CN114260533A - Method for air sealing cover of cavity type pipe cap millimeter wave module - Google Patents
Method for air sealing cover of cavity type pipe cap millimeter wave module Download PDFInfo
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- CN114260533A CN114260533A CN202111444886.5A CN202111444886A CN114260533A CN 114260533 A CN114260533 A CN 114260533A CN 202111444886 A CN202111444886 A CN 202111444886A CN 114260533 A CN114260533 A CN 114260533A
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Abstract
The invention relates to a method for a cavity type tube cap millimeter wave module air sealing cover, which adopts quantitative solder frame vacuum brazing to enable a tube cap and a metal plating layer on the surface of a tube shell to form metallurgical bonding, thereby realizing air sealing cover. The process of the invention is as follows: the welding flux frame with the prefabricated welding flux is arranged in a sealing area of a tube shell of the millimeter wave module to be sealed, then a tube cap is picked up and accurately pasted on the tube shell by a chip mounter, the tube cap is transferred to a vacuum brazing furnace by using a special tray after the tube cap is completed, and the tube shell, a tube cap metal layer and brazing filler metal are brazed and sealed in a high-purity nitrogen atmosphere after the tube cap is vacuumized. And after the sealing cover is finished, the quality of the sealing cover is determined through leak detection. The problem of the air tightness sealing cover of the millimeter wave module with the ceramic cavity pipe cap is effectively solved, and an efficient and highly reliable method is provided for the air tightness sealing cover of the millimeter wave module with the ceramic cavity pipe cap.
Description
Technical Field
The invention discloses a method for an air sealing cover of a cavity type pipe cap millimeter wave module, and belongs to the technical field of micro-assembly and packaging of microwave modules and components.
Background
The microwave millimeter wave module is an important component of electronic components for radar, aircrafts and the like, and plays key functions of transceiving, frequency conversion and the like. Inside the microwave millimeter wave module, the integration, miniaturization and high density are currently developed, so that the internal multipurpose bare chip is mounted on the substrate and interconnected through the MCM process. After the components such as the internal bare chip and the like are assembled, in order to prevent environmental corrosion and mechanical damage, the module must be hermetically sealed, so that the long-term high and reliable work of the microwave millimeter wave module is ensured. Under the millimeter wave frequency band, the resonance characteristic is an index with high difficulty, and the module pipe cap and the cavity are made of ceramic materials, so that the problem of the resonance characteristic under the millimeter wave can be effectively solved. However, the pipe cap with the ceramic cavity cannot be sealed by conventional airtight sealing technology such as laser seam welding and parallel sealing because metal sealing cannot be performed, and the long-term airtightness of the module cannot be ensured because the glue sealing cannot prevent gas permeation. In the field of solder gas seal welding, the Au80Sn20 eutectic solder is a high-reliability solder widely used in the field of electronic packaging. However, in order to realize high-precision signal transmission of electronic components, a high-density interconnection bare chip is often arranged in an inner cavity circuit of a millimeter wave module, and the multi-chip assembly is realized by means of bonding of conductive silver paste, which cannot bear the melting temperature (about 300 ℃) of Au80Sn20 at present. Therefore, the efficient implementation of the airtight sealing cover of such high-density millimeter wave module is one of the key points for realizing high-frequency electronic and electrical signal functions.
Disclosure of Invention
The invention provides a method for a cavity type tube cap millimeter wave module air sealing cover, which aims to overcome the defects in the prior art and adopts a quantitative Sn96.5Ag3Cu0.5 solder frame vacuum brazing method, so that the tube cap and a metal coating layer on the surface of a tube shell form metallurgical bonding while reducing the gradient of a multichip assembly process in a cavity, and high-purity nitrogen is filled in the cavity, thereby realizing the high-efficiency air-tight sealing cover of the cavity type tube cap millimeter wave module, and being particularly suitable for the air-tight sealing cover of a millimeter wave module of a non-planar tube cap containing a ceramic cavity. .
