CN114245621B

CN114245621B - Novel multilayer circuit board manufacturing process

Info

Publication number: CN114245621B
Application number: CN202111658871.9A
Authority: CN
Inventors: 叶何远; 陈小杨; 苏惠武; 赖剑锋
Original assignee: Jiangxi Fuchangfa Circuit Technology Co ltd
Current assignee: Jiangxi Fuchangfa Circuit Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-07-01
Anticipated expiration: 2041-12-31
Also published as: CN114245621A

Abstract

The invention discloses a novel multilayer circuit board manufacturing process, and particularly relates to the technical field of circuit boards, wherein the novel multilayer circuit board manufacturing process comprises the following specific processing steps: s1, prefabricating the plate: firstly, etching a copper foil base layer on the surface of each plate, electroplating and browning a circuit board, and manufacturing a preset circuit; according to the invention, through the structural matching of the rotary adjusting structure and the lifting mechanism with the laminating module, the plate manufacturing dies of the two groups of laminating modules can be adjusted and converted, so that an operator can simultaneously carry out the laminating and laminating work of the two groups of plates, the manufacturing continuity and the production efficiency of the multilayer circuit board are improved, and during the process of entering a stove for drying, hot gas can be forced to uniformly enter the laminating surface between the placing table and the pressing plate from the formed permeable layer and the through groove by utilizing the centrifugal rotation of the two groups of concave die cavities, so that the heat source covering is uniformly and effectively carried out on the multilayer circuit board in the laminating state, and the bonding process of the multilayer circuit board is promoted to be more uniform and comprehensive.

Description

Novel multilayer circuit board manufacturing process

Technical Field

The invention relates to the technical field of circuit boards, in particular to a novel multilayer circuit board manufacturing process.

Background

The multilayer circuit board is a product of the development of electronic technology in the directions of high speed, multiple functions, large capacity and small volume, and along with the continuous development of electronic technology, especially the wide and deep application of large-scale and super-large-scale integrated circuits, the multilayer circuit board is rapidly developing in the directions of high density, high precision and high layer numeralization.

In the production process of the circuit board, a plurality of prefabricated circuit boards are often required to be mutually laminated and extruded to form a multilayer circuit board, however, when the circuit board is extruded, an operator often manually places the prefabricated panels in designated positioning areas for lamination, then places the laminated panels in a furnace for fusion, the operation flow can only be carried out by single group, the efficiency is slow, the splicing surfaces of the multilayer plates are difficult to contact with the heat source in the fire furnace comprehensively, further resulting in uneven bonding surface for the circuit board fusion, reduced precision and quality of the multilayer circuit board production, meanwhile, the adhesive of the circuit board is easy to overflow and leak, so that the defects of the multi-layer circuit board in the manufacturing process are larger, the qualification rate and the comprehensive performance of the product are reduced, when the multilayer circuit boards are integrated, it is difficult for an operator to manually take out the multilayer circuit boards from the laminated board surface, which increases the work difficulty and inconvenience of the operator.

Disclosure of Invention

The present invention is directed to a novel process for manufacturing a multilayer wiring board, which solves the above-mentioned problems associated with the prior art.

In order to achieve the purpose, the invention provides the following technical scheme: the novel multilayer circuit board manufacturing process comprises the following specific processing steps:

s1, prefabricating a plate: firstly, etching a copper foil base layer on the surface of each plate, electroplating and browning a circuit board, and manufacturing a preset circuit;

s2, plate lamination: placing the preset plates in a special die according to a specified preset circuit sequence, promoting the plates to be closely attached by utilizing a guide limiting structure in the die, and simultaneously coating an adhesive layer on the laminated surfaces of the plates;

s3, laminating the plates: the surface of the die is covered by the pressing plate and is attached to a plurality of groups of plates, so that the plurality of groups of plates are laminated, and the viscose glue of the coated adhesive layer is diffused;

s4, fusion welding of plates: after the plates are laminated, the plates can be sent into a fire furnace to fuse the laminated plates together; a multilayer wiring board is formed.

The invention also comprises manufacturing equipment for manufacturing the novel multilayer circuit board, which comprises a rotary adjusting structure, wherein the rotary adjusting structure respectively comprises an annular seat, sliding blocks, an annular sliding groove, a gear, a fluted disc, a connecting block, a servo motor, a rotating shaft and a fixing frame, the annular sliding groove is formed in the edge of the top of the annular seat, four groups of sliding blocks are arranged on the inner side of the annular sliding groove, the connecting blocks are arranged at the tops of the four groups of sliding blocks, the rotating shaft is sleeved at the middle position of the top inside the annular seat, the fixing frame is fixedly connected to the top of the rotating shaft, the servo motor is arranged on one side, close to the rotating shaft, of the inside of the annular seat, and the gear and the fluted disc which are meshed with each other are respectively arranged at the output end of the servo motor and the outer side of the rotating shaft.

