CN114260218A - 一种晶圆片表面清洁装置及方法 - Google Patents
一种晶圆片表面清洁装置及方法 Download PDFInfo
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- CN114260218A CN114260218A CN202210196444.1A CN202210196444A CN114260218A CN 114260218 A CN114260218 A CN 114260218A CN 202210196444 A CN202210196444 A CN 202210196444A CN 114260218 A CN114260218 A CN 114260218A
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- cleaning
- wafer
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- rod
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- 238000004140 cleaning Methods 0.000 title claims abstract description 144
- 238000000034 method Methods 0.000 title claims abstract description 11
- 235000012431 wafers Nutrition 0.000 claims abstract description 127
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 238000005507 spraying Methods 0.000 claims abstract description 20
- 238000010408 sweeping Methods 0.000 claims abstract description 12
- 238000012546 transfer Methods 0.000 claims abstract description 10
- 230000000712 assembly Effects 0.000 claims abstract description 6
- 238000000429 assembly Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 69
- 239000007921 spray Substances 0.000 claims description 17
- 230000001681 protective effect Effects 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 3
- 235000017491 Bambusa tulda Nutrition 0.000 description 3
- 241001330002 Bambuseae Species 0.000 description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 3
- 239000011425 bamboo Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000010865 sewage Substances 0.000 description 3
- 241001417527 Pempheridae Species 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210196444.1A CN114260218B (zh) | 2022-03-02 | 2022-03-02 | 一种晶圆片表面清洁装置及方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210196444.1A CN114260218B (zh) | 2022-03-02 | 2022-03-02 | 一种晶圆片表面清洁装置及方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114260218A true CN114260218A (zh) | 2022-04-01 |
| CN114260218B CN114260218B (zh) | 2022-05-17 |
Family
ID=80833960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210196444.1A Active CN114260218B (zh) | 2022-03-02 | 2022-03-02 | 一种晶圆片表面清洁装置及方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114260218B (zh) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000070875A (ja) * | 1998-08-28 | 2000-03-07 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置および基板洗浄方法 |
| JP2001007069A (ja) * | 1999-06-17 | 2001-01-12 | Ebara Corp | 基板洗浄装置 |
| US20050118938A1 (en) * | 2003-11-27 | 2005-06-02 | Yasutaka Mizomoto | Wafer processing machine |
| TWM515694U (zh) * | 2015-08-11 | 2016-01-11 | E&R Engineering Corp | 晶圓移載裝置 |
| CN207338322U (zh) * | 2017-09-26 | 2018-05-08 | 福建兆元光电有限公司 | 一种晶圆片清洗装置 |
| JP2018086692A (ja) * | 2016-11-28 | 2018-06-07 | 株式会社ディスコ | 研削装置 |
| CN208570577U (zh) * | 2018-08-06 | 2019-03-01 | 上海东煦电子科技有限公司 | 一种半导体晶圆夹持装置 |
| CN215617908U (zh) * | 2021-09-26 | 2022-01-25 | 青岛精诚诺克机械有限公司 | 一种五金加工用工作台 |
-
2022
- 2022-03-02 CN CN202210196444.1A patent/CN114260218B/zh active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000070875A (ja) * | 1998-08-28 | 2000-03-07 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置および基板洗浄方法 |
| JP2001007069A (ja) * | 1999-06-17 | 2001-01-12 | Ebara Corp | 基板洗浄装置 |
| US20050118938A1 (en) * | 2003-11-27 | 2005-06-02 | Yasutaka Mizomoto | Wafer processing machine |
| TWM515694U (zh) * | 2015-08-11 | 2016-01-11 | E&R Engineering Corp | 晶圓移載裝置 |
| JP2018086692A (ja) * | 2016-11-28 | 2018-06-07 | 株式会社ディスコ | 研削装置 |
| CN207338322U (zh) * | 2017-09-26 | 2018-05-08 | 福建兆元光电有限公司 | 一种晶圆片清洗装置 |
| CN208570577U (zh) * | 2018-08-06 | 2019-03-01 | 上海东煦电子科技有限公司 | 一种半导体晶圆夹持装置 |
| CN215617908U (zh) * | 2021-09-26 | 2022-01-25 | 青岛精诚诺克机械有限公司 | 一种五金加工用工作台 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114260218B (zh) | 2022-05-17 |
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| CP01 | Change in the name or title of a patent holder |
Address after: 215316 room 3, No. 299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: 215316 room 3, No. 299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215316 Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 215316 room 3, No. 299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |
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