CN114248043B - Composition for flux, and solder paste - Google Patents
Composition for flux, and solder paste Download PDFInfo
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- CN114248043B CN114248043B CN202111091357.1A CN202111091357A CN114248043B CN 114248043 B CN114248043 B CN 114248043B CN 202111091357 A CN202111091357 A CN 202111091357A CN 114248043 B CN114248043 B CN 114248043B
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- flux
- rosin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The subject of the invention is to inhibit residue cracking of flux residue. The present invention provides a flux composition comprising one or more first rosin compounds selected from the group consisting of imidized maleic acid-modified rosin and hydrides of imidized maleic acid-modified rosin. The present invention also provides a flux, which contains the flux composition and is used for soldering a solder alloy. In addition, the invention provides a solder paste, wherein the soldering flux and the solder alloy are contained.
Description
Technical Field
The present invention relates to a flux composition, a flux, and a solder paste.
Background
The mounting of electronic components and the like on a printed circuit board, and the fixing and electrical connection of electronic components in electronic devices are generally performed by soldering which is advantageous in terms of cost and reliability.
Examples of the method commonly used in soldering include (i) a flow soldering method in which a printed circuit board and an electronic component are brought into contact with molten solder to perform soldering, and (ii) a reflow soldering method in which solder paste, solder preform, or solder in the form of a solder ball is remelted in a reflow furnace to perform soldering.
In soldering, a flux, which is an auxiliary agent for facilitating adhesion of solder to a printed circuit board or an electronic component, is sometimes used. The flux performs the following useful functions in soldering, for example.
(1) Metal surface cleaning action: the oxide film on the metal surfaces of the printed circuit board and the electronic component is chemically removed, so that the surfaces are cleaned to a solderable effect.
(2) Prevention of reoxidation: the cleaned metal surface is covered during welding to block contact with oxygen, thereby preventing reoxidation of the metal surface due to heating.
(3) Interfacial tension reducing action: the effect of lowering the surface tension of the molten solder to increase the wettability of the solder with the metal surface.
The use of rosin derivatives as soldering fluxes is known. For example, patent document 1 describes that a rosin derivative compound obtained by dehydrating and condensing a rosin-based carboxyl group-containing resin with a dimer acid derivative flexible alcohol compound is used as a soldering flux.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2014-185298.
Disclosure of Invention
As described above, the flux achieves a useful function in soldering. However, the use of flux is not without problems.
For example, in the conventional flux, there is a case where "residue cracks" occur in the flux residue after soldering. Such cracks are problematic in terms of reliability of printed circuit boards or electronic components.
The present invention has been made in view of such circumstances. An object of the present invention is to suppress residue cracking of flux residue.
The present inventors completed the invention provided below and have solved the above-mentioned problems.
According to the present invention, there is provided a composition for soldering flux comprising one or more first rosin compounds selected from the group consisting of imidized maleic acid-modified rosin and a hydride of imidized maleic acid-modified rosin.
Further, according to the present invention, there is provided a flux comprising the above composition for a flux and used for soldering a solder alloy.
In addition, according to the present invention, there is provided a solder paste, which contains the above flux and a solder alloy.
According to the present invention, residue cracking of flux residue can be suppressed.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail.
In the present specification, the expression "X to Y" in the description of the numerical ranges indicates X or more and Y or less unless otherwise specified. For example, "1 to 5 mass%" means "1 mass% or more and 5 mass% or less".
In the chemical formulas in the present specification, the bonds represented by wavy lines represent the steric configuration of unspecified bonds. In other words, each compound represented by each general formula described below may be a racemate or may be only one compound having a specific configuration.
In the expression of the group (atomic group) in the present specification, the expression of whether substituted or unsubstituted is not indicated includes both of the unsubstituted group and the substituted group. For example, "alkyl" refers to not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
The expression "(meth) acrylic acid" in the present specification means a concept including both acrylic acid and methacrylic acid. The same applies to "(meth) acrylate" and the like.
Composition for soldering flux
The flux composition of the present embodiment includes one or more first rosin compounds selected from the group consisting of imidized maleic acid-modified rosin and a hydride thereof.
According to the findings of the present inventors, since the flux contains the first rosin compound, the flux residue after soldering becomes moderately soft, and thus, residue cracking is suppressed.
