CN114283683A - Cover plate assembly, cover plate assembly preparation method and display device - Google Patents
Cover plate assembly, cover plate assembly preparation method and display device Download PDFInfo
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- CN114283683A CN114283683A CN202111569231.0A CN202111569231A CN114283683A CN 114283683 A CN114283683 A CN 114283683A CN 202111569231 A CN202111569231 A CN 202111569231A CN 114283683 A CN114283683 A CN 114283683A
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- 239000003446 ligand Substances 0.000 claims description 26
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- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000084 colloidal system Substances 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
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Abstract
The invention discloses a cover plate assembly, a cover plate assembly preparation method and a display device, wherein the cover plate assembly is provided with a bending area and comprises: the surface of the cover plate body positioned in the bending area is provided with a slot; and the filling medium is filled in the slot and comprises a plurality of magnetic units with the same magnetism. Can reserve the deformation space for apron body bending deformation through the fluting, avoid stress concentration. The invention further arranges a filling medium in the slot, and the filling medium can absorb a part of bending stress through the deformation of the filling medium. However, the filling medium absorbs a part of bending stress through the deformation of the filling medium, and in order to further reduce the stress generated by bending, the filling medium in the embodiment of the invention comprises a plurality of magnetic units with the same magnetism, and the magnetic units with the same magnetism have repulsive force, so that the repulsive force between the magnetic units can reduce the risk of the cover plate body being broken due to the rapid concentration of the stress generated by bending.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a cover plate assembly, a cover plate assembly manufacturing method and a display device.
Background
At present, the flexible mobile phone cover plate is mainly made of a CPI (color polymer) material, but the abrasion resistance of the folding screen is easy to scratch, and the touch feeling and the crease phenomenon of surface plastic are to be improved. Ordinary glass is a brittle material, but when the thickness of the glass is less than or equal to 100 mu m, the glass has flexibility and can be bent and coiled, namely, the glass has flexibility and certain rigidity simultaneously. Currently, ultra-Thin glass UTG (ultra Thin glass) is expected to become the preferred cover plate of the novel folding mobile phone. However, when the screen is bent, the UTG cover plate still has the essential defect that the glass is fragile and broken due to the limitation of the physical properties of the material, and the risk of fragment splashing can be caused.
Therefore, a new cover assembly, a method for manufacturing the cover assembly, and a display device are needed.
Disclosure of Invention
The embodiment of the invention provides a cover plate assembly, a cover plate assembly manufacturing method and a display device. However, if only the slots are provided, the part of the cover plate body forming the slots can be subjected to larger bending stress when being bent, and in order to avoid the situation, the filling medium is further arranged in the slots, and the filling medium can absorb a part of the bending stress through the deformation of the filling medium. However, the filling medium absorbs a part of bending stress through the deformation of the filling medium, and in order to further reduce the stress generated by bending, the filling medium in the embodiment of the invention comprises a plurality of magnetic units with the same magnetism, and the magnetic units with the same magnetism have repulsive force, so that the repulsive force between the magnetic units can reduce the risk of the cover plate body being broken due to the rapid concentration of the stress generated by bending.
An aspect of an embodiment of the present invention provides a cover plate assembly having a bending region, the cover plate assembly including: the surface of the cover plate body positioned in the bending area is provided with a slot; and the filling medium is filled in the open slot and comprises a plurality of magnetic units with the same magnetism.
According to one aspect of the invention, the cover plate assembly has a planar area disposed adjacent to the bending area, and the depth of the slot in the direction along the thickness of the cover plate body is less than or equal to three fifths of the thickness of the cover plate body in the planar area.
According to an aspect of the present invention, the thickness of the cap body at the planar area is 90 μm to 110 μm in a direction along the thickness of the cap body; and/or the depth of the groove is 50-70 μm.
According to one aspect of the present invention, the magnetic units comprise magnetic particles and a plurality of metal molecular ligands uniformly distributed around the magnetic particles, and when the cover plate body is in a bent state, adjacent magnetic units are pressed to exchange the metal molecular ligands; the distance between the adjacent magnetic units is 20 nm-600 nm; the volume of the magnetic unit in the filling medium is greater than or equal to 25%.
