CN108984027A - Conductive laminate structure and preparation method thereof, display device - Google Patents
Conductive laminate structure and preparation method thereof, display device Download PDFInfo
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- CN108984027A CN108984027A CN201810703835.1A CN201810703835A CN108984027A CN 108984027 A CN108984027 A CN 108984027A CN 201810703835 A CN201810703835 A CN 201810703835A CN 108984027 A CN108984027 A CN 108984027A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The present invention provides a kind of conductive laminate structure and preparation method thereof, display device, several support columns are formed in the cabling area of substrate, nano metal line layer is formed in substrate and support column, nano metal line layer between adjacent supports column is by gravity and surface tension effects, surface can be in concave curved surface, then adhesion promoting layer is formed on the nano metal line layer, the adhesion promoting layer covers the nano metal line layer, and the adhesion promoting layer between the adjacent support column also has concave curved surface, routing layer is formed in the concave curved surface of the adhesion promoting layer later, the contact surface of the routing layer and the nano metal line layer is curved surface, under the premise of not increasing border width, the contact area of the routing layer Yu the nano metal line layer can be increased, to improve the conductive capability of the nano metal line layer.
Description
Technical field
The present invention relates to technical field of touch control, and in particular to a kind of conductive laminate structure and preparation method thereof, display device.
Background technique
The advantages that touch control device is operated because of it, imaging effect is good, function diversification is gradually by electronic communication industry
Favor, and be widely used on the products such as information system equipment, household appliance, communication apparatus, personal portable.And it is adjoint
Touch panel is in the rapid emergence of communications industry, especially flourishing in mobile communication industry, touch panel one in recent years
Lift the preferred product for becoming imaging display apparatus now.The highest touch panel of utilization rate is mainly electric resistance touch-control panel and electricity
Appearance formula touch panel, but the considerations of user is for controllability, ease for use and appearance, capacitance touching control can be selected mostly
Panel is as its best preferred unit.
In the capacitance type touch-control panel of traditional smart phone, the material of touch control electrode be usually tin indium oxide (referred to as
ITO).The light transmittance of ITO is very high, and electric conductivity is preferable.But with incrementally increasing for touch panel size, it is especially applied to 15
When the very little above panel, the defect of ITO is more and more prominent, and most obvious one defect is exactly that the surface resistance of ITO is excessive, and price is high
It is expensive, it not can guarantee the good electric conductivity of large touch panel and enough sensitivity, can not be suitable for electronic product not yet
The development trend of disconnected low priceization.
Just because of this, industrial circle is being dedicated to developing the alternative materials of ITO always, wherein nano-silver thread (silver nano
Wires, abbreviation SNW) it is used as a kind of brand-new material to start to substitute ITO as preferred conductive material.Nano-silver thread has silver excellent
Good electric conductivity, simultaneously because the dimensional effect of its Nano grade, so that it is with excellent translucency and flexible resistance, therefore
It can be used as substituting material of the ITO as touch control electrode, realize the touch panel based on nano-silver thread.
However, the adhesive capacity of nano-silver thread and flexible substrates such as PI are poor, need using over coater (abbreviation OC)
It assists improving as medium, but due to the incorporation of OC, the conductive capability of nano-silver thread in unit area is caused to reduce.
Summary of the invention
The purpose of the present invention is to provide a kind of conductive laminate structures and preparation method thereof, display device, are not increasing side
Under the premise of width of frame, increases the contact area of nano metal line layer and routing layer, improve the conductive capability of conductive film structure.
To achieve the above object, the present invention provides a kind of conductive laminate structure, comprising:
Substrate；
Several support columns, several described support columns are located at the cabling area of the substrate；
Nano metal line layer, the nano metal line layer cover the substrate and the support column, and the adjacent support
The nano metal line layer between column has concave curved surface；
Adhesion promoting layer, the adhesion promoting layer cover the nano metal line layer, and the thickening between the adjacent support column
Layer has concave curved surface；And
Routing layer, the routing layer are located in the concave curved surface of the adhesion promoting layer.
