CN114283683B - Cover plate assembly, cover plate assembly preparation method and display device - Google Patents
Cover plate assembly, cover plate assembly preparation method and display device Download PDFInfo
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- CN114283683B CN114283683B CN202111569231.0A CN202111569231A CN114283683B CN 114283683 B CN114283683 B CN 114283683B CN 202111569231 A CN202111569231 A CN 202111569231A CN 114283683 B CN114283683 B CN 114283683B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 238000005452 bending Methods 0.000 claims abstract description 64
- 230000005389 magnetism Effects 0.000 claims abstract description 21
- 239000006249 magnetic particle Substances 0.000 claims description 29
- 239000003446 ligand Substances 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 11
- -1 iron ions Chemical class 0.000 claims description 9
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 239000000084 colloidal system Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000002894 chemical waste Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Abstract
The invention discloses a cover plate assembly, a cover plate assembly preparation method and a display device, wherein the cover plate assembly is provided with a bending area and comprises the following components: the cover plate body is provided with a slot on the surface thereof in the bending area; and the filling medium is filled in the grooves and comprises a plurality of magnetic units with the same magnetism. Deformation space can be reserved for bending deformation of the cover plate body through slotting, and stress concentration is avoided. The invention is further provided with the filling medium in the groove, and the filling medium can absorb part of bending stress through self deformation. However, a part of bending stress absorbed by the filling medium through deformation of the filling medium is limited, so that in order to further reduce stress generated by bending, the filling medium comprises a plurality of magnetic units with the same magnetism, repulsive force is arranged among the magnetic units with the same magnetism, and the risk of cover plate body breakage caused by rapid concentration of stress generated by bending can be reduced through repulsive force among the magnetic units.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a cover plate assembly, a cover plate assembly manufacturing method and a display device.
Background
At present, a CPI (Colorless Polyimide) material is mainly adopted as a flexible mobile phone cover plate material, but the abrasion resistance of a folding screen is easy to scratch, and the touch feeling and crease phenomenon of the surface plastic are required to be improved. The common glass is a brittle material, but when the thickness of the glass is less than or equal to 100 mu m, the glass has flexibility and can be bent and wound, namely has flexibility and certain rigidity. At present, the ultrathin glass UTG (Ultra Thin Glass) is expected to become the preferred choice of the novel folding mobile phone cover plate. However, when the screen is bent, the UTG cover plate still has the essential defect of brittle fracture of glass due to the limitation of physical properties of materials, and the risk of fragments splashing is caused.
Therefore, a new cover plate assembly, a method for manufacturing the cover plate assembly, and a display device are needed.
Disclosure of Invention
The embodiment of the invention provides a cover plate assembly, a cover plate assembly preparation method and a display device, wherein deformation space can be reserved for bending deformation of a cover plate body through slotting, and stress concentration is avoided. However, if only the slot is provided, the part of the cover plate body forming the slot is subjected to larger bending stress when being bent, and in order to avoid the situation, the invention is further provided with a filling medium in the slot, and the filling medium can absorb part of the bending stress through self deformation. However, a part of bending stress absorbed by the filling medium through deformation of the filling medium is limited, so that in order to further reduce stress generated by bending, the filling medium comprises a plurality of magnetic units with the same magnetism, repulsive force is arranged among the magnetic units with the same magnetism, and the risk of cover plate body breakage caused by rapid concentration of stress generated by bending can be reduced through repulsive force among the magnetic units.
In one aspect, an embodiment of the present invention provides a cover plate assembly having a bending region, the cover plate assembly including: the cover plate body is positioned in the bending area, and a slot is formed in the surface of the cover plate body; and the filling medium is filled in the grooves and comprises a plurality of magnetic units with the same magnetism.
According to one aspect of the invention, the cover assembly has a planar region disposed adjacent the inflection region, the slot having a depth less than or equal to three-fifths of the thickness of the cover body in the direction along the thickness of the cover body.
According to one aspect of the present invention, the cover plate body located in the planar region has a thickness of 90 μm to 110 μm in a direction along the thickness of the cover plate body; and/or the depth of the groove is 50-70 μm.
