CN114286620B - Binding device and binding method for binding display module - Google Patents
Binding device and binding method for binding display module Download PDFInfo
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- CN114286620B CN114286620B CN202111632634.5A CN202111632634A CN114286620B CN 114286620 B CN114286620 B CN 114286620B CN 202111632634 A CN202111632634 A CN 202111632634A CN 114286620 B CN114286620 B CN 114286620B
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 98
- 238000010438 heat treatment Methods 0.000 claims abstract description 72
- 238000007731 hot pressing Methods 0.000 claims abstract description 69
- 238000003825 pressing Methods 0.000 claims abstract description 30
- 238000009434 installation Methods 0.000 claims abstract description 7
- 230000008569 process Effects 0.000 claims description 21
- 238000001704 evaporation Methods 0.000 claims description 19
- 230000008020 evaporation Effects 0.000 claims description 19
- 239000012788 optical film Substances 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims description 17
- 238000009833 condensation Methods 0.000 claims description 16
- 230000005494 condensation Effects 0.000 claims description 16
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- 238000009413 insulation Methods 0.000 claims description 7
- 239000012212 insulator Substances 0.000 claims description 3
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- 238000002360 preparation method Methods 0.000 abstract description 7
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- 238000006731 degradation reaction Methods 0.000 description 3
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- 238000010521 absorption reaction Methods 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
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Abstract
The embodiment of the application provides a binding device and binding method for binding a display module, the display module includes an installation component and a display panel, the binding device is used for binding a first subsection of the installation component to a binding area of the display panel in a hot-pressing manner, and the binding device includes: a carrier member; the heating component is arranged on one side of the bearing component and can be movably arranged along the pressing direction, and the heating component is provided with a heating surface for heating the first subsection; the heat dissipation part, one or more heat dissipation parts and the heating part are arranged on the same side of the bearing part, and the heat dissipation part is provided with a heat dissipation surface used for being in contact with the non-hot-pressing area of the display module, so that the heat dissipation part can absorb heat of the non-hot-pressing area of the display module through the heat dissipation surface. The binding device is used for improving the quality of the display module formed after hot pressing binding and improving the preparation yield of the display module by arranging the heat radiating component to absorb the heat of the non-hot-pressing area of the display module.
Description
Technical Field
The invention relates to the technical field of binding, in particular to a binding device and a binding method for binding a display module.
Background
The first part of the mounting component is generally thermally pressed and bound to the display panel by a thermal pressing and binding method to form the display module. In the hot pressing binding process, part of heat output by the heating component can cause the heating deterioration of the parts in the non-hot pressing area of the display module, influence the quality of the display module, and reduce the preparation yield of the display module.
Therefore, a new binding device and binding method are needed.
Disclosure of Invention
An aspect of the present application provides a binding device for binding a display module, the display module includes a mounting component and a display panel, the binding device is used for binding a first subsection hot-pressing of the mounting component to a binding area of the display panel, including:
a carrier member;
the heating component is arranged on one side of the bearing component and can be movably arranged along the pressing direction, and the heating component is provided with a heating surface for heating the first subsection;
the heat dissipation part, one or more heat dissipation parts and the heating part are arranged on the same side of the bearing part, and the heat dissipation part is provided with a heat dissipation surface used for being in contact with the non-hot-pressing area of the display module, so that the heat dissipation part can absorb heat of the non-hot-pressing area of the display module through the heat dissipation surface.
According to the binding device provided by the embodiment of the application, on the one hand, the heat of the non-hot-pressing area of the display module is absorbed through the heat dissipation part, so that the thermal degradation of the material performance, the structural stability and the like of parts in the non-hot-pressing area of the display module is avoided, the quality of the display module formed after hot-pressing binding is improved, and the preparation yield of the display module is improved.
Further, the binding apparatus further includes:
the lifting mechanism is connected between the heat dissipation part and the bearing part, and the heat dissipation part is movably arranged along the pressing direction through the lifting mechanism;
preferably, the heat dissipation surface of the heat dissipation component is a plane or an elastic surface.