Optionally, at least two groups support column is provided with along the direction perpendicular to the cabling area, the cabling area.
Optionally, include in every group of support column along cabling area extending direction arrange several support columns, the support
Column has block-shaped protrusion structure.
Optionally, every group of support column includes one or several support columns, and there is the support column edge to be parallel to the base
The fin structure that the direction of bottom corresponding edge extends.
Optionally, the upper surface in the cabling area is flushed with the upper surface for the adhesion promoting layer being located above the support column.
Optionally, the material of the support column is transparent metal oxide.
Optionally, the material of the support column is ITO.
Optionally, the nano metal line layer includes the nano-silver thread stacked.
Correspondingly, the present invention also provides a kind of production methods of conductive laminate structure, comprising:
One substrate is provided, forms several support columns in the cabling area of the substrate；
Nano metal line layer is formed, the nano metal line layer covers the substrate and the support column, and adjacent described
The nano metal line layer between support column has concave curved surface；
Adhesion promoting layer is formed, the adhesion promoting layer covers the nano metal line layer, and described between the adjacent support column
Adhesion promoting layer has concave curved surface；And
Routing layer is formed, the routing layer is located in the concave curved surface of the adhesion promoting layer.
Correspondingly, the present invention also provides a kind of display device, including touch panel as described above.
Compared with prior art, conductive laminate structure provided by the invention and preparation method thereof, display device have following
The utility model has the advantages that
The present invention is formed with several support columns in the cabling area of substrate, is formed with nano metal in substrate and support column
Line layer, the nano metal line layer between adjacent supports column is by gravity and surface tension effects, and surface can be in concave curved surface, then in institute
It states and is formed with adhesion promoting layer on nano metal line layer, the adhesion promoting layer covers the nano metal line layer, and the adjacent support column
Between the adhesion promoting layer also there is concave curved surface, routing layer, the cabling are formed in the concave curved surface of the adhesion promoting layer later
The contact surface of layer and the nano metal line layer is that curved surface can increase the cabling under the premise of not increasing border width
The contact area of layer and the nano metal line layer, to improve the conductive capability of the nano metal line layer.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of a conductive laminate structure；
Fig. 2 is the structural schematic diagram of conductive laminate structure provided by one embodiment of the invention；
Fig. 3 is the flow chart of the production method of conductive laminate structure provided by one embodiment of the invention；
Fig. 4~7 are the section knot of each step of the production method of conductive laminate structure provided by one embodiment of the invention
Structure schematic diagram.
Specific embodiment
It please refers to shown in Fig. 1, is the structural schematic diagram of a conductive laminate structure, as shown in Figure 1, the conductive laminate knot
Structure includes: substrate 1, the OC layer 3 on the nano-silver thread layer 2, is located at institute at the nano-silver thread layer 2 in the substrate 1
The routing layer 4 on OC layer 3 is stated, and routing layer 4 is located at the cabling area of the substrate 1.
Since the adhesion property of nano-silver thread layer 2 is particularly poor, increase by one layer of OC layer 3 on the nano-silver thread layer 2,
For increasing the adhesion strength of the nano-silver thread layer 2, but since the OC in OC layer 3 can penetrate into the nano-silver thread layer 2, lead
Causing the conductive capability of the nano-silver thread layer 2 in unit area reduces.
Contact area can be increased by the contact width of increase nano-silver thread layer 2 and routing layer 4 at present to solve conduction
The problem of ability difference, but increase contact area will definitely increase the width of frame, and increase border width do not meet at present it is narrow
The trend of frame design.
In view of the above-mentioned problems, applicant provides a kind of conductive laminate structure and its manufacturing method, do not increasing border width
Under the premise of, the contact area of the routing layer Yu the nano metal line layer can be increased, improve the nano metal line layer
Conductive capability.
To keep the contents of the present invention more clear and easy to understand, below in conjunction with Figure of description, the contents of the present invention are done into one
Walk explanation.Certainly the invention is not limited to the specific embodiment, and general replacement well known to those skilled in the art is also contained
Lid is within the scope of the present invention.