According to one aspect of the present invention, the magnetic unit has a particle size of 50nm to 150 nm.
According to one aspect of the invention, the magnetic particles comprise magnetic iron oxide and the metal molecule ligands comprise iron ions.
According to an aspect of the present invention, the open cross-sectional area of the slot gradually increases in a direction along the thickness of the cap body.
In another aspect, an embodiment of the present invention provides a method for manufacturing a cover plate assembly, including the following steps: providing a cover plate body to be processed; forming a groove in the bending area of the cover plate body to be processed; and filling a filling medium in the slot, wherein the filling medium comprises a plurality of magnetic units with the same magnetism.
According to another aspect of the present invention, the filling medium includes a colloid, the magnetic units are uniformly dispersed in the colloid, and after the filling medium is filled in the slot, the method further includes: and curing the filling medium.
Another aspect of an embodiment of the present invention provides a display device, including: a cover plate assembly as described in any of the above embodiments; the display panel, the apron subassembly is located display panel's light-emitting side.
Compared with the prior art, the cover plate assembly provided by the embodiment of the invention comprises the cover plate body and the filling medium, wherein the filling medium is filled in the groove of the cover plate body in the bending area, and when the cover plate body is bent towards one side of the groove, the bending area is provided with the groove, so that a deformation space can be reserved for the bending deformation of the cover plate body through the groove, and the stress concentration is avoided. However, if only the slots are provided, the part of the cover plate body forming the slots can be subjected to larger bending stress when being bent, and in order to avoid the situation, the filling medium is further arranged in the slots, and the filling medium can absorb a part of the bending stress through the deformation of the filling medium. However, the filling medium absorbs a part of bending stress through the deformation of the filling medium, and in order to further reduce the stress generated by bending, the filling medium in the embodiment of the invention comprises a plurality of magnetic units with the same magnetism, and the magnetic units with the same magnetism have repulsive force, so that the repulsive force between the magnetic units can reduce the risk of the cover plate body being broken due to the rapid concentration of the stress generated by bending.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a cover plate assembly according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram illustrating a state of a magnetic unit before bending of a cover plate assembly according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram illustrating a state of a magnetic unit during bending of a cover plate assembly according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram illustrating a state of a magnetic unit after bending of a cover plate assembly according to an embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing a cover plate assembly according to an embodiment of the present invention.
In the drawings:
1-cover plate body; 2-a filling medium; 3-a magnetic unit; 31-magnetic particles; 32-a metal molecule ligand; k-slotting; PA-planar area; WA-bending zone.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. It should be noted that the embodiments provided in the embodiments of the present invention can be combined with each other without contradiction.
Embodiments of a cover plate assembly, a method for manufacturing the cover plate assembly, and a display device according to the embodiments of the present invention will be described below with reference to fig. 1 to 5 of the drawings.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a cover plate assembly according to an embodiment of the present invention. The cover plate assembly has a bending area WA, and includes: the cover plate comprises a cover plate body 1, wherein a groove K is formed in the surface of the cover plate body 1 positioned in a bending area WA; and the filling medium 2 is filled in the slot K, and the filling medium 2 comprises a plurality of magnetic units 3 with the same magnetism.
The cover plate assembly provided by the embodiment of the invention comprises a cover plate body 1 and a filling medium 2, wherein the filling medium 2 is filled in a groove K of the cover plate body 1 in a bending area WA, and when the cover plate body 1 is bent towards one side of the groove K (in a bending direction shown by an arrow in figure 1), as the groove K is arranged in the bending area WA, a deformation space can be reserved for the bending deformation of the cover plate body 1 through the groove K, so that the stress concentration is avoided. However, if only the slot K is provided, the portion of the cover plate body 1 forming the slot K may be subjected to a larger bending stress when being bent, and in order to avoid this, the filling medium 2 is further provided in the slot K, and the filling medium 2 can absorb a portion of the bending stress through its own deformation. However, the filling medium 2 absorbs a part of the bending stress through its own deformation, and in order to further reduce the stress generated by bending, the filling medium 2 of the embodiment of the present invention includes a plurality of magnetic units 3 with the same magnetism, and a repulsive force is provided between the magnetic units 3 with the same magnetism, and the repulsive force between the magnetic units 3 can reduce the risk of the cover plate body 1 being broken due to the rapid concentration of the stress generated by bending.