The first rosin compound specifically contains one or two or more compounds selected from the group consisting of a compound having a partial structure represented by the following general formula (1-1) or (1-2), and a hydride of the compound (a compound hydrogenated on a carbon-carbon double bond in the general formula).
In the above formula, the term "a" means a chemical bond with another chemical structure.
Preferably, the first rosin compound contains one or two or more compounds selected from the group consisting of compounds represented by the following general formulae (1 a-1) or (1 a-2), and hydrides of the compounds (compounds hydrogenated on carbon-carbon double bonds in the general formulae).
In the above formula, R each independently represents a linear or branched alkyl group, an alkylene glycol group or a terminally modified polyalkylene oxide group. By setting R to any one of these groups, the flux residue after soldering tends to become sufficiently soft.
In each group of R, a hydrogen atom may be substituted with an optional substituent.
The alkylene glycol group of R is preferably a 1-valent group represented by the following formula (i). In the formula (i), R 1 Each independently represents a straight-chain or branched alkylene group having 1 to 4 carbon atoms, and n represents an integer of 1 to 500.
H-(OR 1 ) n - (i)
The terminal modified polyalkylene oxide group of R is preferably a 1-valent group represented by the following formula (ii). In the formula (ii), R 1 Each independently represents a linear or branched alkylene group having 1 to 4 carbon atoms, X represents an amino group, a linear or branched alkyl ester group having 1 to 40 carbon atoms, or a linear or branched alkyl ether group having 1 to 40 carbon atoms, and n represents an integer of 0 to 500.
X-R 1 -(OR 1 ) n - (ii)
The number of carbon atoms of the alkyl group represented by R is not particularly limited, but is preferably 1 to 54, more preferably 4 to 24, still more preferably 8 to 22, and particularly preferably 12 to 22.
The number of carbon atoms of the alkylene glycol group and the terminal-modified polyalkylene oxide group represented by R is not particularly limited, but is preferably 1 to 500, more preferably 4 to 24, still more preferably 8 to 22, and particularly preferably 12 to 22.
In the formulae (i) and (ii), the number of carbon atoms of the alkyl moiety of X is preferably 1 to 24, R 1 The number of carbon atoms of (2) is preferably 1 to 3. In the formulae (i) and (ii), n is preferably 1 to 500, more preferably 1 to 100, and further preferably 1 to 10.
Examples of the terminal-modified polyalkylene oxide group include a group obtained by adding an alcohol having 1 to 40 carbon atoms such as cetyl alcohol, stearyl alcohol, and behenyl alcohol, or a carboxylic acid having 1 to 40 carbon atoms such as palmitic acid, stearic acid, and behenic acid to the hydroxyl terminal of a polyalkylene glycol such as polyethylene glycol, polypropylene glycol, and a copolymer of ethylene oxide and propylene oxide; and a group in which the hydroxyl end of a polyalkylene glycol such as a copolymer of ethylene oxide and propylene oxide is modified to an amino group.
The molecular weight of the first rosin compound is, for example, 1000 or less, preferably 850 or less, and more preferably 700 or less. Since the molecular weight does not become excessively large, the flux is hard to harden, thereby further suppressing the residue cracking.
The flux composition of the present embodiment preferably further comprises one or more second rosin compounds selected from the group consisting of maleic acid-modified rosin amides and hydrides thereof. Thereby further suppressing residue cracking. The details are not clear, but it is considered that the flux residue after soldering may be sufficiently softened by making the flux composition of the present embodiment a mixture of the first rosin compound and the second rosin compound.
The second rosin compound specifically contains one or two or more compounds selected from the group consisting of compounds having a partial structure represented by the following general formulae (2-1), (2-2), (3-1) or (3-2) and hydrides thereof (compounds hydrogenated on carbon-carbon double bonds in the general formulae).
In the above formula, the term "a" means a chemical bond with another chemical structure.
Preferably, the second rosin compound contains one or more selected from the group consisting of compounds represented by the following general formulae (2 a-1), (2 a-2), (3 a-1) or (3 a-2) and hydrides thereof.