Obviously, the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, all other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.Secondly, the present invention has carried out detailed statement using schematic diagram, the present invention is being described in detail
When example, for ease of description, schematic diagram is not partially enlarged in proportion to the general scale, should not be to this as restriction of the invention.
Core of the invention thought is, several support columns is formed in the cabling area of substrate, in substrate and support column
On be formed with nano metal line layer, the nano metal line layer between adjacent supports column is by gravity and surface tension effects, surface meeting
In concave curved surface, adhesion promoting layer is then formed on the nano metal line layer, the adhesion promoting layer covers the nano metal line layer,
And the adhesion promoting layer between the adjacent support column also has concave curved surface, is formed in the concave curved surface of the adhesion promoting layer later
The contact surface of routing layer, the routing layer and the nano metal line layer is curved surface, under the premise of not increasing border width, energy
Enough increase the contact area of the routing layer Yu the nano metal line layer, to improve the conductive energy of the nano metal line layer
Power.
It please refers to shown in Fig. 2, conductive laminate structure provided by the present embodiment includes: substrate 10；Several support columns 20,
The support column 20 is located at the cabling area of the substrate 10；Nano metal line layer 30, the nano metal line layer 30 cover described
Substrate 10 and the support column 20, and 30 layers of the nano metal between the adjacent support column 20 have concave curved surface；Thickening
Layer 40, the adhesion promoting layer 40 covers the nano metal line layer 30, and 40 layers of the thickening between the adjacent support column 20
With concave curved surface；And routing layer 50, the routing layer 50 are located in the concave curved surface of the adhesion promoting layer 40.
Visible area and rim area corresponding to touch panel, the substrate 10 include functional areas and cabling area (also referred to as
Lead district), the cabling area is, for example, to surround functional areas, and the functional areas are subsequent to be shown commonly used in light transmission, the cabling area
It is usually opaque.
In the present embodiment, along the direction perpendicular to the cabling area, at least two groups support column is provided in the cabling area.
It include several of extending direction (direction for being parallel to 10 corresponding edge of the substrate) arrangement along cabling area in every group of support column
Support column 20, the support column 20 have block-shaped protrusion structure.Every group of support column includes one or several support columns 20, described
Support column 20 has the fin structure extended along the direction for being parallel to 10 corresponding edge of substrate.The upper surface in the cabling area with
The upper surface of adhesion promoting layer 40 above the support column 20 flushes.
The material of the support column 20 is transparent metal oxide, it is preferable that the material of the support column 20 is ITO.This
In embodiment, the support column 20 is formed in the cabling area of a certain opposite sides of the substrate 10, in other embodiments
In, the support column 20, the effect of the support column 20 can also be only formed in the cabling area of certain side of the substrate 10
It is therefore the contact area for increasing the nano metal line layer 30 and the routing layer 50 is formed with away in the substrate 10
Support column 20 is just needed to form in the cabling area first of line floor.In addition, showing in the present embodiment in the two sides of the substrate 10
Two support columns 20 are gone out, in other embodiments, the quantity of the support column 20 of every side can for three or more
It is multiple, the quantity of the support column 20 can be determined according to the area in cabling area.Position of the present invention to the support column 20
And quantity is without limitation.
The support column 20 close to 10 side of substrate size and far from 10 side of substrate size can be it is identical,
It can be the size close to 10 side of substrate and be less than the size far from 10 side of substrate, for example, the vertical sectional shape of support column 20
For inverted trapezoidal.Vertical sectional shape as referred to herein refers to the shape that cutting is carried out along the thickness direction of nano metal line layer 30, that is,
Along the cross sectional shape for the support column 20 for seen after cutting perpendicular to 10 surface of substrate.It is understood that support column 20
Vertical sectional shape can also be the composite structure of inverted trapezoidal structure and rectangular configuration, the relatively close base of rectangular configuration
Plate side, the inverted trapezoidal structure are relatively distant from the side of the substrate, and details are not described herein.In addition, multiple support columns 20
Size both may be the same or different, and can optionally adjust.Equally, the shape of multiple support columns 20 both can be identical,
It can be different.