It should be noted that, the rete that apron body 1 adopted materials such as Glass that the luminousness is high promptly to make, play the effect of protection display screen, it is specific, apron body 1 can adopt the flexible material preparation, make the apron can fold, thereby can be applied to the flexibility, folding display module assembly, it is specific promptly, apron body 1 can adopt UTG (Ultra Thin Glass, Ultra-Thin flexible Glass), CPI (Colorless Polyimide, transparent Polyimide film), transparent such as PET (Polyethylene Terephthalate), soft, folding material preparation, in order to realize the flexible folding of apron, be convenient for be applied to in folding display device. The cover plate assembly provided by the embodiment of the invention is described by taking UTG (Ultra Thin Glass) as an example of the cover plate body 1.
The filling medium 2 may specifically be made of organic glue such as polyimide or OCA (optical Clear Adhesive), which has relatively soft texture and certain elasticity, and can effectively absorb a part of the bending stress, and meanwhile, since the glue such as polyimide has certain viscosity, the fixed magnetic unit 3 can be better accommodated, and certainly, the filling medium 2 may also be made of other materials, and is not particularly limited.
In order to avoid that the grooves K have a major influence on the overall structural strength of the cover body 1, in some alternative embodiments, the cover assembly has a planar area PA arranged adjacent to the bending area WA, and the depth of the grooves K in the direction along the thickness of the cover body 1 is less than or equal to three fifths of the thickness of the cover body 1 located in the planar area PA.
It can be understood that the thickness of the portion of the cover body 1 provided with the slot K becomes thinner, the thickness of the portion of the cover body 1 provided with the slot K is smaller than the thickness of the portion of the cover body 1 not provided with the slot K, the thickness of the portion of the cover body 1 provided with the slot K is too thin, which may affect the service life of the cover assembly, and the cover assembly is easy to bend and break under stress, so in the embodiment, the depth of the slot K is limited to be less than or equal to three fifths of the thickness of the cover body 1 of the plane area PA, so as to ensure that the portion of the cover body 1 provided with the slot K has a sufficient thickness. Optionally, in the direction along the thickness of the cover plate body 1, the thickness of the cover plate body 1 located in the planar area PA is 90 μm to 110 μm; and/or the depth of the groove K is 50-70 μm. Specifically, when the thickness of the cover body 1 of the planar area PA is 100 μm, the depth of the slot K is 60 μm, i.e., the thickness of the portion of the cover body 1 where the slot K is provided is 40 μm, and the thickness of the portion of the cover body 1 where the slot K is not provided is 100 μm. Optionally, the width of the slot K is less than or equal to 8 mm.
In order to further improve the stability of the cover plate assembly when bending, in some alternative embodiments, the magnetic units 3 include magnetic particles 31 and a plurality of metal molecule ligands 32 uniformly distributed around the magnetic particles 31, and when the cover plate body 1 is in a bent state, adjacent magnetic units 3 are pressed to exchange the metal molecule ligands 32.