Preferably, the both ends of mount are equipped with elevating system, and elevating system includes mounting groove, loop bar, sleeve pipe, hinge bar, roof, internal thread piece, two-way lead screw and connecting plate respectively, the mounting groove is two sets of, and is two sets of mounting groove and mount and four group's connecting block rigid couplings, two sets of the both sides at the inside both ends of mounting groove are equipped with the loop bar, and are two sets of with the end the outside symmetrical sleeve of loop bar is equipped with the sleeve pipe, and sheathed tube top articulates respectively has hinge bar and roof, and is two sets of the intermediate position department cover at the inside both ends of mounting groove is equipped with two-way lead screw, and is two sets of the outside symmetry of two-way lead screw is equipped with the internal thread piece of screw thread adaptation, and the both sides of internal thread piece are equipped with the connecting plate with the sleeve pipe rigid coupling.

Preferably, it is two sets of the top of mounting groove is equipped with the lamination module, and the lamination module includes concave type die cavity respectively, places the platform, leads to groove, permeable formation, first setting element and second setting element, concave type die cavity is two sets of, and is two sets of concave type die cavity and mounting groove rigid coupling are two sets of the permeable formation has been seted up to the intermediate position department in the concave type die cavity outside, and is two sets of the inboard edge of concave type die cavity sets up the logical groove that communicates each other with the permeable formation, and is two sets of the bottom of concave type die cavity is equipped with places the platform, and is two sets of the inside of concave type die cavity is evenly arranged and is equipped with first setting element and second setting element, and is two sets of the inboard top card of concave type die cavity is equipped with the clamp plate.

Preferably, the inside outside that is close to servo motor of annular seat is equipped with sealed storehouse, the intermediate position department of annular seat one end is equipped with the controller, and the outside of controller is equipped with prevents touching the lid, the intermediate position department at annular seat top is equipped with the bearing frame, the pivot is established with the bearing housing and is connected, and is two sets of the connecting block is close to the both sides rigid coupling of one end each other with the mounting groove, and is two sets of in addition the connecting block is with the bottom rigid coupling of mounting groove, the inside both sides of mount are equipped with infrared ray sensor.

Preferably, one end of each two-way screw rod, which is far away from each other, is provided with a rotating handle, the rotating handle extends out of the inside of the mounting groove, the tops of the four hinged rods at the same end are hinged with supporting plates, and the supporting plates are fixedly connected with the top plate.

Preferably, the tops of two sides of the two groups of concave die cavities are provided with clamping grooves, the two sides of the two groups of pressing plates are provided with buckles matched with the clamping grooves in a clamping manner, the two sides of the two groups of concave die cavities are provided with moving seats, and the moving seats and the annular seats are on the same horizontal plane.

Preferably, two sets of place the inside both sides of platform and seted up the dovetail groove, and dovetail groove and roof block adaptation, two sets of the intercommunication department of leading to groove and permeable formation is relative with the cavity horizontal plane of placing between platform and the clamp plate.

Preferably, the first positioning piece is formed by combining positioning plates and contact pins respectively, and the positioning plates and the contact pins are arranged at symmetrical positions on two sides and two ends inside the two groups of concave die cavities.

Preferably, the second positioning element is formed by combining an angle-shaped block and an L-shaped splicing plate respectively, the angle-shaped blocks are arranged at four corners inside the concave die cavity, the L-shaped splicing plates matched with the angle-shaped blocks in a clamping manner are arranged at four corners at the bottom of the pressing plate, and the L-shaped splicing plates and the bottom surface of the pressing plate are on the same horizontal plane.

