CN114236708A - TOSA/ROSA shell packaging structure and packaging method - Google Patents
TOSA/ROSA shell packaging structure and packaging method Download PDFInfo
- Publication number
- CN114236708A CN114236708A CN202111499927.0A CN202111499927A CN114236708A CN 114236708 A CN114236708 A CN 114236708A CN 202111499927 A CN202111499927 A CN 202111499927A CN 114236708 A CN114236708 A CN 114236708A
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- Prior art keywords
- wall
- tosa
- ceramic insulator
- rosa
- optical window
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- 235000011449 Rosa Nutrition 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 239000000919 ceramic Substances 0.000 claims abstract description 54
- 239000012212 insulator Substances 0.000 claims abstract description 48
- 230000003287 optical effect Effects 0.000 claims abstract description 47
- 229920006351 engineering plastic Polymers 0.000 claims abstract description 10
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims abstract description 3
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 28
- 230000008569 process Effects 0.000 abstract description 19
- 238000003466 welding Methods 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4263—Details of housings characterised by the shape of the housing of the transisitor outline [TO] can type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a TOSA/ROSA shell packaging structure, which comprises a ceramic insulator, a wall body, an optical window and a heat sink, wherein the wall body is integrally manufactured and molded by engineering plastics, and the ceramic insulator, the wall body, the optical window and the heat sink are assembled and hermetically connected so as to form a sealed space for packaging a TOSA/ROSA and a circuit inside the wall body. According to the TOSA/ROSA shell packaging structure and the packaging method, the traditional metal wall and the metal cover are replaced by the wall integrally made of engineering plastics, so that the production cost is greatly reduced, the traditional high-temperature welding process is replaced by the relatively low-temperature gluing process, the problem that the product is seriously deformed after the metal wall and the ceramic insulator are combined due to high temperature is solved, and meanwhile, the problem that the size deviation is large due to the traditional welding process is solved.
Description
Technical Field
The invention relates to the technical field of TOSA/ROSA shells, in particular to a TOSA/ROSA shell packaging structure and a packaging method.
Background
The traditional optical communication TOSA/ROSA shell mainly adopts a ceramic insulator-metal wall photoelectric device shell with internal wiring for packaging, an electric signal transmission channel and an optical coupling interface are provided for the device, mechanical support and airtight protection are provided, the problem of interconnection between a chip and an external circuit is solved, and the functions of interconversion between an optical signal and an electric signal and signal processing are realized. The shell mainly comprises a ceramic insulator, a metal chassis, a metal wall, a sapphire optical window, a lead and the like, wherein the ceramic insulator is welded on a groove in the side surface of the metal wall, and the internal wiring of the ceramic insulator realizes the internal and external transmission of signals. At present, the traditional metal wall-ceramic insulator structure has the following defects: the ceramic wiring part is concentrated on the ceramic insulator, a frame structure is formed by welding with a metal wall, and finally an additional metal cover is needed for sealing, the process is complex, and because the common metal thermal expansion coefficient is larger than that of the ceramic, stress, even deformation and product reliability are easily generated in the high-temperature brazing (generally 800 ℃) process, so that expensive kovar metal is generally adopted as the wall material when the shell is assembled in order to be matched with the ceramic thermal expansion coefficient, and after welding, the metal wall needs to be plated for anti-oxidation treatment, so that the cost of the traditional optical communication TOSA/ROSA shell is higher. With 5G commercial use, cost advantages of optical devices and optical modules are important when the performance of the optical devices and optical modules meets requirements, and the package housing, which is used as a non-negligible part of the optical module, also puts higher and higher requirements on cost control.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the defects in the prior art, and provide a TOSA/ROSA shell packaging structure and a packaging method, wherein the traditional metal wall and a metal cover are replaced by a wall integrally made of engineering plastics, so that the production cost is greatly reduced, the traditional high-temperature welding process is replaced by a relatively low-temperature gluing process, the problem of serious product deformation caused by high temperature after the metal wall and a ceramic insulator are combined is avoided, and the problem of large size deviation caused by the traditional welding process is solved.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides a TOSA/ROSA shell packaging structure, includes ceramic insulator, wall body, optical window and heat sink, the wall body is by the integrative preparation shaping of engineering plastics, ceramic insulator the wall body the optical window and equipment and sealing connection between the heat sink, so that the inside confined space that constitutes and be used for encapsulating TOSA/ROSA and circuit of wall body.
