CN114253066B - Nanometer imprinting equipment capable of measuring structural accuracy and imprinting method - Google Patents
Nanometer imprinting equipment capable of measuring structural accuracy and imprinting method Download PDFInfo
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- CN114253066B CN114253066B CN202111487129.6A CN202111487129A CN114253066B CN 114253066 B CN114253066 B CN 114253066B CN 202111487129 A CN202111487129 A CN 202111487129A CN 114253066 B CN114253066 B CN 114253066B
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- stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Abstract
The invention provides a nano imprinting device and an imprinting method capable of measuring structural accuracy, comprising a cavity, a left door and a right door which are positioned on the cavity, an imprinting unit, a detection unit and a transmission unit, wherein the detection unit is used for detecting the structural accuracy of the nano imprinting device; the detection unit is positioned on the right side of the cavity and adjacent to the right door and comprises a wafer tray, an XY axis displacement platform and a film thickness detection probe; the transmission unit is positioned between the embossing unit and the detection unit, so that the testing process is simplified, the working efficiency is improved, missing defects are avoided, and the detection automation is realized, so that manpower and material resources are saved.
Description
Technical Field
The invention relates to the technical field of nanoimprint, in particular to nanoimprint equipment and an imprinting method capable of measuring structural accuracy.
Background
The nanoimprint technology is a technology for transferring a micro-nano structure on a template to a material to be processed by the assistance of photoresist. With the rapid development of nanoimprint technology, the size of nanoimprint products is larger and larger, but the critical size of elements is smaller and smaller, defects in the products are difficult to distinguish by naked eyes, if the structural accuracy of the nanoimprint products exceeds tolerance value with the deviation of original dies, the products cannot be used in etching processes, and the traditional test can only achieve spot inspection, and has long time and low efficiency.
Disclosure of Invention
The invention aims to overcome the technical defects and provide the nano imprinting equipment and the imprinting method capable of measuring the structural accuracy, which simplify the testing process and improve the working efficiency.
The technical scheme adopted by the invention for realizing the technical purpose is as follows: the nano imprinting equipment capable of measuring the structural precision comprises a cavity, a left door and a right door which are positioned on the cavity, an imprinting unit, a detection unit and a transmission unit;
the imprinting unit is positioned at the left side of the cavity and adjacent to the left door, the imprinting unit comprises an upper part and a lower part, the upper part comprises a pressing plate and a clamp, a soft mold is further arranged between the pressing plate and the clamp, the soft mold is adsorbed on the pressing plate by means of vacuum, the clamp is adsorbed and fixed on the pressing plate by means of magnetic force, and the clamp clamps and fixes the soft mold;
the pressing plate is fixed at the top of the cavity through a bracket, an ultraviolet lamp is arranged right above the pressing plate at the top of the cavity, a transparent part for passing ultraviolet rays is arranged in the middle of the pressing plate, and a hollowed-out part is arranged in the middle of the clamp;
the lower part of the imprinting unit comprises an up-and-down moving device, a heating device and a tray are arranged above the up-and-down moving device, and a substrate is adsorbed above the tray through vacuum;
the detection unit is positioned on the right side of the cavity and adjacent to the right door, and comprises a wafer tray, a displacement platform and a detection probe; the transmission unit is positioned between the imprinting unit and the detection unit and comprises a manipulator and a vacuum adsorption substrate.
Preferably, the width of the transparent part in the middle of the pressing plate is consistent with the width of the tray.
Preferably, the width of the hollowed-out part in the middle of the clamp is larger than the width of the tray.
Preferably, the displacement platform is an XY axis displacement platform, and the detection probe is a film thickness detection probe.
The nano imprinting equipment capable of measuring the structural accuracy comprises the following steps:
A. the right door is opened, and the original mold is put into a wafer tray of the detection unit;
B. the film thickness detection probe moves on an XY axis displacement platform according to the set path, tests the depth of the multipoint structure and transmits the depth to a computer in real time;
C. the mechanical arm moves, the original mold is adsorbed in vacuum, then the mold moves to a tray in the imprinting unit, and the mechanical arm returns to the original position;
D. the embossing unit executes a copying process, a left door is opened, PET is fixed, then dispensing is performed, and a tray slowly moves upwards;
E. until the glue is uniformly covered on the surface of the original mold, and then curing the glue by an ultraviolet lamp;
F. demoulding after curing, and taking out the original mould from the left door after demoulding;
G. the left side door is closed, the right side door is opened, the stamping substrate is placed in a tray of the detection unit, the thickness of the substrate at the same point position is tested by a film thickness detection probe according to a program, and the thickness is transmitted to a computer in real time, so that the flatness of the substrate is ensured to meet the stamping requirement;
H. the mechanical arm moves, vacuum adsorbs the substrate, then moves to the tray in the imprinting unit, and returns to the original position;
I. the embossing unit executes a copying process, a left door is opened, PET is fixed, then dispensing is performed, and a tray slowly moves upwards;
J. until the glue is uniformly covered on the surface of the original mold, and then curing the glue by an ultraviolet lamp;
K. demoulding after solidification, moving a mechanical arm, moving a vacuum adsorption stamping sheet onto a wafer tray of a detection unit, testing the stamping structure depth of the same point by a film thickness detection probe, comparing the stamping structure depth with the original mould structure depth by software, and calculating deviation;
and L, taking the stamping sheet out of the left door, and then replacing the stamping substrate with the other stamping substrate to continue stamping.
