alloy has a high impedance, and its frequency is, for example, 0.1 to 1 megahertz.

With a magnetic foil containing an iron-nickel alloy, a rectangular BH curve is easily obtained by magnetic field heat treatment, and a flat BH curve is easily obtained by magnetic field heat treatment perpendicular to the magnetic path. That is, the magnetic foil containing the iron-nickel alloy has a high ability to adjust the BH curve.

The iron-silicon alloy is an example of silicon steel, and the magnetic foil containing the iron-silicon alloy is widely distributed in the market and has excellent availability and cost performance.

If the magnetic body 4 is formed of, for example, a magnetic foil made of a magnetic material having a high magnetic permeability such as a cobalt-based amorphous material and a magnetic foil made of a magnetic material such as an iron-based amorphous material, a large current and a low current can be obtained. Inductance can be secured regardless of which of the two flows. In other words, a magnetic material made of an iron-based amorphous material can secure an inductance when a large current flows, and a magnetic material made of a cobalt-based amorphous material makes a coil using only an iron-based amorphous material when a low current flows. Higher inductance can be secured. Further, when a plurality of magnetic materials differ in frequency characteristics of magnetic permeability, it is possible to suppress a signal such as noise in a frequency band in which each magnetic material is different.

The magnetic bodies 4-1 and 4-2 have an insulating layer on the inner surface or the outer surface of the foil, and the magnetic material is exposed on the other surface of the foil of the magnetic bodies 4-1 and 4-2. The insulating layer insulates between the laminated foils of the magnetic bodies 4-1 and 4-2 in the laminating direction. The insulating layer divides the eddy current generated by the noise current into the layers of the magnetic bodies 4-1 and 4-2, and efficiently converts the noise into heat. The insulating layer has an insulating property and is, for example, an aggregate of nonmagnetic insulating powders. The insulating layer is, for example, the following substances,
(1) Sodium silicate, aluminosilicate alkali salt, phyllosilicate alkali salt, silicon carbide, calcium sulfate hemihydrate, potassium carbonate, magnesium carbonate, calcium carbonate, natural inorganic compounds such as barium sulfate,
(2) Metal oxides such as aluminum oxide, boron oxide, magnesium oxide, silicon dioxide, tin dioxide, zinc oxide, zirconium dioxide, diantimony pentoxide, and titanium oxide,
(3) Ceramics composed of complex oxides such as perovskite, silicate glass, phosphate, titanate, niobium, tantalum, and tungstate, aluminum nitride, aluminum oxynitride sintered body, boron nitride, magnesium boron nitride , Boron nitride composites, nitrides such as silicon nitride, lanthanum silicon nitride, sialon, etc., carbides such as boron carbide, silicon carbide, aluminum boron carbide, titanium carbide, titanium diboride, calcium hexaboride, lanthanum hexaboride, etc. Ceramic material exemplified by the boride of
Is. The insulating layer may be a single material or a mixture of a plurality of materials. The insulating layer is preferably an aggregate of powders of, for example, silicon dioxide, aluminum oxide, zirconium dioxide, diantimony pentoxide or titanium oxide. The insulating layer may have an air layer between insulating powders. The air layer has an insulating property and can improve the insulating property of the insulating layer.

At the outer peripheral ends of the magnetic bodies 4-1 and 4-2, the magnetic foils are connected by spot welding or other welding, and the shapes of the magnetic bodies 4-1 and 4-2 are maintained.

The conductor 6 is a conductive linear member or rod-shaped member. The conductor 6 may be, for example, a wire or rod of a low resistance member such as copper or silver, or a valve metal such as aluminum, niobium, tantalum, titanium, hafnium, zirconium, zinc or tungsten. May be. The conductor 6 is preferably copper wire or rod-shaped copper. The conductor 6 may be a conductive foil, or may be formed into a tubular shape by winding a strip-shaped conductive foil.

The electronic component 2 is formed, for example, as follows.
(1) The magnetic foil is wound to form the first magnetic body 4-1 and the second magnetic body 4-2.
(2) The conductor 6 is inserted into the hollow portions 10 of the first magnetic body 4-1 and the second magnetic body 4-2.

According to the first embodiment, the electronic component 2 can have a plurality of inductance characteristics, and the degree of freedom in adjusting functions such as noise cut can be increased. The electronic component 2 can reduce a plurality of types of reduction targets among reduction targets such as noise and overvoltage, and can enhance the function of reducing the reduction targets of the electronic component 2. The electronic component 2 can reduce, for example, noise and overvoltage. For example, it is possible to reduce noise together with the capacitance while protecting the capacitance provided in the electronic component 2 from overvoltage.

Second embodiment

3A shows an example of an electronic component according to the second embodiment, and FIG. 3B conceptually shows a cross section of a conductor and a laminated portion included in the electronic component. In FIG. 3A, a part of the magnetic body 4 is omitted to show the inside of the electronic component. In FIG. 3B, the linear or rod-shaped conductor and the laminated portion are cut along the direction in which they extend. 3, the same parts as those in FIG. 1 are designated by the same reference numerals. The electronic component illustrated in FIG. 3 is an example, and the technology of the present disclosure is not limited to such an electronic component.

The electronic component 22 includes a magnetic body 4, a conductor 6, a laminated portion 24, a resist layer 26, and a lead conductor 28. Since the magnetic body 4 and the conductor 6 are the same as those in the first embodiment, their description will be omitted. In the electronic component 22, the conductor 6 is arranged in the hollow portion 10 of the magnetic body 4 and protrudes from the hollow portion 10, as in the first embodiment. With such a configuration, the magnetic body 4 is linked to the conductor 6, and the magnetic body 4 and the conductor 6 form an inductor.

The laminated portion 24 is formed on the surface of the conductor 6. By forming the laminated portion 24, a capacitance is formed between the solid electrolyte layer 32-2 of the laminated portion 24 and the conductor 6. Therefore, the electronic component 22 functions as an LC electronic component having an inductor and a capacitance, and is used as a noise filter, for example. That is, the electronic component 22 has an impedance different from the internal impedance of the noise source, and the electronic component 22 blocks noise due to impedance mismatch. The interrupted noise current flows through the lead conductor 28 toward the ground.

Similar to the first embodiment, the magnetic body 4 and the conductor 6 are arranged coaxially, and in the cross section of the electronic component 22, the conductor 6, the laminated portion 24 and the magnetic body 4 form, for example, concentric circles. As a result, it is possible to obtain an inductor and a capacitor that are efficient and stable against the attenuation of signals such as noise. Further, by adjusting the length or thickness of the magnetic body 4, the inductance of the inductor formed can be adjusted. That is, the electronic component 22 has a high inductance adjusting function.

