CN103273154A - Microwave multi-cavity partition wall welding process method - Google Patents
Microwave multi-cavity partition wall welding process method Download PDFInfo
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Abstract
The invention relates to a microwave multi-cavity partition wall welding process method. A vacuum eutectic welding mode is adopted to enable a multi-cavity partition wall, an LTCC multi-layer substrate and a component base to be welded into a whole, an integrated structure is formed, namely, a base plate is used as a supporting portion and a grounding portion, a microwave product radio-frequency control circuit and a microwave product low-frequency circuit are both integrated on one LTCC substrate, signal isolation is carried out on an integral multi-cavity partition wall above the substrate, and the partition wall comprises a panel multi-cavity structure and a multi-cavity structure with a boss on the periphery. Meanwhile, a strict welding process curve is formulated, the structures change independent layouts of a plurality of functional units of an original product, the units are tightly fixed in machined cavities through screws, the structure that the units are connected again through a gold belt is adopted, and miniaturization and high densification are achieved. The multi-cavity partition wall structure formed by the method is of an integral structure, and has the advantages of being small in size, high in integration level, good in isolation performance and good in reliability.
Description
Technical field
The present invention relates to the package technique of microwave product, particularly relate to a kind of technological design of microwave multi-cavity partition wall welding and the implementation method of vacuum welding.
Background technology
Because microwave and millimeter wave hybrid microcircuit assembly has the characteristics of light weight, small-sized, integrated, reliable, low consumption, in the satellite electron product, obtained extensive use, especially in payload, it is unique and important that critical component such as low-noise amplifier, power amplifier, frequency converter, receiver etc. have all adopted microwave and millimeter wave hybrid microcircuit assembly, the package technique of microwave, millimeter wave assembly.
Along with the requirement of satellite high density, compact is more and more higher, microwave components also must carry out the miniaturization development.The module size that the microcircuit package technique at initial stage is produced is 10mm * 40mm to the maximum, function singleness, integrated level is low, products such as whole receiver also need a plurality of microcircuit modules to be assembled in the big casing, size is bigger, differed nearly 20 years with world level, and a key technology of restriction product miniaturization is microwave multi-cavity partition wall welding procedure.
Summary of the invention
The objective of the invention is to overcome the above-mentioned deficiency of prior art, a kind of microwave multi-cavity partition wall welding technique is provided, the multi-cavity curtain wall structure that this method forms is integrated, and has that volume is little, integrated level is high, isolation performance is good and the characteristics of good reliability.
Above-mentioned purpose of the present invention mainly is achieved by following technical solution:
A kind of microwave multi-cavity partition wall welding technique comprises the steps:
Step (one), will weld each assembly, comprise that base, substrate and partition wall clean, remove surface oxidation and pollution; Its mid-board is dull and stereotyped multi-cavity structure, comprises frame and is arranged on the interior a plurality of frameworks of frame;
Step (two), apply scaling powder in the base front surface welding position, and weld tabs is placed on the base; Afterwards substrate is placed on the weld tabs;
Step (three), apply scaling powder in substrate front side welding partition wall position, and weld tabs is placed on the substrate; Afterwards partition wall is placed on the substrate, forms assembly to be welded;
Step (four), assembly to be welded is placed welding equipment, the placement force frock, and the cavity of welding equipment vacuumized, discharge air wherein, charge into nitrogen, set the welding curve afterwards, carry out vacuum welding, realize the welding between base and the substrate, the welding between substrate and the partition wall;
The assembly that step (five), taking-up welding are finished cleans assembly, removes scaling powder.
A kind of microwave multi-cavity partition wall welding technique comprises the steps:
Step (one), will weld each assembly, comprise that base, substrate and partition wall clean, remove surface oxidation and pollution; Its mid-board is designed to the multi-cavity structure of peripheral boss, comprises the annular boss of frame, frame periphery and is arranged on the interior a plurality of frameworks of frame;
Step (two), apply scaling powder in the base front surface welding position, and weld tabs is placed on the base; Afterwards substrate is placed on the weld tabs;
Step (three), apply scaling powder in substrate front side welding partition wall position, and weld tabs is placed on the substrate; Afterwards partition wall is placed on the substrate, substrate is positioned at the inside of annular boss on the partition wall, and annular boss contacts with weld tabs on the base, forms assembly to be welded;
Step (four), assembly to be welded is placed welding equipment, the placement force frock, and the cavity of welding equipment vacuumized, discharge air wherein, pour nitrogen, set the welding curve afterwards, carry out vacuum welding, realize the welding between base and the substrate, the welding between substrate and the partition wall;
The assembly that step (five), taking-up welding are finished cleans assembly, removes scaling powder.
