CN114248043A - Composition for flux, and solder paste - Google Patents
Composition for flux, and solder paste Download PDFInfo
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- CN114248043A CN114248043A CN202111091357.1A CN202111091357A CN114248043A CN 114248043 A CN114248043 A CN 114248043A CN 202111091357 A CN202111091357 A CN 202111091357A CN 114248043 A CN114248043 A CN 114248043A
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- Prior art keywords
- flux
- acid
- rosin
- group
- compound
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention aims to suppress residue cracking of flux residue. The present invention provides a composition for a flux, which comprises one or more first rosin compounds selected from the group consisting of imidized maleic acid-modified rosin and a hydride of imidized maleic acid-modified rosin. The present invention also provides a flux which contains the composition for flux and is used for soldering a solder alloy. In addition, the invention provides a solder paste, which comprises the soldering flux and a solder alloy.
Description
Technical Field
The invention relates to a composition for a flux, a flux and a solder paste.
Background
Mounting electronic components and the like on a printed circuit board, and fixing and electrical connection of electronic components in electronic equipment are generally performed by soldering which is advantageous in terms of cost and reliability.
Examples of a method commonly used for soldering include (i) a flow soldering method in which a printed circuit board and an electronic component are brought into contact with molten solder to perform soldering, (ii) a reflow soldering method in which solder in the form of solder paste, solder preform, or solder ball is remelted in a reflow furnace to perform soldering, and the like.
In soldering, a flux, which is an auxiliary agent for facilitating adhesion of solder to a printed circuit board or an electronic component, is sometimes used. The flux achieves the following useful effects in soldering, for example.
(1) Metal surface cleaning action: the oxide film on the metal surface of the printed circuit board and the electronic component is chemically removed, and the surface is cleaned to be capable of being welded.
(2) Prevention of reoxidation: the cleaned metal surface is coated during welding to block contact with oxygen, thereby preventing re-oxidation of the metal surface due to heating.
(3) Interfacial tension reducing action: the effect of lowering the surface tension of the molten solder to improve the wettability of the solder with the metal surface.
It is known to use rosin derivatives as fluxing agents. For example, patent document 1 describes that a rosin derivative compound obtained by dehydrating and condensing a rosin-based carboxyl group-containing resin and a dimer acid derivative flexible alcohol compound is used as a flux for soldering.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2014-185298.
Disclosure of Invention
As mentioned above, flux performs a useful role in soldering. However, the use of flux is not without problems.
For example, in a conventional flux, there is a case where "residue cracking" occurs in flux residue after soldering. Such cracks are problematic in terms of reliability of the printed circuit board and the electronic component.
The present invention has been made in view of such circumstances. An object of the present invention is to suppress residue cracking of flux residue.
The present inventors have completed the invention provided below and solved the above problems.
According to the present invention, there is provided a composition for a flux, comprising one or more first rosin compounds selected from the group consisting of an imidized maleic acid-modified rosin and a hydride of an imidized maleic acid-modified rosin.
Further, according to the present invention, there is provided a flux for soldering a solder alloy, which contains the above-mentioned flux composition.
In addition, according to the present invention, there is provided a solder paste comprising the above flux and a solder alloy.
According to the present invention, residue cracking of flux residue can be suppressed.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail.
In the present specification, the expression "X to Y" in the description of the numerical ranges indicates X or more and Y or less unless otherwise specified. For example, "1 to 5 mass%" means "1 mass% or more and 5 mass% or less".
In the chemical formulae in the present specification, the bond represented by a wavy line represents a steric configuration of an unspecified bond. In other words, each compound represented by each general formula described below may be a racemic body or only one compound having a specific configuration.
In the expression of a group (atomic group) in the present specification, an expression of not designating substitution or non-substitution is an expression including both no substituent and a substituent. For example, "alkyl" refers not only to an alkyl group having no substituent (unsubstituted alkyl), but also includes an alkyl group having a substituent (substituted alkyl).
The expression "(meth) acrylic acid" in the present specification means a concept including both acrylic acid and methacrylic acid. The same applies to "(meth) acrylate" and the like.
< composition for flux >
The composition for a flux of the present embodiment includes one or more first rosin compounds selected from the group consisting of imidized maleic acid-modified rosin and hydrides thereof.
According to the findings of the present inventors, since the flux contains the first rosin compound, the flux residue after soldering is softened appropriately, and therefore, residue cracking is suppressed.
