CN114286531B - Masking device and coating jig - Google Patents
Masking device and coating jig Download PDFInfo
- Publication number
- CN114286531B CN114286531B CN202011042015.6A CN202011042015A CN114286531B CN 114286531 B CN114286531 B CN 114286531B CN 202011042015 A CN202011042015 A CN 202011042015A CN 114286531 B CN114286531 B CN 114286531B
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- shielding
- circuit board
- cross
- frame
- supporting
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- 238000000576 coating method Methods 0.000 title claims abstract description 31
- 239000011248 coating agent Substances 0.000 title claims abstract description 21
- 230000000873 masking effect Effects 0.000 title description 4
- 239000011800 void material Substances 0.000 claims description 8
- 238000012216 screening Methods 0.000 claims 3
- 239000003292 glue Substances 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 10
- 239000003973 paint Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
Abstract
The application discloses a shielding device and a coating jig, wherein the shielding device is used for shielding a preset area of a circuit board and comprises a frame; the shielding parts are arranged corresponding to the preset areas; the connecting wire is used for connecting the frame and the shielding part into a whole; the supporting part is arranged on one side of the shielding part and is used for suspending the frame, the shielding part and the connecting wire above the circuit board. The shielding device disclosed by the application can be used for shielding the area to be shielded when the circuit board is coated, the material cost caused by using gummed paper/shielding glue can be effectively reduced, the labor hour is saved, and the cost of a coating process is greatly reduced.
Description
Technical Field
The application relates to the technical field of paint spraying, in particular to a shielding device and a coating jig.
Background
In the use process of the circuit board, the circuit board may be in different environments, such as chemical substances (fuel, coolant, etc.), vibration, high dust, salt mist, humidity, high temperature, etc., so that the circuit board may have problems of corrosion, softening, deformation, mildew, etc., and the circuit of the circuit board may fail. The three-proofing paint is a paint with a special formula, and is coated on the surface of a circuit board, so that a layer of three-proofing protective film (the three-proofing is dampproof, salt fog-releasing and mildew-proof) can be formed, and the protective film can protect a circuit from damage under the environments of chemistry, vibration, high dust, salt fog, humidity, high temperature and the like, so that the reliability of the circuit board is improved, and the safety coefficient of the circuit board is increased.
In the process of paint spraying and coating various circuit board products, some parts of some circuit boards which cannot be painted are required to be shielded, so that the three-proofing paint is prevented from being coated on parts which do not need to be coated, for example, the use effect of a radiator is reduced when the three-proofing paint is coated on the radiator of the circuit board. The areas of the circuit board that do not require coating may include: radiator, tube seat, potentiometer, safety, button, nixie tube, high-power resistor, lock body and connector.
In the prior art, the parts which do not need to be coated are generally shielded by using gummed paper/shielding glue and the like, and the areas need to be cleaned again after the coating is finished, so that the material cost of the gummed paper/shielding glue is increased. A lot of manpower is wasted, so that the cost of the coating process cannot be reduced.
Disclosure of Invention
The application provides a shielding device and a coating jig, which are used for solving the problems of higher cost and labor waste of a coating process in the prior art.
In order to solve the technical problems, the application provides a shielding device, which comprises a frame; the shielding parts are arranged corresponding to the preset areas; the connecting wire is used for connecting the frame and the shielding part into a whole; the supporting part is arranged on one side of the shielding part and is used for suspending the frame, the shielding part and the connecting wire above the circuit board.
Optionally, the supporting part comprises a plurality of supporting subunits, the supporting subunits are of columnar structures, one end of each supporting subunit is connected with the shielding part, and the supporting subunits correspond to the shielding parts one by one.
Optionally, the support subunit is a hollow structure, and a cross-sectional dimension of the support subunit is smaller than a cross-sectional dimension of the shielding portion.
Optionally, the other end of the support subunit is provided with a void portion, and a cross-sectional dimension of the void portion is smaller than a cross-sectional dimension of the support subunit.
Optionally, the geometric center of the preset area in the circuit board, the geometric center of the cross section of the shielding portion, the geometric center of the cross section of the support subunit, and the geometric center of the cross section of the void portion overlap.
Optionally, the height of the clearance part is 1.5 mm-2 mm; the cross section size of the clearance part is 1-2 mm larger than the size of a preset area in the circuit board.
Optionally, the cross-sectional dimension of the clearance portion is less than 2-4 mm of the cross-sectional dimension of the support subunit; the height of the support subunit is greater than 6mm.
Optionally, the connecting line is used for connecting the two shielding parts or connecting the shielding parts and the frame; the width of the connecting line is smaller than the cross-sectional dimension of the shielding portion.