In above-mentioned microwave multi-cavity partition wall welding technique, remove the method for oxidation in the step () and wash the method that scouring combines with absolute ethyl alcohol for no fluorine toothpaste bubble.
In above-mentioned microwave multi-cavity partition wall welding technique, set the welding curve in the step (four), the concrete steps of carrying out vacuum welding are as follows:
(1) preheating: the cavity to welding equipment is heated to 100~400 ℃, keeps 2~5 minutes;
(2) heat up: according to 2~5 ℃/second heating rate, be rapidly heated to the scolder fusing point;
(3) welding: when temperature reaches the scolder fusing point, vacuumize maintenance 1~3 minute at peak temperature, discharge the gas of scaling powder volatilization, make scolder fully be melted to molten condition simultaneously, finish welding;
(4) cooling: according to 2~5 ℃/second rate of temperature fall, the assembly of finishing welding is cooled off rapidly.
In above-mentioned microwave multi-cavity partition wall welding technique, weld tabs is the lamellar gold tin solder, and the heating-up temperature in the step (1) is 210 ℃~230 ℃, and the heating rate in the step (2) is 2.5~3.5 ℃, and the rate of temperature fall in the step (3) is 1.5~2.5 ℃.
In above-mentioned microwave multi-cavity partition wall welding technique, the weld tabs thickness in the step (two) between substrate and the base is 0.05~0.2mm, and the weld tabs size is identical with weld size; Weld tabs thickness in the step (three) between substrate and the partition wall is 0.1~0.25mm, and the weld tabs width is greater than partition wall border width 0.2~0.6mm.
In above-mentioned microwave multi-cavity partition wall welding technique, the pressure frock quality in the step (four) and the relation of bonding area are as follows:
Bonding area is 300mm
2~900mm
2The time, pressure frock quality is 30g; Bonding area is 900mm
2~3000mm
2The time, pressure frock quality is 70g; Bonding area is 3000mm
2~5000mm
2The time, pressure frock quality is 100g; Bonding area is greater than 5000mm
2The time, pressure frock quality is more than or equal to 250g.
In above-mentioned microwave multi-cavity partition wall welding technique, substrate is the ltcc substrate of integrated micro product radio frequency and low frequency control circuit, and scaling powder is R type scaling powder.
In above-mentioned microwave multi-cavity partition wall welding technique, the assembly to be welded that forms in the step (three) leaves the slit of 0.2~0.4mm between base and the annular boss.
In above-mentioned microwave multi-cavity partition wall welding technique, the edge of base increases the thick weld tabs of one deck 0.15~2.0mm in the step (two), in order to fill up the slit between annular boss and the base.