Compared with the prior art, the invention provides a novel multilayer circuit board manufacturing process, which has the following beneficial effects:

1. according to the invention, through the structural matching of the rotary adjusting structure and the lifting mechanism with the laminating modules, the plate manufacturing dies of the two groups of laminating modules can be adjusted and converted, so that an operator can simultaneously carry out the laminating and laminating work of the two groups of plates, the manufacturing continuity and the production efficiency of the multilayer circuit board are improved, and during the process of entering a stove for drying, hot gas can be forced to uniformly enter the laminating surface between the placing table and the pressing plate from the arranged permeable layer and the arranged through groove by utilizing the centrifugal rotation of the two groups of concave die cavities, so that the heat source covering is uniformly and effectively carried out on the multilayer circuit board in the laminating state, the bonding process of the multilayer circuit board is promoted to be more uniform and comprehensive, the phenomena of uneven baking and overflow of an adhesive during the bonding of the circuit board are avoided, and the qualification rate and the comprehensive performance of the device for manufacturing the multilayer circuit board are improved.

2. The multilayer circuit board laminating and fusing device has the advantages that the structure matching of the placing table and the pressing plate is utilized to enable the pressing plate to extrude the multilayer circuit board to the horizontal plane where the permeable layer and the through groove are baked and fused, so that a heat source in a furnace is enabled to be contacted with the multilayer circuit board more uniformly and comprehensively, in addition, through the structure matching of the laminating module, the multilayer circuit board laminated and fused in the concave die cavity can be ejected out by utilizing the lifting and jacking of the top plate, so that an operator can take the multilayer circuit board conveniently, and the circuit board is prevented from being rubbed and damaged when being manually taken.

Drawings

FIG. 1 is a front view of the present invention;

FIG. 2 is a first front cross-sectional view of the present invention;

FIG. 3 is a second front cross-sectional view of the present invention;

FIG. 4 is a top view of the present invention;

FIG. 5 is a top view of the lift mechanism of the present invention;

FIG. 6 is a bottom view of the platen of the present invention;

fig. 7 is a perspective view of the fixing frame of the present invention.

In the figure: 1. a rotation adjustment structure; 11. an annular seat; 12. a slider; 13. an annular chute; 14. a gear; 15. a fluted disc; 16. connecting blocks; 17. a servo motor; 18. a rotating shaft; 19. a fixed mount; 2. a lifting mechanism; 21. mounting grooves; 22. a loop bar; 23. a sleeve; 24. a hinged lever; 25. a top plate; 26. an internal thread block; 27. a bidirectional screw rod; 28. a connecting plate; 3. laminating the module; 31. a concave die cavity; 32. a placing table; 33. a through groove; 34. a permeable layer; 35. a first positioning member; 36. a second positioning member; 4. and (7) pressing a plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-7, the present invention provides a technical solution: the novel multilayer circuit board manufacturing process comprises the following specific processing steps:

s4, plate fusion: after the plates are laminated, the plates can be sent into a fire furnace to fuse the laminated plates together; a multilayer wiring board is formed.

The invention also comprises manufacturing equipment for manufacturing the novel multilayer circuit board, which comprises a rotary adjusting structure 1, wherein the rotary adjusting structure 1 respectively comprises an annular seat 11, sliding blocks 12, annular sliding grooves 13, gears 14, a fluted disc 15, connecting blocks 16, servo motors 17, a rotating shaft 18 and a fixing frame 19, the annular sliding grooves 13 are formed in the edge of the top of the annular seat 11, four groups of sliding blocks 12 are arranged on the inner side of each annular sliding groove 13, the connecting blocks 16 are arranged on the tops of the four groups of sliding blocks 12, the rotating shaft 18 is sleeved in the middle of the top in the annular seat 11, the top of the rotating shaft 18 is fixedly connected with the fixing frame 19, the servo motors 17 are arranged on one side, close to the rotating shaft 18, of the annular seat 11, and the output end of each servo motor 17 and the outer side of the rotating shaft 18 are respectively provided with the gears 14 and the fluted disc 15 which are meshed with each other.

As a preferable embodiment of the present embodiment: two ends of the fixing frame 19 are provided with lifting mechanisms 2, and the lifting mechanisms 2 respectively comprise mounting grooves 21, loop bars 22, sleeves 23, hinge rods 24, a top plate 25, internal thread blocks 26, two-way screw rods 27 and connecting plates 28, the mounting grooves 21 are two groups, two groups of mounting grooves 21 are fixedly connected with the fixing frame 19 and four groups of connecting blocks 16, two sides of two groups of internal ends of the mounting grooves 21 are provided with the loop bars 22, the outer side symmetrical sleeves of the two groups of loop bars 22 at the same end are provided with the sleeves 23, the tops of the sleeves 23 are respectively hinged with the hinge rods 24 and the top plate 25, the middle positions at the two groups of internal ends of the mounting grooves 21 are provided with the two-way screw rods 27, the outer side symmetrical sleeves of the two groups of two-way screw rods 27 are provided with the internal thread blocks 26 of thread adaptation, and two sides of the internal thread blocks 26 are provided with the connecting plates 28 fixedly connected with the sleeves 23.