The conductor 6 is the same as the conductor 6 of the first embodiment, but is preferably a linear member or a rod member that can be formed. The conductor 6 is, for example, a valve metal wire or rod, preferably an aluminum wire or aluminum rod. The side surface of the conductor 6 is etched, for example, to increase the area of the side surface of the conductor 6.

The laminated portion 24 includes a dielectric layer 30 and an electrode layer 32. The dielectric layer 30 has a dielectric property and is arranged between the conductor 6 and the electrode layer 32. Therefore, the conductor 6, the dielectric layer 30, and the electrode layer 32 form a capacitance. The conductor 6 forms the first electrode of this capacitance and the electrode layer 32 forms the second electrode of this capacitance. The first electrode may be, for example, an anode and may be a cathode, and the second electrode may be, for example, a cathode and may be an anode. For example, the capacitance of the electronic component 22 can be adjusted by adjusting the formation area of the laminated portion 24, the surface area of the conductor 6 enlarged by etching, or the internal structure and thickness of the dielectric layer 30. That is, the electronic component 22 has a high capacity adjusting function.

The dielectric layer 30 is formed by chemical conversion treatment of the conductor 6, for example. When the surface of conductor 6 is, for example, aluminum, this dielectric layer 30 is, for example, an aluminum oxide film. That is, the dielectric layer 30 is, for example, an oxide of the material existing on the surface of the conductor 6. The dielectric layer 30 is arranged not only between the conductor 6 and the electrode layer 32 but also outside the electrode layer 32. However, in the present disclosure, it is assumed that a part of the dielectric layer 30 arranged between the conductor 6 and the electrode layer 32 is included in the laminated portion 24.

The electrode layer 32 has conductivity, and has, for example, a precoat layer 32-1, a solid electrolyte layer 32-2, a carbon layer 32-3, and a silver layer 32-4. The precoat layer 32-1, the solid electrolyte layer 32-2, the carbon layer 32-3, and the silver layer 32-4 are the precoat layer 32-1, the solid electrolyte layer 32-2, and the carbon layer 32 from the dielectric layer 30 side. -3 and a silver layer 32-4 are laminated in this order. The precoat layer 32-1 and the solid electrolyte layer 32-2 include, for example, a conductive polymer such as PEDOT (poly(3,4-ethylenedioxythiophene)), and function as a solid electrolyte layer having a capacity. The carbon layer 32-3 contains carbon, and the silver layer 32-4 contains silver. The carbon layer 32-3 and the silver layer 32-4 form an extraction layer (for example, a cathode extraction layer). The extraction layer has a function of electrically connecting to the solid electrolyte layer 32-2 and drawing electricity from the solid electrolyte layer 32-2. The electrode layer 32 may include other layers and is formed of a part of the precoat layer 32-1, the solid electrolyte layer 32-2, the carbon layer 32-3, and the silver layer 32-4. Good.

The resist layer 26 is an example of a coating layer that partially and cylindrically covers the conductor 6, and is, for example, a resin such as an epoxy resin, a phenol resin, or an acrylic resin. The resist layer 26 has a high resistance and blocks the passage of direct current. The resist layer 26 is formed on the surface of the dielectric layer 30 on the conductor 6, for example, and is in contact with both ends of the laminated portion 24. The resist layer 26 has the same height as the outer surface of the solid electrolyte layer 32-2, for example. Since the resist layer 26 has a high resistance, the resist layer 26, together with the dielectric layer 30, prevents the conductor 6 and the electrode layer 32 from being short-circuited in terms of direct current. When forming the electrode layer 32 on the surface of the dielectric layer 30, the resist layer 26 protects the surface of the dielectric layer 30 and regulates the formation range of the electrode layer 32.

The lead conductor 28 is a conductive foil or wire, for example, a copper foil or a copper wire. One end of the lead conductor 28 is connected to the extraction layer of the electrode layer 32 of the laminated portion 24, and the other end is extracted to the outside of the magnetic body 4. The lead conductor 28 is disposed, for example, between the magnetic body 4 and the laminated portion 24 on the conductor 6, and along the inner surface of the magnetic body 4, the side surface of the conductor 6, and the laminated portion 24.

4 and 5 show an example of an equivalent circuit represented as an electronic component and its distributed constant circuit. 4A and 5A, the front surface of the magnetic body 4 is omitted because the conductor 6, the laminated portion 24, and the resist layer 26 in the hollow portion 10 are shown.

In the electronic component 22 shown in A of FIG. 4, all the laminated portions 24 are arranged inside the hollow portion 10 of the magnetic body 4. That is, the solid electrolyte layer 32-2 relating to the position where the capacitance is formed is all disposed inside the hollow portion 10 of the magnetic body 4. Therefore, the inductors L11 and L12 are formed outside the capacitance C at both end portions of the magnetic body 4 surrounded by the broken line in A of FIG. 4B shows an equivalent circuit represented as a distributed constant circuit of the electronic component 22. At both ends of the magnetic body 4, only inductors are formed. Therefore, when the lead conductor 28 is connected to the laminated portion 24 and the lead conductor 28 is pulled out to the outside of the magnetic body 4, a T-type LC circuit can be formed. Since the first magnetic body 4-1 is related to the formation of the inductor L11, the inductor L11 reduces the overvoltage, for example. The inductor L12 reduces noise, for example.

In the electronic component 22 of FIG. 4A, the laminated portion 24 is entirely arranged in the hollow portion 10 of the magnetic body 4, but as shown in FIG. It may be exposed. That is, a part of the solid electrolyte layer 32-2 related to the position where the capacitance is formed is arranged outside the magnetic body 4. Capacitors C1 and C2 are formed outside the inductors L11 and L12 in the outer portion of the magnetic body 4 surrounded by the broken line in A of FIG. B of FIG. 5 shows an equivalent circuit represented as a distributed constant circuit of the electronic component 22. A capacitance is formed outside the inductor outside the magnetic body 4. Therefore, by connecting the lead conductors 28-1 and 28-2 to both ends of the laminated portion 24 and pulling out the lead conductors 28-1 and 28-2, a π-type LC circuit can be formed. In a high frequency region such as a gigahertz region, the voltage of each part of the laminated portion 24 changes with time and position, and the laminated portion 24 is divided in high frequency. As a result, when the lead conductors 28-1 and 28-2 are connected to both ends of the laminated portion 24, two capacitors can be formed in a circuit manner. Since the first magnetic body 4-1 is related to the formation of the inductor L11, the inductor L11 reduces the overvoltage, for example. The inductor L12 reduces noise, for example.