The present invention compared with prior art has following beneficial effect:
(1) mode of the present invention by adopting the welding of vacuum eutectic is integrally welded with multi-cavity partition wall and substrate, base, form a kind of integrated morphology, be about to base plate as supporting and grounded part, microwave product radio frequency and low frequency control circuit all are integrated on a slice ltcc substrate, integrated multi-cavity partition wall above the substrate carries out the isolation of signal, changed the independent layout in unit of a plurality of functions of existing product, be fastened on by screw in the cavity of machining, the structure that connects with gold ribbon again between the unit has realized miniaturization and densification;
(2) the present invention carries out the design of manufacturability coupling to the assembly various piece, by adjusting each parameter, determine partition wall welding optimised process curve, comprise the processing of welding cavity environment, preheating, intensification, backflow, cooling several sections, this curve is can be simultaneously qualified with base, substrate, partition wall welding by two-layer scolder, satisfy reliability requirement, select for use golden tin solder to weld good seal performance simultaneously;
(3) the present invention selects the pressure frock of approrpiate wts according to the welding cavity size, helps scaling powder to discharge, and scolder overflows in right amount and fills up gap between partition wall housing and the base simultaneously, reaches excellent sealing effect;
(4) the present invention is directed to the product that partition wall weighs less than the substrate film adhesion, designed base, substrate, partition wall solder side and be flat configuration, successively put the method for the integrated welding in back; Weld the product of unreliable problem at the more weak partition wall that causes easily of substrate film adhesion, designed partition wall has been designed to peripheral boss structure, peripheral boss is welded on the base, central frame is welded on the ltcc substrate, the method of the peripheral boss of partition wall and base, the integrated welding of substrate, satisfy different product requirements, had stronger practicality;
(5) the present invention is when the technology of partition wall band shape boss realizes, because the partition wall inner frame is more, and it is good to guarantee that every frame all must weld, and can there be tolerance in machining, therefore during the manufacturability design with the gap of specialized designs 0.3mm between partition wall housing and the base, can guarantee that on the one hand central frame and substrate can tight complete the contacts, form good weld seam, be used for getting rid of gases such as scaling powder when welding on the other hand, avoid the welding cavity;
(6) multi-cavity structure of the present invention is integrated in original a plurality of modules in the assembly, realize the isolation of performance by partition wall, the integrated level height, avoided the transition cascade between a plurality of modules, small product size and weight are reduced more than 50%, have that volume is little, integrated level is high, isolation performance is good and the characteristics of good reliability.
Product of the present invention is successful Application and obtain very good effect.
Description of drawings
Fig. 1 is multi-cavity partition wall welding process flow figure of the present invention;
Fig. 2 is base, substrate and partition wall assembling exploded view in the welding method of the present invention;
Fig. 3 a is base front surface schematic diagram in the welding method of the present invention;
Fig. 3 b is base end face schematic diagram in the welding method of the present invention;
Fig. 3 c is base side view in the welding method of the present invention;
Fig. 4 a is no boss partition wall front view in the welding method of the present invention;
Fig. 4 b is no boss partition wall in the welding method of the present invention and base, substrate in combination side view;
Fig. 5 a has boss partition wall front view in the welding method of the present invention;
Fig. 5 b is for having boss partition wall and base, substrate in combination side view in the welding method of the present invention;
Fig. 5 c has the partial enlarged drawing of boss partition wall and base, substrate in combination for the present invention;
Fig. 6 is process curve schematic diagram of the present invention;
Fig. 7 selects schematic diagram for frock weight of the present invention.
The specific embodiment
The present invention is described in further detail below in conjunction with the drawings and specific embodiments:
Microwave multi-cavity partition wall welding procedure is according to product characteristics multi-cavity partition wall and base plate to be separated, substituted the form that original component internal structure is integrated machine processing, partition wall is on base plate and the ltcc substrate, partition wall outermost size is relatively big, and the welding of partition wall is the key of microwave components signal isolation effect.Partition wall welding except around the circle, each middle framework all needs to be welded on the ltcc substrate, well isolates to realize signal.The product integrated level height of this form, technology difficulty is big, and weight and volume can reduce more than 50% with respect to the form of a plurality of microwave module cascades.
One, the selection of scolder
The selection of scolder must be satisfied weldment coating, whole assembly welding temperature gradient, be welded requirements such as easy to operate, therefore selects the lamellar gold tin solder.At first, golden tin solder good airproof performance is used for the situations such as cover plate for sealing of little completed knocked down products more.Secondly, substrate in the microwave components and base coating are the gold layer, according in European Space Agency's standard about the welding requirements of gold layer, corrosion and golden crisp phenomenon can not take place in gold tin solder and golden membranous layer welding, and the scolder fusing point is higher than about 30 ℃ of chip attachment maximum temperature (217 ℃ in SAC scolder), can form thermograde preferably, not influence mounting of all the other devices of assembly etc.Again, because golden soldering sheet is frangible, therefore according to the size of integrated multi-cavity partition wall lead frame, customize suitable weld tabs, be convenient to mount, the preferred golden tin solder of scolder of the present invention, and the weld tabs thickness between substrate 2 and the base 1 is 0.05~0.2mm, and the weld tabs size is identical with weld size; Weld tabs thickness between substrate 2 and the partition wall 3 is 0.1~0.25mm, and the weld tabs width is greater than partition wall border width 0.2~0.6mm.