According to one aspect of the invention, the magnetic units comprise magnetic particles and a plurality of metal molecular ligands uniformly distributed around the magnetic particles, and the cover plate body is in a bending state, and adjacent magnetic units are pressed to exchange the metal molecular ligands; the distance between the adjacent magnetic units is 20 nm-600 nm; the volume fraction of the magnetic units in the filling medium is greater than or equal to 25%.
According to one aspect of the invention, the magnetic units have a particle size of 50nm to 150nm.
According to one aspect of the invention, the magnetic particles comprise magnetic iron oxide and the metal molecule ligands comprise iron ions.
According to one aspect of the invention, the open cross-sectional area of the slot increases gradually in a direction along the thickness of the cover plate body.
In another aspect, the embodiment of the invention provides a method for preparing a cover plate assembly, which comprises the following steps: providing a cover plate body to be processed; forming a slot in a bending region of the cover plate body to be processed; filling a filling medium in the grooves, wherein the filling medium comprises a plurality of magnetic units with the same magnetism.
According to another aspect of the present invention, the filling medium includes a colloid, the magnetic units are uniformly dispersed in the colloid, and after the filling medium is filled in the grooves, the filling medium further includes: and curing the filling medium.
In still another aspect, a display device according to an embodiment of the present invention includes: the cover plate assembly is the cover plate assembly in any embodiment; and the cover plate component is arranged on the light emitting side of the display panel.
Compared with the prior art, the cover plate assembly provided by the embodiment of the invention comprises the cover plate body and the filling medium, wherein the filling medium is filled in the grooves of the cover plate body in the bending area, and when the cover plate body bends towards one side where the grooves are formed, as the grooves are formed in the bending area, deformation space can be reserved for bending deformation of the cover plate body through the grooves, so that stress concentration is avoided. However, if only the slot is provided, the part of the cover plate body forming the slot is subjected to larger bending stress when being bent, and in order to avoid the situation, the invention is further provided with a filling medium in the slot, and the filling medium can absorb part of the bending stress through self deformation. However, a part of bending stress absorbed by the filling medium through deformation of the filling medium is limited, so that in order to further reduce stress generated by bending, the filling medium comprises a plurality of magnetic units with the same magnetism, repulsive force is arranged among the magnetic units with the same magnetism, and the risk of cover plate body breakage caused by rapid concentration of stress generated by bending can be reduced through repulsive force among the magnetic units.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a schematic view of a cover assembly according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a structure of a magnetic unit before bending a cover assembly according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a state of a magnetic unit in a bending process of a cover assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a bent magnetic unit of the cover assembly according to an embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing a cover plate assembly according to an embodiment of the present invention.
In the accompanying drawings:
1-a cover plate body; 2-filling medium; a 3-magnetic unit; 31-magnetic particles; 32-metal molecule ligands; k-slotting; a PA-planar region; WA-inflection region.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are merely configured to illustrate the invention and are not configured to limit the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by showing examples of the invention.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
It will be understood that when a layer, an area, or a structure is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or another layer or area can be included between the layer and the other layer, another area. And if the component is turned over, that layer, one region, will be "under" or "beneath" the other layer, another region.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims (the claims) and their equivalents. The embodiments provided by the embodiments of the present invention may be combined with each other without contradiction.
The embodiment of the invention provides a cover plate assembly, a cover plate assembly preparation method and a display device, and the cover plate assembly, the cover plate assembly preparation method and the display device are described below with reference to fig. 1 to 5.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a cover assembly according to an embodiment of the invention. The apron subassembly has the district WA of buckling, and the apron subassembly includes: the cover plate body 1 is positioned in the bending area WA, and a slot K is formed in the surface of the cover plate body 1; and the filling medium 2 is filled in the grooves K, and the filling medium 2 comprises a plurality of magnetic units 3 with the same magnetism.