The circuit form such as the T-type LC circuit and the π-type LC circuit is selected depending on the situation of the noise source to which the electronic component 22 is connected. The electronic component 22 can cope with a plurality of circuit configurations by adjusting the arrangement position of the laminated portion 24, particularly the arrangement positions of the dielectric layer 30 and the solid electrolyte layer 32-2 in the manufacturing process, and depending on the impedance of the noise source. It has high circuit selectivity.

As shown in FIGS. 4 and 5, the circuit configuration of the electronic component 22 may be, for example, T-type or π by adjusting the arrangement position of the laminated portion 24, particularly the arrangement positions of the dielectric layer 30 and the solid electrolyte layer 32-2. Can be changed to the type. Further, for example, one end of the laminated portion 24 is arranged inside the hollow portion 10 as shown in A of FIG. 4, and the other end of the laminated portion 24 is exposed from the magnetic body 4 as shown in A of FIG. Then, one end of the solid electrolyte layer 32-2 is disposed inside the hollow portion 10, and the other end is exposed from the magnetic body 4. Therefore, an L-type LC circuit (not shown) is formed. For example, the L-type LC circuit is formed even if the entire laminated portion 24 is exposed from the magnetic body 4. Since the conductor 6 projects from the hollow portion 10, the laminated portion 24, particularly the end portion of the dielectric layer 30 or the solid electrolyte layer 32-2 is arranged at a position exposed not only in the hollow portion 10 but also from the magnetic body 4. be able to. The degree of freedom of the arrangement position of the laminated portion 24 is high, and the electronic circuit 22 can support a plurality of circuit forms of the LC circuit.

[Procedure for manufacturing electronic components]

6 and 7 show an example of a procedure for manufacturing an electronic component, and FIGS. 8 and 9 show an example of a process of changing the surface of a conductor and forming a laminated portion. The electronic component manufacturing procedure is an example of an electronic component manufacturing method. The manufacturing procedure of the electronic component, the change of the surface of the conductor, and the forming process of the laminated portion are examples, and the technique of the present disclosure is not limited by these procedures, changes, and processes.

The manufacturing procedure of the electronic component 22 includes an etching step, a dielectric layer forming step, a masking step, an electrode layer forming step, a dielectric layer restoring step, a resist layer forming step, an electrode forming step, and an aging step. including. The electrode layer forming step includes a precoat layer forming step, a solid electrolyte layer forming step, and a lead layer forming step. The extraction layer forming step includes a carbon layer forming step and a silver layer forming step. The procedure for manufacturing the electronic component 22 further includes the conductor inserting step and the resin filling step described in the first embodiment.

In the etching process, for example, the conductor 6 is immersed in the chloride aqueous solution. After that, a direct current or an alternating current is passed through the conductor 6 to etch the surface of the conductor 6. By such etching treatment, the surface of the conductor 6 is changed from the surface state shown in FIG. 8A to the surface state shown in FIG. 8B, and the surface area of the conductor 6 is increased.

In the dielectric layer forming step, for example, the etched conductor 6 is immersed in a chemical conversion treatment liquid such as ammonium adipate, ammonium dihydrogen phosphate, or an aqueous solution of ammonium borate. Then, a predetermined voltage is applied to the conductor 6 to form an oxide film (dielectric layer 30) on the surface of the conductor 6. By such a chemical conversion treatment, the surface state of the conductor 6 is changed from the surface state shown in FIG. 8B to the surface state shown in FIG. 8C.

In the masking step, as shown in FIG. 6A, the solid electrolyte layer forming surface 34 is set on the side surface of the conductor 6. Then, the masking member 36 is attached to the side surface of the conductor 6 at the portion adjacent to the set solid electrolyte layer forming surface 34. The masking member 36 covers the side surface of the conductor 6 in a portion adjacent to the solid electrolyte layer forming surface 34, and suppresses a layer formed in a later step from going outside from the solid electrolyte layer forming surface 34. Further, the layer protruding from the solid electrolyte layer forming surface 34 to the outside can be removed from the surface of the conductor 6 by removing the masking member 36. The masking member 36 is, for example, a chemical resistant tape such as a polyimide tape. The polyimide tape is not only excellent in chemical resistance, but also excellent in heat resistance and has excellent stability in heating and treatment involving chemicals.

In the precoat layer forming step, as shown in FIG. 6B, the precoat layer 32-1 is formed on the solid electrolyte layer forming surface 34 of the conductor 6. In the precoat layer forming step, the conductor 6 with the masking member 36 is immersed in the chemical polymerization liquid 38. The chemical polymerization liquid 38 has, for example, a monomer solution as the first liquid and an oxidizer solution as the second liquid. The conductor 6 with the masking member 36 is dipped in, for example, a monomer solution and then, for example, in an oxidant solution. The monomer solution and the oxidant solution cause chemical polymerization to form the precoat layer 32-1. The monomer solution contains a monomer such as EDOT (3,4-ethylenedioxythiophene) and a solvent such as ethanol. The oxidant solution contains an oxidant such as iron p-toluenesulfonate and a solvent such as ethanol. The solvent may be any volatile solvent that can disperse the monomer or the oxidant, and is not limited to ethanol. Further, the monomer solution and the oxidant solution may be appropriately selected depending on the precoat layer 32-1 to be formed. The precoat layer 32-1 is formed on the dielectric layer 30, as shown in A of FIG. The precoat layer 32-1 may be formed by a method other than this precoat layer forming step, or the precoat layer 32-1 may be formed by applying and drying a dispersion liquid of a conductive polymer.

In the solid electrolyte layer forming step, as shown in C of FIG. 6, the solid electrolyte layer 32-2 is formed on the solid electrolyte layer forming surface 34. In the solid electrolyte layer forming step, the conductor 6 and the electrode 42 are immersed in the electropolymerization liquid 40 and connected to the positive electrode and the negative electrode of the DC power supply 44, respectively. When an electric potential is generated between the conductor 6 and the electrode 42, the solid electrolyte layer 32-2 is formed. The electropolymerization liquid 40 contains a monomer such as EDOT, a supporting electrolyte, and a solvent such as water or acetonitrile. Supporting electrolytes include, for example, ammonium borodisartylate and sodium butylnaphthalene sulfonate. The electrolytic polymerization liquid 40 may be appropriately selected depending on the solid electrolyte layer 32-2 to be formed. The solid electrolyte layer 32-2 is formed on the precoat layer 32-1 as shown in FIG. 9B. Although the conductor 6 is connected to the positive electrode of the DC power supply 44 in the solid electrolyte layer forming step, the connection of the DC power supply 44 is not limited to such connection. For example, the precoat layer 32-1 may be connected to the positive electrode of the DC power supply 44 by a needle-shaped electrode such as a probe. It is preferable that the formed precoat layer 32-1 has sufficiently high conductivity. Depending on the formation conditions of the precoat layer 32-1, the conductivity of the precoat layer 32-1 is low, and the direct current from the conductor 6 may not flow to the surface of the precoat layer 32-1. By directly connecting the positive electrode, a potential is generated between the precoat layer 32-1 and the electrode 42, and the solid electrolyte layer 32-2 is easily formed.

