CN114245609A - Reflow heat insulation tray, circuit board and ball grid array packaging welding method - Google Patents

Reflow heat insulation tray, circuit board and ball grid array packaging welding method Download PDF

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Publication number
CN114245609A
CN114245609A CN202111589498.6A CN202111589498A CN114245609A CN 114245609 A CN114245609 A CN 114245609A CN 202111589498 A CN202111589498 A CN 202111589498A CN 114245609 A CN114245609 A CN 114245609A
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China
Prior art keywords
circuit board
reflow
heat insulation
grid array
ball grid
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Granted
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CN202111589498.6A
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Chinese (zh)
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CN114245609B (en
Inventor
胡东东
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Ruijie Networks Co Ltd
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Ruijie Networks Co Ltd
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Priority to CN202111589498.6A priority Critical patent/CN114245609B/en
Priority claimed from CN202111589498.6A external-priority patent/CN114245609B/en
Publication of CN114245609A publication Critical patent/CN114245609A/en
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Publication of CN114245609B publication Critical patent/CN114245609B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3436Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/085Cooling, heat sink or heat shielding means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a reflow heat insulation tray, a circuit board and a welding method of a ball grid array package. The reflow heat insulation tray is used for bearing a circuit board, and the circuit board is subjected to reflow soldering with the ball grid array package. The backflow heat insulation tray comprises a frame, a supporting rib and a heat insulation cover, and the heat insulation cover is connected with the frame through the supporting rib. The heat insulation ribs are arranged on the peripheral side of the heat insulation cover, the heat insulation ribs protrude towards one side of the circuit board, and the heat insulation cover is used for covering the ball grid array package. The heat shield is provided with an opening for introducing solder reflow hot air. The reflow heat insulation tray, the circuit board and the welding method of the ball grid array package effectively reduce the phenomenon of tin connection when the ball grid array package and the circuit board are subjected to reflow welding.

Description

Reflow heat insulation tray, circuit board and ball grid array packaging welding method
Technical Field
The invention relates to the technical field of circuit board welding, in particular to a reflow heat insulation tray, a circuit board and a welding method of ball grid array packaging.
Background
Ball Grid Array (BGA) packages have smaller size, better heat dissipation and electrical performance than Thin Small Outline Packages (TSOP). The BGA packaging technology greatly improves the storage capacity per square inch, and the volume of a memory product adopting the BGA packaging technology is only one third of that of a TSOP (transistor-series-parallel Package) under the same capacity; in addition, the BGA package method has a faster and more efficient heat dissipation path than the conventional TSOP package method. Thus, BGA packages are widely used.
The BGA is mounted to a Printed Circuit Board (PCB) using a reflow soldering process. For oversized BGAs (length and width dimensions greater than or equal to 65mm), problems with wicking can occur during soldering. One reason for tin connection is that the heat capacity of the oversized BGA is very large, heat absorption is fast, and a huge temperature gradient is formed at the position where the BGA is placed and around the PCB when the PCB is subjected to soldering reflow, so that the PCB is seriously thermally deformed; in addition, during the reflow soldering process, the edge temperature of the oversized BGA is higher than that of the middle area, so that a large temperature gradient is formed between the edge temperature and the middle temperature of the BGA, and thermal deformation of the BGA is caused. The BGA solder joints are tin connected for the reasons described above.
Disclosure of Invention
The invention provides a reflow heat insulation tray, a circuit board and a welding method of a ball grid array package, which are used for solving the problem of tin connection between the ball grid array package and the circuit board during reflow welding.
The invention provides a reflow heat insulation tray which is used for bearing a circuit board, and the circuit board is subjected to reflow soldering with a ball grid array package. The backflow heat insulation tray comprises a frame, a supporting rib and a heat insulation cover, and the heat insulation cover is connected with the frame through the supporting rib. The heat insulation ribs are arranged on the peripheral side of the heat insulation cover, the heat insulation ribs protrude towards one side of the circuit board, and the heat insulation cover is used for covering ball grid array packaging. The heat shield is provided with an opening for introducing solder reflow hot air.
