CN114256096A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
CN114256096A
CN114256096A CN202111059088.0A CN202111059088A CN114256096A CN 114256096 A CN114256096 A CN 114256096A CN 202111059088 A CN202111059088 A CN 202111059088A CN 114256096 A CN114256096 A CN 114256096A
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substrates
substrate
unit
processing
simultaneous
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CN202111059088.0A
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CN114256096B (en
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中田宏幸
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

Abstract

The invention provides a substrate processing apparatus, which provides a technology capable of collecting parameters more appropriately. The substrate processing apparatus includes a simultaneous processing unit, a transfer unit, a first sensor, and a control unit. The simultaneous processing unit can collectively process N (N is an integer of 2 or more) substrates. The conveying unit conveys N or less substrates collectively to the simultaneous processing unit. The first sensor is provided in the simultaneous processing section and measures a first parameter relating to processing by the simultaneous processing section. The control unit 60 associates and stores a first parameter measured by the first sensor in the simultaneous processing unit processing N substrates when the simultaneous processing unit carries in N substrates from the transfer unit, and associates and stores a first parameter measured by the first sensor in the simultaneous processing unit processing M substrates (M is an integer of 1 or more and less than N) when the simultaneous processing unit carries in M substrates from the transfer unit, and stores a first parameter measured by the first sensor in the simultaneous processing unit processing M substrates.

Description

Substrate processing apparatus and substrate processing method
Technical Field
The present application relates to a substrate processing apparatus and a substrate processing method.
Background
A coater/developer having a plurality of processing apparatuses is known. For example, in the coater/developing apparatus described in patent document 1, a plurality of substrates taken out of a cassette placed on an indexer block are sequentially loaded into a cleaning apparatus, and then sequentially pass through a dehydration baking apparatus, a resist coating apparatus, a pre-baking apparatus, an exposure apparatus, a developing apparatus, and a post-baking apparatus, and are again accommodated in the cassette.
In the coater/developer, the following two processing apparatuses are mixed. That is, a sequential processing apparatus and a simultaneous processing apparatus are mixed. The sequential processing apparatus sequentially conveys substrates in one direction and processes the substrates one by one. Examples of the sequential processing apparatus include a cleaning apparatus and a developing apparatus. A plurality of substrates are collectively carried into the simultaneous processing apparatus. The simultaneous processing apparatus collectively processes a plurality of substrates. An example of the simultaneous processing apparatus is a dehydration baking apparatus. The dehydration baking apparatus is provided with a heating unit and a cooling unit as a plurality of processing units.
Patent document 1: japanese patent laid-open No. 2020-17604
In order to confirm whether or not the process in the substrate processing apparatus is properly performed, sensors for measuring process-related parameters may be provided in the sequential processing apparatus and the simultaneous processing apparatus, respectively. For example, in the dehydration baking apparatus, a temperature sensor may be provided to measure the temperature of the substrate as the parameter.
The substrate processing apparatus may associate and collect the parameters measured by each sensor with the substrate. In other words, the substrate processing apparatus may collect parameters for each substrate. The operator is notified of the processing parameters for each substrate by the substrate processing apparatus, and can confirm the processing parameters for each substrate.
However, collecting the parameters for each substrate is not necessarily optimal. For example, if measured parameters are individually associated with each substrate and collected, the amount of data of the collected data increases.
Disclosure of Invention
Therefore, an object of the present invention is to provide a technique capable of collecting parameters more appropriately.
A first aspect of the substrate processing apparatus includes: a simultaneous processing unit capable of collectively processing N (N is an integer of 2 or more) substrates; a conveying unit configured to collectively convey N or fewer substrates to the simultaneous processing unit; a first sensor provided in the simultaneous processing section and measuring a first parameter relating to a process of the simultaneous processing section; and a control unit that, when N substrates are carried in from the transport unit in the simultaneous processing unit, associates and stores the first parameter measured by the first sensor during processing of the N substrates by the simultaneous processing unit with the N substrates, and when M substrates (M is an integer of 1 or more and less than N) are carried in from the transport unit in the simultaneous processing unit, associates and stores the first parameter measured by the first sensor during processing of the M substrates by the simultaneous processing unit with the M substrates.
A second aspect of the substrate processing apparatus relates to the first aspect, and includes: a sequential processing unit including a substrate introduction unit into which N substrates can be collectively loaded, the sequential processing unit sequentially carrying the substrates from the substrate introduction unit and sequentially processing the substrates; and a second sensor provided in the sequential processing unit and measuring a second parameter related to the processing by the sequential processing unit, wherein the control unit stores the second parameter detected by the second sensor during the processing by the sequential processing unit in association with the substrate individually.
The substrate processing method includes: a step of collectively loading N (an integer of N は 2 or more) substrates into the simultaneous processing unit; a step in which the simultaneous processing unit processes the N substrates collectively; measuring a first parameter related to the processing of the simultaneous processing unit by a first sensor in the processing of the N substrates by the simultaneous processing unit; a step of taking out the N substrates from the simultaneous processing unit; a step of collectively loading M (M is an integer of 1 or more and less than N) substrates into the simultaneous processing unit; a step in which the simultaneous processing unit collectively processes the M substrates; measuring the first parameter by the first sensor during the processing of the M substrates by the simultaneous processing unit; a step of taking out the M substrates from the simultaneous processing unit; and storing the first parameter measured by the first sensor during the processing of the N substrates by the simultaneous processing unit in association with the N substrates, and storing the first parameter measured by the first sensor during the processing of the M substrates by the simultaneous processing unit in association with the M substrates.
According to the first aspect of the substrate processing apparatus and the substrate processing method, the simultaneous processing unit can collectively process N substrates. In the case where a plurality of substrates are collectively processed by the simultaneous processing section, the deviation between the substrates of the first parameter is small, for example, almost the same, as compared with the case where the substrates are processed at different processing timings.
When N substrates are loaded into the simultaneous processing unit, the first parameter is stored in association with the N substrates, and when M substrates are loaded into the simultaneous processing unit, the first parameter is stored in association with the M substrates. That is, the first parameter is stored in association with the group of substrates carried into the simultaneous processing unit, not in association with each substrate individually. This allows the first parameter to be appropriately collected with a smaller volume of data in accordance with the variation in the number of substrates, as compared with the case where the first parameter is individually associated with each substrate and stored.
According to the second aspect of the substrate processing apparatus, the substrates are sequentially transported and sequentially processed in the sequential processing section. Thereby, the substrates are processed at different timings from each other. This increases the variation between the substrates of the second parameter. Such second parameters are individually associated with the substrates and stored, and therefore, the parameters can be collected without losing information of the deviation between the substrates W.
Drawings
Fig. 1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus.
Fig. 2 is a side view schematically showing an example of the configuration of the sequential processing apparatus.
Fig. 3 is a plan view schematically showing an example of the configuration of the simultaneous processing apparatus.
Fig. 4 is a functional block diagram schematically showing an example of the configuration of the control unit.
Fig. 5 is a diagram schematically showing an example of sequentially collecting data.
Fig. 6 is a diagram schematically showing an example of sequentially collecting data.
Fig. 7 is a diagram schematically showing an example of simultaneous data collection.
Fig. 8 is a diagram schematically showing a state in which a plurality of substrates are accommodated in the cassette.
Fig. 9 is a diagram schematically showing a state in which a plurality of substrates are accommodated in the cassette.
Fig. 10 is a plan view schematically showing an example of the configuration of the simultaneous processing apparatus.
Fig. 11 is a diagram schematically showing an example of simultaneous data collection.
Fig. 12 is a diagram schematically showing an example of simultaneous data collection.
Fig. 13 is a flowchart showing an example of the operation of the simultaneous processing device.
Wherein the reference numerals are as follows:
1 substrate processing apparatus
30 sequential processing section (sequential processing apparatus)
40 Simultaneous processing section (Simultaneous processing apparatus)
60 control part
81 conveying part (conveying manipulator)
95. 96 first sensor (temperature sensor)
345. 359, 364 second sensor (flow sensor)
357. 358 second sensor (pressure sensor)
W substrate
Detailed Description
Hereinafter, embodiments will be described with reference to the drawings. It should be noted that the drawings are schematically shown, and the constitutions are appropriately omitted and simplified for convenience of explanation. Further, the interrelationship between the sizes and the positions of the constituents shown in the drawings is not necessarily an accurately described one, but may be one that is appropriately changed.
In the following description, the same components are denoted by the same reference numerals, and the names and functions thereof are also the same. Therefore, detailed descriptions thereof may be omitted to avoid redundancy.
Furthermore, even though ordinal numbers such as "first" or "second" may be used in the following description, these terms are used for ease of understanding the contents of the embodiments, and are not limited to the order in which they may appear, or the like.
Unless otherwise specified, expressions indicating relative or absolute positional relationships (for example, "in a direction", "along a direction", "parallel", "orthogonal", "central", "concentric", "coaxial", etc.) not only strictly indicate their positional relationships but also indicate states of relative displacement in angle or distance within a tolerance range or within a range capable of obtaining the same function. Unless otherwise specified, expressions indicating equal states (e.g., "same", "equal", etc.) not only indicate states which are strictly equal in number, but also indicate states which have a tolerance or a difference that can obtain the same function. Unless otherwise specified, a expression indicating a shape (e.g., "square" or "cylindrical" or the like) indicates not only a strictly geometric shape thereof but also a shape having, for example, irregularities or chamfers or the like within a range in which the same effect can be obtained. The expression "comprising", "including", "containing" or "having" one constituent element is not an exclusive expression excluding the presence of other constituent elements. The expression "at least any one of A, B and C" includes any two of a only, B only, C only, A, B and C, and A, B and C all.
