CN114242654A - Leadless magnetic packaging structure and manufacturing method thereof - Google Patents
Leadless magnetic packaging structure and manufacturing method thereof Download PDFInfo
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- CN114242654A CN114242654A CN202210164355.9A CN202210164355A CN114242654A CN 114242654 A CN114242654 A CN 114242654A CN 202210164355 A CN202210164355 A CN 202210164355A CN 114242654 A CN114242654 A CN 114242654A
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- magnetic
- chip
- magnetically shielded
- resin layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0075—Magnetic shielding materials
Abstract
The invention provides a leadless magnetic packaging structure and a manufacturing method thereof, relating to the field of semiconductor packaging test. The magnetic shielding resin layer is filled between the chip to be magnetically shielded and the magnetic chip so as to realize magnetic signal interference between the chip to be magnetically shielded and the magnetic chip, and the magnetic shielding resin layer is provided with a first connecting surface inclined from the magnetic chip to the chip to be magnetically shielded and a second connecting surface inclined from the upper surface of the magnetic shielding resin layer to the upper surface of the packaging substrate so as to further form a wiring pattern, and the wiring pattern realizes interconnection between the chips and the packaging substrate along the first connecting surface and the second connecting surface.
Description
Technical Field
The invention relates to the technical field of semiconductor chip packaging test sensitive to a magnetic field, in particular to a leadless magnetic packaging structure and a manufacturing method thereof.
Background
In the field of memories, magnetic materials and magnetoresistive elements are widely used, which control magnetic moments to achieve read and write operations of information, however, in the case of a multi-chip package structure sensitive to magnetic fields, magnetic shielding needs to be applied in a transverse direction to ensure normal operation of the chips, but the existing shielding structure is complex, and for a bonding manner of leads, the leads are also affected by the magnetic fields.
Disclosure of Invention
Based on solving the above problems, the present invention provides a method for manufacturing a leadless magnetic package structure, which comprises the following steps:
(1) bonding a chip to be magnetically shielded and a magnetic chip adjacently on a packaging substrate, wherein the height of the magnetic chip is greater than that of the chip to be magnetically shielded;
(2) filling an underfill between the chip to be magnetically shielded and the packaging substrate and between the magnetic chip and the packaging substrate;
(3) filling a magnetic shielding resin layer between the magnetic chip and the magnetic chip, the magnetic shielding resin layer having a first connection face inclined from the magnetic chip to the magnetic chip and a second connection face inclined from an upper surface of the magnetic shielding resin layer to an upper surface of the package substrate;
(4) forming a wiring pattern electrically connecting an upper electrode of the chip to be magnetically shielded and an upper electrode of the magnetic chip on an upper surface of the magnetic shielding resin layer;
(5) and forming a sealing layer to coat the chip to be magnetically shielded, the magnetic chip and the wiring pattern.
According to an embodiment of the present invention, the wiring pattern includes a connection portion that crosses an interface between the magnetic shielding resin layer and the chip to be magnetically shielded and the core chip, and first and second extension portions that are narrower than the connection portion, one ends of which are connected to both sides of the connection portion, respectively, and the other ends of which are connected to an upper electrode of the chip to be magnetically shielded and an upper electrode of the core chip, respectively.
According to an embodiment of the present invention, the wiring pattern further includes a third extension portion narrower than the connection portion, the third extension portion being connected to the other side of the wiring pattern and extending to an upper surface of the package substrate along the second connection face to electrically connect the package substrate.
According to an embodiment of the present invention, forming the wiring pattern specifically includes: a layer of metal is deposited on the upper surfaces of the magnetic shielding resin layer, the magnetic shielding chip and the magnetic chip, and then etched to form the wiring pattern.
According to an embodiment of the present invention, filling the magnetic shield resin layer specifically includes filling between the chip to be magnetically shielded and the magnetic chip with a resin material in which magnetic particles are dispersed, and then thermally curing and baking to form the first connection face and the second connection face having smooth surfaces.
The invention also provides a leadless magnetic packaging structure, which is formed by the manufacturing method and specifically comprises the following steps:
a package substrate;
a magnetic chip and a chip to be magnetically shielded, which are adjacently bonded on the package substrate, wherein the height of the magnetic chip is greater than that of the chip to be magnetically shielded;
the underfill is filled between the chip to be magnetically shielded and the packaging substrate and between the magnetic chip and the packaging substrate;
a magnetic shield resin layer filled between the magnetic chip and the magnetic chip, the magnetic shield resin layer having a first connection face inclined from the magnetic chip to the magnetic chip and a second connection face inclined from an upper surface of the magnetic shield resin layer to an upper surface of the package substrate;
a wiring pattern formed on an upper surface of the magnetic shielding resin layer and electrically connecting an upper electrode of the chip to be magnetically shielded and an upper electrode of the magnetic chip;
and the sealing layer coats the chip to be magnetically shielded, the magnetic chip and the wiring pattern.