Specifically, the first rosin compound includes one or more compounds selected from the group consisting of a compound having a partial structure represented by the following general formula (1-1) or (1-2) and a hydride of the compound (a compound having a hydrogen atom added to a carbon-carbon double bond in the general formula).
In the above formula, the symbol represents a chemical bond with other chemical structures.
Preferably, the first rosin compound contains one or more compounds selected from the group consisting of a compound represented by the following general formula (1a-1) or (1a-2) and a hydride of the compound (a compound having a hydrogen atom at a carbon-carbon double bond in the general formula).
In the above formula, R independently represents a linear or branched alkyl group, an alkylene glycol group or a terminal-modified polyalkylene oxide group. When R is any of these groups, the flux residue after soldering tends to be sufficiently soft.
In each group of R, a hydrogen atom may be substituted with an arbitrary substituent.
The alkylene glycol group of R is preferably a 1-valent group represented by the following formula (i). In the formula (i), R1Each independently is a linear or branched alkylene group having 1 to 4 carbon atoms, and n is an integer of 1 to 500.
H-(OR1)n- (i)
The terminal-modified polyalkylene oxide group of R is preferably a 1-valent group represented by the following formula (ii). In the formula (ii), R1Each independently is a linear or branched alkylene group having 1 to 4 carbon atoms, X is an amino group, a linear or branched alkyl ester group having 1 to 40 carbon atoms, or a linear or branched alkyl ether group having 1 to 40 carbon atoms, and n is an integer of 0 to 500.
X-R1-(OR1)n- (ii)
The number of carbon atoms of the alkyl group represented by R is not particularly limited, but is preferably 1 to 54, more preferably 4 to 24, still more preferably 8 to 22, and particularly preferably 12 to 22.
The number of carbon atoms of the alkylene glycol group represented by R and the terminal-modified polyalkylene oxide group is not particularly limited, but is preferably 1 to 500, more preferably 4 to 24, further preferably 8 to 22, and particularly preferably 12 to 22.
In the formulae (i) and (ii), the number of carbon atoms of the alkyl moiety of X is preferably 1 to 24, and R1The number of carbon atoms of (A) is preferably 1 to 3. In the formulae (i) and (ii), n is preferably 1 to 500, more preferably 1 to 100, and still more preferably 1 to 10.
Examples of the terminal-modified polyalkylene oxide group include a group obtained by adding an alcohol having 1 to 40 carbon atoms such as cetyl alcohol, stearyl alcohol and behenyl alcohol, or a carboxylic acid having 1 to 40 carbon atoms such as palmitic acid, stearic acid and behenic acid to the hydroxyl terminal of a polyalkylene glycol such as polyethylene glycol, polypropylene glycol and a copolymer of ethylene oxide and propylene oxide; and a group in which the hydroxyl group terminal of a polyalkylene glycol such as a copolymer of ethylene oxide and propylene oxide is modified to an amino group.
The molecular weight of the first rosin compound is, for example, 1000 or less, preferably 850 or less, and more preferably 700 or less. Since the molecular weight does not become too large, the flux is hard to harden, and the cracking of the residue is further suppressed.
The composition for a flux of the present embodiment preferably further includes one or more second rosin compounds selected from the group consisting of maleic acid-modified rosin amides and hydrides thereof. Thereby further suppressing the residue cracking. Although the details are not clear, it is considered that the flux residue after soldering can be sufficiently softened by using the composition for a flux of the present embodiment as a mixture of the first rosin compound and the second rosin compound.
The second rosin compound specifically includes one or more compounds selected from the group consisting of compounds having a partial structure represented by the following general formula (2-1), (2-2), (3-1), or (3-2) and hydrides thereof (compounds having hydrogen added to a carbon-carbon double bond in the general formula).
In the above formula, the symbol represents a chemical bond with other chemical structures.
Preferably, the second rosin compound contains one or more selected from the group consisting of compounds represented by the following general formula (2a-1), (2a-2), (3a-1) or (3a-2) and hydrides thereof.
In the above formula, R independently represents a substituted or unsubstituted, linear or branched alkyl group, an alkylene glycol group or a terminal-modified polyalkylene oxide group. Specific examples or preferred embodiments of these groups are the same as those of the general formulae (1a-1) and (1 a-2).