Alternatively, the width of the connecting line is 1-4 mm, and the thickness of the connecting line is 1-4 mm.
In order to solve the above technical problems, the present application provides a coating fixture for a circuit board, which includes a shielding device of any one of the above.
The application discloses a shielding device, wherein the shielding device is used for shielding a preset area of a circuit board and comprises a frame; the shielding parts are arranged corresponding to the preset areas; the connecting wire is used for connecting the frame and the shielding part into a whole; the supporting part is arranged on one side of the shielding part and is used for suspending the frame, the shielding part and the connecting wire above the circuit board. The shielding device disclosed by the application can be used for shielding the area to be shielded when the circuit board is coated, the material cost caused by using gummed paper/shielding glue can be effectively reduced, the labor hour is saved, and the cost of a coating process is greatly reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic top view of an embodiment of a shielding device of the present application;
FIG. 2 is a schematic front view of an embodiment of a portion of the structure of the shielding device of the present application;
FIG. 3 is a schematic side view of an embodiment of a portion of the structure of the shielding device of the present application;
fig. 4 is a schematic structural view of an embodiment of the coating fixture of the present application.
Detailed Description
In order to make the technical scheme of the present application better understood by those skilled in the art, the shielding device and the coating jig provided by the present application are described in further detail below with reference to the accompanying drawings and the detailed description.
In the conventional design of shielding scheme, the area to be shielded is generally shielded by using gummed paper/shielding glue, etc., a large amount of gummed paper with different sizes is stuck on the whole board area of the circuit board or the shielding glue is sprayed on the whole board area, and the gummed paper/shielding glue is removed after the coating and solidification. There are two problems with the conventional approach: firstly, a great deal of manpower and material resources are wasted; secondly, the edge of the three-proofing paint is easy to drop in the process of removing the gummed paper/masking tape.
The application provides a shielding device, which can effectively reduce the material cost caused by using gummed paper/shielding glue on the basis of not influencing the coating effect, avoid man-hour caused by additional operation and greatly reduce the coating process cost.
Referring to fig. 1-3, fig. 1 is a schematic top view of an embodiment of a shielding device according to the present application, fig. 2 is a schematic front view of an embodiment of a shielding device according to the present application, and fig. 3 is a schematic side view of an embodiment of a shielding device according to the present application. In this embodiment, the shielding device 100 may include a frame 110, a plurality of shielding portions 120, a connecting line 130, and a supporting portion (not labeled in the figure).
The shielding device 100 may be used to shield a predetermined area of a circuit board, which is an area where three-proofing paint coating is not required, and one skilled in the art may set the circuit board according to product requirements. For example, the preset area may be an area in the circuit board where screw holes, electrostatic rails, sockets, pins, jumper caps, connection terminals, battery holders, fuse holders, dial switches, light emitting diodes, cement resistor high-power heat dissipation devices, and the like are provided.
The circuit board may be a printed circuit board (Printed Circuit Board, PCB). The circuit board can be a single-sided circuit board or a double-sided circuit board. When the circuit board is a single-sided circuit board, the preset area is arranged on one side of the circuit board; when the circuit board is a double-sided circuit board, the preset areas are arranged on two sides of the circuit board.
The frame 110 may be provided corresponding to the size of the circuit board. The inside of the frame 110 may be provided with a plurality of shielding parts 120. The plurality of shielding portions 120 may be used to be disposed corresponding to a predetermined area for shielding electronic components on the circuit board that do not need to be coated.
The connection line 130 may be used to connect the frame 110 and the shielding part 120 integrally, i.e., the connection line 130 may be disposed between the frame 110 and the shielding part 120, or may be disposed between the shielding part 120 and the shielding part 120. The supporting portion may be disposed at one side of the shielding portion, and is used for suspending the frame 110, the shielding portion 120 and the connection line 130 above the circuit board. Alternatively, the frame 110, the shielding part 120, and the connection line 130 may be positioned at the same horizontal position.
In some embodiments, when the distance between the shielding part 120 and the bezel 110 is sufficiently close, the two may be directly connected without the connection through the connection line 130.
The connection line 130 may be used to connect the two shielding parts 120, or to connect the shielding parts 120 with the frame 110, and the width of the connection line 130 may be smaller than the cross-sectional size of the shielding parts 120. Also, the connection line 130 should be made as thin and narrow as possible while maintaining strength. The connection line 130 may integrate the shielding device 100, and since the connection line 130 is suspended above the circuit board, the atomized tri-proof paint may well cover the shielding shadow caused by the connection line 130 during a normal coating process.