The beneficial effects of the invention are as follows: the nano imprinting equipment capable of measuring the structural precision comprises a cavity, a left door and a right door which are positioned on the cavity, an imprinting unit, a detection unit and a transmission unit; the detection unit is positioned on the right side of the cavity and adjacent to the right door and comprises a wafer tray, an XY axis displacement platform and a film thickness detection probe; the transmission unit is positioned between the embossing unit and the detection unit, so that the testing process is simplified, the working efficiency is improved, missing defects are avoided, and the detection automation is realized, so that manpower and material resources are saved.
Drawings
FIG. 1 is a schematic diagram of the overall principle of the present invention;
FIG. 2 is a schematic diagram of the structure of the embossing unit in FIG. 1;
fig. 3 is a schematic view of the structure of the pressing plate and the clamp in fig. 2.
Marked in the figure as: 1. a cavity; 2. a left door; 3. a right door; 4. an embossing unit;
5. a detection unit; 6. a transmission unit; 41. a pressing plate; 411. a transparent portion; 42. a clamp;
421. a hollowed-out part; 43. a flexible mold; 44. a bracket; 45. an ultraviolet lamp; 46. a vertical movement device; 47. A heating device; 48. a tray; 49. a substrate; 51. a wafer tray; 52. a displacement platform; 53. A detection probe; 61. a manipulator; 62. and (5) vacuum adsorbing the substrate.
Detailed Description
The invention will be further described with reference to examples of drawings.
Example 1
As shown in fig. 1-3: the nano imprinting equipment capable of measuring the structural precision comprises a cavity 1, a left door 2 and a right door 3 which are positioned on the cavity 1, an imprinting unit 4, a detection unit 5 and a transmission unit 6;
the embossing unit 4 is positioned at the left side of the cavity 4 and adjacent to the left door 2, the embossing unit 4 comprises an upper part and a lower part, the upper part comprises a pressing plate 41 and a clamp 42, a soft mold 43 is further arranged between the pressing plate 41 and the clamp 42, the soft mold 43 is adsorbed on the pressing plate 41 by means of vacuum, the clamp 42 is adsorbed and fixed on the pressing plate 41 by means of magnetic force, and the clamp 42 clamps and fixes the soft mold 43;
the pressing plate 41 is fixed at the top of the cavity 1 through a bracket 44, an ultraviolet lamp 45 is further arranged right above the pressing plate 41 at the top of the cavity 1, a transparent part 411 for passing ultraviolet rays is arranged in the middle of the pressing plate 41, and a hollowed part 421 is arranged in the middle of the clamp 42;
the lower part of the embossing unit 4 comprises an up-and-down moving means 46, a heating means 47 and a tray 48 are installed above the up-and-down moving means 46, and a substrate 49 is adsorbed above the tray 48 by vacuum; the detection unit 5 is positioned on the right side of the cavity 1 and adjacent to the right door 3, and comprises a wafer tray 51, a displacement platform 52 and a detection probe 53;
the transfer unit 6 is located between the imprint unit 4 and the detection unit 5, and includes a robot 61 and a vacuum adsorption substrate 62.
The width of the transparent part 411 in the middle of the pressing plate 41 is consistent with the width of the tray 48.
The width of the hollowed-out portion 421 in the middle of the clamp 42 is greater than the width of the tray 48.