In the composition for a flux of the present embodiment, when the compound represented by the general formula (1a-1) or (1a-2) is contained as the first rosin compound and the compound represented by the general formula (2a-1), (2a-2), (3a-1) or (3a-2) is contained as the second rosin compound, that is, when both are contained, it is preferable that R in the general formula (1a-1) or (1a-2) is common to R in the general formula (2a-1), (2a-2), (3a-1) or (3 a-2). This is for ease of synthesis, etc.
The molecular weight of the second rosin compound is, for example, 1000 or less, preferably 850 or less, and more preferably 700 or less. Since the molecular weight does not become too large, the flux is hard to harden, and the cracking of the residue is further suppressed.
In the case where the composition for a flux of the present embodiment contains both the first rosin compound and the second rosin compound, the mass ratio of the first rosin compound to the second rosin compound, for example, the first rosin compound: a second rosin compound ═ 1: 99-99: 1, specifically 5: 95-95: 5.
the mass ratio of the first rosin compound to the second rosin compound can be known, for example, by using a mass analysis bopp as a clue.
Examples of the raw material of the maleic acid-modified rosin as the raw material of the first rosin compound or the second rosin compound include gum rosin, tall oil rosin, wood rosin, and purified products (purified rosins) thereof. Further, raw rosin described in chemical-production, chemistry, and use of pine (written by d.f. zinkel, j.russell, hong translation of kagachu (1993), 361-362) or commercially available gum rosin can be used as the raw rosin. By reacting these raw materials with an appropriate amine compound, a first rosin compound or a second rosin compound can be obtained (by appropriately selecting the reaction conditions, a mixture of the first rosin compound and the second rosin compound can also be obtained).
< soldering flux >
The flux of the present embodiment contains the above-described flux composition and is used for soldering a solder alloy.
The total amount (ratio) of the first rosin compound and the second rosin compound in the flux is preferably more than 0 mass% and 60 mass% or less with respect to the entire flux. The lower limit is more preferably 5% by mass or more, still more preferably 10% by mass or more, still more preferably 20% by mass or more, and particularly preferably 30% by mass or more. The upper limit is more preferably 50% by mass or less, and still more preferably 40% by mass or less. The effect of suppressing the residue cracking of the flux residue tends to become more remarkable as the content of the first rosin compound or the second rosin compound is increased.
The flux of the present embodiment may contain components (resins, etc.) other than the first rosin compound and the second rosin compound contained in the flux composition.
As the resin, various resins used in conventional soldering fluxes can be used. Examples of such resins include rosin resins, (meth) acrylic resins, polyesters, polyethylenes, polypropylenes, polyamides, styrene-maleic acid copolymers, epoxy resins, phenol resins, phenoxy resins, terpene-phenol resins, and mixtures thereof. Among them, rosin-based resins are generally used. Examples of the rosin-based resin include natural rosins such as gum rosin and wood rosin, and derivatives thereof (polymerized rosin, hydrogenated rosin, disproportionated rosin, acid-modified rosin, rosin ester, and the like).
It is to be noted that the rosin-based resin herein is a component different from the first rosin compound and the second rosin compound.
The content of the resin in the flux is not limited. When used as a flux for reflow soldering, the content of the flux may be, for example, 10 to 80 mass%, 20 to 70 mass%, or 30 to 60 mass%. When used as a flux for flow soldering, the amount of the flux may be, for example, 3 to 18 mass%, 6 to 15 mass%, or 9 to 12 mass%.
The flux of the present embodiment may contain a solvent.
Examples of the solvent include water, alcohol solvents, glycol ether solvents, terpineol, and the like.
Examples of the alcohol solvent include isopropanol, 1, 2-butanediol, isobornyl cyclohexanol, 2, 4-diethyl-1, 5-pentanediol, 2-dimethyl-1, 3-propanediol, 2, 5-dimethyl-2, 5-hexanediol, 2, 5-dimethyl-3-hexyne-2, 5-diol, 2, 3-dimethyl-2, 3-butanediol, 1,1, 1-tris (hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1, 3-propanediol, 2 '-oxybis (methylene) bis (2-ethyl-1, 3-propanediol), 2-bis (hydroxymethyl) -1, 3-propanediol, isobornyl cyclohexanol, 2, 4-diethyl-1, 5-pentanediol, 2-dimethyl-1, 3-propanediol, 2, 1, 1-tris (hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1, 3-propanediol, 2' -oxybis (methylene) bis (2-ethyl-1, 3-propanediol, 2-bis (hydroxymethyl) -1, 3-propanediol, and the like, 1,2, 6-trihydroxyhexane, bis [2,2, 2-tris (hydroxymethyl) ethyl ] ether, 1-acetylene-1-cyclohexanol, 1, 4-cyclohexanediol, 1, 4-cyclohexanedimethanol, erythritol, threitol, guaiacol glyceryl ether, 3, 6-dimethyl-4-octyne-3, 6-diol, 2,4,7, 9-tetramethyl-5-decyne-4, 7-diol, and the like.