Multiple support columns 20, which can be, is distributed evenly in substrate 10 (spacing of adjacent protrusion structure is identical),
It is also possible to be non-uniformly distributed in substrate 10.In the present embodiment, the spacing between the adjacent support column 20 is in 1 μm of -20 μ
Between m, for example, the spacing between the adjacent support column 20 is 1 μm, 5 μm, 10 μm, 15 μm or 20 μm, certainly, as it appears from the above,
Spacing between the adjacent support column 20 may be the same or different, for example, from the close visible area to far from described
Visible area, spacing between the adjacent support column 20 can successively decrease or first afterwards in trend, the decline trend or first progressively increase of progressively increasing
The trend being incremented by after successively decreasing.In addition, in the present embodiment, it is preferred that the height of the support column 20 100nm-1000nm it
Between, such as: the height of the support column 20 is 100nm, 300nm, 600nm, 900nm or 1000nm, certainly, multiple supports
The height of column 20 may be the same or different.
Nano metal line in the nano metal line layer 30 can be gold (Au), silver (Ag), platinum (Pt), copper (Cu), cobalt
(Co), the nano wire of palladium (Pd) etc..Due to the features such as silver is conductive and translucency is good, the nano metal line is preferably silver
Nano wire (i.e. nano-silver thread), then the nano metal line layer 30 is preferably nano-silver thread layer, receiving in the nano-silver thread layer
The wire length of rice silver wire can be between for 10 microns to 300 microns, and the line footpath (or line width) of nano-silver thread can be received less than 500
Rice, and its length-width ratio (the ratio between wire length and line footpath) can be greater than 10.The material of the adhesion promoting layer 40 is preferably OC.
Correspondingly, including conductive laminate structure as described above the present invention also provides a kind of touch panel.
The touch panel can be used for the mobile terminals such as mobile phone, game machine, tablet computer, can be used for notebook electricity
The various electronic products such as brain, desktop computer, public information inquiry equipment, multimedia teaching facility.
Correspondingly, including conductive laminate structure as described above the present invention also provides a kind of display device.
It please refers to shown in Fig. 3, is the process of the production method of conductive laminate structure provided by one embodiment of the invention
Figure, as shown in figure 3, the production method that the present invention proposes a kind of conductive laminate structure, comprising the following steps:
Step S01: a substrate is provided, forms several support columns in the cabling area of the substrate；
Step S02: forming nano metal line layer, and the nano metal line layer covers the substrate and the support column, and
The nano metal line layer between the adjacent support column has concave curved surface；
Step S03: forming adhesion promoting layer, and the adhesion promoting layer covers the nano metal line layer, and the adjacent support column it
Between the adhesion promoting layer have concave curved surface；
Step S04: forming routing layer, and the routing layer is located in the concave curved surface of the adhesion promoting layer.
Fig. 4~7 are the section knot of each step of the production method of conductive laminate structure provided by one embodiment of the invention
Structure schematic diagram, please refers to shown in Fig. 4~7, and combines Fig. 4, the production side for the conductive laminate structure that the present invention will be described in detail proposes
Method:
It in step S01, please refers to shown in Fig. 4, a substrate 10 is provided, form multiple in the cabling area of the substrate 10
Dagger 20.
