CN108984027B - Conductive laminated structure, manufacturing method thereof and display device - Google Patents
Conductive laminated structure, manufacturing method thereof and display device Download PDFInfo
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- CN108984027B CN108984027B CN201810703835.1A CN201810703835A CN108984027B CN 108984027 B CN108984027 B CN 108984027B CN 201810703835 A CN201810703835 A CN 201810703835A CN 108984027 B CN108984027 B CN 108984027B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention provides a conductive laminated structure, a manufacturing method thereof and a display device, wherein a plurality of supporting columns are formed in a wiring area of a substrate, a nano metal wire layer is formed on the substrate and the supporting columns, the surface of the nano metal wire layer between adjacent supporting columns is in a concave curved surface under the action of gravity and surface tension, then an adhesion-promoting layer is formed on the nano metal wire layer, the adhesion-promoting layer covers the nano metal wire layer, the adhesion-promoting layer between adjacent supporting columns is also in a concave curved surface, a wiring layer is formed in the concave curved surface of the adhesion-promoting layer, and the contact surface of the wiring layer and the nano metal wire layer is a curved surface.
Description
Technical Field
The invention relates to the technical field of touch control, in particular to a conductive laminated structure, a manufacturing method of the conductive laminated structure and a display device.
Background
Touch devices are gradually favored by the electronic communication industry due to their advantages of easy operation, good imaging effect, diversified functions, etc., and are widely applied to products such as information system devices, home appliances, communication devices, personal portable devices, etc. With the rapid rise of touch panels in the communication industry in recent years, especially the vigorous development in the mobile phone communication industry, touch panels are becoming the first choice of imaging display devices nowadays. The touch panel with the highest utilization rate is mainly a resistive touch panel and a capacitive touch panel, but users mostly select the capacitive touch panel as the best preferred device for the consideration of controllability, usability and surface appearance.
In a capacitive touch panel of a conventional smart phone, a material of a touch electrode is typically Indium Tin Oxide (ITO). The ITO has high light transmittance and good conductivity. However, as the size of the touch panel gradually increases, particularly when the touch panel is applied to a panel with a size of more than 15 inches, ITO defects become more and more prominent, and the most obvious defects include that the surface resistance of ITO is too large, the price is high, good conductivity and sufficient sensitivity of the large-size touch panel cannot be guaranteed, and the touch panel cannot be applied to the development trend of continuous low price of electronic products.
As such, the industry has been working on developing alternative materials to ITO, wherein Silver Nanowires (SNW) as an emerging material is beginning to replace ITO as a preferred conductive material. The nano silver wire has excellent conductivity of silver, and has excellent light transmittance and bending resistance due to the size effect of the nano grade, so the nano silver wire can be used as a material for replacing ITO (indium tin oxide) as a touch electrode to realize a touch panel based on the nano silver wire.
However, the adhesion of the nano silver wire to a flexible substrate such as PI is poor, and an over coater (abbreviated as OC) is required to be used as a medium for assisting improvement, but the conductive capability of the nano silver wire in a unit area is reduced due to the incorporation of OC.
Disclosure of Invention
The invention aims to provide a conductive laminated structure, a manufacturing method thereof and a display device, which can increase the contact area of a nano metal wire layer and a wiring layer and improve the conductive capability of the conductive film structure on the premise of not increasing the width of a frame.
To achieve the above object, the present invention provides a conductive laminated structure comprising:
a substrate;
the supporting columns are positioned in the wiring area of the substrate;
the nano metal wire layer covers the substrate and the supporting columns, and the nano metal wire layer between every two adjacent supporting columns is provided with a concave curved surface;
the adhesion promotion layer covers the nano metal wire layer, and the adhesion promotion layer between the adjacent supporting columns is provided with a concave curved surface; and
a routing layer located within the concave curvature of the adhesion promotion layer.
Optionally, at least two groups of support columns are arranged in the routing area in a direction perpendicular to the routing area.
Optionally, each group of support pillars includes a plurality of support pillars arranged along the extending direction of the routing area, and the support pillars have block-shaped protruding structures.
Optionally, each set of support posts comprises one or several support posts having a fin structure extending in a direction parallel to a respective edge of the base.
Optionally, the upper surface of the wiring area is flush with the upper surface of the adhesion promotion layer located above the supporting column.
Optionally, the support pillar is made of transparent metal oxide.
Optionally, the support pillar is made of ITO.
Optionally, the layer of nanowire metal lines comprises stacked nanowires of silver.