In the dielectric layer repairing step, for example, as shown in D of FIG. 6, the conductor 6 on which the solid electrolyte layer 32-2 is formed is immersed in the chemical conversion treatment liquid 46. Then, a predetermined voltage is applied to the conductor 6 to restore the dielectric layer 30. After this dielectric layer restoration step, the masking member 36 is removed from the conductor 6.

In the resist layer forming step, a resist is applied to the surface of the conductor 6 adjacent to the solid electrolyte layer 32-2 and dried at 150 [° C.] for 15 minutes. By drying the resist, as shown in FIG. 7A, the resist layer 26 is formed outside the solid electrolyte layer 32-2. The resist is a raw material of the resist layer 26 and is a liquid that is solidified by drying.

In the carbon layer forming step, carbon paste is applied on the solid electrolyte layer 32-2 and dried at 150 [° C.] for 15 minutes, for example. By drying the carbon paste, a carbon layer 32-3 is formed as shown in FIG. 7B. The carbon layer 32-3 is formed on the solid electrolyte layer 32-2, as shown in C of FIG.

In the silver layer forming step, the silver paste is applied onto the carbon layer 32-3 and dried at 150[° C.] for 15 minutes, for example. By drying the silver paste, a silver layer 32-4 is formed as shown in FIG. 7C. The silver layer 32-4 is formed on the carbon layer 32-3, as shown in D of FIG.

In the electrode forming step, as shown in D of FIG. 7, the lead conductor 28 is adhered to the silver layer 32-4 with a conductive paste, for example. The conductive paste is dried at 150[° C.] for 15 minutes, for example.

After the electrode forming step, in the aging step, the solid electrolyte layer 32-2 formed in the defective portion of the dielectric layer 30 is insulated by, for example, an aging process. In this aging process, a DC voltage is applied between the conductor 6 and the lead conductor 28. The DC voltage is, for example, a voltage that is equal to or higher than the set maximum voltage of electronic component 22. By this aging treatment, the solid electrolyte layer 32-2 formed in the defective portion of the dielectric layer 30 is insulated, and the leakage current of the formed capacitance can be suppressed.

After the aging step, the electronic component 22 is obtained, for example, as follows.
(1) The magnetic foil is wound to form the first magnetic body 4-1 and the second magnetic body 4-2.
(2) The conductor 6 is inserted into the hollow portions 10 of the first magnetic body 4-1 and the second magnetic body 4-2.

[Effects of Second Embodiment]

In addition to the effects described in the first embodiment, the following effects can be obtained in the second embodiment.

(1) The magnetic body 4 and the conductor 6 form an inductor, but since the capacitance is formed on the surface of the conductor 6, the component hardly expands due to the formation of the capacitance. Therefore, the electronic component 22 can be made smaller than an LC circuit including an inductor element and a capacitor element connected by wiring. Further, the installation area of the electronic component 22 on the circuit board can be made smaller than that of the LC circuit including the inductor element and the capacitor element.

(2) Since the conductor 6 functions not only as the conductor part of the inductor but also as the first electrode of the capacitor and connects the inductor and the capacitor, it is not necessary to connect the inductor and the capacitor by wiring, and the inductor and the capacitor are connected. The burden is reduced. The connection between the inductor and the capacitance by the wiring may cause deterioration of characteristics such as self-resonance frequency characteristic and influence on surrounding electronic components due to parasitic capacitance generated in the wiring. However, in the electronic component 22, due to the absence of wiring, for example, deterioration of the characteristics is small, and deterioration of the filter characteristics as the LC electronic component can be suppressed.

(3) In the electronic component 22, the end portion of the conductor 6 projects from the magnetic body 4, but the central portion of the conductor 6 is arranged inside the magnetic body 4. Therefore, the electronic component 22 has higher robustness than an LC circuit including, for example, a substrate and an inductor element and a capacitive element arranged on the substrate.

(4) By adjusting the length or thickness of the magnetic body 4, the inductance of the electronic component 22 can be adjusted. Further, the capacitance of the electronic component 22 can be adjusted by adjusting the formation area of the laminated portion 24, the surface area of the conductor 6 enlarged by etching, or the internal structure and thickness of the dielectric layer 30. Furthermore, the circuit form of the electronic component 22 can be changed by adjusting the arrangement position of the laminated portion 24. The degree of freedom in adjusting the inductance, capacitance, and circuit form is high, and the flexibility and flexibility of the circuit of the electronic component 22 are high. Further, by adjusting the lengths of the magnetic bodies 4, 4-1, 4-2 and the formation area of the laminated portion 24, the electronic component 22 can have a practical inductance and capacitance as a noise filter, for example. It has both.

(5) The lead conductor 28 is arranged, for example, between the magnetic body 4 and the laminated portion 24 and is drawn out to the outside of the magnetic body 4. Therefore, the lead conductor 28 is not arranged in the radial direction of the magnetic body 4 from the inner surface to the outer surface of the magnetic body 4, and the lead conductor 28 interferes with the magnetic path of the magnetic body 4 (that is, the magnetic path is There is no interruption. The break in the magnetic path causes a magnetic gap. The magnetic gap may cause loss factors such as an increase in magnetic resistance, a decrease in magnetic permeability, a decrease in inductance, a leakage of magnetic flux, generation of an induced current in the surrounding conductive parts, and heat generation due to the leakage of magnetic flux. is there. The heat generated by the magnetic body 4 may have a thermal effect on the solid electrolyte layer 32-2, and the leaked magnetic flux may have a magnetic effect on the solid electrolyte layer 32-2, such as malfunction. By arranging the lead conductor 28 along the magnetic body 4 and the laminated portion 24 to avoid interruption of the magnetic path, it is possible to suppress the loss factor, thermal influence, and magnetic influence. Further, since the leakage of the magnetic flux is suppressed, the overcurrent loss due to the leaked magnetic flux is suppressed, the AC loss of the magnetic body 4 is suppressed, and the equivalent series resistance (ESR) of the electronic component 22 can be suppressed.