It should be noted that, magnetic attraction exists between the magnetic particles 31 and the metal molecular ligands 32, the magnetism of each magnetic particle 31 is the same, so that the magnetism of each metal molecular ligand 32 is the same, and mutual repulsion exists between each metal molecular ligand 32, so that the magnetic attraction and mutual repulsion are balanced, and each metal molecular ligand 32 is uniformly distributed around the magnetic particle 31. Specifically, as shown in fig. 2, fig. 2 is a schematic structural diagram of a state of the magnetic unit 3 before bending the cover plate assembly according to an embodiment of the present invention, and each metal molecular ligand 32 is located on the first track and uniformly distributed around the magnetic particle 31. When the cover plate body 1 is in a bent state, the magnetic unit 3 is subjected to an external pressure, so that the balance between the magnetic particle 31 and some of the metal molecular ligands 32 is broken, and the metal molecular ligands 32 are separated from the first track of the corresponding magnetic particle 31 and move to another adjacent magnetic particle 31, as shown in fig. 3, fig. 3 is a schematic structural diagram of the state of the magnetic unit 3 in the bending process of the cover plate assembly provided by the embodiment of the present invention, that is, the metal molecular ligands 32 separated from the original magnetic particles 31 are closer to another adjacent magnetic particle 31, so that the magnetic attraction force of the other adjacent magnetic particles 31 to the metal molecular ligands 32 separated from the original magnetic particles 31 is larger, so that the metal molecular ligands 32 separated from the original magnetic particles 31 surround another adjacent magnetic particle 31 again, and a dynamic balance is presented, that the cover plate assembly is in different bending degrees, due to the different bending stress, the number of the metal molecular ligands 32 with position exchange changes, that is, the larger the bending degree is, the larger the number of the metal molecular ligands 32 with position exchange is, so as to realize the dynamic balance between each magnetic particle 31 and the metal molecular ligand 32, thereby prolonging the bending life. As shown in fig. 4, fig. 4 is a schematic structural diagram of a state of the magnetic unit 3 after the cover plate assembly is bent, which is greatly beneficial to bending and avoids rapid concentration of stress generated by bending.
Alternatively, the distance between adjacent magnetic units 3 is 20nm to 600nm, and the distance between adjacent magnetic units 3 is not suitable to be too large, which may cause the metal molecular ligand 32 forced to be separated from the original magnetic particle 31 to be unable to be attracted by another adjacent magnetic particle 31, and rebalance. Specifically, the distance between adjacent magnetic units 3 may be 100 nm.
In some alternative embodiments, the volume ratio of the magnetic units 3 in the filling medium 2 is 25% to 50%, and it is understood that the volume ratio of the magnetic units 3 in the filling medium 2 is not too small, and the distance is too small, so that the number of the magnetic units 3 is too small, and the repulsive force generated by the magnetic units 3 is too small to reduce the bending stress. The volume ratio of the magnetic unit 3 in the filling medium 2 should not be too large, and if the volume ratio is too large, the repulsive force generated by the magnetic unit 3 may be too large, which is not favorable for the bending of the cover plate assembly. Optionally, the volume percentage of the magnetic unit 3 in the filling medium 2 is 30%.
In some alternative embodiments, the particle size of the magnetic unit 3 is 50nm to 150nm, and the particle size of the magnetic unit 3 is not too large, so that enough magnetic units 3 can be arranged in the filling medium 2, and the magnetic units 3 can provide enough repulsive force to reduce the stress generated by bending. The particle size of the magnetic unit 3 is understood to be the distance from the center of the magnetic particle 31 to the center of the metal molecular ligand 32. Optionally, the magnetic unit 3 has a particle size of 100 nm.
In order to achieve the magnetic properties of the magnetic unit 3 and the pressure exchange of the metal molecular ligands 32, in some alternative embodiments the magnetic particles 31 compriseMagnetic iron oxide, the metal molecule ligand 32 includes iron ions. It is understood that the magnetic iron oxide is magnetic Fe2O3And the iron ion can be positive 3-valent iron ion, magnetic Fe2O3Can generate attraction force to the positive 3-valent iron ions and mutual repulsion force between the positive 3-valent iron ions, and can keep the positive 3-valent iron ions in the magnetic Fe2O3Fixed on the track around.
In order to better relieve the bending stress, in some alternative embodiments, the opening cross-sectional area of the slot K gradually increases in a direction along the thickness of the cover plate body 1.
It can be understood that the bottom cross sectional area of the slot K is smaller than the cross sectional area of the top opening of the slot K, the cover plate body 1 is bent towards one side of the top opening of the slot K, that is, the deformation amount and the bending stress of the cover plate body 1 at one side of the top opening of the slot K are relatively larger, the slot K is set to be in a structural form that the opening cross sectional area is gradually increased in the direction from the surface of one side of the cover plate body 1 provided with the slot K to the surface of the other side of the cover plate body 1, and the bending stress generated when the cover plate body 1 is bent can be better released.