Correspondingly, the invention also provides a manufacturing method of the conductive laminated structure, which comprises the following steps:
providing a substrate, and forming a plurality of supporting columns in a wiring area of the substrate;
forming a nano metal wire layer, wherein the nano metal wire layer covers the substrate and the supporting columns, and the nano metal wire layer between adjacent supporting columns is provided with a concave curved surface;
forming an adhesion promoting layer, wherein the adhesion promoting layer covers the nano metal wire layer, and the adhesion promoting layer between the adjacent supporting columns is provided with a concave curved surface; and
forming a routing layer, wherein the routing layer is positioned in the concave curved surface of the adhesion promoting layer.
Correspondingly, the invention also provides a display device which comprises the touch panel.
Compared with the prior art, the conductive laminated structure, the manufacturing method thereof and the display device provided by the invention have the following beneficial effects:
according to the invention, a plurality of supporting columns are formed in a wiring area of a substrate, a nano metal wire layer is formed on the substrate and the supporting columns, the surface of the nano metal wire layer between adjacent supporting columns is concave under the action of gravity and surface tension, then an adhesion-promoting layer is formed on the nano metal wire layer, the adhesion-promoting layer covers the nano metal wire layer, the adhesion-promoting layer between adjacent supporting columns is also concave, a wiring layer is formed in the concave surface of the adhesion-promoting layer, the contact surface between the wiring layer and the nano metal wire layer is a curved surface, and the contact area between the wiring layer and the nano metal wire layer can be increased on the premise of not increasing the width of a frame, so that the conductivity of the nano metal wire layer is improved.
Drawings
FIG. 1 is a schematic diagram of a conductive stack structure;
fig. 2 is a schematic structural diagram of a conductive stacked structure according to an embodiment of the present invention;
fig. 3 is a flowchart of a method for fabricating a conductive stack structure according to an embodiment of the invention;
fig. 4 to 7 are schematic cross-sectional structures of steps of a method for manufacturing a conductive stacked structure according to an embodiment of the invention.
Detailed Description
Referring to fig. 1, a schematic structural diagram of a conductive laminated structure is shown, as shown in fig. 1, the conductive laminated structure includes: the nano-silver wire comprises a substrate 1, a nano-silver wire layer 2 positioned on the substrate 1, an OC layer 3 positioned on the nano-silver wire layer 2, a wiring layer 4 positioned on the OC layer 3, and the wiring layer 4 is positioned in a wiring area of the substrate 1.
Since the adhesion property of the nano-silver wire layer 2 is particularly poor, an OC layer 3 is added on the nano-silver wire layer 2 to increase the adhesion of the nano-silver wire layer 2, but since OC in the OC layer 3 penetrates into the nano-silver wire layer 2, the conductive capability of the nano-silver wire layer 2 per unit area is reduced.
The problem of poor conductivity can be solved by increasing the contact width between the nano silver wire layer 2 and the routing layer 4, that is, increasing the contact area, but increasing the contact area will increase the width of the frame, and the increase of the frame width does not conform to the current trend of narrow frame design.
In view of the above problems, the applicant provides a conductive stacked structure and a method for manufacturing the same, which can increase the contact area between the routing layer and the metal nanowire layer without increasing the width of the frame, thereby improving the conductive capability of the metal nanowire layer.
In order to make the contents of the present invention more clearly understood, the contents of the present invention will be further described with reference to the accompanying drawings. The invention is of course not limited to this particular embodiment, and general alternatives known to those skilled in the art are also covered by the scope of the invention.
It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The present invention is described in detail with reference to the drawings, and for convenience of explanation, the drawings are not enlarged partially according to the general scale, and should not be construed as limiting the present invention.
The core idea of the invention is that a plurality of support columns are formed in a routing area of a substrate, a nano metal wire layer is formed on the substrate and the support columns, the surface of the nano metal wire layer between adjacent support columns is concave under the action of gravity and surface tension, then an adhesion-promoting layer is formed on the nano metal wire layer, the adhesion-promoting layer covers the nano metal wire layer, the adhesion-promoting layer between adjacent support columns is also concave, then a routing layer is formed in the concave surface of the adhesion-promoting layer, the contact surface of the routing layer and the nano metal wire layer is a curved surface, and the contact area of the routing layer and the nano metal wire layer can be increased on the premise of not increasing the width of a frame, so that the conductivity of the nano metal wire layer is improved.