The substrate 10 is, for example, flexible substrates, i.e., is made using flexible material, the flexible material refers in work
With some strength and with certain flexible material in industry.Specifically, the material of the substrate 10 is including but not limited to pressure
Gram force, polymethyl methacrylate (PMMA), acrylic nitrile-butadiene-styrene (ABS), polyamide (PA), polyimides
(PI), polybenzimidazoles polybutene (PB), polybutylene terephthalate (PBT) (PBT), polycarbonate (PC), polyether-ether-ketone
(PEEK), polyetherimide (PEI), polyether sulfone (PES), polyethylene (PE), polyethylene terephthalate (PET), poly- second
Alkene tetrafluoroethene (ETFE), polyethylene oxide, polyglycolic acid (PGA), polymethylpentene (PMP), polyformaldehyde (POM), polyphenylene oxide
(PPE), polypropylene (PP), polystyrene (PS), polytetrafluoroethylene (PTFE) (PTFE), polyurethane (PU), polyvinyl chloride (PVC), poly- fluorine
Ethylene (PVF), polyvinylidene chloride (PVDC), polyvinylidene fluoride (PVDF) or styrene-acrylonitrile (SAN) etc..This implementation
In example, the material of the flexible substrates is PI.
Visible area and rim area corresponding to touch panel, the substrate 10 include functional areas and cabling area (also referred to as
Lead district), the cabling area is, for example, to surround functional areas, and the visible area is subsequent to be shown commonly used in light transmission, the cabling area
It is usually opaque.
When it is implemented, flexible material can be coated in rigid basement such as substrate of glass, made on the flexible material
Make support column, nano metal line layer and other elements, after completing whole processing procedures, by the glass base below the flexible material
Bottom removing is to form flexible substrates；It is also possible to be coated with flexible material in rigid basement such as substrate of glass, it then will be described
Substrate of glass removing below flexible material is to form flexible substrates.
In the present embodiment, it using mask plate as exposure mask, is formed using low temperature coating technique at 10 edge of substrate
Multiple support columns 20 expose the region that the support column 20 is needed to form in the substrate 10 using the mask plate,
And remaining region is blocked, the support column 20 is directly then formed using low temperature coating technique.The material of the support column 20 is
Transparent metal oxide, it is preferred that the material of the support column 20 is ITO.
As shown in figure 4, in the present embodiment, being formed in the cabling area of a certain opposite sides of the substrate 10 described
Support column 20 only can also form the support column in the cabling area of certain side of the substrate 10 in other embodiments
20, the effect of the support column 20 is to increase the contact area of the nano metal line layer and routing layer that are subsequently formed, therefore, institute
It states in the cabling area first for be formed in substrate 10 routing layer and just needs to form support column 20.In addition, in the present embodiment, in institute
The two sides for stating substrate 10 all illustrate two support columns 20, in other embodiments, the support column 20 of every side
Quantity can be three or more, and the quantity of the support column 20 can be determined according to the area in cabling area.The present invention couple
The position of the support column 20 and quantity are without limitation.
In step S20, as shown in figure 5, forming nano metal line layer 30, the nano metal line layer 30 covers the base
Bottom 10 and the support column 20, and the nano metal line layer 30 between the adjacent support column 20 has concave curved surface.
In the present embodiment, it is coated with nano metal solution in the substrate 10, at this time due to the presence of the support column 20,
By the effect of gravity and surface tension, surface can present recessed the nano metal solution between the adjacent support column 20
Then curved surface, i.e., recessed curved-surface shape solidify the nano metal solution to form nano metal line layer 30, adjacent described
Concave curved surface is presented in nano metal line layer 30 between support column 20.
It should be noted that the distance and the nanogold of the height of the support column 20, the adjacent support column 20
The thickness for belonging to line layer 30 has decided on whether that concave curved surface can be formed between the adjacent support column 20, and is formed described recessed
The size of curved surface can adjust concave curved surface by adjusting above-mentioned parameter.
The material of the nano metal line layer 30 is including but not limited to nano-silver thread.It, can be in the base in the present embodiment
Nano-silver thread solution is formed on bottom 10, the nano-silver thread solution is dissolved in specific solvent for nano-silver thread and the suspension of formation
Solution, which can be or mixtures thereof water, aqueous solution, solion, saline solns, supercritical fluid, oil etc., described molten
Such as dispersing agent, surfactant, crosslinking agent, stabilizer, wetting agent or thickener additive can also be contained in agent.Then solid
Change the nano-silver thread solution, forms nano-silver thread layer.The nano-silver thread layer includes receiving in matrix and the insertion matrix
Rice silver wire is overlapped between the nano-silver thread by molecular force to form conductive network, and the matrix is used to protect the nanometer
Silver wire such as is not corroded, wears at the influences of external environments.