Further, the bearing component comprises a driving part and a pushing rod arranged on the driving part, one end of the pushing rod, which is away from the driving part, is connected with the heating component, and the heating component is movably arranged along the pressing direction relative to the driving part through the pushing rod;
the lifting mechanism comprises a cantilever and a reset piece, the cantilever is connected to the periphery of the pushing rod, the reset piece is connected to one end of the cantilever, which is away from the pushing rod, and the heat dissipation part is movably arranged along the pressing direction through the reset piece;
preferably, the return member is a spring.
Further, the cantilever is telescopically arranged along the radial direction of the pushing rod.
Further, a heat insulating piece is arranged between the heating component and the heat radiating component,
the heat insulation piece is used for blocking the heating part from transferring heat to the heat dissipation part and adjusting the distance between the heating part and the heat dissipation part.
Further, the heat radiating member is rotatably provided around the heating member.
Further, a plurality of heat radiating members are provided around the heating member peripheral side.
Further, the plurality of heat dissipation members includes a first heat dissipation member and a second heat dissipation member,
the radiating surface of the first radiating component is a plane;
the heat dissipation surface of the second heat dissipation part is an elastic surface.
Further, the heat dissipation part is a heat pipe heat exchange part, the heat dissipation part comprises an evaporation section, a condensation section and working fluid, the non-hot-pressing area is used for completing heat dissipation through the evaporation and condensation circulation process of the working fluid between the evaporation section and the condensation section, wherein,
the radiating surface belongs to the evaporation section, and in the pressfitting direction, evaporation section and condensation segment set up relatively.
Another aspect of the embodiments of the present application provides a binding method, including:
providing a display module pre-assembly comprising a mounting part and a display panel with binding areas, wherein the mounting part and the display panel are arranged in a stacked manner,
adopt the binding device that this application embodiment provided on the one hand to bind the first branch hot pressing of installation component in display panel's binding area formation display module assembly, in the pressfitting direction, the radiating surface of radiator unit is located the non-hot pressing district of display module assembly, and the radiating surface sets up towards the top surface contact of radiator unit with the display module assembly.
According to the binding method provided by the embodiment of the invention, the heat output by the heating component of the binding device in the binding process is prevented from deteriorating the parts in the non-hot-pressing area of the display module, the radiating surface of the radiating component is in contact with the top surface of the display module, which faces the radiating component, so that the contact area between the radiating component and the display module is increased, the heat transfer efficiency is improved, the heat dissipation of the non-hot-pressing area of the display module is accelerated, the binding quality of the display module is ensured in the binding process, and the quality of the display module is ensured.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings, in which like reference characters designate the same or similar features, and in which the figures are not to scale.
FIG. 1 is a schematic diagram of a process for preparing a display module by hot-press binding by a binding device according to an embodiment of an aspect of the present application;
FIG. 2 is a schematic diagram illustrating a process of hot-press binding a binding device to prepare a display module according to another embodiment of an aspect of the present application;
FIG. 3 is a flow chart of a binding method in an embodiment of another aspect of the present application.