Referring to fig. 2, the conductive stacked structure provided in the present embodiment includes: a substrate 10; a plurality of supporting columns 20, wherein the supporting columns 20 are positioned in the wiring area of the substrate 10; a nano metal wire layer 30, wherein the nano metal wire layer 30 covers the substrate 10 and the supporting pillars 20, and the nano metal 30 layer between adjacent supporting pillars 20 has a concave curved surface; an adhesion promoting layer 40, wherein the adhesion promoting layer 40 covers the nano metal wire layer 30, and the adhesion promoting layer 40 between the adjacent supporting columns 20 has a concave curved surface; and a routing layer 50, the routing layer 50 being located within the concave curvature of the adhesion promoting layer 40.
The substrate 10 includes a functional region and a wiring region (also referred to as a wiring region) corresponding to a visible region and a frame region of the touch panel, the wiring region surrounding the functional region, the functional region being generally used for a transmissive display, and the wiring region being generally opaque.
In this embodiment, at least two groups of support pillars are disposed in the routing area along a direction perpendicular to the routing area. Each group of support columns comprises a plurality of support columns 20 arranged along the extending direction of the wiring area (the direction parallel to the corresponding edge of the substrate 10), and the support columns 20 are provided with block-shaped convex structures. Each set of support posts comprises one or several support posts 20, the support posts 20 having a fin structure extending in a direction parallel to the respective edge of the base 10. The upper surface of the wiring area is flush with the upper surface of the adhesion promoting layer 40 above the supporting column 20.
The material of the supporting column 20 is transparent metal oxide, and preferably, the material of the supporting column 20 is ITO. In this embodiment, the supporting pillars 20 are formed in the routing areas on two opposite sides of the substrate 10, in other embodiments, the supporting pillars 20 may be formed only in the routing area on one side of the substrate 10, and the supporting pillars 20 serve to increase the contact area between the metal nanowire layer 30 and the routing layer 50, so that the supporting pillars 20 need to be formed in the routing area on one side of the substrate 10 on which the routing layer is formed. In addition, in the present embodiment, two support columns 20 are shown on both sides of the substrate 10, in other embodiments, the number of the support columns 20 on each side may be three or more, and the number of the support columns 20 may be determined according to the area of the routing area. The present invention does not limit the position and number of the supporting columns 20.
The dimension of the side of the support column 20 close to the substrate 10 and the dimension of the side far from the substrate 10 may be the same, or the dimension of the side close to the substrate 10 may be smaller than the dimension of the side far from the substrate 10, for example, the longitudinal section of the support column 20 is an inverted trapezoid. The vertical sectional shape referred to herein means a shape cut along the thickness direction of the nanowire layer 30, that is, a sectional shape of the supporting pillar 20 seen after cutting perpendicular to the surface of the substrate 10. It is understood that the longitudinal cross-sectional shape of the supporting pillar 20 may also be a combination structure of an inverted trapezoid structure and a rectangular structure, the rectangular structure is relatively close to one side of the substrate, and the inverted trapezoid structure is relatively far from one side of the substrate, which is not described herein again. In addition, the plurality of support columns 20 may be the same size or different sizes, and may be adjusted as appropriate. Also, the plurality of support posts 20 may be identical or different in shape.
The supporting pillars 20 may be uniformly distributed on the substrate 10 (the distance between adjacent protruding structures is the same), or may be non-uniformly distributed on the substrate 10. In the present embodiment, the distance between adjacent supporting pillars 20 is between 1 μm and 20 μm, for example, the distance between adjacent supporting pillars 20 is 1 μm, 5 μm, 10 μm, 15 μm or 20 μm, although, as shown above, the distance between adjacent supporting pillars 20 may be the same or different, for example, the distance between adjacent supporting pillars 20 may be from near the visible region to far from the visible region, and may be in a trend of increasing, decreasing, or increasing first and then decreasing, or decreasing first and then increasing second. In addition, in the present embodiment, it is preferable that the height of the supporting pillar 20 is between 100nm and 1000nm, for example: the height of the supporting pillars 20 is 100nm, 300nm, 600nm, 900nm or 1000nm, and of course, the heights of the supporting pillars 20 may be the same or different.