Two, partition wall welding procedure design
Method one: successively put integrated welding
Be illustrated in figure 2 as base in the welding method of the present invention, substrate and partition wall assembling exploded view.Partition wall 3 is welded on the ltcc substrate 2, and substrate 2 is welded on the base 1, and base 1, substrate 2, partition wall 3 solders side are flat configuration, successively puts the integrated welding in back.This method is applicable to that partition wall weighs less than the product of film adhesion, guarantees to satisfy mechanical analysis, and detailed process is as follows:
Step (one), will weld each assembly, comprise that base 1, substrate 2 and partition wall 3 clean, remove surface oxidation and pollution; Remove the method for oxidation and wash the method that scouring combines with absolute ethyl alcohol for no fluorine toothpaste bubble.Its mid-board 3 is dull and stereotyped multi-cavity structure, comprises frame 4 and a plurality of frameworks 5 that are arranged in the frame 4.Be no boss partition wall front view in the welding method of the present invention as Fig. 4 a, Fig. 4 b is no boss partition wall in the welding method of the present invention and base, substrate in combination side view, base 1, substrate 2 are combined with partition wall 3 and are in the same place, and have weld seam small stair 25 on partition wall 3 frames.
Step (two), apply scaling powder in the positive welding position of base 1, and weld tabs is placed on the base 1; Afterwards substrate 2 is placed on the weld tabs, scaling powder can be R type scaling powder.
Step (three), apply scaling powders in the positive welding of substrate 2 partition walls 3 positions, and weld tabs is placed on the substrate 2; Afterwards partition wall 3 is placed on the substrate 2, forms assembly to be welded.
Step (four), assembly to be welded is placed welding equipment, the placement force frock, and the cavity of welding equipment vacuumized, discharge air wherein, pour nitrogen, set the welding curve afterwards, carry out vacuum welding, realize the welding between base 1 and the substrate 2, the welding between substrate 2 and the partition wall 3;
The assembly that step (five), taking-up welding are finished cleans assembly, removes scaling powder.
Step (six), carry out the check of appearance test and X-ray voidage.
Method two: the peripheral boss of partition wall and base, the integrated welding of substrate
As shown in Figure 2, partition wall 3 is designed to peripheral boss structure, peripheral boss 15 is welded on the base 11, and central frame 16 is welded on the ltcc substrate 2.This method can be avoided owing to cause that partition wall welds unreliable problem a little less than the ltcc substrate film adhesion.But its difficult point is base, partition wall and will designs boss, must well mate, and will consider also during the partition wall welding that its bottom Different Plane, many frames are welded on two kinds of compatibling problems on the material simultaneously.
When method two is realized in technology, because partition wall 3 inner frames are more, and it is good to guarantee that every frame all must weld, and can there be tolerance in machining, therefore during the manufacturability design with the gap of specialized designs 0.2~0.4mm between the annular boss 15 of partition wall 3 frames 14 and the base 1, edge at base 1 during welding increases the thick weld tabs of one deck 0.15-2.0mm, in order to fill up the slit of annular boss 15 designs, can guarantee that so on the one hand central frame and substrate can tight complete the contacts, form good weld seam, be used for getting rid of gases such as scaling powder when welding on the other hand, avoid the welding cavity.
Step (one), will weld each assembly, comprise that base 1, substrate 2 and partition wall 3 clean, remove surface oxidation and pollution, and remove the method for oxidation and wash the method that scouring combines with absolute ethyl alcohol for no fluorine toothpaste bubble.Its mid-board 13 is designed to the multi-cavity structure of peripheral boss, comprises the annular boss 15 of frame 14, frame 14 peripheries and is arranged on a plurality of frameworks 16 in the frame 14; Be no boss partition wall front view in the welding method of the present invention as Fig. 5 a, Fig. 5 b is for having boss partition wall and base, substrate in combination side view in the welding method of the present invention, Fig. 5 c is the partial enlarged drawing of Fig. 5 b, annular boss 15 on the partition wall 13 is complementary with the boss of base 1, be stuck, there is assembling reserving gaps 20 between annular boss 15 and the base 1, also has weld seam small stair 21.