The displacement platform 52 is an XY axis displacement platform, and the detection probe 53 is a film thickness detection probe. The imprinting method comprises the following steps:
A. the right door is opened, and the original mold is put into a wafer tray of the detection unit;
B. the film thickness detection probe moves on an XY axis displacement platform according to the set path, tests the depth of the multipoint structure and transmits the depth to a computer in real time;
C. the mechanical arm moves, the original mold is adsorbed in vacuum, then the mold moves to a tray in the imprinting unit, and the mechanical arm returns to the original position;
D. the embossing unit executes a copying process, a left door is opened, PET is fixed, then dispensing is performed, and a tray slowly moves upwards;
E. until the glue is uniformly covered on the surface of the original mold, and then curing the glue by an ultraviolet lamp;
F. demoulding after curing, and taking out the original mould from the left door after demoulding;
G. the left side door is closed, the right side door is opened, the stamping substrate is placed in a tray of the detection unit, the thickness of the substrate at the same point position is tested by a film thickness detection probe according to a program, and the thickness is transmitted to a computer in real time, so that the flatness of the substrate is ensured to meet the stamping requirement;
H. the mechanical arm moves, vacuum adsorbs the substrate, then moves to the tray in the imprinting unit, and returns to the original position;
I. the embossing unit executes a copying process, a left door is opened, PET is fixed, then dispensing is performed, and a tray slowly moves upwards;
J. until the glue is uniformly covered on the surface of the original mold, and then curing the glue by an ultraviolet lamp;
K. demoulding after solidification, moving a mechanical arm, moving a vacuum adsorption stamping sheet onto a wafer tray of a detection unit, testing the stamping structure depth of the same point by a film thickness detection probe, comparing the stamping structure depth with the original mould structure depth by software, and calculating deviation;
and L, taking the stamping sheet out of the left door, and then replacing the stamping substrate with the other stamping substrate to continue stamping.
Claims (1)
1. The nanoimprint method capable of measuring the structural accuracy is characterized by comprising the following steps of:
A. the right door is opened, and the original mold is put into a wafer tray of the detection unit;
B. the film thickness detection probe moves on an XY axis displacement platform according to the set path, tests the depth of the multipoint structure and transmits the depth to a computer in real time;
C. the mechanical arm moves, the original mold is adsorbed in vacuum, then the mold moves to a tray in the imprinting unit, and the mechanical arm returns to the original position;
D. the embossing unit executes a copying process, a left door is opened, PET is fixed, then dispensing is performed, and a tray slowly moves upwards;
E. until the glue is uniformly covered on the surface of the original mold, and then curing the glue by an ultraviolet lamp;
F. demoulding after curing, and taking out the original mould from the left door after demoulding;
G. the left side door is closed, the right side door is opened, the stamping substrate is placed in a tray of the detection unit, the thickness of the substrate at the same point position is tested by a film thickness detection probe according to a program, and the thickness is transmitted to a computer in real time, so that the flatness of the substrate is ensured to meet the stamping requirement;
H. the mechanical arm moves, vacuum adsorbs the substrate, then moves to the tray in the imprinting unit, and returns to the original position;
I. the embossing unit executes a copying process, a left door is opened, PET is fixed, then dispensing is performed, and a tray slowly moves upwards;
J. until the glue is uniformly covered on the surface of the stamping substrate, and then curing the glue by an ultraviolet lamp;
K. demoulding after solidification, moving a mechanical arm, moving a vacuum adsorption stamping sheet onto a wafer tray of a detection unit, testing the stamping structure depth of the same point by a film thickness detection probe, comparing the stamping structure depth with the original mould structure depth by software, and calculating deviation; and L, taking the stamping sheet out of the left door, and then replacing the stamping substrate with the other stamping substrate to continue stamping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111487129.6A CN114253066B (en) | 2021-12-07 | 2021-12-07 | Nanometer imprinting equipment capable of measuring structural accuracy and imprinting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111487129.6A CN114253066B (en) | 2021-12-07 | 2021-12-07 | Nanometer imprinting equipment capable of measuring structural accuracy and imprinting method |
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| Publication Number | Publication Date |
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| CN114253066A CN114253066A (en) | 2022-03-29 |
| CN114253066B true CN114253066B (en) | 2023-07-11 |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011053013A (en) * | 2009-08-31 | 2011-03-17 | Nof Corp | Method of inspecting nanoimprint molding laminate |
| CN202229742U (en) * | 2011-07-26 | 2012-05-23 | 上海卓晶半导体科技有限公司 | Membrane thickness detecting probe structure |
| JP6302287B2 (en) * | 2014-03-04 | 2018-03-28 | 東芝メモリ株式会社 | Imprint apparatus and pattern forming method |
| CN207901825U (en) * | 2018-03-07 | 2018-09-25 | 宁波微迅新材料科技有限公司 | Full-automatic roll-to-roll logo precise positionings UV nano-imprinting apparatus |
| JP7093214B2 (en) * | 2018-04-02 | 2022-06-29 | キヤノン株式会社 | Imprint device management method, imprint device, flattening layer forming device management method, and article manufacturing method |
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