As a further improvement of the above technical solution:
the ceramic insulator, the wall body, the optical window and the heat sink are connected through adhesive bonding.
The wall body comprises an upper cover, a first vertical wall and a second vertical wall, wherein the second vertical wall is provided with a connecting hole for installing the optical window.
The optical window includes the base station, be provided with a light trap that supplies the light path to pass through on the base station, center on the base station the light trap is provided with the annular convex part that is used for installing the sapphire window piece, the external diameter of annular convex part with the internal diameter adaptation of connecting hole.
The upper cover and the first vertical wall are matched to form a connecting position for mounting the ceramic insulator.
And a chamfer part is arranged at the joint of the first vertical wall and the second vertical wall.
A packaging method based on the TOSA/ROSA shell packaging structure comprises the following steps:
(S1) coating an adhesive on the upper surface of the heat sink and/or the bottom surface of the ceramic insulator, attaching the upper surface of the heat sink to the bottom surface of the ceramic insulator, and heating and curing;
(S2) coating adhesives on the lower surface of the upper cover, the lower surface of the vertical wall and the side surface of the vertical wall of the wall body, attaching the lower surface of the upper cover of the wall body to the top surface of the ceramic insulator, attaching the lower surface of the vertical wall of the wall body to the upper surface of the heat sink, attaching the side surface of the vertical wall of the wall body to the side surface of the ceramic insulator, and heating and curing;
(S3) coating adhesive on the inner vertical surface of the light window, bonding the inner vertical surface of the light window and the outer vertical surface of the wall body, and heating and curing.
Compared with the prior art, the invention has the advantages that:
1. the invention discloses a TOSA/ROSA shell packaging structure, which is formed by assembling a ceramic insulator, a wall body, an optical window and a heat sink, wherein the traditional metal wall body and a metal cover are separated, and the process for assembling the TOSA/ROSA shell needs to be carried out in sequence.
2. The packaging method adopts an adhesive process of assembling and adhering the ceramic insulator, the wall body, the optical window and the heat sink through an adhesive, the traditional metal wall body generally needs high temperature of 800 ℃ to be welded with the ceramic insulator to form a frame structure, expensive Kovar metal is generally selected for matching with the thermal expansion coefficient of the ceramic when the photoelectric shell is assembled, the wall body integrally manufactured and molded by engineering plastics is adopted, the adhesive process is selected, the temperature for assembling the TOSA/ROSA shell is only up to 180 ℃, the problem of serious deformation of a product after the metal wall body is combined with the ceramic insulator due to high temperature is avoided, the problem of large size deviation caused by the traditional welding process is solved, and the assembly precision is higher.
Drawings
FIG. 1 is a schematic structural diagram of a TOSA/ROSA housing package structure.
Fig. 2 is a schematic view of a bottom view angle structure of a wall.
Fig. 3 is a schematic structural view of the optical window.
Figure 4 is an exploded view of a TOSA/ROSA housing packaging structure.
Fig. 5 is a schematic view of fig. 4 at a first viewing angle.
Fig. 6 is a schematic view of fig. 4 at a second viewing angle.
Illustration of the drawings:
1. a ceramic insulator; 2. a wall body; 201. an upper cover; 202. a first vertical wall; 203. a second vertical wall; 204. connecting holes; 205. a connection bit; 206. chamfering the corner; 3. an optical window; 301. a base station; 302. a light-transmitting hole; 303. an annular protrusion; 4. flange heat sink; 1a, a bottom surface; 1b, a top surface; 1c, a side surface; 2a, the lower surface of the upper cover; 2b, a lower surface of the vertical wall; 2c, standing wall side surfaces; 2d, an outer vertical surface; 3a, an inner vertical surface; 4a, upper surface.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples.