In the figure:
a display module-1; a mounting part-11; a first subsection-111; a display panel-12; a display substrate-121; an optical film-122; binding area-B; non-autoclave area-F; a first non-autoclave section-F1; a second non-autoclave zone-F2; a heat insulation zone-f;
binding means-2; a carrier member-21; a driving section-211; pushing the lever-212;
a heating element-22; heating surface-221; a heat radiating member-23; a heat radiating surface-231;
lifting mechanism-3; cantilever-31; a reset member 32.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are merely configured to illustrate the invention and are not configured to limit the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by showing examples of the invention.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
The inventor has found in intensive studies that, in general, a first part of the mounting part is thermally pressed and bound to the display panel by a thermal pressing and binding method to form a display module. In some examples, the mounting component is a flexible circuit board. The display panel comprises a display substrate and an optical film arranged in an unbound region of the display panel. The optical film may be, for example, a polarizer. The display substrate comprises an array substrate, a light-emitting device layer and a packaging layer, wherein the array substrate, the light-emitting device layer and the packaging layer are arranged in a stacked mode, and the packaging layer covers the light-emitting side of the light-emitting device layer. An optical film is arranged on the light-emitting side of the display substrate to prevent light incident on the display panel from the outside from being reflected in the display panel, so that the display effect is affected. The existing ultra-narrow frame design requirement on the display module enables the width of binding terminals in the binding area of the display panel to be reduced, and the distance between the binding terminals and the edge of the optical film to be reduced. The reduced spacing between the binding terminals and the edge of the optical film allows the heat output by the heating element during the binding process to be more easily transferred to the mounting element (e.g., the edge of the optical film), accelerating the temperature rise of the side of the mounting element adjacent to the heating element. The common optical film comprises a polymer material, the sensitivity of the polymer material to temperature is high, and the small spacing design between the binding terminal and the edge of the optical film enables the optical film to be easily deformed and damaged like cracking, curling, melting and the like when being heated, so that the quality of the optical film is affected, and the quality of the display module is further affected.
And a plurality of connecting wires and a plurality of electronic components which are arranged vertically and horizontally on the flexible circuit board are sensitive to temperature and are intolerant to high temperature. The heat output by the heat dissipation component during the thermal compression bonding process can also adversely affect the performance of the electrical components and the connection lines on the flexible circuit board.
The present application has been made in view of the findings and analyses of the above-described problems.
As shown in fig. 1, the first aspect of the present application provides a binding device 2 for binding a display module 1, the display module 1 includes a mounting component 11 and a display panel 12, the binding device 2 is used for thermocompression bonding a first subsection 111 of the mounting component 11 to a binding area B of the display panel 12, and the binding device 2 includes: a carrier 21; a heating member 22 disposed at one side of the carrier member 21, the heating member 22 being movably disposed along the pressing direction, the heating member 22 having a heating surface 221 for heating the first section 111; the heat dissipation part 23, one or more of the heat dissipation part 23 and the heating part 22 are disposed at the same side of the carrier part 21, and the heat dissipation part 23 has a heat dissipation surface 231 for contacting the non-heat-pressing area F of the display module 1, so that the heat dissipation part 23 can absorb heat of the non-heat-pressing area F of the display module 1 through the heat dissipation surface 231.
According to the binding device 2 provided by the embodiment of the application, on the one hand, the heat dissipation part 23 is arranged to absorb the heat of the non-hot-pressing area F of the display module 1, so that the thermal degradation of the material performance, the structural stability and the like of the parts in the non-hot-pressing area F of the display module 1 is avoided, the quality of the display module 1 formed after hot-pressing binding is improved, and the preparation yield of the display module 1 is improved.
In some alternative embodiments, the binding device 2 further comprises a binding platform for placing the mounting component 11 to be bound and the display panel 12. In some examples, the first subsection 111 of the mounting component 11 is stacked on the bonding region B of the display panel 12 prior to thermocompression bonding. In the process of hot press bonding, the heating part 22 in the bonding device 2 applies pressure and outputs heat to the first subsection 111 and the bonding area B of the display panel 12, so that the first subsection 111 of the mounting part 11 is hot press bonded to the bonding area B of the display panel 12.
In some examples, the non-heat-pressing area F of the display module 1 includes a first non-heat-pressing area F1 located at the mounting part 11 and a second non-heat-pressing area F2 located at the display panel 12. The first non-thermal pad F1 includes a plurality of electronic components and circuit connection lines. The second non-hot-pressing area F2 of the display module 1 corresponds to the display area of the display panel 12, and the second non-hot-pressing area F2 includes an optical film 122, such as a polarizer, disposed on the display side of the display substrate 121. A heat insulation area f is arranged between the second non-hot pressing and the binding area B. The provision of the heat-shielding region F further prevents heat output from the heating member 22 from damaging the performance of the display device and the optical film 122 (e.g., the polarizer described above) in the second non-thermal compression region F2. According to the binding device 2, the heat radiating part 23 is more and the absorption heating part 22 is transmitted to the second non-hot-pressing area F2 to heat, so that the setting width of the heat insulation area F is further reduced, the frame of the display module 1 is further narrowed, and the setting requirement on the narrow frame of the display module 1 is met.