The cover plate assembly provided by the embodiment of the invention comprises the cover plate body 1 and the filling medium 2, wherein the filling medium 2 is filled in the groove K of the cover plate body 1 positioned in the bending area WA, and when the cover plate body 1 bends towards one side where the groove K is positioned (bending direction shown by an arrow in fig. 1), as the groove K is arranged in the bending area WA, a deformation space can be reserved for bending deformation of the cover plate body 1 through the groove K, so that stress concentration is avoided. However, if only the slot K is provided, the part of the cover plate body 1 forming the slot K is subjected to larger bending stress during bending, and in order to avoid such a situation, the filling medium 2 is further provided in the slot K, and the filling medium 2 can absorb a part of the bending stress through deformation of the filling medium 2. However, the filling medium 2 absorbs a part of bending stress through deformation of the filling medium 2, so that in order to further reduce stress caused by bending, the filling medium 2 in the embodiment of the invention comprises a plurality of magnetic units 3 with the same magnetism, repulsive force exists among the magnetic units 3 with the same magnetism, and the repulsive force among the magnetic units 3 can reduce the risk of the cover plate body 1 being broken due to rapid concentration of stress caused by bending.
It should be noted that, the cover plate body 1 is a film layer made of Glass with high light transmittance, and plays a role in protecting a display screen, specifically, the cover plate body 1 can be made of a flexible material, so that the cover plate can be folded, and can be applied to a flexible and foldable display module, specifically, the cover plate body 1 can be made of a transparent, soft and foldable material such as UTG (Ultra Thin Glass), CPI (Colorless Polyimide, transparent polyimide film), PET (Polyethylene Terephthalate ), and the like, so as to realize flexible folding of the cover plate, and be applied to a foldable display device conveniently. The cover plate assembly provided by the embodiment of the invention is illustrated by taking UTG (Ultra Thin Glass) as an example of the cover plate body 1.
The filling medium 2 may be specifically an organic adhesive such as polyimide or OCA (Optically Clear Adhesive, optical adhesive), which has a relatively soft texture and a certain elasticity, and can effectively absorb a part of bending stress.
In order to avoid the slots K from significantly affecting the overall structural strength of the cover body 1, in some alternative embodiments, the cover assembly has a planar area PA disposed adjacent to the inflection area WA, the depth of the slots K being less than or equal to three-fifths of the thickness of the cover body 1 located in the planar area PA, in the direction along the thickness of the cover body 1.
It will be appreciated that the thickness of the part of the cover plate body 1 provided with the slot K will be thinner than the thickness of the part of the cover plate body 1 not provided with the slot K, and the thickness of the part of the cover plate body 1 provided with the slot K is too thin to affect the service life of the cover plate assembly and is easy to bend and break under stress, so in this embodiment, the depth of the slot K is limited to be less than or equal to three fifths of the thickness of the cover plate body 1 of the planar area PA, so as to ensure that the part of the cover plate body 1 provided with the slot K has sufficient thickness. Alternatively, the cover plate body 1 located in the planar area PA has a thickness of 90 μm to 110 μm in a direction along the thickness of the cover plate body 1; and/or the depth of the slot K is 50-70 μm. Specifically, when the thickness of the cover plate body 1 of the planar area PA is 100 μm, the depth of the slot K is 60 μm, that is, the thickness of the portion of the cover plate body 1 where the slot K is opened is 40 μm, and the thickness of the portion of the cover plate body 1 where the slot K is not provided is 100 μm. Optionally, the width of the slot K is less than or equal to 8mm.
To further improve the stability of the cover assembly when bent, in some alternative embodiments, the magnetic units 3 comprise magnetic particles 31 and a plurality of metal molecular ligands 32 uniformly distributed around the magnetic particles 31, and the cover body 1 is in a bent state, and adjacent magnetic units 3 are pressed to exchange the metal molecular ligands 32.