The nano-metal wires in the nano-metal wire layer 30 may be nano-wires of gold (Au), silver (Ag), platinum (Pt), copper (Cu), cobalt (Co), palladium (Pd), etc. Since silver has characteristics of good conductivity and light transmittance, the nano metal wire is preferably a silver nanowire (i.e., a nano silver wire), the nano metal wire layer 30 is preferably a nano silver wire layer, the length of the nano silver wire in the nano silver wire layer may be between 10 micrometers and 300 micrometers, the wire diameter (or the wire width) of the nano silver wire may be less than 500 nanometers, and the aspect ratio (the ratio of the wire length to the wire diameter) may be greater than 10. The adhesion promoting layer 40 is preferably made of OC.
Correspondingly, the invention also provides a touch panel comprising the conductive laminated structure.
The touch panel can be used for mobile terminals such as mobile phones, game machines and tablet computers, and can also be used for various electronic products such as notebook computers, desktop computers, public information inquiry equipment and multimedia teaching equipment.
Correspondingly, the invention also provides a display device which comprises the conductive laminated structure.
Referring to fig. 3, which is a flowchart illustrating a method for fabricating a conductive stacked structure according to an embodiment of the present invention, as shown in fig. 3, the present invention provides a method for fabricating a conductive stacked structure, including the following steps:
step S10: providing a substrate, and forming a plurality of supporting columns in a wiring area of the substrate;
step S20: forming a nano metal wire layer, wherein the nano metal wire layer covers the substrate and the supporting columns, and the nano metal wire layer between adjacent supporting columns is provided with a concave curved surface;
step S30: forming an adhesion promoting layer, wherein the adhesion promoting layer covers the nano metal wire layer, and the adhesion promoting layer between the adjacent supporting columns is provided with a concave curved surface;
step S40: forming a routing layer, wherein the routing layer is positioned in the concave curved surface of the adhesion promoting layer.
Fig. 4 to 7 are schematic cross-sectional structure diagrams of steps of a method for manufacturing a conductive stacked structure according to an embodiment of the present invention, and please refer to fig. 4 to 7 in conjunction with fig. 4 to describe in detail the method for manufacturing a conductive stacked structure according to the present invention:
in step S10, please refer to fig. 4, a substrate 10 is provided, and a plurality of supporting pillars 20 are formed in the routing area of the substrate 10.
The substrate 10 is, for example, a flexible substrate, that is, made of a flexible material, which is a material having certain strength and certain flexibility in industry. Specifically, the substrate 10 includes but is not limited to acryl, polymethyl methacrylate (PMMA), polyacrylonitrile-butadiene-styrene (ABS), Polyamide (PA), Polyimide (PI), polybenzimidazole Polybutylene (PB), polybutylene terephthalate (PBT), Polycarbonate (PC), polyether ether ketone (PEEK), Polyetherimide (PEI), Polyethersulfone (PES), Polyethylene (PE), polyethylene terephthalate (PET), and polyethylene tetrafluoroethylene (ETFE), polyethylene oxide, polyglycolic acid (PGA), polymethylpentene (PMP), Polyoxymethylene (POM), polyphenylene ether (PPE), polypropylene (PP), Polystyrene (PS), Polytetrafluoroethylene (PTFE), Polyurethane (PU), polyvinyl chloride (PVC), polyvinyl fluoride (PVF), polyvinylidene chloride (PVDC), polyvinylidene fluoride (PVDF), styrene-acrylonitrile (SAN), or the like. In this embodiment, the flexible substrate is made of PI.
The substrate 10 includes a functional region and a routing region (also referred to as a lead region) corresponding to a visible region and a frame region of the touch panel, the routing region for example surrounding the functional region, the visible region is usually used for a transparent display, and the routing region is usually opaque.
In specific implementation, a rigid substrate such as a glass substrate may be coated with a flexible material, support pillars, a nanowire layer, and other elements may be fabricated on the flexible material, and after all processes are completed, the glass substrate under the flexible material is peeled off to form a flexible substrate; it is also possible to coat a rigid substrate such as a glass substrate with a flexible material and then peel off the glass substrate under the flexible material to form a flexible substrate.
In this embodiment, a mask plate is used as a mask, a low temperature coating technology is used to form a plurality of the supporting pillars 20 on the edge of the substrate 10, that is, the mask plate is used to expose the area of the substrate 10 where the supporting pillars 20 need to be formed and block the rest of the area, and then the low temperature coating technology is used to directly form the supporting pillars 20. The support pillar 20 is made of transparent metal oxide, and preferably, the support pillar 20 is made of ITO.