In the above formula, R each independently represents a substituted or unsubstituted linear or branched alkyl group, an alkylene glycol group or a terminally modified polyalkylene oxide group. Specific examples or preferred embodiments of these groups are the same as those of the general formulae (1 a-1) and (1 a-2).
In the flux composition of the present embodiment, when the compound represented by the general formula (1 a-1) or (1 a-2) is contained as the first rosin compound and the compound represented by the general formula (2 a-1), (2 a-2), (3 a-1) or (3 a-2) is contained as the second rosin compound, that is, both are contained, it is preferable that R in the general formula (1 a-1) or (1 a-2) is common to R in the general formula (2 a-1), (2 a-2), (3 a-1) or (3 a-2). This is for ease of synthesis and the like.
The molecular weight of the second rosin compound is, for example, 1000 or less, preferably 850 or less, and more preferably 700 or less. Since the molecular weight does not become excessively large, the flux is hard to harden, thereby further suppressing the residue cracking.
In the case where the flux composition of the present embodiment contains both the first rosin compound and the second rosin compound, the mass ratio of the first rosin compound to the second rosin compound, for example, the first rosin compound, from the viewpoint of sufficiently obtaining the effect of "containing both", is: second rosin compound = 1:99 to 99:1, specifically 5: 95-95: 5.
the mass ratio of the first rosin compound to the second rosin compound can be known, for example, by mass analysis of the bopring as a clue.
Examples of the raw material of the maleic acid-modified rosin as the raw material of the first rosin compound or the second rosin compound include gum rosin, tall oil rosin, wood rosin, purified products (purified rosin) of these, and the like. Raw rosin and commercially available gum rosin described in "pine chemical production, chemistry and use" (written in D.F.Zinkel, J.Russell, length Gu Chuanji Hongyan (1993), 361-362) can be used as raw rosin. By reacting these raw materials with an appropriate amine compound, a first rosin compound or a second rosin compound can be obtained (by appropriately selecting the reaction conditions, a mixture of the first rosin compound and the second rosin compound can also be obtained).
Flux >
The flux of the present embodiment contains the above-described composition for flux and is used for soldering a solder alloy.
The total amount (ratio) of the first rosin compound and the second rosin compound in the flux is preferably more than 0 mass% and 60 mass% or less with respect to the entire flux. The lower limit is more preferably 5 mass% or more, still more preferably 10 mass% or more, still more preferably 20 mass% or more, and particularly preferably 30 mass% or more. The upper limit is more preferably 50 mass% or less, and still more preferably 40 mass% or less. The larger the content of the first rosin compound or the second rosin compound, the more remarkable the effect of suppressing the residue cracking of the flux residue tends to be.
The flux of the present embodiment may contain components (such as resins) other than the first rosin compound and the second rosin compound contained in the flux composition.
As the resin, various resins used in the conventional soldering flux can be used. Examples of such resins include rosin-based resins, (meth) acrylic resins, polyesters, polyethylenes, polypropylenes, polyamides, styrene-maleic acid copolymers, epoxy resins, phenolic resins, phenoxy resins, terpene phenolic resins, and mixtures of these. Among them, rosin-based resins are generally used. Examples of the rosin-based resin include natural rosins such as gum rosin and wood rosin, and derivatives thereof (polymerized rosin, hydrogenated rosin, disproportionated rosin, acid-modified rosin, rosin ester, and the like).
The rosin-based resin herein is a component different from the first rosin compound and the second rosin compound.
The content of the resin in the flux is not limited. When used as a flux for reflow soldering, the amount of the flux may be in the range of 10 to 80 mass%, 20 to 70 mass%, or 30 to 60 mass%, for example. In the case of using the flux for flow soldering, for example, the flux may be in the range of 3 to 18 mass%, may be in the range of 6 to 15 mass%, and may be in the range of 9 to 12 mass%.
The flux of the present embodiment may contain a solvent.
Examples of the solvent include water, alcohol solvents, glycol ether solvents, terpineols, and the like.