<1. Overall Structure and Overall operation of substrate processing apparatus >
Fig. 1 is a diagram schematically showing an example of the configuration of a substrate processing apparatus 1. In the example of fig. 1, the substrate processing apparatus 1 is a coater/developing apparatus, and mainly includes processing apparatuses of a cleaning apparatus 12, a dehydration baking apparatus 13, a coating-related apparatus 14, a pre-baking apparatus 15, a developing apparatus 17, and a post-baking apparatus 18. An indexer block 11 for carrying substrates in and out of the substrate processing apparatus 1 is disposed on one side of the substrate processing apparatus 1. An exposure device 16 is disposed on the other side of the substrate processing apparatus 1 via an interface unit not shown.
A cleaning device 12, a dehydration baking device 13, a coating-related device 14, and a pre-baking device 15 are arranged in this order on a path from the indexer block 11 to the exposure device 16. A developing device 17 and a post-baking device 18 are disposed in this order on a return path from the exposure device 16 to the indexer block 11.
The indexer block 11 mounts thereon a plurality of cassettes (not shown) for storing a plurality of substrates. The substrate is, for example, a rectangular glass substrate used in a liquid crystal display device. The indexer block 11 is provided with an indexer robot (not shown) as an example of a transport block for transporting substrates. The indexer robot takes out the substrate from the cassette and carries the substrate to the cleaning device 12. In the cleaning apparatus 12, a cleaning process is performed on the substrate. The substrate subjected to the cleaning process is conveyed to the dehydration baking apparatus 13. In the dehydration baking device 13, dehydration treatment (dehydration baking treatment) is performed by heating. The substrate subjected to the dehydration baking process is conveyed to the coating-related apparatus 14, and is subjected to various processes including a resist coating process. The substrate subjected to the treatment is conveyed to the prebaking device 15 and subjected to a heating treatment. The substrate subjected to the heat treatment is conveyed to the exposure device 16 and subjected to the exposure treatment.
The substrate subjected to these processes is carried to the developing device 17 and subjected to a developing process. The substrate subjected to the development processing is conveyed to the post-baking apparatus 18 and subjected to the heat treatment. Thereafter, the substrate is accommodated in a cassette placed on the indexer block 11 by an indexer robot. Through the above-described series of processes, a resist pattern is formed on the surface of the substrate.
Hereinafter, when the first process is performed before the second process, the apparatus performing the first process is described as being located "upstream" of the apparatus performing the second process, and the apparatus performing the second process is described as being located "downstream" of the apparatus performing the first process. The indexer section 11 is located upstream of the cleaning device 12 and downstream of the post-bake device 18. The terms "upstream" and "downstream" are used not only for the apparatus and various elements constituting the apparatus, but also for describing the positional relationship of substrates to be handled.
<2. kinds of treatment apparatuses >
In the substrate processing apparatus 1, the following two types of processing apparatuses are mixed as the types of the processing apparatuses. That is, a sequential processing apparatus (advection processing apparatus) that sequentially conveys substrates in one direction and processes the substrates one by one and a simultaneous processing apparatus that can collectively process N (an integer of 2 or more) substrates at the same time are mixed. Note that the processing periods of the N substrates by the simultaneous processing apparatus need not be completely identical, and at least a part of each processing period may overlap. In short, the term "simultaneously" as used herein may be used in a sense opposite to a state where the respective processing periods do not overlap at all. As the sequential processing devices, the cleaning device 12 and the developing device 17 are exemplified, and as the simultaneous processing devices, the dehydration baking device 13, the coating-related device 14, the pre-baking device 15, and the post-baking device 18 are exemplified.
The sequential processing apparatus may be regarded as a sequential processing unit as a part of the substrate processing apparatus 1. The simultaneous processing apparatus may be regarded as a simultaneous processing section as a part of the substrate processing apparatus 1.
<2-1. sequential processing apparatus >
Fig. 2 is a diagram schematically showing an example of the configuration of the sequential processing apparatus 30. The sequential processing apparatus 30 includes a processing apparatus main body 32 and a substrate lead-out portion 33, and a substrate lead-in portion (receiving portion) 31 is provided in front of the sequential processing apparatus 30. The substrate introduction section 31 collectively receives a plurality of (N) substrates W conveyed from an upstream apparatus. The processing apparatus main body 32 receives a plurality of substrates W conveyed from the substrate introduction portion 31 one by one, conveys the substrates W in one direction (conveying direction: direction from left to right in fig. 2), and performs various processes on the substrates W. The processed substrate W is conveyed from the processing apparatus main body 32 to the substrate lead-out portion 33. The substrate lead-out portion 33 sequentially receives the plurality of substrates W conveyed from the processing apparatus main body 32. The substrate lead-out unit 33 can hold a plurality of (N) substrates W received in sequence. The plurality of substrates W are collectively taken out from the substrate lead-out portion 33 and conveyed to a downstream apparatus. The substrate introduction unit 31 may be included in the sequential processing apparatus 30. The substrate introduction portion 31 may function as an inlet portion of the sequential processing apparatus 30, and the substrate discharge portion 33 may function as an outlet portion of the sequential processing apparatus 30. Hereinafter, a case where N is 2 will be described as an example.
<2-1-1 > substrate introducing part 31>
The substrate introducing section 31 includes a plurality of rollers 311 and 313 as a conveying mechanism, and sensors 314 and 315. The rollers 311 and 313 have a circular cross section, and the central axes of the rollers 311 and 313 are arranged substantially perpendicular to and substantially horizontal to the conveyance direction of the substrate W. The conveyance direction here refers to the conveyance direction of the substrates W in the sequential processing apparatus 30. The plurality of rollers 311 are arranged side by side at intervals in the conveying direction. Each roller 311 is rotatable about its central axis as a rotation axis. Each roller 311 is rotatably fixed to a support plate (not shown) at both ends on the center axis. The pair of support plates are plate-like members extending in the conveying direction, and are fixed to a predetermined mount 312 provided on the floor. The plurality of rollers 313 are arranged side by side at intervals in the conveying direction. The roller 313 is located on the downstream side of the roller 311, and is disposed at the same height as the roller 311. Each roller 313 is rotatable about its central axis as a rotation axis. Each roller 313 is rotatably fixed to a support plate at both ends on the center axis.
The plurality of rollers 311 are driven by a driving section (not shown) and rotate in a predetermined same direction at substantially the same rotational speed (synchronous rotation). The driving section has a motor. The substrate W is placed on the plurality of rollers 311. The substrate W is placed so that the normal direction of the main surface thereof is in the vertical direction (vertical direction in fig. 2). In this state, the plurality of rollers 311 are synchronously rotated in the same direction, so that the substrate W moves on the rollers 311 toward the processing apparatus main body 32 in the conveying direction. The plurality of rollers 313 are also driven by a driving unit (not shown) to rotate in synchronization. Since the rollers 311, 313 are driven by different driving portions, they are controlled independently of each other.
The substrates W are placed on the rollers 311 and 313 one by one. For example, two substrates W from the indexer block 11 may be placed on the rollers 311 and 313. In this state, only the rollers 313 are rotated in synchronization, whereby the substrate W on the rollers 313 can be conveyed to the processing apparatus main body 32. Subsequently, both the rollers 311 and 313 rotate in synchronization with each other, and the substrate W on the roller 313 can be conveyed to the processing apparatus main body 32.
The sensor 314 detects whether or not the substrate W is present at the stop position on the roller 311. The sensor 315 detects whether or not the substrate W is present at the stop position on the roller 313. The sensors 314, 315 are, for example, optical sensors, and detect the substrate W when receiving reflected light from the substrate W. The detection results of the sensors 314 and 315 are output to the control unit 60.
Hereinafter, one of the two substrates W is also referred to as a substrate W1, and the other is also referred to as a substrate W2. Here, it is assumed that the substrate W1 is located on the upstream side of the substrate W2.
<2-1-2 > substrate lead-out section 33>
The substrate lead-out portion 33 can hold a plurality of (N) substrates W sequentially transported from the processing apparatus main body 32. The number of substrates W that can be held by the substrate lead-out portion 33 is the same as the number of substrates W that can be processed by the subsequent simultaneous processing apparatus 40 (for example, the dehydration baking apparatus 13 if the sequential processing apparatus 30 is the cleaning apparatus 12). Here, as an example, it is assumed that the substrate lead-out unit 33 holds two substrates W and the processing apparatus 40 simultaneously processes the two substrates W.
The substrate lead-out section 33 includes a plurality of rollers 331 as a conveyance mechanism, a plurality of rollers 332, and sensors 334 and 335. The rollers 331, 332 are circular in cross section. The rollers 331 are disposed with a gap therebetween in the conveyance direction such that the center axes thereof are perpendicular and horizontal to the conveyance direction of the substrate W. The roller 332 is disposed downstream of the roller 331. The rollers 332 are disposed at intervals in the conveying direction in the same posture as the rollers 331. Both ends of the central shaft of each of the rollers 331 and 332 are rotatably fixed to a support plate (not shown). The plurality of rollers 331 are rotated in synchronization by a driving unit (not shown), and the plurality of rollers 332 are rotated in synchronization by a driving unit (not shown). Since the roller 331 and the roller 332 are driven by different driving portions, they can be controlled independently of each other. Each drive unit has a motor, for example.