It should be noted that, there is a magnetic attraction force between the magnetic particles 31 and the metal molecular ligands 32, and the magnetism of each magnetic particle 31 is the same, so that the magnetism of each metal molecular ligand 32 is the same, and each metal molecular ligand 32 has a mutual repulsive force, so that the magnetic attraction force and the mutual repulsive force are balanced, and each metal molecular ligand 32 is uniformly distributed around the magnetic particle 31. Specifically, as shown in fig. 2, fig. 2 is a schematic structural diagram of a state of a magnetic unit 3 before bending a cover assembly according to an embodiment of the present invention, where each metal molecule ligand 32 is located on a first track and uniformly distributed around a magnetic particle 31. When the cover body 1 is in a bending state, the magnetic unit 3 is subjected to external pressure, so that the balance between the magnetic particles 31 and some of the metal molecular ligands 32 is destroyed, and the metal molecular ligands 32 are separated from the first tracks of the corresponding magnetic particles 31 and move towards the adjacent other magnetic particles 31, as shown in fig. 3, fig. 3 is a schematic structural diagram of the state of the magnetic unit 3 in the bending process of the cover assembly provided by the embodiment of the invention, that is, the metal molecular ligands 32 separated from the original magnetic particles 31 are closer to the adjacent other magnetic particles 31, so that the magnetic attraction of the adjacent other magnetic particles 31 to the metal molecular ligands 32 separated from the original magnetic particles 31 is greater, so that the metal molecular ligands 32 separated from the original magnetic particles 31 are dynamically balanced again around the adjacent other magnetic particles 31, that is, under different bending degrees of the cover assembly, the number of the metal molecular ligands 32 with position exchange is also changed due to different bending degrees, that is, the greater the number of the metal molecular ligands 32 with position exchange is achieved, and the dynamic balance between the magnetic particles 31 and the metal molecular ligands 32 is improved. As shown in fig. 4, fig. 4 is a schematic structural diagram of a state of a magnetic unit 3 after bending a cover assembly according to an embodiment of the present invention, which is greatly beneficial to bending and avoids rapid stress concentration caused by bending.
Alternatively, the distance between the adjacent magnetic units 3 is 20nm to 600nm, and the distance between the adjacent magnetic units 3 should not be too large, which may cause that the metal molecular ligands 32 forced to separate from the original magnetic particles 31 cannot be attracted by the adjacent other magnetic particles 31, and are re-balanced. In particular, the distance between adjacent magnet units 3 may be 100nm.
In some alternative embodiments, the volume ratio of the magnetic units 3 in the filling medium 2 is 25% -50%, it is understood that the volume ratio of the magnetic units 3 in the filling medium 2 should not be too small, and the number of the magnetic units 3 is too small if the distance is too small, so that the repulsive force generated by the magnetic units 3 is too small, which is disadvantageous for reducing the bending stress. The volume ratio of the magnetic unit 3 in the filling medium 2 is not too large, and too large a volume ratio may cause too large repulsive force generated by the magnetic unit 3, which is not beneficial to bending of the cover plate assembly. Alternatively, the volume fraction of the magnetic units 3 in the filling medium 2 is 30%.
In some alternative embodiments, the particle size of the magnetic units 3 is 50nm to 150nm, and the particle size of the magnetic units 3 should not be too large to be able to arrange enough magnetic units 3 in the filling medium 2, ensuring that the magnetic units 3 provide enough repulsive force to reduce the stress due to bending. The particle diameter of the magnetic unit 3 is understood to be the distance from the center of the magnetic particle 31 to the center of the metal molecular ligand 32. Alternatively, the particle size of the magnetic unit 3 is 100nm.
To achieve the magnetic properties of the magnetic unit 3 and the pressurized exchange of the metal molecular ligands 32, in some alternative embodiments the magnetic particles 31 comprise magnetic iron oxide and the metal molecular ligands 32 comprise iron ions. It will be appreciated that magnetic iron oxide, i.e. magnetic Fe 2 O 3 The iron ion can be positive 3-valent iron ion, magnetic Fe 2 O 3 Can generate attractive force for the positive 3-valent iron ions and repulsive force between the positive 3-valent iron ions, and can keep the positive 3-valent iron ions in magnetism Fe 2 O 3 And the surrounding fixed rail.
For better relief of the bending stresses, in some alternative embodiments the open cross-sectional area of the slot K increases gradually in the direction along the thickness of the cover body 1.