As the alcohol-based solvent, a solvent, examples thereof include isopropanol, 1, 2-butanediol, isobornyl cyclohexanol, 2, 4-diethyl-1, 5-pentanediol, 2-dimethyl-1, 3-propanediol, 2, 5-dimethyl-2, 5-hexanediol, 2, 5-dimethyl-3-hexyne-2, 5-diol, 2, 3-dimethyl-2, 3-butanediol, 1-tris (hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1, 3-propanediol, 2' -oxybis (methylene) bis (2-ethyl-1, 3-propanediol) 2, 2-bis (hydroxymethyl) -1, 3-propanediol, 1,2, 6-trihydroxyhexane, bis [2, 2-tris (hydroxymethyl) ethyl ] ether, 1-acetylene-1-cyclohexanol, 1, 4-cyclohexanediol, 1, 4-cyclohexanedimethanol, erythritol, threitol, guaifenesin, 3, 6-dimethyl-4-octyne-3, 6-diol, 2,4,7, 9-tetramethyl-5-decyne-4, 7-diol, and the like.
Examples of the glycol ether solvents include diethylene glycol hexyl ether, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2, 4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether, and tetraethylene glycol monomethyl ether.
The flux of the present embodiment may further contain an organic acid, an amine, a halogen (an organic halogen compound, an amine hydrohalate), or may not contain (the content may be 0%). These can contribute to the activator (improved weldability).
When the flux according to the present embodiment is used as a flux for reflow soldering, it preferably contains more than 0 mass% and 10 mass% or less of an organic acid. When the flux according to the present embodiment is used as a flux for reflow soldering, the flux preferably contains more than 0% by mass and 20% by mass or less of amine, and more preferably contains more than 0% by mass and 5% by mass or less of amine. When the flux according to the present embodiment is used as a flux for reflow soldering, the halogen preferably contains more than 0 mass% and 5 mass% or less of an organic halogen compound, and preferably contains more than 0 mass% and 2 mass% or less of an amine halogen acid salt.
When the flux according to the present embodiment is used as a flux for flow soldering, the flux preferably contains 0.1 mass% or more and 12.0 mass% or less of an activator, more preferably contains 0.3 mass% or more and 8.0 mass% or less, and still more preferably contains 0.5 mass% or more and 4.0 mass% or less.
Examples of the organic acid include glutaric acid, adipic acid, azelaic acid, eicosanedioic acid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutylanilinedioglycolic acid, suberic acid, sebacic acid, thioglycolic acid, terephthalic acid, dodecanedioic acid, p-hydroxyphenylacetic acid, phenylsuccinic acid, phthalic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, tartaric acid, tris (2-carboxyethyl) isocyanurate, glycine, 1, 3-cyclohexanedicarboxylic acid, 2-bis (hydroxymethyl) propionic acid, 2-bis (hydroxymethyl) butyric acid, 2, 3-dihydroxybenzoic acid, 2, 4-diethylglutaric acid, 2-quinolinecarboxylic acid, 3-hydroxybenzoic acid, malic acid, p-anisic acid, stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid, linolenic acid, and the like.
Examples of the organic acid include dimer acid, trimer acid, hydrogenated dimer acid which is a hydride to be hydrogenated to dimer acid, hydrogenated trimer acid which is a hydride to be hydrogenated to trimer acid, and the like.
For example, the number of the cells to be processed, examples of the dimer acid include dimer acid as a reactant of oleic acid and linoleic acid, trimer acid as a reactant of oleic acid and linoleic acid, dimer acid as a reactant of acrylic acid, trimer acid as a reactant of acrylic acid, dimer acid as a reactant of methacrylic acid, trimer acid as a reactant of methacrylic acid, dimer acid as a reactant of acrylic acid and methacrylic acid, trimer acid as a reactant of acrylic acid and methacrylic acid, dimer acid as a reactant of oleic acid, trimer acid as a reactant of oleic acid, dimer acid as a reactant of linoleic acid, dimer acid as a reactant of linolenic acid, trimer acid as a reactant of linolenic acid, dimer acid as a reactant of acrylic acid and oleic acid, trimer acid as a reactant of acrylic acid and oleic acid dimer acid as a reactant of acrylic acid and linoleic acid, dimer acid as a reactant of acrylic acid and linolenic acid, trimer acid as a reactant of acrylic acid and linolenic acid, dimer acid as a reactant of methacrylic acid and oleic acid, trimer acid as a reactant of methacrylic acid and linoleic acid, dimer acid as a reactant of methacrylic acid and linolenic acid, dimer acid as a reactant of oleic acid and linolenic acid, dimer acid as a reactant of linoleic acid and linolenic acid, trimer acid as a reactant of linoleic acid and linolenic acid, hydrogenated dimer acids as the hydrides of the above dimer acids, hydrogenated trimer acids as the hydrides of the above trimer acids, and the like.