Third embodiment

FIG. 10 shows an example of the electronic component according to the third embodiment. 10, the same parts as those in FIG. 1 or 3 are designated by the same reference numerals. 10B is a view of the electronic component viewed from the XB direction shown in A of FIG. In C of FIG. 10, the front surfaces of the magnetic body 4 and the resin 54 are omitted to show the inside of the electronic component.

In the electronic component 2 of the first embodiment and the electronic component 22 of the second embodiment, there is a space between the magnetic body 4 and the conductor 6, the laminated portion 24 or the resist layer 26, but the third component is used. In the electronic component 52 of the above embodiment, the resin 54 is disposed between the magnetic body 4 and the conductor 6, the laminated portion 24 or the resist layer 26. The end of the resin 54 may be positionally aligned with the end of the cylinder of the magnetic body 4 as shown in C of FIG. 10, or may be different. Further, the resin 54 may be partially disposed between the magnetic body 4 and the conductor 6, the laminated portion 24 or the resist layer 26. Due to the arrangement of the resin 54, the magnetic body 4 and the conductor 6 are arranged and fixed, for example, in a concentric circle shape or a substantially concentric circle shape, as shown in FIG. 10B.

The resin 54 is a resin that cures from a liquid state, and is, for example, a thermoplastic resin, a thermosetting resin such as a silicone elastomer, or a resin that can be crosslinked with a curing agent. The resin 54 is filled between the magnetic body 4 and the conductor 6, the laminated portion 24 or the resist layer 26, and then cured. The resin 54 fixes the relative position of the conductor 6 with respect to the magnetic body 4. The resin 54 may be partially disposed between the magnetic body 4 and the conductor 6, the laminated portion 24, or the resist layer 26. Fixing the position of the conductor 6 improves the vibration resistance of the electronic component 52 and stabilizes the impedance of the electronic component 52. In addition, since the thermal conductivity of the resin 54 is higher than that of air, the resin 54 can conduct the heat generated in the conductor 6 to the magnetic body 4 more efficiently than the air when an electric current flows. The heat dissipation of the electronic component 52 can be improved. That is, the electronic component 52 can dissipate the heat generated by the conductor 6 more efficiently than the electronic components 2 and 22. The resin 54 may include a metal powder filler such as copper powder and aluminum powder. The metal powder filler is an example of the heat transfer filler and has a higher thermal conductivity than the resin 54. When the metal powder filler is dispersed in the resin 54, the thermal conductivity of the resin 54 can be increased and the heat dissipation of the electronic component 52 can be improved. In the electronic component 52, it is not necessary to electrically insulate the magnetic body 4 from the conductor 6. Therefore, the content of the metal powder filler is not limited, and the resin 54 may have conductivity. The filler contained in the resin 54 may be a non-metal heat transfer filler having a higher thermal conductivity than the resin 54. Such a non-metal heat transfer filler can enhance the thermal conductivity of the resin 54 and enhance the heat dissipation of the electronic component 52.

The magnetic body 4, the conductor 6, the laminated portion 24, the resist layer 26, and the lead conductor 28 are the same as those in the second embodiment, and the description thereof will be omitted.

[Filling of resin]

FIG. 11 shows an example of a conductor inserting step and a resin filling step in the electronic component manufacturing procedure. In FIG. 11, the lead conductor 28 is omitted. Further, in order to show the inside of the electronic component 52, the front surface of the magnetic body 4 is omitted in FIG. 11B, and the front surfaces of the magnetic body 4 and the resin 54 are omitted in C of FIG. The electronic component manufacturing procedure is an example of an electronic component manufacturing method. The manufacturing procedure of the electronic component, the change of the surface of the conductor, and the forming process of the laminated portion are examples, and the technique of the present disclosure is not limited by these procedures, changes, and processes.

By the manufacturing procedure similar to that of the second embodiment, the conductor 6 provided with the laminated portion 24, the resist layer 26 and the lead conductor 28 is obtained. In the conductor insertion step, as shown in FIG. 11A, one end of the conductor 6 is inserted into the support hole 58 of the support base 56 to support the conductor 6 on the support base 56. Further, as shown in FIG. 11B, the magnetic body 4 is arranged around the conductor 6. That is, the conductor 6 is inserted into the hollow portion 10 of the magnetic body 4. The support base 56 includes, for example, a positioning protrusion 60, and the arrangement position of the magnetic body 4 is adjusted by the positioning protrusion 60, and for example, the central axis of the magnetic body 4 is adjusted to match the central axis of the conductor 6. In the resin filling step, as shown in C of FIG. 11, the resin 54 is filled between the magnetic body 4 and the conductor 6. After that, the resin 54 is cured, and the magnetic body 4, the conductor 6 and the laminated portion 24 are bonded and fixed.

In the conductor inserting step, the magnetic body 4 may be placed on the support base 56, the conductor 6 may be inserted into the magnetic body 4, and one end of the conductor 6 may be inserted into the support hole 58 of the support base 56. ..

According to the third embodiment, the same effects as those of the first and second embodiments can be obtained, and the following effects can be obtained.

(1) By disposing the resin 54, it is possible to obtain effects such as improved vibration resistance and improved heat dissipation.

(2) Since the solid electrolyte layer 32-2 is covered with the resin 54, the solid electrolyte layer 32-2 is shielded from the outside air. The moisture resistance of the capacitive element is improved, and stable capacitive characteristics are obtained. Further, since the solid electrolyte layer 32-2 is covered with the resin 54, the solid electrolyte layer 32-2 is protected, and when the impact due to the external force is applied to the electronic component 52, the deterioration of the solid electrolyte layer 32-2 is reduced and the solid state is stable. The obtained capacitance characteristic is obtained.

(3) The adhesive strength can be improved by covering the adhesive portion between the silver layer 32-4 and the lead conductor 28 with a resin.

Fourth embodiment

FIG. 12 shows an example of the electronic component according to the fourth embodiment. 12, the same parts as those in FIG. 3 are designated by the same reference numerals. In FIG. 12, the front surface of the magnetic body 4 is omitted to show the inside of the electronic component.

The electronic component 62 includes a magnetic body 4, a conductor 6, a plurality of laminated portions 24-1 and 24-2, a plurality of resist layers 26, and a plurality of lead conductors 28. The magnetic body 4, the conductor 6, the laminated portions 24-1 and 24-2, the resist layers 26, and the lead conductors 28 are the magnetic body 4, the conductor 6, the laminated portion 24, and the resist layer of the second embodiment, respectively. 26 and the lead conductor 28. In the electronic component 62, the two laminated parts 24-1 and 24-2 are formed on the surface of the conductor 6, and the first capacitance is formed between the solid electrolyte layer of the laminated part 24-1 and the conductor 6, thereby forming the laminated part. A second capacitor is formed between the solid electrolyte layer 24-2 and the conductor 6. Further, each lead conductor 28 is connected to one of the lead layers formed in the laminated portions 24-1 and 24-2. In the electronic component 62, one resist layer 26 is arranged between the two laminated parts 24-1 and 24-2. However, the two resist layers 26 are arranged between the two laminated portions 24-1 and 24-2, and each resist layer 26 is in contact with either end of the laminated portions 24-1 and 24-2. Good.