As shown in fig. 1 and 4, the package structure of the TOSA/ROSA housing of the present embodiment includes a ceramic insulator 1, a wall 2, an optical window 3 and a heat sink 4, wherein the wall 2 is integrally made of engineering plastic, and the ceramic insulator 1, the wall 2, the optical window 3 and the heat sink 4 are assembled and hermetically connected to each other, so that a sealed space for packaging the TOSA/ROSA and the circuit is formed inside the wall 2. In this embodiment, the ceramic insulator 1 is connected to the heat sink 4, the wall body 2 is connected to the heat sink 4 and connected to the ceramic insulator 1, the optical window 3 is connected to the wall body 2, the TOSA/ROSA housing packaging structure is formed by assembling the ceramic insulator 1, the wall body 2, the optical window 3 and the heat sink 4, the traditional metal wall body and the metal cover are separated, and the process of assembling the TOSA/ROSA housing needs to be carried out in sequence.
Furthermore, the ceramic insulator 1, the wall 2, the optical window 3 and the heat sink 4 are connected by adhesive.
Further, as shown in fig. 2, the wall 2 includes an upper cover 201, a first vertical wall 202 and a second vertical wall 203, wherein the second vertical wall 203 is provided with a connecting hole 204 for installing the light window 3. In this embodiment, the wall 2 includes an upper cover 201, two sets of first vertical walls 202 and one set of second vertical walls 203, and forms a semi-enclosed structure with an opening on one side, so that the structure after the traditional metal wall and the metal cover are connected is replaced, corresponding assembly process steps are omitted, and the wall is integrally made of engineering plastics, so that the cost is reduced, and the high dimensional accuracy is ensured.
Further, as shown in fig. 3, the optical window 3 includes a base 301, a light-transmitting hole 302 for passing a light path is formed on the base 301, an annular protrusion 303 for mounting a sapphire window is formed on the base 301 around the light-transmitting hole 302, and an outer diameter of the annular protrusion 303 is adapted to an inner diameter of the connection hole 204. In this embodiment, the annular protrusion 303 on the optical window 3 can be inserted into the connection hole 204 on the wall 2, and the joint between the base platform 301 and the second vertical wall 203 is glued by using a bonding agent, so that the optical window 3 is glued to the wall 2, and the optical window has the advantages of simple structure, convenience and rapidness in assembly, and high assembly precision.
Further, the upper cover 201 and the first vertical wall 202 are matched to form a connecting position 205 for mounting the ceramic insulator 1. In this embodiment, the length of the upper cover 201 is greater than the lengths of the two sets of first vertical walls 202, an opening, i.e., a connection position 205, is formed on one side of the wall 2, the side of the first vertical wall 202 is attached to the side of the ceramic insulator 1 during the assembly process, the outwardly extending portion of the upper cover 201 covers and is attached to the top of the ceramic insulator 1, and the ceramic insulator 1 is bonded to the wall 2 to form a frame structure.
Further, a chamfered portion 206 is provided at the junction of the first standing wall 202 and the second standing wall 203.
In this embodiment, the wall 2 is made of LCP + GF40 material, and LCP with the chinese name of liquid crystal polymer is a novel polymer material, and has the advantages of good mechanical properties, good dimensional stability, good heat resistance, low thermal expansion coefficient, and the like. In other embodiments, suitable special engineering plastics can be selected according to different application occasions, and the method is not limited in the embodiment.