The materials of the frame 110, the shielding part 120, the connection line 130, and the supporting part may be the same, the material of the shielding device 100 does not react with the three-proofing paint, and excellent performance may be maintained during the coating process, for example, the material of the shielding device 100 may be a metal alloy, such as an aluminum alloy, a magnesium alloy, or the like. Preferably, the aluminum alloy may be aviation aluminum.
The shielding device 100 is in a hollow structure, and the hollow area is an area needing coating treatment, so that components of the exposed circuit board can be rapidly coated, and the shielded components are shielded and are not coated. The size of the shielding device 100 may be the same as the size of the circuit board, and the size of the shielding device 100 may be larger than the size of the circuit board.
The embodiment discloses a shielding device, wherein the shielding device is used for shielding a preset area of a circuit board and comprises a frame; the shielding parts are arranged corresponding to the preset areas; the connecting wire is used for connecting the frame and the shielding part into a whole; the supporting part is arranged on one side of the shielding part and is used for suspending the frame, the shielding part and the connecting wire above the circuit board. The shielding device of the embodiment shields the area to be shielded when the circuit board is coated, and the frame and the shielding parts are suspended above the circuit board, and the whole shielding device is integrally arranged and is not contacted with the circuit board, so that the material cost caused by using gummed paper/shielding glue can be effectively reduced, the labor hour is saved, and the cost of a coating process is greatly reduced; the problem that the edge of the three-proofing paint is easy to drop in the process of removing the gummed paper/masking tape is prevented; and the shielding device can be adapted repeatedly, so that the production cost is reduced.
Further, the supporting portion may include a plurality of supporting subunits 140, the supporting subunits 140 may be a columnar structure, the height of the columnar structure is the suspension height of the shielding device 100, and the cross-sectional shape of the columnar structure may include, but is not limited to, square, rectangle, circle, polygon, etc. One end of the supporting subunit 140 may be connected to one side of the shielding part 120, and one ends of the plurality of supporting subunits 140 are respectively connected to the same side of the plurality of shielding parts 120. The number of the supporting sub-units 140 and the number of the shielding parts 120 may be one-to-one.
Alternatively, the support sub-unit 140 may be a hollow structure in order to save the weight of the shade device 100. The cross-sectional dimension of the support sub-unit 140 may be smaller than the cross-sectional dimension of the shielding part 120. The size of the cross section may refer to the area of the cross section, the diameter of the cross section, the length of the cross section on opposite sides, the perimeter of the cross section, or the like.
The other end of the support sub-unit 140 may be placed on a circuit board when shielding is achieved. The other end of the support subunit 140 may be provided with a void portion 141, wherein a cross-sectional dimension of the void portion 141 may be smaller than a cross-sectional dimension of the support subunit 140, and the cross-sectional dimension of the void portion 141 may be slightly greater than or equal to a dimension of a preset area of the circuit board.
The capillary effect may cause the three-proofing lacquer to permeate from the edge of the supporting subunit 140 to the preset position of the circuit board, so the arrangement of the void portion 141 in this embodiment can effectively avoid the capillary effect from causing the three-proofing lacquer to permeate to the preset region of the circuit board.
Alternatively, the geometric center of the preset area in the circuit board, the geometric center of the cross section of the shielding part 120, the geometric center of the cross section of the supporting subunit 140, and the geometric center of the cross section of the space avoiding part 141 may overlap, so that the shielding device 100 may remain stable when placed on the circuit board.
In order to achieve the best shielding effect, the height W3 of the clearance portion 141 may be 1.5mm to 2mm, and the cross-sectional dimension of the clearance portion 141 may be 1 to 2mm larger than the dimension of the preset area in the circuit board; the cross-sectional dimension of the space 141 may be smaller than the cross-sectional dimension of the support subunit 140 by 2 to 4mm, and the height W2 of the support subunit 140 may be greater than 6mm. The width of the connection line 130 may be 1 to 4mm. The thickness W1 of the connection line 130, the shielding portion 120, and the frame 110 may be the same, and the thickness W1 may be 1 to 4mm. Preferably, both the thickness W1 and the width of the connection line 130 may be 2mm.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of a coating fixture according to the present application. The coating jig 200 may be used for a coating process of a circuit board, and the coating jig 200 may include the shielding device 100 described above. The specific principles and structures have been described in the above embodiments and are not repeated here.
The application discloses a shielding device and a coating jig, wherein the shielding device is used for shielding a preset area of a circuit board and comprises a frame; the shielding parts are arranged corresponding to the preset areas; the connecting wire is used for connecting the frame and the shielding part into a whole; the supporting part is arranged on one side of the shielding part and is used for suspending the frame, the shielding part and the connecting wire above the circuit board. The shielding device disclosed by the application can be used for shielding the area to be shielded when the circuit board is coated, the material cost caused by using gummed paper/shielding glue can be effectively reduced, the labor hour is saved, and the cost of a coating process is greatly reduced.