It can be understood that the cross-sectional area of the bottom of the slot K is smaller than the cross-sectional area of the top opening of the slot K, the cover plate body 1 is bent towards the side where the top opening of the slot K is located, that is, the deformation and bending stress of the cover plate body 1 on the side where the top opening of the slot K is located are relatively larger, the slot K is set to be in a structure form that the cross-sectional area of the opening is gradually increased in the direction from the surface of the side where the cover plate body 1 is provided with the slot K to the opposite surface of the cover plate body 1, and the bending stress generated when the cover plate body 1 is bent can be better released.
Optionally, the slot K is a trapezoid slot, and the bottom angle of the slot K is greater than or equal to 120 °, so that a space is reserved for deformation of the cover plate body 1 during bending, and the cover plate body 1 is convenient to bend.
Referring to fig. 5, fig. 5 is a flowchart of a method for manufacturing a cover assembly according to an embodiment of the invention. The embodiment of the invention also provides a preparation method of the cover plate assembly, which comprises the following steps:
s110: providing a cover plate body 1 to be processed;
s120: forming a slot K in a bending area WA of the cover plate body 1 to be processed;
s130: the filling medium 2 is filled in the slot K, and the filling medium 2 includes a plurality of magnetic units 3 having the same magnetism.
According to the preparation method of the cover plate assembly, the filling medium 2 is filled and solidified in the groove K, and the plurality of magnetic units 3 with the same magnetism are formed in the filling medium 2, so that when the cover plate body 1 bends towards the side where the groove K is located, due to the fact that the groove K is arranged in the bending area WA, deformation space can be reserved for bending deformation of the cover plate body 1 through the groove K, and stress concentration is avoided. Meanwhile, the filling medium 2 is arranged in the slot K, the filling medium 2 can absorb part of bending stress through deformation of the filling medium 2, the filling medium 2 comprises a plurality of magnetic units 3 with the same magnetism, repulsive force is arranged between the magnetic units 3 with the same magnetism, and the risk that the cover plate body 1 is broken due to rapid concentration of stress generated by bending can be reduced by repulsive force between the magnetic units 3.
In step S110, the cover plate body 1 to be processed may be made of UTG (Ultra Thin Glass) material, specifically UTG material with a thickness of 100 μm throughout and without reinforcement.
In step S120, the cover plate body 1 to be processed is etched to form the slot K, and specifically, dry etching or wet etching may be adopted, where the difference between the dry etching and the wet etching is that the wet etching uses a solvent or a solution for etching. Wet etching is a purely chemical reaction process, which means that the etching purpose is achieved by removing the parts not masked by the masking film material by using a chemical reaction between the solution and the pre-etching material. The method has the advantages of good selectivity, good repeatability, high production efficiency, simple equipment and low cost. And dry etching is of a wide variety including photo-evaporation, vapor phase etching, plasma etching, etc. The dry etching has the advantages that: the method has the advantages of good anisotropism, high selection ratio, good controllability, flexibility and repeatability, safe operation of the thin wire, easy realization of automation, no chemical waste liquid, no pollution in the treatment process and high cleanliness. In this embodiment, dry etching or wet etching may be selected according to actual conditions.
After the groove K is formed, the cover plate body 1 to be processed can be chemically strengthened, and the internal stress of the cover plate body 1 to be processed is eliminated by a high-temperature annealing process, so that the strengthened cover plate body 1 to be processed has high hardness.
In some alternative embodiments, the filling medium 2 comprises a gel, the magnetic units 3 are uniformly dispersed in the gel, and after filling the slot with the filling medium, the method further comprises: the filling medium is cured. The colloid specifically may be polyimide, which has a relatively soft texture and a certain elasticity, and can effectively absorb a part of bending stress, and meanwhile, since the colloid such as polyimide has a certain viscosity, the colloid can better accommodate the fixed magnetic unit 3, and of course, the filling medium 2 may also be made of other materials, without special limitation. Where the filling medium 2 comprises a gel, curing of the filling medium 2 is required to avoid a flow of the filling medium 2. It should be noted that curing is a general technique in the art, and specific curing temperatures and conditions are adjusted according to actual situations.