Examples of the glycol ether solvent include diethylene glycol hexyl ether, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2, 4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether, and tetraethylene glycol monomethyl ether.
The flux of the present embodiment may further contain an organic acid, an amine, and a halogen (an organic halogen compound, an amine hydrohalide salt), or may not contain (the content may be 0%). These can contribute to the activator (weldability improvement).
When the flux of the present embodiment is used as a flux for reflow soldering, it preferably contains more than 0 mass% and 10 mass% or less of an organic acid. When the flux of the present embodiment is used as a flux for reflow soldering, the amine is preferably contained in an amount of more than 0% by mass and 20% by mass or less, and more preferably contained in an amount of more than 0% by mass and 5% by mass or less. When the flux of the present embodiment is used as a flux for reflow soldering, the halogen preferably contains an organic halogen compound in an amount of more than 0% by mass and 5% by mass or less, and the amine hydrohalide salt in an amount of more than 0% by mass and 2% by mass or less.
When the flux of the present embodiment is used as a flux for flow soldering, the activator is preferably contained in an amount of 0.1 mass% or more and 12.0 mass% or less, more preferably 0.3 mass% or more and 8.0 mass% or less, and still more preferably 0.5 mass% or more and 4.0 mass% or less.
Examples of the organic acid include glutaric acid, adipic acid, azelaic acid, didecanedioic acid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutylanilinodedioic acid, suberic acid, sebacic acid, thioglycolic acid, terephthalic acid, dodecanedioic acid, p-hydroxyphenylacetic acid, phenylsuccinic acid, phthalic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, tartaric acid, tris (2-carboxyethyl) isocyanurate, glycine, 1, 3-cyclohexanedicarboxylic acid, 2-bis (hydroxymethyl) propionic acid, 2-bis (hydroxymethyl) butyric acid, 2, 3-dihydroxybenzoic acid, 2, 4-diethylglutaric acid, 2-quinolinecarboxylic acid, 3-hydroxybenzoic acid, malic acid, p-anisic acid, stearic acid, 12-hydroxystearic acid, 3-hydroxybenzoic acid, and the like, Oleic acid, linoleic acid, linolenic acid, and the like.
Examples of the organic acid include dimer acid, trimer acid, hydrogenated dimer acid which is a hydride that is hydrogenated to dimer acid, and hydrogenated trimer acid which is a hydride that is hydrogenated to trimer acid.
For example, dimer acid as a reactant of oleic acid and linoleic acid, trimer acid as a reactant of oleic acid and linoleic acid, dimer acid as a reactant of acrylic acid, trimer acid as a reactant of acrylic acid, dimer acid as a reactant of methacrylic acid, trimer acid as a reactant of methacrylic acid, dimer acid as a reactant of acrylic acid and methacrylic acid, trimer acid as a reactant of acrylic acid and methacrylic acid, dimer acid as a reactant of oleic acid, trimer acid as a reactant of oleic acid, dimer acid as a reactant of linoleic acid, trimer acid as a reactant of linoleic acid, dimer acid as a reactant of linolenic acid, trimer acid as a reactant of linolenic acid, dimer acid as a reactant of acrylic acid and oleic acid, trimer acid as a reactant of acrylic acid and oleic acid, dimer acid as a reactant of acrylic acid and linoleic acid, dimer acid as a trimer acid, and trimer acid, Trimer acid as a reactant of acrylic acid and linoleic acid, dimer acid as a reactant of acrylic acid and linolenic acid, trimer acid as a reactant of acrylic acid and linolenic acid, dimer acid as a reactant of methacrylic acid and oleic acid, trimer acid as a reactant of methacrylic acid and oleic acid, dimer acid as a reactant of methacrylic acid and linoleic acid, trimer acid as a reactant of methacrylic acid and linoleic acid, dimer acid as a reactant of methacrylic acid and linolenic acid, trimer acid as a reactant of methacrylic acid and linolenic acid, dimer acid as a reactant of oleic acid and linolenic acid, trimer acid as a reactant of oleic acid and linolenic acid, dimer acid as a reactant of linoleic acid and linolenic acid, trimer acid as a reactant of linoleic acid and linolenic acid, hydrogenated dimer acid as a hydride of each of the foregoing dimer acids, Hydrogenated trimer acids as the hydrogenated products of the above trimer acids, and the like.