The rollers 331, 332 are disposed at the same height as each other. The substrate W is conveyed from the processing apparatus main body 32 to the roller 331, and is appropriately conveyed from the roller 331 to the roller 332. As described later, one substrate W is stopped on the roller 331, and one substrate W is stopped on the roller 332. Thus, the substrate lead-out portion 33 can hold two substrates W.
The sensor 334 detects whether or not the substrate W is present at the stop position on the roller 331. The sensor 335 detects whether or not the substrate W is present at the stop position on the roller 332. The sensors 334, 335 are, for example, optical sensors, and detect the substrate W when receiving reflected light from the substrate W. The detection results of the sensors 334 and 335 are output to the control unit 60.
The substrate lead-out unit 33 can sequentially receive and hold two substrates W from the processing apparatus main body 32. Hereinafter, for convenience, a case where two substrates W are collectively processed will be described. The case where the N substrates W are not collectively processed will be described in detail later.
First, the rollers 331 and 332 rotate in synchronization with each other, and the first substrate W is conveyed to the stop position on the roller 332. Specifically, when neither of the sensors 334 and 335 detects the substrate W, the rollers 331 and 332 are rotated in synchronization with each other to convey the substrate W from the processing apparatus main body 32 to the substrate lead-out portion 33. Then, when the sensor 335 detects the substrate W, the synchronous rotation of the roller 332 is stopped. Thereby, the first substrate W (the downstream substrate W2) is stopped and supported by the roller 332. The second substrate W (the upstream substrate W1) is conveyed to the stop position of the roller 331 by rotating the roller 331 in synchronization with the rotation of the roller 332, thereby rotating the roller 332. Specifically, when the sensor 334 detects the substrate W, the synchronous rotation of the roller 331 is stopped. That is, when both the sensors 334 and 335 detect the substrate W, the synchronous rotation of the roller 331 is stopped. Thereby, the second substrate W is stopped and supported on the roller 331. Thus, the substrate lead-out unit 33 can hold two substrates W.
<2-1-3. treatment apparatus Main body 32>
The processing apparatus main body 32 has a plurality of rollers 321 as a conveyance mechanism. The plurality of rollers 321 have the same shape as the roller 311, and are arranged in the same posture as the roller 311. Both ends of the roller 321 on the center axis are rotatably fixed to support plates (not shown). The plurality of rollers 321 are arranged at intervals in the conveying direction. The plurality of rollers 321 are provided at the same height as the rollers 311 of the substrate introduction section 31, and the substrate W can be moved from the rollers 311 to the rollers 332 via the rollers 313, 321, and 331 in order.
The processing apparatus main body 32 appropriately processes the substrate W moving on the rollers 321 at each position in the conveying direction. Here, the cleaning apparatus 12 will be described as an example of the sequential processing apparatus 30. For example, the processing apparatus main body 32 includes a chemical liquid portion 34, a water washing portion 35, and a water removing portion 36. The chemical liquid portion 34, the water washing portion 35, and the water removal portion 36 are provided in series from upstream to downstream in this order. The plurality of rollers 321 are provided within the ranges of the chemical liquid portion 34, the water washing portion 35, and the water removing portion 36. The plurality of rollers 321 are driven by a driving unit (not shown) to rotate in synchronization with each other. This enables the substrate W to be transported in the transport direction and to pass through the chemical solution unit 34, the water washing unit 35, and the water removal unit 36 in this order.
The chemical liquid section 34 is a device for cleaning the substrate W by supplying a chemical liquid to the substrate W on the roller 321. The chemical liquid portion 34 includes a plurality of nozzles 341 for ejecting a chemical liquid, a chemical liquid tank 342 for storing the chemical liquid, a supply pipe 343 for connecting the chemical liquid tank 342 and the nozzles 341, and a pump 344 for supplying the chemical liquid to the nozzles 341 through the supply pipe 343. The nozzles 341 are provided on both sides of the substrate W in the vertical direction, and supply the chemical solution to both sides of the substrate W. The supply tube 343 is provided with a flow sensor 345 to help control the amount of medical fluid supplied. The chemical liquid section 34 may include a brush (not shown) or the like for brushing the substrate W. By supplying the chemical solution to the substrate W and performing the scrubbing, the cleaning effect can be improved. The chemical solution supplied to the substrate W mainly drops from the edge of the substrate W and is collected in the chemical solution tank 342.
The water washing unit 35 is a device for supplying washing water to the substrate W to wash away the chemical solution remaining on the substrate W. The water washing part 35 has a first water tank 355 and a second water tank 356 for storing washing water. The water washing unit 35 includes a low-pressure water supply unit 351, a high-pressure water supply unit 352, an ultrasonic cleaning water supply unit 353, and a pure water supply unit 354, which are arranged in this order from upstream to downstream. Like the chemical liquid portion 34, each of the portions 351 to 354 includes a nozzle for ejecting a liquid onto the substrate W, a supply pipe connected to the nozzle, and a pump for supplying the liquid to the nozzle through the supply pipe.
The pump 35t of the low-pressure water supply unit 351 is a low-pressure pump that draws washing water from the first water tank 355 at a low pressure and supplies the washing water to the nozzles. Thus, the low pressure water supply unit 351 can supply the cleaning water to the substrate W at a low pressure. The low-pressure water supply unit 351 is provided with a slit nozzle (also referred to as a liquid knife) 35a, and cleaning water is also supplied from the liquid knife 35a to the substrate W. The pressure of the washing water supplied to the low pressure water supply part 351 is measured by the pressure sensor 357.
The pump 35r of the high-pressure water supply unit 352 is a high-pressure pump that draws washing water from the first water tank 355 at high pressure and supplies the washing water to the nozzles. Thus, the high-pressure water supply unit 352 can supply the cleaning water to the substrate W at a high pressure. The pressure of the washing water supplied to the high-pressure water supply unit 352 is measured by a pressure sensor 358. The cleaning water supplied from the low pressure water supply unit 351 and the high pressure water supply unit 352 mainly drops from the edge of the substrate W and is collected in the first water tank 355.
The nozzle 35b of the ultrasonic cleaning water supply unit 353 is provided with an ultrasonic vibrator for applying ultrasonic vibration to the cleaning water from the second water tank 356. The nozzle 35b serves as a liquid knife. The pump 35s of the ultrasonic cleaning water supply unit 353 extracts cleaning water from the second water tank 356 and supplies the cleaning water to the nozzle 35 b. The ultrasonic cleaning water supply unit 353 supplies cleaning water in a vibrating state from the nozzle 35b to the substrate W by the vibration of the ultrasonic vibrator of the nozzle 35 b. The cleaning water supplied from the ultrasonic cleaning water supply unit 353 is mainly collected in the second water tank 356. The flow rate of the washing water supplied to the nozzle 35b is measured by a flow sensor 359.
The nozzle of the pure water supply unit 354 supplies pure water supplied from the pure water supply source 365 to the substrate W. The pure water supply source 365 is provided as a plant (utility), for example. The pure water is mainly recovered to the second water tank 356.
The water removing unit 36 is a device that blows water off the substrate W by flowing a high-pressure air flow to the substrate W. The water removing unit 36 includes an ejection unit (dry air knife) 361 for ejecting gas onto the substrate W, a gas supply source 362 for supplying gas, and a duct 363 for connecting the ejection unit 361 and the gas supply source 362. A flow sensor 364 for measuring the flow rate of the gas is provided in the duct 363. The gas supply source 362 is a gas source provided as a plant (utility).
As described above, the substrate W is conveyed in the conveying direction in the processing apparatus main body 32, and various processes are performed at respective positions. The substrate W subjected to the entire process by the processing apparatus main body 32 is conveyed to the substrate lead-out portion 33.
< 3> Simultaneous processing apparatus 40
Fig. 3 is a diagram schematically showing an example of the configuration of the simultaneous processing apparatus 40. Here, the dehydration baking apparatus 13 will be described as an example of the simultaneous processing apparatus 40. Fig. 3 is a schematic view showing an example of the structure of the dewatering and baking apparatus 13 as viewed vertically downward.
<3-1. dehydration baking apparatus 13>
The dehydration baking device 13 includes a heating section 82 and a cooling section 83. The dehydration baking apparatus 13 receives the substrates W cleaned by the cleaning apparatus 12 (which is the sequential processing apparatus 30) from the conveying robot (conveying unit) 81, and simultaneously processes the received substrates W. The dehydration baking apparatus 13 can simultaneously process a plurality of (N) substrates W. Hereinafter, for the sake of simplicity, a case where two substrates W are collectively processed will be described. The case where the N substrates W are not collectively processed will be described in detail later.
<3-1-1. conveying robot 81>
The conveyance robot 81 includes a hand H1, a moving mechanism 51, a lifting mechanism 52, and a rotating mechanism 53. The moving mechanism 51 can move the hand H1 in a horizontal plane. For example, the moving mechanism 51 has a pair of arms (not shown). Each arm has a plurality of elongated connecting members whose ends are rotatably connected to each other. Each arm is connected at one end to hand H1 and at the other end to lifting mechanism 52. By controlling the connection angle of the connection member, the hand H1 can be moved in the horizontal plane. The lifting mechanism 52 lifts and lowers the hand H1 by lifting and lowering the arm in the vertical direction. The lifting mechanism 52 has, for example, a ball screw mechanism. The rotation mechanism 53 can rotate the elevation mechanism 52 around a rotation axis in the vertical direction. Thereby, the hand H1 rotates in the circumferential direction. By this rotation, the orientation of the hand H1 can be changed. The rotation mechanism 53 has a motor, for example.