The embodiment of the invention also provides a display device, which comprises: the cover plate assembly and the display panel are provided by any one of the embodiments; the cover plate component is arranged on the light-emitting side of the display panel.
The display device provided in the embodiment of the present invention has the technical effects of the technical solution of the cover plate assembly in any of the above embodiments, and the explanation of the same or corresponding structure and terms as those of the above embodiments is not repeated herein. The display device provided by the embodiment of the invention can be a mobile phone or any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, medical equipment, industrial control equipment, touch interactive terminal, etc., which are not particularly limited in this embodiment of the invention.
In the foregoing, only the specific embodiments of the present invention are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present invention is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present invention, and they should be included in the scope of the present invention.
It should also be noted that the exemplary embodiments mentioned in this disclosure describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, or may be performed in a different order from the order in the embodiments, or several steps may be performed simultaneously.
Claims (11)
1. A cover assembly having a inflection region, the cover assembly comprising:
the cover plate body is positioned in the bending area, and a slot is formed in the surface of the cover plate body;
the filling medium is filled in the grooves and comprises a plurality of magnetic units with the same magnetism, wherein the magnetic units comprise magnetic particles and a plurality of metal molecular ligands uniformly distributed around the magnetic particles; and when the cover plate body is in a bending state, the adjacent magnetic units are pressed to exchange the metal molecular ligand.
2. The cover assembly of claim 1, wherein the cover assembly has a planar region disposed adjacent the inflection region, the slot having a depth of less than or equal to three-fifths of the thickness of the cover body in the planar region along the thickness of the cover body.
3. The cover plate assembly according to claim 2, wherein the cover plate body at the planar region has a thickness of 90 μm to 110 μm in a direction along the thickness of the cover plate body; and/or the depth of the groove is 50-70 μm.
4. The cover plate assembly of claim 1, wherein a distance between adjacent magnetic units is 20nm to 600nm.
5. The cover plate assembly of claim 1, wherein the volume fraction of the magnetic units in the fill medium is 25% to 50%.
6. The cover plate assembly of claim 1, wherein the magnetic units have a particle size of 50nm to 150nm.
7. The cover plate assembly of claim 1 wherein the magnetic particles comprise magnetic iron oxide and the metal molecular ligands comprise iron ions.
8. The cover assembly of claim 1, wherein the open cross-sectional area of the slot increases gradually in a direction along the thickness of the cover body.
9. The preparation method of the cover plate assembly is characterized by comprising the following steps of:
providing a cover plate body to be processed;
forming a slot in a bending region of the cover plate body to be processed;
filling a filling medium in the grooves, wherein the filling medium comprises a plurality of magnetic units with the same magnetism, and the magnetic units comprise magnetic particles and a plurality of metal molecular ligands uniformly distributed around the magnetic particles; and when the cover plate body is in a bending state, the adjacent magnetic units are pressed to exchange the metal molecular ligand.
10. The method of manufacturing a closure assembly of claim 9, wherein,
the filling medium comprises a colloid, the magnetic units are uniformly dispersed in the colloid, and the filling medium is filled in the grooves and then the filling medium further comprises: and curing the filling medium.
11. A display device, comprising:
a cover plate assembly according to any one of claims 1 to 9;
and the cover plate component is arranged on the light emitting side of the display panel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111569231.0A CN114283683B (en) | 2021-12-21 | 2021-12-21 | Cover plate assembly, cover plate assembly preparation method and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111569231.0A CN114283683B (en) | 2021-12-21 | 2021-12-21 | Cover plate assembly, cover plate assembly preparation method and display device |
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| CN114283683A CN114283683A (en) | 2022-04-05 |
| CN114283683B true CN114283683B (en) | 2023-10-24 |
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| KR20200138485A (en) * | 2019-05-29 | 2020-12-10 | 삼성디스플레이 주식회사 | Housing member and flexible display device including the same |
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| CN114283683A (en) | 2022-04-05 |
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