The method for forming the nano-silver thread solution can use rotary coating, slit coating, blade coating, bar
In coating, spraying coating, print roll coating, silk-screen printing, intaglio printing, hectographic printing, flexographic printing, bat printing or ink jet printing
A kind of method, can also be using techniques such as deposition, sputterings.Curing method can be naturally dry, simply toast or be heating and curing
Deng so that the nano-silver thread solution is formed by curing nano-silver thread layer.
In step s 30, it please refers to shown in Fig. 6, forms adhesion promoting layer 40, the adhesion promoting layer 40 covers the nano metal line
Layer 30, and the adhesion promoting layer 40 between the adjacent support column 20 has concave curved surface.
In the present embodiment, the adhesion promoting layer 40 is preferably OC layers, specifically, can be using the method for coating in the substrate
OC solution is formed on 10, the OC solution covers the nano metal line layer 30, and due between the adjacent support column 20
The nano metal line layer 30 be in concave curved surface, the OC solution being formed on the concave curved surface is also in concave curved surface, is then heated
The solvent in the OC is evaporated, is formed OC layers described.
In step s 40, it please refers to shown in Fig. 7, forms routing layer 50, the routing layer 50 is located at the adhesion promoting layer 40
In the concave curved surface.
In the present embodiment, the routing layer 50 is formed as exposure mask using mask layer, the material of the routing layer 50 is preferred
For metal.The contact surface of the routing layer 50 and the nano metal line layer 30 is curved surface, can increase the routing layer 50 with
The contact area of the nano metal line layer 30, to improve conductive capability.
Since the cabling area in substrate 10 is formed with multiple support columns 20, when the support column 20 of certain side of substrate 10
Quantity be three or more when, will form two or more concave curved surfaces, the routing layer 50 formed in the concave curved surface
It can be connected to each other.For example, the mask layer exposes the cabling area for being formed with routing layer, other regions are blocked, then shape
At routing layer 50, the routing layer 50 not only covers the concave curved surface, is also connected with each other.Certainly, in multiple concave curved surfaces
The routing layer 50 can also be not connected to, and can be determined according to the actual needs.
The production method of conductive laminate structure provided by the present invention forms multiple supports in the cabling area of substrate 10 first
Column 20 forms nano metal line layer 30, the nano metal line layer 30 between adjacent supports column 20 in substrate 10 and support column 20
By gravity and surface tension effects, surface can be in concave curved surface, and adhesion promoting layer 40, institute are then formed on the nano metal line layer 30
It states adhesion promoting layer 40 and covers the nano metal line layer 30, and the adhesion promoting layer 40 between the adjacent support column 20 is also with recessed
Curved surface forms routing layer 50, the routing layer 50 and the nano metal line layer in the concave curved surface of the adhesion promoting layer 40 later
30 contact surface is curved surface, under the premise of not increasing border width, can increase the routing layer 50 and the nano metal
The contact area of line layer 30, to improve the conductive capability of the nano metal line layer 30.
Correspondingly, including conductive laminate structure as described above the present invention also provides a kind of production method of touch panel
Production method.
