CN114234062B8 - 一种热电分离填平电镀的双面金属基板 - Google Patents

一种热电分离填平电镀的双面金属基板 Download PDF

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Publication number
CN114234062B8
CN114234062B8 CN202111269406.6A CN202111269406A CN114234062B8 CN 114234062 B8 CN114234062 B8 CN 114234062B8 CN 202111269406 A CN202111269406 A CN 202111269406A CN 114234062 B8 CN114234062 B8 CN 114234062B8
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CN
China
Prior art keywords
metal substrate
heat dissipation
led lamp
insulating layers
thermoelectric separation
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CN202111269406.6A
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CN114234062B (zh
CN114234062A (zh
Inventor
吴现柱
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Zhongshan Lyz Lighting Technology Co ltd
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Zhongshan Lyz Lighting Technology Co ltd
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Priority to CN202111269406.6A priority Critical patent/CN114234062B8/zh
Publication of CN114234062A publication Critical patent/CN114234062A/zh
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Publication of CN114234062B8 publication Critical patent/CN114234062B8/zh
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • F21V19/0025Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本发明属于金属基板技术领域,具体是一种热电分离填平电镀的金属基板,包括金属基板,所述金属基板的两侧均设有绝缘层,所述金属基板和绝缘层内部均匀阵列设有多组通孔,所述绝缘层内设有滑槽,所述滑槽与通孔相连通,所述滑槽内壁设有连接弹簧,所述连接弹簧的另一端设有滑板,所述滑板的内部开设有散热槽,所述散热槽的底部设有散热软管,所述散热软管的另一端与远离滑槽的绝缘层内壁固定连接;靠近所述滑槽一侧的绝缘层内部设有散热槽,该金属基板不仅可以适应不同高度的LED灯,使得LED灯不仅可实现热电分离,保证LED灯的工作环境均满足要求,同时还可以根据不同型号的LED灯改变金属基板的散热效率,有效地提高了适应性和散热效率。
CN202111269406.6A 2021-10-29 2021-10-29 一种热电分离填平电镀的双面金属基板 Active CN114234062B8 (zh)

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CN202111269406.6A CN114234062B8 (zh) 2021-10-29 2021-10-29 一种热电分离填平电镀的双面金属基板

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CN202111269406.6A CN114234062B8 (zh) 2021-10-29 2021-10-29 一种热电分离填平电镀的双面金属基板

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CN114234062A CN114234062A (zh) 2022-03-25
CN114234062B CN114234062B (zh) 2023-07-25
CN114234062B8 true CN114234062B8 (zh) 2023-08-11

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238698A (ja) * 2011-05-11 2012-12-06 Shindo Denshi Kogyo Kk 電子モジュール、配線基体および照明装置
CN206558549U (zh) * 2017-03-03 2017-10-13 广东金光原照明科技有限公司 一种金属基板led芯片封装结构
CN207635160U (zh) * 2018-05-07 2018-07-20 南京尚孚电子电路有限公司 热电分离led路灯模组
CN208566229U (zh) * 2018-08-28 2019-03-01 深圳市唯泰光电科技有限公司 一种led光源模块
CN111237649A (zh) * 2020-04-14 2020-06-05 深圳市佳莱特光电科技有限公司 一种超高导热led线路基板及制作工艺
CN111853614A (zh) * 2020-08-08 2020-10-30 张辉辉 一种自清洁高散热型led路灯
CN111954368A (zh) * 2020-08-03 2020-11-17 深圳恒宝士线路板有限公司 一种热电分离填平电镀的双面金属基板及其制作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238698A (ja) * 2011-05-11 2012-12-06 Shindo Denshi Kogyo Kk 電子モジュール、配線基体および照明装置
CN206558549U (zh) * 2017-03-03 2017-10-13 广东金光原照明科技有限公司 一种金属基板led芯片封装结构
CN207635160U (zh) * 2018-05-07 2018-07-20 南京尚孚电子电路有限公司 热电分离led路灯模组
CN208566229U (zh) * 2018-08-28 2019-03-01 深圳市唯泰光电科技有限公司 一种led光源模块
CN111237649A (zh) * 2020-04-14 2020-06-05 深圳市佳莱特光电科技有限公司 一种超高导热led线路基板及制作工艺
CN111954368A (zh) * 2020-08-03 2020-11-17 深圳恒宝士线路板有限公司 一种热电分离填平电镀的双面金属基板及其制作方法
CN111853614A (zh) * 2020-08-08 2020-10-30 张辉辉 一种自清洁高散热型led路灯

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CN114234062A (zh) 2022-03-25

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PB01 Publication
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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
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TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20230725

Address after: 528400 4, 5 block 1A, 391 North East Road, Cao 2 village, Guzhen Town, Zhongshan, Guangdong.

Applicant after: ZHONGSHAN LYZ LIGHTING TECHNOLOGY CO.,LTD.

Address before: 518000 202-41, building 1, guanlida building, No. 269, Qianjin 1st Road, Wenhui community, Xin'an street, Bao'an District, Shenzhen, Guangdong Province

Applicant before: Shenzhen zhichuangxing Industrial Co.,Ltd.

CI03 Correction of invention patent
CI03 Correction of invention patent

Correction item: Patentee|Address

Correct: ZHONGSHAN LYZ LIGHTING TECHNOLOGY CO.,LTD.|528400 4, 5 block 1A, 391 North East Road, Cao 2 village, Guzhen Town, Zhongshan, Guangdong.

False: Shenzhen zhichuangxing Industrial Co.,Ltd.|518000 202-41, building 1, guanlida building, No. 269, Qianjin 1st Road, Wenhui community, Xin'an street, Bao'an District, Shenzhen, Guangdong Province

Number: 30-01

Volume: 39

Correction item: Patentee|Address

Correct: ZHONGSHAN LYZ LIGHTING TECHNOLOGY CO.,LTD.|528400 4, 5 block 1A, 391 North East Road, Cao 2 village, Guzhen Town, Zhongshan, Guangdong.

False: Shenzhen zhichuangxing Industrial Co.,Ltd.|518000 202-41, building 1, guanlida building, No. 269, Qianjin 1st Road, Wenhui community, Xin'an street, Bao'an District, Shenzhen, Guangdong Province

Number: 30-01

Page: The title page

Volume: 39

OR01 Other related matters
OR01 Other related matters