Examples of the amine include monoethanolamine, diphenylguanidine, ditolylbrguanine, ethylamine, triethylamine, cyclohexylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1, 2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, triethylamine, cyclohexylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, and the like, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-diamino-6- [2 ' -methylimidazolyl- (1 ') ] -ethyl-s-triazine, 2, 4-diamino-6- [2 ' -undecylimidazolyl- (1 ') ] -ethyl-s-triazine, 2, 4-diamino-6- [2 ' -ethyl-4 ' -methylimidazolyl- (1 ') ] -ethyl-s-triazine, 2, 4-diamino-6- [2 ' -methylimidazolyl- (1 ') ] -ethyl-s-triazine isocyanuric acid addition product, 2-phenylimidazole isocyanuric acid addition product, and a salt thereof, 2-phenyl-4, 5-dimethyloimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, 3-dihydro-1H-pyrrolo [1,2-a ] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2, 4-diamino-6-vinyl-s-triazine isocyanuric acid addition product, 2, 4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy-imidazole addition product, 2-methylbenzoimidazole, methyl-N-phenylimidazole, methyl-N-methyl-2-methyl-5-hydroxyimidazolium chloride, methyl-2-methyl-6-methyl-s-triazine, methyl-2-methyl-6-methyl-2-methyl-imidazole, methyl-2-methyl-imidazole, methyl-ethyl-methyl-2-methyl-3-methyl-imidazolium chloride, methyl-ethyl-methyl-2, methyl-ethyl-methyl-s-triazine, methyl-ethyl-methyl-n-one, 2-octylbenzimidazole, 2-pentylbenzimidazole, 2- (1-ethylpentyl) benzimidazole, 2-nonylbenzimidazole, 2- (4-thiazolyl) benzimidazole, 2- (2 ' -hydroxy-5 ' -methylphenyl) benzotriazole, 2- (2 ' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2 ' -hydroxy-3 ', 5 ' -di-tert-pentylphenyl) benzotriazole, 2- (2 ' -hydroxy-5 ' -tert-octylphenyl) benzotriazole, 2 ' -methylenebis [6- (2H-benzotriazol-2-yl) -4-tert-octylphenol ]), 6- (2-benzotriazolyl) -4-tert-octyl-6 '-tert-butyl-4' -methyl-2, 2 '-methylenebisphenol, 1,2, 3-benzotriazole, 1- [ N, N-bis (2-ethylhexyl) aminomethyl ] benzotriazole, carboxybenzotriazole, 1- [ N, N-bis (2-ethylhexyl) aminomethyl ] methylbenzotriazole, 2' - [ [ (methyl-1H-benzotriazol-1-yl) methyl ] imino ] diethanol, 1- (1 ', 2' -dicarboxyethyl) benzotriazole, 1- (2, 3-dicarboxypropyl) benzotriazole, 1- [ (2-ethylhexylamino) methyl ] benzotriazole, 2-dimethyldichlorobenzyl-2, 2-dimethylbenzyl-2, 2-methyl-2, 2-dimethylbenzyl-triazole, 1-bis (N-methyl) benzotriazole, 1-bis (N-hydroxy-phenyl) bis (N-methyl) benzotriazole, 1, 2-bis (N-hydroxy-phenyl) benzotriazole, N-methyl) benzotriazole, N-hydroxy-phenyl-bis (N-phenyl) benzotriazole, N-bis (N-hydroxy-phenyl) bis (N-phenyl) bis (N, N-phenyl) bis (N, N, 2, 6-bis [ (1H-benzotriazol-1-yl) methyl ] -4-methylphenol, 5-methylbenzotriazole, 5-phenyltetrazole and the like.