Step (two), apply scaling powders in the positive welding positions of base 11, and weld tabs is placed on the base 1; Afterwards substrate 2 is placed on the weld tabs; Scaling powder can be R type scaling powder.
Step (three), apply scaling powders in the positive welding of substrate 2 partition walls 3 positions, and weld tabs is placed on the substrate 2; Afterwards partition wall 3 is placed on the substrate 2, substrate 2 is positioned at the inside of annular boss 15 on the partition wall 3, and annular boss 15 contacts with weld tabs on the base 1, forms assembly to be welded;
Step (four), assembly to be welded is placed welding equipment, the placement force frock, and the cavity of welding equipment vacuumized, discharge air wherein, pour nitrogen, set the welding curve afterwards, carry out vacuum welding, realize the welding between base 1 and the substrate 2, the welding between substrate 2 and the partition wall 3;
The assembly that step (five), taking-up welding are finished cleans assembly, removes scaling powder.
Step (six), carry out the check of appearance test and X-ray voidage.
Be illustrated in figure 1 as multi-cavity partition wall welding process flow figure of the present invention.
Three, partition wall welding procedure curve
In order to ensure welding effect, must in vacuum welding equipment, carry out, the process curve of partition wall welding comprises vacuum time, preheat temperature, time to peak etc., by adjusting each parameter, determines partition wall welding optimised process curve.In addition, during welding, the pressure frock is also extremely important, according to cavity size, selects the frock of approrpiate wts, helps scaling powder to discharge, and scolder overflows in right amount and fills up gap between housing and the base, reaches excellent sealing effect.The welding curve comprises following link, is illustrated in figure 6 as process curve schematic diagram of the present invention.
(1) welding surroundings is handled.Equipment welding cavity is vacuumized, discharge air wherein, charge into nitrogen then, anti-oxidation.Vacuumize, towards nitrogen two bouts, to guarantee the welding atmosphere.
(2) preheating.Cavity is heated to 100~400 ℃, kept 2~5 minutes.This step belongs to warm-up phase.Because it is inhomogeneous to be heated in the cavity, heating kept after 2~5 minutes, the temperature of weldment can reach 100~400 ℃ constant.When weld tabs was golden tin solder, heating-up temperature was 210~230 ℃.
(3) very fast intensification.According to 2~5 ℃/second heating rate, be rapidly heated to the scolder fusing point.When weld tabs was golden tin solder, heating rate was 2.5~3.5 ℃/second.
(4) welding.When the weldment temperature reaches the scolder fusing point, vacuumize maintenance 1~3 minute at peak of curve, discharge the gas of scaling powder volatilization, make scolder fully be melted to molten condition simultaneously.If the too short then gas of time to peak can not be discharged fully, and the fusion effect is bad.
(5) cooling.The way that employing is cooled off rapidly towards nitrogen.Simultaneously also be that if too slow, then weld seam is sent out dirt, and is rough according to 2~5 ℃ of/second rate of temperature fall coolings.When weld tabs was golden tin solder, rate of temperature fall was 1.5~2.5 ℃/second.
Four, the selection of pressure frock
At different bonding areas, the pressure frock can be omited inching according to selecting as Fig. 7 and table 1 in the time of suitably.
The tabulation of table 1 frock
Multi-cavity structure mainly is that original a plurality of modules are integrated in the assembly, realizes the isolation of performance by partition wall, and the integrated level height has been avoided the transition cascade between a plurality of modules, makes small product size and weight reduce more than 50%.
Enumerate a specific embodiment below:
As shown in Figure 2, a kind of multi-cavity partition wall weld assembly of present embodiment, its base 1 material are the carbon silico-aluminum or can cut down material that length and width are of a size of 77mm*45.5mm, for loss of weight, have done the part in the bottom and have emptied processing.Substrate 2 is the LTCC LTCC, and partition wall 3 is 20 integrated structures of loculus, and material is kovar alloy, frame 14 width of partition wall 3 are 1.6mm, partition wall 3 peripheries are provided with annular boss, require with these three parts intact be welded into an assembly, air-tightness and welding voidage meet the demands.