In conclusion in conductive laminate structure provided by the invention and preparation method thereof, display device, in the cabling of substrate
Area is formed with several support columns, and nano metal line layer, the nanometer between adjacent supports column are formed in substrate and support column
Metal line layer can be in concave curved surface by gravity and surface tension effects, surface, then be formed with increasing on the nano metal line layer
Adhesion coating, the adhesion promoting layer covering nano metal line layer, and the adhesion promoting layer between the adjacent support column also have recessed
Curved surface, is formed with routing layer in the concave curved surface of the adhesion promoting layer later, and the routing layer connects with the nano metal line layer
Contacting surface is curved surface, under the premise of not increasing border width, can increase connecing for the routing layer and the nano metal line layer
Contacting surface product, to improve the conductive capability of the nano metal line layer.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (10)
1. a kind of conductive laminate structure characterized by comprising
Substrate；
Several support columns, several described support columns are located at the cabling area of the substrate；
Nano metal line layer, the nano metal line layer cover the substrate and the support column, and the adjacent support column it
Between the nano metal line layer have concave curved surface；
Adhesion promoting layer, the adhesion promoting layer cover the nano metal line layer, and the adhesion promoting layer tool between the adjacent support column
There is concave curved surface；And
Routing layer, the routing layer are located in the concave curved surface of the adhesion promoting layer.
2. conductive laminate structure as described in claim 1, which is characterized in that described along the direction perpendicular to the cabling area
At least two groups support column is provided in cabling area.
3. conductive laminate structure as claimed in claim 2, which is characterized in that include along the cabling area in every group of support column
Several support columns of extending direction arrangement, the support column have block-shaped protrusion structure.
4. conductive laminate structure as claimed in claim 2, which is characterized in that every group of support column includes one or several supports
Column, the support column have the fin structure extended along the direction for being parallel to the substrate corresponding edge.
5. conductive laminate structure as described in claim 1, which is characterized in that the upper surface in the cabling area be located at the branch
The upper surface of adhesion promoting layer above dagger flushes.
6. conductive laminate structure as described in claim 1, which is characterized in that the material of the support column is transparent metal oxide
Object.
7. conductive laminate structure as claimed in claim 6, which is characterized in that the material of the support column is ITO.
8. conductive laminate structure as described in claim 1, which is characterized in that the nano metal line layer includes the nanometer stacked
Silver wire.
9. a kind of production method of conductive laminate structure characterized by comprising
One substrate is provided, forms several support columns in the cabling area of the substrate；
Nano metal line layer is formed, the nano metal line layer covers the substrate and the support column, and the adjacent support
The nano metal line layer between column has concave curved surface；
Adhesion promoting layer is formed, the adhesion promoting layer covers the nano metal line layer, and the thickening between the adjacent support column
Layer has concave curved surface；And
Routing layer is formed, the routing layer is located in the concave curved surface of the adhesion promoting layer.
10. a kind of display device, which is characterized in that the display panel includes leading described in any one of claim 1 to 8
Electric layer stack structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810703835.1A CN108984027B (en) | 2018-06-30 | 2018-06-30 | Conductive laminated structure, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810703835.1A CN108984027B (en) | 2018-06-30 | 2018-06-30 | Conductive laminated structure, manufacturing method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108984027A true CN108984027A (en) | 2018-12-11 |
| CN108984027B CN108984027B (en) | 2022-03-04 |
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| CN201810703835.1A Active CN108984027B (en) | 2018-06-30 | 2018-06-30 | Conductive laminated structure, manufacturing method thereof and display device |
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| TWI751757B (en) * | 2020-10-23 | 2022-01-01 | 大陸商宸美（廈門）光電有限公司 | Touch panel and touch device |
| US11543902B2 (en) | 2020-11-27 | 2023-01-03 | Tpk Advanced Solutions Inc. | Touch panel and touch device |
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| CN108984027B (en) | 2022-03-04 |
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Application publication date: 20181211 Assignee: Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd.|Kunshan Guoxian photoelectric Co., Ltd Assignor: The valley (Guan) Technology Co. Ltd. Contract record no.: X2019990000155 Denomination of invention: Conductive laminate structure, manufacture method thereof, and display device License type: Common License Record date: 20191030 |
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Effective date of registration: 20191210 Address after: No. 2 Xiangshan Avenue, Yongning Street, Zengcheng District, Guangzhou, Guangdong province (the core of Zengcheng economic and Technological Development Zone) Applicant after: Guangzhou Guoxian Technology Co., Ltd Address before: 065500 Hebei Langfang County Guan emerging industry demonstration area Applicant before: The valley (Guan) Technology Co. Ltd. |
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