Two substrates W are placed in a state of being aligned in a horizontal direction (the left-right direction in fig. 3) in the hand H1. The hand H1 has, for example, a plurality of finger members F1, and a base end member P1 that connects the base ends of the finger members F1 to each other. One end of the arm is connected to the base end member P1. The finger member F1 has a long strip shape, and a substrate W is placed on the upper surface thereof. The two substrates W are placed side by side in the longitudinal direction (the left-right direction in fig. 3) of the finger member F1. Therefore, the length of the finger member F1 in the longitudinal direction is set according to the length of the two substrates W and the distance between the substrates W.
The conveyance robot 81 can move and rotate the hand H1 as appropriate, thereby moving the hand H1 to the heating unit 82, the cooling unit 83, the substrate lead-out unit 33 of the cleaning device 12, and the coating-related device 14 (not shown in fig. 3) in the next step. The conveyance robot 81 may collectively take out two substrates W from the substrate lead-out section 33, the heating section 82, and the cooling section 83, or collectively transfer two substrates W to the heating section 82, the cooling section 83, and the coating-related device 14.
For example, the transport robot 81 collectively takes out two substrates W from the substrate lead-out portion 33 as follows. That is, the transport robot 81 moves the hand H1 to the substrate lead-out section 33 so that the hand H1 is positioned below the two substrates W held by the substrate lead-out section 33.
The rollers 331 and 332 are configured to avoid collision with the hand H1 of the transport robot 81. Then, the transport robot 81 can lift up the two substrates W by the hand H1 by vertically raising the hand H1 upward. Thereby, the two substrates W are separated from the rollers 331 and 332, respectively. The two substrates W are placed on the hand H1 at intervals in the longitudinal direction of the hand H1. The two substrates W are placed on the hand H1 in a posture in which the normal direction of the main surfaces thereof is perpendicular.
The two substrates W may be placed on the hand H1 at intervals in the lateral direction (short side direction) of the hand H1. This mounting method is realized by, for example, providing a turntable and rotating the substrate W by 90 degrees.
Next, the transport robot 81 moves the hand H1 away from the substrate lead-out unit 33 to collectively take out two substrates W from the substrate lead-out unit 33.
A plurality of suction ports may be formed in the upper surface (surface on which the substrate W is placed) of the finger member F1. The suction ports are provided at positions facing the two substrates W, and air is drawn out from the suction ports to suck the substrates W. This can improve the holding force for holding the substrate W.
The conveyance robot 81 collectively takes out two substrates W from the heating unit 82 and the cooling unit 83 by the same operation as described above. On the other hand, the conveyance robot 81 collectively delivers two substrates W to the heating unit 82, the cooling unit 83, and the coating-related device 14 (hereinafter, each unit) in reverse order to the above-described operation. That is, the transport robot 81 moves the hand H1 on which the two substrates W are placed into each portion, and lowers the hand H1 to place the two substrates W on the upper surface of the substrate holding portion of each portion. The substrate holding portions of the respective portions are configured to avoid collision with the hand H1 when two substrates W are carried in and out. Then, the transport robot 81 moves the hand H1 from the inside to the outside of each part. Thereby, the two substrates W are collectively delivered to each portion.
As described above, the transport robot 81 can hold N (two) substrates W among the plurality of substrates W processed by the cleaning device 12 as the sequential processing device in parallel in one horizontal direction, and collectively transport the N (two) substrates W to the dehydration baking device 13 as the simultaneous processing device. By collectively conveying a plurality of substrates W, the throughput of the conveying operation can be improved as compared with the case where the substrates W are conveyed one by one.
<3-1-2. heating section 82>
The two substrates W from the transport robot 81 are collectively transferred to the heating unit 82. The heating unit 82 includes a substrate holding unit 91 that holds the two substrates W in parallel in the horizontal direction, and a heating unit 92 that performs heating processing on the two substrates W at once. In other words, the heating unit 82 performs the heating process simultaneously on the two substrates W.
The substrate holding unit 91 has a member for supporting the lower surfaces of the two substrates W. The two substrates W are held by being mounted on the member. The two substrates W are placed in a posture in which the normal direction of the main surfaces thereof is vertical. For example, the substrate holding portion 91 includes a plurality of lift pins (not shown). The plurality of lift pins are raised and lowered between an upper position where their tips protrude from the upper surface of the substrate holding portion 91 and a lower position where they are retracted below the upper surface. The conveyance robot 81 transfers the two substrates W to the plurality of lift pins protruding upward, and then retracts them from the heating unit 82. The plurality of lift pins are lowered while supporting the two substrates W, and the two substrates W are placed on the upper surface of the substrate holding portion 91.
The heating unit 92 is, for example, a heater, and performs a heating process on the two substrates W held by the substrate holding unit 91 at once. This heating process can evaporate pure water remaining on the substrate W (dehydration process), for example. By performing the heat treatment on a plurality of substrates W at once, the throughput of the heat treatment can be improved as compared with the case where the heat treatment is performed on the substrates W one by one.
The heating mechanism 92 may be built in the substrate holding portion 91, for example. Further, the heating portion 82 may be provided with a plurality of heating mechanisms 92. The plurality of heating mechanisms 92 may be disposed adjacent to each other in a plan view and controlled independently of each other. The two substrates W are placed at positions vertically opposed to the plurality of heating mechanisms 92, for example. In this case, the temperatures in the plurality of regions of the two substrates W in the plan view can be adjusted for each of the regions. If the size of the substrate W in a plan view is increased, it is difficult to uniformly heat the substrate W by the single heating mechanism 92, but the substrate W can be more uniformly heated by providing a plurality of heating mechanisms 92.
The heating portion 82 may further include a temperature sensor 95 that measures the temperature of the substrate W. The heating portion 82 may be provided with a plurality of temperature sensors 95. The respective temperature sensors 95 measure temperatures of regions different from each other in plan view. For example, the temperature sensor 95 may be provided in one-to-one correspondence with the heating mechanism 92. In this case, the temperature sensor 95 measures the temperature of the heating target region of the corresponding heating mechanism 92.
The temperature measured by the temperature sensor 95 is output to the control section 60. The control unit 60 may control the heating mechanism 92 based on the measured temperature measured by the temperature sensor 95, for example. This makes it possible to more uniformly bring the temperature of the substrate W close to the target value.
<3-1-3. Cooling section 83>
The two substrates W heated by the heating unit 82 are collectively transferred from the conveyance robot 81 to the cooling unit 83. That is, the transport robot 81 holds two substrates W processed by the heating unit 82 after being processed by the cleaning unit 12 as the sequential processing unit in a horizontal direction, and transports the two substrates W to the cooling unit 83 at once. The cooling unit 83 includes a substrate holding unit 93 for holding the two substrates W in parallel in the horizontal direction, and a cooling mechanism 94 for collectively performing a cooling process on the two substrates W. In other words, the cooling unit 83 simultaneously performs the cooling process on the two substrates W.
The substrate holding unit 93 includes a member (not shown) for supporting the lower surfaces of the two substrates W. The two substrates W are held by being mounted on the member. The two substrates W are placed in a posture in which the normal direction of the main surfaces thereof is vertical. The substrate holding portion 93 has the same structure as the substrate holding portion 91.
The cooling mechanism 94 is, for example, a cooling plate that causes cold water to flow through a liquid path formed inside the metal plate, and collectively performs a cooling process on the two substrates W held by the substrate holding unit 93. The cooling mechanism 94 is controlled by the control unit 60. By this cooling process, the two substrates W are cooled, and the temperatures of the two substrates W can be set to the temperature suitable for the processing apparatus (coating-related apparatus 14) on the downstream side. By performing the cooling process on the two substrates W at once, the throughput of the cooling process can be improved as compared with the case where the cooling process is performed on the substrates W one by one.
The cooling mechanism 94 may be built in the substrate holding portion 93, for example. Further, the cooling portion 83 may be provided with a plurality of cooling mechanisms 94. The plurality of cooling mechanisms 94 may be disposed adjacent to each other in a plan view and controlled independently of each other. The two substrates W are placed at positions vertically opposed to the plurality of cooling mechanisms 94, for example. In this case, the temperatures in the plurality of regions of the substrate W in the plan view can be adjusted for each of the regions. If the size of the substrate W in a plan view is increased, it is difficult to uniformly heat the substrate W by the single cooling mechanism 94, but the substrate W can be more uniformly cooled by providing a plurality of cooling mechanisms 94.
The cooling portion 83 may further include a temperature sensor 96 that measures the temperature of the substrate W. The cooling portion 83 may be provided with a plurality of temperature sensors 96. The respective temperature sensors 96 detect temperatures of different regions from each other in a plan view. For example, the temperature sensor 96 may be provided in one-to-one correspondence with the cooling mechanism 94. In this case, the temperature sensor 96 measures the temperature of the cooling image area of the corresponding cooling mechanism 94.
The temperature measured by the temperature sensor 96 is output to the control section 60. The control unit 60 may control the cooling mechanism 94 based on, for example, the measured temperature measured by the temperature sensor 96. This makes it possible to more uniformly bring the temperature of the substrate W close to the target value.
The cooling unit 83 may cool the two substrates W by natural cooling. The natural cooling means that the heated substrate W is cooled without using power (electric power), and the substrate W is left to be cooled. In this case, the cooling mechanism 94 configured as a cooling plate or the like is not necessary.