In the technical scheme, the edge of the ball grid array package and the circuit board are positioned in the area covered by the ball grid array package and the surrounding area of the covered area, and are isolated from the welding reflow hot air through the heat insulation cover, so that the edge of the ball grid array package is prevented from being directly heated by the welding reflow hot air. The solder reflow hot air can directly heat the middle area of the ball grid array package through the opening, so that the temperature of the middle area of the ball grid array package is higher. Therefore, the whole temperature of the ball grid array package tends to be balanced, and the problem that the ball grid array package is deformed due to overlarge temperature gradient between the middle and the edge is reduced. Meanwhile, the circuit board is positioned in the coverage area of the ball grid array package and the surrounding area of the ball grid array package and is covered by the heat insulation cover, so that the temperature is reduced, and the deformation of the circuit board is reduced. Therefore, the phenomenon of tin connection between the ball grid array package and the circuit board during reflow soldering is reduced.
In an optional technical scheme, the frame is provided with a positioning pin, the circuit board is provided with a positioning hole, and the positioning pin is used for being inserted into the positioning hole. The positioning pins and the positioning holes are inserted to realize the positioning of the backflow heat insulation tray and the circuit board.
In an optional technical scheme, the orthographic projection of the ball grid array package on the circuit board completely covers the orthographic projection of the opening on the circuit board. Such that the edge of the ball grid array package is isolated from the solder reflow hot air by a heat shield.
In an optional technical scheme, the width of the heat insulation ribs is 3 mm-5 mm. The heat insulation ribs with the width can achieve a good effect of blocking welding backflow hot air.
In an optional technical scheme, the diameter of the positioning pin is 1 mm-1.5 mm. The positioning pin is adopted, so that the positioning stability can be ensured, and the backflow heat insulation tray and the circuit board are prevented from generating relative displacement.
In an alternative embodiment, the length a of the ball grid array package in the first direction and the length B of the ball grid array package in the second direction satisfy: a is more than or equal to 65mm and less than or equal to 90mm, B is more than or equal to 65mm and less than or equal to 90mm, and the first direction is perpendicular to the second direction. The reflow heat insulation tray is suitable for the BGA300 and circuit board 200 welding which accord with the sizes, and the welding effect is better.
The invention also provides a circuit board which is packaged and welded with the ball grid array by adopting the reflow heat insulation tray. The circuit board comprises a separation strip, the separation strip encloses a closed area, and the ball grid array package is located in the closed area. The separation strip is used for being abutted against the supporting rib, so that the edge of the heat shield is tightly attached to the circuit board, welding backflow hot air is blocked, the edge of the ball grid array package is isolated from the welding backflow hot air, and direct heating is avoided.
In an optional technical solution, the ball grid array package includes a first edge, a second edge, a third edge and a fourth edge, the barrier bars include a first barrier bar, a second barrier bar, a third barrier bar and a fourth barrier bar, a distance a between the first edge and the first barrier bar, a distance b between the second edge and the second barrier bar, a distance c between the third edge and the third barrier bar, and a distance d between the fourth edge and the fourth barrier bar satisfy: a is more than 30mm and less than 50mm, b is more than 30mm and less than 50mm, c is more than 30mm and less than 50mm, and d is more than 30mm and less than 50 mm. Through experimental determination, the welding effect is better by adopting the numerical values.
In an optional technical scheme, a distance a between a first edge and a first barrier strip, a distance b between a second edge and a second barrier strip, a distance c between a third edge and a third barrier strip, and a distance d between a fourth edge and a fourth barrier strip satisfy: a, b, c, and d.