According to an embodiment of the present invention, the wiring pattern includes a connection portion that crosses an interface between the magnetic shielding resin layer and the chip to be magnetically shielded and the core chip, and first and second extension portions that are narrower than the connection portion, one ends of which are connected to both sides of the connection portion, respectively, and the other ends of which are connected to an upper electrode of the chip to be magnetically shielded and an upper electrode of the core chip, respectively.
According to an embodiment of the present invention, the wiring pattern further includes a third extension portion narrower than the connection portion, the third extension portion being connected to the other side of the wiring pattern and extending to an upper surface of the package substrate along the second connection face to electrically connect the package substrate.
According to an embodiment of the present invention, the third extension portion extends along a gap between the chip to be magnetically shielded and the magnetic chip.
According to an embodiment of the present invention, the magnetic shield resin layer is formed of a resin material in which magnetic particles are dispersed.
The magnetic shielding resin layer is filled between the chip to be magnetically shielded and the magnetic chip so as to realize magnetic signal interference between the chip to be magnetically shielded and the magnetic chip, and the magnetic shielding resin layer is provided with a first connecting surface inclined from the magnetic chip to the chip to be magnetically shielded and a second connecting surface inclined from the upper surface of the magnetic shielding resin layer to the upper surface of the packaging substrate so as to further form a wiring pattern, and the wiring pattern realizes interconnection between the chips and the packaging substrate along the first connecting surface and the second connecting surface.
Drawings
FIG. 1 is a cross-sectional view of a leadless magnetic package structure of the present invention;
FIG. 2 is a cross-sectional view taken along line C of FIG. 1;
FIG. 3 is a top view of a leadless magnetic package structure of the present invention;
FIG. 4 is a cross-sectional view of a substrate with a magnetic chip and a chip to be magnetically shielded joined;
FIG. 5 is a cross-sectional view of the underfill of FIG. 4;
FIG. 6 is a sectional view of a magnetic shielding resin layer formed between a chip to be shielded and a magnetic chip;
FIG. 7 is a cross-sectional view of a wiring pattern formed on the upper surface;
fig. 8 is a cross-sectional view after the sealing layer is finally formed.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
A leadless magnetic package according to the disclosed embodiment of the invention will be described in detail with reference to the drawings.
Referring to fig. 1 to fig. 3, the leadless magnetic package structure of the present application includes two chips, namely a chip 101 to be magnetically shielded and a magnetic chip 102, disposed adjacently on a package substrate 100. The magnetic chip 102 may be a Magnetoresistive Random Access Memory (MRAM), and the chip 101 to be magnetically shielded may be a hall chip, a magnetic sensor, or the like. The magnetic chip 102 is generally a stacked structure of a plurality of memory cells, which has a higher top surface, and the chip 101 to be magnetically shielded has a lower top surface, i.e. there is a height difference between the chip 101 to be magnetically shielded and the magnetic chip 102.
Also, there is a gap between the chip 101 to be magnetically shielded and the magnetic chip 102. The width of the gap becomes larger as the difference in height between the magnetic chip 101 to be magnetically shielded and the magnetic chip 102 becomes larger, so that the first connection face 111 formed by the gap has a gentle slope when the magnetic chip 101 to be magnetically shielded is formed later.
The chip 101 to be magnetically shielded and the magnetic chip 102 are bonded to the package substrate 100 by solder balls, and the package substrate 100 may have a magnetic shielding layer disposed directly below the chip 101 to be magnetically shielded and the magnetic chip 102. With this arrangement, it is possible to prevent the magnetic field from being introduced to the chip 101 and the magnetic chip 102 to be magnetically shielded through the end of the package substrate 100, which affects the normal operation of the chips.
An underfill 109 is filled between the chip 101 to be magnetically shielded and the package substrate 100 and between the magnetic chip 102 and the package substrate 100, and the underfill 109 may be a conventional cured resin material that maintains the insulation of the solder balls and the support of the chip bottom.