The technical solution of the invention is as follows: a method for using for the gaseous sealed lid of millimeter wave module of body style pipe cap, use quantitative solder frame vacuum braze welding make pipe cap and tube surface metal coating layer form metallurgical bonding, realize the airtight closing cap of millimeter wave module of body style pipe cap, include the following step specifically:
(1) prefabricating a Sn96.5Ag3Cu0.5 solder sheet, wherein the length and the width are less than the size of a sealing area of the tube shell, and the thickness is 0.06mm to obtain a solder frame;
(2) placing the solder frame in a sealing area of the tube shell to be sealed and covered;
(3) mounting the tube cap on the tube shell/welding material frame;
(4) transferring the tray to a vacuum brazing furnace, and completing brazing sealing between the tube shell and the tube cap metal layer and the brazing filler metal in a high-purity nitrogen atmosphere;
(5) the capping process ends.
The pipe cap of the millimeter wave module comprises a ceramic cavity, the thickness of the Ni layer on the surface of the pipe cap is 2-8 mu m, and the thickness of the Au layer is more than 0.8 mu m.
The tube shell of the millimeter wave module is of a planar structure and does not contain a metal or ceramic cavity, the thickness of a Ni layer on the surface of the tube shell is 2-8 mu m, and the thickness of an Au layer is larger than 0.8 mu m.
The solder frame comprises Sn96.5Ag3Cu0.5, and the soldering flux accounts for 1% of the weight of the alloy solder.
The size of the solder frame is 0.1mm of single-side retraction relative to the sealing area of the tube shell.
The ceramic cavity tube cap is placed on the tube shell/welding flux frame, and a high-precision chip mounter is used for carrying out accurate alignment and surface mounting.
The capping process is completed in a vacuum brazing furnace, the preheating zone after the volatilization of the soldering flux is exhausted, and the brazing filler metal is melted to keep the vacuum furnace filled with high-purity nitrogen.
And (5) after the capping program is finished, detecting airtightness to determine the capping quality.
The invention has the beneficial effects that:
(1) the invention has flexible operation and strong universality, can finish the sealing process by a chip mounter and a vacuum brazing furnace which are commonly used equipment of a microelectronic assembly line, is not limited by special sealing and welding equipment, can finish the sealing process by using a vacuum brazing furnace which is commonly used equipment for brazing, and can be effectively applied to small-batch and large-scale production.
(2) The welding sealing cover has strong designability, and can realize the brazing sealing cover of millimeter wave modules with different specifications and sizes through the design of the welding frame.
(3) Compared with Au80Sn20 eutectic solder commonly used in the industry, the alloy solder with relatively low melting point is adopted to realize air-tight sealing, which is beneficial to leaving enough process assembly windows for internal circuit assembly.
(4) A feasible airtight sealing and welding method is provided for the millimeter wave module needing the ceramic cavity cover plate, and the application of the module with good high-frequency characteristics can be further popularized. Compared with the commonly used glue sealing cover plate mode of the high-frequency module, the long-term sealing performance and the reliability are obviously superior.
Drawings
Fig. 1 is a schematic structural diagram of a cavity type tube cap millimeter wave module cover provided by the embodiment of the invention.
Wherein, the reference numerals in the figure, 1 is a millimeter wave module cavity type pipe cap, 2 is a solder frame, and 3 is a millimeter wave module pipe shell.
Fig. 2 is an X-Ray photograph of the cavity type tube cap millimeter wave module provided by the embodiment of the invention after being covered.
Detailed Description
Placing a welding flux frame with prefabricated soldering flux in a tube sealing area of a millimeter wave module to be sealed, then accurately picking up and accurately mounting a tube cap on the tube by using a chip mounter, transferring the tube cap to a vacuum brazing furnace by using a special tray after the tube cap is completely picked up, and performing brazing sealing between the tube cap, a tube cap metal layer and brazing filler metal in a high-purity nitrogen atmosphere after the tube cap and the tube cap are vacuumized.
The method specifically comprises the following steps:
(1) a sn96.5ag3cu0.5 solder frame of 1 wt.% flux was preformed.