It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application. Further, for convenience of description, only some, but not all, of the structures related to the present application are shown in the drawings. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms "first," "second," and the like in this disclosure are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.
Claims (7)
1. A shielding device for shielding a predetermined area of a circuit board, the shielding device comprising:
A frame;
a plurality of shielding parts which are arranged corresponding to the preset area;
The connecting wire is used for connecting the frame and the shielding part into a whole;
The supporting part is arranged on one side of the shielding part and is used for suspending the frame, the shielding part and the connecting wire above the circuit board, the supporting part comprises a plurality of supporting subunits, the supporting subunits are of columnar structures, one ends of the supporting subunits are connected with the shielding part and correspond to the shielding parts one by one, the supporting subunits are of hollow structures, the cross section size of the supporting subunits is smaller than that of the shielding part, the other ends of the supporting subunits are provided with clearance parts, and the cross section size of the clearance parts is smaller than that of the supporting subunits.
2. The shielding device according to claim 1, wherein a geometric center of a preset area in the circuit board, a geometric center of a cross section of the shielding portion, a geometric center of a cross section of the support subunit, and a geometric center of a cross section of the clearance portion overlap.
3. A screening arrangement according to claim 2, wherein the height of the clearance is 1.5 mm-2 mm; the cross section size of the clearance part is 1-2 mm larger than the size of a preset area in the circuit board.
4. A screening arrangement according to claim 2, wherein the cross-sectional dimension of the void is smaller than the support subunit cross-sectional dimension by 2-4 mm; the height of the support subunit is greater than 6mm.
5. The shielding device according to claim 1, wherein the connecting wire is used for connecting two of the shielding parts or for connecting the shielding parts with the frame; the connecting line has a width smaller than a cross-sectional dimension of the shielding portion.
6. A screening arrangement according to claim 5, characterized in that the width of the connection line is 1-4 mm and the thickness of the connection line is 1-4 mm.
7. A coating jig for a circuit board, characterized in that the coating jig comprises a shielding device according to any one of the preceding claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011042015.6A CN114286531B (en) | 2020-09-28 | 2020-09-28 | Masking device and coating jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011042015.6A CN114286531B (en) | 2020-09-28 | 2020-09-28 | Masking device and coating jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114286531A CN114286531A (en) | 2022-04-05 |
| CN114286531B true CN114286531B (en) | 2024-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011042015.6A Active CN114286531B (en) | 2020-09-28 | 2020-09-28 | Masking device and coating jig |
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| Country | Link |
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| CN (1) | CN114286531B (en) |
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| CN208300143U (en) * | 2018-06-12 | 2018-12-28 | 株洲麦格米特电气有限责任公司 | A kind of wiring board coating jig |
| CN209452100U (en) * | 2018-12-05 | 2019-10-01 | 苏州易启康电子科技有限公司 | Three-proofing coating coats jig |
| CN210112407U (en) * | 2018-12-06 | 2020-02-21 | 大陆泰密克汽车系统（上海）有限公司 | Printed circuit board assembly coating equipment |
| CN209577114U (en) * | 2018-12-25 | 2019-11-05 | 郑州市装联电子有限公司 | A kind of spray painting auxiliary mould of processing circuit board |
| CN209577116U (en) * | 2018-12-27 | 2019-11-05 | 郑州市装联电子有限公司 | A kind of circuit board spray painting mold |
| CN209676628U (en) * | 2018-12-27 | 2019-11-22 | 郑州市装联电子有限公司 | A kind of radical occlusion device for circuit board spray painting |
| CN209646796U (en) * | 2019-01-02 | 2019-11-19 | 杭州吉众机电股份有限公司 | A kind of jig for masking of dusting |
| CN209631456U (en) * | 2019-02-15 | 2019-11-15 | 众鼎瑞展电子科技(深圳)有限公司 | Key spray finishing jig and key spraying equipment |
| CN211099696U (en) * | 2019-06-05 | 2020-07-28 | 长沙景嘉微电子股份有限公司 | PCBA three proofings protection frock structure |
| CN210736940U (en) * | 2019-09-02 | 2020-06-12 | 深南电路股份有限公司 | Electroplating device and electroplating system |
| CN211184464U (en) * | 2019-12-03 | 2020-08-04 | 惠亚电子科技（深圳）有限公司 | A tool mechanism for three proofings lacquer coating |
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