As the amine, there may be mentioned monoethanolamine, diphenylguanidine, xylylguanidine, ethylamine, triethylamine, cyclohexylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1, 2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-diamino-6- [2 '-methylimidazole- (1') ] -ethyl-s-triazine, 2, 4-diamino-6- [2 '-undecylimidazole- (1') ] -ethyl-s-triazine, 2, 4-diethyl-2 '-undecylimidazole-s-triazine, 2-ethyl-2' -cyanoethyl-2-undecylimidazole-s-triazine, 2, 4-diamino-6- [2 '-methylimidazolyl- (1') ] -ethyl-s-triazine isocyanuric acid addition product, 2-phenylimidazole isocyanuric acid addition product, 2-phenyl-4, 5-dimethylol imidazole, 2-phenyl-4-methyl-5-hydroxymethyl imidazole, 2, 3-dihydro-1H-pyrrolo [1,2-a ] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2, 4-diamino-6-vinyl-s-triazine isocyanuric acid addition product, 2, 4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy-imidazole addition product, 2-methylbenzimidazole, 2-octylbenzimidazole, 2-pentylbenzoimidazole, 2- (1-ethylpentyl) benzimidazole, 2-nonylbenzimidazole, 2- (4-thiazolyl) benzimidazole, 2- (2 '-hydroxy-5' -methylbenzotriazole), 2- (2 '-hydroxy-phenyl) -2' -hydroxy-2 '-3-phenyltriazole, 2' -tert-butylphenyl) -2 '-3' -hydroxy-chlorobenzotriazole, 3 '-tert-butylphenyl-5' -butyltriazole, 3 '-tert-butylphenyl-5' -hydroxy-chlorobenzotriazole, 2- (2 '-hydroxy-5' -tert-octylphenyl) benzotriazole, 2 '-methylenebis [6- (2H-benzotriazol-2-yl) -4-tert-octylphenol ], 6- (2-benzotriazolyl) -4-tert-butyl-4' -methyl-2, 2 '-methylenebisphenol, 1,2, 3-benzotriazole, 1- [ N, N-bis (2-ethylhexyl) aminomethyl ] benzotriazole, carboxybenzotriazole, 1- [ N, N-bis (2-ethylhexyl) aminomethyl ] methylbenzotriazole, 2' - [ [ (methyl-1H-benzotriazol-1-yl) methyl ] imino ] diethanol, 1- (1 ',2' -dicarboxyethyl) benzotriazole, 1- (2, 3-dicarboxypropyl) benzotriazole, 1- [ (2-ethylhexyl amino) methyl ] benzotriazole, 2, 6-bis [ (1H-benzotriazol-1-yl) methyl ] -4-methylphenol, 5-methyltetrazole, and the like.
Examples of the organohalogen compound include trans-2, 3-dibromo-2-butene-1, 4-diol, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-1, 2-propanediol, 1, 4-dibromo-2-butanol, 1, 3-dibromo-2-propanol, 2, 3-dibromo-1, 4-butanediol, 2, 3-dibromo-2-butene-1, 4-diol, tris (2, 3-dibromopropyl) isocyanurate, and chloric anhydride.
Amine hydrohalates are compounds obtained by reacting an amine with a hydrogen halide.
As the amine of the amine hydrohalate, the above-mentioned amine can be used, and examples thereof include ethylamine, cyclohexylamine, ethylenediamine, triethylamine, diphenylguanidine, xylylguanidine, methylimidazole, 2-ethyl-4-methylimidazole and the like. Examples of the hydrogen halide include chlorine, bromine, iodine, and hydrogen fluoride (hydrogen chloride, hydrogen bromide, hydrogen iodide, and hydrogen fluoride). In addition, boron fluoride may be used instead of or in addition to the amine halogen acid salt, and as boron fluoride, fluoroboric acid and the like may be given.