As a preferable embodiment of the present embodiment: the top of two sets of mounting grooves 21 is equipped with lamination module 3, and lamination module 3 includes concave type die cavity 31 respectively, place the platform 32, lead to groove 33, permeable formation 34, first setting element 35 and second setting element 36, concave type die cavity 31 is two sets of, two sets of concave type die cavity 31 and mounting groove 21 rigid couplings, permeable formation 34 has been seted up to the intermediate position department in two sets of concave type die cavity 31 outsides, two sets of concave type die cavity 31 inboard edges have been seted up with the logical groove 33 that permeable formation 34 communicates each other, two sets of concave type die cavity 31's bottom is equipped with places platform 32, two sets of concave type die cavity 31's inside is evenly arranged and is equipped with first setting element 35 and second setting element 36, two sets of concave type die cavity 31 inboard top cards are equipped with clamp plate 4.

As a preferable embodiment of the present embodiment: the inside outside that is close to servo motor 17 of annular seat 11 is equipped with the sealed storehouse, the intermediate position department of annular seat 11 one end is equipped with the controller, and the outside of controller is equipped with prevents touching the lid, the intermediate position department at annular seat 11 top is equipped with the bearing frame, pivot 18 establishes with the bearing frame cover and is connected, two sets of connecting blocks 16 and the both sides rigid coupling that mounting groove 21 is close to one end each other, the bottom rigid coupling of another two sets of connecting blocks 16 and mounting groove 21, the inside both sides of mount 19 are equipped with infrared ray sensor, accessible infrared ray sensor ensures the accuracy nature of mount 19 rotation angle modulation.

As a preferable embodiment of the present embodiment: the one end that two sets of two-way lead screw 27 kept away from each other is equipped with changes the handle, and changes the handle and extend the inside of mounting groove 21, and the top of four groups of hinge bar 24 of same end articulates there is the layer board, and layer board and roof 25 rigid coupling, and the lift support of accessible layer board drives roof 25 and rises to lift the automatic multilayer circuit board that rises.

As a preferable embodiment of the present embodiment: the tops of two sets of concave die cavity 31 both sides are equipped with the draw-in groove, and the both sides of two sets of clamp plates 4 are equipped with the buckle with draw-in groove block adaptation, and the both sides of two sets of concave die cavity 31 are equipped with the removal seat, and remove the seat and be same horizontal plane with annular seat 11, and the accessible removes the supplementary removal of seat, makes the holistic stability of concave die cavity 31 better, avoids concave die cavity 31 position skew and not hard up to appear in lamination during operation.

As a preferable embodiment of the present embodiment: two sets of inside both sides of placing platform 32 have seted up the dovetail groove, and dovetail groove and roof 25 block adaptation, and two sets of intercommunication departments that lead to groove 33 and permeable formation 34 are relative with the cavity horizontal plane of placing between platform 32 and the clamp plate 4, and the dovetail groove that the accessible was seted up and the block adaptation of roof 25 impel roof 25 and place platform 32 and be same horizontal plane, are convenient for follow-up to the multilayer circuit board lift out, make things convenient for operating personnel to take.

As a preferable embodiment of the present embodiment: the first positioning piece 35 is formed by combining positioning plates and pins, the positioning plates and the pins are arranged at symmetrical positions of two sides and two ends inside the two groups of concave die cavities 31, and the prefabricated clamping holes of the circuit boards can be inserted through the pins so as to guide the circuit boards, so that the multiple groups of circuit boards are stacked mutually, and the subsequent lamination precision is improved.

As a preferable embodiment of the present embodiment: the second positioning member 36 is formed by combining an angle-shaped block and an L-shaped splicing plate respectively, the angle-shaped block is arranged at the four corners inside the two groups of concave die cavities 31, the L-shaped splicing plate matched with the angle-shaped block in a clamping manner is arranged at the four corners at the bottom of the two groups of pressing plates 4, the L-shaped splicing plates and the bottom surfaces of the pressing plates 4 are in the same horizontal plane, the L-shaped splicing plates are clamped into the outer sides of the angle-shaped blocks along with the descending of the pressing plates 4, and therefore the pressing plates are enabled to stably laminate circuit boards in the concave die cavities 31 when the pressing plates 4 are guided.