In the electronic component 62, two capacitors, that is, a first capacitor and a second capacitor are formed. The capacitance values of the two capacitors are made different by adjusting the formation area of the laminated portions 24-1 and 24-2, the surface area of the conductor 6 enlarged by etching, or the internal structure and thickness of the dielectric layer 30. You can In the electronic component 62, for example, the formation area of the laminated portion 24-1 is smaller than the formation area of the laminated portion 24-2, and the first capacitance has a smaller capacitance value than the capacitance value of the second capacitance.

The resonance frequency of the capacitance is determined by the capacitance value of the capacitance. Specifically, the resonance frequency decreases as the capacitance value increases. At the resonant frequency, the impedance of the capacitance drops and current will pass through the capacitance. In the LC electronic component such as the electronic component 22, 52, 62, when the lead conductor 28 is connected to the ground and the capacitance is grounded, a current having a resonance frequency flows to the ground through the capacitance, and the current flowing through the conductor 6 is reduced. A current having a resonant frequency can be removed.

13A shows an example of the individual impedance characteristics of the two capacitors formed in the electronic component 62, and FIG. 13B shows an example of the impedance characteristics of the entire two capacitors formed in the electronic component 62. ing.

When the capacitance values of the two capacitors formed in the electronic component 62 are different, the impedance characteristics of the two capacitors are different as shown in A of FIG. For example, the first capacitance resonates at the frequency f1, and the impedance 64-1 of the first capacitance becomes the lowest at the frequency f1. The second capacitance resonates at the frequency f2, and the impedance 64-2 of the second capacitance becomes the lowest at the frequency f2. The frequencies f1 and f2 are examples of resonance frequencies.

Since the electronic component 62 has the first capacitance and the second capacitance, the impedance due to the capacitance of the electronic component 62 has an impedance 64-1 at each frequency as shown by the solid line in B of FIG. , 64-2, the lower impedance. Since the electronic component 62 has capacitances having different capacitance values, the electronic component 62 can have a characteristic in which the characteristics of these capacitances are combined. As a result, the electronic component 62 can attenuate a signal such as noise in a wider frequency band than an LC circuit having one capacitance or an LC circuit having two capacitances having the same capacitance value.

The frequency f1 is inversely proportional to √C _F when the first capacitance is C _F, and the frequency f2 is inversely proportional to √C _S when the second capacitance is C _S. That is, there is a fixed relationship between frequency and capacity. Therefore, when the frequencies f1 and f2 are set according to the frequency band of noise to be reduced, the capacitance values of the first capacitance and the second capacitance are determined. The first capacitance and the second capacitance are adjusted so as to have a predetermined capacitance value, for example.

When the electronic component 62 is, for example, a π-type LC electronic component, the ratio of the first capacitance and the second capacitance is 10 or more (that is, 1:10 or more, or 10 or more: 1), preferably the first capacitance. If the ratio of the first capacitance to the second capacitance is 100 or more, the frequency band in which a signal such as noise is attenuated is widened, which is preferable. For example, if one of the first capacitance and the second capacitance is 0.01 to 2.0 [μF] and the other is 1.0 to 100 [μF], approximately 100 [kHz] to 100 [MHz] ], the amount of signal attenuation such as noise can be increased.

In the electronic component 62, a space is formed between the magnetic body 4 and the conductor 6, the laminated portions 24-1, 24-2 or the resist layer 26, but the resin 54 may be arranged.

In the electronic component 62, the positions of the laminated parts 24-1 and 24-2 may be adjusted as appropriate. Each laminated part 24-1, 24-2 may be arrange|positioned in the magnetic body 4, and some or all of each laminated part 24-1, 24-2 may be exposed from the magnetic body 4.

In the electronic component 62, the two laminated parts 24-1 and 24-2 are formed, but three or more laminated parts may be formed.

According to the fourth embodiment, the same effects as those of the first and second embodiments can be obtained, and noises and the like in a wide frequency band can be obtained by the first capacitance and the second capacitance. The signal can be attenuated.

Modifications of the embodiment described above are listed below.

(1) The conductor 6 is, for example, a low resistance member or a valve metal wire, rod, or flat plate. The conductor 6 may have a circular or rectangular cross section. The conductor 6 is not limited to a single member such as an aluminum wire or an aluminum rod. The conductor 6 includes a low resistance member such as copper and silver and a valve metal film formed on the surface of the low resistance member, and may be formed of a plurality of materials. The conductor 6 formed of a plurality of materials has a low resistance value due to the low resistance member and can be formed by the valve metal film. Since the resistance value of the conductor 6 is low, heat generation in the conductor 6 can be suppressed even if a large direct current flows, for example.

(2) In the above embodiment, the magnetic body 4 is formed by winding a strip-shaped magnetic foil, but it may be a sintered body of a magnetic material, for example. If the magnetic body 4 has magnetism, the electronic components 2, 22, 52, 62 can have inductance.

(3) In the second embodiment, the resist layer 26 is formed after the masking member 36 is removed from the conductor 6. However, the removal of the masking member 36 and the formation of the resist layer 26 may be omitted, and the carbon layer 32-3 and the silver layer 32-4 may be formed with the masking member 36 attached to the conductor 6. When the masking member 36 is in close contact with the precoat layer 32-1 and the solid electrolyte layer 32-2, invasion of the carbon layer 32-3 or the silver layer 32-4 is suppressed, and the carbon layer 32-3 or the silver layer 32- It is suppressed that 4 is short-circuited with the conductor 6. The masking member 36 may or may not be removed after the silver layer 32-4 is formed. According to such a modification, the resist layer 26 is omitted and the manufacturing load can be reduced. Further, the resist layer 26 may be formed instead of the masking member 36 in the precoat layer forming step to the dielectric layer repairing step. That is, the precoat layer 32-1, the solid electrolyte layer 32-2, the carbon layer 32-3, and the silver layer 32-4 may be formed after forming the resist layer 26 on the portion of the conductor 6 where the masking member 36 is attached. ..

(4) In the above embodiment, the magnetic body 4 includes the first magnetic body 4-1 and the second magnetic body 4-2. The magnetic body 4 may include three or more magnetic bodies.