Concrete heat treatment process step is as follows:
Step (one), will weld each assembly and comprise that base 1, substrate 2, partition wall 3 clean, remove surface oxidation and pollution, and adopt toothpaste to throw during cleaning to wash to clean with absolute ethyl alcohol to combine;
Step (two), the auxiliary groove pen of usefulness draw at base 1 and need the profile of welding position, apply R type scaling powder in the welding position;
Step (three), the golden soldering sheet that 0.1mm is thick are placed on base 1 welding position; all the other positions of not welding are protected with adhesive tape; at the boss form, increase the wide weld tabs of the thick 2.0mm of one deck 0.15mm at the edge of base 1, in order to fill up the slit of boss design.
Step (four), ltcc substrate 2 is placed on the weld tabs;
Step (five), apply scaling powders in the positive welding of ltcc substrate 2 partition walls 3 positions;
Step (six), the golden soldering sheet that the thick 2.0mm of 0.15mm is wide are placed on welding position on the substrate 2 (weld tabs in step 3 and the step 6 can preformed also can use undersized splicing);
Step (seven), whole assembly is placed welding equipment, placement force frock 250g sets the welding curve, carry out vacuum welding, specifically comprise preheating, processes such as maintenance, intensification, peak value backflow, cooling, 220 ℃ of preheat temperatures, 310 ℃ of peak temperatures, 1 minute pumpdown time;
Step (eight), assembly is carried out vapour phase clean, remove scaling powder;
Step (nine), carry out the check of appearance test and X-ray voidage.The result shows efficient weld area greater than 85%, and smooth welding joint is full, has exceeded the related request of national military standard.
The above; only be the specific embodiment of the best of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
The content that is not described in detail in the specification of the present invention belongs to this area professional and technical personnel's known technology.
Claims (10)
1. a microwave multi-cavity partition wall welding technique is characterized in that comprising the steps:
Step (one), will weld each assembly, comprise that base (1), substrate (2) and partition wall (3) clean, remove surface oxidation and pollution; Its mid-board (3) is dull and stereotyped multi-cavity structure, comprises frame (4) and is arranged on the interior a plurality of frameworks (5) of frame (4);
Step (two), apply scaling powder in the positive welding position of base (1), and weld tabs is placed on the base (1); Afterwards substrate (2) is placed on the weld tabs;
Step (three), apply scaling powder in the positive welding of substrate (2) partition wall (3) position, and weld tabs is placed on the substrate (2); Afterwards partition wall (3) is placed on the substrate (2), forms assembly to be welded;
Step (four), assembly to be welded is placed welding equipment, the placement force frock, and the cavity of welding equipment vacuumized, discharge air wherein, charge into nitrogen, set the welding curve afterwards, carry out vacuum welding, realize the welding between base (1) and the substrate (2), the welding between substrate (2) and the partition wall (3);
The assembly that step (five), taking-up welding are finished cleans assembly, removes scaling powder.
2. a microwave multi-cavity partition wall welding technique is characterized in that comprising the steps:
Step (one), will weld each assembly, comprise that base (1), substrate (2) and partition wall (3) clean, remove surface oxidation and pollution; Its mid-board (3) is designed to the multi-cavity structure of peripheral boss, comprises the annular boss (15) of frame (14), frame (14) periphery and is arranged on the interior a plurality of frameworks (16) of frame (14);
Step (two), apply scaling powder in the positive welding position of base (1), and weld tabs is placed on the base (11); Afterwards substrate (2) is placed on the weld tabs;
Step (three), apply scaling powder in the positive welding of substrate (2) partition wall (3) position, and weld tabs is placed on the substrate (2); Afterwards partition wall (3) is placed on the substrate (2), substrate (2) is positioned at the inside that partition wall (3) is gone up annular boss (15), and annular boss (15) contacts with weld tabs on the base (1), forms assembly to be welded;
Step (four), assembly to be welded is placed welding equipment, the placement force frock, and the cavity of welding equipment vacuumized, discharge air wherein, pour nitrogen, set the welding curve afterwards, carry out vacuum welding, realize the welding between base (1) and the substrate (2), the welding between substrate (2) and the partition wall (3);
The assembly that step (five), taking-up welding are finished cleans assembly, removes scaling powder.