Embodiment 1, as shown in fig. 1 to 4, when multiple groups of circuit boards are embedded into the concave cavity 31, the multiple groups of circuit boards are stacked one on another under the positioning of the first positioning member 35 by the positioning of the preset first positioning member 35, and when the pressing plate 4 is pressed into the concave cavity 31, the L-shaped splicing plates at four corners of the pressing plate 4 are matched with the second positioning members 36 composed of the corner-shaped blocks, so that the pressing plate 4 is fully embedded into the concave cavity 31, the multiple groups of circuit boards are laminated, and the laminated pressing plate 4 is fixedly connected into the concave cavity 31 by the matching of the clamping grooves and the buckles, thereby ensuring the laminating efficiency of the multiple groups of circuit boards and improving the precision of the subsequent fusion-bonding operation.

Embodiment 2, as shown in fig. 2 and 5, when the circuit board is laminated and fused to form a multilayer circuit board, the rotation of the bidirectional screw rod 27 drives the two sets of internal thread blocks 26 to approach each other, so that the internal thread blocks 26 drive the connecting plate 28 and the sleeve 23 to approach each other under the guidance of the loop bar 22, and further the sleeve 23 drives the hinge bar 24 to cooperate in a linkage manner, so that the hinge bar 24 is forced to drive the top plate 25 to lift up, and further the multilayer circuit board laminated on the surface of the placing table 32 is lifted out of the concave mold cavity 31, thereby facilitating the direct taking out of the multilayer circuit board by an operator, increasing the operability and convenience of the operator, and avoiding the occurrence of friction and damage when the multilayer circuit board is taken out.

The working principle is as follows: when a multilayer circuit board is manufactured, the prefabricated circuit board is sequentially embedded into the concave cavity 31 according to a specified layer, the circuit board is enabled to keep consistent vertical surfaces to be mutually contacted and laminated under the structural cooperation of the first positioning piece 35 in the process, meanwhile, an adhesive layer is coated on the laminated surface, when a prefabricated multilayer plate is arranged in one group of concave cavity 31, the gear 14 and the fluted disc 15 are driven to be mutually meshed through the starting of the servo motor 17 to force the rotating shaft 18 to rotate, then the fixing frame 19, the two groups of mounting grooves 21 and the concave cavity 31 are driven to rotate 180 degrees in a centrifugal mode through the rotating shaft 18, so that the positions of the two groups of concave cavities 31 are changed, at the moment, the pressing plate 4 can be driven by a machine to laminate the circuit board in the concave cavity 31, and meanwhile, a worker carries out the laminating work of the prefabricated circuit board again;

after the circuit boards of two sets of concave die cavities 31 are laminated and pressed, the device can be placed on a conveyor belt to enter a stove, the servo motor 17 is started to drive the rotating shaft 18 and the two sets of concave die cavities 31 to rotate continuously, at the moment, the centrifugal rotation of the concave die cavities 31 is in contact with a heat source in the stove, the heat source is enabled to seep out of the concave die cavities 31 through openings of the permeable layers 34 and the through grooves 33, and multiple sets of circuit boards of the placing table 32 and the laminating surface of the pressing plate 4 are fused, so that the integrated manufacturing work of multiple layers of circuit boards can be achieved.

Finally, it should be noted that the above-mentioned contents are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, and that the simple modifications or equivalent substitutions of the technical solutions of the present invention by those of ordinary skill in the art can be made without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. The manufacturing process of the multilayer circuit board is characterized in that: the specific processing steps are as follows:

s4, fusion welding of plates: after the plates are laminated, the plates are sent into a fire furnace to fuse the laminated plates together; a multi-layer wiring board is formed,

wherein, the manufacture equipment of multilayer circuit board manufacturing process includes rotation regulation structure (1), rotation regulation structure (1) includes annular seat (11), slider (12), annular spout (13), gear (14), fluted disc (15), connecting block (16), servo motor (17), pivot (18) and mount (19) respectively, annular spout (13) have been seted up to the edge at annular seat (11) top, the inboard of annular spout (13) is equipped with four groups slider (12), four groups the top of slider (12) is equipped with connecting block (16), the intermediate position department cover at annular seat (11) inside top is equipped with pivot (18), the top rigid coupling of pivot (18) has mount (19), one side that annular seat (11) inside is close to pivot (18) is equipped with servo motor (17), the output of servo motor (17) is equipped with intermeshing's gear (14) and pivot (18) respectively with the outside of pivot (18) gear (14) and mount (19), and the output of servo motor (17) are equipped with intermeshing respectively A fluted disc (15),