In some alternative embodiments, the binding device 2 further comprises a lifting mechanism 3. The lifting mechanism 3 is connected between the heat dissipation part 23 and the bearing part 21, and the heat dissipation part 23 is movably arranged along the pressing direction through the lifting mechanism 3.
In these embodiments, the heat dissipation part 23 is movably disposed along the pressing direction by a lifting mechanism 3 connected between the heat dissipation part 23 and the carrying part 21, and the lifting mechanism 3 is used for adjusting the interaction force between the heating part 22 and the non-heat pressing area F of the display module 1 during the pressing of the first subsection 111 of the mounting part 11 and the binding area B of the display panel 12 by the heating part 22. The lifting mechanism 3 makes the heat radiating surface 231 of the heat radiating component 23 contact with the non-hot-pressing area F of the display module 1, so that the heat radiating component 23 can absorb heat of the non-hot-pressing area F of the display module 1 through the heat radiating surface 231, and meanwhile, excessive pressure applied by the heat radiating component 23 to the non-hot-pressing area F of the display module 1 is avoided, so that display devices and optical films 122 arranged in the non-hot-pressing area F of the display module 1 are protected, and the preparation yield and quality of the display module 1 are improved.
In some alternative embodiments, the carrier 21 includes a driving portion 211 and a pushing rod 212 disposed on the driving portion 211, where an end of the pushing rod 212 facing away from the driving portion 211 is connected to the heating member 22, and the heating member 22 is movably disposed in the pressing direction relative to the driving portion 211 by the pushing rod 212. The lifting mechanism 3 includes a cantilever 31 and a restoring member 32, the cantilever 31 is connected to the circumferential side of the pushing rod 212, the restoring member is connected to one end of the cantilever 31 facing away from the pushing rod 212, and the heat dissipating member 23 is movably disposed in the pressing direction through the restoring member 32.
In some examples, the driving part 211 includes a cylinder connected to a motor, and a push rod 212 of the driving part 211 is provided at a power output end of the driving part 211 for implementing the driving of the heating part 22 to press the mounting part 11 stacked on the bonding area B of the display panel 12.
In some examples, the return 32 is a spring. In these examples, during the thermocompression bonding, the air cylinder pushes the heating member 22 connected to the end of the push rod 212 facing away from the driving portion 211 downward. The cantilever 31 is connected to the circumferential side of the push rod 212, and thus the cantilever 31 also moves toward the display module 1 along with the push rod 212. In the process that the cantilever 31 moves towards the display module 1, the spring serving as the reset piece 32 is contracted and deformed due to the fact that the cantilever 31 is pressed down, so that the effect of buffering and absorbing the pressure of the cantilever 31 towards the display module 1 is achieved, the fact that the heat dissipation part 23 completely transfers the pressure applied by the cantilever 31 to the non-hot-pressing area F of the display module 1 is avoided, the fact that parts arranged in the non-hot-pressing area F of the display module 1 are free from the effect of external pressure is guaranteed, and the quality of the display module 1 obtained through preparation is guaranteed. In some alternative embodiments, the cantilever 31 is telescopically arranged along the radial direction of the push rod 212.
In these embodiments, the cantilever 31 is telescopically arranged along the radial direction of the pressing rod 212, and can be used to adjust the spacing between the heating member 22 and the heat dissipating member 23. In the hot pressing process, the distance between the heating part 22 and the heat dissipation part 23 is adjusted according to the display modules 1 with different sizes and the display modules 1 with different requirements on the width setting of the heat insulation area f, so that the production efficiency is improved, and the production equipment is saved.