Examples of the organic halogen compound include trans-2, 3-dibromo-2-butene-1, 4-diol, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-1, 2-propanediol, 1, 4-dibromo-2-butanol, 1, 3-dibromo-2-propanol, 2, 3-dibromo-1, 4-butanediol, 2, 3-dibromo-2-butene-1, 4-diol, tris (2, 3-dibromopropyl), chlorendic anhydride, and the like.
Amine hydrohalides are compounds obtained by reacting amines with hydrogen halides.
As the amine of the amine hydrohalide salt, the above-mentioned amines can be used, and examples thereof include ethylamine, cyclohexylamine, ethylenediamine, triethylamine, diphenylguanidine, ditolylbutylguanidine, methylimidazole, 2-ethyl-4-methylimidazole and the like. Examples of the hydrogen halide include hydrides of chlorine, bromine, iodine, and fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, and hydrogen fluoride). The amine hydrohalide may be replaced with a borofluoride or may contain a borofluoride together with the amine hydrohalide, and examples of the borofluoride include fluoroboric acid.
Examples of the amine hydrohalide salt include aniline hydrogen chloride, cyclohexylamine hydrogen chloride, aniline hydrogen bromide, diphenylguanidine hydrogen bromide, ditolyguanidinium hydrogen bromide, and ethylamine hydrogen bromide.
The flux of the present embodiment may further contain an antioxidant. The antioxidant includes a hindered phenol antioxidant and the like, and when used as a flux for reflow soldering, the antioxidant is preferably contained in an amount of more than 0% by mass and 5% by mass or less, and when used as a flux for flow soldering, the antioxidant is preferably contained in an amount of more than 0% by mass and 5% by mass or less, and more preferably more than 0% by mass and 2% by mass or less.
The flux of the present embodiment may include a thixotropic agent. Due to the action of the thixotropic agent, the separation of the soldering flux and the solder alloy after being mixed into the soldering paste can be inhibited.
Examples of the thixotropic agent include wax-based thixotropic agents, amide-based thixotropic agents, and sorbitol-based thixotropic agents. Examples of the wax thixotropic agent include hardened castor oil and the like. Examples of the amide-based thixotropic agent include monoamide-based thixotropic agents, bisamide-based thixotropic agents, and polyamide-based thixotropic agents, and specific examples thereof include lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide, hydroxystearic acid amide, saturated fatty acid amide, oleic acid amide, erucic acid amide, unsaturated fatty acid amide, p-tolylmethane amide, aromatic amide, methylene bisstearic acid amide, ethylene bislauric acid amide, ethylene bishydroxystearic acid amide, saturated fatty acid bisamide, methylene bisoleic acid amide, unsaturated fatty acid bisamide, m-xylylene bisstearic acid amide, aromatic bisamide, saturated fatty acid polyamide, unsaturated fatty acid polyamide, aromatic polyamide, substituted amide, methylol stearic acid amide, methylolamide, and fatty acid ester amide. Examples of the sorbitol thixotropic agent include dibenzylidene-D-sorbitol and bis (4-methylbenzylidene) -D-sorbitol.
The flux of the present embodiment may contain an ester compound as a thixotropic agent. Examples of the ester compound include hardened castor oil and the like.
The total amount of the thixotropic agent contained in the flux, when used as a flux for reflow soldering, is preferably more than 0 mass% and 15 mass% or less, and more preferably more than 0 mass% and 10 mass% or less. The content of the amide thixotropic agent is preferably more than 0% by mass and not more than 12% by mass when used as a flux for reflow soldering, and the content of the ester compound is preferably more than 0% by mass and not more than 8.0% by mass, and more preferably not less than 0% by mass and not more than 4.0% by mass when used as a flux for reflow soldering.
The total amount of the thixotropic agent contained in the flux, when used as a flux for flow soldering, is preferably more than 0 mass% and 3 mass% or less, and more preferably more than 0 mass% and 1 mass% or less.
< solder paste >
The solder paste of the present embodiment includes the flux and the solder alloy.
The solder paste of the present embodiment can be used for either flow soldering or reflow soldering. From the viewpoint of the effect of suppressing the residue cracking, it is preferably used for reflow soldering.
The kind (alloy composition, etc.) of the solder alloy is not particularly limited. Specifically, there may be mentioned Sn-Ag alloys, Sn-Cu alloys, Sn-Ag-Cu alloys, Sn-In alloys, Sn-Pb alloys, Sn-Bi alloys, Sn-Ag-Cu-Bi alloys, and alloys obtained by further adding Ag, Cu, In, Ni, Co, Sb, Ge, P, Fe, Zn, Ga or the like to the above alloy compositions.