wherein, both ends of the fixing frame (19) are provided with lifting mechanisms (2), the lifting mechanisms (2) respectively comprise mounting grooves (21), loop bars (22), sleeves (23), hinged rods (24), a top plate (25), internal thread blocks (26), two-way screw rods (27) and connecting plates (28), the mounting grooves (21) are divided into two groups, two groups of mounting grooves (21) are fixedly connected with the fixing frame (19) and four groups of connecting blocks (16), the loop bars (22) are arranged on both sides of the two ends in the two groups of mounting grooves (21), the sleeves (23) are symmetrically sleeved on the outer sides of the two groups of loop bars (22) at the same end, the top parts of the sleeves (23) are respectively hinged with the hinged rods (24) and the top plate (25), the two groups of the middle positions at both ends in the mounting grooves (21) are sleeved with the two-way screw rods (27), the outer sides of the two groups of the two-way screw rods (27) are symmetrically provided with the internal thread blocks (26) with thread adaptation, and two sides of the internal thread block (26) are provided with connecting plates (28) fixedly connected with the sleeve (23).

2. The process for manufacturing a multilayer wiring board according to claim 1, characterized in that: the tops of the two groups of mounting grooves (21) are provided with laminating modules (3), and the laminating modules (3) respectively comprise concave die cavities (31), placing tables (32), through grooves (33), permeable layers (34), first positioning pieces (35) and second positioning pieces (36), concave type die cavity (31) are two sets of, two sets of concave type die cavity (31) and mounting groove (21) rigid coupling, and are two sets of permeable formation (34) have been seted up to the intermediate position department in concave type die cavity (31) outside, and are two sets of logical groove (33) that communicate each other with permeable formation (34) are seted up to the edge of concave type die cavity (31) inboard, and are two sets of platform (32) are placed to the bottom of concave type die cavity (31) is equipped with, and are two sets of first setting element (35) and second setting element (36) are evenly arranged to the inside of concave type die cavity (31), and are two sets of the inboard top card of concave type die cavity (31) is equipped with clamp plate (4).

3. The process for producing a multilayer wiring board according to claim 1, wherein: the outside that is close to servo motor (17) in annular seat (11) inside is equipped with sealed storehouse, the intermediate position department of annular seat (11) one end is equipped with the controller, and the outside of controller is equipped with prevents touching the lid, the intermediate position department at annular seat (11) top is equipped with the bearing frame, pivot (18) are established with the bearing frame cover and are connected, and are two sets of connecting block (16) and mounting groove (21) are close to the both sides rigid coupling of one end each other, and are two sets of in addition the bottom rigid coupling of connecting block (16) and mounting groove (21), the inside both sides of mount (19) are equipped with infrared ray sensor.

4. The process for producing a multilayer wiring board according to claim 1, wherein: one end of each two-way screw rod (27) is provided with a rotating handle, the rotating handles extend out of the mounting groove (21), the tops of the four hinged rods (24) at the same end are hinged with supporting plates, and the supporting plates are fixedly connected with a top plate (25).

5. The process for producing a multilayer wiring board according to claim 2, wherein: the top of two sides of the concave die cavities (31) is provided with a clamping groove, the two sides of the pressing plate (4) are provided with buckles matched with the clamping grooves in a clamping mode, the two sides of the concave die cavities (31) are provided with moving seats, and the moving seats and the annular seat (11) are on the same horizontal plane.

6. The process for producing a multilayer wiring board according to claim 2, wherein: two sets of place the inside both sides of platform (32) and seted up the dovetail groove, and dovetail groove and roof (25) block adaptation, two sets of the intercommunication department that leads to groove (33) and permeable formation (34) is relative with the cavity horizontal plane of placing between platform (32) and clamp plate (4).

7. The process for producing a multilayer wiring board according to claim 2, wherein: the first positioning piece (35) is formed by combining positioning plates and inserting pins respectively, and the positioning plates and the inserting pins are arranged at symmetrical positions on two sides and two ends inside the two groups of concave die cavities (31).

8. The process for manufacturing a multilayer wiring board according to claim 2, characterized in that: the second positioning piece (36) is formed by combining an angle-shaped block and an L-shaped splicing plate respectively, the angle-shaped blocks are arranged at four corners inside the concave die cavity (31), the L-shaped splicing plates matched with the angle-shaped blocks in a clamping manner are arranged at four corners at the bottom of the pressing plate (4), and the L-shaped splicing plates and the bottom surface of the pressing plate (4) are on the same horizontal plane.