As shown in fig. 4, in the present embodiment, the supporting pillars 20 are formed in the routing areas on two opposite sides of the substrate 10, in other embodiments, the supporting pillars 20 may be formed only in the routing area on one side of the substrate 10, and the supporting pillars 20 act to increase the contact area between the subsequently formed nano-metal wire layer and the routing layer, so that the supporting pillars 20 need to be formed in the routing area of one routing layer formed on the substrate 10. In addition, in the present embodiment, two support columns 20 are shown on both sides of the substrate 10, in other embodiments, the number of the support columns 20 on each side may be three or more, and the number of the support columns 20 may be determined according to the area of the routing area. The present invention does not limit the position and number of the supporting columns 20.
In step S20, as shown in fig. 5, a nano-metal wire layer 30 is formed, the nano-metal wire layer 30 covers the substrate 10 and the supporting pillars 20, and the nano-metal wire layer 30 between adjacent supporting pillars 20 has a concave curved surface.
In this embodiment, the nano-metal solution is coated on the substrate 10, and at this time, due to the existence of the supporting pillars 20, the nano-metal solution between the adjacent supporting pillars 20 is subjected to gravity and surface tension, and the surface thereof is in a concave curved surface, i.e., a concave curved surface form, and then the nano-metal solution is cured to form the nano-metal wire layer 30, and the nano-metal wire layer 30 between the adjacent supporting pillars 20 is in a concave curved surface form.
It should be noted that the height of the supporting pillars 20, the distance between adjacent supporting pillars 20, and the thickness of the nanowire layer 30 determine whether a concave surface can be formed between adjacent supporting pillars 20, and the size of the formed concave surface, and the concave surface can be adjusted by adjusting the above parameters.
The material of the nanowire layer 30 includes, but is not limited to, a silver nanowire. In this embodiment, a nano silver wire solution may be formed on the substrate 10, and the nano silver wire solution is a suspension solution formed by dissolving a nano silver wire in a specific solvent, such as water, an aqueous solution, an ionic solution, a salt-containing solution, a supercritical fluid, oil, or a mixture thereof, and the solvent may further contain an additive such as a dispersant, a surfactant, a cross-linking agent, a stabilizer, a wetting agent, or a thickener. And then solidifying the nano silver wire solution to form a nano silver wire layer. The nano silver wire layer comprises a substrate and nano silver wires embedded in the substrate, the nano silver wires are in lap joint through molecular force to form a conductive network, and the substrate is used for protecting the nano silver wires from being influenced by external environments such as corrosion and abrasion.
The method for forming the nano silver wire solution may be one of spin coating, slit coating, blade coating, wire bar coating, spray coating, roll coating, screen printing, gravure printing, offset printing, flexo printing, pad printing, or inkjet printing, and may also be deposition, sputtering, or the like. The curing method can be natural drying, simple baking or heating curing and the like, so that the nano silver wire solution is cured to form a nano silver wire layer.
In step S30, please refer to fig. 6, an adhesion promoting layer 40 is formed, the adhesion promoting layer 40 covers the metal nanowire layer 30, and the adhesion promoting layer 40 between adjacent supporting pillars 20 has a concave curved surface.
In this embodiment, the adhesion promoting layer 40 is preferably an OC layer, and specifically, an OC solution may be formed on the substrate 10 by a coating method, the OC solution covers the nano metal wire layer 30, and since the nano metal wire layer 30 between adjacent supporting pillars 20 is a concave curved surface, the OC solution formed on the concave curved surface is also a concave curved surface, and then the OC layer is formed by heating and evaporating a solvent in the OC.
In step S40, please refer to fig. 7, a wiring layer 50 is formed, and the wiring layer 50 is located in the concave curved surface of the adhesion promoting layer 40.
In this embodiment, the routing layer 50 is formed by using a mask layer as a mask, and the material of the routing layer 50 is preferably metal. The contact surface between the routing layer 50 and the metal nanowire layer 30 is a curved surface, which can increase the contact area between the routing layer 50 and the metal nanowire layer 30, thereby improving the conductive capability.
Since a plurality of support pillars 20 are formed at the routing area of the substrate 10, when the number of the support pillars 20 at a certain side of the substrate 10 is three or more, two or more concave curved surfaces in which the routing layers 50 formed may be connected to each other are formed. For example, the mask layer exposes a routing area where a routing layer is formed, blocks other areas, and then forms routing layers 50, the routing layers 50 not only cover the concave curved surface but also are connected to each other. Of course, the routing layers 50 in the concave curved surfaces may not be connected and may be determined according to actual needs.