The invention also provides a welding method of the ball grid array package, which is used for welding the ball grid array package on the circuit board, and the reflow heat insulation tray is adopted during welding. The method comprises the following steps:
the ball grid array package is attached to the circuit board. And assembling the backflow heat insulation tray and the circuit board to enable the barrier strips to be abutted against the support ribs. And welding the ball grid array package to the circuit board by adopting a hot air reflow welding process, wherein the welding reflow hot air enters the heat insulation cover from the opening, so that the temperature of the ball grid array package at the opening is higher than the temperature of the ball grid array package at the edge. Because the area of the ball grid array package positioned in the opening is directly heated by the welding reflow hot air, the temperature is higher than that of the edge area of the ball grid array package, and meanwhile, the edge temperature of the ball grid array package is higher than the middle temperature, the temperature is neutralized, so that the whole temperature of the ball grid array package tends to be balanced. The problem of large deformation of the ball grid array package is solved, and meanwhile, the temperature of the area of the circuit board covered by the heat shield tends to be balanced, and the deformation of the circuit board is also reduced. Therefore, the occurrence of tin connection phenomenon during the reflow soldering of the ball grid array package and the circuit board is reduced.
Drawings
FIG. 1 is a schematic view of a reflow insulation tray in one embodiment of the present invention;
FIG. 2 is a schematic diagram of a circuit board according to an embodiment of the present invention;
fig. 3 is an assembly view of a circuit board and a reflow insulation tray in an embodiment of the invention.
Reference numerals:
100-a reflow insulation tray; 200-a circuit board; 300-ball grid array package; 1-a frame; 2-supporting ribs; 3-heat shield; 4-heat insulation ribs; 5-opening; 6-positioning pins; 7-voids; 8-barrier strips; 81-a first barrier strip; 82-a second barrier strip; 83-third barrier strip; 84-a fourth barrier strip; 301-a first edge; 302-a second edge; 303-third edge; 304-fourth edge; m-a first direction; n-second direction.
Detailed Description
To reduce the occurrence of tin connection between a ball grid array package and a circuit board during reflow soldering. Embodiments of the invention provide a reflow heat insulation tray, a circuit board and a soldering method of a ball grid array package. In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the following embodiments.
Fig. 1 is a schematic structural view of a reflow insulation tray according to an embodiment of the present invention, fig. 2 is a schematic structural view of a circuit board according to an embodiment of the present invention, and fig. 3 is an assembly view of the circuit board and the reflow insulation tray according to an embodiment of the present invention. Referring to fig. 1 to fig. 3, a reflow insulation tray 100 according to an embodiment of the present invention is used for carrying a circuit board 200. The circuit board 200 is reflow soldered to the ball grid array package 300. The backflow heat insulation tray 100 comprises a frame 1, a support rib 2 and a heat insulation cover 3, wherein the heat insulation cover 3 is connected with the frame 1 through the support rib 2, and a gap 7 is formed between the support rib 2, the frame 1 and the heat insulation cover 3. The above-mentioned gap 7 is used to avoid other electronic components of the circuit board 200. The heat insulating ribs 4 are provided on the peripheral side of the heat insulating cover 3, and the heat insulating ribs 4 protrude toward the circuit board 200. The heat shield 3 is used to cover the ball grid array package 300 such that the ball grid array package 300 is entirely located in the heat shield 3. The heat shield 3 is provided with an opening 5, which opening 5 is used for introducing solder reflow hot air. In the case of specifically preparing the reflow heat insulating tray 100, the opening 5 may be located at an intermediate position of the heat shield 3.
In the above embodiment, the edge of the bga package 300 is isolated from the solder reflow heat via the heat shield 3, so as to prevent the solder reflow heat from directly heating the edge of the bga package 300. The solder reflow hot air passing through the opening 5 can directly heat the middle area of the ball grid array package 300, so that the temperature of the middle area of the ball grid array package 300 is higher. Since the above-described reflow soldering tray is not used, the edge temperature of the bga package 300 is higher than the middle temperature during the heating process. Therefore, the temperature can be neutralized by adopting the reflow soldering tray, so that the overall temperature of the ball grid array package tends to be balanced. The deformation of the ball grid array package 300 due to excessive intermediate and edge temperature gradients is reduced. Meanwhile, since the heat capacity of the bga package 300 is large and the heat absorption is fast, the temperature of the circuit board 200 is higher in the coverage area of the bga package 300 and the surrounding area of the bga package 300. After the circuit board 200 is covered by the heat shield 3, the temperature of the circuit board 200 in the area covered by the ball grid array package 300 and the area surrounded by the heat shield 3 around the ball grid array package 300 is lower than that in the area not covered by the heat shield 3, and the temperature is neutralized, so that the temperature of the whole circuit board 200 tends to be balanced. Thereby reducing deformation of the circuit board 200. Therefore, the phenomenon of tin connection between the ball grid array package 300 and the circuit board 200 during reflow soldering is reduced.