The gap between the magnetic shield chip 101 and the magnetic chip 102 to be magnetically shielded is filled with the magnetic shield resin layer 110, and the magnetic shield resin layer 110 is formed of a resin material in which magnetic particles are uniformly dispersed, and the filling method thereof can be formed by a dot coating method. A first connection face 111 inclined from the magnetic chip 102 to the chip 101 to be magnetically shielded and a second connection face 119 inclined from the upper face of the magnetic shield resin layer 110 to the upper face of the package substrate 100 are formed on the magnetic shield resin layer 110. Specifically, the magnetic particle-dispersed resin material is baked to round the first connection face 111 and the second connection face 119, and further, to ensure the reliability of the subsequent wiring pattern 112.
A wiring pattern 112 is deposited and patterned on the first connection face 111 of the to-be-magnetically shielded chip 101, the magnetic chip 102 and the magnetic shield resin layer 110. The wiring pattern 112 may be any conductive material such as copper, aluminum, silver, gold, or the like. Referring to fig. 3, the wiring pattern 112 includes a connection portion 113 in the middle, and three branch portions connected to the connection portion 113, i.e., a first extension portion 114, a second extension portion 115, and a third extension portion 116, wherein the first extension portion 114, the second extension portion 115, and the third extension portion 116 are connected to three side positions of the connection portion 113, respectively.
In particular, the connection portion 113 has a wider width than the first, second, and third extension portions 114, 115, and 116, and the first, second, and third extension portions 114, 115, and 116 may have the same width. The connecting portion 113 has an interface crossing between the magnetic shield resin layer 110 and the chip 101 to be magnetically shielded and the magnetic chip 102. Due to the difference in thermal expansion coefficient between the magnetic shield resin layer 110 and the chip 101 to be magnetically shielded and the magnetic chip 102, in operation, the wiring pattern 112 has a large stress difference at the interface between the magnetic shield resin layer 110 and the chip 101 to be magnetically shielded and the magnetic chip 102, which may cause the wiring pattern 112 to break at the interface, resulting in disconnection of the wiring pattern. The wide connection portion 113 can effectively prevent disconnection of the wiring pattern 112, ensuring reliability of electrical connection.
One ends of the first extension portion 114 and the second extension portion 115 are respectively connected to both sides of the connecting portion 113, and the other ends are respectively connected to the upper electrode 104 of the chip 101 to be magnetically shielded and the upper electrode 106 of the magnetic chip 102. The third extension portion 116 is disposed along the magnetic shield resin layer 110 at the gap between the magnetic chip 101 and the magnetic chip 102 to be magnetically shielded, which extends to the upper surface of the package substrate 100 along the second connection face 119, which is connected to the pad 118 on the package substrate 100.
An encapsulating layer 117 is formed on the package substrate 100, and the encapsulating layer 117 encapsulates the chip 101 to be magnetically shielded and the magnetic chip 102, and the material thereof is selected from a thermosetting or photo-curing resin material.
The magnetic shielding resin layer is filled between the chip to be magnetically shielded and the magnetic chip so as to realize magnetic signal interference between the chip to be magnetically shielded and the magnetic chip, and the magnetic shielding resin layer is provided with a first connecting surface inclined from the magnetic chip to the chip to be magnetically shielded and a second connecting surface inclined from the upper surface of the magnetic shielding resin layer to the upper surface of the packaging substrate so as to further form a wiring pattern, and the wiring pattern realizes interconnection between the chips and the packaging substrate along the first connecting surface and the second connecting surface.
The manufacturing method of the leadless magnetic packaging structure is also simple and feasible, and specifically comprises the following steps:
(1) bonding a chip to be magnetically shielded and a magnetic chip adjacently on a packaging substrate, wherein the height of the magnetic chip is greater than that of the chip to be magnetically shielded;
(2) filling an underfill between the chip to be magnetically shielded and the packaging substrate and between the magnetic chip and the packaging substrate;
(3) filling a magnetic shielding resin layer between the magnetic chip and the magnetic chip, the magnetic shielding resin layer having a first connection face inclined from the magnetic chip to the magnetic chip and a second connection face inclined from an upper surface of the magnetic shielding resin layer to an upper surface of the package substrate;
(4) forming a wiring pattern electrically connecting an upper electrode of the chip to be magnetically shielded and an upper electrode of the magnetic chip on an upper surface of the magnetic shielding resin layer;
(5) and forming a sealing layer to coat the chip to be magnetically shielded, the magnetic chip and the wiring pattern.