<3-1-4 > A series of treatments in a dehydration baking apparatus >
Next, a series of processes of the dehydration baking apparatus 13 will be briefly described. The conveyance robot 81 takes out two substrates W collectively from the substrate lead-out portion 33 of the cleaning device 12 on the upstream side, and collectively transfers the two substrates W to the heating portion 82. In the heating unit 82, two substrates W are also held in a state of being arranged in parallel in the horizontal direction. The heating unit 82 performs a heating process on the two substrates W collectively. The two substrates W after the heat treatment are collectively taken out by the conveyance robot 81 and collectively transferred to the cooling unit 83. In the cooling unit 83, the two substrates W are also held in a state of being arranged in parallel in the horizontal direction. The cooling unit 83 collectively performs a cooling process on the two substrates W. The two substrates W subjected to the cooling process are collectively taken out by the conveyance robot 81 and collectively conveyed to the coating-related apparatus 14.
<4. control section >
As illustrated in fig. 1, the substrate processing apparatus 1 includes a control unit 60 that controls processing and substrate conveyance in each processing apparatus. Fig. 4 is a functional block diagram schematically showing an example of the configuration of the control unit 60.
The control Unit 60 is a control circuit, and as shown in fig. 4, is constituted by a general-purpose computer such as a CPU (Central Processing Unit) 61, a ROM (Read Only Memory) 62, a RAM (Random Access Memory) 63, and a storage device 64, which are connected to each other via a bus 65. The ROM62 stores basic programs and the like, and the RAM63 provides a work area when the CPU61 performs predetermined processing. The storage device 64 is a nonvolatile storage device such as a flash memory or a hard disk drive.
Further, in the control section 60, an input section 66, a display section 67, and a communication section 68 are also connected to the bus 65. The input unit 66 is configured by various switches, a touch panel, and the like, and receives various input setting instructions such as a procedure from an operator. The display section 67 is constituted by a liquid crystal display device, a lamp, and the like, and displays various information under the control of the CPU 61. The communication unit 68 has a data communication function via a LAN (Local Area Network) or the like.
Further, each robot (e.g., a transport robot such as an indexer robot) and each processing device described above are connected to the control unit 60 as objects to be controlled. That is, the control unit 60 may be used as a conveyance control unit that controls conveyance of the substrate W.
The storage device 64 of the control unit 60 stores a processing program P for controlling each device constituting the substrate processing apparatus 1. The CPU61 of the control unit 60 executes the processing program P to control the substrate conveying operation and the substrate processing operation. Further, the processing program P may be stored in a storage medium. By using this storage medium, the processing program P can be installed in the control section 60 (computer). Note that a part or all of the functions executed by the control unit 60 need not necessarily be realized by software, and may be realized by hardware such as a dedicated logic circuit.
The control portion 60 may have a multi-layer structure. For example, the control section 60 may include a main control section and a plurality of end control sections. The end control unit is provided in each processing unit such as an indexer block 11, a cleaning unit 12, a dehydration baking unit 13, a coating-related unit 14, a pre-baking unit 15, an exposure unit 16, a developing unit 17, and a post-baking unit 18. The main control unit is provided in the substrate processing apparatus 1 and communicates with the plurality of end control units. The main control unit manages the overall operation of the substrate processing apparatus 1, and the end control unit controls the operation of each corresponding apparatus.
The plurality of end controls may communicate with each other. For example, data related to the substrate W is transmitted and received between the end control sections. The data relating to the substrates W indicates, for example, data of the substrates W in units of groups, and information indicating the processing contents of the substrates W is included in the data. The end control section controls the corresponding device and processes the substrate W based on the data of the substrate W received from the end control section on one upstream side. For example, the end controller of the cleaning device 12 receives data of the substrates W from the end controller of the indexer block 11, and the substrates W are carried into the cleaning device 12 in units of groups. The end controller of the cleaning device 12 controls the cleaning device 12 based on the received data of the substrate, and performs a cleaning process on the carried-in substrate W. After the processing of the substrates W is completed, the substrates W are transported to the dehydration baking apparatus 13 in units of a group, and data of the substrates W is transmitted from the end control unit of the cleaning apparatus 12 to the end device of the dehydration baking apparatus 13. Hereinafter, the treatment is performed in the same manner.
<5. Collection of Process parameters >
As described above, the substrate processing apparatus 1 is provided with various sensors (for example, flow sensors 345, 359, 364, pressure sensors 357, 358, and temperature sensors 95, 96). These sensors can be said to be sensors that measure process related parameters. Hereinafter, the sensor provided in the simultaneous processing device 40 (for example, the dehydration baking device 13) may be referred to as a first sensor, and the sensor provided in the sequential processing device 30 (for example, the cleaning device 12) may be referred to as a second sensor.
Examples of the first sensor include temperature sensors 95 and 96. The temperature sensors 95, 96 measure the temperature of the substrate W as a parameter (first parameter) related to the process. As the second sensors, flow sensors 345, 359, 364 and pressure sensors 357, 358 are exemplified. The flow rate sensors 345, 359, 364 measure the flow rate of the fluid supplied to the substrate W as a parameter (second parameter) related to the process. The pressure sensors 357 and 358 measure the pressure of the fluid supplied to the substrate W as a parameter (second parameter) related to the process.
The control unit 60 associates the parameters measured by the first sensor and the second sensor with the substrate W, and stores the parameters in a nonvolatile storage medium (for example, the storage device 64). Hereinafter, the collection of the parameters will be described for each of the sequential processing device 30 and the simultaneous processing device 40. In the following, as an example, the conveyance and the processing will be described for each set including two substrates W.
<5-1. Collection of parameters of the sequential processing apparatus 30 >
As described above, two substrates W belonging to one group are collectively carried into the substrate introduction portion 31 of the sequential processing apparatus 30. The sequential processing apparatus 30 sequentially transfers two substrates W carried in one by one and sequentially processes the respective substrates W. Specifically, first, the downstream substrate W2 of the two substrates W is conveyed to process the substrate W2 by the processing apparatus main body 32, and then the upstream substrate W1 is conveyed to process the substrate W1 by the processing apparatus main body 32. Hereinafter, the description will be given by taking the substrate W2 as a representative.
In the chemical solution portion 34, the chemical solution is supplied from the nozzle 341 to the substrate W2. Thus, the substrate W2 was processed in accordance with the chemical solution. The flow rate of the chemical liquid supplied to the substrate W2 is measured by the flow rate sensor 345, and a measurement signal indicating the measured value is output from the flow rate sensor 345 to the control unit 60.
Subsequently, the substrate W2 is conveyed to the water washing unit 35. In the water washing unit 35, the substrate W2 is first conveyed to the low pressure water supply unit 351, and washing water is supplied from the liquid knife 35a to the substrate W2. The pressure of the cleaning water supplied to the substrate W2 is measured by the pressure sensor 357, and the measurement signal is output from the pressure sensor 357 to the controller 60.
Subsequently, the substrate W2 is conveyed to the high-pressure water supply unit 352, and cleaning water is supplied from the nozzle of the high-pressure water supply unit 352 to the substrate W2. The pressure of the cleaning water supplied to the substrate W2 is measured by the pressure sensor 358, and the measurement signal is output from the pressure sensor 358 to the control unit 60.
Subsequently, the substrate W2 is conveyed to the ultrasonic cleaning water supply unit 353, and cleaning water is supplied from the nozzle 35b to the substrate W2. The pressure of the cleaning water supplied to the substrate W2 is measured by the flow rate sensor 359, and a measurement signal is output from the flow rate sensor 359 to the control unit 60.
Subsequently, the substrate W2 is transferred to the pure water supply unit 354, and pure water is supplied to the substrate W2 from the nozzle of the pure water supply unit 354. The pure water supply unit 354 may be provided with a flow sensor for detecting the flow rate of pure water supplied to the substrate W2, and in this case, the measurement signal is output from the flow sensor to the control unit 60.
As described above, the substrate W2 is cleaned by supplying the cleaning water and the pure water to the substrate W2 in sequence in the water washing unit 35.
Subsequently, the substrate W2 is conveyed to the water removing unit 36, and gas is supplied from the ejection unit 361 of the water removing unit 36 to the substrate W2. Thereby, the liquid adhering to the substrate W2 is blown off. The flow rate of the gas supplied to the substrate W2 is measured by the flow rate sensor 364, and the measurement signal is output from the flow rate sensor 364 to the control unit 60.
The controller 60 associates the flow rates measured by the flow rate sensors 345, 359, and 364 and the pressures measured by the pressure sensors 357 and 358 with the substrate W2, and stores the data in the storage device 64 as sequentially collected data, for example. That is, the controller 60 stores the parameter measured by the second sensor in association with the substrate W2 in the storage device 64 during the processing of the substrate W2 by the sequential processing apparatus 30.
Fig. 5 is a diagram schematically showing an example of sequentially collecting data with respect to the substrate W2. In the example of fig. 5, the collected data includes group identification information Da1, position information Db1, and processing information Dd1 in this order. The group identification information Da1 and the position information Db1 are information for identifying the substrate W, and will be described in detail later. The processing information Dd1 is information indicating the measured values (so-called actual measurement values) of the parameters measured by the respective second sensors. In the example of fig. 5, the sequentially collected data includes five pieces of processing information Dd1 based on the flow sensors 345, 359, 364 and the pressure sensors 357, 358 of the cleaning device 12. In the example of fig. 5, the measured values are schematically indicated with "×".
In the above example, the description was made on the substrate W2, and the same applies to the substrate W1. That is, the controller 60 stores the parameter measured by the second sensor in association with the substrate W1, for example, in the storage device 64 during the processing of the substrate W1 by the sequential processing apparatus 30. Fig. 6 is a diagram schematically showing an example of sequentially collecting data with respect to the substrate W1. In the example of fig. 6, the sequentially collected data on the substrate W1 also includes group identification information Da1, position information Db1, and processing information Dd 1.