Optionally, the slot K is a trapezoidal slot, and a bottom base angle of the slot K is greater than or equal to 120 °, so as to leave a space for deformation of the cover plate body 1 during bending, thereby facilitating bending of the cover plate body 1.
Referring to fig. 5, fig. 5 is a flowchart illustrating a method for manufacturing a cover plate assembly according to an embodiment of the present invention. The embodiment of the invention also provides a preparation method of the cover plate assembly, which comprises the following steps:
s110: providing a cover plate body 1 to be processed;
s120: forming a slot K in a bending area WA of the cover plate body 1 to be processed;
s130: the slot K is filled with a filling medium 2, and the filling medium 2 comprises a plurality of magnetic units 3 with the same magnetism.
According to the cover plate assembly manufacturing method provided by the embodiment of the invention, the filling medium 2 is filled and solidified in the groove K, the plurality of magnetic units 3 with the same magnetism are formed in the filling medium 2, and when the cover plate body 1 bends towards one side where the groove K is located, because the groove K is arranged in the bending area WA, a deformation space can be reserved for the bending deformation of the cover plate body 1 through the groove K, and the stress concentration is avoided. Meanwhile, the filling medium 2 is arranged in the groove K, the filling medium 2 can absorb part of bending stress through self deformation, the filling medium 2 comprises a plurality of magnetic units 3 with the same magnetism, repulsive force is arranged between the magnetic units 3 with the same magnetism, and the repulsive force between the magnetic units 3 can reduce the risk of the cover plate body 1 being broken due to the fact that stress is rapidly concentrated due to bending.
In step S110, the cover plate body 1 to be processed may be made of UTG (Ultra Thin Glass, Ultra Thin flexible Glass) material, specifically, UTG material with a thickness of 100 μm over the whole surface and without strengthening.
In step S120, the cover plate body 1 to be processed is etched to form the trench K, and specifically, dry etching or wet etching may be adopted, where the dry etching and the wet etching are different in that the wet etching uses a solvent or a solution to perform etching. Wet etching is a pure chemical reaction process, which means that chemical reaction between solution and pre-etching material is used to remove the part not masked by the masking film material for etching purpose. The method has the advantages of good selectivity, good repeatability, high production efficiency, simple equipment and low cost. The dry etching is of various types, including photo-evaporation, gas phase etching, plasma etching, etc. The dry etching has the advantages that: good anisotropy, high selectivity ratio, good controllability, flexibility and repeatability, safe thin line operation, easy realization of automation, no chemical waste liquid, no pollution in the treatment process and high cleanliness. In this embodiment, dry etching or wet etching may be selected according to actual conditions.
After the open groove K is formed, the cover plate body 1 to be processed can be chemically strengthened, the high-temperature annealing process is carried out, the internal stress of the cover plate body 1 to be processed is eliminated, and the strengthened cover plate body 1 to be processed has the characteristic of high hardness.
In some optional embodiments, the filling medium 2 includes a colloid, the magnetic units 3 are uniformly dispersed in the colloid, and after the filling medium is filled in the slot, the method further includes: the filling medium is cured. The colloid specifically can adopt polyimide, and its texture is softer relatively, and has certain elasticity, can effectively absorb some bending stress, simultaneously, because colloids such as polyimide have certain viscidity, can be better hold fixed magnetic element 3, of course, filling medium 2 also can adopt other materials to make, and is not specially limited. When the filling medium 2 comprises a gel, the filling medium 2 needs to be cured to avoid the filling medium 2 flowing. It should be noted that curing is a general technique in the art, and the specific curing temperature and conditions are adjusted according to actual conditions.
An embodiment of the present invention further provides a display device, including: the display panel comprises a cover plate assembly and a display panel, wherein the cover plate assembly is provided by any one of the embodiments; the cover plate assembly is arranged on the light emitting side of the display panel.
The display device provided by the embodiment of the invention has the technical effects of the technical solutions of the cover plate assemblies in any of the above embodiments, and the explanations of the structures and terms identical to or corresponding to those in the above embodiments are not repeated herein. The display device provided by the embodiment of the invention can be a mobile phone and can also be any electronic product with a display function, including but not limited to the following categories: the touch screen display system comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the invention is not particularly limited in this respect.