Referring first to fig. 4, a package substrate 100 is provided, and the package substrate 100 may be a PCB board, a flexible circuit board, an LTCC ceramic board, or the like. A chip 101 to be magnetically shielded and a magnetic chip 102 are bonded to the package substrate 100 through solder balls 107 and 108, respectively. The chip 101 to be magnetically shielded includes an electrode 103 on the bottom surface and an electrode 104 on the top surface, and the magnetic chip 102 includes an electrode 105 on the bottom surface and an electrode 106 on the top surface, wherein the electrode 103 is bonded to a solder ball 107, and the electrode 105 is bonded to a solder ball 108. The chip 101 to be magnetically shielded and the magnetic chip 102 are disposed adjacently, and have a gap whose width is positively correlated with the height difference between the chip 101 to be magnetically shielded and the magnetic chip 102.
Then, an underfill 109 is formed between the chip 101 and the magnetic chip 102 to be magnetically shielded and the package substrate 100, see fig. 5.
Referring next to fig. 6, a resin material in which magnetic particles are dispersed is filled in a gap between a magnetic shield chip 101 and a magnetic chip 102 and cured to form a magnetic shield resin layer 110, and after baking, a first connection face 111 inclined from the magnetic chip 102 to the magnetic shield chip 101 and a second connection face 119 inclined from an upper face of the magnetic shield resin layer 110 to an upper face of the package substrate 100 are formed on the magnetic shield resin layer 110.
Referring to fig. 7, a metal layer is deposited and patterned to form a wiring pattern 112 by sputtering, chemical vapor deposition, physical vapor deposition. Referring to fig. 3, the wiring pattern 112 includes a connection portion 113 in the middle, and three branch portions connected to the connection portion 113, i.e., a first extension portion 114, a second extension portion 115, and a third extension portion 116, wherein the first extension portion 114, the second extension portion 115, and the third extension portion 116 are connected to three side positions of the connection portion 113, respectively.
In particular, the connection portion 113 has a wider width than the first, second, and third extension portions 114, 115, and 116, and the first, second, and third extension portions 114, 115, and 116 may have the same width. The connecting portion 113 has an interface crossing between the magnetic shield resin layer 110 and the chip 101 to be magnetically shielded and the magnetic chip 102. Due to the difference in thermal expansion coefficient between the magnetic shield resin layer 110 and the chip 101 to be magnetically shielded and the magnetic chip 102, in operation, the wiring pattern 112 has a large stress difference at the interface between the magnetic shield resin layer 110 and the chip 101 to be magnetically shielded and the magnetic chip 102, which may cause the wiring pattern 112 to break at the interface, resulting in disconnection of the wiring pattern. The wide connection portion 113 can effectively prevent disconnection of the wiring pattern 112, ensuring reliability of electrical connection.
One ends of the first extension portion 114 and the second extension portion 115 are respectively connected to both sides of the connecting portion 113, and the other ends are respectively connected to the upper electrode 104 of the chip 101 to be magnetically shielded and the upper electrode 106 of the magnetic chip 102. The third extension portion 116 is disposed along the magnetic shield resin layer 110 at the gap between the magnetic chip 101 and the magnetic chip 102 to be magnetically shielded, which extends to the upper surface of the package substrate 100 along the second connection face 119, which is connected to the pad 118 on the package substrate 100.
Referring finally to fig. 8, a sealing layer 117 is formed by injection molding, etc., and the sealing layer 117 may be a thermosetting or photocurable resin to prevent moisture from damaging the internal chips and electrical interconnect structures.
The expressions "exemplary embodiment," "example," and the like, as used herein, do not refer to the same embodiment, but are provided to emphasize different particular features. However, the above examples and exemplary embodiments do not preclude their implementation in combination with features of other examples. For example, even in a case where a description of a specific example is not provided in another example, unless otherwise stated or contrary to the description in the other example, the description may be understood as an explanation relating to the other example.
The terminology used in the present invention is for the purpose of illustrating examples only and is not intended to be limiting of the invention. Unless the context clearly dictates otherwise, singular expressions include plural expressions.
While example embodiments have been shown and described, it will be apparent to those skilled in the art that modifications and changes may be made without departing from the scope of the invention as defined by the claims.