The group identification information Da1 is information for identifying a group of the substrates W. The group is constituted by, for example, N (two in this case) substrates W1, W2. Here, since the substrates W1, W2 belong to the same group, the group identification information Da1 of the substrates W1, W2 are the same as each other. In the example of fig. 5 and 6, "pair k" is indicated as the group identification information Da 1. For example, as the "k" value of the group identification information Da1 becomes larger, it indicates that the group is located on the upstream side. The position information Db1 is information indicating the position within the group of substrates W. Here, since the substrate W2 is located on the downstream side of the substrate W1, the position information Db1 (see fig. 5) of the substrate W2 indicates "downstream", and the position information Db1 (see fig. 6) of the substrate W1 indicates "upstream". The substrates W can be identified based on the group identification information Da1 and the position information Db1, respectively.
In the above example, the cleaning apparatus 12 has been described as the sequential processing apparatus 30, but the same applies to the other sequential processing apparatuses 30. The other sequential processing device 30 is also provided with a second sensor measuring a parameter related to the process. The control section 60 associates the parameter measured by the second sensor in the processing of the substrate W2 with the substrate W2 and stores it in the storage device 64, for example. Specifically, the controller 60 adds the process information Dd1 indicating the measured value of the parameter measured by the second sensor of the other sequential processing apparatus 30 to the sequentially collected data of the substrates W2. The same applies to the substrate W1. In fig. 5 and 6, the presence of the processing information Dd1 corresponding to the other sequential processing device 30 is schematically indicated by vertically arranged black circles.
As described above, although the substrates W are carried in the sequential processing apparatus 30 in units of groups, the substrates W1, W2 belonging to the group are carried in the sequential processing apparatus 30 one by one, and the substrates W1, W2 are processed one by one. That is, the substrates W1, W2 are processed separately at different timings. For example, before the substrate W1, the chemical liquid is supplied to the substrate W2 from the nozzle 341 of the chemical liquid portion 34, and then the chemical liquid is supplied to the substrate W1 from the nozzle 341. The flow rate of the chemical solution discharged from the nozzle 341 may vary with the passage of time, and the flow rates of the chemical solutions supplied to the substrates W1, W2 may be different from each other. That is, even for example, the substrates W1, W2 belonging to the same group may have different parameters in the sequential processing apparatus 30. Therefore, the controller 60 stores the parameters measured in the sequential processing apparatus 30 in association with the substrates W1 and W2 individually.
<5-2. Collection of parameters in Simultaneous processing apparatus 40>
As described above, the simultaneous processing apparatus 40 also carries in the substrates W in groups. That is, two substrates W1, W2 belonging to one set are collectively carried into the simultaneous processing apparatus 40. Then, the simultaneous processing apparatus 40 collectively processes the two carried-in substrates W1, W2.
For example, two substrates W1, W2 are collectively carried in the heating unit 82, and the heating unit 82 collectively heats two substrates W1, W2. The temperature sensor 95, which is an example of the first sensor, measures the temperature of the substrates W1 and W2, and outputs the measurement signal to the controller 60. The controller 60 may control the heating mechanism 92 based on the temperatures of the substrates W1, W2 measured by the temperature sensor 95 and the target values of the heating temperatures. This makes it possible to bring the temperature of the substrates W1 and W2 close to the target value of the heating temperature. The temperatures of the substrates W1 and W2 were controlled to be almost the same values.
The two substrates W1, W2 are collectively carried into the cooling unit 83. The cooling unit 83 cools the two substrates W1 and W2 together. The temperature sensor 96, which is an example of the first sensor, measures the temperature of the substrates W1 and W2, and outputs the measurement signal to the controller 60. The controller 60 may control the cooling mechanism 94 based on the temperatures of the substrates W1, W2 measured by the temperature sensor 96 and the target values of the cooling temperature. This makes it possible to bring the temperature of the substrates W1 and W2 close to the target value of the cooling temperature. The temperatures of the substrates W1 and W2 were controlled to be almost the same values.
The control section 60 associates the temperature measured by the temperature sensor 95 in the heating process of the substrates W1, W2 by the heating section 82 with the group of substrates W1, W2, and stores the same as simultaneous collection data in the storage device 64, for example. Similarly, the control section 60 associates the temperature measured by the temperature sensor 96 in the cooling process of the substrates W1, W2 by the cooling section 83 with the group of substrates W1, W2, and stores the same as the simultaneous collection data in the storage device 64, for example.
Fig. 7 is a diagram schematically showing an example of simultaneous data collection. In the example of fig. 7, the simultaneous collection data includes group identification information Da1, substrate presence/absence information De1, target information Df1, and process information Dd 1. The board presence/absence information De1 is information indicating the board configuration of the group. Here, since both the substrates W1 and W2 constitute a group, in the example of fig. 7, the substrate presence/absence information De1 indicates "two substrates" of both the substrates W1 and W2.
The target information Df1 is a target value of a parameter related to the process. As a more specific example, the target information Df1 indicates the target temperature of the substrate W in the heating section 82 and the target temperature of the substrate W in the cooling section 83, respectively. In the example of fig. 7, the target information Df1 in the heating unit 82 and the processing information Dd1 for the temperature sensor 95 are shown vertically adjacent to each other, and the target information Df1 in the cooling unit 83 and the processing information Dd1 for the temperature sensor 96 are also shown vertically adjacent to each other. In the example of fig. 7, the measured values and the target values are schematically indicated by ". times..
In the above example, the heating unit 82 and the cooling unit 83 are described as the simultaneous processing apparatus 40, but the same applies to the other simultaneous processing apparatuses 40. The other simultaneous processing device 40 is also provided with a first sensor for measuring a parameter related to the process. The controller 60 stores the parameters measured by the first sensors in the processing of the substrates W1, W2 by the simultaneous processing device 40 in association with the group of substrates W1, W2 in the storage device 64, for example. Specifically, the controller 60 adds the process information Dd1 indicating the measured value of the parameter measured by the first sensor of the other simultaneous processing apparatus 40 to the simultaneous collection data of the substrates W1 and W2. Further, the target information Df1 of the other simultaneous processing device 40 may be added to the simultaneous collection data. In the example of fig. 7, the presence of the processing information Dd1 and the target information Df1 corresponding to the other simultaneous processing devices 40 is schematically indicated by vertically arranged black circles.
As described above, the simultaneous processing apparatus 40 carries in the substrates W in units of groups. Then, the simultaneous processing apparatus 40 collectively processes the substrates W in units of groups. Here, the simultaneous processing apparatus 40 processes the substrates W1, W2 at once. Therefore, the substrates W1 and W2 in the simultaneous processing apparatus 40 have smaller variations in parameters (e.g., temperature) and are almost the same as each other, as compared with the sequential processing apparatus 30 that processes at different timings. Therefore, the control section 60 associates and stores the parameters measured in the simultaneous processing device 40 with the groups of the substrates W1, W2 individually. Thus, the parameters in the simultaneous processing apparatus 40 can be collected with a smaller storage capacity than in the case where the parameters are individually associated with the substrates W1, W2.
<6. deficiency of substrate >
In the above example, the case where two substrates W1, W2 are included in a set has been described. However, in at least one of the plurality of sets, one of the substrates W1 and W2 may be missing. Hereinafter, a case where one of the substrates W1 and W2 is missing in the cassette loaded in the substrate processing apparatus 1 will be described as a specific example.
Fig. 8 and 9 are views schematically showing a state in which a plurality of substrates W are stored in a cassette 10 for each set. The cassette 10 is loaded into the indexer block 11. The plurality of substrates W are stored in different storage positions (slots) in the cassette 10 for each group. The different slots in fig. 8 and 9 are located above and below in the figure.
In the example of fig. 8, two substrates W1, W2 are accommodated in each of the grooves in parallel in the left-right direction. The indexer robot of the indexer block 11 collectively takes out the substrates W1 and W2 from the respective slots of the cassette 10 and carries them into the cleaning device 12. Thus, each slot corresponds to a group. In the example of fig. 8, since the substrates W1 and W2 are accommodated in all the slots, the indexer robot takes out two substrates W1 and W2 collectively from any one of the slots. In this case, all the groups are constituted by two substrates W1, W2.
On the other hand, in the example of fig. 9, the grooves for accommodating two substrates W and the groove for accommodating only one substrate W are present at the same time. Specifically, in the example of fig. 9, the second slot from the top accommodates the substrate W1 only on the left side, and the fifth slot from the top accommodates the substrate W2 only on the right side. Two substrates W1, W2 are accommodated in the other grooves in a lateral direction. In this case, the number of substrates W taken out of the cassette 10 by the indexer robot differs depending on the groove.
The indexer robot can take out the substrates W from the grooves of the cassette 10 in order from above, for example. In this case, the indexer robot first takes out the substrates W1 and W2 collectively from the uppermost slot and conveys them to the cleaning device 12. The group is composed of substrates W1 and W2. Subsequently, the indexer robot takes out one substrate W1 from the second tank and carries it into the cleaning apparatus 12. The group is constituted only by the substrate W1. Thereafter, similarly, the indexer robot takes out the substrates W from the respective grooves of the cassette 10 and conveys the substrates W to the cleaning device 12. The indexer robot may be referred to as a transport unit that transports N or fewer substrates W (two substrates W in this case).
When both the substrates W1 and W2 are taken out, one set is composed of the substrates W1 and W2. When only the substrate W1 is to be taken out, one group is constituted by only the substrates W1. That is, the substrates W2 are missing from the group. When only the substrate W2 is to be taken out, one group is constituted by only the substrates W2. That is, the substrates W1 are missing from the group.