Examples of the amine hydrohalate include aniline hydrogen chloride, cyclohexylamine hydrogen chloride, aniline hydrogen bromide, diphenylguanidine hydrogen bromide, xylylguanidine hydrogen bromide, and ethylamine hydrogen bromide.
The flux of the present embodiment may further contain an antioxidant. Examples of the antioxidant include hindered phenol antioxidants, and when used as a flux for reflow soldering, the antioxidant is preferably contained in an amount of more than 0% by mass and 5% by mass or less, and when used as a flux for flow soldering, the antioxidant is preferably contained in an amount of more than 0% by mass and 5% by mass or less, and more preferably in an amount of more than 0% by mass and 2% by mass or less.
The flux of the present embodiment may contain a thixotropic agent. The thixotropic agent can inhibit separation of the soldering flux and the solder alloy after being mixed into soldering paste.
Examples of the thixotropic agent include wax-based thixotropic agents, amide-based thixotropic agents, sorbitol-based thixotropic agents, and the like. Examples of the wax thixotropic agent include hardened castor oil and the like. Examples of the amide thixotropic agent include monoamide thixotropic agents, bisamide thixotropic agents, and polyamide thixotropic agents, and specifically include lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide, hydroxystearic acid amide, saturated fatty acid amide, oleic acid amide, erucic acid amide, unsaturated fatty acid amide, p-toluenemethane amide, aromatic amide, methylenebisstearic acid amide, ethylenebislauric acid amide, ethylenebishydroxystearic acid amide, saturated fatty acid bisamide, methylenebisoleic acid amide, unsaturated fatty acid bisamide, m-xylylene bisstearic acid amide, aromatic bisamide, saturated fatty acid polyamide, unsaturated fatty acid polyamide, aromatic polyamide, substituted amide, methylol stearic acid amide, methylol amide, fatty acid ester amide, and the like. Examples of sorbitol thixotropic agents include dibenzylidene-D-sorbitol, bis (4-methylbenzylidene) -D-sorbitol, and the like.
In addition, the flux of the present embodiment may contain an ester compound as a thixotropic agent. Examples of the ester compound include hardened castor oil and the like.
When the total amount of the thixotropic agent contained in the flux is used as a flux for reflow soldering, it is preferably more than 0% by mass and 15% by mass or less, and more preferably more than 0% by mass and 10% by mass or less. The content of the amide thixotropic agent is preferably more than 0 mass% and 12 mass% or less when used as a flux for reflow soldering, and the content of the ester compound is preferably more than 0 mass% and 8.0 mass% or less, more preferably 0 mass% or more and 4.0 mass% or less when used as a flux for reflow soldering.
When the thixotropic agent is used as a flux for flow soldering, the total amount of the thixotropic agent contained in the flux is preferably more than 0 mass% and 3 mass% or less, and more preferably more than 0 mass% and 1 mass% or less.
< solder paste >)
The solder paste of the present embodiment contains the flux and the solder alloy described above.
The solder paste of the present embodiment can be used for either flow soldering or reflow soldering. From the viewpoint of the effect of suppressing the residue cracking, it is preferable to use for reflow soldering.
The kind of solder alloy (alloy composition, etc.) is not particularly limited. Specifically, examples thereof include Sn-Ag alloy, sn-Cu alloy, sn-Ag-Cu alloy, sn-In alloy, sn-Pb alloy, sn-Bi alloy, sn-Ag-Cu-Bi alloy, and alloys In which Ag, cu, in, ni, co, sb, ge, P, fe, zn, ga, and the like are further added to the alloy composition.
The solder paste according to the present embodiment can be generally produced by mixing the flux and the solder alloy powder (metal powder). The mixing ratio of the flux and the metal powder is not particularly limited, and the finally obtained solder paste may have a viscosity to such an extent that it is practically free from problems. The mixing ratio of the soldering flux to the metal powder is generally, according to mass ratio, soldering flux: metal powder = 1:99 to 30:70, preferably flux: metal powder = 3: 97-20: 80, more preferably a flux: metal powder = 5: 95-15: 85.
the embodiments of the present invention have been described above, but these are merely examples of the present invention, and various configurations other than the above can be adopted. The present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within a range that can achieve the object of the present invention are included in the present invention.
Examples (example)
Embodiments of the present invention will be described in detail based on examples and comparative examples. The present invention is not limited to the examples.