(2) And accurately placing the solder frame in the sealing area of the tube shell to be sealed.
(3) And (4) picking up the tube cap by using a high-precision chip mounter and accurately mounting the tube cap on the tube shell/solder frame.
(4) And transferring the tube shell and the tube cap to a vacuum brazing furnace by using a special tray, and completing the brazing sealing between the tube shell and the tube cap metal layer and the brazing filler metal in a high-purity nitrogen atmosphere.
(5) And after the capping program is finished, detecting the air tightness according to corresponding conditions of the national military standard.
The pipe cap of the millimeter wave module comprises a ceramic cavity, and the resonance performance of the device in a millimeter wave frequency band is improved. The thickness of the Ni layer on the surface of the tube cap is 2-8 mu m, and the thickness of the Au layer is more than 0.8 mu m.
The tube shell of the millimeter wave module is of a planar structure and does not contain a metal or ceramic cavity, the thickness of a Ni layer on the surface of the tube shell is 2-8 mu m, and the thickness of an Au layer is larger than 0.8 mu m.
The solder frame for sealing comprises Sn96.5Ag3Cu0.5, and the soldering flux accounts for 1% of the weight of the alloy solder.
The size of the welding material frame for sealing is 0.1mm of single-side retraction relative to the sealing area of the tube shell.
The ceramic cavity tube cap is placed on the tube shell/welding flux frame, and a high-precision chip mounter is preferably selected for precise alignment and mounting.
The millimeter wave module sealing process is finished in a vacuum brazing furnace, the preheating area after the soldering flux is volatilized needs to be exhausted, and high-purity nitrogen is filled in the vacuum furnace when the brazing filler metal is molten.
Example 1
(1) And prefabricating a Sn96.5Ag3Cu0.5 solder frame with 1 wt.% of soldering flux, wherein the single side is retracted by 0.1mm according to the size of a sealing area of the tube shell, and the thickness is 0.06 mm.
(2) And accurately placing the solder frame in the sealing area of the tube shell to be sealed.
(3) And (4) picking up the tube cap by using a high-precision chip mounter and accurately mounting the tube cap on the tube shell/solder frame.
(4) And transferring the special tray to a vacuum brazing furnace, and finishing brazing sealing between the tube shell and the tube cap metal layer and the brazing filler metal in a high-purity nitrogen environment to ensure stable pressure in the cavity.
(5) And after the capping program is finished, detecting the air tightness according to corresponding conditions of the national military standard.
In the embodiment, the solder frame component is Sn96.5Ag3Cu0.5, and the weight ratio of the soldering flux to the alloy solder is 1%.
In this embodiment, the solder frame size should be one-sided retracted 0.1mm relative to the package sealing area. The Ni layer thickness on the surface of the tube cap is 3 μm, and the Au layer thickness is 1 μm. The Ni layer on the surface of the tube shell is 3 μm thick, and the Au layer is more than 1 μm thick.
In this embodiment, the millimeter wave module capping process should be completed in a vacuum brazing furnace, the preheating zone after the volatilization of the flux should be vented, and the whole process of the solder melting should be kept filled with high-purity nitrogen gas.
Fig. 2 is an X-Ray photograph of the millimeter wave module in the embodiment after being capped, and it can be seen that no obvious cavity exists in the capping interface, the total cavity rate is less than 25%, and the single cavity rate is not more than 10%. The leakage rate of the covered microwave module is detected, and the leakage rate of the leakage detection result is less than 1 multiplied by 10-9Pa·m3And/s, meets the requirement of airtightness in the method 1014.2 in the GJB 548.