The method for manufacturing the conductive laminated structure provided by the invention comprises forming a plurality of supporting pillars 20 on the wiring region of the substrate 10, forming a nano-metal wire layer 30 on the substrate 10 and the supporting pillars 20, wherein the nano-metal wire layer 30 between adjacent supporting pillars 20 is formed into a concave surface under the action of gravity and surface tension, an adhesion promoting layer 40 is then formed on the nanowire layer 30, the adhesion promoting layer 40 covering the nanowire layer 30, and the adhesion promoting layer 40 between the adjacent supporting pillars 20 also has a concave curved surface, and then a routing layer 50 is formed in the concave curved surface of the adhesion promoting layer 40, the contact surface of the routing layer 50 and the nano metal wire layer 30 is a curved surface, on the premise of not increasing the width of the frame, the contact area between the routing layer 50 and the nano-metal wire layer 30 can be increased, so that the conductive capability of the nano-metal wire layer 30 is improved.
Correspondingly, the invention also provides a manufacturing method of the touch panel, which comprises the manufacturing method of the conductive laminated structure.
In summary, in the conductive stacked structure, the manufacturing method thereof, and the display device provided by the present invention, a plurality of support pillars are formed in the routing area of the substrate, the metal nanowire layers are formed on the substrate and the support pillars, the metal nanowire layers between adjacent support pillars are subjected to the action of gravity and surface tension, the surface of each metal nanowire layer is a concave surface, then an adhesion promoting layer is formed on each metal nanowire layer, the adhesion promoting layer covers the metal nanowire layers, the adhesion promoting layer between adjacent support pillars also has a concave surface, then a routing layer is formed in the concave surface of the adhesion promoting layer, and the contact surface between the routing layer and the metal nanowire layers is a curved surface.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (10)
1. An electrically conductive laminated structure, comprising:
a substrate;
the supporting columns are positioned in the wiring area of the substrate;
the nano metal wire layer covers the substrate and the supporting columns, and the nano metal wire layer between every two adjacent supporting columns is provided with a concave curved surface;
the adhesion promotion layer covers the nano metal wire layer, and the adhesion promotion layer between the adjacent supporting columns is provided with a concave curved surface; and
a routing layer located within the concave curvature of the adhesion promotion layer.
2. The conductive laminate structure of claim 1, wherein at least two sets of support posts are disposed in the routing region in a direction perpendicular to the routing region.
3. The conductive stack of claim 2, wherein each group of support posts comprises a plurality of support posts arranged along the extending direction of the routing region, and the support posts have a block-shaped bump structure.
4. The conductive laminate structure of claim 2, wherein each set of support posts comprises one or more support posts having a fin structure extending in a direction parallel to a respective edge of the substrate.
5. The conductive laminate structure of claim 1, wherein an upper surface of the routing region is flush with an upper surface of an adhesion promotion layer located above the support posts.
6. The conductive stack of claim 1, wherein the support posts are made of a transparent metal oxide.
7. The conductive stack of claim 6, wherein the support posts are ITO.
8. The conductive stack of claim 1, wherein the layer of nanometal lines comprises stacked nanosilver lines.
9. A method of making a conductive laminate structure, comprising:
providing a substrate, and forming a plurality of supporting columns in a wiring area of the substrate;
forming a nano metal wire layer, wherein the nano metal wire layer covers the substrate and the supporting columns, and the nano metal wire layer between adjacent supporting columns is provided with a concave curved surface;
forming an adhesion promoting layer, wherein the adhesion promoting layer covers the nano metal wire layer, and the adhesion promoting layer between the adjacent supporting columns is provided with a concave curved surface; and
forming a routing layer, wherein the routing layer is positioned in the concave curved surface of the adhesion promoting layer.
10. A display device characterized in that it comprises the conductive laminated structure of any one of claims 1 to 8.
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| JP2019121311A (en) * | 2018-01-11 | 2019-07-22 | シャープ株式会社 | Substrate, display device and method for producing substrate |
| CN110308820B (en) * | 2019-06-28 | 2021-02-12 | 云谷（固安）科技有限公司 | Touch structure, display panel and display device thereof |
| TWI751757B (en) * | 2020-10-23 | 2022-01-01 | 大陸商宸美（廈門）光電有限公司 | Touch panel and touch device |
| US11543902B2 (en) | 2020-11-27 | 2023-01-03 | Tpk Advanced Solutions Inc. | Touch panel and touch device |
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