3. a kind of microwave multi-cavity partition wall welding technique according to claim 1 and 2 is characterized in that: the method for removing oxidation in the described step () is washed the method that scouring combines with absolute ethyl alcohol for no fluorine toothpaste bubble.
4. a kind of microwave multi-cavity partition wall welding technique according to claim 1 and 2 is characterized in that: set the welding curve in the described step (four), the concrete steps of carrying out vacuum welding are as follows:
(1) preheating: the cavity to welding equipment is heated to 100~400 ℃, keeps 2~5 minutes;
(2) heat up: according to 2~5 ℃/second heating rate, be rapidly heated to the scolder fusing point;
(3) welding: when temperature reaches the scolder fusing point, vacuumize maintenance 1~3 minute at peak temperature, discharge the gas of scaling powder volatilization, make scolder fully be melted to molten condition simultaneously, finish welding;
(4) cooling: according to 2~5 ℃/second rate of temperature fall, the assembly of finishing welding is cooled off rapidly.
5. a kind of microwave multi-cavity partition wall welding technique according to claim 4, it is characterized in that: when weld tabs is the lamellar gold tin solder, heating-up temperature in the step (1) is 210 ℃~230 ℃, heating rate in the step (2) is 2.5~3.5 ℃, and the rate of temperature fall in the step (3) is 1.5~2.5 ℃.
6. a kind of microwave multi-cavity partition wall welding technique according to claim 1 and 2 is characterized in that: the weld tabs thickness in the described step (two) between substrate (2) and the base (1) is 0.05~0.2mm, and the weld tabs size is identical with weld size; Weld tabs thickness in the step (three) between substrate (2) and the partition wall (3) is 0.1~0.25mm, and the weld tabs width is greater than partition wall border width 0.2~0.6mm.
7. a kind of microwave multi-cavity partition wall welding technique according to claim 1 and 2, it is characterized in that: the pressure frock quality in the described step (four) and the relation of bonding area are as follows:
Bonding area is 300mm
2~900mm
2The time, pressure frock quality is 30g; Bonding area is 900mm
2~3000mm
2The time, pressure frock quality is 70g; Bonding area is 3000mm
2~5000mm
2The time, pressure frock quality is 100g; Bonding area is greater than 5000mm
2The time, pressure frock quality is more than or equal to 250g.
8. a kind of microwave multi-cavity partition wall welding technique according to claim 1 and 2 is characterized in that: described substrate (2) is the ltcc substrate of integrated micro product radio frequency and low frequency control circuit, and described partition wall (3) carries out the isolation of signal.
9. a kind of microwave multi-cavity partition wall welding technique according to claim 1 and 2, it is characterized in that: described weld tabs is the lamellar gold tin solder, described scaling powder is R type scaling powder.
10. a kind of microwave multi-cavity partition wall welding technique according to claim 2 is characterized in that: the assembly to be welded that forms in the described step (three), leave the slit of 0.2~0.4mm between base (1) and the annular boss (15).