With continued reference to fig. 1, in an alternative embodiment, the width of the insulating ribs 4 is 3mm to 5 mm. In a specific embodiment, the width of the insulating ribs 4 can be as follows, for example: 3 mm; 4 mm; 5 mm. The present application is not particularly limited. The heat insulation ribs with the width can achieve a good effect of blocking welding backflow hot air.
For convenience of description, the ball grid array package 300 will be referred to as the BGA300 and the reflow insulation tray 100 will be referred to as the tray 100.
Referring to fig. 3, in an alternative embodiment, the frame 1 may be provided with positioning pins 6, the circuit board 200 may have positioning holes (not shown), and the positioning pins 6 are used for being inserted into the positioning holes. When the positioning pins 6 are specifically arranged, the number of the positioning pins 6 can be four, and the application is not particularly limited. The positioning pins 6 are inserted into the positioning holes to position the tray 100 and the circuit board 200. When the circuit board 200 is specifically manufactured, the diameter of the positioning pin 6 may be 1mm to 1.5mm, and the above dimensions can ensure positioning stability and prevent the tray 100 and the circuit board 200 from generating relative displacement.
With continued reference to fig. 3, in an alternative embodiment, the orthographic projection of BGA300 on board 200 completely covers the orthographic projection of opening 5 on board 200. Thus, the edge of the BGA300 is entirely within the heat shield 3. The edge of the BGA300 is isolated from the solder reflow hot air.
In an alternative embodiment, the length a in the first direction M and the length B in the second direction N of the BGA300 satisfy: a is more than or equal to 65mm and less than or equal to 90mm, and B is more than or equal to 65mm and less than or equal to 90 mm. In a specific embodiment, the following values are used to achieve the object of the present invention, for example: a is 65 mm; a is 70 mm; a is 80 mm; a is 90 mm; b is 65 mm; b is 70 mm; b is 80 mm; and B is 90 mm. The first direction M is perpendicular to the second direction N. Through experimental determination, the tray 100 of the present application is suitable for the welding of the BGA300 and the circuit board 200 with the above dimensions, and the welding effect is better.
With continued reference to FIG. 1, in an alternative embodiment, the length of the opening 5 along the first direction M is C, and the length along the second direction N is D, such that C is greater than or equal to 45mm and less than or equal to 50mm, and D is greater than or equal to 45mm and less than or equal to 50 mm. In a specific embodiment, the following values are used to achieve the object of the present invention, for example: c is 45 mm; c is 48 mm; c is 50 mm; d is 45 mm; d is 48 mm; d is 50 mm. Through experimental determination, the size of the opening 5 adopts the numerical value, and the welding effect is better.
Referring to fig. 2 and 3, an embodiment of the invention further provides a circuit board 200, and the circuit board 200 is soldered to the BGA300 by using the tray 100. The circuit board 200 includes a barrier strip 8, the barrier strip 8 enclosing an enclosed area, and the BGA300 being located within the enclosed area. The blocking strips 8 are used for being abutted to the supporting ribs 2, so that the edge of the heat shield is tightly attached to the circuit board 200, welding backflow hot air is blocked, the edge of the BGA300 is isolated from the welding backflow hot air, and direct heating is avoided.