Claims (8)
1. A method for using the gaseous sealed lid of the millimeter wave module of body style pipe cap, its characteristic is to adopt the quantitative solder frame to braze in vacuum and make pipe cap and surface metal coating layer of tube form the metallurgical combination, realize the airtight sealed lid of the millimeter wave module of body style pipe cap, include the following step specifically:
(1) prefabricating a Sn96.5Ag3Cu0.5 solder sheet, wherein the length and the width are less than the size of a sealing area of the tube shell, and the thickness is 0.06mm to obtain a solder frame;
(2) placing the solder frame in a sealing area of the tube shell to be sealed and covered;
(3) mounting the tube cap on the tube shell/welding material frame;
(4) transferring the tray to a vacuum brazing furnace, and completing brazing sealing between the tube shell and the tube cap metal layer and the brazing filler metal in a high-purity nitrogen atmosphere;
(5) the capping process ends.
2. The method as claimed in claim 1, wherein the millimeter wave module comprises a ceramic cavity, the Ni layer on the surface of the millimeter wave module has a thickness of 2 μm to 8 μm, and the Au layer has a thickness greater than 0.8 μm.
3. The method as claimed in claim 1, wherein the millimeter wave module has a planar tube shell without metal or ceramic cavity, the thickness of Ni layer on the surface of the tube shell is 2 μm-8 μm, and the thickness of Au layer is greater than 0.8 μm.
4. The method as claimed in claim 1, wherein the solder frame component is Sn96.5Ag3Cu0.5, and the flux accounts for 1% of the alloy solder.
5. The method as claimed in claim 1, wherein the solder frame is one-side retracted by 0.1mm relative to the sealing area of the tube shell.
6. The method as claimed in claim 1, wherein the ceramic cavity cap is placed on the tube shell/solder frame, and a high precision chip mounter is used for precise alignment mounting.
7. The method as claimed in claim 1, wherein the sealing process is performed in a vacuum brazing furnace, the preheating zone after the volatilization of the flux is exhausted, and the brazing filler metal is melted to keep the vacuum furnace filled with high-purity nitrogen.
8. The method for the airtight cover of the cavity type pipe cap millimeter wave module as claimed in claim 1, wherein after the closing procedure in step (5) is finished, the airtightness is detected to determine the closing quality.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111444886.5A CN114260533A (en) | 2021-11-30 | 2021-11-30 | Method for air sealing cover of cavity type pipe cap millimeter wave module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111444886.5A CN114260533A (en) | 2021-11-30 | 2021-11-30 | Method for air sealing cover of cavity type pipe cap millimeter wave module |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4551745A (en) * | 1981-09-30 | 1985-11-05 | Fujitsu Limited | Package for semiconductor device |
| CN1638070A (en) * | 2004-12-01 | 2005-07-13 | 美新半导体（无锡）有限公司 | Airtight packaging method for planar carrier cavity in microelectronic circuit |
| CN103273154A (en) * | 2013-04-25 | 2013-09-04 | 西安空间无线电技术研究所 | Microwave multi-cavity partition wall welding process method |
| CN105609904A (en) * | 2015-12-29 | 2016-05-25 | 中国电子科技集团公司第二十六研究所 | Hermetic package for chip-scale acoustic surface wave device and hermetic package method |
| CN112216655A (en) * | 2020-11-03 | 2021-01-12 | 中国电子科技集团公司第四十三研究所 | LTCC-based SiP packaging shell and preparation method thereof |
-
2021
- 2021-11-30 CN CN202111444886.5A patent/CN114260533A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4551745A (en) * | 1981-09-30 | 1985-11-05 | Fujitsu Limited | Package for semiconductor device |
| CN1638070A (en) * | 2004-12-01 | 2005-07-13 | 美新半导体（无锡）有限公司 | Airtight packaging method for planar carrier cavity in microelectronic circuit |
| CN103273154A (en) * | 2013-04-25 | 2013-09-04 | 西安空间无线电技术研究所 | Microwave multi-cavity partition wall welding process method |
| CN105609904A (en) * | 2015-12-29 | 2016-05-25 | 中国电子科技集团公司第二十六研究所 | Hermetic package for chip-scale acoustic surface wave device and hermetic package method |
| CN112216655A (en) * | 2020-11-03 | 2021-01-12 | 中国电子科技集团公司第四十三研究所 | LTCC-based SiP packaging shell and preparation method thereof |
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