As shown in fig. 4 to 6, the present invention also provides a method for packaging the package structure of the TOSA/ROSA housing, including the following steps:
(S1) applying an adhesive to the upper surface 4a of the heat sink 4 and/or the bottom surface 1a of the ceramic insulator 1, bonding the upper surface 4a of the heat sink 4 to the bottom surface 1a of the ceramic insulator 1, and heating and curing;
(S2) applying an adhesive to the lower surface 2a of the upper cover, the lower surface 2b of the standing wall, and the side surfaces 2c of the standing wall of the wall 2, and bonding the lower surface 2a of the upper cover of the wall 2 to the top surface 1b of the ceramic insulator 1, the lower surface 2b of the standing wall of the wall 2 to the upper surface 4a of the heat sink 4, and the side surfaces 2c of the standing wall of the wall 2 to the side surfaces 1c of the ceramic insulator 1, and heating and curing the adhesive;
(S3) the inner surface 3a of the optical window 3 is coated with an adhesive, and the inner surface 3a of the optical window 3 is bonded to the outer surface 2d of the wall 2 and cured by heating.
In the actual process of packaging the TOSA/ROSA, after the step (S1) is completed, the devices inside the TOSA/ROSA are mounted on the heat sink 4 in the step (S1), and then the following step of bonding the wall 2 is performed; in step (S3), it is necessary to bond the optical window 3 and the wall 2 together by using a special optical coupling device, mainly for the functional requirements of the TOSA/ROSA device itself, and to ensure that the optical path is aligned during the bonding process.
In this embodiment, the adhesive is epoxy glue manufactured by Guangdong Huazhi core electronic technology corporation, model number HZ 6813. Epoxy resins are generally internally added with various curing agents, and are divided into three stages, i.e., a, B, and C stages, according to the degree of curing. The glue in this example can achieve these 3 stages: a, liquid state and non-solidification are carried out at normal temperature; b, heating to 170 ℃ for 10 minutes, wherein the mixture is solid but not completely cured, and the state can be transported and stored for a long distance without damaging the surface appearance after dispensing; c, heating at 180 degrees for 30 minutes or more, at which time it is solid and fully cured. In this example, in the step (S1), the heat sink 4 and the ceramic insulator 1 are directly bonded together after dispensing, and heated to a C-stage; after the glue is dispensed on the wall body 2 and the optical window 3 in the steps (S2) and (S3), the wall body 2 and the optical window 3 need to be heated to a B-stage, then are bonded, and then are thermally cured to a C-stage.
In the embodiment, the packaging method adopts the gluing process of assembling and gluing the ceramic insulator 1, the wall body 2, the optical window 3 and the heat sink 4 by the adhesive, the traditional metal wall body generally needs high temperature of 800 ℃ to be welded with the ceramic insulator 1 to form a frame structure, expensive Kovar metal is generally selected for matching with the thermal expansion coefficient of ceramic when the photoelectric shell is assembled, the wall body 2 integrally manufactured and molded by engineering plastics is adopted in the invention, the gluing process is selected, the temperature for assembling the TOSA/ROSA shell is only up to 180 ℃ at most, the problem of serious product deformation caused by the combination of the metal wall body and the ceramic insulator due to high temperature is avoided, the temperature requirement for the packaging process required by the invention is lower, the material cost is low, the cost advantage is obvious under the condition that the performances of optical devices and optical modules meet the requirements, and the problem of larger size deviation caused by the traditional welding process is solved at the same time, the assembly precision is higher.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-described embodiments. Modifications and variations that may occur to those skilled in the art without departing from the spirit and scope of the invention are to be considered as within the scope of the invention.
Claims (7)
1. The utility model provides a TOSA/ROSA shell packaging structure, includes ceramic insulator (1), wall body (2), optical window (3) and heat sink (4), its characterized in that: wall body (2) are by engineering plastics integrated manufacturing shaping, ceramic insulator (1) wall body (2) optical window (3) and assemble and sealing connection between heat sink (4) to make inside constitution of wall body (2) is used for encapsulating TOSA/ROSA and the confined space of circuit.
2. The TOSA/ROSA housing encapsulation structure according to claim 1, characterized in that the ceramic insulator (1), the wall (2), the optical window (3) and the heat sink (4) are connected by adhesive bonding.