Since the indexer robot takes out and conveys the substrates W in the cassette 10 to the cleaning device 12 one by one for each slot, the substrates W1, W2, only the substrates W1, and only the substrates W2 may be collectively carried in the cleaning device 12.
The controller 60 can know the state of the substrates W stored in the cassette 10. For example, the storage information indicating whether or not the substrate W is present at each position of each slot of the cassette 10 is input to the control unit 60. Based on the storage information, the control unit 60 can know the substrate configuration of each group. The storage information may be input to the control unit 60 by an operator through the input unit 66, or may be transmitted to the control unit 60 from a device on the upstream side of the substrate processing apparatus 1, or a sensor that detects the presence or absence of the substrate W in the cassette 10 may be provided in the substrate processing apparatus 1.
Since the controller 60 can know the substrate configuration (presence or absence of each of the substrates W1 and W2) of each group based on the storage information, the conveyance and processing of the substrates W can be managed for each group by controlling the substrate processing apparatus 1 based on the storage information. The control unit 60 may also know the substrate configuration of the group using the detection results of the sensors 314 and 315 of the substrate introduction unit 31 of the cleaning apparatus 12. Alternatively, when a sensor for detecting the presence or absence of the substrate W is provided on the hand of the indexer robot, the controller 60 may know the substrate configuration of the group based on the detection result of the sensor.
The conveyance and processing of the group including both the substrates W1 and W2 are as described above. That is, the cleaning apparatus 12 sequentially carries the substrates W1 and W2 and sequentially processes the substrates W1 and W2. Then, when both the substrates W1 and W2 are conveyed to the substrate lead-out portion 33, the conveyance robot 81 conveys both the substrates W1 and W2 to the dehydration baking apparatus 13. The dehydration baking apparatus 13 collectively processes the substrates W1 and W2. Specifically, the heating unit 82 performs heating processing on the loaded substrates W1 and W2 collectively. When the heat treatment is completed, the substrates W1 and W2 are collectively conveyed to the cooling unit 83 by the conveyance robot 81. The cooling unit 83 cools the loaded substrates W1 and W2. When the cooling process is completed, the substrates W1 and W2 are transported to the downstream side by the transport robot 81. Thereafter, in this group, the substrates W1, W2 are transported to the other simultaneous processing apparatus 40 and the other sequential processing apparatus 30, and are processed in the other simultaneous processing apparatus 40 and the other sequential processing apparatus 30.
On the other hand, for example, in a group including only the substrate W2, the indexer robot carries only the substrate W2 into the substrate introduction unit 31 of the cleaning device 12. The substrate W2 is placed on the roller 313 of the substrate introduction section 31 and detected by the sensor 315. The substrate introduction unit 31 may carry in two substrates W1, W2 collectively, or may carry in one substrate W.
The controller 60 rotates the rollers 313 synchronously to convey the substrate W2 to the processing apparatus main body 32. The substrate W2 is subjected to various processes in the processing apparatus main body 32 and is conveyed to the rollers 332 of the substrate lead-out portion 33. The substrate W2 is detected by the sensor 335 of the substrate lead-out portion 33. Since the group lacks the substrate W1, the transfer robot 81 takes out the substrate W2 from the substrate lead-out section 33 and transfers the substrate W2 to the dehydration baking device 13 (heating unit 82) without waiting for the detection of the substrate W1 by the sensor 334 of the substrate lead-out section 33. The conveyance robot 81 may be referred to as a conveyance unit that conveys N or less (two substrates W in this case).
Fig. 10 is a plan view schematically showing an example of the structure of the dewatering and baking apparatus 13. In the example of fig. 10, only the substrate W2 is carried in the heating unit 82. The heating unit 82 performs a heating process only on the loaded substrate W2. When the heat treatment is completed, the substrate W2 is conveyed to the cooling unit 83 by the conveyance robot 81. The cooling unit 83 performs a cooling process only on the loaded substrate W2. When the cooling process is completed, the substrate W2 is transported to the downstream device by the transport robot 81. Thereafter, only the substrate W2 in this group is transported to the other simultaneous processing apparatus 40 and the other sequential processing apparatus 30, and is processed in the other simultaneous processing apparatus 40 and the other sequential processing apparatus 30. The same applies to the group including only the substrate W1.
<6-1. Collection of parameters >
Next, the collection of parameters of a group including only one substrate W will be described. Hereinafter, a group including only the substrate W2 will be described as a representative group.
As described above, when only the substrate W2 is loaded into the substrate introduction section 31 of the cleaning device 12, the cleaning device 12 carries and processes the loaded substrate W2. In this process, the second sensors (the flow rate sensors 345, 359, and 364 and the pressure sensors 357 and 358) measure parameters, and the measurement signals are output to the control unit 60. The controller 60 associates the parameter measured by the second sensor with the substrate W2, and stores the parameter in the storage device 64 as sequentially collected data, for example. The data collected for the substrate W2 in sequence is the same as in fig. 5.
When the substrate W2 reaches the substrate lead-out portion 33, that is, when the sensor 335 of the substrate lead-out portion 33 detects the substrate W2, the conveyance robot 81 takes out the one substrate W2 from the substrate lead-out portion 33 and conveys the one substrate W to the heating unit 82.
The heating unit 82 performs a heating process on only one loaded substrate W2 (see fig. 10). In this process, the temperature sensor 95 measures the temperature of the substrate W2 and outputs a measurement signal to the control unit 60. In this case, the control unit 60 stores the temperature measured by the temperature sensor 95 in the storage device 64 as collected data while associating the temperature with one substrate W2. Fig. 11 is a diagram schematically showing an example of simultaneous data collection for a group including only the substrate W2. In the example of fig. 11, the substrate presence/absence information De1 indicates that only the downstream substrate W2 is present in the group as the "downstream substrate". In the example of fig. 11, target information Df1 indicating the heating temperature and processing information Dd1 indicating the temperature measured by the temperature sensor 95 are also displayed adjacent to each other.
When the heating process by the heating unit 82 is completed, the transport robot 81 takes out one substrate W2 from the heating unit 82 and transports it to the cooling unit 83. The cooling unit 83 performs a cooling process on the single loaded substrate W2. In this process, the first sensor (temperature sensor 96) measures the temperature of the substrate W2 and outputs a measurement signal to the control unit 60. In this case, the control unit 60 stores the temperature measured by the temperature sensor 96 in the storage device 64 as collected data while associating the temperature with one substrate W2. In the example of fig. 11, target information Df1 indicating the cooling temperature and processing information Dd1 indicating the temperature measured by the temperature sensor 96 are displayed adjacent to each other.
In the above example, the case where the group including only the substrate W2 is configured was described, but the case where the group including only the substrate W1 is configured is also the same. That is, the parameters measured in the sequential processing apparatus 30 (e.g., the cleaning apparatus 12) are associated with the substrate W1 and stored as sequentially collected data in the storage device 64, for example. The data collected for the substrate W1 in sequence is the same as in fig. 6.
The parameters measured in the simultaneous processing device 40 (e.g., the dehydration baking device 13) are associated with one substrate W1 and are stored as collected data in the storage device 64, for example. Fig. 12 is a diagram schematically showing an example of simultaneous data collection for a group including only the substrate W1. In the example of fig. 12, the substrate presence/absence information De1 indicates that only the upstream substrate W1 is present as the "upstream substrate". In the example of fig. 12, target information Df1 indicating the heating temperature and process information Dd1 indicating the temperature measured by the temperature sensor 95 are also adjacently indicated, and target information Df1 indicating the cooling temperature and process information Dd1 indicating the temperature measured by the temperature sensor 96 are adjacently indicated.
In the above example, the case where each of the grooves in the cassette 10 is empty as a defect of the substrate W is described. However, when an abnormality occurs in the processing of the substrate W in the substrate processing apparatus 1, the substrate W in which the abnormality occurs may be excluded from the substrate processing apparatus 1. The type of the abnormality is not particularly limited, and the abnormality may be a crack in the substrate W. The substrate processing apparatus 1 can interrupt its operation when an abnormality occurs. Then, the operator manually excludes the substrate W having the abnormality from the substrate processing apparatus 1. At this time, the operator inputs information indicating which substrate W is excluded to the input unit 66. Thereby, the controller 60 can know which substrate W is excluded.
<6-2. flow chart >
Here, in the cassette 10 shown in fig. 9, the operation of the substrate processing apparatus 1 will be described with respect to the simultaneous processing apparatus 40 as the main component, the uppermost substrates W1 and W2, and the second substrate W1. First, the two substrates W1 and W2 in the uppermost tank are taken out and processed, and then one substrate W1 in the second tank is taken out and processed. Fig. 13 is a flowchart showing an example of the operation of the simultaneous processing device 40. Here, the simultaneous processing device 40 is exemplified by the heating unit 82 of the dehydration baking device 13.
When the processing of the cleaning device 12 for the substrates W1, W2 accommodated in the uppermost slot of the cassette 10 is completed, the transport robot 81 takes out two substrates W1, W2 from the substrate lead-out portion 33 of the cleaning device 12 and collectively carries them into the heating unit 82 as an example of the simultaneous processing device 40 (step S1).
Next, the heating unit 82 collectively heats the two substrates W1, W2 (step S2). In parallel with this heating process, the temperature sensor 95 measures the temperature of the substrates W1, W2 (step S3). That is, the temperature sensor 95 measures the temperature of the substrates W1 and W2 during the processing of the two substrates W1 and W2 by the heating unit 82. When the heating process is completed, the transport robot 81 collectively takes out two substrates W1, W2 from the heating unit 82, and transports the substrates W1, W2 to the cooling unit 83 (step S4).