The solder paste of the present embodiment can be generally produced by mixing the above-described flux and solder alloy powder (metal powder). The mixing ratio of the flux and the metal powder is not particularly limited, and the finally obtained solder paste may have a viscosity of such a degree that there is no problem in practical use. The mixing ratio of the soldering flux and the metal powder is, by mass, generally the ratio of the soldering flux: metal powder 1: 99-30: 70, preferably flux: metal powder 3: 97-20: 80, more preferably flux: metal powder 5: 95-15: 85.
the embodiments of the present invention have been described above, but these are merely examples of the present invention, and various configurations other than the above-described configurations can be adopted. The present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within a range that can achieve the object of the present invention are included in the present invention.
[ examples ]
Embodiments of the present invention will be described in detail based on examples and comparative examples. The present invention is not limited to the embodiments.
< production of composition for flux >
Raw material rosin (including maleic anhydride-modified rosin and/or maleic anhydride-modified hydrogenated rosin) and a monoamine compound were put into a stainless steel beaker in an equimolar amount. Then, the mixture was heated at 150 ℃ for 10 minutes in the atmosphere. The raw material rosin was imidized in this way to obtain a composition for a flux.
By changing the monoamine compound, a composition for a flux containing the components described in the following "imidized maleic acid-modified rosin or its hydride" was obtained. For example, N- (2-ethyl) hexylsuccinic acid imidized maleic acid-modified rosin is obtained by reacting a raw material rosin with N- (2-ethyl) hexylamine.
The mass bopp of the obtained flux composition was obtained using a time-of-flight mass spectrometer (ESI-TOF-MS). Specifically, two of the cation and anion pops, which are noise-reduced by software processing, are obtained.
In the anionic plump, a peak having a mass number (m/z) that is only 18 times larger than that of the imidized maleic acid-modified rosin (first compound) as the main reactant was confirmed. It was confirmed that the reactant obtained above further contained a certain amount of maleic acid-modified rosin amide (second compound) in which the imide ring in the first compound was an open ring structure, based on the mass number of water molecules being 18 or the like.
< preparation of soldering flux >
First, a flux having the composition shown in the following table was prepared. The composition ratio of each component in the following table is an amount in the case where the total amount of the flux is 100 parts by mass.
And (3) mixing the prepared soldering flux and metal powder according to the mass percent of 11% of the soldering flux: the metal powders were mixed at a ratio of 89 mass% to obtain a solder paste. As the metal powder, a Sn-Ag-Cu solder alloy (average particle diameter of the metal powder is 20 μm) containing 3.0 mass% of Ag, 0.5 mass% of Cu, and the balance Sn was used.
< evaluation of inhibition of residue cracking >
First, paste was printed on a substrate on which 64 rows of electrode pads having a size of 1.5 × 0.25mm were arranged at a pitch of 0.4mm using a metal mask having a thickness of 0.15 mm.
Then, soldering was performed using a reflow oven (reflow peak temperature 240 ℃).
After reflow soldering, the substrate was left to stand in a normal temperature environment for 24 hours or more. Thereafter, the number of cracks in the flux residue existing between the pads was counted, and evaluated according to the following.
Good (good): 15 or less residue cracks;
x (poor): the number of residue cracks exceeded 15.
Various information is shown in the following table.
Incidentally, as described above, the "imidized maleic acid-modified rosin or its hydride" further contains a corresponding maleic acid-modified rosin amide.
As shown in the above table, residue cracking can be suppressed by soldering using a flux containing an imidized maleic acid-modified rosin or a hydride thereof.
< reference: liquid soldering flux >
In the above, a "solder paste" is prepared using a flux containing an imidized maleic acid-modified rosin or a hydride thereof, and soldering is performed using the solder paste.
On the other hand, a flux containing an imidized maleic acid-modified rosin or a hydride thereof can also be used as a liquid flux for flow soldering. That is, the flux of the present embodiment can be used also in an application in which the flux is sprayed on a substrate and molten solder is applied by spraying to bond the substrate.
The following table is an example of the composition of such a "liquid flux".
Claims (10)
1. A composition for a flux, wherein,
comprising one or more first rosin compounds selected from the group consisting of imidized maleic acid-modified rosin and a hydride of imidized maleic acid-modified rosin.