3. The TOSA/ROSA housing packaging structure of claim 1, characterized in that the wall (2) comprises an upper cover (201), a first vertical wall (202) and a second vertical wall (203), wherein the second vertical wall (203) is provided with a connecting hole (204) for mounting the optical window (3).
4. The TOSA/ROSA housing packaging structure according to claim 3, wherein the optical window (3) comprises a base (301), a light transmission hole (302) for passing the light path is arranged on the base (301), an annular convex part (303) for mounting a sapphire window sheet is arranged on the base (301) around the light transmission hole (302), and the outer diameter of the annular convex part (303) is matched with the inner diameter of the connecting hole (204).
5. The TOSA/ROSA housing packaging structure according to claim 3, wherein the upper cover (201) and the first standing wall (202) are cooperatively formed with a connection site (205) for mounting the ceramic insulator (1).
6. The TOSA/ROSA housing packaging structure according to claim 3, wherein the junction of the first standing wall (202) and the second standing wall (203) is provided with a chamfered portion (206).
7. A packaging method based on the TOSA/ROSA shell packaging structure of any one of claims 1 to 6, characterized by comprising the following steps:
(S1) applying an adhesive to the top surface (4a) of the heat sink (4) and/or the bottom surface (1a) of the ceramic insulator (1), and bonding the top surface (4a) of the heat sink (4) and the bottom surface (1a) of the ceramic insulator (1) together, followed by heating and curing;
(S2) applying an adhesive to the lower top cover surface (2a), the lower standing wall surface (2b), and the side standing wall surface (2c) of the wall (2), bonding the lower top cover surface (2a) of the wall (2) to the top surface (1b) of the ceramic insulator (1), bonding the lower standing wall surface (2b) of the wall (2) to the upper surface (4a) of the heat sink (4), and bonding the side standing wall surface (2c) of the wall (2) to the side surface (1c) of the ceramic insulator (1), and heating and curing;
(S3) coating an adhesive on the inner vertical surface (3a) of the optical window (3), bonding the inner vertical surface (3a) of the optical window (3) and the outer vertical surface (2d) of the wall body (2), and heating and curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111499927.0A CN114236708A (en) | 2021-12-09 | 2021-12-09 | TOSA/ROSA shell packaging structure and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111499927.0A CN114236708A (en) | 2021-12-09 | 2021-12-09 | TOSA/ROSA shell packaging structure and packaging method |
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| Publication Number | Publication Date |
|---|---|
| CN114236708A true CN114236708A (en) | 2022-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111499927.0A Pending CN114236708A (en) | 2021-12-09 | 2021-12-09 | TOSA/ROSA shell packaging structure and packaging method |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11218650A (en) * | 1998-02-04 | 1999-08-10 | Hitachi Ltd | Optical module |
| KR20090053980A (en) * | 2007-11-26 | 2009-05-29 | 김정수 | Manufacturing method of housing for laser diode package |
| CN208255478U (en) * | 2018-05-04 | 2018-12-18 | 河北中瓷电子科技有限公司 | The U-shaped wall multi-layer ceramics insulator encapsulating shell of fiber optic communication |
| CN214477381U (en) * | 2020-12-15 | 2021-10-22 | 河北中瓷电子科技股份有限公司 | Plastic packaging shell |
-
2021
- 2021-12-09 CN CN202111499927.0A patent/CN114236708A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11218650A (en) * | 1998-02-04 | 1999-08-10 | Hitachi Ltd | Optical module |
| KR20090053980A (en) * | 2007-11-26 | 2009-05-29 | 김정수 | Manufacturing method of housing for laser diode package |
| CN208255478U (en) * | 2018-05-04 | 2018-12-18 | 河北中瓷电子科技有限公司 | The U-shaped wall multi-layer ceramics insulator encapsulating shell of fiber optic communication |
| CN214477381U (en) * | 2020-12-15 | 2021-10-22 | 河北中瓷电子科技股份有限公司 | Plastic packaging shell |
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