In some alternative embodiments, as shown in fig. 2, a thermal insulator is disposed between the heating element 22 and the heat dissipating element 23, the thermal insulator being used to block the heat transfer from the heating element 22 to the heat dissipating element 23 and also to adjust the spacing between the heating element 22 and the heat dissipating element 23.
In some examples of these embodiments, the heat shield is made of a material with a low thermal conductivity, and the heat shield is configured to insulate the heating element 22 and the heat dissipating element 23, so as to prevent the heating element 22 from transferring heat to the heat dissipating element 23 due to too close distance from the heat dissipating element 23, and reduce the heat dissipating effect of the heat dissipating element 23. The arrangement of the heat insulating member further prevents the heat output from the heating part 22 from adversely affecting the parts arranged in the non-thermal compression region of the display module 1. In the hot pressing process, the distance between the heating part 22 and the heat dissipation part 23 is adjusted according to the display modules 1 with different sizes and the display modules 1 with different requirements for the width setting of the heat insulation area f, so that the preparation efficiency and quality of the display modules 1 are further improved.
In some examples of these embodiments, the thermal shield includes cooperating rails and sliding members, and the spacing between the heating member 22 and the heat dissipating member 23 is adjusted by movement of the sliding members on the rails.
In other examples of these embodiments, the thermal shield comprises an insulated inflatable bladder, and the spacing between the heating element 22 and the heat dissipating element 23 is adjusted by adjusting the amount of inflation in the insulated impact bladder. In these examples, the distance between the heating component 22 and the heat dissipation component 23 can be adjusted more precisely by adjusting the inflation amount, so that the accuracy of the frame size of the display module 1 is further ensured, the non-hot-pressing area F of the display module 1 is not affected by the heat output by the heating component 22, and the hot-pressing binding assembly quality of the display module 1 is improved.
As shown in fig. 1-2, in some alternative embodiments, the heat sink member 23 is rotatably disposed about the heating member 22. In some examples, the cantilever 31 is rotatably coupled to the push rod 212 such that the heat sink member 23 is rotatably disposed about the heating member 22.
In these embodiments, the non-thermal compression area of the display module 1 includes a first non-thermal compression area F1 located at the mounting part 11 and a second non-thermal compression area F2 located at the display panel 12. The heat dissipation part 23 is rotatably arranged around the heating part 22, so that the heat dissipation part 23 can selectively dissipate heat of the first non-hot-pressing area F1 or the second non-hot-pressing area F2 according to actual production needs in the hot-pressing binding process, and can also dissipate heat of the first non-hot-pressing area F1 and the second non-hot-pressing area F2 according to a preset sequence.
In some alternative embodiments, a plurality of heat dissipating members 23 are disposed circumferentially around the heating member 22.
In these embodiments, the non-thermal compression area of the display module 1 includes a first non-thermal compression area F1 located at the mounting part 11 and a second non-thermal compression area F2 located at the display panel 12. The plurality of heat dissipation components 23 can simultaneously conduct heat dissipation protection on different non-hot-pressing areas F in the display module 1, so that the quality of the prepared display module 1 is further improved, and components located in the different non-hot-pressing areas F are prevented from being damaged by overheating.
In some alternative embodiments, the plurality of heat dissipating members 23 includes a first heat dissipating member 23 and a second heat dissipating member 23, the heat dissipating surface 231 of the first heat dissipating member 23 being planar; the heat radiation surface 231 of the second heat radiation member 23 is an elastic surface.