2. The composition for flux of claim 1, wherein,
the first rosin compound contains one or more compounds selected from the group consisting of a compound having a partial structure represented by the following general formula (1-1) or (1-2) and a hydride of the compound,
in the above formula, the symbol represents a chemical bond with other chemical structures.
3. The composition for flux of claim 1 or 2, wherein,
the first rosin compound contains one or more compounds selected from the group consisting of a compound represented by the following general formula (1a-1) or (1a-2) and a hydride of the compound,
in the above formula, R independently represents a linear or branched alkyl group, an alkylene glycol group or a terminal-modified polyalkylene oxide group.
4. The composition for flux according to any one of claims 1 to 3, wherein,
further comprising one or more second rosin compounds selected from the group consisting of maleic acid-modified rosin amides and hydrides of maleic acid-modified rosin amides.
5. The composition for flux of claim 4, wherein,
the second rosin compound contains one or more compounds selected from the group consisting of a compound having a partial structure represented by the following general formula (2-1), (2-2), (3-1) or (3-2) and a hydride of the compound,
in the above formula, the symbol represents a chemical bond with other chemical structures.
6. The composition for flux of claim 4 or 5, wherein,
the second rosin compound contains one or more compounds selected from the group consisting of compounds represented by the following general formula (2a-1), (2a-2), (3a-1) or (3a-2) and hydrides of the compounds,
in the above formula, R's each independently represent a substituted unsubstituted linear or branched alkyl group, an alkylene glycol group or a terminal-modified polyalkylene oxide group.
7. A flux, wherein,
the composition for flux of any one of claims 1 to 6, and used for soldering a solder alloy.
8. The flux of claim 7,
further comprising a thixotropic agent.
9. The flux of claim 7 or 8,
further comprises one or more selected from the group consisting of amines, organic halogen compounds, amine hydrohalides, antioxidants and resins.
10. A solder paste, wherein,
the flux and the solder alloy according to any one of claims 7 to 9.
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| JP2020159472A JP7021446B1 (en) | 2020-09-24 | 2020-09-24 | Flux and solder paste |
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| CN101934440A (en) * | 2010-10-21 | 2011-01-05 | 江苏科技大学 | Soldering flux |
| JP2016032817A (en) * | 2014-07-30 | 2016-03-10 | 株式会社タムラ製作所 | Rosin modified product, soldering flux and solder paste |
| JP2017177210A (en) * | 2016-03-31 | 2017-10-05 | 株式会社タムラ製作所 | Flux composition, solder composition and electronic circuit board |
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| CN110964081A (en) * | 2019-11-29 | 2020-04-07 | 广东省石油与精细化工研究院 | Alkyl maleimide sodium carboxylate and preparation method and application thereof |
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| JPH08132282A (en) * | 1994-11-01 | 1996-05-28 | Sanei Kagaku Kk | Flux for soldering |
| CN102702527B (en) * | 2012-06-21 | 2013-07-31 | 东莞市信诺橡塑工业有限公司 | Rosin-base half alicyclic polyamide imide terpolymer and synthetic method thereof |
| WO2020241687A1 (en) * | 2019-05-27 | 2020-12-03 | 千住金属工業株式会社 | Flux composition containing maleic acid-modified rosin ester or maleic acid-modified rosin amide, flux containing said composition, and solder paste |
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|---|---|---|---|---|
| CN101934440A (en) * | 2010-10-21 | 2011-01-05 | 江苏科技大学 | Soldering flux |
| JP2016032817A (en) * | 2014-07-30 | 2016-03-10 | 株式会社タムラ製作所 | Rosin modified product, soldering flux and solder paste |
| JP2017177210A (en) * | 2016-03-31 | 2017-10-05 | 株式会社タムラ製作所 | Flux composition, solder composition and electronic circuit board |
| CN109312140A (en) * | 2016-05-31 | 2019-02-05 | 三菱瓦斯化学株式会社 | Resin combination, laminated body, the semiconductor crystal wafer with resin composition layer, substrate for mounting semiconductor and semiconductor device with resin composition layer |
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| JP7021446B1 (en) | 2022-02-17 |
| CN114248043B (en) | 2023-09-19 |
| JP2022052939A (en) | 2022-04-05 |
| JP2022053501A (en) | 2022-04-05 |
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