As will be apparent to those skilled in the art, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present invention, and these modifications or substitutions should be covered within the scope of the present invention.
It should also be noted that the exemplary embodiments mentioned in this patent describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.
Claims (10)
1. A cover plate assembly having a bending zone, the cover plate assembly comprising:
the surface of the cover plate body positioned in the bending area is provided with a slot;
and the filling medium is filled in the open slot and comprises a plurality of magnetic units with the same magnetism.
2. The cover assembly of claim 1, wherein the cover assembly has a planar area disposed adjacent the inflection area, the depth of the slot in a direction along the thickness of the cover body being less than or equal to three-fifths of the thickness of the cover body at the planar area.
3. The cover plate assembly of claim 2, wherein the cover plate body at the planar area has a thickness of 90 μm to 110 μm in a direction along the thickness of the cover plate body; and/or the depth of the groove is 50-70 μm.
4. The lid assembly of claim 1, wherein the magnetic unit comprises magnetic particles and a plurality of metal molecule ligands uniformly distributed around the magnetic particles; when the cover plate body is in a bent state, the adjacent magnetic units are pressed to exchange the metal molecular ligands;
preferably, the distance between adjacent magnetic units is 20nm to 600 nm;
preferably, the volume percentage of the magnetic unit in the filling medium is 25-50%.
5. The lid assembly according to claim 1 or 4, wherein the magnetic unit has a particle size of 50nm to 150 nm.
6. The lid assembly of claim 4, wherein the magnetic particles comprise magnetic iron oxide and the metal molecular ligands comprise iron ions.
7. The cover plate assembly of claim 1, wherein the open cross-sectional area of the slot increases gradually in a direction along the thickness of the cover plate body.
8. A method of making a cover plate assembly, comprising the steps of:
providing a cover plate body to be processed;
forming a groove in the bending area of the cover plate body to be processed;
and filling a filling medium in the slot, wherein the filling medium comprises a plurality of magnetic units with the same magnetism.
9. The method of manufacturing a cover plate assembly according to claim 8,
the filling medium comprises colloid, the magnetic units are uniformly dispersed in the colloid, and the filling medium is filled in the groove and then the method further comprises the following steps: and curing the filling medium.
10. A display device, comprising:
a cover plate assembly as claimed in any one of claims 1 to 7;
the display panel, the apron subassembly is located display panel's light-emitting side.
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| CN202111569231.0A CN114283683B (en) | 2021-12-21 | 2021-12-21 | Cover plate assembly, cover plate assembly preparation method and display device |
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| CN202111569231.0A CN114283683B (en) | 2021-12-21 | 2021-12-21 | Cover plate assembly, cover plate assembly preparation method and display device |
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| CN114283683A true CN114283683A (en) | 2022-04-05 |
| CN114283683B CN114283683B (en) | 2023-10-24 |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112542094A (en) * | 2020-12-11 | 2021-03-23 | 合肥维信诺科技有限公司 | Display module and display device |
| JP2021096386A (en) * | 2019-12-18 | 2021-06-24 | 日本製鉄株式会社 | Back cover attachment structure of display device |
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| CN105679806A (en) * | 2016-04-13 | 2016-06-15 | 京东方科技集团股份有限公司 | Flexible display substrate and mother board thereof, preparation method, flexible display panel and mother board thereof |
| CN109859634A (en) * | 2019-03-25 | 2019-06-07 | 武汉华星光电半导体显示技术有限公司 | Foldable display device |
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| JP2021096386A (en) * | 2019-12-18 | 2021-06-24 | 日本製鉄株式会社 | Back cover attachment structure of display device |
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| CN112037664A (en) * | 2020-09-29 | 2020-12-04 | 天马微电子股份有限公司 | Display device with cover plate and display panel |
| CN112365800A (en) * | 2020-10-30 | 2021-02-12 | 合肥维信诺科技有限公司 | Flexible display panel |
| CN112542094A (en) * | 2020-12-11 | 2021-03-23 | 合肥维信诺科技有限公司 | Display module and display device |
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| CN114283683B (en) | 2023-10-24 |
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