In these embodiments, different heat dissipation members 23 have different heat dissipation surfaces 231 to meet the heat dissipation requirements of different non-heat-pressing areas F in the display module 1. In some examples, the first heat dissipation part 23 is correspondingly disposed in the second non-hot pressing area F2 to absorb heat of the second non-hot pressing area F2. The second non-hot pressing area F2 includes the optical film 122 contacting the first heat dissipation member 23, and the heat dissipation surface 231 of the second heat dissipation member 23 is configured to be planar, so as to facilitate increasing the contact area between the heat dissipation surface 231 of the second heat dissipation member 23 and the optical film 122, and further facilitate protecting the optical film 122 from thermal degradation. The second heat dissipation component 23 is correspondingly disposed in the first non-hot pressing area F1 to absorb heat of the first non-hot pressing area F1. The first non-hot-pressing area F1 includes a plurality of electronic components, so the surface of the first non-hot-pressing area F1 of the display module 1 facing the binding device 2 is uneven, the heat dissipation surface 231 of the second heat dissipation component 23 is set to be an elastic surface, so that on one hand, the contact area between the electronic components in the first non-hot-pressing area F1 and the second heat dissipation component 23 is sufficient, the heat dissipation efficiency is improved, on the other hand, the heat dissipation surface 231 of the second heat dissipation component 23 is attached to the outside of the electronic components, the second heat dissipation component 23 is prevented from rubbing the outside of the electronic components, and the quality of the prepared display module 1 is further improved.
In some alternative embodiments, the heat dissipation component 23 is a heat pipe heat exchange component, where the heat dissipation component 23 includes an evaporation section, a condensation section, and a working fluid, and the non-hot pressing area F performs heat dissipation through an evaporation and condensation cycle process of the working fluid between the evaporation section and the condensation section, and the heat dissipation surface 231 belongs to the evaporation section, and the evaporation section is disposed opposite to the condensation section in the pressing direction.
In these alternative embodiments, the heat sink member 23 includes a die storing a working fluid. In the hot press binding process, the heat dissipating surface 231 (belonging to the evaporation section) of the heat dissipating component 23 contacts with the non-hot press area F of the display module 1, and the liquid working fluid in the core of the heat dissipating component 23 is heated to evaporate the working fluid in the vapor state, and takes away heat, which is the latent heat of evaporation of the liquid working fluid. The working fluid in the vapor state flows from the vapor channel of the heat dissipation part 23 to the condensation section of the heat dissipation part 23 in the pressing direction, and the working fluid in the vapor state is condensed into liquid in the condensation section to become the working fluid in the liquid state, and simultaneously, latent heat is released, thereby completing an evaporation and condensation cycle process. An evaporative condensing cycle transfers a substantial amount of heat from the evaporator end to the condenser end. When the tube core in the heat exchange part of the heat pipe is vertically placed, and the working fluid in the vapor state condenses into the working fluid in the liquid state in the condensation section, the working fluid in the liquid state flows back to the evaporation section by the action of self gravity.
In some alternative embodiments, the compression joint area of the heat dissipation part 23 and the display module 1 is located at a side area of the display module 1 near the heating part 23.
In some alternative embodiments, the working fluid in the liquid state is some low boiling point cooling liquid.
As shown in fig. 3, another aspect of the embodiments of the present application provides a binding method, including:
s10, a display module pre-assembly is provided, which includes a mounting member 11 and a display panel 12 having a binding area B, which are stacked.
S20, the binding device 2 provided in one aspect of the present application is used to bind the first portion 111 of the mounting component 11 to the binding area B of the display panel 12 to form the display module 1 in a hot pressing manner, in the pressing direction, the heat dissipation surface 231 of the heat dissipation component 23 is located in the non-hot pressing area F of the display module 1, and the heat dissipation surface 231 is in contact with the top surface of the display module 1 facing the heat dissipation component 23.
According to the binding method provided by the embodiment of the invention, the heat output by the heating component 22 of the binding device 2 in the binding process is prevented from deteriorating the parts in the non-hot-pressing area F of the display module 1, the heat radiating surface 231 of the heat radiating component 23 is in contact with the top surface of the display module 1 facing the heat radiating component 23, the contact area of the heat radiating component 23 and the display module 1 is increased, so that the heat transfer efficiency is improved, the heat radiation of the non-hot-pressing area F of the display module 1 is accelerated, and the binding quality of the display module 1 and the quality of the display module 1 are ensured in the binding process.