(5) In the above embodiment, as shown in FIG. 3B, the resist layer 26 is formed on the surface of the conductor 6 that has been subjected to the etching and chemical conversion treatment, that is, the surface of the dielectric layer 30. However, the resist layer 26 may be formed on the surface of the conductor 6 before the chemical conversion treatment. That is, the dielectric layer 30 may be formed only between the electrode layer 32 of the laminated portion 24 and the conductor 6, and the resist layer 26 may be formed on the surface of the conductor 6. Further, the resist layer 26 may be formed on the surface of the conductor 6 before etching. The resist layer 26 having resistance can insulate the electrode layer 32 of the laminated portion 24 from the conductor 6 and prevent a short circuit between the electrode layer 32 and the conductor 6. As a result, the carbon layer 32-3 and the silver layer 32-4 can be formed on the surface of the conductor 6 without paying attention to short circuits.

(6) In the above embodiment, as shown in FIG. 3B, the resist layer 26 has the same height as the outer surface of the solid electrolyte layer 32-2. However, the shape of the resist layer 26 may be freely set as long as the resist layer 26 can insulate the conductor 6 and the electrode layer 32 from each other. Further, the carbon layer 32-3 and the silver layer 32-4 may be electrically connected to the solid electrolyte layer 32-2, and the positions of the carbon layer 32-3 and the silver layer 32-4 may be changed to the solid electrolyte layer 32--. It is not necessary to match the position of 2.

(7) The insulating layer of the magnetic body 4 may be formed on the inner surface and the outer surface of the foil of the magnetic body 4. When the insulating layers are formed on both sides, the insulating property of the magnetic body 4 is enhanced, and the eddy current generated by the noise current can be easily divided into the layers of the magnetic body 4, and the noise can be efficiently converted into heat. Further, in the magnetic body 4, the insulating layer may be omitted.

(8) In the above embodiment, the magnetic body 4 includes the first magnetic body 4-1 and the second magnetic body 4-2. For example, a plurality of magnetic foils having different magnetic materials are laminated. The magnetic body 4 may be formed by winding in a state. When a plurality of magnetic foils are laminated and wound to form a magnetic body, one magnetic body can include a plurality of magnetic materials, and the plurality of types of reduction targets described above can be reduced. In addition, when a plurality of magnetic foils are laminated and then wound to form a magnetic body, the number of windings can be reduced and productivity can be improved. In addition, the magnetic body formed of the thin magnetic foil can suppress the eddy current that increases in the high frequency region and relax the skin effect, as compared with the magnetic body formed of the thick magnetic foil. Therefore, the magnetic body formed of a thin magnetic foil can suppress a decrease in magnetic permeability, and the electronic components 2, 22, 52, and 62 can obtain high impedance up to a high frequency region. Therefore, by stacking thin magnetic foils and winding them to form a magnetic body, it is possible to manufacture an electronic component having high impedance in a high frequency region while improving productivity. In this case, an insulating layer may be formed on at least one of the plurality of magnetic foils.

Different magnetic materials may be formed by winding a magnetic foil made of one magnetic material on the outer periphery of a magnetic body made of the other magnetic material to form a magnetic body. The magnetic material may be formed by stacking the following magnetic foils and winding the stacked magnetic foils. In this case, an insulating layer may be formed on at least one side of the magnetic foil. If the magnetic body 4 has a plurality of foils, and the materials of the plurality of foils are different, the electronic components 2, 22, 52, 62 can have a plurality of inductance characteristics, and adjustment of functions such as noise cut. The degree of freedom of is increased.

(9) In the above-described embodiment, the electronic components 2, 22, 52, 62 are provided with one magnetic body 4 and one conductor 6. However, as shown in FIG. 14, the electronic component 72 includes a plurality of magnetic bodies 4 (for example, two magnetic bodies 4) and one conductor 6, and one conductor 6 is provided in the hollow portion 10 of the plurality of magnetic bodies 4. It may be arranged and may protrude from the hollow portion 10.

The conductor 6 is bent at 90 degrees at two places so that both ends of the conductor 6 are parallel to each other. Further, the two magnetic bodies 4 are arranged so that the hollow portions 10 are parallel to each other. Then, both ends of the conductor 6 are inserted into the hollow portions 10 of the two magnetic bodies 4 to form the electronic component 72. Similar to the second embodiment, the laminated portion 24 and the resist layer 26 are formed on the surface of the conductor 6, and the lead conductor 28 is connected to the laminated portion 24. As a result, the electronic component 72 has a plurality of electronic components 72-1 and 72-2 connected in series. Each of the electronic components 72-1 and 72-2 is the same as the electronic component 22 described in the second embodiment, for example. The equivalent circuit represented by the distributed constant circuit of the electronic component 72 is represented by connecting the equivalent circuit represented by the distributed constant circuit of the electronic component 22 shown in FIG. 4B, for example, in series. 14B shows an example of an equivalent circuit represented as a distributed constant circuit of the electronic component 72. In FIG. 14B, the equivalent circuit 74-1 is an equivalent circuit represented as a distributed constant circuit of the electronic component 72-1 and the equivalent circuit 74-2 is an equivalent circuit represented as a distributed constant circuit of the electronic component 72-2. Circuit. In the equivalent circuit shown as the distributed constant circuit shown in B of FIG. 14, the inductances of the inductors L11 and L21 may have the same value or different values, and the inductances of the inductors L12 and L22 may have the same value or different values. , C11 and C21 may have the same capacitance value or different capacitance values.

At the input portion IN of the electronic component 72, the inductor L11 is formed by the magnetic body 4 of the electronic component 72-1. The inductor L11 is adjusted to attenuate noise having a voltage (for example, 20 to 30 volts) higher than the rated voltage of the capacitors C11 and C21. The noise having the high voltage is an example of the overvoltage, and may occur when the voltage of the power supply (for example, 12 V) fluctuates, and may be mixed in the DC current flowing into the electronic component 72. Therefore, the inductor L11 attenuates this noise on the input IN side of the electronic component 72, so that the deterioration of the filtering performance of the capacitors C11 and C21 can be suppressed. Since the inductor L21 is formed in the output portion OUT of the electronic component 72 by the magnetic body 4 of the electronic component 72-2, even if the output portion OUT of the electronic component 72 is installed on the input side, the inductor L21 of the electronic component 72 is formed. L21 can attenuate this noise and suppress the deterioration of the filtering performance of the capacitors C11 and C21.