Production of a composition for soldering flux
Raw rosin (comprising maleic anhydride modified rosin and/or maleic anhydride modified hydrogenated rosin) and monoamine compound were charged in equimolar amounts into a stainless steel beaker. Then, the mixture was heated at 150℃for 10 minutes in the atmosphere. Thus, the raw material rosin was imidized to obtain a composition for soldering flux.
By changing the monoamine compound, a composition for soldering flux containing the components described in the following table "imidized maleic acid-modified rosin or its hydride" was obtained. For example, N- (2-ethyl) hexyl succinic imidized maleic acid-modified rosin is obtained by reacting raw rosin with N- (2-ethyl) hexylamine.
The mass spectrum of the obtained composition for soldering flux was obtained using a time-of-flight mass analysis device (ESI-TOF-MS). Specifically, both of the cationic and anionic pops were obtained, and the pops were noise reduced by the software processing.
In the anionic poling, it was confirmed that the mass number (m/z) was only 18 larger than the peak of imidized maleic acid-modified rosin (first compound) as the main reactant. Based on the mass number of water molecules being 18 or the like, it was confirmed that the reactant obtained above further contained a certain amount of maleic acid-modified rosin amide (second compound) in which the imide ring in the first compound is of a ring-opened structure.
< preparation of soldering flux >)
First, a flux having a composition shown in the following table was prepared. The composition ratios of the components in the following table are amounts in the case where the total amount of the flux is 100 parts by mass.
The prepared soldering flux and metal powder are prepared according to 11 mass percent of the soldering flux: the ratio of 89 mass% of the metal powder was mixed to obtain a solder paste. As the metal powder, a sn—ag—cu solder alloy in which Ag is 3.0 mass%, cu is 0.5 mass%, and the remainder is Sn (average particle size of the metal powder is Φ20μm) was used.
< evaluation of inhibiting residue cracking >
First, paste was printed on a substrate on which 64 columns of electrode pads having a size of 1.5x0.25 mm were arranged at a pitch of 0.4mm using a metal mask having a thickness of 0.15 mm.
Then, soldering was performed using a reflow oven (reflow peak temperature: 240 ℃ C.).
After reflow soldering, the solder paste is left in a normal temperature environment for more than 24 hours. Thereafter, the number of cracks in the flux residue existing between the pads was counted and evaluated according to the following.
((good): residue cracks are less than 15;
x (difference): the number of residue cracks exceeds 15.
Various information is shown in the following table.
Incidentally, as described above, the "imidized maleic acid-modified rosin or its hydride" also contains the corresponding maleic acid-modified rosin amide.
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As shown in the above table, by soldering using a flux containing imidized maleic acid-modified rosin or a hydride thereof, residue cracking can be suppressed.
Reference: liquid soldering flux
Among the above, a "solder paste" was prepared using a flux containing imidized maleic acid-modified rosin or a hydride thereof, and soldering was performed using the solder paste.
On the other hand, a flux containing imidized maleic acid-modified rosin or a hydride thereof can also be used as a liquid flux for flow soldering. That is, the flux of the present embodiment can be used for the purpose of spraying the flux on the substrate and applying the molten solder by spraying for bonding.
The following table shows examples of the composition of such "liquid flux".
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Claims (8)
1. A soldering flux, wherein,
the flux is used to solder a solder alloy,
the flux comprises a flux composition,
the composition for soldering flux comprises one or more first rosin compounds selected from the group consisting of imidized maleic acid-modified rosin and hydrides of imidized maleic acid-modified rosin; and one or more second rosin compounds selected from the group consisting of maleic acid-modified rosin amide and a hydride of maleic acid-modified rosin amide,
the total amount of the first rosin compound and the second rosin compound is 10 mass% or more and 60 mass% or less with respect to the whole flux,
the molecular weight of the first rosin compound is 700 or less, and the molecular weight of the second rosin compound is 700 or less.
2. The flux of claim 1, wherein,
the first rosin compound contains one or more compounds selected from the group consisting of a compound having a partial structure represented by the following general formula (1-1) or (1-2) and a hydride of the compound,
in the above formula, the term "a" means a chemical bond with another chemical structure.