In some examples, in order to further avoid the heat output by the heating component 22 from deteriorating the edge of the optical film 122 in the second non-hot-pressing area F2 of the display module 1 due to heating, such as curling and yellowing, the heat dissipation component 23 is disposed at the edge of the second non-hot-pressing area F2 near the heating component 22, so as to better protect the optical film 122.
These embodiments are not exhaustive or to limit the invention to the precise embodiments disclosed, and according to the invention described above. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (9)
1. The utility model provides a bind device for display module assembly binds, the display module assembly includes installation component and display panel, bind device be used for with installation component's first subsection hot pressing bind in display panel's binding area, display module assembly's non-hot pressing district is including the first non-hot pressing district that is located installation component and the second non-hot pressing district that is located display panel, and first non-hot pressing district includes electronic components, and the second non-hot pressing district includes the optical film piece, a serial communication port, bind device includes:
a carrier member;
the heating component is arranged on one side of the bearing component and is movably arranged along the pressing direction, and the heating component is provided with a heating surface for heating the first subsection;
the heat dissipation part is arranged on the same side of the bearing part, and is provided with a heat dissipation surface used for being in contact with a non-hot-pressing area of the display module, so that the heat dissipation part can absorb heat of the non-hot-pressing area of the display module through the heat dissipation surface;
a plurality of the heat radiating members are disposed around the heating member;
the heat dissipation parts comprise a first heat dissipation part and a second heat dissipation part, the first heat dissipation part is arranged in the second non-hot-pressing area, the second heat dissipation part is arranged in the first non-hot-pressing area, the heat dissipation surface of the first heat dissipation part is a plane, and the heat dissipation surface of the second heat dissipation part is an elastic surface.
2. The binding apparatus of claim 1, wherein the binding apparatus further comprises:
the lifting mechanism is connected between the heat dissipation part and the bearing part, and the heat dissipation part is movably arranged along the pressing direction through the lifting mechanism.
3. The binding apparatus of claim 2, wherein the binding apparatus further comprises a binding member,
the bearing component comprises a driving part and a pushing rod arranged on the driving part, one end of the pushing rod, which is away from the driving part, is connected with the heating component, and the heating component is movably arranged along the pressing direction relative to the protected driving part through the pushing rod;
the lifting mechanism comprises a cantilever and a reset piece, the cantilever is connected to the periphery of the push rod, the reset piece is connected to one end of the cantilever, which is away from the push rod, and the heat dissipation part is movably arranged along the pressing direction through the reset piece.
4. A binding apparatus according to claim 3, wherein the return member is a spring.
5. A binding apparatus according to claim 3, wherein the cantilever arm is telescopically arranged in the radial direction of the push rod.
6. The binding apparatus of claim 3 or 5, wherein a heat insulator is provided between the heating member and the heat dissipating member,
the heat insulation piece is used for blocking the heating part from transferring heat to the heat dissipation part and adjusting the distance between the heating part and the heat dissipation part.
7. The binding apparatus of claim 1, wherein the heat sink member is rotatably disposed about the heating member.
8. The binding apparatus of any of claims 1 to 7, wherein the heat dissipating member is a heat pipe heat exchanging member including an evaporation section, a condensation section, and a working fluid, the non-thermocompression region performing heat dissipation by an evaporation and condensation cycle process of the working fluid between the evaporation section and the condensation section, wherein,
the heat dissipation surface belongs to the evaporation section, and in the pressing direction, the evaporation section and the condensation section are oppositely arranged.
9. A method of binding, comprising:
providing a display module pre-assembly comprising a mounting part and a display panel with binding areas, wherein the mounting part and the display panel are arranged in a stacked manner,
the binding device according to any one of claims 1 to 8 is used for binding the first subsection of the installation component to the binding area of the display panel to form a display module, and in the pressing direction, the radiating surface of the first radiating component is located in a second non-hot-pressing area of the display module, the radiating surface of the second radiating component is located in the first non-hot-pressing area of the display module, and the radiating surface and the display module are arranged in contact with the top surface of the radiating component.
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| CN114286620A (en) | 2022-04-05 |
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