In the electronic component 72, the plurality of electronic components 72-1 and 72-2 are integrally formed, and it is not necessary for the substrate and the connection wiring to connect between the electronic components 72-1 and 72-2. The electronic component 72 including the plurality of electronic components 72-1 and 72-2 may remove noise in a wide frequency band or remove noise in a plurality of frequency bands. Instead of the electronic components 22, the electronic component 72 is the electronic component 2 described in the first embodiment, the electronic component 52 described in the third embodiment, or the electronic component 72 described in the fourth embodiment. The electronic component 62 may be included. Even if the electronic parts are replaced, a plurality of electronic parts are integrally formed, and it is not necessary for the board and the connection wiring to connect between the electronic parts. The electronic part 72 removes, for example, overvoltage and noise, and has a wide frequency band. It is possible to remove noise with or to remove noise in multiple frequency bands.

(10) In the second embodiment, the precoat layer 32-1 and the solid electrolyte layer 32-2 are formed in separate steps, but the precoat layer 32-1 is omitted and the solid electrolyte layer 32- Only two may be formed. Further, the precoat layer 32-1 and the solid electrolyte layer 32-2 may be formed by a method other than chemical polymerization and electrolytic polymerization. A method other than the chemical polymerization and the electrolytic polymerization is, for example, a method of applying a dispersion liquid containing a solvent and conductive polymer fine particles or powder dispersed in the solvent. Further, instead of the conductive polymer layer, the conductive oxide layer may be formed by, for example, a thermal decomposition method. Although the precoat layer 32-1 is formed by chemical polymerization, the precoat layer 32-1 is not limited to this and may be formed by applying and applying a conductive material such as carbon.

(11) In the above embodiment, the conductor 6 projects from the hollow portion 10 of the magnetic body 4, but the conductor 6 only needs to penetrate the hollow portion 10 of the magnetic body 4. For example, the position of the end of the conductor 6 may coincide with the position of the end of the magnetic body 4.

(12) In the first embodiment, the second embodiment, and the fourth embodiment, the magnetic body 4, the conductor 6, the laminated portions 24, 24-1, 24-2, or the resist layer is used. Although a space is formed between 26, the conductor 6, the laminated portions 24, 24-1, 24-2 and the resist layer 26 may be in contact with the magnetic body 4 without this space. Further, in the above-described embodiment, the conductor 6, the laminated portions 24, 24-1, 24-2 and the magnetic body 4 form a concentric circle, but the conductor 6 and the laminated portions 24, 24-1, 24-2 are It may be biased and may be in contact with the magnetic body 4. The amount of conduction heat increases due to the contact between the conductor 6, the laminated portions 24, 24-1, 24-2 and the magnetic body 4, and the heat dissipation of the heat generated by the conductor 6 and the like is improved.

(13) In the above embodiment, the side surface of the conductor 6 is etched, but the dielectric layer 30 may be formed on the surface of the conductor 6 without etching. By not performing etching, the surface area of the conductor 6 does not increase and the obtained capacitance becomes smaller, but the resistance can be reduced.

(14) In the above embodiment, each electronic component processes high frequency, for example, but low frequency may be processed. The equivalent circuit of an electronic component that processes low frequencies can be represented as a lumped constant circuit, unlike the case of high frequencies. However, even when the electronic component processes low frequencies, it is possible to increase the degree of freedom in setting the circuit form, as in the case of high frequencies.

As described above, the most preferable embodiment of the present disclosure and the like have been described, but the present invention is not limited to the above description, and is described in the claims or the invention disclosed in the specification. It goes without saying that various modifications and changes can be made by those skilled in the art based on the gist, and such modifications and changes are included in the scope of the present invention.

The technique of the present disclosure can be used for removing noise from a noise generation source such as a switching power supply, and is useful.

2, 22, 52, 62, 72 Electronic component 4 Magnetic body 4-1 First magnetic body 4-2 Second magnetic body 6 Conductor 10 Hollow part 24, 24-1, 24-2 Laminated part 26 Resist layer 28 , 28-1, 28-2 Lead conductor 30 Dielectric layer 32 Electrode layer 32-1 Precoat layer 32-2 Solid electrolyte layer 32-3 Carbon layer 32-4 Silver layer 34 Solid electrolyte layer forming surface 36 Masking member 38 Chemical polymerization Liquid 40 Electrolytic polymerization liquid 42 Electrode 44 DC power supply 46 Chemical conversion treatment liquid 54 Resin 56 Supporting base 58 Supporting hole 60 Positioning projection

Claims (9)

A magnetic body including a first magnetic material and a second magnetic material different from the first magnetic material and having a hollow portion;
A conductor that penetrates the hollow portion of the magnetic body and projects from the hollow portion,
A dielectric layer formed on the surface of the conductor;
A solid electrolyte layer formed on the surface of the dielectric layer;
An extraction layer electrically connected to the solid electrolyte layer,
An electronic component comprising:
The first magnetic material and the second magnetic material are strip-shaped,
The electronic component according to claim 1, wherein the band-shaped first magnetic material and the band-shaped second magnetic material are wound in a laminated state.
The first magnetic material is strip-shaped and wound,
The second magnetic material is strip-shaped and wound,
The electronic component according to claim 1, wherein the wound first magnetic material and the wound second magnetic material are arranged adjacent to each other.
The electronic component according to claim 1, wherein the conductor and the magnetic body form an inductor, and the first magnetic material is included to reduce an overvoltage applied to the electronic component.
The magnetic body is
A first magnetic body including the first magnetic material and having a part of the hollow portion;
A second magnetic body including the second magnetic material and having another part of the hollow portion;
5. The electronic component according to claim 1, wherein the first magnetic body is arranged next to the second magnetic body.
The electronic component according to claim 5, wherein the first magnetic body is joined to the second magnetic body.
The magnetic body includes a first magnetic foil containing the first magnetic material and a second magnetic foil containing the second magnetic material, and the first magnetic foil and the second magnetic foil are The electronic component according to claim 1 or 4, wherein the electronic component is laminated and wound around each other.
8. The first magnetic material and the second magnetic material are silicon steel, a soft magnetic crystal material, a nanocrystal material, an amorphous metal or an amorphous alloy, according to claim 1. The electronic component described in the item.
A step of forming a magnetic body having a hollow portion, the step including a first magnetic material and a second magnetic material different from the first magnetic material;
A step of sequentially forming a dielectric layer, a solid electrolyte layer and a lead layer on the surface of the conductor,
The conductor on which the dielectric layer, the solid electrolyte layer and the extraction layer are formed is inserted into the hollow portion of the magnetic body, the conductor is arranged in the hollow portion, and the end portion of the conductor is hollow. The step of protruding from the part,
A method of manufacturing an electronic component, comprising:

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