When the processing of the cleaning device 12 for the substrates W1 stored in the second tank of the cassette 10 is completed, the transport robot 81 takes out one substrate W1 from the substrate lead-out portion 33 of the cleaning device 12 and carries it into the heating portion 82 (step S5).
Next, the heating unit 82 heat-processes the single substrate W1 (step S6). In parallel with this heating process, the temperature sensor 95 measures the temperature of the substrate W1 (step S7). That is, the temperature sensor 95 measures the temperature of the substrate W1 during processing of one substrate W1 by the heating unit 82. When the heating process is completed, the transport robot 81 takes out one substrate W1 from the heating unit 82 and transports the substrate W1 to the cooling unit 83 (step S8).
Next, the control unit 60 associates and stores the first parameter measured in step S3 with the two substrates W1 and W2 processed in step S2, and associates and stores the first parameter measured in step S7 with the one substrate W1 processed in step S6 (step S9). Further, the control portion 60 may associate and store the first parameter measured in step S3 with the two substrates W1, W2 processed in step S2 in response to the end of the heat treatment in step S2.
<7. Effect >
As described above, in the present embodiment, the parameter measured by the first sensor of the simultaneous processing device 40 is associated with a group and stored in the control unit 60.
In the simultaneous processing apparatus 40, as described above, the processing timings for the respective substrates W are substantially the same. Therefore, the parameters of the substrates W belonging to the same group have small variations and are almost the same. When such parameters are stored in association with the substrates W alone, the amount of data of the collected data increases, and the storage capacity of the storage device 64 is consumed in a large amount.
In contrast, in the present embodiment, the parameters measured by the first sensor of the simultaneous processing device 40 are associated with the group and stored in the control unit 60. Thereby, the parameters can be collected with a smaller amount of data.
When the number of the substrates W constituting the group varies, the parameters measured by the first sensor of the simultaneous processing device 40 are collected based on the variation in the number of the substrates W. Specifically, when two substrates W are collectively loaded into the simultaneous processing device 40, the control unit 60 stores the parameter measured by the first sensor in association with the two substrates W (see fig. 7), and when one substrate W is collectively loaded into the simultaneous processing device 40, the control unit 60 stores the parameter measured by the first sensor in association with the one substrate W (see fig. 11 and 12).
More generally, when N substrates W are collectively loaded into the simultaneous processing apparatus 40, the control unit 60 stores the parameter measured by the first sensor during the processing of the N substrates W in association with the group of the N substrates W, and when M (M is an integer of 1 or more and less than N) substrates W are collectively loaded into the simultaneous processing apparatus 40, the control unit 60 stores the parameter measured by the first sensor during the processing of the M substrates W in association with the group of the M substrates W.
Accordingly, even if the number of substrates W constituting a group varies, the parameter can be collected based on the varied number of substrates W. This enables appropriate parameter collection in accordance with a variation in the number of substrates W.
In the above example, the parameters measured by the second sensors of the sequential processing apparatus 30 are stored in the control unit 60 in association with the substrates W individually, not in association with the group. In the sequential processing apparatus 30, the timings of processing for the respective substrates W are different from each other, and therefore, the parameters measured by the second sensors of the sequential processing apparatus 30 are different for each substrate W even if, for example, the same set is used. In particular, in the sequential processing apparatus 30 such as the cleaning apparatus 12 for supplying the fluid to the substrate W, the flow rate and pressure of the fluid are likely to vary with time, and thus the variation in the parameters becomes large.
In the above example, the parameter measured by the second sensor of the sequential processing apparatus 30 is stored in the control unit 60 in association with the substrate W alone, not in association with the group. Thereby, the parameters can be appropriately collected without losing the deviation information on the parameters between the substrates W.
<8. notification of Process parameters >
When the operator wants to confirm the collected data (sequentially collect data and simultaneously collect data), the operator inputs a notification instruction of the collected data to the input unit 66. In response to this input, the control unit 60 notifies the operator of, for example, the sequentially collected data and the simultaneously collected data stored in the storage device 64. For example, the control unit 60 causes the display unit 67 to display the sequentially collected data and the simultaneously collected data. Thus, the operator can confirm the first parameter and the second parameter for the substrate W, and can confirm whether the processing of the substrate W is appropriate.
For example, the operator can confirm these differences by comparing the simultaneous collected data of the group including both the substrates W1, W2 (see fig. 7) and the simultaneous collected data of the group including only one of the substrates W1, W2 (see fig. 11 and 12). For example, there is a case where the measured temperature of the temperature sensor 95 of the group including only one of the substrates W1, W2 is higher than the measured temperature of the temperature sensor 95 of the group including both the substrates W1, W2. This is because the temperature of the substrate W in the heating portion 82 is more likely to increase as the number of substrates W decreases. In this case, the target value of the heating temperature when only one of the substrates W1, W2 is processed may be updated to a smaller value so that the measured temperature is closer to the target value of the heating temperature. Such an update may be input to the controller 60 by an operator inputting a new target value for processing only one of the substrates W1 and W2 to the input unit 66, for example.
Further, the operator can check these differences by comparing the sequentially collected data of the respective substrates W with each other. When the difference is larger than the allowable value, the operator can use the difference for, for example, determination of whether or not the valve (not shown) in each pipe of the cleaning apparatus 12 needs to be adjusted, determination of whether or not the filter (not shown) in the pipe needs to be replaced, and determination of whether or not the drive system of the pump needs to be changed.
<9. modified example >
In the above example, the control unit 60 appropriately associates and collects the parameters measured during the processing with the substrate W. The measurement timing of the parameter to be collected is not particularly limited. The control unit 60 may store parameters measured at appropriate times during the processing. The length of the period from the start of the process on each substrate W to the measurement time may be a common length between the plurality of substrates W or may be slightly different. When the sensor repeatedly measures the parameter during the processing of the substrate W, the control unit 60 calculates a time statistic value (for example, an average value) of the parameter, and stores the statistic value as the parameter of the substrate W.
Further, in the case where a plurality of sensors (for example, a plurality of temperature sensors 95) that measure the same parameter are provided, the control section 60 may store at least one of a plurality of parameters measured by the plurality of sensors. Alternatively, the control unit 60 may store statistical values (for example, average values) of the plurality of parameters.
Although the embodiment of the substrate processing apparatus has been described above, various modifications other than the above can be made without departing from the spirit of the embodiment. The various embodiments and modifications described above can be implemented in appropriate combinations.
For example, the sizes of the substrates W1, W2 may be different from each other. Further, the control portion 60 may have a multilayer structure. For example, the control section 60 may include a main control section and a plurality of end control sections. The end control unit is provided in each processing unit of the indexer block 11, the cleaning unit 12, the dehydration baking unit 13, the coating-related unit 14, the pre-baking unit 15, the exposure unit 16, the developing unit 17, and the post-baking unit 18, for example. The main control unit is provided in the substrate processing apparatus 1 and communicates with the plurality of end control units. When a plurality of substrate processing apparatuses 1 are provided, a central control unit that centrally manages the substrate processing apparatuses 1 may be provided. The central control unit communicates with the main control units of the plurality of substrate processing apparatuses 1. The measurement signals of the sensors in the respective devices are transmitted to the end control section to be collected. The collected data may be transmitted from the end control unit to the higher main control unit and the central control unit. Thus, the central control unit can manage the collected data of the plurality of substrate processing apparatuses 1.

Claims (3)

1. A substrate processing apparatus, comprising:
a simultaneous processing unit capable of collectively processing N substrates, N being an integer of 2 or more;
a conveying unit configured to collectively convey N or fewer substrates to the simultaneous processing unit;
a first sensor provided in the simultaneous processing section and measuring a first parameter relating to a process of the simultaneous processing section; and
and a control unit that, when N substrates are carried in from the transport unit in the simultaneous processing unit, associates and stores the first parameter measured by the first sensor in the processing of the N substrates by the simultaneous processing unit with the N substrates, and when M substrates are carried in from the transport unit in the simultaneous processing unit, associates and stores the first parameter measured by the first sensor in the processing of the M substrates by the simultaneous processing unit with the M substrates, where M is an integer of 1 or more and less than N.
2. The substrate processing apparatus of claim 1, comprising:
a sequential processing unit including a substrate introduction unit into which N substrates can be collectively loaded, the sequential processing unit sequentially carrying the substrates from the substrate introduction unit and sequentially processing the substrates; and
a second sensor provided in the sequential processing section and measuring a second parameter relating to processing by the sequential processing section,
the control unit associates and stores the second parameter detected by the second sensor during the processing by the sequential processing unit with the substrate.
3. A method of processing a substrate, comprising:
a step of collectively loading N substrates into the simultaneous processing section, wherein N is an integer of 2 or more;
a step in which the simultaneous processing unit processes the N substrates collectively;
measuring a first parameter related to the processing of the simultaneous processing unit by a first sensor in the processing of the N substrates by the simultaneous processing unit;
a step of taking out the N substrates from the simultaneous processing unit;
a step of collectively carrying M substrates into the simultaneous processing section, M being an integer of 1 or more and less than N;
a step in which the simultaneous processing unit collectively processes the M substrates;
measuring the first parameter by the first sensor during the processing of the M substrates by the simultaneous processing unit;
a step of taking out the M substrates from the simultaneous processing unit; and
and storing the first parameter measured by the first sensor during the processing of the N substrates by the simultaneous processing unit in association with the N substrates, and storing the first parameter measured by the first sensor during the processing of the M substrates by the simultaneous processing unit in association with the M substrates.
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