3. The flux according to claim 1 or 2, wherein,
the first rosin compound contains one or more compounds selected from the group consisting of compounds represented by the following general formulae (1 a-1) or (1 a-2) and hydrides of the compounds,
in the above formula, R each independently represents a linear or branched alkyl group, an alkylene glycol group or a terminally modified polyalkylene oxide group.
4. The flux according to claim 1 or 2, wherein,
the second rosin compound contains one or two or more compounds selected from the group consisting of compounds having a partial structure represented by the following general formulae (2-1), (2-2), (3-1) or (3-2), and hydrides of the compounds,
in the above formula, the term "a" means a chemical bond with another chemical structure.
5. The flux according to claim 1 or 2, wherein,
the second rosin compound contains one or more selected from the group consisting of compounds represented by the following general formulae (2 a-1), (2 a-2), (3 a-1) or (3 a-2), and hydrides of the compounds,
in the above formula, R each independently represents a substituted unsubstituted straight or branched alkyl group, an alkylene glycol group or a terminally modified polyalkylene oxide group.
6. The flux according to claim 1 or 2, wherein,
further comprising a thixotropic agent.
7. The flux according to claim 1 or 2, wherein,
further comprising one or more selected from the group consisting of an amine, an organic halogen compound, an amine hydrohalate, an antioxidant, and a resin.
8. A solder paste, wherein,
a flux and solder alloy comprising the flux of any one of claims 1-7.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101934440A (en) * | 2010-10-21 | 2011-01-05 | 江苏科技大学 | Soldering flux |
| JP2016032817A (en) * | 2014-07-30 | 2016-03-10 | 株式会社タムラ製作所 | Rosin modified product, soldering flux and solder paste |
| JP2017177210A (en) * | 2016-03-31 | 2017-10-05 | 株式会社タムラ製作所 | Flux composition, solder composition and electronic circuit board |
| CN107649067A (en) * | 2017-09-14 | 2018-02-02 | 中国林业科学研究院林产化学工业研究所 | A kind of abietyl rigid anionic surfactant and its stable foam of formation |
| CN109312140A (en) * | 2016-05-31 | 2019-02-05 | 三菱瓦斯化学株式会社 | Resin combination, laminated body, the semiconductor crystal wafer with resin composition layer, substrate for mounting semiconductor and semiconductor device with resin composition layer |
| CN110964081A (en) * | 2019-11-29 | 2020-04-07 | 广东省石油与精细化工研究院 | Alkyl maleimide sodium carboxylate and preparation method and application thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08132282A (en) * | 1994-11-01 | 1996-05-28 | Sanei Kagaku Kk | Flux for soldering |
| CN102702527B (en) * | 2012-06-21 | 2013-07-31 | 东莞市信诺橡塑工业有限公司 | Rosin-base half alicyclic polyamide imide terpolymer and synthetic method thereof |
| WO2020241687A1 (en) * | 2019-05-27 | 2020-12-03 | 千住金属工業株式会社 | Flux composition containing maleic acid-modified rosin ester or maleic acid-modified rosin amide, flux containing said composition, and solder paste |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101934440A (en) * | 2010-10-21 | 2011-01-05 | 江苏科技大学 | Soldering flux |
| JP2016032817A (en) * | 2014-07-30 | 2016-03-10 | 株式会社タムラ製作所 | Rosin modified product, soldering flux and solder paste |
| JP2017177210A (en) * | 2016-03-31 | 2017-10-05 | 株式会社タムラ製作所 | Flux composition, solder composition and electronic circuit board |
| CN109312140A (en) * | 2016-05-31 | 2019-02-05 | 三菱瓦斯化学株式会社 | Resin combination, laminated body, the semiconductor crystal wafer with resin composition layer, substrate for mounting semiconductor and semiconductor device with resin composition layer |
| CN107649067A (en) * | 2017-09-14 | 2018-02-02 | 中国林业科学研究院林产化学工业研究所 | A kind of abietyl rigid anionic surfactant and its stable foam of formation |
| CN110964081A (en) * | 2019-11-29 | 2020-04-07 | 广东省石油与精细化工研究院 | Alkyl maleimide sodium carboxylate and preparation method and application thereof |
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| JP2022053501A (en) | 2022-04-05 |
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