With continued reference to fig. 2, the BGA300 includes a first edge 301, a second edge 302, a third edge 303, and a fourth edge 304, and the barrier bars 8 include a first barrier bar 81, a second barrier bar 82, a third barrier bar 83, and a fourth barrier bar 84. The distance a between the first edge 301 and the first barrier strip 81, the distance b between the second edge 302 and the second barrier strip 82, the distance c between the third edge 303 and the third barrier strip 83, and the distance d between the fourth edge 304 and the fourth barrier strip 84 satisfy: a is more than 30mm and less than 50mm, b is more than 30mm and less than 50mm, c is more than 30mm and less than 50mm, and d is more than 30mm and less than 50 mm. In a specific embodiment, the following values are used to achieve the object of the present invention, for example: a is 30 mm; a is 40 mm; a is 50 mm; b is 30 mm; b is 40 mm; b is 50 mm; c is 30 mm; c is 40 mm; c is 50 mm; d is 30 mm; d is 40 mm; d is 50 mm. Through experimental determination, the welding effect is better by adopting the numerical values.
In an alternative embodiment, the welding effect is better when a, b, c, and d. In a specific embodiment, tests show that when a, B, c, d and 40mm are 65mm, a, B, d and 40mm can achieve better welding effect.
The width of the barrier strips 8 is 3mm to 5 mm. In a specific embodiment, the width of the barrier strips 8 can be as follows, for example: 3 mm; 4 mm; 5 mm. The present application is not particularly limited.
An embodiment of the present invention further provides a method for soldering a ball grid array package, where the soldering method is used to solder the BGA300 to the circuit board 200, and the soldering method uses the tray 100, and the specific method includes: the BGA300 is first attached to the circuit board 200. Then, the tray 100 is assembled with the circuit board 200 so that the spacer bars 8 abut against the support ribs 2 and the positioning pins 6 are inserted into the positioning holes. The BGA300 is finally soldered to the circuit board 200 using a hot air reflow soldering process. Solder reflow hot air enters the heat shield 3 from the opening 5, causing the temperature of the BGA300 at the opening 5 to be higher than at the edge of the BGA 300. Since the area of BGA300 in opening 5 is directly heated by the solder reflow heat, the temperature is higher in the edge area relative to BGA300, and the edge temperature of BGA300 itself is higher than the intermediate temperature, so that the temperature is neutralized and the overall temperature of BGA300 is balanced. The problem of large deformation of the BGA300 is reduced. Meanwhile, the temperature of the area of the circuit board 200 covered by the heat shield 3 is reduced, so that the overall temperature of the circuit board 200 tends to be balanced, and the deformation of the circuit board 200 is reduced. Thus, the occurrence of the phenomenon of tin connection during reflow soldering of the BGA300 and the circuit board 200 is reduced.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. A reflow heat insulation tray is used for bearing a circuit board, the circuit board is reflow-welded with a ball grid array package, and the reflow heat insulation tray is characterized by comprising a frame, supporting ribs and a heat insulation cover, wherein the heat insulation cover is connected with the frame through the supporting ribs;
heat insulation ribs are arranged on the peripheral side of the heat insulation cover, the heat insulation ribs protrude towards one side of the circuit board, and the heat insulation cover is used for covering the ball grid array package; the heat shield is provided with an opening for introducing welding reflow hot air.
2. The reflow oven tray of claim 1, wherein the frame is provided with positioning pins, and the circuit board is provided with positioning holes for inserting the positioning pins.
3. The reflow tray of claim 1, wherein an orthographic projection of the ball grid array package on the circuit board completely covers an orthographic projection of the opening on the circuit board.
4. The reflow insulation tray of claim 1, wherein the insulation ribs have a width of 3mm to 5 mm.
5. The reflow tray of claim 1, wherein the dowel pin has a diameter of 1mm to 1.5 mm.
6. The reflow tray of claim 1, wherein the length a in the first direction and the length B in the second direction of the ball grid array package satisfy: a is more than or equal to 65mm and less than or equal to 90mm, B is more than or equal to 65mm and less than or equal to 90mm, and the first direction is perpendicular to the second direction.
7. A circuit board soldered to the BGA package using the reflow oven tray of any of claims 1-6, wherein the circuit board includes a dam bar enclosing an enclosed area, the BGA package being located within the enclosed area, the dam bar being configured to abut the support ribs.