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CN110625144A (en) * | 2019-10-21 | 2019-12-31 | 宁波红日工具有限公司 | Cutter and welding process thereof |
CN110899884A (en) * | 2019-12-06 | 2020-03-24 | 上海劲为精密机械有限公司 | Novel brazing process for machining high-power laser seat structure |
CN110961740A (en) * | 2019-12-05 | 2020-04-07 | 中国科学院电子学研究所 | Welding method of Au-based LTCC substrate with deep cavity structure |
CN113745169A (en) * | 2021-07-23 | 2021-12-03 | 中国电子科技集团公司第二十九研究所 | Multi-cavity LTCC substrate and packaging box body welding structure and method |
CN114256575A (en) * | 2021-12-10 | 2022-03-29 | 中国电子科技集团公司第二十九研究所 | Multi-channel miniaturized microwave assembly and metal-based composite substrate structure thereof |
CN114260533A (en) * | 2021-11-30 | 2022-04-01 | 中国电子科技集团公司第五十五研究所 | Method for air sealing cover of cavity type pipe cap millimeter wave module |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000183564A (en) * | 1998-12-21 | 2000-06-30 | Sharp Corp | Electronic apparatus having circuit board and chassis and manufacture thereof |
US6352743B1 (en) * | 1998-10-05 | 2002-03-05 | Kulicke & Soffa Investments, Inc. | Semiconductor copper band pad surface protection |
JP2002190681A (en) * | 2000-12-19 | 2002-07-05 | Alps Electric Co Ltd | Electronic equipment |
CN1578609A (en) * | 2003-07-07 | 2005-02-09 | 阿尔卑斯电气株式会社 | Mounting structure for circuit board in electronic device and mounting method thereof |
CN101866861A (en) * | 2010-05-07 | 2010-10-20 | 贵州振华风光半导体有限公司 | Integration method of high-reliability power hybrid integrated circuit |
CN102497730A (en) * | 2011-12-08 | 2012-06-13 | 无锡华测电子系统有限公司 | Ceramic substrate assembly and grounding welding method thereof |
-
2013
- 2013-04-25 CN CN201310147821.3A patent/CN103273154B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6352743B1 (en) * | 1998-10-05 | 2002-03-05 | Kulicke & Soffa Investments, Inc. | Semiconductor copper band pad surface protection |
JP2000183564A (en) * | 1998-12-21 | 2000-06-30 | Sharp Corp | Electronic apparatus having circuit board and chassis and manufacture thereof |
JP2002190681A (en) * | 2000-12-19 | 2002-07-05 | Alps Electric Co Ltd | Electronic equipment |
CN1578609A (en) * | 2003-07-07 | 2005-02-09 | 阿尔卑斯电气株式会社 | Mounting structure for circuit board in electronic device and mounting method thereof |
CN101866861A (en) * | 2010-05-07 | 2010-10-20 | 贵州振华风光半导体有限公司 | Integration method of high-reliability power hybrid integrated circuit |
CN102497730A (en) * | 2011-12-08 | 2012-06-13 | 无锡华测电子系统有限公司 | Ceramic substrate assembly and grounding welding method thereof |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106876267A (en) * | 2015-12-11 | 2017-06-20 | 中国航空工业集团公司雷华电子技术研究所 | A kind of ltcc substrate component and its eutectic sintering process method |
CN106876267B (en) * | 2015-12-11 | 2019-12-17 | 中国航空工业集团公司雷华电子技术研究所 | LTCC substrate assembly and eutectic sintering process method thereof |
CN106783405A (en) * | 2017-01-21 | 2017-05-31 | 上海旭光真空科技有限公司 | A kind of production method of high-voltage DC contactor |
CN106783405B (en) * | 2017-01-21 | 2019-08-06 | 旭格威科技(上海)有限公司 | A kind of production method of high-voltage DC contactor |
CN110625144A (en) * | 2019-10-21 | 2019-12-31 | 宁波红日工具有限公司 | Cutter and welding process thereof |
CN110961740A (en) * | 2019-12-05 | 2020-04-07 | 中国科学院电子学研究所 | Welding method of Au-based LTCC substrate with deep cavity structure |
CN110899884A (en) * | 2019-12-06 | 2020-03-24 | 上海劲为精密机械有限公司 | Novel brazing process for machining high-power laser seat structure |
CN113745169A (en) * | 2021-07-23 | 2021-12-03 | 中国电子科技集团公司第二十九研究所 | Multi-cavity LTCC substrate and packaging box body welding structure and method |
CN113745169B (en) * | 2021-07-23 | 2023-10-24 | 中国电子科技集团公司第二十九研究所 | Multi-cavity groove LTCC substrate and packaging box welding structure and method |
CN114260533A (en) * | 2021-11-30 | 2022-04-01 | 中国电子科技集团公司第五十五研究所 | Method for air sealing cover of cavity type pipe cap millimeter wave module |
CN114256575A (en) * | 2021-12-10 | 2022-03-29 | 中国电子科技集团公司第二十九研究所 | Multi-channel miniaturized microwave assembly and metal-based composite substrate structure thereof |
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