Claims (10)
1. A method for manufacturing a leadless magnetic packaging structure is characterized by comprising the following steps:
(1) bonding a chip to be magnetically shielded and a magnetic chip adjacently on a packaging substrate, wherein the height of the magnetic chip is greater than that of the chip to be magnetically shielded;
(2) filling an underfill between the chip to be magnetically shielded and the packaging substrate and between the magnetic chip and the packaging substrate;
(3) filling a magnetic shielding resin layer between the magnetic chip and the magnetic chip, the magnetic shielding resin layer having a first connection face inclined from the magnetic chip to the magnetic chip and a second connection face inclined from an upper surface of the magnetic shielding resin layer to an upper surface of the package substrate;
(4) forming a wiring pattern electrically connecting an upper electrode of the chip to be magnetically shielded and an upper electrode of the magnetic chip on an upper surface of the magnetic shielding resin layer;
(5) and forming a sealing layer to coat the chip to be magnetically shielded, the magnetic chip and the wiring pattern.
2. The method of manufacturing a leadless magnetic package structure of claim 1, wherein the wiring pattern comprises a connection portion and a first extension portion and a second extension portion narrower than the connection portion, wherein the connection portion crosses an interface between the magnetic shielding resin layer and the chip to be magnetically shielded and the magnetic chip, and one end of the first extension portion and the second extension portion are respectively connected to both sides of the connection portion, and the other end is respectively connected to an upper electrode of the chip to be magnetically shielded and an upper electrode of the magnetic chip.
3. The method of manufacturing a leadless magnetic package structure of claim 2, wherein the wiring pattern further comprises a third extension portion narrower than the connection portion, the third extension portion being connected to the other side of the wiring pattern and extending to an upper surface of the package substrate along the second connection face to electrically connect the package substrate.
4. The method of manufacturing a leadless magnetic package structure of claim 3, wherein forming the wiring pattern specifically comprises: a layer of metal is deposited on the upper surfaces of the magnetic shielding resin layer, the magnetic shielding chip and the magnetic chip, and then etched to form the wiring pattern.
5. The method of claim 4, wherein filling the magnetic shielding resin layer comprises filling a resin material with magnetic particles dispersed between the chip to be magnetically shielded and the magnetic chip, and then thermally curing and baking to form the first and second connection faces with rounded surfaces.
6. A leadless magnetic package formed by the method of manufacture of claim 1, wherein the leadless magnetic package comprises:
a package substrate;
a magnetic chip and a chip to be magnetically shielded, which are adjacently bonded on the package substrate, wherein the height of the magnetic chip is greater than that of the chip to be magnetically shielded;
the underfill is filled between the chip to be magnetically shielded and the packaging substrate and between the magnetic chip and the packaging substrate;
a magnetic shield resin layer filled between the magnetic chip and the magnetic chip, the magnetic shield resin layer having a first connection face inclined from the magnetic chip to the magnetic chip and a second connection face inclined from an upper surface of the magnetic shield resin layer to an upper surface of the package substrate;
a wiring pattern formed on an upper surface of the magnetic shielding resin layer and electrically connecting an upper electrode of the chip to be magnetically shielded and an upper electrode of the magnetic chip; and
and the sealing layer coats the chip to be magnetically shielded, the magnetic chip and the wiring pattern.
7. The leadless magnetic packaging structure of claim 6, wherein the wiring pattern comprises a connection portion and a first extension portion and a second extension portion narrower than the connection portion, wherein the connection portion crosses an interface between the magnetic shielding resin layer and the chip to be magnetically shielded and the magnetic chip, and one end of the first extension portion and the second extension portion are respectively connected to both sides of the connection portion, and the other end is respectively connected to the upper electrode of the chip to be magnetically shielded and the upper electrode of the magnetic chip.
8. The leadless magnetic package structure of claim 7, wherein the wiring pattern further comprises a third extension narrower than the connection portion, the third extension being connected to the other side of the wiring pattern and extending to the upper surface of the package substrate along the second connection face to electrically connect the package substrate.
9. The leadless magnetic package structure of claim 8, wherein the third extension extends along a gap between the chip to be magnetically shielded and the magnetic chip.
10. The leadless magnetic packaging structure of claim 6, wherein the magnetic shielding resin layer is formed of a resin material dispersed with magnetic particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210164355.9A CN114242654B (en) | 2022-02-23 | 2022-02-23 | Leadless magnetic packaging structure and manufacturing method thereof |
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| CN202210164355.9A CN114242654B (en) | 2022-02-23 | 2022-02-23 | Leadless magnetic packaging structure and manufacturing method thereof |
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| CN114242654B (en) | 2022-05-13 |
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