8. The circuit board of claim 7, wherein the BGA package includes a first edge, a second edge, a third edge, and a fourth edge, the barrier bars include a first barrier bar, a second barrier bar, a third barrier bar, and a fourth barrier bar, a distance a between the first edge and the first barrier bar, a distance b between the second edge and the second barrier bar, a distance c between the third edge and the third barrier bar, and a distance d between the fourth edge and the fourth barrier bar satisfy: a is more than 30mm and less than 50mm, b is more than 30mm and less than 50mm, c is more than 30mm and less than 50mm, and d is more than 30mm and less than 50 mm.
9. The circuit board of claim 8, wherein a distance a between the first edge and the first barrier strip, a distance b between the second edge and the second barrier strip, a distance c between the third edge and the third barrier strip, and a distance d between the fourth edge and the fourth barrier strip satisfy: a, b, c, and d.
10. A method of soldering a ball grid array package to a circuit board according to any one of claims 7 to 9, using the reflow insulation tray of any one of claims 1 to 6, the method comprising:
adhering the ball grid array package to the circuit board;
assembling the reflow heat insulation tray with the circuit board to enable the barrier strips to be abutted against the support ribs;
and welding the ball grid array package to the circuit board by adopting a hot air reflow welding process, wherein solder reflow hot air enters the heat insulation cover from the opening, so that the temperature of the ball grid array package at the opening is higher than that at the edge of the ball grid array package.
CN202111589498.6A 2021-12-23 Reflow heat insulation tray, circuit board and ball grid array packaging welding method Active CN114245609B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111589498.6A CN114245609B (en) 2021-12-23 Reflow heat insulation tray, circuit board and ball grid array packaging welding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111589498.6A CN114245609B (en) 2021-12-23 Reflow heat insulation tray, circuit board and ball grid array packaging welding method

Publications (2)

Publication Number Publication Date
CN114245609A true CN114245609A (en) 2022-03-25
CN114245609B CN114245609B (en) 2024-10-25

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041619A (en) * 1996-07-19 1998-02-13 Sony Corp Reflow soldering equipment
KR19990000030A (en) * 1997-06-02 1999-01-15 윤종용 Solder Ball Flattening Unit in Ball Grid Array Package
JP2001156440A (en) * 1999-11-24 2001-06-08 Sony Corp Device for repairing semiconductor package and its usage
JP2001196735A (en) * 2000-01-11 2001-07-19 Taisei Kaken:Kk Reflow nozzle
US6503336B1 (en) * 2001-03-21 2003-01-07 Emc Corporation Techniques for modifying a circuit board using a flow through nozzle
US20030057265A1 (en) * 2001-09-21 2003-03-27 Aspandiar Raiyomand F. Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
US20040134975A1 (en) * 2003-01-10 2004-07-15 Visteon Global Technologies, Inc. Composite pallet for a vector transient reflow process
JP2005276974A (en) * 2004-03-24 2005-10-06 Fujitsu Ltd Removing jig, removing method and device of bga of a printed circuit board
TWM286402U (en) * 2005-07-28 2006-01-21 Ching-Hai Tu Hot wind sleeve having uniform heat effect

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041619A (en) * 1996-07-19 1998-02-13 Sony Corp Reflow soldering equipment
KR19990000030A (en) * 1997-06-02 1999-01-15 윤종용 Solder Ball Flattening Unit in Ball Grid Array Package
JP2001156440A (en) * 1999-11-24 2001-06-08 Sony Corp Device for repairing semiconductor package and its usage
JP2001196735A (en) * 2000-01-11 2001-07-19 Taisei Kaken:Kk Reflow nozzle
US6503336B1 (en) * 2001-03-21 2003-01-07 Emc Corporation Techniques for modifying a circuit board using a flow through nozzle
US20030057265A1 (en) * 2001-09-21 2003-03-27 Aspandiar Raiyomand F. Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
US20040134975A1 (en) * 2003-01-10 2004-07-15 Visteon Global Technologies, Inc. Composite pallet for a vector transient reflow process
JP2005276974A (en) * 2004-03-24 2005-10-06 Fujitsu Ltd Removing jig, removing method and device of bga of a printed circuit board
TWM286402U (en) * 2005-07-28 2006-01-21 Ching-Hai Tu Hot wind sleeve having uniform heat effect

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